Display panel and display device thereof

Abstract

This application relates to a display panel and a display device thereof. The display panel includes a substrate; a pixel defining layer disposed on one side of the substrate; wherein the pixel defining layer encloses and forms a plurality of pixel openings; a plurality of isolation pillars disposed on the side of the pixel defining layer away from the substrate, the isolation pillars extending in a direction away from the substrate; wherein the isolation pillars have isolation sidewalls, and the isolation sidewalls form a first angle with the plane where the pixel defining layer is located, the first angle being less than or equal to 90°; and a light-emitting functional layer disposed on the side of the pixel defining layer away from the substrate, the light-emitting functional layer at least covering the pixel openings, the pixel defining layer, and the isolation pillars; wherein the light-emitting functional layer has a thinning region at the top of the isolation pillars.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to display panels and display devices thereof. Background Technology

[0002] Organic light-emitting diode (OLED) display technology has advantages such as low power consumption and flexibility, making it one of the mainstream technologies in the flat panel display field. It is widely used in various terminal products such as smartphones, tablets, automotive displays, and wearable devices.

[0003] With the continuous development of display technology, high resolution and high pixel density have become the main development direction of display panels. Increased pixel density means that the spacing between adjacent sub-pixels is constantly decreasing. However, the light-emitting functional layer in an OLED panel has a certain degree of lateral conductivity. When the spacing between adjacent pixels decreases, the light-emitting functional layer is prone to lateral leakage, leading to electrical crosstalk between adjacent sub-pixels, such as color mixing, decreased display contrast, and poor image uniformity, severely affecting the display effect. Summary of the Invention

[0004] Based on this, a display panel and display device are provided, which can effectively cut off the lateral conductive path of the light-emitting functional layer between adjacent pixels, significantly suppress pixel crosstalk, and improve the display effect and reliability of the display panel.

[0005] A display panel, comprising:

[0006] Substrate;

[0007] A pixel definition layer is disposed on one side of the substrate; wherein the pixel definition layer encloses and forms a plurality of pixel openings;

[0008] Multiple isolation pillars are disposed on the side of the pixel definition layer away from the substrate, and the isolation pillars extend in a direction away from the substrate; wherein, the isolation pillars have isolation sidewalls, and the isolation sidewalls have a first angle with the plane where the pixel definition layer is located, the first angle being less than or equal to 90°;

[0009] A light-emitting functional layer is disposed on the side of the pixel definition layer opposite to the substrate, and the light-emitting functional layer at least covers the pixel opening, the pixel definition layer and the isolation pillar; wherein the light-emitting functional layer has a thinning region at the top of the isolation pillar.

[0010] In one embodiment, the thickness of the light-emitting functional layer in the thinned region is less than the thickness at the pixel opening;

[0011] Preferably, the light-emitting functional layer is discontinuous at the isolation pillar;

[0012] Preferably, the light-emitting functional layer is disconnected in the thinning region;

[0013] Preferably, the light-emitting functional layer located on the isolation sidewall has a predetermined thickness.

[0014] In one embodiment, the isolation pillar has an isolation top surface and an isolation bottom surface along the thickness direction of the display panel, the isolation sidewall includes a first sub-sidewall and a second sub-sidewall disposed opposite to each other, the top surface is connected to the isolation bottom surface through the first sub-sidewall and the second sub-sidewall, and the isolation bottom surface is connected to the pixel definition layer;

[0015] The second included angle between at least one of the first sub-sidewall and the second sub-sidewall and the isolation bottom surface is greater than or equal to 90°;

[0016] Preferably, the width of the top insulating surface is greater than the width of the bottom insulating surface;

[0017] Preferably, the width of the top insulating surface is equal to the width of the bottom insulating surface;

[0018] Preferably, the isolation pillar has a first height along the thickness direction of the display panel, the first height being 1μm-10μm;

[0019] Preferably, the first height is 2μm-5μm;

[0020] Preferably, the first height is greater than the second height of the pixel definition layer along the thickness direction of the display panel.

[0021] In one embodiment, multiple isolation pillars are provided, and each of the multiple isolation pillars corresponds to one of the multiple pixel openings;

[0022] Preferably, each of the isolation pillars is a closed loop surrounding the outer periphery of a corresponding pixel opening, and the isolation pillars enclose the opening to form an isolation opening; wherein, adjacent isolation pillars are spaced apart to form independent, fully enclosed isolation pillars;

[0023] Preferably, the closed-loop profile of the isolation column is circular;

[0024] Preferably, the plurality of isolation pillars are in the form of a continuous grid-like integrated structure, the grid-like integrated structure enclosing a plurality of sequentially arranged isolation openings, the isolation openings corresponding one-to-one with the pixel openings, and adjacent two isolation openings sharing the isolation sidewall of the same isolation pillar, forming a continuous, fully enclosed isolation pillar;

[0025] Preferably, the integrated mesh structure is a honeycomb mesh, and the outline of the isolation opening is a regular hexagon.

[0026] In one embodiment, the isolation column is provided with a notch, and the notch communicates with the isolation opening;

[0027] Preferably, each of the isolation posts is provided with the notch to form a semi-enclosed isolation post;

[0028] Preferably, the plurality of isolation columns are in the form of a continuous grid-like integrated structure, and two adjacent isolation openings share the isolation sidewall of the same isolation column. The notch is opened on the isolation sidewall surrounding the isolation opening, so that the isolation opening is connected to the adjacent area through the notch, forming a continuous grid-like semi-enclosed isolation column.

[0029] In one embodiment, the pixel definition layer and the isolation pillar are integrally formed by the same exposure and development process;

[0030] Preferably, both the pixel definition layer and the isolation pillars are organic materials.

[0031] In one embodiment, the substrate includes an array substrate having pixel driving circuitry and a planarization layer disposed on one side of the array substrate;

[0032] The planarization layer has a first through hole along the thickness direction of the display panel, and a conductive part is disposed in the first through hole, which is connected to the pixel driving circuit.

[0033] In one embodiment, the light-emitting functional layer includes at least a first electrode, a second electrode, a light-emitting layer, and a charge carrier functional layer. The first electrode covers a portion of the first via and the planarization layer. The light-emitting layer is disposed within the pixel opening and located between the first electrode and the charge carrier functional layer. The second electrode covers the top surface of the charge carrier functional layer.

[0034] In one embodiment, the display panel further includes an encapsulation layer disposed on the side of the light-emitting functional layer opposite to the substrate.

[0035] A display device includes a display panel as described above.

[0036] The aforementioned display panel and display device, by setting isolation pillars between the pixel definition layer and the light-emitting functional layer, with the isolation pillars extending away from the substrate, creates a first angle of less than or equal to 90° between the isolation sidewall of the isolation pillar and the plane where the pixel definition layer is located, thereby forming an approximately vertical or outwardly inclined sidewall step between adjacent pixel openings. Since the light-emitting functional layer is fabricated over the isolation pillars using a full-surface fabrication process, when the light-emitting functional layer passes through this sidewall step, the film thickness of the light-emitting functional layer at the sidewall is significantly reduced or even broken due to the step effect. This effectively cuts off the lateral conductive path between the light-emitting functional layers at adjacent pixel openings, suppressing electrical crosstalk between adjacent sub-pixels caused by lateral leakage of the light-emitting functional layer, improving problems such as color mixing, decreased display contrast, and deteriorated image uniformity, and enhancing the display effect of the display panel. Attached Figure Description

[0037] Figure 1 This is a top view of an isolation column in an exemplary embodiment.

[0038] Figure 2 for Figure 1 The diagram shows the AA section.

[0039] Figure 3 This is a schematic diagram of the layout of the isolation columns in an exemplary embodiment.

[0040] Figure 4 This is a schematic diagram of the layout of the isolation columns in another exemplary embodiment.

[0041] Figure 5 This is a schematic diagram of the notch in an exemplary embodiment of the isolation column.

[0042] Figure 6 This is a schematic diagram of the notch in an isolation column in another exemplary embodiment.

[0043] Figure label:

[0044] 100, Substrate; 110, Array substrate; 120, Planarization layer; 121, First via; 122, Conductive portion; 200, Pixel definition layer; 210, Pixel opening; 300, Light-emitting functional layer; 310, Light-emitting layer; 320, Carrier functional layer; 330, Thinning region; 400, Encapsulation layer; 510, Isolation pillar; 511, Isolation sidewall; 511a, First sub-sidewall; 511b, Second sub-sidewall; 512, Isolation top surface; 513, Isolation bottom surface; 520, Isolation opening; 530, Notch. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] In related technologies, to suppress lateral crosstalk between pixels, the stepped structure of the pixel definition layer is usually relied upon to block the conductive path of the light-emitting functional layer. However, the thickness of ordinary pixel definition layers is limited, and the sidewall morphology is difficult to precisely control. For charge generation layers with strong conductivity or functional film layers with large thickness, it is impossible to effectively cut off the conductive path, and the crosstalk suppression effect is very limited.

[0047] In some exemplary embodiments, such as Figure 1 , Figure 2 As shown, a display panel is used to solve the crosstalk problem caused by lateral leakage current in the light-emitting functional layer between adjacent pixels. The display panel includes a substrate 100, a pixel definition layer 200, a light-emitting functional layer 300, and a plurality of isolation pillars 510.

[0048] In this embodiment, the substrate 100 serves as the supporting base for the display panel, supporting the various functional film layers and device structures thereon. In this embodiment, the substrate 100 includes an array substrate 110 with pixel driving circuitry and a planarization layer 120, the planarization layer 120 being disposed on one side of the array substrate 110.

[0049] The array substrate 110 integrates a pixel driving circuit composed of thin-film transistors, capacitors, and other devices, which provides driving current to the light-emitting functional layer 300 and controls the light emission brightness of each sub-pixel. A planarization layer 120 covers the driving circuit structure on the array substrate 110 to smooth the surface morphology and prevent steps in the underlying circuitry from affecting the fabrication yield of the upper light-emitting devices. The array substrate 110 can be made of rigid transparent substrates such as glass or quartz, or flexible transparent substrates such as polyimide (PI); this embodiment does not limit the choice.

[0050] Furthermore, the planarization layer 120 has a first through-hole 121 along the thickness direction of the display panel, and a conductive part 122 is disposed within the first through-hole 121, which is connected to the pixel driving circuit. The conductive part 122 is used to realize the electrical connection between the pixel driving circuit and the upper light-emitting functional layer 300, and to transmit the driving signal to the light-emitting device. The material of the planarization layer 120 can be a photolithographically readable organic material such as acrylic organic resin or polyimide, or an inorganic material such as silicon oxide or silicon nitride; this embodiment does not limit this. The thickness of the planarization layer 120 can be adjusted according to the step height of the underlying circuit; this embodiment does not limit this.

[0051] The conductive part 122 can be made of metals such as molybdenum, aluminum, or copper, or it can be a multilayer metal stack structure; this embodiment does not limit this. One end of the conductive part 122 is electrically connected to the pixel driving circuit on the array substrate 110, and the other end extends upward through the first through-hole 121 to make electrical contact with the upper light-emitting functional layer 300, thereby transmitting the current signal output by the driving circuit to the light-emitting functional layer 300, driving the light-emitting functional layer 300 to emit light. The cross-sectional shape of the first through-hole 121 can be set to a circle, a square, or other regular or irregular shape, and its size is set according to the cross-sectional area of ​​the conductive part 122 and the process precision requirements; this embodiment does not limit this.

[0052] In this embodiment, the pixel definition layer 200 is disposed on the side of the substrate 100 where the planarization layer 120 is located, specifically on the side of the planarization layer 120 facing away from the array substrate 110. The pixel definition layer 200 has multiple spaced pixel openings 210 arranged in an array, with each pixel opening 210 corresponding to the light-emitting area of ​​a sub-pixel. The pixel definition layer 200 is made of an insulating material to isolate adjacent sub-pixels and define the range of the light-emitting area. The material of the pixel definition layer 200 can be an organic material with good insulating properties, such as polyimide or acrylic resin, or an inorganic material, such as silicon nitride or silicon oxide; this embodiment does not limit the choice of material.

[0053] In this embodiment, the light-emitting functional layer 300 is disposed on the side of the pixel definition layer 200 facing away from the substrate 100. The light-emitting functional layer 300 covers the pixel opening 210 and the pixel definition layer 200 to achieve encapsulation protection of the light-emitting device and carrier function regulation. The light-emitting functional layer 300 includes a light-emitting layer 310, a first electrode (not shown in the figure), a second electrode (not shown in the figure), and a carrier function layer 320.

[0054] The light-emitting layer 310 is disposed within the pixel opening 210, located between the first electrode and the carrier functional layer 320. The light-emitting layer 310 within different pixel openings 210 can be correspondingly prepared to emit red, green, and blue light to achieve color display.

[0055] The carrier functional layer 320 is composed of one or more carrier modulation functional thin films, specifically including one or more of the following: electron transport layer (ETL), hole transport layer (HTL), hole injection layer (HIL), and electron injection layer (EIL). This embodiment does not limit this. For example, the carrier functional layer 320 may only have an electron transport layer to transport electrons injected from the second electrode to the light-emitting layer 310. Alternatively, a hole transport layer and an electron transport layer may be provided simultaneously to form a bipolar transport structure, balancing the injection efficiency of electrons and holes and improving the luminous efficiency of the device.

[0056] The first electrode covers a portion of the first via 121 and the planarization layer 120, and is electrically connected to the pixel driving circuit through the conductive portion 122 within the first via 121. A portion of the structure of the first electrode is located within the pixel opening 210, and the pixel definition layer 200 covers the edge region of the first electrode, which can prevent device failure caused by the concentration of electric field at the electrode edge.

[0057] The light-emitting layer 310 is located inside the pixel opening 210 and covers the light-emitting area of ​​the first electrode. Under the electric field drive of the first electrode and the second electrode, charge carriers recombine in the light-emitting layer 310 and emit light.

[0058] The second electrode covers the top surface of the carrier functional layer 320 and serves as a common electrode to provide a unified electrical signal to all sub-pixels. The outermost layer is a packaging layer that covers the second electrode to achieve device packaging.

[0059] In this embodiment, the first electrode is set as the anode and can be prepared by sputtering or evaporation. The material can be a transparent conductive material such as indium tin oxide or indium zinc oxide, or a reflective metal material such as silver or aluminum. The second electrode is set as the cathode and can be a composite metal material such as magnesium-silver alloy or lithium fluoride to improve electron injection efficiency and luminous efficiency. If it is an inverted structure device, the first electrode can also be set as the cathode and the second electrode as the anode. This embodiment does not limit this.

[0060] In actual fabrication, the various functional films of the light-emitting functional layer 300 can be prepared using a vacuum evaporation process. Due to the good directionality of evaporation, the film thickness is relatively uniform in flat areas, but in non-flat areas such as the sidewall of the pixel opening 210, the film thickness will be significantly reduced due to the limitation of the incident angle.

[0061] In this embodiment, multiple isolation pillars 510 are disposed between the pixel definition layer 200 and the light-emitting functional layer 300, that is, the isolation pillars 510 are sandwiched between the upper surface of the pixel definition layer 200 and the lower surface of the charge carrier functional layer 320 of the light-emitting functional layer 300. The isolation pillars 510 are used to cut off the conductive path of the light-emitting functional layer 300 at the openings 210 of two adjacent pixels, thereby suppressing crosstalk between adjacent pixels caused by the lateral conductivity of the light-emitting functional layer 300.

[0062] For example, the isolation pillar 510 extends in a direction away from the substrate 100. The isolation pillar 510 has an isolation sidewall 511, which has a first angle with the plane where the pixel definition layer 200 is located, the first angle being less than or equal to 90°.

[0063] The isolation pillars 510 extend upward from the surface of the pixel definition layer 200 in a direction away from the substrate 100, forming a protruding structure in the region between the pixel openings 210. Since the first angle between the isolation sidewalls 511 and the plane containing the pixel definition layer 200 is less than or equal to 90° (i.e., the isolation sidewalls 511 are inclined or approximately perpendicular to the surface of the pixel definition layer 200), the light-emitting functional layer 300, when covering the isolation pillars 510, experiences a significant thinning of the film thickness at the isolation sidewalls 511 due to a step effect, and may even break. Specifically, the light-emitting functional layer 300 has a thinning region 330 at the top of the isolation pillars 510, and the thickness of the light-emitting functional layer 300 in the thinning region 330 is less than the thickness at the pixel openings 210. The light-emitting functional layer 300 may be discontinuous at the isolation pillars 510, or it may be broken in the thinning region 330. For example, the light-emitting functional layer 300 located on the isolation sidewalls 511 has a preset thickness, which is less than or equal to 1 μm.

[0064] This physically severs the lateral conductive path of the light-emitting functional layer 300 at the adjacent pixel opening 210. The pixel definition layer 200 and the isolation pillar 510 can be integrally formed using the same exposure and development process. Preferably, both the pixel definition layer 200 and the isolation pillar 510 are made of organic materials. During the fabrication process, only one layer of organic insulating material needs to be deposited. By adjusting parameters such as exposure dose and development time through a single photolithography process, isolation pillars 510 with a set height and sidewall morphology can be fabricated at the corresponding positions simultaneously with the formation of the pixel definition layer 200. The entire process eliminates the need for additional film deposition and photolithography steps, greatly simplifying the fabrication process and reducing production costs. Furthermore, the integrally formed structure with the same material has strong interfacial adhesion, eliminating the risk of delamination or peeling, resulting in higher structural reliability.

[0065] The isolation pillar 510 is used to cut off the conductive path of the light-emitting functional layer 300 located on the isolation sidewall 511. Due to the directionality of vapor deposition, the film thickness at the sidewall is much smaller than that in the flat area. When the thickness is below the conductivity threshold, the film no longer has continuous conductivity, that is, the conductive path is cut off. Preferably, the light-emitting functional layer 300 located on the isolation sidewall 511 is in a broken state. At this time, the lateral conductive path is completely cut off, and the crosstalk suppression effect is optimal. The isolation pillar 510 of this disclosure, through the sidewall design of the isolation pillar 510, makes the thickness of the light-emitting functional layer 300 thinner at the sidewall until it breaks, cutting off the lateral conductive path, thereby effectively suppressing electrical crosstalk between pixels and improving the contrast and color purity of the displayed image.

[0066] In this embodiment, by setting an isolation pillar 510 with a specific geometric shape between the pixel definition layer 200 and the light-emitting functional layer 300, the inclined or vertical structure of the isolation sidewall 511 forces the light-emitting functional layer 300, which is fabricated on the whole surface, to be thinned or broken at that point, effectively cutting off the lateral conductive path and thus suppressing crosstalk.

[0067] Furthermore, the isolation pillars 510 can be fabricated in the same photolithography and etching process as the pixel definition layer 200. For example, while fabricating the pixel definition layer 200, the structure of the isolation pillars 510 can be formed simultaneously in the area between the pixel openings 210 by adjusting the mask pattern. This process has strong compatibility and will not significantly increase the fabrication cost.

[0068] It should be noted that the display panel in this disclosure also includes an encapsulation layer 400, which is disposed on the side of the light-emitting functional layer 300 facing away from the substrate 100. The encapsulation layer 400 is used to prevent external corrosive substances such as water and oxygen from entering the interior of the light-emitting device, thereby preventing the light-emitting material from failing and extending the service life of the display panel.

[0069] The encapsulation layer 400 can adopt a thin-film encapsulation structure, including alternating layers of inorganic and organic encapsulation layers, such as a three-layer stacked structure of inorganic encapsulation layer, organic encapsulation layer, and inorganic encapsulation layer. Among them, the inorganic encapsulation layer is used to achieve water and oxygen barrier, and the organic encapsulation layer is used to planarize the surface and buffer stress. The combination of the two can achieve excellent encapsulation effect and mechanical reliability.

[0070] In some exemplary embodiments, such as Figure 1 , Figure 2As shown, the isolation pillar 510 includes an isolation pillar 510 that protrudes and extends in a direction away from the substrate 100. For example, the isolation pillar 510 has an isolation top surface 512 and an isolation bottom surface 513 along the thickness direction of the display panel, and the isolation sidewall 511 includes a first sub-sidewall 511a and a second sub-sidewall 511b disposed opposite to each other. The isolation top surface 512 is connected to the isolation bottom surface 513 through the first sub-sidewall 511a and the second sub-sidewall 511b, and the isolation bottom surface 513 is fixedly connected to the surface of the pixel definition layer 200.

[0071] In this embodiment, at least one of the first sub-sidewall 511a and the second sub-sidewall 511b has a second included angle with the isolation bottom surface 513 greater than or equal to 90°. That is, the isolation sidewall 511 is perpendicular to or inclined outward relative to the isolation bottom surface 513 (i.e., the plane where the pixel definition layer 200 is located).

[0072] In one optional embodiment, the second included angle is equal to 90°, meaning that both the first sub-sidewall 511a and the second sub-sidewall 511b are perpendicular to the isolation bottom surface 513. In this case, the isolation sidewall 511 is vertical. When the luminescent functional layer 300 is prepared by vapor deposition, the vapor-deposited particles have difficulty forming a continuous, thick film at the sidewall. The thickness of the functional film at the sidewall is significantly less than the film thickness in the flat area. When the thickness is below the conductivity threshold, the lateral conductive path is cut off, thereby achieving electrical isolation between adjacent pixels. In this embodiment, the width of the isolation top surface 512 can also be set to be equal to the width of the isolation bottom surface 513. In this case, the isolation pillar 510 has a rectangular cross-section, making the etching process easier to control, resulting in higher fabrication precision and improved production yield.

[0073] In another alternative embodiment, the second included angle is greater than 90°, meaning that at least one of the first sub-sidewall 511a and the second sub-sidewall 511b is inclined outward relative to the insulating bottom surface 513. Preferably, the width of the insulating top surface 512 is greater than the width of the insulating bottom surface 513, in which case the insulating sidewall 511 is inclined outward, and the insulating pillar 510 has an inverted trapezoidal cross-section. The inclined sidewall is more likely to disrupt the continuity of the light-emitting functional layer 300, resulting in a better blocking effect on the lateral conductive path.

[0074] The isolation pillar 510 has a first height along the thickness direction of the display panel, which can be set to 1μm-10μm. For example, the first height can be any value among 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, and 10μm. Further, the first height is 2μm-5μm. When the first height is within the range of 2μm-5μm, the blocking effect and fabrication feasibility can be further balanced. Sufficient height can amplify the cutting effect of the step on the light-emitting functional layer 300, ensuring the blocking effect on thick film layers and highly conductive film layers. At the same time, its height will not be too high, avoiding increasing the overall thickness of the panel and preventing subsequent problems with poor coverage of film layer steps.

[0075] Furthermore, the first height of the isolation pillar 510 is greater than the second height of the pixel definition layer 200 along the thickness direction of the display panel. That is, the isolation pillar 510 protrudes from the surface of the pixel definition layer 200, forming a significant height difference, thereby more effectively disrupting the continuity of the light-emitting functional layer 300 and enhancing the ability to block lateral conductive paths.

[0076] In this embodiment, by setting an isolation pillar 510 with a specific geometric shape between the pixel definition layer 200 and the light-emitting functional layer 300, the vertical or outward structure of the isolation sidewall 511 forces the light-emitting functional layer 300, which is fabricated on the whole surface, to be thinned or broken at that point, effectively cutting off the lateral conductive path and thus suppressing crosstalk.

[0077] In some exemplary embodiments, such as Figure 1 , Figure 2 As shown, multiple isolation pillars 510 are provided, and each isolation pillar 510 corresponds one-to-one with a multiple pixel opening 210. The isolation pillars 510 have different arrangements to increase their flexibility and meet different application scenarios.

[0078] First Example

[0079] like Figures 1-3 As shown, each isolation pillar 510 is a closed loop surrounding the outer periphery of a corresponding pixel opening 210, and the isolation pillars 510 enclose to form an isolation opening 520. The orthographic projection of the pixel opening 210 on the substrate 100 is located within the orthographic projection range of the corresponding isolation opening 520. Adjacent isolation pillars 510 are spaced apart to form independent, fully enclosed isolation pillars 510.

[0080] In this design, the functional layer of each pixel is completely surrounded by an independent closed-loop isolation pillar 510, cutting off all lateral leakage paths between adjacent pixels. This results in optimal crosstalk suppression, making it suitable for high-resolution display panels with extremely high crosstalk requirements. Because the isolation pillars 510 of each pixel are independent, even if a manufacturing defect occurs in one isolation pillar 510, it will not affect the isolation effect of adjacent pixels, demonstrating good structural fault tolerance.

[0081] For example, the closed-loop profile of the isolation pillar 510 is circular. The sidewall stress distribution of the circular profile is uniform, the morphology is easy to control during etching, and the functional film layer has good uniformity of coverage on the circular sidewall, avoiding the problem of local stress concentration. According to actual design requirements, the closed-loop profile can also be set to other shapes such as square or ellipse, and this disclosure does not limit it.

[0082] Second example

[0083] like Figure 1 , Figure 2 , Figure 4 As shown, multiple isolation pillars 510 form a continuous grid-like integrated structure, which encloses multiple sequentially arranged isolation openings 520. The isolation openings 520 are configured in a one-to-one correspondence with the pixel openings 210, and adjacent two isolation openings 520 share the isolation sidewall 511 of the same isolation pillar 510, forming a continuous, fully enclosed isolation pillar 510.

[0084] This integrated structure can be formed through a single photolithography etching process, eliminating the need to fabricate the isolation pillars 510 for each pixel separately, thus simplifying the process flow. The continuous, integrated structure provides enhanced mechanical stability and reduces the likelihood of localized detachment. Furthermore, adjacent pixels share sidewalls, saving space between pixels and facilitating increased pixel density to meet the demands of high-PPI displays. In high-PPI display panels, the pixel pitch can be reduced to below 30μm. The continuous mesh-like integrated structure effectively isolates pixels within a limited pixel pitch while maximizing panel area utilization.

[0085] For example, the integrated mesh structure is a honeycomb mesh, and the outline of the isolation opening 520 is a regular hexagon. The honeycomb arrangement of regular hexagons is the most space-efficient arrangement, which can accommodate more pixel units within a limited panel. At the same time, each sidewall of the regular hexagon is subjected to uniform stress, resulting in good structural stability and excellent uniformity of etching morphology.

[0086] Third Example

[0087] In this embodiment, as Figures 1-5 As shown, the isolation column 510 is provided with a notch 530, which is connected to the isolation opening 520.

[0088] like Figure 5As shown, in the independent closed-loop structure, each isolation pillar 510 is provided with a notch 530 to form a semi-closed isolation pillar 510. In this structure, the isolation pillar 510 cuts off the conductive path of the light-emitting functional layer 300 in most of the circumferential range, which is sufficient to achieve crosstalk suppression. However, the light-emitting functional layer 300 at the notch 530 remains continuous. For common electrode layers such as the second electrode 313 fabricated on the entire surface, they are not completely isolated by the isolation pillar 510, which can ensure the resistance uniformity within the common electrode surface, reduce the voltage drop of the electrodes, and improve the brightness uniformity of the display screen.

[0089] like Figure 6 As shown, in the continuous mesh-like integrated structure, a notch 530 is formed on the isolation sidewall 511 that surrounds the isolation opening 520, allowing the isolation opening 520 to connect with adjacent areas through the notch 530, forming a continuous mesh-like semi-enclosed isolation pillar 510. This structure combines the manufacturing convenience of a continuous mesh with the conductivity advantage of a notch, effectively blocking lateral leakage current in the light-emitting functional layer while ensuring uniform conductivity of the common electrode layer.

[0090] With the above structure, since the light-emitting functional layer 300 is usually prepared by full-surface evaporation or coating process, without the isolation pillar 510, the light-emitting functional layer 300 will continuously cover the area between adjacent pixel openings 210, forming a lateral conductive path, which will cause leakage crosstalk between adjacent pixels. However, in this embodiment, by setting an isolation pillar 510 with a specific geometric shape between the pixel definition layer 200 and the light-emitting functional layer 300, the vertical or outward structure of the isolation sidewall 511 forces the light-emitting functional layer 300, which is prepared on the whole surface, to be thinned or broken at that point, effectively cutting off the lateral conductive path, thereby suppressing crosstalk.

[0091] The size of the notch 530 can be adjusted according to the resistance uniformity requirements of the common electrode, such as setting it to 5%-20% of the perimeter of the isolation opening 520.

[0092] This disclosure also provides a display device, including the display panel in any of the above embodiments. The display device can be, but is not limited to, various terminal products with display functions such as smartphones, tablets, laptops, automotive displays, smart wearable devices, televisions, and digital photo frames. Due to the use of the aforementioned display panel, the display device has advantages such as low pixel crosstalk, good image quality, high reliability, and controllable manufacturing costs.

[0093] Since the light-emitting functional layer 300 is typically prepared using a full-surface vapor deposition or coating process, without the isolation pillar 510 described in this disclosure, the light-emitting functional layer 300 would continuously cover the area between adjacent pixel openings 210, forming a lateral conductive path, leading to leakage crosstalk between adjacent pixels. This embodiment, by providing an isolation pillar 510 with a specific geometric shape between the pixel definition layer 200 and the light-emitting functional layer 300, utilizes the vertical or outward-sloping structure of the isolation sidewall 511 to force the full-surface light-emitting functional layer 300 to thin or break at that point. This reduces the thickness of the light-emitting functional layer 300 on the isolation sidewall 511 to a preset thickness, or even causes it to break, effectively cutting off the lateral conductive path, thereby suppressing crosstalk and improving the contrast and color purity of the displayed image.

[0094] Compared to related technologies that rely solely on pixel definition layer steps to block conductive paths, the isolation pillar 510 in this embodiment has a greater height, such as a first height greater than the second height of the pixel definition layer, and a more favorable sidewall angle, such as a first included angle less than or equal to 90°. This enables effective cutting off of conductive paths in charge generation layers with strong conductivity or functional film layers with large thickness, significantly improving crosstalk suppression.

[0095] Furthermore, the isolation pillars 510 can be integrally formed with the pixel definition layer 200 using the same photolithography and etching process. For example, while fabricating the pixel definition layer 200, the isolation pillars 510 can be simultaneously formed in the area between the pixel openings 210 by adjusting the mask pattern. This process offers strong compatibility and does not significantly increase fabrication costs. The integrally formed structure with the same material exhibits strong interfacial bonding, eliminating the risk of delamination or detachment, resulting in higher structural reliability.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Substrate; A pixel definition layer is disposed on one side of the substrate; wherein the pixel definition layer encloses and forms a plurality of pixel openings; Multiple isolation pillars are disposed on the side of the pixel definition layer away from the substrate, and the isolation pillars extend in a direction away from the substrate; wherein, the isolation pillars have isolation sidewalls, and the isolation sidewalls have a first angle with the plane where the pixel definition layer is located, the first angle being less than or equal to 90°; A light-emitting functional layer is disposed on the side of the pixel definition layer opposite to the substrate, and the light-emitting functional layer covers the pixel opening, the pixel definition layer, and the isolation pillar; wherein the light-emitting functional layer has a thinning region at the top of the isolation pillar.

2. The display panel according to claim 1, characterized in that, The thickness of the light-emitting functional layer in the thinned region is less than the thickness at the pixel opening; Preferably, the light-emitting functional layer is discontinuous at the isolation pillar; Preferably, the light-emitting functional layer is disconnected in the thinning region; Preferably, the light-emitting functional layer located on the isolation sidewall has a predetermined thickness.

3. The display panel according to claim 1, characterized in that, The isolation pillar has an isolation top surface and an isolation bottom surface along the thickness direction of the display panel. The isolation sidewall includes a first sub-sidewall and a second sub-sidewall disposed opposite to each other. The top surface is connected to the isolation bottom surface through the first sub-sidewall and the second sub-sidewall. The isolation bottom surface is connected to the pixel definition layer. The second included angle between at least one of the first sub-sidewall and the second sub-sidewall and the isolation bottom surface is greater than or equal to 90°; Preferably, the width of the top insulating surface is greater than the width of the bottom insulating surface; Preferably, the width of the top surface of the isolation is equal to the width of the bottom surface of the isolation; Preferably, the isolation column has a first height along the thickness direction of the display panel, and the first height is 1μm-10μm; Preferably, the first height is 2μm-5μm; Preferably, the first height is greater than the second height of the pixel definition layer along the thickness direction of the display panel.

4. The display panel according to claim 1, characterized in that, Each of the isolation pillars is configured to correspond one-to-one with a plurality of the pixel openings; Each of the isolation pillars is a closed loop surrounding the outer periphery of a corresponding pixel opening, and the isolation pillars enclose the opening to form an isolation opening; wherein, adjacent isolation pillars are spaced apart to form independent, fully enclosed isolation pillars; Preferably, the closed-loop profile of the isolation column is circular; Preferably, the plurality of isolation pillars are in the form of a continuous grid-like integrated structure, the grid-like integrated structure enclosing a plurality of sequentially arranged isolation openings, the isolation openings corresponding one-to-one with the pixel openings, and adjacent two isolation openings sharing the isolation sidewall of the same isolation pillar, forming a continuous, fully enclosed isolation pillar; Preferably, the integrated mesh structure is a honeycomb mesh, and the outline of the isolation opening is a regular hexagon.

5. The display panel according to claim 4, characterized in that, The isolation column is provided with a notch, and the notch communicates with the isolation opening; Preferably, each of the isolation posts is provided with a notch to form a semi-enclosed isolation post; Preferably, the plurality of isolation columns are in the form of a continuous grid-like integrated structure, and two adjacent isolation openings share the isolation sidewall of the same isolation column. The notch is opened on the isolation sidewall surrounding the isolation opening, so that the isolation opening is connected to the adjacent area through the notch, forming a continuous grid-like semi-enclosed isolation column.

6. The display panel according to claim 1, characterized in that, The pixel definition layer and the isolation pillar are integrally formed by the same exposure and development process; Preferably, both the pixel definition layer and the isolation pillars are organic materials.

7. The display panel according to any one of claims 1-6, characterized in that, The substrate includes an array substrate with pixel driving circuitry and a planarization layer, the planarization layer being disposed on one side of the array substrate; The planarization layer has a first through hole along the thickness direction of the display panel, and a conductive part is disposed in the first through hole, which is connected to the pixel driving circuit.

8. The display panel according to claim 7, characterized in that, The light-emitting functional layer includes at least a first electrode, a second electrode, a light-emitting layer, and a charge carrier functional layer. The first electrode covers a portion of the first via and the planarization layer. The light-emitting layer is disposed within the pixel opening and located between the first electrode and the charge carrier functional layer. The second electrode covers the top surface of the charge carrier functional layer.

9. The display panel according to claim 1, characterized in that, The display panel further includes an encapsulation layer disposed on the side of the light-emitting functional layer opposite to the substrate.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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