Film expanding device and chip preparation system

Abstract

This application discloses a film expansion device, including: a chassis, a rotating base, a carrier, a locking mechanism, and a lifting mechanism. The rotating base is rotatably mounted on the chassis about a horizontal axis; the carrier is mounted on the rotating base and can hold a first wafer ring and a second wafer ring stacked together; the locking mechanism is mounted on the rotating base and is used to press and fix the second wafer ring onto the first wafer ring, and the locking mechanism has a through-hole that exposes at least the opening area of ​​the annular film; the lifting mechanism is mounted on the rotating base and is used to push the bottom film toward the annular film until the bottom film and the annular film are adhered. Using the above-mentioned film expansion device, during the film expansion process, the rotating base can be rotated first so that the carrier is located at the bottom of the rotating base, and the lifting mechanism pushes the bottom film to expand. The fragments generated during the expansion process fall directly through the opening of the annular film and the through-hole, and will not fall on the bottom film, thereby preventing fragment damage to the chip during chip pickup and improving chip quality. This application also discloses a chip fabrication system.

Description

Technical Field

[0001] This application belongs to the field of wafer expansion technology, specifically relating to an expansion device and a chip fabrication system. Background Technology

[0002] In semiconductor device manufacturing, wafer dicing is a crucial step in achieving chip unitization. Through mechanical or laser dicing, the completed wafer is divided into individual chip units along predetermined dicing paths. After dicing, each chip remains attached to a substrate film and is closely spaced. To meet the requirements of subsequent chip pick-up, bonding, and other packaging processes, the substrate film supporting the chips typically undergoes a film expansion process. This involves using film expansion equipment to uniformly stretch the film, creating a stable and uniform spacing between the chips, thus providing the necessary conditions for subsequent packaging operations.

[0003] During chip expansion, fragments are generated. In existing expansion equipment, these fragments fall directly onto the substrate film. During subsequent chip pick-up, if the nozzle or ejector pin presses these fragments onto the surface of adjacent chips, it can cause physical damage. Summary of the Invention

[0004] The technical problem this application aims to solve is that, during the expansion process of existing film expansion equipment, the chip fragments generated during chip expansion fall onto the base film, which may damage the chip in subsequent processes. To solve this technical problem, this application provides a film expansion equipment and chip fabrication system that can effectively prevent chip fragments from falling onto the base film.

[0005] The technical solution proposed in this application is as follows: A film expansion device, comprising: Chassis; A rotating base is rotatably mounted on the chassis about a horizontal axis; A carrier is disposed on the rotating seat. The carrier is capable of loading a first wafer ring and a second wafer ring that are stacked together. The first wafer ring is fixed with a base film, and a wafer is disposed on the base film. The second wafer ring is fixed with an annular film, and the opening area of ​​the annular film corresponds to the wafer. A locking mechanism is provided on the rotating seat for pressing and fixing the second wafer ring onto the first wafer ring, and the locking mechanism has a through-hole that exposes at least the opening area of ​​the annular film. A lifting mechanism, located on the rotating seat, is used to push the bottom film toward the annular film until the bottom film and the annular film are in contact.

[0006] Using the aforementioned film expansion equipment, the first wafer ring requiring film expansion is loaded onto a carrier, and a second wafer ring is placed on top of the first wafer ring. The second wafer ring is then pressed together by a clamping mechanism. Next, the rotating base is rotated so that the carrier is positioned at the bottom of the rotating base. The lifting mechanism pushes the bottom film to expand. During the expansion process, any broken crystals generated fall directly through the openings and through-holes of the annular film, preventing them from falling onto the bottom film. This prevents broken crystals from damaging the chip during chip pickup and improves chip quality.

[0007] Furthermore, the through-hole can expose the annular membrane; The film expansion equipment also includes a pressing mechanism, which is disposed in the machine housing and is used to cooperate with the lifting mechanism to press and adhere the bottom film and the annular film together.

[0008] Furthermore, the pressing mechanism includes a pressing drive and a pressure cover. The pressing drive is disposed in the housing and connected to the pressure cover. The pressing drive can drive the pressure cover to pass through the through-hole and press against the annular membrane.

[0009] Furthermore, a clearance groove is provided on the side of the pressure cap that abuts against the annular membrane; When the pressure cap presses against the annular membrane, the clearance groove corresponds to the opening area of ​​the annular membrane.

[0010] Furthermore, it also includes an anti-rotation component, which is disposed in the chassis and configured to dock with and detach from the rotating seat. When the anti-rotation component docks with the rotating seat, the rotating seat is fixed relative to the chassis.

[0011] Furthermore, the anti-rotation assembly includes an anti-rotation drive and an anti-rotation rod. The anti-rotation drive is disposed in the chassis and connected to the anti-rotation rod. An anti-rotation hole is provided on the rotating seat, and the anti-rotation drive can drive the anti-rotation rod to be inserted into the anti-rotation hole.

[0012] Furthermore, the rotating seat can pass through the working position and the waste discharge position during its rotation; When the rotating seat rotates to the working position, the carrier is located on top of the rotating seat, and the anti-rotation component can dock with the rotating seat; when the rotating seat rotates to the waste discharge position, the carrier is located at the bottom of the rotating seat.

[0013] Furthermore, the chassis is equipped with a collection compartment located below the rotating base.

[0014] Furthermore, it also includes an adjustment ring disposed between the first wafer ring and the second wafer ring.

[0015] A chip fabrication system, characterized in that it includes the aforementioned film expansion equipment.

[0016] In summary, the film expansion equipment and chip fabrication system provided in this application have at least the following advantages: 1. The rotating seat can rotate so that the carrier faces downwards, and the fragments generated during the expansion of the bottom film fall directly off and will not remain on the bottom film, preventing fragments from damaging the chip and improving chip quality.

[0017] 2. An adjustment ring of corresponding thickness can be set between the first and second wafer rings according to expansion requirements, which is more convenient.

[0018] 3. After the rotating seat rotates to the working position, the anti-rotation component can fix the rotating seat and prevent the rotating seat from shaking when the clamping mechanism is in operation. Attached Figure Description

[0019] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0020] Figure 1 This is a schematic diagram of the structure of a film expansion device provided in one embodiment of this application; Figure 2 for Figure 1 A schematic diagram of some components in the film expansion device shown.

[0021] Label Explanation: 110. Chassis; 111. Recycling bin; 112. Collection box; 120. Rotating seat; 130. Locking mechanism; 131. Through port; 140. Lifting mechanism; 150. Pressing mechanism; 160. Anti-rotation component. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] On one hand, this application provides a chip fabrication system, which includes a film expansion device and other equipment for chip fabrication. After the film expansion device completes the chip expansion process, the substrate film on which the chip is located will not be under tensile stress, thereby effectively reducing or avoiding the loosening or detachment of the chip on the substrate film during storage.

[0029] like Figure 1 and Figure 2 As shown, in one embodiment, the film expansion device includes a housing 110, a rotating base 120, a carrier, a locking mechanism 130, and a lifting mechanism 140.

[0030] A rotating base 120 is rotatably mounted on a chassis 110 about a horizontal axis. A carrier, a locking mechanism 130, and a lifting mechanism 140 are all mounted on the rotating base 120. The carrier can hold a first wafer ring and a second wafer ring stacked on top of each other, with the first wafer ring mounted on the carrier and the second wafer ring stacked on top of the first wafer ring. A base film is fixed to the first wafer ring, and a diced wafer is mounted on the base film. An annular film is fixed to the second wafer ring, with the opening area of ​​the annular film corresponding to the wafer. The locking mechanism 130 is used to press and fix the second wafer ring onto the first wafer ring, and the locking mechanism 130 has a through-hole 131 that exposes at least the opening area of ​​the annular film. The lifting mechanism 140 is used to push the base film toward the annular film until the base film and the annular film adhere, causing the wafer on the base film to expand, forming multiple spaced-apart chips, thus completing the film expansion.

[0031] In practical applications, during the film expansion process, the rotating base 120 is first rotated so that the carrier is positioned at the top of the rotating base 120. The first and second wafer rings are placed sequentially on the carrier, and then the first and second wafer rings are fixed by the locking mechanism 130. Next, the rotating base 120 is rotated so that the carrier is positioned at the bottom of the rotating base 120, and then the lifting mechanism 140 pushes the bottom film to expand. During the expansion process, the fragments generated fall directly through the opening of the annular film and the through-hole 131, and do not fall onto the bottom film. The rotating base 120 is rotated so that the carrier is positioned at the top of the rotating base 120, and after the bottom film and the annular film are bonded, the first and second wafer rings are released by the locking mechanism 130, and both can be removed.

[0032] Using the aforementioned film expansion equipment, the first wafer ring requiring film expansion is loaded onto the carrier, and the second wafer ring is placed on top of the first wafer ring. The second wafer ring is then pressed together by the clamping mechanism 150. Next, the rotating base 120 is rotated so that the carrier is positioned at the bottom of the rotating base 120. The lifting mechanism 140 pushes the bottom film to expand. During the expansion process, the broken crystals generated fall directly through the opening and through-hole 131 of the annular film, preventing them from falling onto the bottom film. This prevents the broken crystals from damaging the chip during chip pickup and improves chip quality.

[0033] In one embodiment, the chassis 110 has a pick-and-place port on its side and a door that can open and close the pick-and-place port. Operators can pick up and place wafer rings through the pick-and-place port. During the film expansion process, the pick-and-place port can be closed through the door. Alternatively, the door can be made of a transparent material, such as acrylic, or have an observation window that is sealed with quartz glass or an acrylic sheet to facilitate observation of the internal film expansion process.

[0034] In one embodiment, the chassis 110 also includes a collection chamber. The collection chamber is located below the rotating base 120 to collect fallen crystal fragments. Preferably, the collection chamber includes a collection box 112, which is movably disposed within the collection chamber via a drawer-type structure to collect crystal fragments that fall during the expansion process.

[0035] In one embodiment, the film expansion apparatus further includes an adjustment ring. The adjustment ring can be disposed between the first wafer ring and the second wafer ring to adjust the spacing between the base film and the annular film, thereby adjusting the degree of expansion of the base film and thus adjusting the chip dispersion spacing. In other embodiments, the degree of expansion of the base film can be controlled by controlling the thickness of the first wafer ring and / or the second wafer ring.

[0036] In one embodiment, the locking mechanism 130 includes a locking member and a snap-fit ​​member. One end of the locking member is connected to the rotating base 120, and the snap-fit ​​member is disposed on the rotating base 120. During the rotation of the locking member, its movable end (i.e., the end away from the rotating base 120) can engage with the snap-fit ​​member, and at this time, the locking member presses against the second wafer ring to press and fix the second wafer ring onto the first wafer ring. It can also be determined that the through-hole 131 is formed in the locking member.

[0037] Optionally, the locking element can be disposed inside the rotating base 120, with an opening on the surface of the rotating base 120. The movable end of the locking element is provided with a locking tongue structure, which can pass through the opening and engage with the locking element. It should be noted that the locking and unlocking methods of the locking tongue structure are conventional means, and those skilled in the art can choose a suitable locking structure according to their needs, without any restrictions.

[0038] Preferably, the through-hole 131 exposes the annular film. The film expansion device also includes a pressing mechanism 150. The pressing mechanism 150 is disposed in the housing 110 and cooperates with the lifting mechanism 140 to press the bottom film and the annular film tightly together, thereby ensuring a tight fit between the two film layers and preventing subsequent separation or detachment. In other embodiments, the through-hole 131 may match the opening of the annular film. When the locking member presses against the second wafer ring, the locking member can also cover the annular film, thus cooperating with the lifting mechanism 140 to press the bottom film and the annular film tightly together when the lifting mechanism 140 pushes the bottom film to expand.

[0039] In one embodiment, the pressing mechanism 150 includes a pressing drive and a pressure cap. The pressing drive is disposed in the housing 110 and connected to the pressure cap. The pressing drive can drive the pressure cap through the through-hole 131 and press it against the annular membrane, so as to cooperate with the lifting mechanism 140 to press the bottom membrane and the annular membrane tightly together.

[0040] Furthermore, a clearance groove is provided on the side of the pressure cap that abuts against the annular film. When the pressure cap presses against the annular film, the clearance groove corresponds to the opening area of ​​the annular film, thereby corresponding to the wafer on the bottom film and preventing damage to the wafer (chip) on the bottom film. Optionally, the pressing drive is a cylinder or an electric cylinder.

[0041] In one embodiment, the rotating seat 120 can pass through a working position and a waste discharge position during rotation. When the rotating seat 120 rotates to the working position, the carrier is located at the top of the rotating seat 120, and the pressure cap in the clamping mechanism 150 can pass through the through-hole 131 and press against the annular membrane. When the rotating seat 120 rotates to the waste discharge position, the carrier is located at the bottom of the rotating seat 120. At this time, the lifting mechanism 140 can push the bottom membrane to expand, and the fragments generated during the expansion can fall into the collection bin below through the opening of the annular membrane and the through-hole 131.

[0042] In one embodiment, the film expansion apparatus further includes an anti-rotation component 160. The anti-rotation component 160 is disposed in the housing 110 and configured to dock with and disengage from the rotating base 120. When the anti-rotation component 160 docks with the rotating base 120, the rotating base 120 is fixed relative to the housing 110, thereby fixing the rotating base 120 in the working position and preventing rotation of the rotating base 120 during the film expansion process. It can be determined that when the anti-rotation component 160 disengages from the rotating base 120, the rotating base 120 can rotate relative to the housing 110.

[0043] In practical applications, the anti-rotation assembly 160 includes an anti-rotation drive and an anti-rotation rod. The anti-rotation drive is disposed in the housing 110 and connected to the anti-rotation rod to drive the anti-rotation rod to reciprocate. The rotating base 120 has an anti-rotation hole. When the rotating base 120 rotates to the working position, the anti-rotation drive can drive the anti-rotation rod to insert into the anti-rotation hole, thereby limiting the rotation of the rotating base 120. The anti-rotation drive can be a pneumatic cylinder or an electric cylinder.

[0044] It is certain that the rotation angle of the rotating seat 120 between the working position and the waste discharge position is 180°. In order to fix the rotating seat 120 when it is in the waste discharge position, anti-rotation holes can be opened on both sides of the rotating seat 120. When the rotating seat 120 rotates to the working position or the waste discharge position, the anti-rotation rod can be inserted into the anti-rotation holes on both sides to limit the rotation of the rotating seat 120. Of course, when the rotating seat 120 rotates to the waste discharge position, only the lifting mechanism 140 needs to push the bottom film to expand. It will not be subjected to other external forces (such as the pressure of the pressing mechanism 150), and there is no need to consider stability. Therefore, it is usually not necessary to fix it by the anti-rotation component 160.

[0045] To facilitate understanding of the technical solutions of this application, the operation process of the film expansion equipment in the above embodiments is described below: Initially, when the rotating seat 120 is in the working position, the carrier is located on the side of the rotating seat 120 facing the pressing mechanism 150. At this time, the operator can place the first wafer ring on the carrier, then place the adjusting ring according to the height requirement, and then place the second wafer ring on the adjusting ring. The second wafer ring is then pressed and fixed by the locking mechanism 130. Next, the rotating seat 120 is rotated to the waste discharge position. At this time, the carrier is located on the side of the rotating seat 120 away from the pressing mechanism 150. The lifting mechanism 140 pushes the bottom membrane to expand until the bottom membrane contacts the annular membrane. The broken crystals generated during the expansion process fall directly into the collection box 112 below. The rotating seat 120 is rotated back to the working position, and the anti-rotation drive drives the anti-rotation rod to insert into the anti-rotation hole to fix the rotating seat 120. The pressing drive drives the pressure cap to descend until it passes through the through hole and presses against the annular membrane, so that the bottom membrane and the annular membrane are tightly adhered. After the adhesion is completed, the pressing drive drives the pressure cap to rise, opening the locking mechanism 130, and the carrier can be removed.

[0046] It should be noted that after removing the carrier, the first and second wafer rings are removed from the carrier, and then the base film is removed from the first wafer ring. At this time, the base film is bonded and fixed to the second wafer ring by an annular film. The carrier facilitates the placement and removal of the first and second wafer rings. For example, when placing the first and second wafer rings, they can be placed on the carrier first, and then the carrier can be placed on the rotary table 120. In other embodiments, the carrier can also be integrally formed with the rotary table 120, that is, the carrier can be a part of the rotary table 120.

[0047] Based on the above embodiments, it should be noted that, in order to achieve automated operation of the film expansion equipment, a rotary drive component and a control module can also be installed inside the chassis 110. A display screen capable of displaying and controlling the image can also be installed on the side wall of the chassis 110. For example, the rotary drive component can be a motor, which can drive the rotating seat 120 to rotate. The display screen can limit the current position and rotation angle of the rotating seat 120, and can also display the film expansion progress. Furthermore, the actions of the operator in the above embodiments can also be replaced by a robotic arm.

[0048] In summary, the film expansion equipment and chip fabrication system provided in this application have at least the following advantages: 1. The rotating seat 120 can rotate so that the carrier faces downwards, and the fragments generated during the expansion of the bottom film fall directly off and will not remain on the bottom film, thus preventing the fragments from damaging the chip and improving the chip quality.

[0049] 2. An adjustment ring of corresponding thickness can be set between the first and second wafer rings according to expansion requirements, which is more convenient.

[0050] 3. After the rotating seat 120 is rotated to the working position, the anti-rotation component 160 can fix the rotating seat 120 to prevent the rotating seat 120 from shaking when the clamping mechanism 150 is activated.

[0051] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A film expansion device, characterized in that, include: Chassis; A rotating base is rotatably mounted on the chassis about a horizontal axis; A carrier is disposed on the rotating seat. The carrier is capable of loading a first wafer ring and a second wafer ring that are stacked together. The first wafer ring is fixed with a base film, and a wafer is disposed on the base film. The second wafer ring is fixed with an annular film, and the opening area of ​​the annular film corresponds to the wafer. A locking mechanism is provided on the rotating seat for pressing and fixing the second wafer ring onto the first wafer ring, and the locking mechanism has a through-hole that exposes at least the opening area of ​​the annular film. A lifting mechanism, located on the rotating seat, is used to push the bottom film toward the annular film until the bottom film and the annular film are in contact.

2. The film expansion device according to claim 1, characterized in that, The through-hole can expose the annular membrane; The film expansion equipment also includes a pressing mechanism, which is disposed in the machine housing and is used to cooperate with the lifting mechanism to press and adhere the bottom film and the annular film together.

3. The film expansion device according to claim 2, characterized in that, The clamping mechanism includes a clamping drive and a pressure cover. The clamping drive is disposed in the housing and connected to the pressure cover. The clamping drive can drive the pressure cover to pass through the through-hole and press against the annular membrane.

4. The film expansion device according to claim 3, characterized in that, The side of the pressure cap that abuts against the annular membrane has an avoidance groove; When the pressure cap presses against the annular membrane, the clearance groove corresponds to the opening area of ​​the annular membrane.

5. The film expansion device according to claim 1, characterized in that, It also includes an anti-rotation component, which is disposed in the chassis and configured to dock with and detach from the rotating base. When the anti-rotation component docks with the rotating base, the rotating base is fixed relative to the chassis.

6. The film expansion device according to claim 5, characterized in that, The anti-rotation assembly includes an anti-rotation drive and an anti-rotation rod. The anti-rotation drive is disposed in the chassis and connected to the anti-rotation rod. An anti-rotation hole is provided on the rotating seat, and the anti-rotation drive can drive the anti-rotation rod to be inserted into the anti-rotation hole.

7. The film expansion device according to claim 5, characterized in that, The rotating seat can pass through the working position and the waste discharge position during rotation; When the rotating seat rotates to the working position, the carrier is located on top of the rotating seat, and the anti-rotation component can dock with the rotating seat; when the rotating seat rotates to the waste discharge position, the carrier is located at the bottom of the rotating seat.

8. The film expansion device according to claim 1, characterized in that, The chassis is equipped with a collection compartment, which is located below the rotating base.

9. The film expansion device according to claim 1, characterized in that, It also includes an adjustment ring, which is disposed between the first wafer ring and the second wafer ring.

10. A chip fabrication system, characterized in that, Includes the film expansion device according to any one of claims 1-9.

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