Chip-glass bonding apparatus

Abstract

This invention discloses a chip-glass bonding device, comprising: a sealed cavity, which is divided into an upper cover and a lower cavity, the lower cavity being connected to an external vacuum device; a pressure rod, slidably connected to the upper cover, with a first vacuum suction cup at its lower end for adsorbing glass; a transfer platform, disposed within the lower cavity for supporting the chip; at least one pair of detection mechanisms, mounted on the lower cavity for detecting whether the glass and chip are aligned from different angles; and several UV curing lamps, mounted on the bottom of the upper cover and arranged in a ring. This invention enables the entire bonding process to be completed at a single station, greatly shortening the process flow and improving production efficiency; it also improves bonding accuracy and increases product yield.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing equipment technology, and in particular to a chip-glass bonding device. Background Technology

[0002] UV adhesive bonding between chips and glass is a key pre-process in the thinning process of advanced packaging such as optical chips, micro-sensor chips, memory chips, power semiconductor chips, image sensor chips (CIS), logic chips, MEMS (Micro-Electro-Mechanical Systems), RF / high-frequency communication chips, optoelectronic devices & display driver chips, flexible electronic chips, and TSV (Through Silicon Via) 3D IC stacked chips. It mainly uses UV photosensitive colloids to achieve bonding and sealing between glass cover plates and chip wafers / bare chips, as well as optical packaging. It has the advantages of low-temperature processing, wide adaptability, and low cost, and is widely used in consumer electronics, optoelectronic sensing, and various advanced packaging processes, providing a stable and robust bonding state and perfect realization of thinning chip grinding processes.

[0003] Existing chip-glass bonding equipment employs a split, multi-station structure, separating processes such as glass-chip alignment detection, vacuum bonding, UV curing, and precision re-inspection into different independent stations. Workpieces require multiple transfers and loading / unloading operations between these stations using robotic arms. This processing method has several inherent drawbacks: the workpiece is highly susceptible to minute displacements and angular misalignments during multi-station transfers, resulting in accumulated alignment errors. This significantly reduces the alignment accuracy of the glass-chip bonding, leading to a decrease in product yield. Summary of the Invention

[0004] According to an embodiment of the present invention, a chip-glass bonding apparatus is provided, comprising: The sealed cavity is divided into an upper cover and a lower cavity, with the lower cavity connected to an external vacuum device. The pressure rod is slidably connected to the upper cover, and a first vacuum suction cup is provided at the lower end of the pressure rod. The first vacuum suction cup is used to adsorb glass. The transfer platform is located inside the lower cavity and is used to support the chip; At least one pair of detection mechanisms (which are existing technologies) are installed on the lower cavity to detect whether the glass and the chip are aligned from different angles; Several UV curing lamps are installed at the bottom of the top cover and arranged in a ring.

[0005] Furthermore, a second vacuum suction cup is provided on the transfer platform, which is used to adsorb the chip.

[0006] Furthermore, the transfer platform can drive the second vacuum suction cup to move along the X and Y directions.

[0007] Furthermore, a sealing connection can be formed between the upper cover and the lower cavity through a sealing ring.

[0008] Furthermore, a glass window corresponding to the testing mechanism is provided on the side of the lower cavity. The glass window is sealed to the lower cavity, and the testing mechanism can use the glass window to check whether the glass and the chip are aligned.

[0009] Furthermore, a sealing ring forms a sealed connection between the lower pressure rod and the upper cover to achieve a seal when the lower pressure rod moves up and down relative to the upper cover.

[0010] Furthermore, the number of UV curing lamps is 3 to 8.

[0011] The chip-glass bonding apparatus according to embodiments of the present invention enables the entire bonding process to be completed at the same station, greatly shortening the process flow and improving production efficiency; at the same time, it improves bonding accuracy and increases product yield.

[0012] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure according to an embodiment of the present invention; Figure 2 for Figure 1 Top view; Figure 3 for Figure 2 Sectional view along axis AA; Figure 4 for Figure 2 BB-direction sectional view. Detailed Implementation

[0014] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0015] First, combine Figures 1-4 The chip-glass bonding apparatus according to embodiments of the present invention is described, which is used for chip-glass bonding and has a wide range of applications.

[0016] like Figures 1-4 As shown, the chip-glass bonding apparatus of this embodiment includes: A sealed cavity (belonging to the prior art) is divided into an upper cover 1 and a lower cavity 2, with the lower cavity 2 connected to an external vacuum device; The pressure rod 3 is slidably connected to the upper cover 1. A first vacuum suction cup 31 is provided at the lower end of the pressure rod 3. The first vacuum suction cup 31 is used to adsorb the glass 7. Transfer platform 4 is located inside the lower cavity 2 and is used to carry chip 8; At least one pair of detection mechanisms 5 are installed on the lower cavity 2 to detect whether the glass 7 and the chip 8 are aligned from different angles; Several UV curing lamps 6 are installed at the bottom of the upper cover 1 and arranged in a ring.

[0017] Furthermore, such as Figures 3-4 As shown, in this embodiment, a second vacuum suction cup 41 is provided on the transfer platform 4. The second vacuum suction cup 41 is used to adsorb the chip 8 and prevent the chip 8 from being displaced.

[0018] Furthermore, in this embodiment, the first vacuum suction cup 31 and the second vacuum suction cup 41 are connected to a vacuum generator, which provides negative pressure to the corresponding vacuum suction cup.

[0019] Furthermore, such as Figures 3-4 As shown, in this embodiment, the transfer platform 4 can drive the second vacuum chuck 41 to move along the X and Y directions to achieve fine-tuning and alignment of the chip 8.

[0020] Furthermore, such as Figures 3-4 As shown, in this embodiment, the upper cover 1 and the lower cavity 2 can be connected by a sealing ring, which is the prior art.

[0021] Furthermore, such as Figures 3-4 As shown, in this embodiment, a glass window 21 corresponding to the detection mechanism 5 is provided on the side of the lower cavity 2. The glass window 21 is sealed to the lower cavity 2. The detection mechanism 5 can detect whether the glass 7 and the chip 8 are aligned through the glass window 21.

[0022] Furthermore, such as Figure 3 As shown, in this embodiment, the lower pressure rod 3 and the upper cover 1 are connected by a sealing ring (which is the prior art) to achieve sealing when the lower pressure rod 3 moves up and down relative to the upper cover 1.

[0023] Furthermore, such as Figures 3-4 As shown, in this embodiment, the number of UV curing lamps 6 is 3 to 8, and the ring layout can ensure the uniformity of light illumination and achieve uniform curing of the bonded colloid.

[0024] Working principle: After preparation, the glass 7 is fixed by the first vacuum suction cup 31, and the chip 8 is fixed by the second vacuum suction cup 41. The sealed cavity is closed to complete the vacuuming operation. Then, the detection mechanism 5 detects the alignment status of the glass 7 and the chip 8 in real time, and drives the transfer platform 4 to make fine adjustments in the X and Y directions according to the detection data until the workpieces are accurately aligned. After alignment, the pressure rod 3 moves down to press the glass 7 and the chip 8 together. Then, the first vacuum suction cup 31 loses air and detaches from the glass 7. The pressure rod 3 moves the first vacuum suction cup 31 up to reset. Finally, the ring-shaped UV curing lamps 6 are turned on to uniformly cure the bonding colloid. The entire process of alignment, pressing and curing can be completed in a single cavity without the need for workpiece transfer, which greatly improves the processing accuracy and production efficiency.

[0025] Above, refer to Figures 1-4 A chip 8-glass 7 bonding apparatus according to an embodiment of the present invention is described, which enables the entire bonding process to be completed at the same station, greatly shortening the process flow and improving production efficiency; at the same time, it improves bonding accuracy and increases product yield.

[0026] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element.

[0027] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A chip-glass bonding device, characterized in that, Include: A sealed cavity, which is divided into an upper cover and a lower cavity; A pressure rod is slidably connected to the upper cover, and a first vacuum suction cup is provided at the lower end of the pressure rod. The first vacuum suction cup is used to adsorb glass. A transfer platform, disposed within the lower cavity, is used to support the chip; At least one pair of detection mechanisms are installed on the lower cavity to detect whether the glass and the chip are aligned from different angles; A plurality of UV curing lamps are installed at the bottom of the upper cover and arranged in a ring.

2. The chip-glass bonding apparatus as described in claim 1, characterized in that, The transfer platform is equipped with a second vacuum suction cup, which is used to adsorb the chip.

3. The chip-glass bonding apparatus as described in claim 2, characterized in that, The transfer platform can drive the second vacuum suction cup to move along the X and Y directions.

4. The chip-glass bonding apparatus as described in claim 1, characterized in that, The upper cover and the lower cavity can be sealed together by a sealing ring.

5. The chip-glass bonding apparatus as described in claim 1, characterized in that, The lower cavity has a glass window on its side corresponding to the detection mechanism. The glass window is sealed to the lower cavity, and the detection mechanism can detect whether the glass and the chip are aligned through the glass window.

6. The chip-glass bonding apparatus as described in claim 1, characterized in that, The lower pressure rod and the upper cover are connected by a sealing ring to achieve a seal when the lower pressure rod moves up and down relative to the upper cover.

7. The chip-glass bonding apparatus as described in claim 1, characterized in that, The number of UV curing lamps is 3 to 8.

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