A cutting patch device and method

Abstract

This invention discloses a cutting and attaching device and method. The device includes a base plate, a movable plate, and an attaching mechanism. A circuit board is placed on the base plate; the movable plate is placed above the base plate to support the substrate to be cut. The attaching mechanism includes a driving assembly, a first functional plate, a second functional plate, a cutting assembly, and an adsorption assembly. A cutting tool surrounds the bottom of the first functional plate to form an attaching outline. The adsorption assembly is disposed within the area surrounded by the cutting tool and connected to the second functional plate, having an adsorption surface and an adsorption hole communicating with a vacuum source. This invention uses a two-stage pressing action. In the first stage, the cutting tool cuts the substrate on the movable plate and adsorbs the attaching tool in situ. After the movable plate moves horizontally away along the track to avoid the cutting tool, the second stage allows the adsorption assembly to continue extending towards the base plate relative to the cutting tool, attaching the attaching tool to the circuit board in situ. This invention achieves mechanical separation of the cutting and attaching sequence and the force-bearing surface, effectively suppressing edge glue overflow and residue.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging device, and more particularly to a die cutting and mounting device. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] In the manufacturing process of electronic products, it is usually necessary to cut the patch made of materials such as high-molecular-weight polyimide insulating matrix from a roll of raw materials and accurately attach it to the surface of the flexible circuit board below. In the existing technology, the cutting and attaching process is usually completed in one step by a single punching tool. That is, at the moment the tool cuts the patch on the base material, the downward punching force presses the patch onto the circuit board underneath.

[0004] Because existing cutting blades have a physical thickness, when they cut downwards with great force, the blade sidewalls exert lateral pressure on the adhesive layer at the edge of the material being cut. This causes residual adhesive to overflow from the edge of the chip after it is dropped, thus contaminating the circuit board surface and impairing electrical performance. At the same time, the stamping blades directly apply cutting impact force to the flexible circuit board at the bottom, which can easily cause the fine copper wires inside the flexible circuit board to break or suffer fatigue damage, reducing the yield of semiconductor packaging.

[0005] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0006] The purpose of this invention is to provide a cutting and bonding device that can achieve two-stage actions in a time-sequential manner through a two-stage structure, enabling in-situ precision cutting and non-destructive bonding, thereby effectively suppressing excess and residual adhesive at the edge of the bonding pad and protecting the circuit board from the impact of cutting forces.

[0007] To achieve the above objectives, the present invention discloses a cutting and patching device, the cutting and patching device comprising: A base plate, on which a circuit board is placed; A movable plate is placed on the base plate and is used to hold the base material to be cut. The patching mechanism includes a driving component, a cutting component, and an adsorption component. The driving component drives the cutting component and the adsorption component to move toward the movable plate. The cutting component includes a cutter that surrounds and forms the patch outline. The adsorption component is disposed in the area surrounded by the cutter. The adsorption component has an adsorption surface and at least one adsorption hole communicating with a vacuum source for adsorbing the patch after it has been cut and separated by the cutter.

[0008] As a further description of the above technical solution, the driving component is configured to drive the cutting component and the adsorption component to perform a two-stage pressing action, including: During the first pressing phase, the cutter and the adsorption component extend together, so that the cutter cuts the patch on the base material, and the adsorption component adsorbs the patch. In the second pressing phase, after the movable plate leaves, the adsorption component continues to extend toward the circuit board relative to the cutter to attach the patch to the circuit board.

[0009] As a further description of the above technical solution, in the first pressing stage, the tool position is lower than the adsorption component, forming a drop of the patch thickness.

[0010] As a further description of the above technical solution, the patching mechanism also includes a first functional plate and a second functional plate. The first functional plate and the second functional plate are respectively connected to the corresponding output shaft of the driving component. A plurality of the cutting tools are disposed at the bottom of the first functional plate, and a plurality of the adsorption components are disposed at the bottom of the second functional plate. The adsorption components are inserted into the first functional plate and cooperate with the corresponding cutting tools.

[0011] As a further description of the above technical solution, the drive assembly includes a first motor and a second motor, wherein the first output shaft of the first motor is connected to the first functional board, and the second output shaft of the second motor is connected to the second functional board.

[0012] As a further description of the above technical solution, the first functional board has a first maximum stroke under the drive of the first motor, so that the cutter precisely cuts the base material on the movable board, and the second functional board has a second maximum stroke under the drive of the second motor, so that the adsorption component precisely attaches the patch to the surface of the circuit board.

[0013] As a further description of the above technical solution, the bottom of the movable plate is connected to the movable arm, the bottom of the movable arm is embedded in the movable track, and moves relative to the movable track under the drive of the belt motor.

[0014] As a further description of the above technical solution, the number of the patching mechanism is set to multiple groups, and the movable track is arranged between the multiple groups of patching mechanisms.

[0015] The present invention also discloses a method of using the above-mentioned cutting and patching device, comprising the following steps: Place the base material to be cut on the movable plate and place the circuit board to be attached on the base plate, so that the base material is located below the mounting mechanism; The drive patching mechanism performs a first pressing action, causing the cutting component and the adsorption component to move together toward the movable plate. The cutter cuts the patch on the base material, and the adsorption component generates negative pressure through the adsorption holes to adsorb the patch. Maintain the adsorption state of the adsorption component on the patch, drive the movable plate away from the base plate, so that the circuit board is located on the attachment path of the patch mechanism; The drive patching mechanism performs a second pressing action, causing the adsorption component to continue extending toward the circuit board relative to the cutter, and attaching the patch to the surface of the circuit board; Release the adsorption component from the patch, leaving the patch on the circuit board, and drive the adsorption component and the tool to reset, thereby completing the patch placement operation.

[0016] By employing the above technical solutions, the beneficial effects of the present invention are as follows: The cutting and bonding device of this invention, through a two-stage structure, achieves two-stage operation in a sequential manner, enabling in-situ precision cutting and non-destructive bonding. This effectively suppresses adhesive overflow and residue at the edge of the bonding pad and protects the circuit board from the impact of cutting forces. Specifically, during the first-stage pressing down, the reaction force of the high-hardness punching force is released onto the movable plate. The circuit board at the bottom does not bear any rigid physical impact from the cutting tool during the entire cutting process, effectively extending the life of the internal wiring of the circuit board and ensuring that its electrical performance is not subject to explicit or implicit damage. At the same time, since the bonding pad is directly adsorbed and locked onto the adsorption surface of the adsorption component after the tool cuts the base material, and the second-stage bonding is performed by the adsorption component only after the movable plate is horizontally withdrawn midway, sufficient lateral buffer space is provided for the adsorption area and its surroundings. This avoids the lateral extrusion of adhesive layer edges caused by the thickness of the tool itself, fundamentally eliminating the common problem of adhesive residue on the outer contour of the bonding pad, and significantly improving the cleanliness and overall production efficiency of microelectronic product assembly.

[0017] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the cutting component and adsorption component of a cutting and patching device provided in the embodiments of this specification; Figure 2 This is a top-view perspective perspective view of a cutting and patching device provided in the embodiments of this specification; Figure 3 This is a bottom perspective perspective view of a cutting and patching device provided in the embodiments of this specification; In the picture: 100. Base material; 200. Circuit board; 1. Base plate; 2. Movable plate; 21. Movable arm; 22. Movable track; 23. Belt motor; 3. Patch assembly; 31. Drive assembly; 32. Cutting assembly; 321. Cutting tool; 33. Adsorption assembly; 331. Adsorption surface; 3311. Adsorption hole; 34. First functional board; 35. Second functional board. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0021] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0022] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0023] Please see Figure 1-3 This embodiment provides a cutting and patching device, which includes: Base plate 1, on which circuit board 200 is placed; Movable plate 2, which is placed on the base plate 1, is used to place the base material 100 to be cut; The patch assembly 3 includes a driving component 31, a cutting component 32, and an adsorption component 33. The driving component 31 drives the cutting component 32 and the adsorption component 33 to move towards the movable plate 2. The cutting component 32 includes a cutter 321 that surrounds and forms the patch outline. The adsorption component 33 is disposed in the area surrounded by the cutter 321. The adsorption component 33 has an adsorption surface 331 and at least one adsorption hole 3311 communicating with a vacuum source for adsorbing the patch after it has been cut and separated by the cutter 321.

[0024] Specifically, in the above structure, the base plate 1 has a horizontal bearing surface for placing and supporting the circuit board 200 to be surface mounted. The movable plate 2 is stacked in the space above the base plate 1, maintaining a set vertical distance from the base plate 1. The movable plate 2 is mainly responsible for bearing and orderly stepping transport of the uncut roll of base material 100. The surface mount mechanism 3, as the main processing execution core, includes a drive assembly 31 responsible for power output, a cutting assembly 32 for workpiece cutting and separation, and an adsorption assembly 33 for clamping and transporting. The output shaft of the drive assembly 31 can output a downward linear driving force, thereby guiding the entire cutting assembly 32 and the adsorption assembly 33 to move synchronously towards the spatial plane where the movable plate 2 is located. The cutting assembly 32 includes a rigid cutter 321 that surrounds and forms the outline of the surface mount. The adsorption assembly 33 is fixed inside the hollow area surrounded by the cutter 321 in an embedded configuration. The bottom end face of the adsorption component 33 forms a highly flat adsorption surface 331. At least one adsorption hole 3311 connected to an external vacuum source pipeline is provided on the adsorption surface 331. It can use airflow to draw negative pressure to grab and fix each individual patch after it has been cut by the cutter 321 and separated from the whole roll of raw material.

[0025] Based on the above-described process of the present invention, during operation, the driving component 31 is configured via its internal timing motion controller to drive the cutting component 32 and the adsorption component 33 to jointly perform precise two-stage downward pressing. Specifically, during the first pressing stage, the first functional plate 34 and the second functional plate 35 move downward simultaneously, driving the cutter 321 and the adsorption component 33 to extend forward together. At this time, since the movable plate 2 is directly below the patching mechanism 3, the cutter 321 first vertically penetrates the base material 100 on the movable plate 2 and cuts through the base material 100 to separate the patch. At the same time, the adsorption hole 3311 at the bottom of the adsorption component 33 simultaneously opens a vacuum negative pressure, and the patch is directly locked in place on the adsorption surface 331. After the first stage is completed, the patching mechanism 3 is slightly lifted, the belt motor 23 starts and drives the movable plate 2 to move horizontally away from the processing center area. The system then immediately enters the second pressing stage. At this time, since the movable plate 2 has been retracted, the adsorption component 33 can achieve independent relative axial displacement relative to the cutter 321. It passes through the gap where the movable plate 2 was originally located and continues to extend and protrude toward the circuit board 200 on the base plate 1, and finally adheres to the surface of the circuit board 200.

[0026] In other words, the solution of this invention can achieve two-stage actions in a time-sequential manner through a two-stage structure, enabling in-situ precision cutting and non-destructive attachment, thereby effectively suppressing excess and residual adhesive at the edge of the patch and protecting the circuit board 200 from the impact of cutting forces. Specifically, during the first stage of pressing down, the reaction force of the high-hardness punching force is released onto the movable plate 2. The bottom circuit board 200 does not bear any rigid physical impact from the cutting tool 321 during the entire cutting process, effectively extending the life of the internal wiring of the circuit board 200 and ensuring that its electrical performance is not subject to explicit or implicit damage. Meanwhile, since the cutter 321 cuts the base material 100, the patch is directly adsorbed and locked onto the adsorption surface 331 of the adsorption component 33. Furthermore, the adsorption component 33 performs the second-stage attachment only after the movable plate 2 is horizontally withdrawn midway. This provides sufficient lateral buffer space for the adsorption area and its surroundings, avoiding the horizontal extrusion of adhesive at the edge of the adhesive layer caused by the wall thickness of the cutter 321 itself. This fundamentally eliminates the common problem of residual adhesive on the outer contour of the patch, significantly improving the cleanliness and overall production efficiency of microelectronic product assembly.

[0027] Furthermore, at a specific processing point in the first pressing stage, the lowermost cutting edge plane of the tool 321 is positioned vertically below the adsorption surface 331 of the adsorption component 33. This spatial arrangement naturally creates a small geometric step difference in the longitudinal dimension, which is exactly equal to the overall thickness of a single patch to be cut. This ensures that when the first-stage pressing and cutting action is performed, while the cutting edge of the tool 321 cuts the base material 100 to a depth, the adsorption surface 331 of the adsorption component 33 can gently smooth and contact the main surface of the patch with a gentle adhesion force, thus ensuring that the patch is grasped flat in situ without damage.

[0028] To facilitate batch surface mount technology (SMT) processing, the SMT mechanism 3 also incorporates a first functional plate 34 and a second functional plate 35. The first functional plate 34 and the second functional plate 35 are independently spaced and respectively connected to the corresponding independent drive output shaft of the drive assembly 31. Multiple sets or a single cutter 321 are mounted on the bottom edge of the first functional plate 34, while multiple sets or a single adsorption assembly 33 are fixedly mounted on the bottom of the second functional plate 35. The columnar upper body of all the adsorption assemblies 33 is axially inserted into pre-drilled through-holes in the first functional plate 34, thereby forming a coaxially aligned and non-interfering reciprocating motion pair with the corresponding cutter 321 in space.

[0029] To drive this dual-layer functional board structure, the drive assembly 31 consists of a separate first motor and a second motor. The first output shaft of the first motor is connected to the first functional board 34 via a ball screw pair or a linkage mechanism, enabling independent control of the vertical lifting and lowering of the first functional board 34 and its bottom cutter 321. The second output shaft of the second motor is connected to the second functional board 35 via another parallel transmission pair, enabling independent control of the vertical displacement of the second functional board 35 and its bottom adsorption assembly 33, thus providing a hardware foundation for time-division stepping control.

[0030] In specific stroke control, the first functional board 34, driven by the first motor, has a first maximum downward stroke. The endpoint of this stroke is calibrated to the limit physical position where the cutting edge of the cutter 321 precisely cuts through the base material 100 on the surface of the movable plate 2 without damaging the body of the movable plate 2. Correspondingly, the second functional board 35, driven independently by the second motor, is given a second maximum downward stroke of a longer distance. This stroke allows the adsorption component 33 to completely penetrate the inner cavity of the cutter 321 and ensures that the endpoint of the adsorption component 33 gently presses the gripped patch onto the upper surface of the bottommost circuit board 200, achieving precise depth control.

[0031] In terms of displacement control of the movable plate 2, the bottom sidewall of the movable plate 2 is rigidly interconnected with a horizontally extending movable arm 21 via a robust connector. The base of the movable arm 21 is horizontally slidably embedded in the internal groove of a long, narrow movable track 22. Driven by an external belt motor 23 via a high-tension synchronous belt, the movable arm 21 can drive the entire movable plate 2 to perform high-frequency horizontal reciprocating linear misalignment translation within the movable track 22. Based on this structure, the number of the patching mechanisms 3 is designed to be multiple sets arranged in parallel in actual factory deployment. Correspondingly, the long, narrow movable track 22 is horizontally positioned directly below the gaps between the multiple sets of parallel patching mechanisms 3, thereby allowing a single movable track 22 and a single long movable plate 2 to simultaneously meet the needs of multiple patching heads for assembly line-style batch cutting and in-situ patching operations.

[0032] Preferably, in this embodiment, there are two sets of patching mechanisms 3.

[0033] The above-mentioned device is specifically implemented based on the following operating method, including: Step 1, placing the base material 100 to be cut on the movable plate 2, and placing the circuit board 200 to be attached on the base plate 1, so that the base material 100 is located below the mounting mechanism 3; Step 2, driving the mounting mechanism 3 to perform a first pressing action, so that the cutting component 32 and the adsorption component 33 move together toward the movable plate 2, the cutter 321 cuts the patch on the base material 100, and the adsorption component 33 generates negative pressure through the adsorption hole 3311 to adsorb the patch; Step 3, maintaining the adsorption component 33 on the base material 100. Step 4: Drive the movable plate 2 away from the base plate 1 to place the circuit board 200 on the attachment path of the patch assembly 3. Step 5: Drive the patch assembly 3 to perform a second pressing action, so that the adsorption component 33 continues to extend towards the circuit board 200 relative to the cutter 321 and attaches the patch to the surface of the circuit board 200. Step 6: Release the adsorption effect of the adsorption component 33 on the patch, leaving the patch on the circuit board 200, and drive the adsorption component 33 and the cutter 321 to reset to complete the patch placement operation.

[0034] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0035] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0036] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A device for cutting and attaching patches, characterized in that, The cutting and patching device includes: A base plate, on which a circuit board is placed; A movable plate is placed on the base plate and is used to hold the base material to be cut. The patching mechanism includes a driving component, a cutting component, and an adsorption component. The driving component drives the cutting component and the adsorption component to move toward the movable plate. The cutting component includes a cutter that surrounds and forms the patch outline. The adsorption component is disposed in the area surrounded by the cutter. The adsorption component has an adsorption surface and at least one adsorption hole communicating with a vacuum source for adsorbing the patch after it has been cut and separated by the cutter.

2. The cutting and patching device according to claim 1, characterized in that: The driving component is configured to drive the cutting component and the adsorption component to perform a two-stage pressing action, including: During the first pressing phase, the cutter and the adsorption component extend together, so that the cutter cuts the patch on the base material, and the adsorption component adsorbs the patch. In the second pressing phase, after the movable plate leaves, the adsorption component continues to extend toward the circuit board relative to the cutter to attach the patch to the circuit board.

3. The cutting and patching device according to claim 2, characterized in that: In the first pressing stage, the tool is positioned below the adsorption component, creating a drop in the thickness of the patch.

4. The cutting and patching device according to claim 1, characterized in that: The patching mechanism further includes a first functional plate and a second functional plate, which are respectively connected to the corresponding output shafts of the driving component. A plurality of the cutting tools are disposed at the bottom of the first functional plate, and a plurality of the adsorption components are disposed at the bottom of the second functional plate. The adsorption components are inserted into the first functional plate and cooperate with the corresponding cutting tools.

5. The cutting and patching device according to claim 4, characterized in that: The drive assembly includes a first motor and a second motor. The first output shaft of the first motor is connected to the first function board, and the second output shaft of the second motor is connected to the second function board.

6. The cutting and patching device according to claim 5, characterized in that: The first functional board has a first maximum stroke driven by the first motor, which allows the cutter to precisely cut the base material on the movable board. The second functional board has a second maximum stroke driven by the second motor, which allows the adsorption assembly to precisely attach the patch to the surface of the circuit board.

7. The cutting and patching device according to claim 1, characterized in that: The bottom of the movable plate is connected to the movable arm, the bottom of the movable arm is embedded in the movable track, and moves relative to the movable track under the drive of the belt motor.

8. The cutting and patching device according to claim 7, characterized in that: The number of the patching mechanism is set to multiple groups, and the moving track is arranged between the multiple groups of patching mechanisms.

9. A method for using the cutting and patching apparatus according to any one of claims 1-8, characterized in that, Includes the following steps: Place the base material to be cut on the movable plate and place the circuit board to be attached on the base plate, so that the base material is located below the mounting mechanism; The drive patching mechanism performs a first pressing action, causing the cutting component and the adsorption component to move together toward the movable plate. The cutter cuts the patch on the base material, and the adsorption component generates negative pressure through the adsorption holes to adsorb the patch. Maintain the adsorption state of the adsorption component on the patch, drive the movable plate away from the base plate, so that the circuit board is located on the attachment path of the patch mechanism; The drive patching mechanism performs a second pressing action, causing the adsorption component to continue extending toward the circuit board relative to the cutter, and attaching the patch to the surface of the circuit board; Release the adsorption component from the patch, leaving the patch on the circuit board, and drive the adsorption component and the tool to reset, thereby completing the patch placement operation.

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