Pressure sensor with molded base

Abstract

A pressure sensor and a method of manufacturing the same include a body supporting at least one conductive structure. The body may be an injection-molded polymer body having a diaphragm, on which at least a portion of the conductive structure is supported. The diaphragm may include one or more reinforcing structures. The thickness of the reinforcing structures and the diaphragm can be selected to adapt the pressure sensor to a wide range of pressures.

Description

Cross-references to related applications

[0001] This application claims the benefit of U.S. Application No. 18 / 590,507, filed on February 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure generally relates to sensing devices, and more specifically, to pressure sensors for sensing pressure. Background Technology

[0003] Pressure sensors are widely used in a variety of applications, such as aerospace, automotive, medical, consumer, wearable devices, industrial, HVAC, and home automation. For example, such pressure sensors can be piezoresistive, piezoelectric, and / or capacitive.

[0004] A typical semiconductor piezoresistive sensor generally comprises a semiconductor substrate, a piezoresistive element, and circuitry. The substrate (e.g., a single-crystal silicon or metal alloy substrate) includes a diaphragm. The piezoresistive element is disposed within the diaphragm and serves as the sensing device of the semiconductor piezoresistive sensor. The circuitry is electrically connected to the piezoresistive element and includes, for example, complementary metal-oxide-semiconductor (CMOS), bridge circuitry, amplifier circuitry, or logic circuitry for receiving and processing the signal output from the piezoresistive element. A typical sensor is supported on an aluminum substrate.

[0005] One type of sensing element includes a Wheatstone bridge device or other types of bridge circuits, which are circuits that can measure minute changes in resistance. A Wheatstone bridge device is designed as a voltage divider bridge circuit with four resistors, where two pairs of resistors are connected in parallel with each other. This structure is used to measure the change in resistance of one pair of resistors relative to the other pair caused by applied pressure. In conventional pressure sensors, polymer structures are typically not used.

[0006] Conventional pressure sensors are typically manufactured, at least partially, using photolithography. Additionally, conventional pressure sensors can be manufactured using physical vapor deposition (PVD). Furthermore, the fabrication of conventional pressure sensors requires careful handling of small substrates. Cleanrooms are typically required for their manufacturing. Moreover, the materials used in the fabrication of conventional pressure sensors can be expensive.

[0007] A pressure sensor is needed that solves the problems of conventional pressure sensors.

[0008] Therefore, there is a need for a pressure sensor that avoids or minimizes the use of photolithography, physical vapor deposition techniques, or the handling of small substrates.

[0009] There is a further need for a pressure sensor that uses cost-effective materials.

[0010] There is a further need for a pressure sensor that uses a cost-effective mechanism.

[0011] A further need is for a pressure sensor that does not require cleanroom manufacturing.

[0012] There is a further need for a pressure sensor that does not require handling small substrates or individual devices.

[0013] There is a further need for a pressure sensor that addresses adhesion and / or application issues at high temperatures and / or high pressures.

[0014] A further need is for a sensor that does not require a self-compensating temperature meter.

[0015] The aspects disclosed herein address these needs. Summary of the Invention

[0016] Various aspects of this disclosure relate to a pressure sensor comprising a body defining a diaphragm and at least one conductive structure at least partially supported on the diaphragm of the body.

[0017] The body may include an injection-molded polymer, a 3D-printed polymer, and / or a machined polymer. The at least one conductive structure may include a Wheatstone bridge. The injection-molded body may include threads for mating engagement with an associated housing. The pressure sensor may include a cover layer covering at least a portion of the at least one conductive structure. The diaphragm may include at least one reinforcing structure. The at least one reinforcing structure may include a plurality of concentric circular ribs. The at least one conductive structure may include at least one of a hysteresis compensator or a temperature compensator. The at least one conductive structure may include at least one metal.

[0018] According to another aspect of this disclosure, a method includes: forming a body comprising a membrane; and forming at least one conductive structure on the membrane of the body, at least partially.

[0019] Forming the body may include injection-molded polymer materials, 3D-printed polymer materials, and / or machined polymer materials. Forming at least one conductive structure may include electroless (chemical-plated) deposition of metal on the body. Forming at least one conductive structure may include removing a portion of the deposited metal from the body. Electroless metal deposition may include using an electroless nickel immersion gold process. Forming at least one conductive structure may include forming a Wheatstone bridge. The method may include forming a capping layer over at least a portion of the at least one conductive structure. The method may include: creating an opening in the capping layer by removing a portion of the capping layer to expose a portion of the at least one conductive structure; and filling the opening with a conductive material. Forming the capping layer may include injection molding the capping layer having an opening exposing a portion of the at least one conductive structure, and the method further includes filling the opening with a conductive material. Forming the body may include forming a cylindrical threaded body.

[0020] According to another aspect of this disclosure, a body for a pressure sensor includes a molded polymer body having a diaphragm for supporting a conductive structure and threads for engaging with a mating threaded engagement with an associated housing. Attached Figure Description

[0021] Embodiments of the invention are shown in the accompanying drawings by way of example rather than limitation, and the same reference numerals refer to similar elements.

[0022] Figure 1 This is a perspective cross-sectional view of an exemplary pressure transducer including a pressure sensor according to the present disclosure.

[0023] Figure 2 This is a perspective view of the main body of the pressure sensor according to this disclosure.

[0024] Figure 3 yes Figure 2 A top view of the main body.

[0025] Figure 4 yes Figure 2 A bottom view of the main body.

[0026] Figure 5 It is along Figure 2 A three-dimensional sectional view taken from the diameter of the main body.

[0027] Figure 6 It is along Figure 2 A cross-sectional view taken from the diameter of the main body.

[0028] Figure 7 yes Figure 6 A magnified view of the local area.

[0029] Figure 8This is a flowchart of the method according to this disclosure.

[0030] Figure 9 A is Figure 8 The diagram shows the structure after the first step of the method.

[0031] Figure 9 B is Figure 8 The diagram shows the structure after the second step of the method.

[0032] Figure 9 C is Figure 8 The structural diagram after the third step of the method.

[0033] Figure 9 D is Figure 8 The structural diagram after the fourth step of the method.

[0034] Figure 9 E is Figure 8 The structural diagram after the fifth step of the method.

[0035] Figure 10 This is a flowchart of another method according to this disclosure.

[0036] Figure 11 A is Figure 10 The diagram shows the structure after the first step of the method.

[0037] Figure 11 B is Figure 10 The diagram shows the structure after the second step of the method.

[0038] Figure 11 C is Figure 10 The structural diagram after the third step of the method.

[0039] Figure 11 D is Figure 10 The structural diagram after the fourth step of the method.

[0040] Figure 11 E is Figure 10 The structural diagram after the fifth step of the method.

[0041] Figure 11 F is Figure 10 The structural diagram after the sixth step of the method.

[0042] Figure 12 This is a flowchart of another method according to this disclosure.

[0043] Figure 13 A is Figure 12 The diagram shows the structure after the first step of the method.

[0044] Figure 13 B is Figure 12 The diagram shows the structure after the second step of the method.

[0045] Figure 13 C is Figure 12 The structural diagram after the third step of the method.

[0046] Figure 13 D is Figure 12 The structural diagram after the fourth step of the method.

[0047] Figure 14 This is a perspective view of a pressure sensor with a spring-loaded contact according to the present disclosure.

[0048] Figure 15 This is a cross-sectional view of the spring-loaded contact according to this disclosure.

[0049] Figure 16 This is a cross-sectional view of an exemplary pressure transducer including a pressure sensor and a spring-loaded contact according to the present disclosure.

[0050] Figure 17 yes Figure 16 First three-dimensional sectional view of the pressure transducer.

[0051] Figure 18 yes Figure 16 The second perspective sectional view of the pressure transducer. Detailed Implementation

[0052] The description provided herein is intended to enable those skilled in the art to make and use the described embodiments. However, various modifications, equivalents, variations, combinations, and alternatives will be apparent to those skilled in the art. Any and all such modifications, variations, equivalents, combinations, and alternatives are intended to fall within the spirit and scope of the invention as defined by the claims.

[0053] Certain terms used in the following description are for convenience only and not for limitation. The words “right,” “left,” “top,” and “bottom” indicate orientation in the accompanying drawings. The words “a” and “an,” as used in the relevant portions of the claims and specification, are defined to include one or more of the referenced items, unless otherwise specified. This term includes the words specifically mentioned above, their derivatives, and words with similar meanings. The phrase “at least one” followed by a list of two or more items, such as “A, B, or C,” means any single one of A, B, or C and any combination thereof.

[0054] This document discloses embodiments of a pressure sensor and a method for manufacturing the same, the pressure sensor comprising a molded substrate or body. In a preferred embodiment, the molded substrate is an injection-molded polymer substrate.

[0055] One advantage of the pressure sensor according to this disclosure is that the molded polymer matrix is ​​inexpensive compared to current techniques that utilize, for example, aluminum alloy substrates. Furthermore, the disclosed pressure sensors and their manufacturing methods are easier to construct because they avoid or seek to minimize the use of photolithography, physical vapor deposition, and the handling of small substrates or individual sensors during the manufacturing process, but are not limited to these.

[0056] exist Figure 1 An exemplary pressure transducer is shown and is generally identified by reference numeral 10. The pressure transducer 10 includes a housing 14 in which a screw-in pressure sensor 18 according to this disclosure is supported. A first end of the housing 14 includes an external thread 22 configured to screw into a pressure sensor port, such as a manifold pressure sensor port. A pressure compensator 24 may be provided to accommodate pressure peaks. A second end of the housing 14 includes an internal thread 26 adapted to receive and engage an external threaded portion of an electrical connector 30. The pressure transducer 10 is exemplary, and it will be understood that the pressure sensor 18 according to this disclosure can be used in a wide variety of pressure transducer devices. Furthermore, the pressure sensor 18 according to this disclosure can take other forms besides the screw-in pressure sensor 18 shown.

[0057] Go to Figures 2 to 7 The illustrative pressure sensor 18 includes a body 34 having threads 36, a top portion 38, and a cavity 42. The top portion 38 defines a diaphragm 43 having an inner surface structure 44 and an outer surface structure 46, wherein conductive structures 48 for sensing pressure and / or compensating for temperature and / or hysteresis are supported. The conductive structure 48 of the outer surface structure 46 is a reference structure for measuring the resistance difference compared to the conductive structure 48 of the inner surface structure 44, which enables the measurement of the resistivity difference between the structures caused by applied pressure and / or temperature and / or hysteresis.

[0058] Figures 2 to 7 The body 34 is shown prior to the formation of the conductive structure 48. The conductive structure 48 may include, for example, a Wheatstone bridge. Details of the formation of the conductive structure 48 on the body 34 are described below in conjunction with the rest. Figures 8 to 13 D is described.

[0059] Surface structure 46 typically includes a pattern of alternating ridges and recesses. The recesses are configured to receive a metal layer and ultimately define the shape of one or more conductive structures 48, as described below. Deflection of diaphragm 43 in response to pressure changes in cavity 42 results in changes in the electrical characteristics of one or more electrical structures 48, which can be detected and correlated with absolute pressure, differential pressure, or gauge pressure. Top portion 38 also includes radial contact structures 50 for contacting electrical connector 30 when assembled in transducer 10. Specific details relating to conductive structures 48 are well known, and those skilled in the art will recognize that a wide variety of conductive structures can be used in conjunction with various aspects of this disclosure.

[0060] According to this disclosure, the body 34 comprises a molded, preferably cylindrical structure. In some embodiments, the body 34 may be an injection-molded polymer material, such as polyetheretherketone (PEEK). Additional exemplary materials include any high-performance or engineered polymer, including any fiber-reinforced variant (glass fiber or aramid fiber), such as PI, PAI, PEKK, PEK, PEKEKK, LCP, PP, PPS, PA, PES, PPSU, PEI, PSIJ, PTFE, PFA, PVDF. In some embodiments, the body 34 may be a molded metallic material, such as aluminum, formed by, for example, powder injection molding. It should be understood that multiple bodies (e.g., hundreds or more) may be formed in a single molding process.

[0061] The diaphragm 43 of the body 34 can be configured to achieve suitable deflection based on the expected pressure range and the specific material used for the body 34. In this regard, the thickness t of the diaphragm 43 can be thicker for higher pressure applications and thinner for lower pressure applications. Furthermore, as shown in the illustrated embodiment, reinforcing structures in the form of ribs 52 can be provided on the body 34. Ribs 52 can have a shape and / or size that achieves suitable deflection of the diaphragm 43. In the illustrated embodiment, the ribs 52 are circular and concentrically arranged, but other types of reinforcing structures are possible as a complement to or alternative to the ribs 52. Typically, the ribs 52 are formed during the molding of the body 34.

[0062] exist Figure 8 In this context, an exemplary method for forming a pressure sensor 18 having a molded body 34 according to the present disclosure is generally identified by reference numeral 70. Figure 9 A to Figure 9 E schematically illustrates the structure obtained during the various steps of method 70.

[0063] Method 70 begins at process step 72, in which the body 34 is molded. As described above, the body is typically formed using a polymer material in an injection molding process. Figure 9A illustrates an exemplary molded body 34 having a cavity 42, surface structures 46, and ribs 52. In process step 74, the body 34 is activated to prepare it to receive one or more metal layers. Alternatively, a doped polymer material can be used, making activation in process step 74 unnecessary. Activation of the body 34 can be performed, for example, by chemical, mechanical, or laser abrasion.

[0064] In process step 76, a metal layer is deposited on the body 34. Figure 9 B illustrates one or more metal layers 90 deposited on the surface of the substrate 34. The one or more metal layers 90 may include, for example, Ni-P, NiP-Au, Co, NiB, Cu, Al, or any other suitable material. It will be understood that any suitable process can be used to deposit the one or more metal layers 90, such as electroless (chemical) nickel immersion gold (ENIG) process. ENIG is an electroless deposition based on an autocatalytic reaction. The ENIG process can be performed with or without gold (Au). In one example, the ENIG process on a polymer may include: degreasing the surface of the substrate 34 with an alkaline solution to improve uniformity and adhesion; roughening the surface of the substrate 34 with sulfuric acid to increase the total surface area and hydrophilicity; sensitizing with a sensitization bath including adsorbed Sn nuclei to prepare bonding sites thereby promoting Pd deposition; activating with an activation bath including deposited Pd as a deposition seed (catalyst) for NiP; reducing with a reduction bath to increase the catalytic activity of the surface and prevent contamination; and electroless plating using an electroless plating bath to deposit NiP.

[0065] In process step 78, portions of one or more metal layers 90 are removed. Typically, the removal of portions of one or more metal layers 90 is performed by grinding and / or laser ablation or any other suitable process. Figure 9 C illustrates the body 34 after portions of one or more metal layers 90 have been removed. In process step 80, an optional capping layer 92 is formed by injection molding. The capping layer 92 can be made of any material suitable for the body 34, such as those described above, but with a lower glass transition temperature compared to the body material to enable a secondary (secondary) injection molding. In this example, an opening 94 is formed during the injection molding process, leaving portions of one or more metal layers 90 exposed. Figure 9 D shows the main body 34 after process step 78. In process step 82, the opening 94 is filled with metal in the secondary ENIG process without the need for reactivation. Figure 9 E shows the main body 34 after process step 80.

[0066] Figure 10Another exemplary method of forming a pressure sensor 18 having a molded body 34 according to the present disclosure is shown, the method being generally identified by reference numeral 100. Figure 11 A to Figure 11 F schematically illustrates the structure obtained during the various steps of method 100.

[0067] Method 100 begins with process step 102, in which the body 34 is molded. As mentioned above, the body is typically formed in an injection molding process. Figure 11 A shows an exemplary molded body 34 having a cavity 42, ribs 52, and surface structure 46. In process step 104, the body 34 is activated to prepare for receiving one or more metal layers. Activation of the body 34 can be performed by chemical, mechanical, or laser abrasion.

[0068] In process step 106, a metal layer is deposited on the substrate 34. Figure 11 B illustrates one or more metal layers 90 deposited on the surface of the substrate 34. The one or more metal layers 90 may include, for example, Ni-P, NiP-Au, Co, NiB, Cu, Al, or any other suitable material. It will be understood that any suitable process can be used to deposit the one or more metal layers 90, such as an electroless nickel immersion gold process (Au-free ENIG growth). ENIG is an electroless deposition based on an autocatalytic reaction. In one example, the ENIG process on a polymer may include: degreasing the surface of the substrate 34 with an alkaline solution to improve uniformity and adhesion; roughening the surface of the substrate 34 with sulfuric acid to increase the total surface area and hydrophilicity; sensitizing with a sensitization bath including adsorbed Sn nuclei to prepare bonding sites thereby promoting Pd deposition; activation with an activation bath including deposited Pd as a deposition seed (catalyst) for NiP; reduction with a reduction bath to increase the catalytic activity of the surface and prevent contamination; and electroless plating with an electroless plating bath to deposit NiP.

[0069] In process step 108, portions of one or more metal layers 90 are removed. Typically, the removal of portions of one or more metal layers 90 is performed by grinding and / or laser ablation or any other suitable process. Figure 11 C shows the body 34 after portions of one or more metal layers 90 have been removed. In process step 110, an optional cover layer 92 is formed by injection molding. The cover layer 92 can be made of any material suitable for the body 34, such as those described above, but has a lower glass transition temperature compared to the body material to enable secondary injection molding. Figure 11 D shows the main body 34 after process step 108. In process step 112, an opening 94 is formed in the cover layer 92 by removing a portion of the cover layer 92, as shown. Figure 11 As shown in E. In process step 114, opening 94 is filled with metal in the secondary ENIG process. Figure 11 F shows the main body 34 after process step 80.

[0070] Figure 12 Another exemplary method of forming a pressure sensor 18 having a molded body 34 according to the present disclosure is shown, the method being generally identified by reference numeral 200. Figure 13 A to Figure 13 D schematically illustrates the structure obtained during the various steps of method 200.

[0071] Method 200 begins with process step 202, in which the body 34 is molded. As mentioned above, the body is typically formed in an injection molding process. Figure 13 A shows an exemplary molded body 34 having a cavity 42, ribs 50, and surface structure 46. In process step 204, the body 34 is activated to prepare it to receive one or more metal layers. Activation of the body 34 can be performed by chemical, mechanical, or laser abrasion.

[0072] In process step 206, a metal layer is deposited on the body 34. Figure 13 B illustrates one or more metal layers 90 deposited on the surface of the substrate 34. The one or more metal layers 90 may include, for example, Ni-P, NiP-Au, Co, NiB, Cu, Al, or any other suitable material. It will be understood that any suitable process can be used to deposit the one or more metal layers 90, such as an electroless nickel immersion gold process (Au-free ENIG growth). ENIG is an electroless deposition based on an autocatalytic reaction. In one example, the ENIG process on a polymer may include: degreasing the surface of the substrate 34 with an alkaline solution to improve uniformity and adhesion; roughening the surface of the substrate 34 with sulfuric acid to increase the total surface area and hydrophilicity; sensitizing with a sensitization bath including adsorbed Sn nuclei to prepare bonding sites thereby promoting Pd deposition; activation with an activation bath including deposited Pd as a deposition seed (catalyst) for NiP; reduction with a reduction bath to increase the catalytic activity of the surface and prevent contamination; and electroless plating with an electroless plating bath to deposit NiP.

[0073] In process step 208, portions of one or more metal layers 90 are removed. Typically, the removal of portions of one or more metal layers 90 is performed by grinding, laser ablation, or any other suitable process. Figure 13C illustrates the body 34 after portions of one or more metal layers 90 have been removed. In process step 210, an optional capping layer 92 is formed by injection molding. The capping layer 92 can be made of any material suitable for the body 34, such as those described above, but with a lower glass transition temperature compared to the body material to allow for secondary injection molding. In this embodiment, the capping layer 92 exposes portions of one or more metal layers 90. Figure 13 D shows the main body 34 after process step 210.

[0074] The conductive structure of embodiments of this disclosure may have a dimension of, for example, 2 µm, while the overall size of the pressure sensor is approximately 5 mm. The pressure sensor according to this disclosure can be configured to sense a wide range of pressures, such as 0-3550 bar or greater.

[0075] Although the aforementioned exemplary pressure sensor is a piezoresistive pressure sensor, it will be understood that aspects of this disclosure are applicable to capacitive pressure sensors or any other similar electronic devices.

[0076] Figure 14 An exemplary pressure sensor 118 and four spring-loaded contacts 122 are shown. The spring-loaded contacts 122 can be used to electrically couple the pressure sensor 118 to an electrical connector, such as... Figure 1 Electrical connector 30 in the component. See also... Figure 15 Each spring-loaded contact 122 includes a hollow body 126 in which a pin 130 is supported for reciprocating motion. The pin 130 extends from a first end of the body 126. An end cap 134 closes a second end of the body 126. A spring 138 is positioned between the end cap 134 and the pin 130, and... Figure 15 The pin 130 is biased to the right. The pin 130 includes a first radial flange 142 and a second radial flange 146, which are adapted to engage a radially inwardly extending stop 150 of the body 126 to limit the limits of axial movement of the pin 130 relative to the body 126.

[0077] It will be understood that the spring-loaded contact 122 facilitates device assembly, particularly in screw-in applications where each sensor can be screwed into the corresponding device housing by a different amount. Furthermore, the spring-loaded contact 122 can compensate for changes caused by thermal expansion / contraction.

[0078] exist Figures 16 to 18The diagram illustrates an exemplary pressure transducer 200 including a pressure sensor according to the present disclosure. The pressure transducer 200 includes a housing 214 in which a screw-in pressure sensor 218 according to the present disclosure is supported. A first end of the housing 214 includes an external thread 222 configured to screw into a pressure sensor port (e.g., a manifold pressure sensor port). A pressure compensator 224 can be configured to accommodate pressure peaks. A second end of the housing 214 includes an internal thread 226 adapted to receive and engage an external threaded portion of an electrical connector 230. A plurality of spring-loaded contacts 122 are connected to a PCB 234 supported in the electrical connector 230 and configured to electrically couple the pressure sensor 218 to the electrical connector 230.

[0079] In the aforementioned example, injection molding was used to form the sensor's body. It will be understood that in other examples, the body may be formed in other ways, such as 3D printing, machining, or other manufacturing processes.

[0080] Although the features and elements of the invention are described in particular combinations in the exemplary embodiments, each feature may be used alone without the other features and elements of the exemplary embodiments, or in various combinations with or without the other features and elements of the invention. Changes in form and proportions of components or parts, as well as substitutions of equivalents, are contemplated, provided that circumstances may suggest or facilitate such changes without departing from the spirit or scope of the invention.

[0081] The foregoing description has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed, and many modifications and variations are possible in accordance with the foregoing teachings. The invention should be interpreted according to the claims and their equivalents.

Claims

1. A pressure sensor comprising: A polymer matrix that defines a membrane; as well as At least one conductive structure is supported at least partially on the membrane of the body.

2. The pressure sensor according to claim 1, wherein, The main body includes at least one of injection-molded main body, 3D-printed main body, or machined main body.

3. The pressure sensor according to claim 1, wherein, The at least one conductive structure includes a Wheatstone bridge.

4. The pressure sensor according to claim 1, wherein, The body includes threads for engaging with mating threads of the associated housing.

5. The pressure sensor of claim 1, further comprising a covering layer covering at least a portion of the at least one conductive structure.

6. The pressure sensor according to claim 1, wherein, The diaphragm includes at least one reinforcing structure.

7. The pressure sensor according to claim 6, wherein, The at least one reinforcing structure includes a plurality of concentric circular ribs.

8. The pressure sensor according to claim 1, wherein, The at least one conductive structure includes at least one of a hysteresis compensator or a temperature compensator.

9. The pressure sensor according to claim 1, wherein, The at least one conductive structure comprises at least a metal.

10. A method for forming a pressure sensor, the method comprising: Forming a polymer matrix with membranes; as well as At least one conductive structure is formed, at least partially, on the membrane of the main body.

11. The method according to claim 10, wherein, The body comprises at least one of injection-molded polymer material, 3D-printed polymer material, or machined polymer material.

12. The method according to claim 10, wherein, Forming at least one conductive structure includes electroless deposition of metal on the body.

13. The method according to claim 12, wherein, Forming at least one conductive structure includes removing a portion of the deposited metal from the body.

14. The method according to claim 12, wherein, Electroless metal deposition includes the use of electroless nickel immersion gold processes.

15. The method according to claim 10, wherein, Forming at least one conductive structure includes forming a Wheatstone bridge.

16. The method of claim 10, further comprising forming a capping layer over at least a portion of the at least one conductive structure.

17. The method of claim 16, further comprising creating an opening in the cover layer by removing a portion of the cover layer to expose a portion of the at least one conductive structure, and filling the opening with a conductive material.

18. The method according to claim 16, wherein, Forming the cover layer includes injection molding the cover layer having an opening that exposes a portion of the at least one conductive structure, and the method further includes filling the opening with a conductive material.

19. The method according to claim 10, wherein, Forming the body includes forming a cylindrical threaded body.

20. A body for a pressure sensor, comprising: A polymer body having a diaphragm for supporting a conductive structure and threads for engaging with a mating threaded connection to an associated housing.

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