Multi-chip die-bonding apparatus and die-bonding method

Abstract

This application discloses a multi-chip eutectic bonding apparatus and method. The bonding apparatus includes a first nozzle and a second nozzle distributed horizontally, as well as a first Z-axis linear module and a second Z-axis linear module distributed horizontally. The first nozzle and the second nozzle are used to pick up a first chip and a second chip, respectively. The first Z-axis linear module and the second Z-axis linear module are respectively drivenly connected to the first nozzle and the second nozzle, and are used to independently control the movement of the first nozzle and the second nozzle in the Z-axis direction. Specifically, the first Z-axis linear module controls the first nozzle to pick up the first chip and maintain the picking state. While the first nozzle is holding the first chip, the second Z-axis linear module controls the second nozzle to pick up the second chip. This solution, through the independent driving of the two nozzles, can achieve independent adaptation of the bonding force and height difference for different chips while avoiding thermal cycling damage to the eutectic chip.

Description

Technical Field

[0001] This application relates to the field of eutectic bonding technology, specifically a multi-chip eutectic bonding apparatus and bonding method. Background Technology

[0002] In eutectic bonding processes, for scenarios where multiple chips need to be mounted on the same substrate, existing solutions are mainly divided into two categories.

[0003] The first approach uses a single eutectic head to sequentially eutectic-bond multiple chips. That is, after the first chip completes mounting, heating, and cooling to achieve eutectic bonding, the second chip is then mounted, heated, and cooled to achieve the same result. However, when eutectic bonding a subsequent chip, if the spacing between adjacent chips is small (e.g., only a few millimeters), the already eutectic-bonded chip will be heated again and cooled due to the overall preheating of the substrate and heat conduction. This causes repeated remelting of the solder layer, reducing the reliability of the eutectic connection.

[0004] The second approach involves mounting two eutectic heads on the same Z-axis linear module, simultaneously mounting the two chips to achieve eutectic bonding. However, this approach cannot guarantee that both types of chips requiring eutectic bonding on the same layer will achieve the corresponding bonding force, and the height difference between the two eutectic heads is constrained by the chip height difference, thus limiting its applicability.

[0005] Therefore, how to achieve independent adaptation of bonding force and height difference for different chips while avoiding thermal cycling damage to eutectic chips is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0006] The purpose of this application is to provide a multi-chip eutectic bonding device and bonding method, so as to avoid thermal cycling damage to the eutectic chip while achieving independent adaptation of bonding force and height difference for different chips.

[0007] To achieve the above objectives, the technical solution provided in this application is as follows: A multi-chip eutectic bonding device includes a first nozzle and a second nozzle distributed along a horizontal direction, and a first Z-axis linear module and a second Z-axis linear module distributed along a horizontal direction. The first nozzle and the second nozzle are used to pick up a first chip and a second chip, respectively. The first Z-axis linear module and the second Z-axis linear module are respectively drivenly connected to the first nozzle and the second nozzle, and are used to independently control the movement of the first nozzle and the second nozzle in the Z-axis direction. The first Z-axis linear module controls the first nozzle to pick up the first chip and maintain the picking state. While the first nozzle is holding the first chip, the second Z-axis linear module controls the second nozzle to pick up the second chip.

[0008] This application also provides a multi-chip eutectic bonding method, applied to the above-mentioned multi-chip eutectic bonding device. The bonding method includes: a first Z-axis linear module driving a first nozzle to pick up a first chip and maintaining the picking state; while the first nozzle is maintaining the picking state of the first chip, a second Z-axis linear module driving a second nozzle to pick up a second chip.

[0009] This application has the following significant beneficial effects: The multi-chip eutectic bonding device and method provided in this application, by setting two independently controlled Z-axis linear modules to drive two nozzles respectively, and limiting the sequential picking sequence of the first nozzle picking up the first chip and maintaining the picking state, and the second nozzle picking up the second chip, has the following beneficial effects: First, the two chips are picked up sequentially but not yet bonded, and can subsequently descend simultaneously to complete the eutectic bonding. The two chips undergo heating and cooling cycles synchronously, avoiding the thermal cycling damage problem of the bonded chip being heated and cooled again due to traditional sequential eutectic bonding, thus improving the reliability of the eutectic connection; Secondly, the first Z-axis linear module and the second Z-axis linear module are independent of each other. The first and second suction nozzles can reach their respective picking positions at different times. This overcomes the shortcomings of traditional solutions, which can only lift and lower simultaneously because the two suction nozzles share the same Z-axis module, cannot adapt to different chip height differences, and are limited by chip spacing when picking up materials at the same time. This solution has a wider range of applicability. Finally, the first suction nozzle maintains the picking state after picking up materials, which provides compatibility and expansion space for subsequent processes (such as turntable calibration, vision inspection, etc.) without having to put the chip down in the middle or wait for the second chip to be processed before proceeding.

[0010] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a three-dimensional structural schematic diagram of the multi-chip eutectic bonding device provided in the embodiments of this application; Figure 2 yes Figure 1 Front view of a multi-chip eutectic bonding device; Figure 3 yes Figure 1 Side view of a multi-chip eutectic bonding device; Figure 4 yes Figure 1 A partial three-dimensional structural diagram of a multi-chip eutectic bonding device; Figure 5 yes Figure 4 Partial structural diagram; Figure 6 This is a schematic flowchart of the multi-chip eutectic bonding method provided in the embodiments of this application.

[0012] The reference numerals in the figures include: First suction nozzle 10 First suction nozzle hole 101 First valve 102 First oblong hole 103 Second suction nozzle 20 Second suction nozzle hole 201 Second air valve 202 Second oblong hole 203 First Z-axis linear module 30 Second Z-axis linear module 40 50 transfer stations First horizontal position adjustment mechanism 60 First mounting base 61 Second horizontal position adjustment mechanism 70 Second mounting bracket 71 Eutectic stage 80 Substrate 81 Visual Module 90 Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0014] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0015] In this application, the reference to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0016] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0017] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0018] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0019] In this application, "multiple" means two or more (including two).

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural schematic diagram of the multi-chip eutectic bonding device provided in the embodiments of this application. Figure 2 yes Figure 1 Front view of a multi-chip eutectic bonding device. Figure 3 yes Figure 1 A side view of a multi-chip eutectic bonding device. The multi-chip eutectic bonding device provided in this embodiment includes a first suction nozzle 10 and a second suction nozzle 20 distributed horizontally, and a first Z-axis linear module 30 and a second Z-axis linear module 40 distributed horizontally. (In conjunction with...) Figure 4 and Figure 5 , Figure 4 yes Figure 1 A partial three-dimensional structural diagram of a multi-chip eutectic bonding device. Figure 5yes Figure 4 A partial three-dimensional structural diagram, Figure 4 and Figure 5 A three-dimensional schematic diagram of the assembly structure of the first Z-axis linear module 30, the second Z-axis linear module 40, the first suction nozzle 10, and the second suction nozzle 20 is shown. The first Z-axis linear module 30 and the second Z-axis linear module 40 are respectively connected to the first suction nozzle 10 and the second suction nozzle 20 for independently controlling the movement of the first suction nozzle 10 and the second suction nozzle 20 in the Z-axis direction. The first Z-axis linear module 30 controls the first suction nozzle 10 to first pick up the first chip and maintain the picking state. While the first suction nozzle 10 is holding the first chip, the second Z-axis linear module 40 controls the second suction nozzle 20 to then pick up the second chip.

[0021] In this embodiment, the first suction nozzle 10 and the second suction nozzle 20 are used to pick up the first chip and the second chip, respectively. The structures of the first chip and the second chip may be the same or different. The suction surfaces of the first suction nozzle 10 and the second suction nozzle 20 are designed to adapt to the shape and size of the first chip and the second chip, respectively. Therefore, corresponding to whether the structures of the first chip and the second chip are the same or different, the suction surfaces of the first suction nozzle 10 and the second suction nozzle 20 are also correspondingly the same or different. Figures 4 to 5 This illustrates a scenario where the first suction nozzle 10 and the second suction nozzle 20 employ different suction structures for picking up chips. Figure 4 and Figure 5 This solution is applicable to situations where the first suction nozzle 10 and the second suction nozzle 20 respectively pick up chips with different structures. Specifically, such as... Figure 5 As shown, the bottom surface of the first suction nozzle 10 is provided with multiple first suction nozzle holes 101, and the side surface of the first suction nozzle 10 is provided with a first air nozzle 102 communicating with each of the first suction nozzle holes 101. By drawing a vacuum through the first air nozzle 102, the first chip can be sucked up through each of the first suction nozzle holes 101. Similarly, the bottom surface of the second suction nozzle 20 is provided with multiple second suction nozzle holes 201, and the side surface of the second suction nozzle 20 is provided with a second air nozzle 202 communicating with each of the second suction nozzle holes 201. By drawing a vacuum through the second air nozzle 202, the second chip can be sucked up through each of the second suction nozzle holes 201. Thus, the first suction nozzle 10 and the second suction nozzle 20 can stably suck up and release the first chip and the second chip, respectively.

[0022] The first Z-axis linear module 30 and the second Z-axis linear module 40 operate independently, each driving the first nozzle 10 and the second nozzle 20 to move along the Z-axis. This design completely decouples the movements of the first nozzle 10 and the second nozzle 20 in the Z-axis direction, making sequential pick-up and calibration and simultaneous placement possible. Based on this, the placement apparatus of this application achieves the following timing sequence: first, the first chip is picked up; while the first nozzle 10 is holding the first chip, the second chip is then picked up.

[0023] Optionally, the first Z-axis linear module 30 and the second Z-axis linear module 40 may adopt, but are not limited to, linear module structures such as lead screw and slider mechanisms and linear motors.

[0024] Generally speaking, the multi-chip eutectic bonding apparatus of this application also includes a eutectic stage 80. The eutectic stage 80 is usually located below the overall structure formed by the first nozzle 10, the second nozzle 20, the first Z-axis linear module 30, and the second Z-axis linear module 40. The substrate 81 on which the chip to be bonded is placed, and a heating device for heating the substrate 81 are also placed on the eutectic stage 80. After the first chip and the second chip have been calibrated, the first nozzle 10 holds the state of picking up the first chip and the second nozzle 20 holds the state of picking up the second chip. The first Z-axis linear module 30 and the second Z-axis linear module 40 synchronously drive the first nozzle 10 and the second nozzle 20 to descend simultaneously (since the first Z-axis linear module 30 and the second Z-axis linear module 40 are independent, the first nozzle 10 and the second nozzle 20 may descend asynchronously). The first chip and the second chip are bonded to the target position on the substrate 81 simultaneously, thus completing the eutectic bonding.

[0025] It should be noted that after the first nozzle 10 picks up the first chip and the second nozzle 20 picks up the second chip, they move to the transfer station 50 and from the transfer station 50 to the eutectic stage 80, requiring horizontal movement. Therefore, the placement device of this application also includes a drive mechanism for realizing the horizontal movement of the first nozzle 10 and the second nozzle 20. Further details will not be elaborated here.

[0026] The multi-chip eutectic bonding device provided in this application, by setting independently controlled first Z-axis linear module 30 and second Z-axis linear module 40 to drive first nozzle 10 and second nozzle 20 respectively, and limiting the sequential picking sequence of first nozzle 10 picking up the first chip and maintaining the picking state, and second nozzle 20 picking up the second chip, has the following beneficial effects: First, the two chips are picked up sequentially but not yet bonded, and can subsequently descend simultaneously to complete the eutectic bonding. The two chips undergo heating and cooling cycles synchronously, avoiding the thermal cycle damage problem caused by the reheating and cooling of the bonded chip due to traditional sequential eutectic bonding, thus improving the reliability of the eutectic connection; Second, the first Z-axis... The linear module 30 and the second Z-axis linear module 40 are independent of each other. The first suction nozzle 10 and the second suction nozzle 20 can reach their respective picking positions at different times. This overcomes the shortcomings of traditional solutions, which can only lift and lower simultaneously because the two suction nozzles share the same Z-axis module, cannot adapt to different chip height differences, and are limited by chip spacing when picking up materials at the same time. This solution has a wider range of applicability. Finally, after the first suction nozzle 10 picks up materials, it remains in the picking state during the picking process of the second suction nozzle 20. This provides compatibility and expansion space for subsequent processes (such as turntable calibration and vision inspection as described later), without having to put the chip down in the middle or wait for the second chip to be processed before proceeding.

[0027] In some embodiments, the patching device of this application further includes a transfer table 50, which is used to place a first chip on a first nozzle 10 and a second chip on a second nozzle 20, and to correct the angle of the first chip and / or the second chip by rotating the transfer table 50.

[0028] It should be explained that the meaning of correcting the angle of the first chip and the second chip in this application is that the first chip / second chip rotates around the Z-axis to the target angle.

[0029] The reason this application performs angle correction on the transfer table 50 is that the chip mounting angle has strict requirements. To ensure that the chip is mounted on the substrate in the correct direction and meets the product's functional and performance requirements, the chip angle needs to be corrected. This application places the first chip and the second chip on the transfer table 50 respectively, and achieves angle correction by rotating the transfer table 50. The reason for this is that the small distance between the first chip and the second chip makes it difficult to directly correct the angle by rotating the first nozzle 10 / second nozzle 20 after it picks up the first chip / second chip. Therefore, this application requires the use of the transfer table 50 to perform angle correction on the first chip and the second chip.

[0030] The placement device in this embodiment executes the following timing sequence: first, the first chip is picked up and corrected, then the first nozzle 10 picks up the first chip again and maintains the state of picking up the first chip, then the second chip is picked up and corrected, and then the second nozzle 20 picks up the second chip again.

[0031] The process of picking up and calibrating the first chip includes the first suction nozzle 10 picking up the first chip, placing the first chip on the transfer table 50, and rotating the transfer table 50 to calibrate the angle of the first chip.

[0032] The process of picking up and calibrating the second chip includes the second nozzle 20 picking up the second chip and placing the second chip on the transfer table 50, and the transfer table 50 rotating to calibrate the angle of the second chip.

[0033] The above-described solution in this embodiment, by adding a rotatable transfer platform 50, allows the first chip picked up by the first nozzle 10 and the second chip picked up by the second nozzle 20 to be placed sequentially on the same transfer platform 50 for angle correction. This eliminates the need for a separate rotation correction mechanism for each nozzle, simplifying the nozzle structure and reducing device cost and complexity while achieving precise chip angle correction. Furthermore, since the transfer platform 50 is located within the placement device, the first chip, after correction, can be directly picked up again by the first nozzle 10 and transferred to the substrate for mounting, eliminating the need for additional transfer devices and improving efficiency. Similarly, the second chip can undergo angle correction through the same transfer platform 50, further demonstrating the cost advantages of shared structure.

[0034] In some embodiments, the patching device of this application further includes a vision module 90, disposed above the transfer station 50, for at least acquiring angle images of a first chip and / or a second chip located on the transfer station 50; the controller calculates the angle deviation of the first chip placed on the transfer station 50 based on the angle image of the first chip acquired by the vision module 90, and controls the transfer station 50 to rotate to correct the angle of the first chip based on the angle deviation of the first chip; the controller also calculates the angle deviation of the second chip placed on the transfer station 50 based on the angle image of the second chip acquired by the vision module 90, and controls the transfer station 50 to rotate to correct the angle of the second chip based on the angle deviation of the second chip.

[0035] In this embodiment, the vision module 90 can be fixedly installed directly above the turntable 50, and its field of view covers all or part of the turntable 50, ensuring that when the chip is placed on the turntable 50, the vision module 90 can clearly acquire images of the chip and extract the chip's angle information (e.g., the chip's rotation angle around the Z-axis). This image data will be sent to the controller for subsequent angle deviation calculation and correction control. Since the first chip and the second chip are placed on the turntable 50 in a time-sharing manner, the vision module 90 also acquires images of the first chip and the second chip in a time-sharing manner.

[0036] In the above embodiments of this application, by setting up a vision module 90 and controlling the rotation of the turntable 50 based on the angle deviation calculated by the controller according to the image acquired by the vision module 90, closed-loop automatic correction of the chip angle is achieved. Specifically, the vision module 90, as a detection unit, can accurately acquire real-time angle images of the chip in a non-contact manner; the controller, as a decision-making unit, processes the image data and calculates the angle deviation, and then issues a precise rotation command to the turntable 50. The beneficial effects of this solution are as follows: First, it achieves full automation of angle correction, eliminating the need for manual visual inspection or adjustment, thus avoiding human error and improving correction accuracy and efficiency. Second, the vision module 90, controller, and turntable 50 form a closed-loop control system, enabling real-time feedback and correction of the correction results to ensure the accuracy of chip angle correction. Third, the vision module 90 is positioned above the turntable 50, with a fixed field of view corresponding to the position of the turntable 50, allowing image acquisition without movement, simplifying the system structure and shortening the correction time. Fourth, the controller calculates the angle deviation based on the image acquired by the vision module 90, achieving micron-level or even sub-micron-level detection accuracy, meeting the angle control requirements of high-precision eutectic bonding.

[0037] In a further embodiment, the vision module 90 is also used to acquire horizontal position images of the first chip and / or the second chip located on the turntable 50 after the turntable 50 rotates to correct the angle of the first chip and / or the second chip, and extract the chip position information (e.g., the X and Y coordinates of the chip in the horizontal direction) from the images. These image data will be sent to the controller for subsequent horizontal position deviation calculation and correction control.

[0038] The reason why this application corrects the horizontal position of the first chip after the angle of the first chip is that, after the angle of the first chip is corrected by rotating the turntable 50, if the rotation center does not coincide with the center of the first chip, the horizontal center position of the first chip will shift after rotation. At this time, since the first nozzle 10 is still in the original horizontal position to pick up the first chip, it may not be able to pick up the first chip accurately. Therefore, this application can make a fine adjustment of the position of the turntable 50 in the horizontal direction (for example, adjust the position of the turntable 50 on the X-axis and Y-axis) to correct the horizontal position of the first chip on the turntable 50, so that the first nozzle 10 is aligned with the horizontal position of the first chip after the position correction, and then picks up the chip again, ensuring that the horizontal position of the first chip finally picked up by the first nozzle 10 meets the mounting requirements.

[0039] Similarly, the reason why this application corrects the horizontal position of the second nozzle 20 after the angle of the second chip is that after the angle of the second chip is corrected by rotating the transfer table 50, the horizontal position of the second chip may also be offset. This application can make a fine adjustment of the position of the transfer table 50 in the horizontal direction (for example, adjust the position of the transfer table 50 on the X and Y axes) to correct the horizontal position of the second chip on the transfer table 50, so that the second nozzle 20 is aligned with the horizontal position of the second chip after the position is corrected before picking it up again, ensuring that the horizontal position of the second chip finally picked up by the second nozzle 20 meets the mounting requirements.

[0040] The above embodiments of this application acquire angle and position images of the first chip and / or the second chip through the vision module 90, and with the cooperation of the controller, the first chip is picked up and its angle and position are corrected first, and then the second chip is picked up and its angle and position are corrected, thereby improving the angle and position accuracy of the two chips during final mounting.

[0041] In some embodiments, the patching device of this application further includes at least one horizontal position adjustment mechanism connected to the first suction nozzle 10 and / or the second suction nozzle 20, for adjusting the horizontal distance between the first suction nozzle 10 and the second suction nozzle 20 before the first suction nozzle 10 and the second suction nozzle 20 pick up the first chip and the second chip; wherein, at least one of the first suction nozzle 10 and the second suction nozzle 20 has a width in a first direction in the horizontal direction that is less than a preset threshold, and the horizontal position adjustment mechanism is used to adjust the horizontal distance between the first suction nozzle 10 and the second suction nozzle 20 in the first direction.

[0042] For example, the first horizontal direction can be the X-axis, the second horizontal direction can be the Y-axis, and the X-axis and Y-axis are perpendicular to each other from the Z-axis.

[0043] Figure 4 and Figure 5The illustration shows the case where the width of the second suction nozzle 20 in the first horizontal direction (X-axis) is less than a preset threshold. That is, the size of the second suction nozzle 20 in the X-axis is much smaller than the size in the Y-axis. For example, the size of the second suction nozzle 20 in the X-axis can be 0.5mm, etc., and the size of the second suction nozzle 20 in the X-axis is several times or even tens of times the size in the Y-axis. It can be seen that the second suction nozzle 20 and the first chip must be strictly aligned in the X-axis in order to accurately pick up the first chip.

[0044] In this embodiment, because the width of the first suction nozzle 10 and / or the second suction nozzle 20 in the first direction (X-axis) is small, the alignment tolerance between the nozzle and the chip in this direction is extremely limited. If there is a slight offset between the nozzle and the chip, the nozzle may fail to effectively pick up the chip. By setting a horizontal position adjustment mechanism, the distance between the two nozzles in the first direction can be adjusted to a preset value before picking up the chip, ensuring that each nozzle is precisely aligned with its corresponding chip in the first direction. This effectively compensates for the positional deviation between the nozzle and the chip caused by installation errors, ensuring the reliability and stability of the picking process. At the same time, only an adjustment mechanism needs to be set in the first direction to meet the accuracy requirements, eliminating the need for adjustment structures in both directions. This simplifies the device structure, reduces manufacturing costs, and makes the device structure more compact.

[0045] In some embodiments, such as Figure 4 and Figure 5 As shown, at least one horizontal position adjustment mechanism includes a first horizontal position adjustment mechanism 60 and a second horizontal position adjustment mechanism 70; the first horizontal position adjustment mechanism 60 is connected to the first suction nozzle 10 and is used to adjust the horizontal position of the first suction nozzle 10 in the first direction; the second horizontal position adjustment mechanism 70 is connected to the second suction nozzle 20 and is used to adjust the horizontal position of the second suction nozzle 20 in the first direction.

[0046] The embodiments of this application, by configuring independent horizontal position adjustment mechanisms for the first suction nozzle 10 and the second suction nozzle 20 respectively, allow each nozzle to independently adjust its horizontal position in the first direction. This compensates for positional deviations caused by factors such as installation errors, manufacturing tolerances, or thermal expansion, ensuring that each nozzle is precisely aligned with its corresponding chip, further improving the reliability and flexibility of material handling. Compared to setting only a single horizontal position adjustment mechanism, the dual adjustment mechanism allows the position adjustments of the two suction nozzles to be independent and non-interfering, adapting to situations where the installation errors of the two nozzles differ, and exhibiting stronger adaptability and fault tolerance.

[0047] In some embodiments, the first horizontal position adjustment mechanism 60 includes a first mounting base 61, a first oblong hole 103, at least one first fastening hole, and at least one first fastener. The first mounting base 61 is fixed to the output end of the first Z-axis linear module 30. The first oblong hole 103 extends along the X-axis direction. Each first fastener and each first fastening hole are correspondingly arranged and distributed along the X-axis direction. One of the first oblong hole 103 and at least one first fastening hole is disposed in the first mounting base 61 and the other is disposed in the first suction nozzle 10. The first fastener passes through the first oblong hole 103 and is fastened to the first fastening hole to connect the first mounting base 61 and the first suction nozzle 10.

[0048] In the above embodiment, the first horizontal position adjustment mechanism 60 is configured with a structure consisting of an oblong hole and a fastener, enabling manual adjustment of the first suction nozzle 10 in the X-axis direction. Specifically, after loosening the first fastener, the first suction nozzle 10 can slide along the extension direction of the first oblong hole 103, thereby changing the position of the first suction nozzle 10 in the X-axis direction; after adjusting to the target position, tightening the first fastener will fix the first suction nozzle 10 to the first mounting base 61. This structure offers the following advantages: First, it is simple in design, requiring only an oblong hole and a fastening hole on the first mounting base 61 and the first suction nozzle 10, and position adjustment can be achieved with the fasteners, eliminating the need for complex transmission mechanisms and reducing manufacturing costs and assembly difficulty. Second, the adjustment is reliable; once the first fastener is tightened, it maintains the long-term stability of the first suction nozzle 10's position, preventing drift due to equipment vibration. Third, it is easy to operate; operators only need to loosen and tighten the first fastener to complete the adjustment, requiring no special tools, making it suitable for rapid debugging during equipment assembly or production changeovers. Fourth, the length of the oblong hole limits the adjustment range of the first suction nozzle 10, avoiding interference problems caused by over-adjustment. In other embodiments, other manual or automatic adjustment methods can also be used.

[0049] In some embodiments, the second horizontal position adjustment mechanism 70 includes a second mounting base 71, a second oblong hole 203, at least one second fastening hole, and at least one second fastener. The second mounting base 71 is fixed to the output end of the second Z-axis linear module 40. The second oblong hole 203 extends along the X-axis direction. Each second fastener and each second fastening hole are correspondingly arranged and distributed along the X-axis direction. One of the second oblong hole 203 and at least one second fastening hole is disposed in the second mounting base 71, and the other is disposed in the second suction nozzle 20. The second fastener passes through the second oblong hole 203 and is fastened to the second fastening hole to connect the second mounting base 71 and the second suction nozzle 20. Similarly, the same oblong hole and fastener mating structure can be used in the second horizontal position adjustment mechanism 70 to achieve the same technical effect.

[0050] In some embodiments, the controller of this application is configured to perform the following timing control: control the first Z-axis linear module 30 to cause the first nozzle 10 to pick up the first chip and place the first chip on the transfer stage 50; control the transfer stage 50 to rotate to correct the angle of the first chip according to the image acquired by the vision module 90; control the first nozzle 10 to re-pick up the first chip on the transfer stage 50 and maintain the picking state; control the second Z-axis linear module 40 to cause the second nozzle 20 to pick up the second chip and place the second chip on the transfer stage 50; control the transfer stage 50 to rotate to correct the angle of the second chip according to the image acquired by the vision module 90; control the second nozzle 20 to re-pick up the second chip on the transfer stage 50; control the first Z-axis linear module 30 and the second Z-axis linear module 40 to lower the first nozzle 10 and the second nozzle 20 to eutecticly mount the first chip and the second chip onto the substrate.

[0051] In the above embodiments, by configuring the controller to execute the aforementioned timing control, automated and coordinated control of the first suction nozzle 10, the second suction nozzle 20, the transfer table 50, the first horizontal position adjustment mechanism 60, and the second horizontal position adjustment mechanism 70 is achieved. Specifically, the controller automatically controls the first suction nozzle 10 to complete material picking, placement, angle correction, and re-picking and holding, following the order of first chip first and then second chip. Then, it controls the second suction nozzle 20 to complete the same material picking and correction process. Finally, it controls the first suction nozzle 10 and the second suction nozzle 20 to descend and complete the eutectic bonding. The beneficial effects of this solution are as follows: First, it realizes a fully automated dual-chip sequential calibration and simultaneous placement process without manual intervention, significantly improving production efficiency and placement consistency. Second, the controller can precisely control the action sequence and coordination timing of each mechanism according to the preset timing sequence, avoiding the timing chaos or action conflict that may occur during manual operation. Third, the controller's independent control of the first nozzle 10 and the second nozzle 20 ensures that the angle calibration of the two chips does not interfere with each other, guaranteeing their respective calibration accuracy. Fourth, the controller controls the two nozzles to descend for placement, ensuring that the solder of the two chips melts and solidifies simultaneously, thereby avoiding the problem of the placed chips being reheated and cooled due to sequential eutectic bonding, effectively ensuring the reliability of the eutectic connection.

[0052] In some embodiments, after the first chip and the second chip have both been calibrated, the first Z-axis linear module 30 and the second Z-axis linear module 40 can be controlled to cause the first nozzle 10 and the second nozzle 20 to descend synchronously, so that the first nozzle 10 and the second nozzle 20 simultaneously mount the first chip and the second chip onto the substrate 81. In the above embodiments, the first Z-axis linear module 30 and the second Z-axis linear module 40 drive the first nozzle 10 and the second nozzle 20 to descend synchronously, so that the first nozzle 10 and the second nozzle 20 simultaneously mount the chips they have picked up onto the substrate 81. The beneficial effects of this solution are: the solder of the two chips melts and solidifies at the same time, realizing the parallel eutectic bonding of the two chips, fundamentally avoiding the problem of the first chip being reheated and cooled again due to sequential mounting, effectively ensuring the reliability of the eutectic bonding; at the same time, the synchronous descent of the first nozzle 10 and the second nozzle 20 ensures that the two chips contact the substrate 81 at the same speed and stroke, resulting in uniform mounting pressure distribution, which is beneficial to improving the consistency of eutectic bonding quality. In other embodiments, the descent of the first suction nozzle 10 and the second suction nozzle 20 may not be completely synchronized.

[0053] This application also provides a multi-chip eutectic bonding method, applied to the multi-chip eutectic bonding apparatus of the above embodiments. Please refer to [link to relevant documentation]. Figure 6 , Figure 6 This is a flowchart illustrating a multi-chip eutectic bonding method provided in an embodiment of this application. The bonding method includes: Step S110: The first Z-axis linear module drives the first nozzle to pick up the first chip and maintain the picking state.

[0054] Step S120: While the first nozzle is holding the first chip, the second Z-axis linear module drives the second nozzle to hold the second chip.

[0055] The chip mounting method provided in this application allows the first nozzle 10 and the second nozzle 20 to move independently along the Z-axis. Therefore, the first chip can be picked up first, and then the first nozzle 10 can be in the state of picking up the first chip before the second chip is picked up. This avoids the reliability problems caused by the reheating and cooling of the already mounted chips during the eutectic process, and also eliminates the limitation of chip height difference on mounting quality.

[0056] In some embodiments, step S110 includes: Step S111: The first suction nozzle places the first chip it has sucked up onto the transfer platform, and controls the rotation of the transfer platform to correct the angle of the first chip.

[0057] Step S112: The first suction nozzle re-picks up the calibrated first chip and maintains the suction state.

[0058] After step S120, the following is also included: Step S130: The second suction nozzle places the second chip it has sucked up onto the transfer platform, and controls the rotation of the transfer platform to correct the angle of the second chip.

[0059] Step S140: The second nozzle re-absorbs the calibrated second chip.

[0060] Steps S111 to S112 described above are for picking up and calibrating the first chip, specifically including the first suction nozzle 10 picking up the first chip, placing the first chip on the transfer table 50, and the transfer table 50 calibrating the angle of the first chip. Steps S120 to S140 are for picking up and calibrating the second chip, specifically including the second suction nozzle 20 picking up the second chip, placing the second chip on the transfer table 50, and the transfer table 50 calibrating the angle of the second chip.

[0061] In this embodiment, the first chip picked up by the first nozzle 10 and the second chip picked up by the second nozzle 20 can be placed sequentially on the same transfer platform 50 for angle correction. This eliminates the need for a separate rotation correction mechanism for each nozzle, simplifying the nozzle structure and reducing device cost and complexity while achieving precise chip angle correction. Furthermore, since the transfer platform 50 is located within the surface mount assembly, the first chip, after correction, can be directly picked up again by the first nozzle 10 and transferred to the substrate for mounting without additional transfer devices, improving efficiency. Similarly, the second chip can undergo angle correction using the same transfer platform 50, further demonstrating the cost advantages of shared structure.

[0062] In some embodiments, prior to step S110, the method further includes: Step S100: Adjust the horizontal distance between the first suction nozzle and the second suction nozzle to a preset value using the horizontal distance adjustment mechanism; wherein, at least one of the first suction nozzle and the second suction nozzle has a width in the first horizontal direction that is less than a preset threshold, and the horizontal position adjustment mechanism is used to adjust the horizontal distance between the first suction nozzle and the second suction nozzle in the first horizontal direction.

[0063] In this embodiment, by setting a horizontal position adjustment mechanism, the distance between the two suction nozzles in the first direction can be adjusted to a preset value before material picking, ensuring that each suction nozzle is precisely aligned with its corresponding chip in the first direction. This effectively compensates for the positional deviation between the suction nozzle and the chip caused by installation errors, ensuring the reliability and stability of material picking. Furthermore, only an adjustment mechanism in the first direction is needed to meet the accuracy requirements, eliminating the need for adjustment structures in both directions. This simplifies the device structure, reduces manufacturing costs, and makes the device more compact.

[0064] The specific structure of the horizontal position adjustment mechanism can be found in the patch device of the above embodiment, and will not be described again here.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A multi-chip eutectic bonding device, characterized in that, include: The first and second suction nozzles, which are distributed horizontally, are used to pick up the first chip and the second chip, respectively. The first Z-axis linear module and the second Z-axis linear module, which are distributed horizontally, are respectively connected to the first suction nozzle and the second suction nozzle, and are used to independently control the movement of the first suction nozzle and the second suction nozzle in the Z-axis direction. Specifically, the first Z-axis linear module controls the first nozzle to first pick up the first chip and maintain the picking state. While the first nozzle is holding the first chip, the second Z-axis linear module controls the second nozzle to pick up the second chip.

2. The multi-chip eutectic bonding device according to claim 1, characterized in that, The patch assembly further includes: A transfer station is used to allow the first suction nozzle to place the first chip and the second suction nozzle to place the second chip in sequence, and to correct the angle of the first chip and / or the second chip by rotating the transfer station.

3. The multi-chip eutectic bonding device according to claim 2, characterized in that, The patch assembly further includes: A vision module is disposed above the transfer station and is used at least to acquire angular images of the first chip and / or the second chip located on the transfer station. The controller calculates the angle deviation of the first chip placed on the transfer platform based on the angle image of the first chip acquired by the vision module, and controls the rotation of the transfer platform to correct the angle of the first chip based on the angle deviation of the first chip. The controller also calculates the angle deviation of the second chip placed on the transfer platform based on the angle image of the second chip acquired by the vision module, and controls the rotation of the transfer platform to correct the angle of the second chip based on the angle deviation of the second chip.

4. The multi-chip eutectic bonding device according to claim 1, characterized in that, The patch assembly further includes: At least one horizontal position adjustment mechanism is connected to the first suction nozzle and / or the second suction nozzle, for adjusting the horizontal distance between the first suction nozzle and the second suction nozzle before the first suction nozzle and the second suction nozzle pick up the first chip and the second chip; Wherein, at least one of the first suction nozzle and the second suction nozzle has a width in the first horizontal direction that is less than a preset threshold, and the horizontal position adjustment mechanism is used to adjust the distance between the first suction nozzle and the second suction nozzle in the first horizontal direction.

5. The multi-chip eutectic bonding apparatus according to claim 4, characterized in that, The at least one horizontal position adjustment mechanism includes: A first horizontal position adjustment mechanism is connected to the first suction nozzle and is used to adjust the horizontal position of the first suction nozzle in the first direction; The second horizontal position adjustment mechanism is connected to the second suction nozzle and is used to adjust the horizontal position of the second suction nozzle in the first direction.

6. The multi-chip eutectic bonding apparatus according to claim 5, characterized in that, The first horizontal position adjustment mechanism includes a first mounting base, a first oblong hole, at least one first fastening hole, and at least one first fastener. The first mounting base is fixed to the output end of the first Z-axis linear module. The first oblong hole extends along the first direction. Each first fastener and each first fastening hole are arranged in a corresponding manner and distributed along the first direction. One of the first oblong hole and the at least one first fastening hole is disposed in the first mounting base and the other is disposed in the first suction nozzle. The first fastener passes through the first oblong hole and is fastened to the first fastening hole to connect the first mounting base and the first suction nozzle. And / or, the second horizontal position adjustment mechanism includes a second mounting base, a second oblong hole, at least two second fastening holes, and at least one second fastener. The second mounting base is fixed to the output end of the second Z-axis linear module. The second oblong hole extends along the first direction. Each second fastener and each second fastening hole are correspondingly arranged and distributed along the first direction. One of the second oblong hole and the at least one second fastening hole is disposed in the second mounting base, and the other is disposed in the second suction nozzle. The second fastener passes through the second oblong hole and is fastened to the second fastening hole to connect the second mounting base and the second suction nozzle.

7. The multi-chip eutectic bonding apparatus according to claim 3, characterized in that, The controller is configured to perform the following timing control: The first Z-axis linear module is controlled to make the first nozzle pick up the first chip and place the first chip on the transfer platform; Based on the image acquired by the vision module, the rotation of the turntable is controlled to correct the angle of the first chip; Control the first suction nozzle to re-pick up the first chip on the transfer station and maintain the suction state; Control the second Z-axis linear module to make the second nozzle pick up the second chip and place the second chip on the transfer platform; Based on the images acquired by the vision module, the rotation of the turntable is controlled to correct the angle of the second chip; Control the second suction nozzle to re-absorb the second chip on the transfer station; Control the first Z-axis linear module and the second Z-axis linear module to lower the first suction nozzle and the second suction nozzle, and eutectic mount the first chip and the second chip onto the substrate.

8. A method for multi-chip eutectic bonding, characterized in that, The multi-chip eutectic bonding apparatus according to any one of claims 1 to 7, wherein the bonding method comprises: The first Z-axis linear module drives the first nozzle to pick up the first chip and maintain the picking state; While the first suction nozzle is holding the first chip, the second Z-axis linear module drives the second suction nozzle to hold the second chip.

9. The multi-chip eutectic bonding method according to claim 8, characterized in that, The steps of the first Z-axis linear module driving the first nozzle to pick up the first chip and maintaining the picking state include: The first suction nozzle places the first chip it has picked up onto the transfer platform, and controls the rotation of the transfer platform to correct the angle of the first chip; The first suction nozzle re-picks up the calibrated first chip and maintains the suction state; After the step of the second Z-axis linear module driving the second nozzle to pick up the second chip while the first nozzle is holding the first chip, the method further includes: The second suction nozzle places the second chip it has sucked up onto the transfer platform, and controls the rotation of the transfer platform to correct the angle of the second chip; The second nozzle re-absorbs the calibrated second chip.

10. The multi-chip eutectic bonding method according to claim 8, characterized in that, Before the step of the first Z-axis linear module driving the first nozzle to pick up the first chip and maintaining the picking state, the method further includes: The horizontal spacing adjustment mechanism adjusts the horizontal spacing between the first suction nozzle and the second suction nozzle to a preset value; wherein, at least one of the first suction nozzle and the second suction nozzle has a width in a first horizontal direction that is less than a preset threshold, and the horizontal position adjustment mechanism is used to adjust the horizontal spacing between the first suction nozzle and the second suction nozzle in the first direction.

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