A cooling and shaping tool for chip packaging

Abstract

This invention discloses a cooling and shaping fixture for chip packaging, belonging to the field of chip packaging technology. It includes a mounting frame, a chip packaging cooling mold unit, a packaging fluid delivery assembly, a drive unit, a lifting unit, a temperature detection unit, a control unit, and a cooling execution unit. The temperature detection unit is mounted on the chip packaging cooling mold unit and includes a cavity temperature sensor electrically connected to the control unit. This invention, through real-time monitoring of the cavity temperature and adaptive mold-locking control, can control the mold opening and closing based on the actual curing state of the chip packaging colloid. This fundamentally avoids chip warping and deformation and packaging layer cracking caused by premature mold opening before complete curing, significantly improving the molding quality and yield of chip packaging cooling and shaping.

Description

Technical Field

[0001] This invention relates to the field of chip packaging, specifically to a cooling and shaping fixture for chip packaging. Background Technology

[0002] Chip packaging is a critical step in the chip manufacturing process. The cooling and shaping process directly determines the curing quality of the encapsulant, the stability of the chip structure, and the yield of the packaged product. As chip integration continues to increase and package size continues to miniaturize, higher requirements are placed on the uniformity of cooling and shaping, the accuracy of timing control, and the structural stability. Traditional cooling and shaping tooling can no longer meet the production needs of high-precision chip packaging.

[0003] Most existing chip packaging cooling and shaping fixtures use fixed timing control for mold opening and closing, which cannot adaptively adjust according to the actual cooling state of the chip. This easily leads to premature mold opening before the encapsulating colloid is fully cured, resulting in defects such as chip warping, deformation, and cracking of the encapsulation layer. Furthermore, traditional fixtures lack real-time monitoring of the mold cavity temperature, failing to identify problems such as excessively rapid cooling rates and large local temperature differences, resulting in poor stability during the cooling process. In addition, existing fixtures lack a linkage protection mechanism between mold opening and closing and the transport pipeline operation, making them prone to interference and collisions between the pipeline and the mold, affecting the reliability of equipment operation. Moreover, the cooling process relies on manual judgment or simple timing control, resulting in low levels of intelligence and difficulty in guaranteeing cooling effect and packaging quality.

[0004] This invention achieves linkage control between cooling status and mold movement by setting a temperature detection unit inside the mold cavity and combining it with a control unit. Compared with existing tooling, it can sense the actual cooling process of the chip in real time and use the actual solidification state as the basis for mold opening, rather than fixed time control. At the same time, it combines temperature monitoring with mechanical linkage structure to achieve coordinated actions of cooling, mold locking, mold opening and pipeline separation without adding complex driving components. The overall structure is simpler, the control logic is more in line with the actual packaging process, and the stability and adaptability are stronger. Summary of the Invention

[0005] The purpose of this invention is to provide a cooling and shaping fixture for chip packaging to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: including a mounting frame, a chip packaging cooling mold unit, a packaging liquid delivery assembly, a drive unit, a lifting unit, a temperature detection unit, a control unit, and a cooling execution unit; the temperature detection unit is disposed on the chip packaging cooling mold unit and includes a cavity temperature sensor, which is electrically connected to the control unit;

[0007] The control unit is used to receive the output value of the temperature detection unit and regulate the action timing of the drive unit and the lifting unit, thereby realizing adaptive mode-locking and timing control of the chip packaging cooling and shaping process;

[0008] It includes a temperature calculation module, which receives the temperature value output by the temperature detection unit and calculates the cooling rate and temperature uniformity.

[0009] The temperature control module calculates the action permission signals of the drive unit and the lifting unit based on the cooling rate and temperature uniformity, and transmits them to the drive unit and the lifting unit through the controller.

[0010] The drive unit includes an electric telescopic rod and matching actuators. The electric telescopic rod receives signals from the controller and allows the mold to open and close after the cooling reaches the required level. If the cooling does not reach the required level, the electric telescopic rod is locked to prevent the mold from opening.

[0011] As a further preferred embodiment of this technical solution: the cavity temperature sensor is embedded in the inner wall of the holding slot of the first packaging mold, and adopts a hidden bonding installation method. It does not directly contact the chip and the encapsulation liquid. The installation position is adjacent to the cooling channel, which can accurately reflect the curing temperature and cooling status of the chip encapsulation colloid.

[0012] As a further preferred embodiment of this technical solution: the cavity temperature sensor collects the cooling temperature signal of the chip packaging cavity in real time, converts the temperature physical quantity into an electronic control signal and outputs it to the control unit, and the sensor's detection response is adapted to the dynamic working conditions of chip packaging cooling and shaping.

[0013] As a further preferred embodiment of this technical solution: the control unit takes the main controller as its core carrier, and the main controller has a built-in interference signal filtering module to filter irrelevant interference signals such as ambient temperature fluctuations, so as to ensure the accuracy of temperature detection signals and subsequent control commands;

[0014] As a further preferred embodiment of this technical solution: the temperature calculation module is integrated inside the main controller. The temperature calculation module establishes a signal transmission relationship with the cavity temperature sensor to receive the temperature detection signal. After signal conversion, temperature calculation, and data caching, the module calculates the cooling rate and temperature uniformity in real time and outputs them to the temperature control module.

[0015] As a further preferred embodiment of this technical solution: the temperature control module is integrated inside the main controller and establishes signal transmission relationships with the temperature calculation module and the electric telescopic rod respectively. It is used to receive the cooling rate and temperature uniformity parameters, combine them with the preset threshold logic to calculate the action allowable parameters of the drive unit, and convert them into control commands to be transmitted to the electric telescopic rod.

[0016] As a further preferred embodiment of this technical solution: the temperature calculation module calculates the real-time cavity temperature based on the electronic control signal output by the cavity temperature sensor, and then calculates and outputs the cooling rate per unit time and the internal temperature difference value of the cavity based on multiple sets of continuously collected temperature data.

[0017] As a further preferred embodiment of this technical solution: the temperature control module presets a lower temperature threshold, a cooling rate threshold, and a temperature difference threshold range, classifies and judges the received cooling rate and temperature difference parameters, determines the curing state of the chip encapsulant based on the judgment results, and generates corresponding mold-locking or mold-opening permission commands.

[0018] As a further preferred embodiment of this technical solution: the temperature control module dynamically corrects the action permissions of the drive unit based on the adjusted cavity cooling state and the real-time temperature parameters fed back by the temperature calculation module. When the cooling is not up to standard, the mold-locking state is maintained, and when the cooling is up to standard, the mold-opening state is switched to be allowed, thus forming a closed-loop control.

[0019] As a further preferred embodiment of this technical solution: the chip packaging cooling mold unit includes a first packaging mold, a second packaging mold, a guide groove, a guide slider, and a holding groove; the driving unit also includes a limiting telescopic rod and a wedge-shaped push block; the lifting unit includes a support plate, a guide slide rod, a connecting plate, a second conveying pipe, a connecting slide rod, a reset spring, and a guide plate; the electric telescopic rod drives the second packaging mold to open and close along the guide groove, and the wedge-shaped push block cooperates with the wedge-shaped driven block to drive the second conveying pipe to rise and fall, thereby realizing the mechanical linkage between the mold opening and closing and the packaging liquid conveying assembly.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. This invention, through real-time monitoring of cavity temperature and adaptive mold-locking control, can control the opening and closing of the mold according to the actual curing state of the chip encapsulant, fundamentally avoiding chip warping and deformation and encapsulation layer cracking caused by premature mold opening before complete curing, and significantly improving the molding quality and yield of chip encapsulation cooling and shaping.

[0022] 2. This invention can identify the cooling rate and temperature difference distribution of the cavity in real time, stabilize the cooling environment through its own thermal stress and mold clamping preload, ensure a uniform and smooth cooling process, solve the problem of residual internal stress in the package caused by uneven cooling and uncontrollable cooling rate of traditional tooling, and improve the stability of the chip packaging structure.

[0023] 3. This invention realizes the mechanical linkage between mold opening and closing and conveying pipeline lifting and lowering, and combines temperature signal for action interlock protection, effectively avoiding interference and collision between pipeline and mold. At the same time, it abandons the fixed timing control mode, improves the reliability and intelligence level of tooling operation, and reduces equipment failure risk and production maintenance costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a cooling and shaping fixture for chip packaging according to the present invention. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the structure of a cooling and shaping fixture for chip packaging according to the present invention. Figure 2 ;

[0026] Figure 3 This is an exploded view of a cooling and shaping fixture for chip packaging according to the present invention. Figure 1 ;

[0027] Figure 4 This is an exploded view of a cooling and shaping fixture for chip packaging according to the present invention. Figure 2 ;

[0028] Figure 5 This is a flowchart of a cooling and shaping fixture for chip packaging according to the present invention.

[0029] In the diagram: 1. Mounting rack; 2. Chip packaging cooling mold unit; 21. First packaging mold; 22. Holding tank; 23. Guide groove; 24. Guide slider; 25. Second packaging mold; 3. Packaging liquid delivery assembly; 31. First delivery pipe; 32. Second delivery pipe; 4. Drive unit; 41. Electric telescopic rod; 42. Limiting telescopic rod; 43. Wedge push block; 44. Wedge driven block; 5. Lifting unit; 51. Support plate; 52. Guide slide rod; 53. Connecting plate; 54. Connecting slide rod; 55. Return spring; 56. Guide plate. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example

[0032] Please see Figures 1-5 This is a schematic diagram of some embodiments of a cooling and shaping fixture used in chip packaging according to this application.

[0033] It includes a mounting frame 1, a chip packaging cooling mold unit, a packaging liquid delivery assembly 3, a drive unit 4, a lifting unit 5, a temperature detection unit, a control unit, and a cooling execution unit;

[0034] A temperature detection unit is mounted on the chip packaging cooling mold unit and includes a cavity temperature sensor, which is electrically connected to a control unit.

[0035] The control unit is used to receive the output value of the temperature detection unit and regulate the action timing of the drive unit 4 and the lifting unit 5, thereby realizing adaptive mode-locking and timing control of the chip packaging cooling and shaping process;

[0036] Includes: a temperature calculation module, which receives the temperature value output by the temperature detection unit and calculates the cooling rate and temperature uniformity; and a temperature control module, which calculates the action permission signal of the drive unit 4 and the lifting unit 5 based on the cooling rate and temperature uniformity, and transmits it to the drive unit 4 and the lifting unit 5 through the controller.

[0037] The drive unit 4 includes an electric telescopic rod 41 and a matching execution component. The electric telescopic rod 41 receives a controller signal and allows the mold to open and close after the cooling reaches the required level. When the cooling does not reach the required level, the electric telescopic rod 41 is locked to prevent the mold from opening.

[0038] In this embodiment, the cavity temperature sensor, as the core component of the temperature detection unit, is fixedly embedded in the inner wall of the holding groove 22 of the first packaging mold 21. It adopts a hidden bonding installation method and does not directly contact the chip and the encapsulation liquid. It can simultaneously collect real-time temperature data of multiple cavity areas, taking into account the temperature monitoring of the central area and the edge area. Its installation position is adjacent to the cooling channel, which can accurately reflect the curing temperature and cooling status of the chip encapsulation colloid.

[0039] This sensor adopts an industrial-grade high-precision surface mount structure with a detection response time of ≤0.05s and a temperature detection range of 0℃–150℃. Its core function is to capture temperature signals in real time during the chip packaging cooling and shaping process, including the curing temperature of the encapsulant, the cooling rate of the cavity, and the local temperature difference distribution, and directly convert different temperature values ​​into corresponding electrical control signals of 0–5V.

[0040] The temperature value and the sensor output voltage have a strictly linear relationship, and the mathematical formula is as follows:

[0041] In the formula: U is the output voltage of the sensor (unit: V), and T is the real-time temperature of the cavity (unit: °C). The cooling temperature signal of the chip packaging cavity is detected in real time by the cavity temperature sensor, and the physical quantity of temperature is converted into an electrical control signal and transmitted to the control unit. The control unit directly determines the curing state based on the real-time temperature and cooling rate, and changes the action permissions of the drive unit and the lifting unit, thereby realizing adaptive mold locking and safe mold opening control in the cooling and shaping process.

[0042] The temperature calculation module is integrated into the main controller. It receives the temperature signal output by the temperature detection unit, and after signal conversion, temperature calculation, and data caching, it calculates the cooling rate and temperature uniformity in real time and outputs them to the temperature control module, providing a quantitative basis for subsequent mold locking and mold opening control.

[0043] Steps of the temperature calculation module:

[0044] S1, Sensor acquires voltage signal: The cavity temperature sensor acquires the cooling temperature signal of the chip packaging cavity in real time, converts it into a 0-5V analog voltage signal U, and continuously transmits it to the main controller;

[0045] S2, Data Conversion: The analog-to-digital converter built into the main controller performs digital processing on the analog voltage signal, converting the continuous analog signal into a discrete digital signal;

[0046] S3, Digital Signal Output: After data conversion, a digital voltage signal is output for subsequent temperature calculation.

[0047] S4, Temperature Calculation and Processing: Based on the linear relationship between temperature and voltage, the real-time cavity temperature is calculated using a formula;

[0048] S5, Output Temperature Value: Output the calculated real-time temperature value T to the data buffer unit;

[0049] S6, Data Cache Storage: Cache and store multiple consecutive sets of temperature values ​​for subsequent calculation of cooling rate and temperature uniformity.

[0050] S7, Cooling rate calculation: Calculates the cavity cooling rate per unit time based on the cached temperature data;

[0051] S8, Temperature Uniformity Calculation: Calculates the temperature difference inside the cavity based on multi-region temperature data;

[0052] S9, Output status parameters: Cooling rate V, temperature difference value The output is sent to the temperature control module, serving as the core basis for subsequent control.

[0053] Temperature back calculation formula: ;

[0054] Formula for calculating cooling rate:

[0055] Where: V is the cooling rate (unit: ℃ / s). Current temperature Temperature at the previous sampling time Sampling time interval (unit: s).

[0056] Formula for calculating temperature uniformity:

[0057] In the formula: Cavity temperature difference value, The highest temperature at the monitoring point Lowest temperature at the monitoring point.

[0058] The temperature control module is also integrated into the main controller, transmitting signals with the temperature calculation module and the electric telescopic rod to directly read the cooling rate V and temperature difference value output by the temperature calculation module. Based on a preset quantitative threshold relationship, it is determined whether the chip encapsulation colloid has been cured, and then converted into a corresponding control signal, which is transmitted to the electric telescopic rod of the drive unit through the main controller.

[0059] Preset threshold range:

[0060] Temperature limit threshold:

[0061] Cooling rate threshold:

[0062] Temperature difference threshold:

[0063] Uncured state: If any item fails to meet the threshold, a mold-locking signal is output to prevent the mold from opening;

[0064] Solidified state: All thresholds are met, output mold opening permission signal, allowing the mold to open.

[0065] Working principle: The chip is placed in the holding tank 22 of the first packaging mold 21. The electric telescopic rod 41 of the drive unit 4 pushes the second packaging mold 25 to close along the guide groove 23, completing the mold closing. The packaging liquid delivery component 3 injects the packaging liquid into the cavity through the second delivery pipe 32. After the injection is completed, the cooling and shaping stage begins. During the cooling process, the cavity temperature sensor embedded in the wall of the holding tank 22 collects temperature signals from multiple areas in real time, converts them into electrical signals, and transmits them to the control unit. The control unit is based on the main controller. Its built-in temperature calculation module receives the electrical signals and, after digital conversion, temperature calculation, data caching, and other processes, calculates the cooling rate and temperature uniformity in real time and outputs them to the temperature control module.

[0066] The temperature control module determines whether the encapsulating colloid has completed curing and cooling based on a preset threshold: when the temperature is below the threshold, the cooling rate is too fast, or the temperature difference is too large, it is determined that the colloid has not been cured, and a mold locking command is output to lock the electric telescopic rod 41, preventing the drive unit 4 from opening the mold. At the same time, the cavity sealing environment is stabilized by thermal stress deformation and mold closing pre-tightening force to avoid chip warping and deformation. When the temperature drops below the threshold, the cooling rate is stable, and the temperature difference is small, it is determined that the cooling and shaping have been completed, and a mold opening permission command is output. The electric telescopic rod 41 can pull the second encapsulation mold 25 to open, and at the same time, the wedge pusher 43 drives the wedge driven block 44 to rise, so that the second delivery pipe 32 is separated from the liquid inlet, completing the entire encapsulation cooling and shaping process.

[0067] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0068] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art, inspired by this description, design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the scope of protection of this invention.

[0069] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling and shaping fixture for chip packaging, characterized in that: It includes a mounting frame (1), a chip packaging cooling mold unit, a packaging liquid delivery assembly (3), a drive unit (4), a lifting unit (5), a temperature detection unit, a control unit, and a cooling execution unit; the temperature detection unit is set on the chip packaging cooling mold unit and includes a cavity temperature sensor, which is electrically connected to the control unit. The control unit is used to receive the output value of the temperature detection unit and regulate the action timing of the drive unit (4) and the lifting unit (5), thereby realizing adaptive mode-locking and timing control of the chip packaging cooling and shaping process; It includes a temperature calculation module, which receives the temperature value output by the temperature detection unit and calculates the cooling rate and temperature uniformity. The temperature control module calculates the action permission signal of the drive unit (4) and the lifting unit (5) based on the cooling rate and temperature uniformity, and transmits it to the drive unit (4) and the lifting unit (5) through the controller. The drive unit (4) includes an electric telescopic rod (41) and a matching execution component. The electric telescopic rod (41) receives a controller signal and allows the mold to open and close after the cooling reaches the standard. When the cooling does not reach the standard, the electric telescopic rod (41) is locked to prevent the mold from opening.

2. The cooling and shaping fixture for chip packaging according to claim 1, characterized in that: The cavity temperature sensor is embedded in the inner wall of the holding groove (22) of the first packaging mold (21). It adopts a hidden bonding installation method and does not directly contact the chip and the packaging liquid. The installation position is adjacent to the cooling channel, which can accurately reflect the curing temperature and cooling status of the chip packaging colloid.

3. The cooling and shaping fixture for chip packaging according to claim 2, characterized in that: The cavity temperature sensor collects the cooling temperature signal of the chip packaging cavity in real time, converts the physical quantity of temperature into an electronic control signal and outputs it to the control unit. The sensor's detection response is adapted to the dynamic working conditions of chip packaging cooling and shaping.

4. The cooling and shaping fixture for chip packaging according to claim 3, characterized in that: The control unit uses the main controller as its core. The main controller has a built-in interference signal filtering module to filter out irrelevant interference signals such as ambient temperature fluctuations, ensuring the accuracy of temperature detection signals and subsequent control commands.

5. A cooling and shaping fixture for chip packaging according to claim 4, characterized in that: The temperature calculation module is integrated into the main controller. The temperature calculation module establishes a signal transmission relationship with the cavity temperature sensor to receive the temperature detection signal. After signal conversion, temperature calculation, and data caching, it calculates the cooling rate and temperature uniformity in real time and outputs them to the temperature control module.

6. A cooling and shaping fixture for chip packaging according to claim 5, characterized in that: The temperature control module is integrated inside the main controller and establishes signal transmission relationships with the temperature calculation module and the electric telescopic rod (41) respectively. It is used to receive the cooling rate and temperature uniformity parameters, combine the preset threshold logic to calculate the action allow parameters of the drive unit (4), and convert them into control commands to be transmitted to the electric telescopic rod (41).

7. A cooling and shaping fixture for chip packaging according to claim 6, characterized in that: The temperature calculation module calculates the real-time cavity temperature based on the electronic control signal output by the cavity temperature sensor, and then calculates and outputs the cooling rate per unit time and the internal temperature difference value of the cavity based on multiple sets of continuously collected temperature data.

8. A cooling and shaping fixture for chip packaging according to claim 7, characterized in that: The temperature control module presets a lower temperature threshold, a cooling rate threshold, and a temperature difference threshold range. It classifies and judges the received cooling rate and temperature difference parameters, determines the curing state of the chip encapsulant based on the judgment results, and generates corresponding mold-locking or mold-opening permission commands.

9. A cooling and shaping fixture for chip packaging according to claim 8, characterized in that: The temperature control module dynamically corrects the action permissions of the drive unit (4) based on the adjusted cavity cooling state and the real-time temperature parameters fed back by the temperature calculation module. When the cooling is not up to standard, the mold is locked; when the cooling is up to standard, the mold is opened, thus forming a closed-loop control.

10. A cooling and shaping fixture for chip packaging according to claim 9, characterized in that: The chip packaging cooling mold unit includes a first packaging mold (21), a second packaging mold (25), a guide groove (23), a guide slider (24), and a holding groove (22); the drive unit (4) also includes a limiting telescopic rod (42) and a wedge-shaped push block (43); the lifting unit (5) includes a support plate (51), a guide slide rod (52), a connecting plate (53), a second conveying pipe (32), a connecting slide rod (54), a reset spring (55), and a guide plate (56); the electric telescopic rod (41) drives the second packaging mold (25) to open and close along the guide groove (23), and the wedge-shaped push block (43) and the wedge-shaped driven block (44) cooperate to drive the second conveying pipe (32) to rise and fall, so as to realize the mechanical linkage between the mold opening and closing and the packaging liquid conveying assembly (3).

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