Measuring device and measuring method

Abstract

A measuring device is provided, comprising: a plate-shaped transparent member through which far-infrared rays emitted from a heated device under test (DUT) can pass; a pusher block having a refrigerant flow path for refrigerant to flow through, the refrigerant being used to cool the DUT via the transparent member, the pusher block being oriented toward the DUT and causing the transparent member to move, thereby bringing the transparent member against the DUT; a lens assembly inserted through a through hole in the pusher block and exposed in the refrigerant flow path; and a temperature measuring unit that, when the DUT is in operation, detects far-infrared rays emitted from the DUT via the transparent member, the refrigerant flow path, and the lens assembly, thereby measuring the temperature distribution of the DUT.

Description

Technical Field

[0001] This invention relates to a measuring device and a measuring method. Background Technology

[0002] Patent Document 1 states: "A magnetic field detector such as a superconducting quantum interference device (SQUID) is used to detect the strength of the magnetic field, based on which a scanmagnetic field image is produced. A display device superimposes the scanmagnetic field image on a screen, so it is possible to perform defect inspection on the semiconductor device chip." (Abstract) Patent Document 2 states: "A Device Under Test (DUT) 101 emits electromagnetic (EM) radiation 201 from a specific location, such as a region. For example, the EM radiation 201 has a frequency of 50 MHz. At a specific location within a medium 103, the resonant frequency of the medium 103 may coincide with the frequency of the EM radiation. At this location, the EM radiation 201 causes changes in the optical parameters of the medium 103, particularly its luminescence, thereby enabling the EM radiation 201 to be detected by an image detector 107. In particular, the processor is configured to analyze the acquired image and determine the frequency of the EM radiation based on the location and / or shape of features within the intensity profile depicted on the image."(The DUT 101 emits the EM radiation 201 from a certain location, eg an antenna on theDUT 101. For example, the EM radiation 201 has a frequency of 50 MHz. At acertain location in the medium 103, the resonance frequency of the medium 103can match the frequency of the EM radiation. At said location the EMradiation 201 modifies the optical parameter, in particular the luminesce, of the medium 103, which can be detected by the image detector 107. In particular, the processor is configured to analyze the acquired image and todetermine the frequency of the EM radiation based on the location and / or ashape of features in the intensity profile depicted in the Image.) (0083). Patent document 3 states: "An insulation defect detection device includes: a quantum sensor configured to be close to a converter; a laser generator that irradiates the quantum sensor with a laser to activate the quantum sensor; and a microwave transceiver that transmits microwave signals to the quantum sensor and receives microwave signals fed back from the quantum sensor." . (The insulation defect detectionapparatus consists of a quantum sensor arranged near a current transformer, alaser generator for emitting laser to the quantum sensor to excite thequantum sensor, a microwave transceiver for transmitting a microwave signal to the quantum sensor and receiving a microwave signal fed back by thequantum sensor )"(summary).

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] US2002106820A1

[0006] [Patent Document 2] US2021349142A1

[0007] [Patent Document 3] CN107807342A Summary of the Invention

[0008] In a first embodiment of the present invention, a measuring device is provided. The measuring device includes: a plate-shaped transparent member through which far-infrared rays emitted from a heated device under test (DUT) can pass; a pusher block having a refrigerant flow path for refrigerant to flow through, the refrigerant being used to cool the DUT via the transparent member, the pusher block moving towards the DUT and causing the transparent member to abut against the DUT; a lens assembly inserted through a through hole in the pusher block and exposed in the refrigerant flow path; and a temperature measuring unit that, when the DUT is in operation, detects the far-infrared rays emitted from the DUT via the transparent member, the refrigerant flow path, and the lens assembly, thereby measuring the temperature distribution of the DUT.

[0009] In the measuring device, the temperature measuring unit can measure the temperature distribution of the device under test during the transition period of temperature rise before the temperature of the device under test reaches a stable state at the start of operation.

[0010] In any of the measuring devices, the positional relationship between the temperature measuring section and the lens group relative to the device under test in the optical axis direction of the lens group can be pre-designed, such that when the transparent member abuts against the device under test, the image light from the device under test is imaged onto the light-receiving surface of the temperature measuring section via the transparent member, the refrigerant flow path for the refrigerant to flow, and the lens group.

[0011] In any of the measuring devices, the temperature measuring unit can generate an image signal of the measured temperature distribution. The measuring device may further include an image processing unit that performs image processing on the image signal input from the temperature measuring unit to generate an image of the temperature distribution of the device under test.

[0012] In a second embodiment of the present invention, a measurement method is provided. The measurement method includes the following steps: moving a plate-shaped transparent member, through which far-infrared rays emitted from a heated device under test (DUT) are permeable, toward the DUT, thereby bringing the transparent member against the DUT; and while the DUT is in operation, cooling the DUT by allowing a refrigerant to flow through a refrigerant flow path at least a portion of which is surrounded by the transparent member, while detecting the far-infrared rays emitted from the DUT via the transparent member and the refrigerant flow path, thereby measuring the temperature distribution of the DUT.

[0013] Furthermore, the description of the invention does not list all the features of the invention. Moreover, sub-combinations of these feature groups can also constitute an invention. Attached Figure Description

[0014] [ Figure 1 [Illustrated perspective view of a measuring device 100 for measuring the temperature distribution of a device under test 10 according to one embodiment.]

[0015] [ Figure 2 [This is a schematic cross-sectional view showing the state in which the pusher 160, etc., of the measuring device 100 according to one embodiment abuts against the device under test 10.]

[0016] [ Figure 3 [This is a schematic cross-sectional view showing the state after the pusher 160 of the measuring device 100 according to one embodiment comes into contact with the device under test 10.]

[0017] [ Figure 4 This image shows an example of the temperature distribution of the device under test 10 visualized by a measuring device 100 according to one embodiment. Detailed Implementation

[0018] The present invention will now be described through embodiments thereof; however, these embodiments are not intended to limit the invention as described in the claims. Furthermore, the solutions of the invention do not necessarily require all combinations of the features described in the embodiments.

[0019] Figure 1 This is a schematic oblique perspective view of a measuring device 100 that measures the temperature distribution of a device under test 10 according to one embodiment. Figure 1 The diagram shows the mutually orthogonal X, Y, and Z axes. The X-axis extends along the depth direction when facing the paper; the Y-axis extends along the left-right direction when facing the paper; and the Z-axis extends along the up-down direction when facing the paper. The corresponding X, Y, and Z axes will be shown in subsequent figures, thus omitting further explanation.

[0020] The measuring device 100 includes a lens group 133, a temperature measuring unit 140, a pusher block 160, and a transparent member 170. The measuring device 100 of this embodiment may further include an image processing unit 150, a housing unit 180, and a performance board 190. Figure 1 It is indicated by the lens group 133, the temperature measuring part 140, the pusher 160 and the transparent component 170.

[0021] The device under test 10, which is the object of measurement in the measuring device 100, is a semiconductor device, such as an image sensor, a complementary metal-oxide-semiconductor (CMOS) sensor, or a charge-coupled device (CCD) sensor. As an example, the device under test 10 is formed by dicing a wafer into a single piece and then encapsulating it with resin.

[0022] Lens group 133 may consist of one or more lenses. Lens group 133 is configured such that its optical axis is parallel to the Z-axis. Lens group 133 focuses far-infrared light emitted from the device under test 10 in operation and incident from the negative side of the Z-axis into lens group 133. Lens group 133 is inserted through a through hole in push block 160 along the Z-axis direction and is fixed therein. As described in detail later, lens group 133 can be positioned in the Z-axis direction in such a way that there is no air layer between it and the refrigerant flowing in the refrigerant flow path formed in push block 160.

[0023] The temperature measurement unit 140 measures the temperature distribution of the device under test 10. The temperature measurement unit 140 is, for example, a thermal imaging camera. A thermal imaging camera can also be called a thermal sensor camera. Based on this embodiment, the temperature measurement unit 140 detects far-infrared light emitted from the device under test 10 in operation via the lens group 133.

[0024] The intensity of the far-infrared radiation detected by the temperature measurement unit 140 is stronger in areas of higher temperature and weaker in areas of lower temperature within the device under test 10. The temperature measurement unit 140 measures the two-dimensional temperature distribution on the principal surface of the device under test 10 parallel to the XY plane based on the intensity of the far-infrared radiation. The temperature measurement unit 140 generates an image signal of the measured temperature distribution and outputs it to the image processing unit 150. The temperature measurement unit 140 is wired to the image processing unit 150 to output the image signal. The temperature measurement unit 140 can also be wirelessly connected to the image processing unit 150. Furthermore, the principal surface of the device under test 10 parallel to the XY plane is, for example, a square with a side length of approximately 10 mm to 30 mm.

[0025] The image processing unit 150 processes the image signal input from the temperature measurement unit 140 to generate an image of the temperature distribution on the main surface of the device under test 10. Specifically, the image processing unit 150 generates an image of the temperature distribution corresponding to the intensity distribution of far-infrared radiation detected by the temperature measurement unit 140 on the main surface. The image processing unit 150 can generate a thermal image, using red to represent high-temperature areas on the main surface of the device under test 10 and blue to represent low-temperature areas. The image processing unit 150 can display the generated image on a screen.

[0026] The pusher block 160 forms a refrigerant flow path for refrigerant to flow through, the refrigerant being used to cool the device under test 10 via the transparent member 170. The pusher block 160 moves toward the device under test 10, causing the transparent member 170 to abut against the device under test 10.

[0027] More specifically, the pusher block 160, together with the lens assembly 133 and the transparent member 170 fixed on it, moves up and down along the Z-axis via a drive mechanism (not shown), thereby pushing the device under test 10 or a structure pulled away from the device under test 10. The temperature measuring unit 140 may also be fixed on the pusher block 160, meaning these components can all move up and down along the Z-axis as a single unit. Additionally, the pusher block 160 may also be referred to as a cover or a support, etc.

[0028] The refrigerant flow path formed in the pusher block 160 is a hollow portion extending along the X-axis, surrounded by the pusher block 160 and the transparent member 170. The lens assembly 133 is exposed in the refrigerant flow path through the through-hole formed in the pusher block 160. Figure 1As indicated by the arrow, a gas or liquid flows in the refrigerant path, serving as the refrigerant used to cool the device under test 10. For example, water may flow in the refrigerant path. The refrigerant path is sealed by a shielding structure to prevent refrigerant leakage to the outside. The refrigerant path includes areas not shown, configured in a refrigerant-circulating manner.

[0029] The transparent component 170 is, for example, glass, and is a plate-shaped optical component that allows far-infrared radiation emitted from the device under test 10 to pass through.

[0030] The housing 180 is a frame that houses the device under test 10 on the main surface on the positive side of the Z-axis. The performance board 190 has the housing 180 mounted on the main surface on the positive side of the Z-axis. The performance board 190 is electrically connected to the device under test 10 housed in the housing 180 and supplies power to the device under test 10 to make the device under test 10 operational.

[0031] Figure 2 This is a schematic cross-sectional view showing the state in which the pusher 160 and the like of the measuring device 100 according to one embodiment abut against the device under test 10. Figure 3 This is a schematic cross-sectional view showing the state after the pusher 160 of the measuring device 100 according to one embodiment abuts against the device under test 10. Figure 2 In the diagram, white arrows indicate the direction of the pusher block 160's movement. Additionally, in... Figure 2 and Figure 3 In the cross-sectional view, only a portion of the structure is represented by shaded lines for clarity.

[0032] like Figure 2 and Figure 3 As shown, the device under test 10 of this embodiment includes: one or more bare dies 11, a package 13 formed by sealing one or more bare dies 11 with resin, and an interposer 15 electrically connected to one or more bare dies 11. The device under test 10 can be a multi-package structure including multiple bare dies 11, or a single-package structure including one bare die 11.

[0033] The measuring device 100 of this embodiment is as follows: Figure 2 As shown, with the pusher block 160 and the like pulled away from the housing section 180 and the performance plate 190 along the Z-axis, the device under test 10 is housed in the housing section 180. The device under test 10 housed in the housing section 180 is electrically connected to the performance plate 190.

[0034] The measuring device 100 of this embodiment is as follows: Figure 3As shown, the pusher 160 and the like are moved toward the device under test 10 along the Z-axis, so that the transparent member 170 abuts against the device under test 10. The positional relationship between the temperature measuring section 140 and the lens group 133 relative to the device under test 10 in the optical axis direction of the lens group 133 is pre-designed so that in this state, the image light from the device under test 10 is imaged onto the light-receiving surface of the temperature measuring section 140 through the transparent member 170, the coolant flow path for coolant flow, and the lens group 133.

[0035] In this embodiment, the measuring device 100 initiates the circulation of refrigerant in the refrigerant flow path of the pusher block 160 and begins supplying power from the performance plate 190 to the device under test 10, thereby bringing the device under test 10 into an operational state. In the operational state of the device under test 10, multiple bare dies 11 each generate heat. The measuring device 100 cools the heated device under test 10 by circulating refrigerant in the refrigerant flow path.

[0036] The measuring device 100 measures the temperature distribution of the device under test 10 while the device under test 10 is in operation. With the transparent member 170 abutting against the device under test 10, the measuring device 100 cools the device under test 10 by flowing a refrigerant with controlled temperature and flow rate through a refrigerant flow path, while simultaneously measuring the temperature distribution on the main surface of the device under test 10 and visualizing the measured temperature distribution. Figure 4 This is an example illustrating the temperature distribution of the device under test 10 visualized by a measuring device 100 according to one embodiment. Figure 4 In this system, the intensity of gray is used to represent temperature, with darker gray indicating higher temperature. The image processing unit 150 of the measuring device 100 can, for example, generate... Figure 4 The temperature distribution image is shown and displayed on the screen.

[0037] If the temperature distribution in the device under test 10 starts from multiple bare wafers 11 and, over time, the temperature stops rising and reaches a stable state, then all of them will have the same temperature distribution. If the temperature distribution becomes uniform, it becomes difficult to specifically identify the relatively high-temperature wafers 11 within the device under test 10. Therefore, the measuring device 100 measures the temperature distribution of the device under test 10 during the transition period of temperature rise, before the temperature of the device under test 10 reaches a stable state, while suppressing the temperature rise of the device under test 10 at the start of operation. That is, the temperature measuring unit 140 measures the temperature distribution of the device under test 10 during the transition period of temperature rise before the temperature of the device under test 10 at the start of operation reaches a stable state. The temperature measuring unit 140 can begin measuring the temperature distribution of the device under test 10 at a predetermined time point after a predetermined time has elapsed since the power supply to the device under test 10 begins. Furthermore, the measuring device 100 can vary the predetermined time by adjusting the flow rate of the refrigerant flowing in the refrigerant path. In addition, the temperature of the device under test 10 measured by the measuring device 100 can be up to about 150°C.

[0038] Here, as a comparative example of the measuring device 100 based on this embodiment, it is assumed to be the following measuring device: in order to suppress the heat generation of the device under test 10, a temperature control unit such as a heat sink or a cooling fan is placed on the device under test 10, and the temperature of the device under test 10 is controlled by the temperature control unit while the temperature distribution of the device under test 10 is measured.

[0039] As described, when the device under test (DUT) 10 is operated, one or more dies 11 contained within the DUT 10 generate heat. The heat generation behavior of the DUT 10 varies depending on the individual differences of the dies 11 within the DUT 10. In so-called chiplet and 3D packaging, because multiple dies 11 are contained within the same package and dies 11 from multiple suppliers are mixed together, the prediction and control of heat generation becomes more complex, raising concerns about damage such as cracks to the dies 11, the interposer 15, and their contacts, which have different coefficients of thermal expansion. According to the comparative example measurement device, since the temperature control unit is placed over the DUT 10, it is impossible to determine from the outside how the DUT 10 is generating heat.

[0040] As another comparative example of the measuring device 100 based on this embodiment, consider the following measurement method: a temperature sensor, such as a distributed temperature sensor (DTS) or a thermistor diode, is placed in the package of the device under test (DUT) 10, thereby measuring the temperature distribution of the DUT 10. According to the measurement methods of other comparative examples, the location and number of temperature sensors are limited. When designing the DUT 10, locations that are expected to be high-temperature areas are anticipated, and the temperature sensors are placed in these locations to package the DUT 10. However, when the DUT 10 is actually operating, the locations that become high-temperature areas are sometimes significantly different from the anticipated locations. It is impossible to place the temperature sensors in the most suitable location, which also takes into account the influence of adjacent bare dies 11, thus failing to predict the most suitable location. Since the DUT 10 is also packaged, the position of the temperature sensors cannot be changed. Furthermore, due to circuit constraints of the device under test 10, there may be situations where the temperature sensor cannot be placed in the desired location; also, the heat distribution of a single die 11 may differ from that of a package of multiple dies 11, which becomes a critical heat source. Therefore, it is impossible to accurately measure the desired temperature location. It is possible that temperature anomalies occur outside the detection point, yet the data cannot be read. Moreover, in fin field-effect transistors (FinFETs), gate all-around (GAA), and complementary field-effect transistors (CFETs), there is no escape route for heat and internal heat sources exist, making temperature analysis and proper control even more critical issues, and ensuring reliability is extremely challenging.

[0041] In contrast, according to the measuring device 100 based on this embodiment, a transparent member 170, through which far-infrared rays emitted from the heated device under test (DUT) 10 are permeable, is moved toward the DUT 10, thereby bringing the transparent member 170 into contact with the DUT 10. Furthermore, while the DUT 10 is operational, the measuring device 100 cools the DUT 10 by flowing coolant through a coolant flow path at least a portion of which is surrounded by the transparent member 170, and simultaneously detects far-infrared rays emitted from the DUT 10 via the transparent member 170 and the coolant flow path, thereby measuring the temperature distribution of the DUT 10. Thus, the measuring device 100 is not affected by the circuit area and design of the DUT 10, and can comprehensively measure the temperature of a plurality of detection points covering the entire surface of the DUT 10 while suppressing the temperature rise of the DUT 10 when it starts operating, even when one or more bare dies 11 are packaged. Therefore, the measuring device 100 can visualize the temperature distribution of the DUT 10.

[0042] The present invention has been described above using embodiments, but the scope of the present invention is not limited to the scope described in the embodiments. Those skilled in the art will understand that various modifications or improvements can be made to the embodiments. As will be known from the claims, such modifications or improvements can also be included within the scope of the present invention.

[0043] It should be noted that the execution order of actions, sequences, steps, and stages in the apparatus, systems, programs, and methods shown in the claims, specification, and drawings can be implemented in any order unless specifically indicated as "before" or "before," and unless the output of a previous process is used in a later process. The flow of actions in the claims, specification, and drawings is described using terms such as "firstly," "secondly," etc., for convenience, but this does not imply that the actions must be performed in the stated order.

[0044] Explanation of icon numbers

[0045] 10: Device under test

[0046] 11: Nude Film

[0047] 13: Package

[0048] 15: Intermediary Board

[0049] 100: Measuring device

[0050] 133: Lens Group

[0051] 140: Temperature Measurement Department

[0052] 150: Image Processing Department

[0053] 160: Push Block

[0054] 170: Transparent component

[0055] 180: Containment Department

[0056] 190: Performance Board

Claims

1. A measuring device comprising: The plate-shaped transparent component allows far-infrared rays emitted from the heated device under test to pass through; A pusher block forms a refrigerant flow path for refrigerant to flow through, the refrigerant being used to cool the device under test via the transparent member. The pusher block moves toward the device under test, causing the transparent member to abut against the device under test. The lens assembly is inserted through the through hole of the pusher block and exposed in the refrigerant flow path; and The temperature measurement unit, when the device under test is in operation, detects the far-infrared rays emitted from the device under test via the transparent component, the refrigerant flow path, and the lens group, thereby measuring the temperature distribution of the device under test.

2. The measuring device according to claim 1, wherein, The temperature measurement unit measures the temperature distribution of the device under test during the transition period of temperature rise before the temperature of the device under test reaches a stable state after the device starts working.

3. The measuring device according to claim 1, wherein, The positional relationship between the temperature measuring section and the lens group relative to the device under test in the optical axis direction of the lens group is pre-designed such that when the transparent member abuts against the device under test, the image light from the device under test is imaged onto the light-receiving surface of the temperature measuring section via the transparent member, the refrigerant flow path for the refrigerant to flow, and the lens group.

4. The measuring device according to claim 1, wherein, The temperature measuring unit generates an image signal of the measured temperature distribution; Furthermore, the measuring device further includes an image processing unit that performs image processing on the image signal input from the temperature measuring unit to generate an image of the temperature distribution of the device under test.

5. A measurement method, comprising the following steps: A plate-shaped transparent member, allowing far-infrared radiation emitted from a heated device under test to pass through, moves toward the device under test, thereby bringing the transparent member into contact with the device under test; and While the device under test (DUT) is in operation, the DUT is cooled by allowing a refrigerant to flow through a refrigerant flow path that is at least partially surrounded by the transparent member, and the far-infrared radiation emitted from the DUT is detected via the transparent member and the refrigerant flow path, thereby measuring the temperature distribution of the DUT.

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