Field ready environmental sensor device

CN122953471APending Publication Date: 2026-10-20SHOCKWATCH INC
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Patent Information

Application Number
CN202580017585.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-04-15
Filing Date
2025-04-16
Publication Date
2026-10-20

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Abstract

An environmental sensor device includes a detection component comprising at least one response element that responds to an environmental stimulus received by the detection component exceeding a threshold. A readiness component is configured to hold the detection component in an unready state. The readiness component includes a collecting element and a holding element connected to the collecting element. The holding element is positioned to prevent at least one response element from responding to the environmental stimulus. The collecting element is configured to collect energy that causes the holding element to ablate, thereby placing the detection component in a readiness state.
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Description

[0001] Cross-references to related applications Invention Field

[0002] This application claims priority to U.S. Provisional Application No. 63 / 635,141 (filed April 17, 2024) and U.S. Provisional Application No. 63 / 651,577 (filed May 24, 2024) under 35 U.S.C., the entire contents of which are incorporated herein by reference. Background of the Invention

[0003] During manufacturing, storage, or transportation, many types of objects need to be monitored due to their sensitivity or fragility. For example, some types of objects may be easily damaged upon drop or impact. Other types of objects need to be monitored or tracked due to their temperature sensitivity or vulnerability. For example, some types of objects may be easily damaged if exposed to specific temperatures (e.g., food or pharmaceuticals). Therefore, for quality control purposes and / or general monitoring of transportation conditions, it is necessary to identify and / or verify the environmental conditions under which objects have been exposed. Brief description of the attached diagram

[0004] To gain a more complete understanding of this application and its objectives and advantages, the following description is made with reference to the accompanying drawings, wherein:

[0005] Figure 1 An application diagram of an embodiment of the environmental sensor device according to the present disclosure is shown;

[0006] Figure 2 A block diagram of an embodiment of an environmental sensor device according to the present disclosure is shown;

[0007] Figure 3 A partial schematic diagram of an embodiment of an environmental sensor device according to the present disclosure is shown in an unprepared state;

[0008] Figure 4 This is a schematic diagram illustrating the standby state according to this disclosure. Figure 3 This is part of an embodiment of an environmental sensor device;

[0009] Figure 5 A schematic diagram of an embodiment of an environmental sensor device according to another embodiment of the present disclosure is shown;

[0010] Figure 6 The following is shown in accordance with this disclosure: Figure 5 A schematic diagram of a cross-section of a portion of an environmental sensor device in an unprepared state; and

[0011] Figure 7This is a schematic diagram illustrating the standby state of the device according to this disclosure. Figure 5 A cross-sectional view of a portion of an environmental sensor device. Detailed description

[0012] Reference will now be made in detail to the present embodiments of this disclosure, one or more examples of which are illustrated in the accompanying drawings. Detailed descriptions use numbers and letters to refer to features in the drawings. The same or similar names in the drawings and specification are used to refer to the same or similar parts of this disclosure.

[0013] The following description is provided to enable those skilled in the art to make and use the described embodiments to implement this disclosure. However, various modifications, equivalents, variations, and substitutions will be apparent to those skilled in the art. Any and all such modifications, variations, equivalents, and substitutions are intended to fall within the scope of this disclosure.

[0014] As used herein, the term "exemplary" means "serving as an example, instance, or illustration." Any implementation described herein as "exemplary" is not necessarily to be construed as superior to or better than other implementations. Furthermore, unless specifically indicated, all embodiments described herein should be considered exemplary.

[0015] For the purposes described below, the terms “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” “lateral,” “longitudinal,” and their derivatives should be applied to this disclosure because they are oriented in the accompanying drawings. However, it should be understood that various alternative variations may be taken in this disclosure unless expressly stated to the contrary. It should also be understood that the specific devices shown in the drawings and described in the following specification are merely exemplary embodiments of this disclosure. Therefore, specific dimensions and other physical features associated with the embodiments disclosed herein should not be considered limiting.

[0016] As used herein, the terms “first” and “second” are used interchangeably to distinguish one component from another and are not intended to indicate the location or importance of the individual components.

[0017] The singular forms “a,” “one,” and “the” include the plural, unless the context clearly indicates otherwise.

[0018] The terms “coupled,” “fixed,” “attached,” etc., refer to direct coupling, fixing, or attachment, as well as indirect coupling, fixing, or attachment through one or more intermediate components or features, unless otherwise stated herein.

[0019] Embodiments of this disclosure provide apparatus and techniques for field-ready sensor devices. As used herein, an "unready" state of a sensor device refers to a state in which it does not respond to environmental stimuli configured to detect and / or indicate them, while a "ready" state of a sensor device refers to a state in which it responds to environmental stimuli configured to detect and / or indicate them. In other words, in an unready state, the sensor device is configured to remain inactive even if it may experience environmental stimuli configured to detect them, such as, as a non-limiting example, a temperature event exceeding a threshold. Therefore, in a ready state, the sensor device is configured to provide an indication of having experienced an environmental stimulus in response to an environmental stimulus exceeding a threshold.

[0020] In exemplary embodiments, the apparatus and techniques for field-ready environmental sensor devices do not require a user of the environmental sensor device to remove components of the environmental sensor device to put the sensor device into a ready state. In other words, embodiments of this disclosure achieve non-contact readiness of the environmental sensor device. According to an exemplary embodiment, the environmental sensor device includes a readiness component having an energy harvesting element configured to harvest energy from radio waves impacting the energy harvesting element. The readiness component is configured to generate a current from the harvested energy, such that the current generates heat to dissolve a portion of the readiness component to readjust the environmental sensor device. In exemplary embodiments, radio waves from a device, such as, as a non-limiting example, a radio frequency identification (RFID) reader device, generate the current and heat. Therefore, in exemplary embodiments, a non-contact method for reading and preparing an environmental sensor device is provided, such that a user of the environmental sensor device does not need to physically remove tabs, pins, or other components of the environmental sensor device to readjust the environmental sensor device.

[0021] Now refer to the attached drawings, especially to Figure 1 Example diagrams of sensor device 10 are provided, in which illustrative embodiments of the present disclosure can be implemented. Figure 1 In this embodiment, sensor device 10 is a portable device configured to be fixed to or disposed within a transport container 14 containing an object, and related events of the object will be monitored, such as, by way of non-limiting example, temperature and / or shock events exceeding a defined time and / or threshold. Embodiments of sensor device 10 monitor whether the object has been exposed to some degree of environmental stimuli during the manufacture, storage, use, and / or transport of the object. In some embodiments, sensor device 10 may include a housing 12 that can be fixed to transport container 14 using, for example, adhesive materials, permanent or temporary fasteners, or various different types of attachment devices. Transport container 14 may include a container in which the monitored object is loosely placed, or may include a container / surface of the monitored object itself. It should be understood that... Figure 1This is merely an example and is not intended to assert or imply any limitation on environments in which different embodiments may be implemented.

[0022] Figure 2 A block diagram illustrating an embodiment of the sensor device 10 according to embodiments of the present disclosure. Figure 2 In the middle, in the outer shell 12 ( Figure 1 Within the sensor device 10, a microsensor 20 and a wireless communication module 22 are included. The microsensor 20 is a micromechanical and / or microelectronic device (e.g., a microscopic device or system, typically a component with a micrometer-sized overall dimension, usually measured in square millimeters) used to detect environmental events. The microsensor 20 may be configured as a microelectromechanical system (MEMS) device (e.g., using silicon or other materials to create a desired shape / part in processes or techniques such as material layer deposition, patterning by photolithography, and etching), a liquid crystal display (LCD) panel fabrication device (e.g., a device fabricated using glass components and / or glass substrates through LCD manufacturing processes such as patterning, lamination, masking, dicing, and thin-film transistor (TFT) deposition techniques, which may or may not include liquid crystals), and / or formed using roll-to-roll (R2R) processing techniques (e.g., forming the device on a roll of flexible plastic, metal foil, or flexible glass).

[0023] In some embodiments, the microsensor 20 includes a detection component 24. The detection component 24 may include one or more switching elements, traces, contacts, circuitry, fluids, absorbent materials, fusible substances, substances, and / or other types of structures and / or components configured to detect environmental stimuli and / or detect changes in the activation state of the microsensor 20. For example, in some embodiments, the microsensor 20 may include a movable element that moves or becomes displaced in response to a shock and / or temperature event. Displacement of the movable element may cause a change in the state of the detection component 24 (e.g., an impedance change, from an open-circuit state to a closed-circuit state, and vice versa, etc.). The wireless communication module 22 is configured to wirelessly transmit information associated with the state of the detection component 24, indicating the activation state of the sensor device 10 (e.g., based on the open or closed state of the component 24). For example, in one embodiment, the wireless communication module 22 includes an RFID module 30. In some embodiments, the RFID module 30 includes a passive RFID module 30 (e.g., a passive RFID tag) having an RFID integrated circuit or circuitry 32 (e.g., disposed on or as part of a printed circuit board), a memory 34, and an antenna 36. As a passive RFID module 30, the sensor device 10 does not include a battery (e.g., it is powered by an external reader device 46, such as a wireless or RFID reader as a non-limiting example), thus forming a battery-free environment sensor device 10. For example, in an embodiment where the reader device 46 is an RFID reader device, when the RFID module 30 encounters radio waves from the reader device 46, the antenna 36 generates a magnetic field, thereby powering the RFID module 30 to excite the circuitry 32. Once excited / activated, the RFID module 30 can output / transmit information encoded in the memory 34. However, it should be understood that in some embodiments, the RFID module 30 may include an active RFID module 30, which includes a power source (e.g., a battery) configured to continuously, intermittently, and / or according to programming or event triggering to broadcast or transmit specific information. One embodiment of passive RFID tags is flexible circuit RFID in roll form. In flexible circuit RFIDs, chips and antennas are embedded onto a thin substrate of 100 to 200 nanometers (nm) using materials such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), phenolic plastics, polyester, styrene, or paper, through copper etching or hot stamping. The RFID manufacturing process involves screen printing using conductive inks containing copper, nickel, or carbon. An example of commercially available flexible circuit passive RFID tags, which can contain hundreds or even thousands per roll, is the Smartrac™ product from Avery Dennison.

[0024] It should also be understood that the wireless communication module 22 can be configured for other types of wireless communication types, modes, protocols, and / or formats (e.g., Short Message Service (SMS), wireless data using General Packet Radio Service (GPRS) / 3G / 4G or via Wi-Fi over the public Internet, or locally with other wireless communication protocol standards such as Wi-Fi, Z-Wave, ZigBee, Bluetooth, Bluetooth Low Energy (BLE), LoRA, NB-IoT, SigFox, Digital Enhanced Cordless Telecommunications (DECT), or other popular technologies). As will be further explained below, in response to the reception of a specific level and / or amplitude of an environmental event, the environmental sensor device 10 functions as a passive sensor / indicator, which can be used as part of an electronic signal or circuit. In some embodiments, when in a monitored state, the environmental sensing capability / function of the environmental sensor device 10 of this disclosure does not require power.

[0025] In the illustrated embodiment, memory 34 may include one or more stored and / or encoded values ​​40, which are externally and / or wirelessly transmitted by wireless communication module 22 to indicate whether environmental sensor device 10 has been activated, or in other words, experienced or detected an environmental event it is configured to detect. In an exemplary embodiment, one or more values ​​40 may include at least two different stored and / or encoded values ​​42 and 44. For example, value 42 may correspond to a value output / transmitted by wireless communication module 30 when detection component 24 is in an open-circuit state, and value 44 may correspond to a value output / transmitted by wireless communication module 30 when detection component 24 is in a closed-circuit state. As an example, value 44 may represent an RFID tag identification (ID) number without an activated detection component 24, and the RFID tag ID number may have an additional character (e.g., "0") placed at its end. Value 42 may represent an RFID ID number with an activated detection component 24, and the RFID tag ID number may have an additional character (e.g., "1") at its end different from that carried by value 44. In the illustrated embodiment, the RFID module 30 (e.g., circuitry 32) is coupled to the detection component 24 and can detect whether the component 24 is in an open or closed circuit condition or state. Thus, for example, the detection component 24 may initially be in a closed circuit condition or state. Therefore, if powered on / activated, the wireless communication module 30 transmits value 44 to the reader device 46. If the sensor device 10 is subjected to an environmental event, the microsensor 20 may cause a change in the state of the detection component 24, resulting in the detection component 24 being in an open circuit condition or state. Therefore, if powered on / activated (e.g., after an environmental event), the wireless communication module 30 will instead transmit value 42 to the reader device 46. Therefore, embodiments of the invention enable the environmental sensor device 10 to use electronic indicators (e.g., RFID readers) to monitor its attached sensitive products / objects to detect potential damage caused by environmental events, while the environmental sensor device 10 does not contain or require any internal power source (e.g., battery). In some embodiments, the detection component 24 is configured to be irreversible, such that once the state of the detection component 24 changes, the detection component 24 is prevented from returning to a previous state. For example, if the detection component 24 is in a closed-circuit state or condition before the microsensor 20 is activated, and an environmental event causes the microsensor 20 to be activated, which also causes the detection component 24 to transition to an open-circuit state or condition, then the microsensor 20 is configured to remain in the open-circuit state and cannot return to the closed-circuit state. Therefore, embodiments of this disclosure prevent any unauthorized reset of the environmental sensor device 10.

[0026] Embodiments of the environmental sensor device 10 according to this disclosure may include computer program instructions at any possible level of integration technical detail (e.g., stored in a computer-readable storage medium (or media) (e.g., memory 34)) for causing a processor to execute aspects of the invention. The computer-readable program instructions described herein may be downloaded to a corresponding computing / processing device (e.g., wireless communication module 22 and / or RFID module 30). The computer-readable program instructions for performing operations of the invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, integrated circuit configuration data, or source code or object code written in any combination of one or more programming languages. In some embodiments, electronic circuitry (e.g., circuit 32) including, for example, programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs) can be personalized to execute the computer-readable program instructions by utilizing status information from the computer-readable program instructions in order to perform aspects of the invention. Aspects of the invention are described herein with reference to illustrations and / or block diagrams of methods and / or apparatus according to embodiments of the invention. It will be understood that each box in the illustrations and / or block diagrams, and combinations of boxes in the illustrations and / or block diagrams, may represent a module, code segment, or code portion, implementable by computer-readable program instructions. These computer-readable program instructions may be provided to a processor or other programmable data processing apparatus to produce a machine, such that the instructions, executed via the processor, create means for implementing the functions / actions specified in one or more boxes of the illustrations and / or block diagrams. These computer-readable program instructions may also be stored in a computer-readable storage medium that can instruct computing devices, programmable data processing apparatuses, and / or other devices to operate in a particular manner, such that the computer-readable storage medium storing the instructions includes an article of manufacture comprising instructions for implementing aspects of the functions / actions specified in one or more boxes of the illustrations and / or block diagrams. The detection component 24, the wireless communication module 22, and / or the RFID module 30 may be implemented using known technologies in any suitable manner, which may be hardware-based, software-based, or some combination of both. For example, the detection component 24, the wireless communication module 22, and / or the RFID module 30 may include software, logic, and / or executable code for performing the various functions described herein (e.g., as software and / or algorithms running on a processor unit, hardware logic residing in a processor or other type of logic chip, centralized in a single integrated circuit, or distributed across different chips in a data processing system). As those skilled in the art will understand, aspects of this disclosure can be embodied as a system, method, or computer program product. Therefore, aspects of this disclosure can take the form of hardware embodiments, software embodiments (including firmware, resident software, microcode, etc.).This may be an embodiment combining software and hardware aspects, which are generally referred to herein as “circuit,” “module,” or “system.”

[0027] Figure 3 A schematic diagram of an exemplary embodiment of the environmental sensor device 10 according to the present disclosure is shown. Figure 3 In the illustrated embodiment, the environmental sensor device 10 is a collision sensor device 50. Figure 3 In this embodiment, the collision sensor device 50 is depicted as being in an unready state. In an exemplary embodiment, the collision sensor device 50 includes a detection component 24. Figure 3 In the illustrated embodiment, the detection component 24 includes a response component 52 configured to respond to one or more environmental stimuli. As a non-limiting example, environmental stimuli may be one or more of acceleration or impact events, vibrations, temperature events (e.g., approaching, reaching, and / or exceeding a specific temperature level at any time or for a certain duration), tilting events, changes in physical location, humidity, or light. In the illustrated embodiment of the collision sensor device 50, the response component 52 is a detection mass block 60 that can move in response to an acceleration or impact event exceeding a defined threshold. However, it should be understood that the response component 52 may be configured differently for other types of environmental sensor devices 10 and / or environmental stimuli.

[0028] exist Figure 3 In this assembly, detection component 24 further includes connecting elements 62 and 64 coupled to the detection mass block 60. Connecting elements 62 and 64 are conductive and electrically coupled to a detection circuit 66 forming at least a portion of the detection component 24. The detection circuit 66 may be electrically coupled and / or communicatively coupled to a wireless communication module 22. Figure 2 For example, as a non-limiting example, RFID circuit 32 ( Figure 2 In an exemplary embodiment, at least a portion of the detection mass block 60 is conductive, such that the detection mass block 60, in conjunction with connecting elements 62 and 64, forms a closed circuit of the detection circuit 66. However, it should be understood that in alternative embodiments, connecting elements 62 and 64 may extend across the detection mass block 60 and be electrically connected to each other when the detection mass block 60 is not conductive.

[0029] In an exemplary embodiment, the detection mass 60 is positioned in a suspended position by one or more flexures, springs, or other flexible elements (not shown), allowing the detection mass 60 to move along at least one sensitive axis 70. Therefore, in response to an acceleration or impact event along the sensitive axis 70, the detection mass 60 deflects or moves in the direction of the sensitive axis 70, corresponding to the magnitude of the acceleration or impact event. In an exemplary embodiment, one or more of the connecting elements 62, 64 are fragile or prone to breakage in response to the magnitude of an acceleration or impact event exceeding a defined threshold. Therefore, in an exemplary embodiment, in response to the magnitude of an acceleration or impact event exceeding a defined threshold, at least one of the connecting elements 62, 64 disconnects and interrupts the electrical path between the connecting elements 62, 64. Therefore, in Figure 3 In the illustrated embodiment, the detection circuit 66 can change from a closed-circuit state to an open-circuit state. In an exemplary embodiment, the detection mass block 60 and connecting elements 62, 64 can be formed using standard MEMS, LCD, and / or r2r methods.

[0030] exist Figure 3 In the illustrated embodiment, the environmental sensor device 10 includes a preparedness component 80 configured to keep the environmental sensor device 10 in an unprepared state. In other words, for... Figure 3 The collision sensor device 50 shown, in response to receiving an acceleration or impact event exceeding a predetermined threshold, causes component 80 to limit or prevent the detection mass block 60 from moving to the extent that one or more connecting elements 62, 64 would damage or break the closed circuit of the detection circuit 66. Figure 3 In the illustrated embodiment, the preparation component 80 includes one or more energy harvesting or collecting elements 82. As used herein, an "energy harvesting element" is one or more components configured to capture radio frequency signals and convert them into electrical current. In an exemplary embodiment, one or more harvesting elements 82 are configured to harvest or collect energy from radio waves emitted by a reader device, such as reader device 46 (e.g., an RFID reader device), as a non-limiting example. Therefore, as a non-limiting example, antenna 36 ( Figure 2 It can be considered as an energy harvesting element 82, since the antenna 36 can be used to power the RFID circuit 32.

[0031] exist Figure 3In the illustrated embodiment, the collecting element 82 forming at least a portion of the backup assembly 80 is a single-turn loop antenna 90. In an exemplary embodiment, the backup assembly 80 also includes a ground plane 92 and a retaining element 94. The loop antenna 90 is a bent metal conductor. The loop antenna 90 can be formed by electroplating or etching the bent metal conductor onto a non-conductive substrate material such as paper or plastic. The ground plane 92 is a metallic ground plane, which can be in the form of a thin metal plate or a layer of conductive material, for example, as a non-limiting example, a metal or conductive layer formed on the surface of a printed circuit board, paper, or plastic substrate. The retaining element 94 is also a metal or conductive layer. Figure 3 In the illustrated embodiment, the first end 100 of the loop antenna 90 is electrically connected to the ground plane 92, and the second end 102 of the loop antenna 90, opposite to the first end 100, is electrically connected to the first end 104 of the holding element 94. The second end 106 of the holding element 94, opposite to the first end 104, is electrically connected to the detection mass block 60.

[0032] In an exemplary embodiment, the retaining element 94 is configured to have a greater mechanical strength than the connecting elements 62, 64. Therefore, in an exemplary embodiment, the retaining element 94 limits or prevents the detection mass block 60 from moving in response to an acceleration or impact event exceeding a predetermined threshold, which would otherwise cause at least one of the connecting elements 62, 64 to break. In an exemplary embodiment, the cross-section of the retaining element 94 is three to thirty times thicker than the connecting elements 62, 64. In an exemplary embodiment, the retaining element 94 may be formed to have a smaller cross-sectional area than the loop antenna 90. The backup assembly 80 can be formed using standard MEMS, LCD, and / or R2R methods.

[0033] Figure 4 This is a schematic diagram illustrating the standby state of the device according to this disclosure. Figure 3An exemplary embodiment of the sensor device 10 is provided. In operation, the loop antenna 90 serves as an energy harvesting component, utilizing radio waves received from a radio wave generating device, such as, but not limited to, the reader device 46. Thus, in an exemplary embodiment where the reader device 46 is an RFID reader device, the loop antenna 90 receives radio frequency energy from the reader device 46 and serves as an inductive circuit element resonating with a capacitor formed by the detection mass block 60 and the ground plane 92. Current flows through the loop antenna 90 and the holding element 94 based on the radio waves emitted by the reader device 46 and the impacts of these radio waves on the loop antenna 90. In an exemplary embodiment, the inductor-capacitor (LC) resonance causes the generation of thermal energy or heat in the holding element 94 sufficient to melt the holding element 94, causing the holding element 94 to disconnect from the detection mass block 60 and enabling the detection mass block 60 to respond to acceleration or impact events. In other words, degradation of the holding element 94 causes the detection mass block 60 to move along the sensitive axis 70 in response to acceleration or impact events exceeding a defined threshold. In an exemplary embodiment, the loop antenna 90, the holding element 94, and / or the ground plane 92 may be selected and / or configured based on the frequency characteristics of the radio waves emitted by the reader device 46, such that the radio waves generate a current passing through the loop antenna 90 and the holding element 94, sufficient to cause degradation of the holding element 94. Therefore, in an exemplary embodiment, the holding element 94 functions as a fuse responsive to the radio waves emitted by the reader device 46. Figure 4 In this configuration, the retaining element 94 is depicted as being in an ablated, melted, or broken state, thus placing the collision sensor device 50 in a standby state. Therefore, in response to an acceleration or impact event exceeding a predetermined threshold, the detection mass 60 moves freely in the direction of the sensitivity axis 70, sufficient to cause one or more connecting elements 62, 64 to break and change the detection circuit 66 from a closed state to an open state.

[0034] Figure 5 A schematic diagram of an exemplary embodiment of the sensor device 10 according to the present disclosure is shown. Figure 5 In the illustrated embodiment, sensor device 10 is temperature sensor device 120. Figure 5In this embodiment, the temperature sensor device 120 includes a container 130 containing a substance 132 that responds to temperatures exceeding a predetermined threshold. In an exemplary embodiment, the substance 132 may be a solid form of wax or an ionic substance or compound that melts or liquefies in response to exposure to a temperature level exceeding the predetermined threshold. The container 130 may be in the form of a paper material having a substance embedded therein or on it. The container 130 may also be a container for containing the substance 132, for example, as a non-limiting example, a walled container. The temperature sensor device 120 also includes an indicator element 140 positioned relative to the container 130 such that, in response to a temperature event exceeding the predetermined threshold, the substance 132 melts or liquefies and is absorbed by the indicator element 140. The indicator element 140 may be configured to provide a visual indication of activation of the temperature sensor device 120, such that, as a non-limiting example, the substance 132 may be a specific color or change to a specific color in response to a temperature event exceeding the predetermined threshold. The absorption and / or migration of substance 132 into and / or along a portion of the length of indicator element 140 can provide a visual indication of the activation of temperature sensor device 120. Additionally or alternatively, indicator element 140 may be coupled to detection circuitry 66, and substance 132 may be ionic, such that the presence and / or migration of ionic substance in and / or along a portion of the length of indicator element 140 can close the circuit (e.g., change detection circuitry 66 from an open-circuit state to a closed-circuit state).

[0035] exist Figure 5 In the illustrated embodiment, the temperature sensor device 120 includes a collecting element 82, which is in the form of a loop antenna 150 disposed or formed on a substrate 152. At least a portion of the loop antenna 150 is disposed between the indicator element 140 and the material 132. In operation, at least a portion of the loop antenna 150 acts as a dam or barrier element, which restricts or blocks the flow of the material 132 to or from contacting the indicator element 140 when the temperature sensor device 120 is in an unready state. Thus, in an exemplary embodiment, at least a portion of the loop antenna 150 holds the temperature sensor device 120 in an unready state, preventing the material 132 from contacting the indicator element 140 in response to a temperature event exceeding a predetermined threshold, which would otherwise cause the material 132 to melt or liquefy. In an exemplary embodiment, the substrate 152 may be a non-conductive plastic sheet or a layer of material.

[0036] Also for reference Figure 6 and 7 , Figure 6 It is in a state of inadequacy. Figure 5 A schematic enlarged cross-sectional view of a portion of the temperature sensor device 120, and Figure 7 It is in a state of readiness. Figure 5 A schematic enlarged cross-sectional view of a portion of the temperature sensor device 120. (See attached image.) Figure 6 As best shown, retaining element 94 is formed as part of loop antenna 150. Figure 6 and 7 In the illustrated embodiment, the retaining element 94 includes a portion 160 of the loop antenna 150, which serves as a fuse portion of the loop antenna 150. The portion 160 may be a narrowed or necked region in the cross-section of the loop antenna 150, such that sufficient current flowing through the loop antenna 150 generates sufficient heat to degrade, melt, or ablate the portion 160. In an exemplary embodiment, the substrate 152 includes an opening, void region, or channel 170 located near the portion 160 and between the material 132 and the portion 160. In an exemplary embodiment, in response to a temperature event exceeding a predetermined threshold that would otherwise cause the material 132 to melt or liquefy, the material 132 may enter the channel 170, but the portion 160 restricts, blocks, or prevents further flow of the material 132 to reach or contact the indicator element 140.

[0037] like Figure 7 As best illustrated, in response to radio waves emitted by a radio wave transmitting device (e.g., as a non-limiting example, reader device 46 (e.g., RFID reader device)) and striking the loop antenna 150, a current is generated in the loop antenna 150 and heat is generated in the loop antenna 150. In an exemplary embodiment, the loop antenna 150 and / or portion 160 can be selected and / or configured based on the frequency characteristics of the radio waves emitted by the reader device 46, such that the radio waves generate a current through the loop antenna 150 and portion 160 sufficient to cause degradation of portion 160. Figure 7 As shown, at least a portion of the degradation, melting, or ablation of section 160 enables channel 170 to be in fluid communication with indicator element 140, and enables substance 132 to flow through channel 170 and contact indicator element 140 in response to a temperature event exceeding a defined threshold that would cause substance 132 to melt or liquefy. Figure 5-7 For ease of description and explanation, the ground plane is omitted from the view, for example, ground plane 92 as a non-limiting example. Figure 3 and Figure 4However, it should be understood that the conductive layer or ground plane may be located at one or more different locations in the layered arrangement of the temperature sensor device 120 to generate a conductor-capacitor (LC) resonance relative to the loop antenna 150, thereby generating heat sufficient to melt or ablate at least a portion of portion 160. As a non-limiting example, the ground plane may be located on a substrate 152 spaced apart from the loop antenna 150 (e.g., on the side of the substrate 152 opposite to the loop antenna 150), or it may be a separate conductive layer located above or below the loop antenna 150 and spaced apart from the loop antenna 150 in the layered arrangement of the temperature sensor device 120.

[0038] All the means or steps plus functional elements in the following claims are intended to include any structure, material, action, and equivalent for performing the function in combination with other claimed elements of the specific claim. The description of this disclosure has been given for purposes of illustration and description, but it is not intended to be exhaustive or to limit the disclosure to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of this disclosure. The embodiments were chosen and described in order to best explain the principles and practical application of this disclosure and to enable others skilled in the art to understand it; various embodiments with various modifications are suitable for the particular intended use.

Claims

1. An environmental sensor device, comprising: A detection component, comprising at least one response element that responds to environmental stimuli exceeding a threshold received by the detection component; and A prepared component configured to keep the detection component in an unprepared state, wherein the prepared component includes: Collect components; and A retaining element coupled to the collecting element, the retaining element being positioned to prevent the at least one responding component from responding to the environmental stimulus, and wherein the collecting element is configured to collect energy that causes the retaining element to ablate in order to place the detection component in a standby state.

2. The environmental sensor device of claim 1, wherein the collecting element is configured to collect energy from radio waves.

3. The environmental sensor device according to claim 1, wherein the collecting element comprises at least one antenna.

4. The environmental sensor device of claim 1, wherein the holding element is further coupled to the at least one response component.

5. The environmental sensor device according to claim 1, wherein, The at least one response component includes a substance configured to liquefy in response to environmental stimuli.

6. The environmental sensor device of claim 5, wherein the holding element is positioned to restrict movement of the liquefied state of the substance.

7. The environmental sensor device according to claim 1 further includes a wireless communication module configured to output the activation state of the detection component.

8. An environmental sensor device, comprising: A detection component includes at least one response component that responds to environmental stimuli exceeding a threshold received by the detection component. One or more antennas; and A holding element coupled to at least one of the one or more antennas, the holding element being positioned to prevent the at least one responding component from responding to environmental stimuli, and wherein the at least one antenna is configured to collect radio wave energy that causes the holding element to ablate, so that the at least one responding component can respond to environmental stimuli.

9. The environmental sensor device according to claim 8 further includes a wireless communication module configured to output the activation state of the detection component.

10. The environmental sensor device according to claim 9, wherein, The at least one antenna includes a first antenna, and wherein the one or more antennas include a second antenna, the second antenna being configured to power the wireless communication module based on radio waves received from the reader device.

11. The environmental sensor device according to claim 8, characterized in that, The at least one response component includes detection quality.

12. The environmental sensor device of claim 11, wherein the holding element is coupled to the detection mass block.

13. The environmental sensor device according to claim 11 further includes a grounding layer disposed separately from the detection mass block.

14. The environmental sensor device of claim 8, wherein the at least one responding component comprises a substance configured to liquefy in response to an environmental stimulus, and wherein the retaining element is positioned to restrict movement of the liquefied state of the substance.

15. An environmental sensor device, comprising: The detection component includes at least one response element that responds to environmental stimuli exceeding a threshold received by the detection component; and Positioned as a prepared component that keeps the detection component in an unprepared state, wherein the prepared component includes: Positioned as a retaining element to prevent the responding component from responding to environmental stimuli; and A collecting element electrically coupled to the holding element, wherein in response to a radio wave striking the collecting element, current flows through the holding element and generates heat in the holding element, and wherein the heat causes the holding element to melt and puts the detection component into a standby state.

16. The environmental sensor device of claim 15, wherein the holding element is coupled to the at least one response component.

17. The environmental sensor device of claim 15, wherein the at least one response component comprises at least one of the following: The detection mass block moves in response to environmental stimuli; or A substance that liquefies in response to environmental stimuli.

18. The environmental sensor device of claim 15 further includes a wireless communication module configured to output the activation state of the detection component.

19. The environmental sensor device of claim 15, wherein the collecting element comprises an antenna, and wherein the holding element comprises at least a portion of the antenna.

20. The environmental sensor device according to claim 15, wherein, The detection component forms at least a portion of at least one of a collision sensor device or a temperature sensor device.