Cleaning device, cleaning method, wafer grinder, storage medium, and cleaning apparatus

Abstract

This application relates to a cleaning device, a cleaning method, a wafer polishing machine, a storage medium, and a cleaning equipment. The cleaning device includes a base, an oilstone mechanism, a sponge mechanism, and a lifting drive. The base is connected to a polishing water tank. The oilstone mechanism is mounted on the base and includes an oilstone and a rotating shaft, with the oilstone connected to the rotating shaft. The sponge mechanism includes a sponge and a central shaft, with the sponge connected to the central shaft and the central shaft passing through the rotating shaft, and the two slidingly engaging axially. The relative positions of the central shaft and the rotating shaft are locked circumferentially, and the rotating shaft is configured to rotate to drive the sponge mechanism and the oilstone mechanism to rotate synchronously. The lifting drive is connected to the central shaft and can drive the central shaft to move up and down axially.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a cleaning apparatus, cleaning method, wafer polishing machine, storage medium, and cleaning equipment. Background Technology

[0002] With the continuous development of semiconductor packaging technology, the precision requirements of wafer grinding and thinning processes are becoming increasingly stringent. After wafer grinding, the non-grinding surfaces of the wafer, as well as the suction surfaces of the chucks used during handling, may be contaminated with grinding debris, particles, and other pollutants. If these contaminants are not removed, they will affect subsequent wafer handling and processing steps.

[0003] In related technologies, cleaning devices are typically used to clean the polished wafers and transfer chucks. These devices include an oilstone and cleaning components (such as a roller brush or sponge). The oilstone is used to polish and clean the suction surface of the transfer chuck, while the cleaning components are used to clean the non-polished surfaces of the wafer. To achieve both wafer cleaning and chuck cleaning functions, the oilstone and cleaning components each require independent drive mechanisms to perform their cleaning actions.

[0004] However, the oilstone and cleaning component each have their own independent drive systems, resulting in a complex overall structure, large size, and high manufacturing cost. Moreover, when cleaning the non-grinding surface of the wafer, the cleaning component needs to protrude from the oilstone to contact the wafer, while when cleaning the transfer suction cup, the cleaning component needs to be lower than the oilstone to avoid interfering with the oilstone's operation. In addition, an independent lifting drive structure is required in addition to the cleaning component's own rotation drive mechanism, further increasing the complexity of the device structure. Summary of the Invention

[0005] Therefore, it is necessary to provide a cleaning device, cleaning method, wafer polishing machine, storage medium, and cleaning equipment to address the problems of complex structure and high cost of existing cleaning devices.

[0006] A first aspect of this application provides a cleaning apparatus, the cleaning apparatus comprising:

[0007] The base is used to connect to the grinding water tank;

[0008] An oilstone mechanism is mounted on the base. The oilstone mechanism includes an oilstone and a rotating shaft, with the oilstone connected to the rotating shaft.

[0009] A sponge mechanism includes a sponge and a central shaft, wherein the sponge is connected to the central shaft, the central shaft passes through the rotating shaft, and the two are slidably engaged along the axial direction; the relative positions of the central shaft and the rotating shaft are locked in the circumferential direction, and the rotating shaft is configured to rotate so as to drive the sponge mechanism and the oilstone mechanism to rotate synchronously;

[0010] A lifting drive component is connected to the central shaft, and the lifting drive component is capable of driving the central shaft to move up and down along the axial direction.

[0011] In one embodiment, the base includes:

[0012] Mounting section for connection to the grinding water tank;

[0013] An adjusting plate is connected at one end to the mounting part, and at the other end can swing relative to the mounting part along the axial direction; the oilstone mechanism is connected to the adjusting plate.

[0014] An adjusting member is connected to the mounting portion and abuts against the other end of the adjusting plate. The adjusting member is capable of moving along the axial direction to drive the other end of the adjusting plate to swing relative to the mounting portion.

[0015] In one embodiment, the oilstone mechanism further includes a connecting seat and a mounting assembly, wherein the oilstone is connected to the rotating shaft via the connecting seat, and the mounting assembly includes:

[0016] An oilstone support is provided on the connecting seat. The oilstone support includes a first plate and a second plate arranged opposite to each other, and a third plate connecting the first plate and the second plate. The oilstone is placed within the space enclosed by the oilstone support.

[0017] A clamping pad is disposed between the first plate and the oilstone;

[0018] A clamping element passes through the first plate and abuts against the clamping pad, so that the clamping pad and the second plate together clamp the oilstone.

[0019] In one embodiment, the mounting components are provided in a plurality of them, which are arranged at intervals around the axial direction, and each mounting component is configured to mount one of the oilstones.

[0020] In one embodiment, the sponge mechanism includes a plurality of sponge supports, each of which is provided with at least one sponge, and the sponge is connected to the central axis through the sponge support;

[0021] Multiple sponge supports are arranged around the axial direction, and one sponge support is provided between two adjacent mounting components.

[0022] In one embodiment, a limiting structure is also included, the limiting structure including a limiting groove and a limiting protrusion that engage with each other, the limiting groove being provided in multiple ways, the multiple limiting grooves being arranged around the axial direction and extending along the axial direction, one of the limiting groove and the limiting protrusion being disposed on the rotating shaft and the other being disposed on the central shaft.

[0023] In one embodiment, the central shaft has a first channel, and the sponge mechanism further includes:

[0024] A sponge fixing seat, wherein the sponge is fixed on the sponge fixing seat, the sponge fixing seat is connected to the central shaft, and the sponge fixing seat has a second channel communicating with the first channel;

[0025] A spray pipe is connected to the second channel, and the spray pipe has multiple spray holes;

[0026] A cleaning source is connected to the first channel, and the cleaning source is used to supply cleaning fluid or purging gas.

[0027] A second aspect of this application also provides a wafer polishing machine, including a polishing water tank and a cleaning device as described in any of the preceding claims, wherein the base is connected to the polishing water tank.

[0028] A third aspect of this application also provides a cleaning method using the cleaning apparatus described in any of the preceding claims, the cleaning method comprising:

[0029] When the part to be cleaned is a wafer, the central shaft is driven to move axially by the lifting drive, so that the cleaning surface of the sponge is higher than the grinding surface of the oilstone.

[0030] Make the sponge contact the non-abrasive surface of the wafer;

[0031] The rotating shaft is driven to rotate so that the sponge cleans the non-abrasive surface of the wafer;

[0032] When the object to be cleaned is a suction cup, the central shaft is driven to move axially by the lifting drive, so that the cleaning surface of the sponge is lower than the grinding surface of the whetstone.

[0033] Make the oilstone come into contact with the adsorption surface of the conveying suction cup;

[0034] The rotating shaft is driven to rotate so that the oilstone cleans the suction surface of the transport suction cup.

[0035] In one embodiment, before the sponge cleans the non-abrasive surface of the wafer, cleaning fluid is sprayed onto the non-abrasive surface of the wafer through a spray pipe;

[0036] After the sponge cleans the non-abrasive surface of the wafer, the spraying of cleaning fluid is stopped, and purging gas is blown onto the non-abrasive surface of the wafer through the spray pipe to dry the non-abrasive surface of the wafer;

[0037] And / or, before the oilstone cleans the adsorption surface of the transfer suction cup, a cleaning solution is sprayed onto the adsorption surface of the transfer suction cup through a spray pipe.

[0038] After the oilstone cleans the adsorption surface of the transfer suction cup, the spraying of cleaning fluid is stopped, and purging gas is blown onto the adsorption surface of the transfer suction cup through the spray pipe to dry the adsorption surface of the transfer suction cup.

[0039] In one embodiment, the step of bringing the sponge into contact with the non-abrasive surface of the wafer includes:

[0040] The chuck is driven to lower the wafer until the non-abrasive surface of the wafer contacts the sponge.

[0041] During the process of the sponge cleaning the non-abrasive surface of the wafer, the transport suction cup is driven to swing back and forth at a fixed height;

[0042] And / or, the step of bringing the oilstone into contact with the suction surface of the conveying suction cup includes:

[0043] Drive the transfer suction cup to descend until the suction surface of the transfer suction cup contacts the oilstone;

[0044] During the process of the oilstone cleaning the adsorption surface of the transfer suction cup, the transfer suction cup is driven to swing back and forth at a fixed height.

[0045] In one embodiment, before the oilstone cleans the suction surface of the transport suction cup, the method further includes:

[0046] Control the transfer suction cup to activate the back-blowing function to blow out the dirt inside the micropores of the transfer suction cup;

[0047] The backflush function remains on until the oilstone has finished cleaning the suction surface of the transfer suction cup.

[0048] A fourth aspect of this application provides a storage medium storing a computer program / instructions that, when executed by a processor, implement the steps of the method as described in any one of the preceding descriptions.

[0049] The fifth aspect of this application provides a cleaning device, comprising:

[0050] processor;

[0051] Memory, which stores computer programs;

[0052] When the processor executes the computer program, it implements the steps of any one of the methods described above.

[0053] The aforementioned cleaning device connects the base to the grinding water tank, providing a stable mounting foundation for the oilstone and sponge mechanisms. By inserting the central shaft through the rotating shaft, the sponge and oilstone mechanisms are coaxially nested, and the relative positions of the central shaft and rotating shaft are locked circumferentially. When the rotating shaft is configured to rotate, it can drive the sponge and oilstone mechanisms to rotate synchronously. This allows the oilstone and sponge mechanisms to share the same set of rotational drive power, eliminating the need for separate rotational drive sources for the oilstone and sponge. This simplifies the overall transmission structure, reduces the number of parts, lowers manufacturing costs, and reduces the size of the device. Furthermore, because the relative positions of the central shaft and rotating shaft are locked circumferentially, the sponge mechanism maintains a fixed circumferential relative position with the oilstone mechanism during lifting and rotation, preventing the sponge from deflecting or swaying during lifting.

[0054] By sliding the central shaft and rotating shaft axially, the sponge mechanism can move up and down relative to the whetstone mechanism axially. The lifting drive is connected to the central shaft and drives the central shaft to move up and down axially, allowing the cleaning surface of the sponge to be higher or lower than the grinding surface of the whetstone. Only one lifting drive is needed to achieve the function of the sponge extending during operation and avoiding obstruction when not in operation. When cleaning the non-grinding surface of the wafer, the sponge rises until its cleaning surface is higher than the grinding surface of the whetstone, ensuring that the sponge can smoothly contact the wafer for cleaning. When cleaning the transfer suction cup, the sponge descends until its cleaning surface is lower than the grinding surface of the whetstone, avoiding interference between the sponge and the whetstone when cleaning the transfer suction cup. This allows for two operating modes: cleaning the non-grinding surface of the wafer and cleaning the suction surface of the transfer suction cup. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of the cleaning device provided in this application embodiment installed in a grinding water tank.

[0056] Figure 2 This is a schematic diagram of the cleaning device provided in an embodiment of this application.

[0057] Figure 3 This is a schematic diagram of the internal structure of the cleaning device provided in an embodiment of this application.

[0058] Figure 4 This is a schematic diagram of the internal structure of the base provided in an embodiment of this application.

[0059] Figure 5 This is a schematic diagram of the structure of the base provided in an embodiment of this application.

[0060] Figure 6 This is a schematic diagram of the structure of the oilstone mechanism provided in the embodiments of this application.

[0061] Figure 7This is a schematic diagram of the internal structure of the oilstone mechanism provided in the embodiments of this application.

[0062] Figure 8 This is a schematic diagram of a connector with a limiting groove provided in an embodiment of this application.

[0063] Figure 9 This is a schematic diagram of the installation component provided in an embodiment of this application.

[0064] Figure 10 This is a first-view structural schematic diagram of the sponge mechanism provided in an embodiment of this application.

[0065] Figure 11 This is a second-view structural schematic diagram of the sponge mechanism provided in an embodiment of this application.

[0066] Figure 12 This is a schematic diagram of the internal structure of the sponge mechanism provided in an embodiment of this application.

[0067] Figure 13 The motion trajectory diagram of the handling suction cup provided in the embodiment of this application.

[0068] Figure 14 The flowchart illustrates a cleaning method for a wafer when the part to be cleaned is a wafer, as provided in this embodiment of the application.

[0069] Figure 15 The flowchart illustrates a cleaning method for a transfer suction cup when the component to be cleaned is provided in an embodiment of this application.

[0070] Figure 16 This is an overall flowchart of the cleaning method provided in the embodiments of this application.

[0071] Figure label:

[0072] 100. Base; 110. Mounting part; 120. Adjusting plate; 130. Adjusting component;

[0073] 200. Oilstone mechanism; 210. Oilstone; 220. Connecting seat; 230. Rotating shaft; 240. Bearing; 250. Bearing seat; 260. Waterproof cover; 270. Mounting assembly; 271. Oilstone support; 2711. First plate; 2712. Third plate; 272. Clamping pad;

[0074] 300, Sponge mechanism; 310, Sponge; 320, Sponge support; 330, Central shaft; 340, Sponge fixing seat; 350, Spray pipe;

[0075] 400. Lifting drive components;

[0076] 510. Limiting groove; 520. Limiting protrusion;

[0077] 600. Rotary drive mechanism; 610. Motor; 620. First pulley; 630. Second pulley;

[0078] 700. Rotary joint;

[0079] 800. Grinding water tank;

[0080] 900. Handling suction cup; 910. Loading and unloading station; 920. Wafer cleaning station. Detailed Implementation

[0081] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0082] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0083] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0084] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0085] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0086] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0087] The existing cleaning devices have separate rotary drive systems and lifting drive systems for the oilstone and cleaning components, resulting in a complex overall structure, large size, and high manufacturing cost. Furthermore, the need for a separate lifting drive structure to switch the working position of the cleaning components further exacerbates the complexity of the device structure.

[0088] To address the aforementioned problems, the first aspect of this application provides a cleaning device, such as... Figures 1 to 3As shown, the cleaning device includes a base 100, an oilstone mechanism 200, a sponge mechanism 300, and a lifting drive 400. The base 100 is connected to the grinding water tank 800. The oilstone mechanism 200 is mounted on the base 100 and includes an oilstone 210 and a rotating shaft 230, with the oilstone 210 connected to the rotating shaft 230. The sponge mechanism 300 includes a sponge 310 and a central shaft 330, with the sponge 310 connected to the central shaft 330. The central shaft 330 passes through the rotating shaft 230, and the two slide in axial direction. The relative positions of the central shaft 330 and the rotating shaft 230 are locked in the circumferential direction. The rotating shaft 230 is configured to rotate to drive the sponge mechanism 300 and the oilstone mechanism 200 to rotate synchronously. The lifting drive 400 is connected to the central shaft 330 and can drive the central shaft 330 to move up and down axially.

[0089] The aforementioned cleaning device connects the base 100 to the grinding water tank 800, providing a stable mounting foundation for the oilstone mechanism 200 and the sponge mechanism 300. By inserting the central shaft 330 through the rotating shaft 230, the sponge mechanism 300 and the oilstone mechanism 200 are coaxially nested, and the relative positions of the central shaft 330 and the rotating shaft 230 are locked in the circumferential direction. When the rotating shaft 230 is configured to rotate, it can drive the sponge mechanism 300 and the oilstone mechanism 200 to rotate synchronously. This allows the oilstone mechanism 200 and the sponge mechanism 300 to share the same set of rotational drive power, eliminating the need for separate rotational drive sources for the oilstone 210 and the sponge 310. This simplifies the overall transmission structure, reduces the number of parts, lowers manufacturing costs, and reduces the size of the device. Moreover, since the relative positions of the central shaft 330 and the rotating shaft 230 are locked in the circumferential direction, the sponge mechanism 300 and the oilstone mechanism 200 are always kept in a fixed circumferential relative position during the lifting and rotating process, thus preventing the sponge 310 from deflecting or shaking during the lifting and lowering process.

[0090] By sliding the central shaft 330 and the rotating shaft 230 axially, the sponge mechanism 300 can move up and down relative to the oilstone mechanism 200 axially. The lifting drive 400 is connected to the central shaft 330 and drives the central shaft 330 to move up and down axially, allowing the cleaning surface of the sponge 310 to be higher or lower than the grinding surface of the oilstone 210. Only one lifting drive 400 is needed to achieve the function of the sponge 310 extending during operation and avoiding obstruction when not in operation. When it is necessary to clean the non-grinding surface of the wafer, the sponge 310 rises until the cleaning surface of the sponge 310 is higher than the grinding surface of the oilstone 210, ensuring that the sponge 310 can smoothly contact the wafer for cleaning. When it is necessary to clean the transfer suction cup 900, the sponge 310 descends until the cleaning surface of the sponge 310 is lower than the grinding surface of the oilstone 210, avoiding interference of the sponge 310 with the oilstone 210 when cleaning the transfer suction cup 900. This completes two operation modes: cleaning the non-grinding surface of the wafer and cleaning the suction surface of the transfer suction cup 900.

[0091] It should be noted that the axial direction refers to the axial direction of the rotating shaft 230, or the axial direction of the central shaft 330, or the common axis direction of the rotating shaft 230 and the central shaft 330. It is also the lifting direction of the central shaft 330 and the rotation axis direction of the rotating shaft 230.

[0092] In one embodiment, such as Figures 2 to 5 As shown, the base 100 includes a mounting part 110, an adjusting plate 120, and an adjusting member 130. The mounting part 110 is used to connect to the grinding water tank 800. One end of the adjusting plate 120 is connected to the mounting part 110, and the other end can swing axially relative to the mounting part 110. The oilstone mechanism 200 is connected to the adjusting plate 120. The adjusting member 130 is connected to the mounting part 110 and abuts against the other end of the adjusting plate 120. The adjusting member 130 can move axially to drive the other end of the adjusting plate 120 to swing relative to the mounting part 110.

[0093] The mounting part 110 is connected to the grinding water tank 800, thus fixing the entire cleaning device to the grinding water tank 800. The oilstone mechanism 200 is connected to the adjusting plate 120, so that the adjusting plate 120 can drive the entire oilstone mechanism 200 and the sponge mechanism 300 to adjust their angle relative to the mounting part 110. One end of the adjusting plate 120 is connected to the mounting part 110, and the other end is suspended. The adjusting member 130 is connected to the mounting part 110 and abuts against the other end of the adjusting plate 120. The adjusting member 130 can move axially to drive the other end of the adjusting plate 120 to swing relative to the mounting part 110. The operator can control the swing angle of the adjusting plate 120 by adjusting the adjusting member 130, thereby adjusting the overall tilt posture of the oilstone mechanism 200 and the sponge mechanism 300.

[0094] Specifically, such as Figures 2 to 5 As shown, the adjusting plate 120 extends in a direction perpendicular to the axial direction. It should be noted that the two ends of the adjusting plate 120 refer to the points along the axial direction (where the adjusting plate 120 extends perpendicular to the axial direction). Figure 4 (As shown in the horizontal direction) at both ends.

[0095] Specifically, such as Figures 2 to 5 As shown, the adjusting member 130 is threadedly connected to the mounting part 110. By rotating the adjusting member 130, it comes into contact with the adjusting plate 120, thereby achieving fine adjustment of the adjusting plate 120.

[0096] In one embodiment, such as Figures 6 to 9As shown, the oilstone mechanism 200 also includes a connecting seat 220, a bearing 240, a bearing housing 250, and a waterproof cover 260. The oilstone 210 is connected to the rotating shaft 230 through the connecting seat 220. The bearing 240 is rotatably fitted inside the bearing housing 250 and is sleeved on the rotating shaft 230. The bearing 240 is connected to the bearing housing 250, and the bearing housing 250 is connected to the adjusting plate 120. The waterproof cover 260 is located between the connecting seat 220 and the bearing housing 250 and extends axially. The connecting seat 220 is connected to the bearing housing 250 through the waterproof cover 260.

[0097] The oilstone 210 and the rotating shaft 230 are connected by a connecting seat 220; the rotating shaft 230 is rotatably supported in the bearing seat 250 by a bearing 240, which provides radial and axial support for the rotating shaft 230; at the same time, a waterproof cover 260 is located between the connecting seat 220 and the bearing seat 250 and extends axially. The connecting seat 220 is connected to the bearing seat 250 by the waterproof cover 260. The waterproof cover 260 covers the core transmission components such as the rotating shaft 230 and the bearing 240 inside it, reducing the entry of cleaning fluid and grinding contaminants into the bearing seat 250 during the operation of the cleaning device.

[0098] In one embodiment, such as Figures 6 to 9 As shown, the oilstone mechanism 200 also includes a mounting assembly 270, which includes an oilstone support 271, a clamping pad 272, and a clamping member. The oilstone support 271 is mounted on the connecting seat 220 and includes a first plate 2711 and a second plate arranged opposite to each other, and a third plate 2712 connecting the first plate 2711 and the second plate. The oilstone 210 is disposed within the space enclosed by the oilstone support 271. The clamping pad 272 is disposed between the first plate 2711 and the oilstone 210. The clamping member passes through the first plate 2711 and abuts against the clamping pad 272, so that the clamping pad 272 and the second plate together clamp the oilstone 210.

[0099] By setting the mounting component 270, the oilstone 210 is placed within the space formed by the oilstone support 271, providing a space for the oilstone 210 to be accommodated and positioned, ensuring that the oilstone 210 will not shift or fall off during the rotation cleaning process. The clamping pad 272 is placed between the first plate 2711 and the oilstone 210. The clamping member passes through the first plate 2711 and abuts against the clamping pad 272, so that the clamping pad 272 and the second plate together clamp the oilstone 210. When the clamping member is turned, the clamping member pushes the clamping pad 272 to move towards the oilstone 210, and the clamping pad 272 presses the oilstone 210 against the second plate, thereby achieving the clamping and fixing of the oilstone 210. At the same time, the clamping pad 272 increases the contact area between the clamping member and the oilstone 210, avoiding the risk of local stress concentration and oilstone 210 breakage caused by the clamping member directly acting on the surface of the oilstone 210, and protecting the integrity of the oilstone 210.

[0100] Furthermore, when the oilstone 210 wears out and needs replacement, the old oilstone can be easily removed and a new oilstone installed simply by loosening the clamps. The operation is simple and quick, eliminating the need to replace the entire oilstone bracket 271 or connector 220, thus reducing consumable replacement costs. The oilstone bracket 271 of this application can accommodate oilstones 210 of different thicknesses, improving the versatility and interchangeability of the mounting assembly 270, further reducing usage costs.

[0101] In one embodiment, such as Figures 6 to 9 As shown, the oilstone 210 has a convex arc-shaped surface, which is used to form a line contact with the transfer suction cup 900. By setting the oilstone 210 to have a convex arc-shaped surface, when the oilstone 210 cleans the suction surface of the transfer suction cup 900, the arc-shaped surface forms a line contact with the suction cup 900. This line contact significantly reduces the contact area between the oilstone 210 and the suction surface. Under the same pressure, the contact pressure generated in the line contact area is much greater than that in the surface contact area, thereby enhancing the oilstone 210's ability to remove stubborn dirt from the suction surface and improving its cleaning effect.

[0102] In one embodiment, such as Figures 6 to 9As shown, the cleaning device also includes a rotary drive mechanism 600. The rotary drive mechanism 600 includes a motor 610, a first pulley 620, a second pulley 630, and a belt connecting the first pulley 620 and the second pulley 630. The first pulley 620 and the second pulley 630 are arranged along a first direction. The motor 610 is fixed on the adjusting plate 120 of the base 100, and the output end of the motor 610 is connected to the first pulley 620. The second pulley 630 is sleeved on the rotating shaft 230, wherein the first direction is perpendicular to the axial direction of the rotating shaft 230. By setting the rotary drive mechanism 600, the motor 610 is fixed on the adjusting plate 120 of the base 100 and its output end is connected to the first pulley 620. The second pulley 630 is sleeved on the rotating shaft 230. After the motor 610 is started, it transmits power to the rotating shaft 230 through the first pulley 620, the belt, and the second pulley 630, driving the rotating shaft 230 to rotate.

[0103] In other embodiments, the motor 610 can be directly connected to the rotating shaft 230, and the rotating shaft 230 can be directly driven to rotate by the motor 610.

[0104] In one embodiment, such as Figures 6 to 9 As shown, multiple mounting components 270 are provided, arranged at intervals around the axial direction, and each mounting component 270 is equipped with an oilstone 210. The arrangement of the multiple mounting components 270 at intervals around the axial direction, with each mounting component 270 equipped with an oilstone 210, ensures that the multiple oilstones 210 are evenly distributed in the same circumferential direction. When the rotating shaft 230 drives the connecting seat 220 to rotate, the multiple oilstones 210 rotate simultaneously around the axial direction. Each oilstone 210 can clean the adsorption surface of the transfer suction cup 900. During rotation, the multiple oilstones 210 take turns passing through the same radial area of ​​the adsorption surface of the transfer suction cup 900, increasing the contact frequency and cleaning area between the oilstone 210 and the adsorption surface per unit time, thus improving the cleaning efficiency and uniformity of stubborn dirt on the adsorption surface of the transfer suction cup 900.

[0105] In one embodiment, please refer to the reference. Figures 1 to 3The sponge mechanism 300 includes multiple sponge supports 320, each sponge support 320 having at least one sponge 310 mounted on it. The sponge 310 is connected to the central shaft 330 via the sponge support 320. The multiple sponge supports 320 are arranged axially, with one sponge support 320 between two adjacent mounting components 270. By setting the sponge supports 320 to connect the sponge 310 and the central shaft 330, and by arranging the multiple sponge supports 320 axially, with one sponge support 320 between two adjacent mounting components 270, the sponge 310 and the oilstone 210 are alternately arranged and evenly distributed in the circumferential direction. When the rotating shaft 230 drives the connecting seat 220 to rotate, the multiple sponges 310 rotate simultaneously axially, allowing each sponge 310 to clean the non-abrasive surface of the wafer. During rotation, the multiple sponges 310 take turns passing through the same radial area of ​​the non-abrasive surface of the wafer, increasing the contact frequency and cleaning area between the sponge 310 and the non-abrasive surface of the wafer per unit time, thereby improving the cleaning efficiency and uniformity of cleaning contaminants on the non-abrasive surface of the wafer.

[0106] Moreover, the uniform distribution of multiple sponges 310 in the circumferential direction ensures that the sponge mechanism 300 is subjected to balanced forces during lifting and rotation, avoiding uneven loading and tilting caused by uneven distribution of sponges 310, and ensuring the smoothness of the lifting action of sponges 310 and the consistency of contact pressure with the non-polished surface of the wafer.

[0107] Specifically, in this embodiment, three sets of mounting components 270 are provided, which are evenly distributed along the circumference. Three sets of sponge brackets 320 are provided, with a set of sponge brackets 320 between two adjacent mounting components 270.

[0108] Furthermore, such as Figures 10 to 12 As shown, the central shaft 330 has a first channel, and the sponge mechanism 300 also includes a sponge fixing seat 340, a spray pipe 350, and a cleaning source. The sponge 310 is fixed to the sponge fixing seat 340 by a sponge bracket 320. The sponge fixing seat 340 is connected to the central shaft 330 and has a second channel communicating with the first channel. The spray pipe 350 communicates with the second channel and has multiple spray holes. The cleaning source communicates with the first channel and is used to supply cleaning liquid or purging gas. By setting a first channel in the central shaft 330, setting a second channel in the sponge fixing seat 340, and communicating with the cleaning source, a fluid passage is constructed from the cleaning source through the interior of the central shaft 330 and the sponge fixing seat 340 to the spray pipe 350. This fluid passage is integrated inside the central shaft 330 and the sponge fixing seat 340, eliminating the need for separate external liquid and gas supply lines. This simplifies the piping layout of the cleaning device and avoids entanglement, pulling, or wear of external pipes during rotation and lifting.

[0109] The cleaning fluid supplied by the cleaning source is delivered to the spray pipe 350 through this fluid passage, so that the spray pipe 350 can spray the cleaning fluid onto the non-abrasive surface of the wafer before and during cleaning, which serves to rinse and moisturize. After cleaning, the cleaning source is switched to purge gas, which is supplied to the spray pipe 350 to blow and dry the non-abrasive surface of the wafer, thus avoiding the impact of cleaning fluid residue on subsequent processes.

[0110] Specifically, such as Figures 10 to 12 As shown, multiple sets of sponge brackets 320 are connected to sponge fixing base 340, and sponge fixing base 340 is connected to central axis 330 through limiting protrusion 520 (mentioned below).

[0111] Furthermore, to achieve multi-angle spraying, the insertion position and angle of the spray pipe 350 are adjustable. For example, the spray pipe 350 is mounted on the sponge fixing base 340 via a ball-joint universal adjustment structure.

[0112] In one embodiment, such as Figures 10 to 12 As shown, the sponge mechanism 300 also includes a rotary joint 700, which is connected to the end of the central shaft 330 opposite to the sponge support 320. By setting the rotary joint 700 to the end of the central shaft 330 opposite to the sponge support 320, the rotary joint 700 can rotate with the central shaft 330. At the same time, the rotary joint 700 is fixedly connected to the external cleaning source pipeline, realizing the supply of cleaning fluid and purging gas.

[0113] Furthermore, in order to achieve a sliding fit between the central shaft 330 and the rotating shaft 230 along the axial direction, and a relative position lock along the circumferential direction, such as Figure 8 , Figure 10 as well as Figure 11 As shown, the cleaning device also includes a limiting structure, which includes a limiting groove 510 and a limiting protrusion 520 that engage with each other. Multiple limiting grooves 510 are provided, and the multiple limiting grooves 510 are arranged around the axial direction and extend along the axial direction. One of the limiting grooves 510 and the limiting protrusion 520 is provided on the rotating shaft 230, and the other is provided on the central shaft 330.

[0114] By setting a limiting structure, one of the limiting groove 510 and the limiting protrusion 520 is set on the rotating shaft 230, and the other is set on the central shaft 330. When the central shaft 330 passes through the rotating shaft 230 and slides axially with the rotating shaft 230, the limiting protrusion 520 is embedded in the corresponding limiting groove 510 and slides along the extension direction of the limiting groove 510, thus realizing the axial sliding engagement between the central shaft 330 and the rotating shaft 230. During the lifting and lowering process and when the rotating shaft 230 rotates, the central shaft 330 can maintain circumferential synchronization with the rotating shaft 230, thus realizing the circumferential limiting engagement between the central shaft 330 and the rotating shaft 230.

[0115] The multiple limiting grooves 510 are arranged axially, so that there are multiple circumferential limiting points between the central shaft 330 and the rotating shaft 230. The force is more evenly distributed, avoiding wear or deformation caused by concentrated force on a single limiting structure, extending the service life of the limiting structure. At the same time, it ensures the smooth axial movement of the central shaft 330 during lifting and lowering, and will not cause jamming or increased resistance due to circumferential limiting.

[0116] Specifically, such as Figure 8 , Figure 10 as well as Figure 11 As shown, in this embodiment, the oilstone 210 of the oilstone mechanism 200 is connected to the rotating shaft 230 through the connecting seat 220, and a limiting groove 510 is provided on the connecting seat 220 of the oilstone mechanism 200; the sponge bracket 320 of the sponge mechanism 300 is connected to the central shaft 330 through the limiting protrusion 520.

[0117] In this embodiment, the limiting protrusion 520 is a triangular prism structure, and the limiting groove 510 is a triangular prism-shaped groove adapted to the triangular prism limiting protrusion 520. In other embodiments, the shapes of the limiting protrusion 520 and the limiting groove 510 are determined according to actual operational needs, as long as axial sliding and circumferential limiting can be achieved.

[0118] A second aspect of this application also provides a wafer polishing machine, including a polishing water tank 800 and the aforementioned cleaning device, with a base 100 connected to the polishing water tank 800. By connecting the base 100 to the polishing water tank 800, the cleaning device cleans the suction surface of the transfer suction cup 900 of the wafer polishing machine, as well as the non-polishing surface of the wafer processed by the wafer polishing machine.

[0119] A third aspect of this application also provides a cleaning method, such as Figures 13 to 15 As shown, using any of the above-mentioned cleaning devices, the cleaning method includes:

[0120] When the part to be cleaned is a wafer, the central shaft 330 is driven to move axially by the lifting drive 400, so that the cleaning surface of the sponge 310 is higher than the grinding surface of the oilstone 210.

[0121] Make the sponge 310 contact the non-abrasive surface of the wafer;

[0122] Drive the rotating shaft 230 to rotate so that the sponge 310 cleans the non-abrasive surface of the wafer;

[0123] When the item to be cleaned is the suction cup 900, the central shaft 330 is driven to move axially by the lifting drive 400, so that the cleaning surface of the sponge 310 is lower than the grinding surface of the oilstone 210.

[0124] Make the oilstone 210 contact the adsorption surface of the transfer suction cup 900;

[0125] Drive the rotating shaft 230 to rotate so that the oilstone 210 cleans the suction surface of the transfer suction cup 900.

[0126] The above cleaning method, using the aforementioned cleaning device, when the object to be cleaned is a wafer, drives the central shaft 330 to move axially via the lifting drive 400, so that the cleaning surface of the sponge 310 is higher than the abrasive surface of the oilstone 210, ensuring that the sponge 310 is higher than the oilstone 210 and can smoothly contact the non-abrasive surface of the wafer; after the sponge 310 contacts the non-abrasive surface of the wafer, drives the rotating shaft 230 to rotate, so that the sponge mechanism 300 and the oilstone mechanism 200 rotate synchronously, so as to clean the non-abrasive surface of the wafer through the sponge 310.

[0127] When the object to be cleaned is the transfer suction cup 900, the lifting drive 400 drives the central shaft 330 to move axially, so that the cleaning surface of the sponge 310 is lower than the grinding surface of the oilstone 210. This ensures that the sponge 310 is lower than the oilstone 210, avoiding interference between the sponge 310 and the oilstone 210 when cleaning the adsorption surface of the transfer suction cup 900, allowing the oilstone 210 to smoothly contact the adsorption surface of the transfer suction cup 900. After the oilstone 210 contacts the adsorption surface of the transfer suction cup 900, the rotating shaft 230 is driven to rotate, so that the oilstone mechanism 200 and the sponge mechanism 300 rotate synchronously, so that the oilstone 210 cleans the adsorption surface of the transfer suction cup 900, ensuring the cleanliness of the adsorption surface of the transfer suction cup 900.

[0128] The above cleaning method, by switching the position of the sponge 310 through the lifting drive component 400 and synchronously driving the oilstone mechanism 200 and the sponge mechanism 300 to rotate through the same rotary drive source, realizes two operation modes on the same cleaning device: sequential cleaning of the non-abrasive surface of the wafer and cleaning of the adsorption surface of the transfer suction cup 900, which simplifies the cleaning operation steps and control logic.

[0129] Furthermore, when installing the cleaning device, it is positioned on the movement path of the transfer suction cup 900, and located between the loading / unloading station 910 and the wafer cleaning station 920. During operation, the transfer suction cup 900 moves back and forth along a preset path between the loading / unloading station 910, the station where the cleaning device is located, and the wafer cleaning station 920. After the polished wafer is placed at the loading / unloading station 910, the transfer suction cup 900 moves to the loading / unloading station 910 to pick up the wafer, and then moves along the movement path to the station where the cleaning device is located, where the non-polished surfaces of the wafer are cleaned. After the non-polished surfaces of the wafer are cleaned, the transfer suction cup 900 continues to move along the movement path to the wafer cleaning station 920, where the wafer is placed down for cleaning.

[0130] Then, the transfer suction cup 900 moves in the reverse direction along the motion path to the station where the cleaning device is located, where the suction surface of the transfer suction cup 900 is cleaned. After the suction surface of the transfer suction cup 900 is cleaned, the transfer suction cup 900 continues to move in the reverse direction along the motion path to the loading / unloading station 910, waiting for the next transfer instruction.

[0131] This application places the cleaning device along the movement path of the transfer suction cup 900, utilizing the suction cup 900's own movement and lifting functions to complete the cleaning of the wafer and the suction cup. This eliminates the need for separate wafer transport and positioning mechanisms, simplifying the equipment structure and shortening the wafer's transfer path and time from polishing completion to backside cleaning. When the transfer suction cup 900 moves the wafer directly above the cleaning device, the cleaning device can clean the non-polished surface of the wafer. When the transfer suction cup 900 unloads the wafer and returns to its original position above the cleaning device, the cleaning device can clean the suction surface of the transfer suction cup 900. This integrates the cleaning process with the original movement trajectory and rhythm of the transfer suction cup 900, eliminating additional waiting time and steps, and ensuring efficient equipment operation.

[0132] In one embodiment, before the sponge 310 cleans the non-abrasive surface of the wafer, a cleaning solution is sprayed onto the non-abrasive surface of the wafer through a spray pipe 350; after the sponge 310 cleans the non-abrasive surface of the wafer, the spraying of the cleaning solution is stopped, and a purging gas is blown onto the non-abrasive surface of the wafer through the spray pipe 350 to dry the non-abrasive surface of the wafer.

[0133] Before the sponge 310 cleans the non-abrasive surface of the wafer, cleaning fluid is sprayed onto the non-abrasive surface of the wafer through the spray pipe 350. This allows the cleaning fluid to pre-wet and rinse the non-abrasive surface of the wafer, softening and removing contaminants such as abrasive particles attached to the non-abrasive surface. This reduces the frictional resistance generated by the sponge 310 in direct contact with the wafer surface. At the same time, the rinsing action of the cleaning fluid can remove some loose particles, improving the cleaning efficiency and cleanliness of the sponge 310. After the sponge 310 cleans the non-abrasive surface of the wafer, the spraying of cleaning fluid is stopped, and purge gas is blown onto the non-abrasive surface of the wafer through the spray pipe 350 to dry the non-abrasive surface of the wafer. This allows the cleaning fluid remaining on the non-abrasive surface of the wafer to be quickly blown away after cleaning. At the same time, the blowing process of the purge gas can further remove any fine particles that may remain on the non-abrasive surface.

[0134] In one embodiment, before the oilstone 210 cleans the adsorption surface of the transfer suction cup 900, cleaning fluid is sprayed onto the adsorption surface of the transfer suction cup 900 through the spray pipe 350; after the oilstone 210 cleans the adsorption surface of the transfer suction cup 900, the spraying of cleaning fluid is stopped, and purging gas is blown onto the adsorption surface of the transfer suction cup 900 through the spray pipe 350 to dry the adsorption surface of the transfer suction cup 900.

[0135] Similarly, before the oilstone 210 cleans the adsorption surface of the transfer chuck 900, cleaning fluid is sprayed onto the adsorption surface of the transfer chuck 900 through the spray pipe 350. This allows the cleaning fluid to pre-rinse the adsorption surface of the transfer chuck 900, wetting and removing the adhering dirt on the surface, reducing the wear caused by the dry grinding of the oilstone 210. After the oilstone 210 cleans the adsorption surface of the transfer chuck 900, the spraying of cleaning fluid is stopped, and purging gas is blown onto the adsorption surface of the transfer chuck 900 through the spray pipe 350 to dry the adsorption surface of the transfer chuck 900. This ensures that the cleaning fluid and grinding debris remaining on the adsorption surface of the transfer chuck 900 after cleaning are completely blown away, guaranteeing that the adsorption surface of the transfer chuck 900 is dry and clean during subsequent wafer handling. This avoids the problem of residual liquid entering the micropores of the transfer chuck 900, which could lead to a decrease in adsorption force or micropore blockage.

[0136] The wafer cleaning and transfer suction cup 900 cleaning methods of this application share the same set of spray pipes 350 to supply cleaning fluid and purging gas in both modes, eliminating the need to set up separate spray systems for the two modes. This further simplifies the device structure and operation method, and reduces manufacturing and operating costs.

[0137] In one embodiment, the step of bringing the sponge 310 into contact with the non-abrasive surface of the wafer includes: driving the transfer suction cup 900 to lower the wafer until the non-abrasive surface of the wafer contacts the sponge 310; during the cleaning process of the sponge 310 on the non-abrasive surface of the wafer, driving the transfer suction cup 900 to oscillate back and forth at a fixed height; the contact between the wafer and the sponge 310 is achieved through the lifting and lowering motion of the transfer suction cup 900, utilizing the existing lifting function of the transfer suction cup 900 itself, eliminating the need for an additional wafer lifting mechanism, thus simplifying the equipment structure. During the cleaning process of the sponge 310 on the non-abrasive surface of the wafer, driving the transfer suction cup 900 to oscillate back and forth at a fixed height allows the wafer to oscillate back and forth relative to the sponge 310 while in contact with it. Combined with the rotational motion of the sponge 310 itself, this increases the effective contact area between the sponge 310 and the non-abrasive surface of the wafer and the number of friction cleaning cycles.

[0138] In one embodiment, the step of bringing the oilstone 210 into contact with the adsorption surface of the transfer suction cup 900 includes: driving the transfer suction cup 900 to descend until the adsorption surface of the transfer suction cup 900 contacts the oilstone 210; and driving the transfer suction cup 900 to swing back and forth at a fixed height during the cleaning process of the oilstone 210 on the adsorption surface of the transfer suction cup 900. Similarly, the contact between the adsorption surface and the oilstone 210 is achieved through the self-lifting function of the transfer suction cup 900, and the contact position is precisely controllable, ensuring that the contact pressure between the oilstone 210 and the adsorption surface is moderate. During the cleaning process of the oilstone 210 on the adsorption surface of the transfer suction cup 900, the transfer suction cup 900 is driven to swing back and forth at a fixed height. This causes the adsorption surface of the transfer suction cup 900 to swing back and forth relative to the oilstone 210 while in contact with it. Combined with the rotational motion of the oilstone 210 itself, this increases the effective grinding area and number of impacts between the oilstone 210 and the adsorption surface of the transfer suction cup 900, thereby improving the removal effect of stubborn dirt and the uniformity of cleaning.

[0139] In one embodiment, before the oilstone 210 cleans the adsorption surface of the transfer suction cup 900, the method further includes: controlling the transfer suction cup 900 to activate the back-blowing function to blow out the dirt in the micropores of the transfer suction cup 900; the back-blowing function remains activated until the oilstone 210 has finished cleaning the adsorption surface of the transfer suction cup 900. Before the oilstone 210 cleans the suction surface of the transfer suction cup 900, the back-blowing function of the transfer suction cup 900 is activated to blow out the dirt inside the micropores of the transfer suction cup 900. This prevents the dirt from being carried into the depths of the micropores by the cleaning fluid during the subsequent cleaning process of the cleaning fluid spray and the oilstone 210 cleaning process, or from mixing with the cleaning fluid to form a mud-like substance that blocks the micropores. The back-blowing function remains on, so that the back-blowing gas is continuously blown out from the inside of the micropores throughout the entire cleaning process of the transfer suction cup 900. While the oilstone 210 is grinding and cleaning and the spray pipe 350 is spraying cleaning fluid, the inside of the micropores is always under positive pressure, which prevents the cleaning fluid and grinding debris from entering the micropores through the micropore openings, thus avoiding the intrusion and blockage of the micropores by liquids and contaminants during the cleaning process.

[0140] Furthermore, such as Figure 16 As shown, the overall workflow of the cleaning method in this application is as follows:

[0141] S1. After the wafer grinding is completed, return to the front panel.

[0142] S2. The transfer suction cup 900 removes the polished wafer and moves it directly above the cleaning device;

[0143] S3, the spray pipe 350 starts spraying cleaning fluid to rinse and moisturize the non-abrasive surface of the wafer. At the same time, the lifting drive 400 drives the sponge 310 to rise until the cleaning surface of the sponge 310 is higher than the abrasive surface of the oilstone 210. The rotation drive mechanism 600 drives the rotating shaft 230 to start rotating the central shaft 330.

[0144] S4. The transfer suction cup 900 slowly descends with the wafer until the wafer contacts the sponge 310, after which the transfer suction cup 900 stops descending;

[0145] S5. The transfer suction cup 900 is kept at a fixed height and begins to swing back and forth. At the same time, the sponge mechanism 300 will also rotate to clean the non-abrasive surface of the wafer.

[0146] S6. After the non-abrasive surface of the wafer is cleaned, the transfer suction cup 900 stops swinging and stops directly above the cleaning device, and then begins to be lifted to the transfer height.

[0147] S7. Spray pipe 350 stops spraying cleaning fluid and switches to air blowing to dry the non-grinding surface of the wafer. After drying is completed, spray pipe 350 stops blowing air.

[0148] S8. The rotary drive mechanism 600 stops driving, the sponge mechanism 300 stops rotating, and the lifting drive component 400 drives the sponge 310 to fall until the cleaning surface of the sponge 310 is lower than the grinding surface of the oilstone 210.

[0149] S9. The transfer suction cup 900 transfers the wafer to the wafer cleaning station 920 to facilitate cleaning of the wafer's polished surface;

[0150] S10. After the transfer suction cup 900 removes the wafer, it returns to the top of the cleaning device along the same path. At this time, the transfer suction cup 900 activates the back-blowing function to blow out the dirt in the micropores and prevent dirt from entering the micropores during cleaning.

[0151] S11, the spray pipe 350 starts spraying cleaning fluid to rinse the adsorption surface of the transfer suction cup 900 to remove surface dirt, and the rotary drive mechanism 600 drives the rotating shaft 230 to start rotating the central shaft 330.

[0152] S12. The transfer suction cup 900 begins to descend until it contacts the oilstone 210, at which point the transfer suction cup 900 stops descending.

[0153] S13. The transfer suction cup 900 is kept at a fixed height and begins to swing back and forth. At the same time, the oilstone mechanism 200 rotates to clean the stubborn dirt on the suction surface of the transfer suction cup 900.

[0154] S14. After the suction surface of the transfer suction cup 900 is cleaned, the transfer suction cup 900 stops swinging and stops directly above the cleaning device, and then begins to be lifted to the transfer height.

[0155] S15. Spray pipe 350 stops spraying cleaning fluid and switches to air blowing to dry the adsorption surface of the transfer suction cup 900. After drying is completed, spray pipe 350 stops blowing air.

[0156] S16. After drying is completed, the back-blowing air of the transfer chuck 900 is turned off, and it returns to the loading and unloading station 910. The transfer chuck 900 waits for the next transfer of the polished wafer.

[0157] A fourth aspect of this application provides a storage medium storing a computer program / instructions that, when executed by a processor, implement the steps of the method as described in any one of the preceding descriptions. The storage medium stores program instructions for performing the cleaning method. When the processor executes the program, it can automatically control the lifting drive to switch the sponge position, control the rotary drive mechanism to synchronously drive the oilstone and sponge to rotate, and coordinate with spraying and drying operations, thereby sequentially cleaning the non-abrasive surface of the wafer and the adsorption surface of the transfer suction cup 900 on the same device.

[0158] This application provides a fifth aspect of a cleaning device, including a processor and a memory, the memory storing a computer program; the processor executes the computer program to implement the steps of any one of the methods described above. The aforementioned cleaning device, through the processor executing the stored computer program, can automatically perform a non-abrasive surface cleaning mode and an adsorption surface cleaning mode of the transfer suction cup 900 according to a preset process, without manual intervention. It has a compact structure, occupies little space, and provides stable and reliable cleaning results.

[0159] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0160] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A cleaning device, characterized in that, The cleaning device includes: A base (100) for connection to a grinding water tank (800); An oilstone mechanism (200) is mounted on the base (100). The oilstone mechanism (200) includes an oilstone (210) and a rotating shaft (230). The oilstone (210) is connected to the rotating shaft (230). A sponge mechanism (300) includes a sponge (310) and a central shaft (330). The sponge (310) is connected to the central shaft (330), and the central shaft (330) passes through the rotating shaft (230) and the two are axially slidably engaged. The relative positions of the central shaft (330) and the rotating shaft (230) are locked in the circumferential direction. The rotating shaft (230) is configured to rotate to drive the sponge mechanism (300) and the oilstone mechanism (200) to rotate synchronously. A lifting drive (400) is connected to the central shaft (330), and the lifting drive (400) can drive the central shaft (330) to move up and down along the axial direction.

2. The cleaning device according to claim 1, characterized in that, The base (100) includes: Mounting part (110) is used to connect to the grinding water tank (800); An adjusting plate (120) is connected at one end to the mounting part (110) and at the other end is able to swing relative to the mounting part (110) along the axial direction. The oilstone mechanism (200) is connected to the adjusting plate (120). An adjusting member (130) is connected to the mounting portion (110) and abuts against the other end of the adjusting plate (120). The adjusting member (130) is capable of moving along the axial direction to drive the other end of the adjusting plate (120) to swing relative to the mounting portion (110).

3. The cleaning device according to claim 1, characterized in that, The oilstone mechanism (200) further includes a connecting seat (220) and a mounting assembly (270). The oilstone (210) is connected to the rotating shaft (230) via the connecting seat (220). The mounting assembly (270) includes: An oilstone support (271) is provided on the connecting seat (220). The oilstone support (271) includes a first plate (2711) and a second plate arranged opposite to each other, and a third plate (2712) connecting the first plate (2711) and the second plate. The oilstone (210) is provided in the space enclosed by the oilstone support (271). A clamping pad (272) is disposed between the first plate (2711) and the oilstone (210); A clamping element passes through the first plate (2711) and abuts against the clamping pad (272) so that the clamping pad (272) and the second plate together clamp the oilstone (210).

4. The cleaning device according to claim 3, characterized in that, The mounting assembly (270) is provided in multiple ways, and the multiple mounting assemblies (270) are arranged at intervals around the axial direction, and each mounting assembly (270) is equipped with an oilstone (210).

5. The cleaning device according to claim 4, characterized in that, The sponge mechanism (300) includes a plurality of sponge supports (320), each sponge support (320) is provided with at least one sponge (310), and the sponge (310) is connected to the central shaft (330) through the sponge support (320); Multiple sponge supports (320) are arranged around the axial direction, and one sponge support (320) is provided between two adjacent mounting components (270).

6. The cleaning device according to claim 1, characterized in that, It also includes a limiting structure, which includes a limiting groove (510) and a limiting protrusion (520) that engage with each other. There are multiple limiting grooves (510), which are arranged around the axial direction and extend along the axial direction. One of the limiting grooves (510) and the limiting protrusion (520) is disposed on the rotating shaft (230), and the other is disposed on the central shaft (330).

7. The cleaning device according to claim 1, characterized in that, The central shaft (330) has a first channel, and the sponge mechanism (300) further includes: A sponge fixing seat (340) is provided, wherein the sponge (310) is fixed on the sponge fixing seat (340), the sponge fixing seat (340) is connected to the central shaft (330), and the sponge fixing seat (340) has a second channel communicating with the first channel; A spray pipe (350) is connected to the second channel, and the spray pipe (350) has a plurality of spray holes; A cleaning source is connected to the first channel, and the cleaning source is used to supply cleaning fluid or purging gas.

8. A wafer grinding machine, characterized in that, It includes a grinding water tank (800) and a cleaning device according to any one of claims 1-7, wherein the base (100) is connected to the grinding water tank (800).

9. A cleaning method using the cleaning apparatus according to any one of claims 1-7, characterized in that, The cleaning method includes: When the part to be cleaned is a wafer, the central shaft (330) is driven to move axially by the lifting drive (400) so that the cleaning surface of the sponge (310) is higher than the grinding surface of the oilstone (210); The sponge (310) is brought into contact with the non-abrasive surface of the wafer; The rotating shaft (230) is driven to rotate so that the sponge (310) cleans the non-abrasive surface of the wafer; When the object to be cleaned is a suction cup (900), the central shaft (330) is driven to move axially by the lifting drive (400), so that the cleaning surface of the sponge (310) is lower than the grinding surface of the oilstone (210); Make the oilstone (210) come into contact with the adsorption surface of the conveying suction cup (900); Drive the rotating shaft (230) to rotate so that the oilstone (210) cleans the adsorption surface of the transport suction cup (900).

10. The cleaning method according to claim 9, characterized in that, Before the sponge (310) cleans the non-abrasive surface of the wafer, cleaning fluid is sprayed onto the non-abrasive surface of the wafer through the spray pipe (350); After the sponge (310) cleans the non-abrasive surface of the wafer, the spraying of cleaning fluid is stopped, and purging gas is blown onto the non-abrasive surface of the wafer through the spray pipe (350) to dry the non-abrasive surface of the wafer; And / or, before the oilstone (210) cleans the adsorption surface of the transfer suction cup (900), a cleaning solution is sprayed onto the adsorption surface of the transfer suction cup (900) through a spray pipe (350). After the oilstone (210) cleans the adsorption surface of the transfer suction cup (900), the spraying of cleaning liquid is stopped, and purging gas is blown onto the adsorption surface of the transfer suction cup (900) through the spray pipe (350) to dry the adsorption surface of the transfer suction cup (900).

11. The cleaning method according to claim 9, characterized in that, The step of bringing the sponge (310) into contact with the non-abrasive surface of the wafer includes: The chuck (900) is driven to lower the wafer until the non-abrasive surface of the wafer contacts the sponge (310); During the process of the sponge (310) cleaning the non-abrasive surface of the wafer, the transport suction cup (900) is driven to swing back and forth at a fixed height; And / or, the step of bringing the oilstone (210) into contact with the adsorption surface of the conveying suction cup (900) includes: Drive the transfer suction cup (900) to descend until the suction surface of the transfer suction cup (900) contacts the oilstone (210); During the cleaning process of the oilstone (210) on the adsorption surface of the transfer suction cup (900), the transfer suction cup (900) is driven to swing back and forth at a fixed height.

12. The cleaning method according to claim 9, characterized in that, Before the oilstone (210) cleans the suction surface of the conveying suction cup (900), the following steps are also included: Control the transfer suction cup (900) to activate the back-blowing function to blow out the dirt in the micropores of the transfer suction cup (900); The backflush function remains on until the oilstone (210) has finished cleaning the suction surface of the transfer suction cup (900).

13. A storage medium, characterized in that, The system stores a computer program / instructions that, when executed by a processor, implement the steps of the method as described in any one of claims 9-12.

14. A cleaning device, characterized in that, include: processor; Memory, which stores computer programs; When the processor executes the computer program, it implements the steps of the method according to any one of claims 9-12.

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