Method of planarizing a substrate, planarization system, and method of manufacturing an article

Abstract

This disclosure provides a method for planarizing a substrate, a planarization system, and a method for manufacturing an article. One method for planarizing a substrate includes: dispensing a formable material onto a substrate; at a planarization station at a first location, contacting a cover plate held by a cover plate chuck with the formable material on the substrate to form a multilayer structure comprising the cover plate, a film of the formable material, and a substrate; releasing the cover plate from the cover plate chuck; moving the multilayer structure from the first location to a curing station located at a second location away from the first location, the curing station comprising an array of light-emitting diodes (LEDs); and curing the film by exposing the film of the multilayer structure to light emitted from the LED array.

Description

[0001] This application is a divisional application of the invention patent application filed on August 9, 2021, with application number 202180062090.5, PCT international application number PCT / US2021 / 045171, entitled "Planarization Process, Planarization System and Method of Manufacturing Article". Technical Field

[0002] This disclosure relates to substrate processing, and more specifically, to surface planarization in semiconductor manufacturing. Background Technology

[0003] Planarization techniques are useful in the manufacture of semiconductor devices. Processes for manufacturing semiconductor devices involve, for example, repeatedly adding and removing material from a substrate. This process can produce layered substrates with irregular height variations (i.e., topography), and these height variations can increase as more layers are added. Height variations negatively impact the ability to add more layers to a layered substrate. On the other hand, semiconductor substrates (e.g., silicon wafers) are not always perfectly flat and may include initial surface height variations (i.e., topography). One way to address this problem is to planarize the substrate between layering steps. Various photolithographic patterning methods benefit from patterning on a flat surface. In ArFi laser-based lithography, planarization improves depth of focus (DOF), critical dimension (CD), and critical dimension uniformity. In extreme ultraviolet (EUV) lithography, planarization improves feature placement and DOF. In nanoimprint lithography (NIL), planarization improves feature filling and CD control after pattern transfer.

[0004] Planarization techniques, sometimes referred to as inkjet-based adaptive planarization (IAP), involve distributing a variable droplet pattern of polymerizable material between a substrate and a superstrate, where the droplet pattern varies with the substrate morphology. The superstrate is then brought into contact with the polymerizable material, which subsequently polymerizes on the substrate, before the superstrate is removed. Improvements to planarization techniques, including IAP, are expected to enhance, for example, whole-wafer processing and semiconductor device fabrication.

[0005] In some known imprinting / planarization systems and methods, the curing step is performed by transmitting UV light radiation through a transparent cover plate chuck. Due to the structure of the cover plate chuck, curing through a transparent cover plate chuck can result in uneven transmission of UV light radiation to the formable material located between the cover plate and the substrate. Uneven transmission leads to unsatisfactory curing performance. Furthermore, in systems where UV light radiation is transmitted through a transparent cover plate chuck, numerous optical components (e.g., dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.) are used to guide the UV light radiation. This results in a tall, large, and costly profile system. Therefore, there is a need in the art for planarization systems and methods that avoid these drawbacks. Summary of the Invention

[0006] A method for planarizing a substrate includes: dispensing a formable material onto the substrate; at a planarization station located at a first position, contacting a cover plate held by a cover plate chuck with the formable material on the substrate to form a multilayer structure comprising the cover plate, a film of the formable material, and the substrate; releasing the cover plate from the cover plate chuck; moving the multilayer structure from the first position to a curing station located at a second position away from the first position, the curing station comprising an array of light-emitting diodes; and curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes.

[0007] A planarization system includes: a substrate chuck configured to hold a substrate; a cover plate chuck configured to hold a cover plate; a positioning stage; a dispensing system configured to dispense formable material onto the substrate; a planarization station configured at a first location to contact the formable material dispensed on the substrate with the cover plate to form a multilayer structure including the cover plate, a film of formable material, and the substrate; and a curing station located at a second location away from the first location, the curing station including an array of light-emitting diodes, wherein the cover plate chuck is further configured to release the cover plate, wherein the positioning stage is configured to move the multilayer structure from the planarization station to the curing station after the cover plate has been released, and wherein, when the multilayer structure is located at the curing station, the curing station is configured to cure the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes.

[0008] A method of manufacturing an article includes: dispensing a formable material onto a substrate; at a planarization station located in a first position, contacting a cover plate held by a cover plate chuck with the formable material on the substrate to form a multilayer structure comprising a cover plate, a film of the formable material, and a substrate; releasing the cover plate from the cover plate chuck; moving the multilayer structure from the first position to a curing station located in a second position away from the first position, the curing station comprising an array of light-emitting diodes; curing the film by exposing the film of the multilayer structure to light emitted from the array of light-emitting diodes; and processing the cured film to manufacture an article.

[0009] These and other objects, features, and advantages of this disclosure will become apparent when read in conjunction with the accompanying drawings and the provided claims, along with the following detailed description of exemplary embodiments of this disclosure. Attached Figure Description

[0010] To gain a detailed understanding of the features and advantages of this disclosure, reference can be made to the embodiments shown in the accompanying drawings for a more specific description of the embodiments of this disclosure. However, it should be noted that the drawings illustrate only typical embodiments of this disclosure and should not be construed as limiting its scope, as other equivalent embodiments are permissible.

[0011] Figure 1 This is a schematic diagram of an example flattening system according to one aspect of this disclosure.

[0012] Figure 2 This is a flowchart of an example flattening method according to one aspect of this disclosure.

[0013] Figures 3A to 3K It is shown Figure 2 A schematic cross-sectional view of the flattening method.

[0014] Figure 4 This is a schematic cross-sectional view showing a portion of a planarization system according to another aspect of this disclosure.

[0015] While this disclosure will now be described in detail with reference to the accompanying drawings, it will be described in conjunction with illustrative exemplary embodiments. Changes and modifications may be made to the described exemplary embodiments without departing from the true scope and spirit of this disclosure as defined by the appended claims. Detailed Implementation

[0016] Flattening system Figure 1 An example planarization system according to one aspect of this disclosure is shown. The planarization system 100 is used to planarize a film on a substrate 102. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin chuck, a slot chuck, an electrostatic chuck, an electromagnetic chuck, etc.

[0017] The substrate 102 and substrate chuck 104 can be further supported by the substrate positioning stage 106. The substrate positioning stage 106 can provide support along the x-axis, y-axis, z-axis, θ-axis, and y-axis. Shaft and Translational and / or rotational movements of one or more axes. The substrate positioning stage 106, substrate 102, and substrate chuck 104 may also be positioned on a base (not shown). The substrate positioning stage 106 may be part of a positioning system.

[0018] like Figure 1As shown, in the example embodiment, the planarization system 100 may include three separate stations: a distribution station 103, a planarization station 105, and a curing station 107. These three stations may be located in different locations. The platform 106 is capable of moving along the track 109 (… Figure 3B , Figures 3E to 3J The system moves to transport substrate 102 to each of the three stations. In another example embodiment, substrate 102 and substrate chuck 104 can be transported to the respective stations via a robotic arm. See below for reference. Figures 3A to 3J In the example embodiment discussed in more detail, the planarization station 105 is located in a first position, and the curing station 107 is located in a second position different from the first position, but both positions may also be included within the common housing 114. Figure 3B , Figures 3E to 3J ).

[0019] The dispensing station 103 of the planarization system 100 may include a fluid dispenser 122. The fluid dispenser 122 may be used to deposit droplets of liquid formable material 124 (e.g., a photocurable polymerizable material) onto the substrate 102, wherein the volume of the deposited material varies over a region of the substrate 102 at least in part based on the topographic profile of the substrate. Different fluid dispensers 122 may use different techniques to dispense the formable material 124. When the formable material 124 is jettable, an inkjet dispenser may be used to dispense the formable material. For example, thermal inkjet, microelectromechanical system (MEMS) based inkjet, valve jetting, and piezoelectric inkjet are common techniques for dispensing jettable liquids. In the example embodiment shown, because the substrate 102 is brought to the dispensing station 103, and because the dispensing station 103 is in a different location from the planarization station 105 and the curing station 107, the fluid dispenser 122 may be stationary.

[0020] like Figure 1 As shown, the planarization station 105 of the planarization system 100 may include a cover plate 108 having a working surface 112 facing and spaced apart from the substrate 102. The cover plate 108 may be formed of materials including, but not limited to, molten silicon oxide, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, hardened sapphire, etc. In one embodiment, the cover plate 108 is transparent to UV light radiation. The surface 112 typically has the same area size as or slightly larger than the surface of the substrate 102.

[0021] The planarization station 105 may also include a cover plate chuck 118 and a planarization head 120 as part of a positioning system. The cover plate 108 may be coupled to or held by the cover plate chuck 118. The cover plate chuck 118 may be coupled to the planarization head 120. The planarization head 120 may be movably coupled to a bridge. The planarization head 120 may include one or more actuators (such as voice coil motors, piezoelectric motors, linear motors, nut-screw motors, etc.) configured at least in the z-axis direction and possibly other directions (e.g., x-axis, y-axis, θ-axis, ...). shaft and The cover plate chuck 118 moves relative to the substrate 102 on the axis. In operation, the planarization head 120 or the substrate positioning stage 106, or both, change the distance between the cover plate 108 and the substrate 102 to define a desired space (three-dimensional bounded physical extent) filled with the formable material 124. For example, the planarization head 120 may move toward the substrate and may apply force to the cover plate 108 such that the cover plate contacts and diffuses droplets of the formable material 124, as described in further detail herein.

[0022] Planarization station 105 may also include camera 136 positioned to observe the diffusion of the formable material 124 when the cover plate 108 contacts the formable material 124 during the planarization process. Camera 136 may include one or more of a CCD, sensor array, linear array camera, and photodetector, configured to focus light at wavelengths that show the contrast between areas below the cover plate 108 and in contact with the formable material 124 and areas below the cover plate 108 but not in contact with the formable material 124. Camera 136 may be configured to provide images of the diffusion of the formable material 124 below the cover plate 108 and / or images of the separation of the cover plate 108 from the cured formable material 124. Camera 136 may also be configured to measure interference fringes that change with the diffusion of the formable material 124 between the surface 112 and the substrate surface.

[0023] In another example embodiment, the distribution station 103 and the flattening station 105 may be integrated into a single station. In this embodiment, the fluid distributor 122 may be movably coupled to the bridging member. In one embodiment, the fluid distributor 122 and the flattening head 120 share one or more of all positioning components. In an alternative embodiment, the fluid distributor 122 and the flattening head move independently of each other. When the distribution station 103 and the flattening station 105 are integrated into a single station, the fluid distributor 122 and the flattening head 120 are movable, allowing each to perform its respective function without interfering with the others.

[0024] As described above, the curing station 107 may be located at a different location than the planarization station 105. As discussed in more detail below, after the formable material film 144 is formed at the planarization station 105, the substrate 102 having the formable material film 144 and the cladding 108 thereon will proceed to the curing station 107. The curing station 107 includes a radiation source 126 that directs actinic energy, such as UV light radiation, along the exposure path 128. In an example embodiment, the radiation source 126 includes a light-emitting diode (LED) array 127 and a diffuser 129. The LED array 127 and the diffuser 129 may be configured such that the emitted light is distributed across the entire substrate 102 with 80% or greater uniformity. The diffuser 129 may be positioned close to the light output of the LEDs to help achieve the desired uniformity. The wavelength of the emitted light may be from 300 nm to 400 nm. Stage 106 and track 109 can be configured such that the positions of substrate 102 and cover plate 108, and the formable material film 144 therebetween, overlap with exposure path 128. LED array 127, combined with diffuser 129, transmits photochemical energy along exposure path 128. In this manner, photochemical energy is uniformly applied to formable material film 144. Notably, curing station 107 does not include (or does not include) additional optical components (e.g., dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.). That is, LED array 127 and diffuser 129 are all the components required to uniformly guide sufficient photochemical energy to the entire surface area of ​​formable material film. Curing station 107 may also include camera 137 for data collection and monitoring of the curing process. For example, in the event of failure of one or more LEDs, such as in LED array 127, camera 137 can capture images of incomplete localized curing.

[0025] The planarization system 100 may also include a detector 139 configured to detect one, more, or all of the following after the planarization step is completed at the planarization station 105: a) particles located between the cover plate 108 and the substrate 102, b) incomplete diffusion of the formable material 124, c) particles located on the upper surface 141 of the cover plate 108 (i.e., the surface opposite to the surface facing the formable material film 144), and d) scratches located on the upper surface 141 of the cover plate 108.

[0026] Regarding the detection of particles between the cover plate 108 and the substrate 102, or the detection of incomplete diffusion of the formable material 124, if such defects are detected before curing, curing can be aborted and the substrate can be reclaimed by removing the formable material. Otherwise, if curing is performed with these defects present, the substrate 102 may need to be discarded. To detect particles between the cover plate 108 and the substrate 102, detector 139 can use optical imaging via, for example, a line scan camera, a scatterometer, or a microscope. Regarding the detection of incomplete diffusion of the formable material 124, detector 139 can use optical imaging via a line scan camera, a microscope, or stripe detection. Detector 139 can be used to determine whether the size and / or number of particles exceeds a predetermined threshold. The predetermined threshold can be selected based on the specifications of a particular manufacturing process. If the threshold is exceeded, curing can be aborted. Furthermore, in most cases, if detector 139 detects any amount of incomplete diffusion, curing can be aborted. However, in some cases, detector 139 may have a sufficiently high resolution so that detector 139 is able to detect the extent of incomplete diffusion falling within the acceptable tolerances of a particular manufacturing process. In this case, a predetermined threshold can be used to determine when to stop the curing process.

[0027] Regarding the detection of particles and scratches on the upper surface 141 of the cover plate 108, detectors such as line scan cameras, scatterometers, or microscopes can be used. Particles located on the upper surface 141 of the cover plate 108 negatively affect the flatness of the cover plate chuck 118, and particles can also migrate to the substrate 102 or substrate chuck 104, thereby negatively affecting the final planarization of the formable material. Scratches on the upper surface 141 of the cover plate 108 can indicate wear and / or particle generation, indicating that the cover plate 108 needs to be replaced, and / or can negatively affect the curing of the formable material 124. In the case of scratch detection on the upper surface 141 of the cover plate 108, if the number and / or size of the scratches exceed a predetermined threshold, the cover plate 108 can be replaced. Detector 139 can be used to determine whether the size and / or number of scratches exceed the predetermined threshold. The predetermined threshold can be selected based on specific manufacturing specifications. If the predetermined threshold is exceeded, the cover plate 108 can be replaced. When particle detection is performed on the upper surface 141 of the cover plate 108, the planarization system 100 may further include a particle removal device 143. The particle removal device 143 may be, for example, a vacuum or electrostatic tool. The particle removal device 143 may be operated to remove detected particles. A detector 139 may be used to determine whether the size and / or number of particles exceeds a predetermined threshold. The predetermined value may be selected based on specific manufacturing specifications. If the threshold is exceeded, the particles may be removed using the particle removal device 143. In another embodiment, the particle removal device 143 may be operated without first determining the presence of particles or regardless of whether particles exceeding the predetermined threshold are detected.

[0028] One or more processors 140 (controllers) communicating with one or more components and / or subsystems, such as substrate chuck 104, substrate positioning stage 106, overlay chuck 118, fluid dispenser 122, planarization head 120, camera 136, detector 139, particle removal device 143, radiation source 126, and / or camera 137, regulate, control, and / or guide the planarization system 100. Processors 140 can be operated based on instructions in a computer-readable program stored in non-transitory computer memory 142. Processors 140 can be or include one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and general-purpose computer. Processors 140 can be a specially built controller or can be a general-purpose computing device suitable for use as a controller. Examples of non-transitory computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-ray, hard disk drive, network attached storage (NAS), intranet-connected non-transitory computer-readable storage devices, and internet-connected non-transitory computer-readable storage devices. All the method steps described herein can be executed by processor 140.

[0029] Flattening methods Figure 2 A flowchart of a flattening method 200 according to an example embodiment is shown. Figures 3A to 3K A schematic cross-sectional view of the planarization system 100 during the execution of method 200 is shown. Planarization method 200 may begin at step S202, where formable material 124 is dispensed onto substrate 102 in droplet form. As described above, the surface of substrate 102 has various morphologies, which may be known based on previous processing operations or measured using a profilometer, AFM, SEM, or an optical surface profilometer based on optical interference effects (such as a Zygo NewView 8200). The local bulk density of the deposited formable material 124 varies depending on the substrate morphology. Also as described above, step S202 may be performed at dispensing station 103, which may be located at a different location than planarization station 105 or curing station 107. Figure 3A A schematic cross-sectional view of the substrate 102 is shown after the formable material 124 has been dispensed (i.e., after step S202 is completed).

[0030] Then, the planarization method 200 can proceed to step S204, in which the substrate 102 having the formable material 124 is planarized using the planarization station 105 to form a multilayer structure 111. In an example embodiment where the planarization station 105 is located separately from the dispensing station 103, the substrate 102 having the formable material 124 is first brought to the planarization station 105. Figure 3BA schematic cross-sectional view of a portion of a planarization system 100 is shown after a substrate 102 having a formable material 124 has been placed at a planarization station 105 but before planarization. Figure 3B As shown, in one example embodiment, the planarization station 105 and the curing station 107 can be positioned side-by-side within a common housing 114. Similarly, as... Figure 3B As shown, the track 109 on which the stage 106 travels can be coupled to the interior of the housing 114 and can extend from the planarization station 105 to the curing station 107. As a result of this structural arrangement, the stage 106 can travel along the track 109 to reach both the planarization station 105 and the curing station 107. The detector 139 and the particle removal device 143 can also be located within the housing 114 between the planarization station 105 and the curing station 107. Figure 3B At the moment shown, the cover plate 108 is being held by the cover plate chuck 118 and has not yet come into contact with the formable material 124.

[0031] Figure 3C and Figure 3D A more detailed schematic cross-sectional view is shown of the interaction between the cover plate 108 and the formable material 124 that occurs during step S204. Figure 3C This illustrates the moment when the cover plate 108 is about to come into contact with the formable material 124 on the substrate 102. As described above, the planarization head 120 can move toward the substrate 102 and apply force to the cover plate 108, causing the cover plate 108 to contact and diffuse droplets of the formable material 124. Figure 3D The post-contact steps are shown after the cover plate 108 has made full contact with the formable material 124. When the cover plate 108 contacts the formable material 124, droplets coalesce to form a formable material film 144 filling the space between the cover plate 108 and the substrate 102. Preferably, to minimize unfilled defects, the filling process occurs uniformly, without trapping any air or bubbles between the cover plate 108 and the substrate 102. Figure 3D At the indicated moment, step S204 has been completed. Furthermore, although the cover plate 108 is still in contact with the formable material 124, a multilayer structure 111 has been formed. Specifically, the multilayer structure sequentially comprises the cover plate 108, the formable material film 144, and the substrate 102, or is composed of the cover plate 108, the formable material film 144, and the substrate 102. Alternatively, the multilayer structure can also be considered to sequentially comprise the cover plate 108, the formable material film 144, the substrate 102, and the substrate chuck 104, or is composed of the cover plate 108, the formable material film 144, the substrate 102, and the substrate chuck 104. In either case, as... Figure 3D As shown, in the multilayer structure, the lower surface 112 of the cover plate 108 is in direct contact with the upper surface of the formable material film 144, while the lower surface of the formable material film 144 is in direct contact with the upper surface of the substrate 102.

[0032] Then, the method can proceed to step S206, in which the cover plate 108 is released from the cover plate chuck 118 while the cover plate 108 is still in contact with the formable material film 144. Figure 3E A schematic cross-sectional view of the planarization station 105 and curing station 107 in the housing 114 is shown immediately after the release of the cover plate 108. The action of releasing the cover plate 108 from the cover plate chuck 118 disengages the multilayer structure 111 from the planarization head 120. Releasing the cover plate 108 from the cover plate chuck 118 can also be referred to as "dechucking". Therefore, as a result of releasing the cover plate 108 from the cover plate chuck 118, the multilayer structure 111 (i.e., the sequentially arranged cover plate 108, formable material film 144, and substrate 102) can move along the track 109 via the stage 106. Figure 3E As shown, immediately after the cover plate 108 is released, the platform 106 that supports the multi-layer structure 111 is still located at the leveling station 105.

[0033] The method then proceeds to step S208, in which the multilayer structure 111 is transferred from the planarization station 105 to the curing station 107. The transfer of the multilayer structure 111 can be performed by actuating the stage 106 to travel linearly along the track 109 from the planarization station 105 to the curing station 107. Because the stage 106 (via the substrate chuck 104) carries the multilayer structure 111, the linear movement of the stage 106 along the track 109 also moves the multilayer structure 111. Therefore, in step S208, the multilayer structure 111 moves from the first position located at the planarization station 105 to the second position located at the curing station 107.

[0034] In one example embodiment, as the multilayer structure 111 travels along track 109, it may pass under detector 139 and subsequent particle removal equipment 143 before reaching curing station 107. Figure 3F A schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 is shown as the multilayer structure 111 passes beneath the detector 139 and the particle removal device 143. Figure 3FAs shown, detector 139 and particle removal device 143 may be located at an intermediate position between the first position of planarization station 105 and the second position of curing station 107. When the multilayer structure 111 passes under detector 139, detector 139 may detect one, more, or all of the above conditions. That is, detector 139 may detect one, more, or all of the following: a) particles located between cover plate 108 and substrate 102, b) incomplete diffusion of formable material, c) particles located on the upper surface 141 of cover plate 108 (i.e., the surface opposite to the surface facing the formable material film 144), d) scratches located on the upper surface 141 of cover plate 108. Also as stated above, if detector 139 does detect condition a) or b) before the multilayer structure 111 reaches curing station 107, the process can be stopped, and substrate 102 can be reused by removing the formable material film 144. More specifically, if detector 139 detects condition a) and / or b) exceeding a predetermined threshold, the process can be stopped, and substrate 102 can be reused. In this case, the above steps can be repeated with a new substrate having a formable material. If conditions a) and b) are not detected, the new substrate will only be cured. If the detector 139 does detect condition c) before the multilayer structure 111 reaches the curing station 107, the particle removal device 143 is activated to remove the detected particles as the multilayer structure 111 passes under it. More specifically, the particle removal device 143 can be activated if the detector 139 detects condition c) exceeding a predetermined threshold. In another example embodiment, the particle removal device 143 can operate in all cases, performing or not performing detection, regardless of whether particles are detected or whether the detected particles exceed the predetermined threshold. Furthermore, for example, when the cured multilayer structure (see below) returns to the planarization station 105 after curing, a second pass under the detector can be performed to confirm that the particles have been removed. Alternatively, a second pass can be performed by reversing the direction of travel of the multilayer structure before continuing to the curing station 107. If particles are still present, the particle removal device 143 can be operated again. The detection and removal steps can be repeated until the detector 139 no longer detects particles exceeding the predetermined threshold. If detector 139 detects condition d) before the multilayer structure 111 reaches curing station 107, the process is stopped and the cover plate is replaced with a new one. More specifically, if detector 139 detects condition d) exceeding a predetermined threshold, the process can be stopped and the cover plate can be replaced. The above steps can then be repeated with a new cover plate and a new substrate with a formable material on top; if condition d) is not detected, curing will proceed only.

[0035] After the multilayer structure 111 is transported to the curing station 107 at station 106, the method can proceed to step S210, in which the formed film layer 144 is cured. Figure 3G A schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 is shown when the multilayer structure 111 is located below the radiation source 126 and the curing process has begun. The polymerization or curing of the formable material 124 can be initiated using photochemical radiation (e.g., UV radiation). For example, the radiation source 126 provides photochemical radiation to cure, solidify, and / or crosslink the formable material film 144, thereby defining a cured layer 146 on the substrate 102. More specifically, as... Figure 3G As shown, UV light radiation is emitted from LED array 127 and directed to multilayer structure 111. Diffuser 129 uniformly diffuses the UV light radiation emitted from LED array 127 onto the surface of multilayer structure 111 along exposure path 128. Because cladding 108 is configured to be transparent with respect to the UV light radiation emitted from LED array 127, the UV light radiation passes through cladding 108 and acts on formable material film 144 to cure formable material film 144, thereby producing cured layer 146. Furthermore, because the curing step occurs at a different location than the planarization step, the UV light radiation does not pass through cladding chuck 118. Therefore, by preventing UV light radiation from passing through cladding chuck 118, the aforementioned uneven transmission of UV light occurring in other systems is avoided. Therefore, cladding chuck 118 does not need to be transparent with respect to UV light radiation.

[0036] Figure 3H A schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 is shown at the moment the curing process is completed. Figure 3H As shown, when the curing process is complete, the formable material film 144 becomes the cured layer 146. Similarly, the multilayer structure 111 becomes the cured multilayer structure 113. The cured multilayer structure 113 differs from the multilayer structure 111 in that the multilayer structure 111 includes the formable material film 144 between the cover plate 108 and the substrate 102, while the cured multilayer structure 113 includes the cured layer 146 between the cover plate 108 and the substrate 102. In other words, the cured multilayer structure 113 sequentially includes the cover plate 108, the cured layer 146, and the substrate 102, or sequentially consists of the cover plate 108, the cured layer 146, and the substrate 102. Alternatively, the cured multilayer structure 113 can also be considered to sequentially include the cover plate 108, the cured layer 146, the substrate 102, and the substrate chuck 104, or sequentially consists of the cover plate 108, the cured layer 146, the substrate 102, and the substrate chuck 104.

[0037] Then, planarization method 200 can proceed to step S212, in which the cured multilayer structure 113 is transferred back to planarization station 105. The cured multilayer structure can be transferred back to planarization station 105 by seemingly controlling stage 106 to travel linearly along track 109 in a direction opposite to the travel direction in step S208. That is, the cured multilayer structure 113 can be transferred by actuating stage 106 to travel linearly along track 109 from curing station 107 to planarization station 105. Because stage 106 (via substrate chuck 104) carries the cured multilayer structure 113, the linear movement of stage 106 along track 109 also moves the cured multilayer structure 113. Therefore, in step S212, the cured multilayer structure 113 moves from the second position located at curing station 107 to the first position located at planarization station 105. As described above, during the return to the planarization station 105, as the multilayer structure 113 passes under the detector 139, the detector can be operated again to detect particles located on the upper surface 141 of the cover plate 108. Any detected particles (new or previously unremoved particles) can then be removed using the particle removal device 143.

[0038] Figure 3I A schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 is shown when the cured multilayer structure 113 has been returned to the planarization station 105. Figure 3I As shown, at this time, the cured multilayer structure 113 is once again located below the cover plate chuck 118 and the planarization head 120.

[0039] Then, planarization method 200 can proceed to step S214, in which the cover plate 108 is separated from the cured layer 146. To remove the cover plate 108 from the cured layer 146, while the cover plate 108 is still in contact with the cured layer 146, the cover plate chuck 118 can be recoupled to the cover plate 108 (i.e., the cover plate 108 is re-clamped) via the operation of the planarization head 120. Once the cover plate 108 is coupled to the cover plate chuck 118, the cover plate chuck 118 can begin to be lifted upwards away from the substrate 102 via the operation of the planarization head 120. Because the cover plate 108 is coupled to the cover plate chuck 118, this lifting force will cause the cover plate 108 to separate from the cured layer 146. The separation force can be applied by several different methods. For example, separation force can be applied by a pin pushing upward on the cover plate 108, by a vacuum pulling upward on the upper surface 141 of the cover plate 108, and / or by applying a high-pressure air jet at the intersection of the cured layer 146 and the cover plate 108.

[0040] Figure 3JA schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 is shown after the cover plate 108 has separated from the curing layer 146. Figure 3J As shown, at this time, the cover plate 108 is once again in a state of... Figure 3A The starting position is shown, and the cured layer 146 is exposed on the substrate 102. Figure 3K A more detailed schematic cross-section of the substrate 102 is shown after the cover plate 108 has been removed from the cured layer 146 (i.e., after step S214 is completed). That is, Figure 3K A planarization layer 146, fully cured, is shown on substrate 102. Substrate 102 and cured layer 146 can then undergo additional known steps and processes for manufacturing devices (articles), such as patterning, curing, oxidation, layer formation, deposition, doping, planarization, etching, removal of formable material, cutting, bonding, and encapsulation. Substrate 102 can be processed to manufacture multiple articles (devices). These additional steps can be performed by removing substrate 102 with exposed cured layer 146 from housing 114 to different locations. Once substrate 102 with exposed cured layer 146 is removed from housing 114, planarization station 105 and curing station 107 are ready to receive new substrates with formable material and repeat the above processes.

[0041] Figure 4 A schematic cross-sectional view of the following example embodiment is shown, wherein the planarization system 100 includes two stacked housings 114, each housing 114 including a planarization station 105 and a curing station 107. Figure 4 As shown, each housing 114 has the same structure, including stations 105 and 107. By having multiple stacked housing units with stations, multiple substrates 102 having formable material 124 can simultaneously undergo the same processing described above. The structure described above regarding the curing station 107 allows for physically stacked units. In particular, by using an LED array 127 and a diffuser 129 as a radiation source 126, the curing station 107 has a much smaller profile than other systems where the radiation source is structurally more complex and requires... Figure 4 The aforementioned optical components (e.g., dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.) are not present in the design. Although Figure 4The diagram shows two stacked housings 114, but the planarization system 100 may include more housings 114, each housing including stations 105 and 107. This can be achieved by stacking additional housings 114, each including stations 105 and 107, and / or by placing stacked housings 114 side-by-side, each housing having stations 105 and 107. In an example embodiment, the planarization system 100 may include 1 to 20 housings 114, each housing including stations 105 and 107. Other examples include 5 to 15 or 8 to 12 housings 114, each housing including stations 105 and 107. In an example embodiment, the number of housings 114 that can be stacked in a single stack may be 2 to 10. Other examples include 3 to 8 or 5 to 7 housings 114 in a single stack. The compact structure that allows stacking significantly improves manufacturing throughput compared to other systems that require more physical space.

[0042] In view of this description, further variations and alternative embodiments of various aspects will be apparent to those skilled in the art. Therefore, this description should be construed as illustrative only. It should be understood that the forms shown and described herein should be considered as examples of embodiments. Elements and materials may be substituted with those shown and described herein, components and processes may be reversed, and certain features may be used independently, all of which will be apparent to those skilled in the art who benefit from this description.

Claims

1. A method for planarizing a substrate, comprising: Dispensing formable material onto a substrate; At the planarization station at the first position, the cover plate held by the cover plate chuck is brought into contact with the formable material on the substrate, thereby forming a multilayer structure including the cover plate, a film of the formable material, and the substrate; Release the cover plate from the cover plate chuck; The multilayer structure is moved from the first position to a curing station located at a second position far from the first position; While the multilayer structure is being transferred between the planarization station and the curing station, incomplete diffusion of the formable material within the multilayer structure is detected. as well as The multilayer membrane is cured by exposing it to light emitted by the curing station. The detection is performed by a detector located at an intermediate position between the planarization station and the curing station, while the multilayer structure passes under the detector during movement.

2. The method according to claim 1, wherein, The incomplete diffusion includes unfilled areas in the film of the formable material between the cover plate and the substrate.

3. The method according to claim 1, wherein, The detector uses a line scan camera, microscope, or stripe detection to optically detect the incomplete diffusion.

4. The method according to claim 1, wherein, The testing is performed before the multi-layer structure reaches the curing station.

5. The method of claim 1, further comprising detecting one or more of the following: a) There are particles between the cladding and the substrate of the multilayer structure; b) Particles are present on the upper surface of the cladding of the multilayer structure; and c) Scratches exist on the upper surface of the cladding of the multilayer structure.

6. The method according to claim 5, wherein, If particles are detected on the upper surface of the cover plate, the detected particles are removed using a vacuum tool or electrostatic tool located between the planarization station and the curing station while the multilayer structure is being transferred.

7. The method according to claim 5, further comprising: If particles are detected between the cover plate and the substrate of the multilayer structure, a correction action is performed to process the detected particles before the film is cured.

8. The method according to claim 5, further comprising: If scratches are detected on the upper surface of the cover plate, the multilayer structure is reformed using a scratch-free cover plate before the film of the multilayer structure is cured.

9. The method according to claim 1, wherein, The curing station includes a light-emitting diode array and a diffuser configured to diffuse light emitted from the light-emitting diode array, wherein the light-emitting diode array and the diffuser are configured to distribute the light with 80% or greater uniformity across the entire substrate.

10. The method according to claim 9, wherein, During curing, the light emitted by the curing station passes through the cover plate to reach the film without passing through the cover plate chuck, and wherein the curing station does not contain additional optical components, including dichroic mirrors, beam combiners, prisms, lenses, and reflectors.

11. The method according to claim 1, further comprising: After curing: The cured multilayer structure, including the cover plate, the curing layer and the substrate, is moved from the curing station back to the planarization station; The cover plate is re-clamped at the leveling station using the cover plate chuck. and Separate the cover plate from the cured layer.

12. A planarization system, comprising: A substrate chuck, which is configured to hold the substrate; A cover plate chuck, configured to hold the cover plate; Positioning station; A dispensing system configured to dispense formable material onto the substrate; A planarization station is configured to contact, at a first location, a formable material dispensed on the substrate with a cover plate held by the cover plate chuck to form a multilayer structure comprising the cover plate, a film of the formable material, and the substrate. The curing station is located at a second location, away from the first location; as well as A detector, located at an intermediate position between the planarization station and the curing station, is configured to detect incomplete diffusion of the formable material within the multilayer structure while the multilayer structure is being transferred between the planarization station and the curing station. The cover plate chuck is further configured to release the cover plate. The positioning station is configured to move the multi-layer structure from the planarization station to the curing station after the cover plate has been released, and When the multilayer structure is located in the curing station, the curing station is configured to cure the membrane of the multilayer structure by exposing the membrane to light emitted by the curing station.

13. The planarization system according to claim 12, wherein, The curing station includes an array of light-emitting diodes and a diffuser configured to diffuse light emitted from the array of light-emitting diodes, wherein the cover plate chuck is located outside the exposure path of the light emitted by the curing station when the curing station cures the film.

14. The planarization system according to claim 12, further comprising: A first housing includes the planarization station, the detector, and the curing station; as well as The second housing contains an additional planarization station, an additional detector, and an additional curing station. The second housing is stacked on top of the first housing.

15. A method of manufacturing an article, comprising: Planarize the substrate using the method described in claim 1; as well as The cured film is processed to manufacture the article.

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