Wafer loading mechanism for high-precision chip three-temperature test

Abstract

This invention relates to the field of chip testing technology and discloses a high-precision wafer loading mechanism for three-temperature chip testing, comprising a basket lifting mechanism, a film expansion mechanism, a pull arm mechanism, grippers, a grasping mechanism, and a telescopic component. By designing the grasping mechanism as a thin-film structure, including a substrate, a pressing plate, and an airbag, this invention allows the grasping mechanism to adapt to the small interlayer spacing of wafer rings within the basket, smoothly extending into the narrow gaps between adjacent wafer rings or between a wafer ring and the top structure of the basket. This avoids the problem of interference between the grippers and the lower wafer ring or the top of the basket when the grippers directly extend into the basket, significantly improving the success rate of wafer ring grasping, and is particularly suitable for baskets with small wafer slot spacing.

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