Common mode noise filter

Abstract

The common-mode noise filter (1) of the embodiment includes: a first conductor portion (3), a second conductor portion (4), a first barrier layer (5) electrically insulated from the first conductor portion (3), and a second barrier layer (6) electrically insulated from the second conductor portion (4). The first conductor portion (3) has a first helical conductor (31) and a first lead-out conductor (32). The second conductor portion (4) has a second helical conductor (41) and a second lead-out conductor (42). The first barrier layer (5) is disposed at a position where the outermost periphery (315) of the first lead-out conductor (32) and the first helical conductor (31) overlap when viewed from above. The second barrier layer (6) is disposed at a position where the outermost periphery (415) of the second lead-out conductor (42) and the second helical conductor (41) overlap when viewed from above.

Description

Technical Field

[0001] This disclosure generally relates to common-mode noise filters. More specifically, this disclosure relates to common-mode noise filters having multiple conductor portions. Background Technology

[0002] Patent Document 1 discloses a common-mode noise filter comprising stacked first and second helical conductors, first and second terminal electrodes, first and second lead-out conductors, and multiple resin insulating layers. The first lead-out conductor connects the inner peripheral end of the first helical conductor to the first terminal electrode. The second lead-out conductor connects the inner peripheral end of the second helical conductor to the second terminal electrode. Multiple resin insulating layers are disposed between the first and second helical conductors. The first and second lead-out conductors are formed on different resin insulating layers.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-33033 Summary of the Invention

[0006] In the common-mode noise filter described above, when a high voltage is applied to the first helical conductor and the first lead-out conductor, the following problem may occur: the electric field strength between the outermost periphery of the first helical conductor and the first lead-out conductor increases, and sometimes cracks or fissures may appear between the outermost periphery of the first helical conductor and the first lead-out conductor. In other words, in the conventional common-mode noise filter described above, the tolerance to high voltage may sometimes decrease.

[0007] This disclosure provides a common-mode noise filter capable of suppressing reduced tolerance to high voltage.

[0008] The common-mode noise filter disclosed herein comprises: a substrate, a first conductor portion and a second conductor portion, a first blocking layer and a second blocking layer. The first conductor portion and the second conductor portion are disposed inside the substrate and arranged vertically. The first blocking layer is disposed inside the substrate and is electrically insulated from the first conductor portion. The second blocking layer is disposed inside the substrate and is electrically insulated from the second conductor portion. The first conductor portion has a first helical conductor and a first lead-out conductor. The first helical conductor extends in a helical shape. The first lead-out conductor is disposed in a plane different from the first helical conductor in the vertical direction, and its two ends are respectively led out to the outer surface of the substrate. The second conductor portion has a second helical conductor and a second lead-out conductor. The second helical conductor extends in a helical shape. The second lead-out conductor is disposed in a plane different from the second helical conductor in the vertical direction, and its two ends are respectively led out to the outer surface of the substrate. The first blocking layer is disposed between the first helical conductor and the first lead-out conductor in the vertical direction, at a position where the outermost peripheries of the first lead-out conductor and the first helical conductor overlap when viewed from the vertical direction. The second barrier layer is positioned between the second spiral conductor and the second lead conductor in the vertical direction, at the point where the outermost peripheries of the second lead conductor and the second spiral conductor overlap when viewed from the vertical direction.

[0009] The common-mode noise filter according to one aspect of this disclosure has the advantage of being able to suppress the reduction in tolerance to high voltage. Attached Figure Description

[0010] Figure 1 This is an exploded perspective view of the common-mode noise filter involved in this embodiment.

[0011] Figure 2A This is a top view of the common-mode noise filter described above.

[0012] Figure 2B This is a top view of the common-mode noise filter described above.

[0013] Figure 2C This is a top view of the common-mode noise filter described above.

[0014] Figure 2D This is a top view of the common-mode noise filter described above.

[0015] Figure 2E This is a top view of the common-mode noise filter described above.

[0016] Figure 2F This is a top view of the common-mode noise filter described above.

[0017] Figure 3 The diagram illustrating the location where the first blocking layer is set is provided for the aforementioned common-mode noise filter.

[0018] Figure 4 The common-mode noise filter mentioned above is Figures 2A to 2F A sectional view of the main part at line X1-X1.

[0019] Figure 5 The common-mode noise filter mentioned above is Figures 2A to 2F A sectional view of the main part at the X2-X2 line.

[0020] Figure 6A This is a top view of the first blocking layer in the common-mode noise filter of the first variant example.

[0021] Figure 6B This is a top view of the second blocking layer in the common-mode noise filter of the first variant.

[0022] Figure 7A This is a top view of the first blocking layer in the common-mode noise filter of the second variant.

[0023] Figure 7B This is a top view of the second blocking layer in the common-mode noise filter of the second variant.

[0024] Figure 8 The common-mode noise filter, which relates to other variations, is a main partial cross-sectional view of the case where the first blocking layer is positioned closer to the first lead-out conductor than the first helical conductor.

[0025] Figure 9 The common-mode noise filter, which relates to other variations, is a main partial cross-sectional view of the case where the first blocking layer is positioned closer to the first helical conductor than the first lead-out conductor. Detailed Implementation

[0026] The embodiments and modifications described below are merely examples of this disclosure. This disclosure is not limited to these embodiments and modifications; even outside of these embodiments and modifications, various changes can be made according to design, etc., as long as they do not depart from the scope of the technical concept involved in this disclosure. The figures described in the following embodiments and modifications are schematic figures, and the size and thickness ratios of the constituent elements in the figures may not reflect the actual size ratios.

[0027] (Implementation Method)

[0028] (1) Summary

[0029] The following is for reference Figures 1-3 An overview of the common-mode noise filter 1 involved in this embodiment will be described. Figure 1 This is an exploded perspective view of the common-mode noise filter 1 involved in this embodiment. Figures 2A to 2F This is a top view of common-mode noise filter 1. Figure 3This diagram illustrates the position where the first blocking layer 5 is located, relating to the common-mode noise filter 1. Furthermore, the terms "upper" and "lower" used in this disclosure merely indicate the relative positional relationship of the various structures of the common-mode noise filter 1 and are not intended to limit the direction of use of the common-mode noise filter 1. The term "lower" in this disclosure can refer to, for example, the use of the common-mode noise filter 1 in the direction of up, front, back, left, or right. Moreover, in... Figure 1 , Figures 2A to 2F The diagram shows arrows representing up, down, left, right, and front and back, but these arrows are merely for illustrative purposes and do not represent any actual objects.

[0030] The common-mode noise filter 1 described in this embodiment allows the differential-mode component of the signal to pass through while attenuating the common-mode noise component. The common-mode noise filter 1 is mounted on a circuit board or electronic component of an electronic device.

[0031] like Figure 1 As shown, the common-mode noise filter 1 includes: a base body 2, a first conductor portion 3, a second conductor portion 4, a first blocking layer 5, and a second blocking layer 6. The first conductor portion 3 and the second conductor portion 4 are disposed inside the base body 2 and arranged in the vertical direction. The first blocking layer 5 is disposed inside the base body 2 and is electrically insulated from the first conductor portion 3. The second blocking layer 6 is disposed inside the base body 2 and is electrically insulated from the second conductor portion 4.

[0032] The first conductor section 3 has a first helical conductor 31 and a first lead-out conductor 32. The first helical conductor 31 extends in a helical shape. The first lead-out conductor 32 is disposed in a plane different from the first helical conductor 31 in the vertical direction, and leads both ends of the first helical conductor 31 to the outer surface of the substrate 2. Similarly, the second conductor section 4 has a second helical conductor 41 and a second lead-out conductor 42. The second helical conductor 41 extends in a helical shape. The second lead-out conductor 42 is disposed in a plane different from the second helical conductor 41 in the vertical direction, and leads both ends of the second helical conductor 41 to the outer surface of the substrate 2.

[0033] In the common-mode noise filter 1 of this embodiment, the first blocking layer 5 is disposed between the first spiral conductor 31 and the first lead conductor 32 in the vertical direction. When viewed from the vertical direction, the outermost periphery 315 of the first lead conductor 32 and the first spiral conductor 31 (refer to...) Figure 2C The overlapping positions. Similarly, the second barrier layer 6 is disposed between the second spiral conductor 41 and the second lead conductor 42 in the vertical direction. Viewed from the vertical direction, the outermost periphery 415 of the second lead conductor 42 and the second spiral conductor 41 (refer to) Figure 2D (The overlapping positions)

[0034] In a common-mode noise filter (hereinafter referred to as the "comparative common-mode noise filter") where no second spiral conductor or either of the two second lead-out conductors is provided between the first spiral conductor in the vertical direction and the two first lead-out conductors, the following problem arises: In the comparative common-mode noise filter, when a high voltage is applied to the first spiral conductor and the two first lead-out conductors, a voltage drop corresponding to the number of turns of the first spiral conductor occurs. As a result, the electric field strength between the outermost periphery of the first spiral conductor and the first lead-out conductor with the longer conductive distance from the outermost periphery increases. Consequently, the comparative common-mode noise filter sometimes develops cracks or fissures between the outermost periphery of the first spiral conductor and the aforementioned first lead-out conductors. As a result, the outermost periphery of the first spiral conductor and the aforementioned first lead-out conductors are electrically connected through the sides of the cracks or fissures, which sometimes fails to attenuate common-mode noise components. In summary, the comparative common-mode noise filter sometimes exhibits reduced tolerance to high voltages.

[0035] However, in the common-mode noise filter 1 of this embodiment, the first blocking layer 5 is disposed between the first spiral conductor 31 and the first lead conductor 32 in the vertical direction. When viewed from the vertical direction, the first lead conductor 32 and the first spiral conductor 31 have at least the outermost periphery 315 (refer to) the outermost periphery 315 of the first spiral conductor 31. Figure 2C The common-mode noise filter 1 of this embodiment can suppress the problems of the common-mode noise filter of the comparative example when a high voltage is applied to the first spiral conductor 31 and the first lead conductor 32. That is, suppose a crack or fissure occurs between the outermost periphery 315 of the first spiral conductor 31 and the first lead conductor 32, which has a longer conductive distance from the outermost periphery 315. Even in this case, the common-mode noise filter 1 of this embodiment can suppress the connection of the crack or fissure to both sides of the outermost periphery 315 of the first spiral conductor 31 and the first lead conductor 32. In other words, when a high voltage is applied to the first spiral conductor 31 and the first lead conductor 32, the common-mode noise filter 1 of this embodiment can suppress the electrical connection between the outermost periphery 315 of the first spiral conductor 31 and the first lead conductor 32 via the side of the crack or fissure.

[0036] Similarly, in the common-mode noise filter 1 of this embodiment, the second blocking layer 6 is disposed between the second spiral conductor 41 and the second lead conductor 42 in the vertical direction. When viewed from the vertical direction, at least the outermost periphery 415 of the second lead conductor 42 and the second spiral conductor 41 (refer to...) Figure 2DThe positions where they overlap. Therefore, when a high voltage is applied to the second helical conductor 41 and the second lead conductor 42, the common-mode noise filter 1 of this embodiment can suppress the electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead conductor 42 via the side of the crack or fissure.

[0037] Therefore, the common-mode noise filter 1 of this embodiment has the advantage of being able to suppress the reduction in tolerance to high voltage.

[0038] (2) Detailed structure

[0039] (2-1) Overall structure

[0040] The following is for reference Figures 1-5 The detailed structure of common-mode noise filter 1 is described below. Figure 4 Involving common-mode noise filter 1, is Figures 2A to 2F A sectional view of the main part at line X1-X1. Figure 5 Involving common-mode noise filter 1, is Figures 2A to 2F A sectional view of the main part at the X2-X2 line.

[0041] like Figure 1 As shown, the common-mode noise filter 1 includes: a body 2, a first conductor portion 3, a second conductor portion 4, a first blocking layer 5, a second blocking layer 6, through holes B1, B2, B3, and B4, and a magnetic body member 7.

[0042] like Figure 1 As shown, the first conductor section 3 has a first spiral conductor 31 and a first lead-out conductor 32. (As...) Figure 2A As shown, the first conductor section 3 has two first lead-out conductors 321 and 322 as first lead-out conductors 32. The first lead-out conductor 321 is electrically connected to the first spiral conductor 31 via a through-hole B1. Furthermore, the first lead-out conductor 322 is electrically connected to the first spiral conductor 31 via a through-hole B2. In summary, the first lead-out conductor 321 and the first lead-out conductor 322 are electrically connected via through-hole B1, the first spiral conductor 31, and through-hole B2.

[0043] Similarly, as Figure 1 As shown, the second conductor section 4 has a second spiral conductor 41 and a second lead-out conductor 42. (As...) Figure 2F As shown, the second conductor section 4 has two second lead-out conductors 421 and 422 as second lead-out conductors 42. The second lead-out conductor 421 is electrically connected to the second spiral conductor 41 via a through-hole B3. Furthermore, the second lead-out conductor 422 is electrically connected to the second spiral conductor 41 via a through-hole B4. In summary, the second lead-out conductor 421 and the second lead-out conductor 422 are electrically connected via through-hole B3, the second spiral conductor 41, and through-hole B4.

[0044] One of the first lead-out conductors 321 and 322 serves as a first input terminal, and the other serves as a first output terminal. One of the second lead-out conductors 421 and 422 serves as a second input terminal, and the other serves as a second output terminal. That is, the common-mode noise filter 1 includes a first input terminal, a second input terminal, a first output terminal, and a second output terminal. The common-mode noise filter 1 removes common-mode noise from the differential signal input through the first and second input terminals and outputs a signal from the first and second output terminals.

[0045] (2-2) Body

[0046] like Figure 1 As shown, base body 2 contains multiple ( Figure 1 There are 17 insulating layers 20. Multiple insulating layers 20 are stacked in the vertical direction.

[0047] Multiple insulating layers 20 include insulating layers 21, 22, 23, 24, 25, 26, 27, 201, 202, 203, 204, 2a, 2b, 2c, 2d, 2e, and 2f. The multiple insulating layers 20 are overlapped from top to bottom in the order of insulating layers 2a, 201, 2b, 202, 2c, 21, 22, 23, 24, 25, 26, 27, 2d, 203, 2e, 204, and 2f. Furthermore, adjacent insulating layers 20 can be integrated to the point where the boundaries between layers are not visually discernible.

[0048] Insulating layers 21-27 and 201-204 are non-magnetic layers. These non-magnetic layers may contain, for example, glass-ceramic materials. As an example, in... Figure 1 In this invention, the thickness of insulating layers 201-204 is greater than the thickness of insulating layers 21-27. The term "thickness" as used in this disclosure refers to the dimension in the vertical direction.

[0049] Insulator layers 2a to 2f are magnetic layers. These magnetic layers may contain, for example, ferrite as a material. As an example, the thickness of the magnetic layers (insulator layers 2a to 2f) is greater than the thickness of the non-magnetic layers (insulator layers 21 to 27).

[0050] In this embodiment, such as Figure 1As shown, the first lead conductors 321 and 322 are disposed on a first plane inside the substrate 2. The first barrier layer 5 is disposed on a second plane inside the substrate 2. The first helical conductor 31 is disposed on a third plane inside the substrate 2. The second helical conductor 41 is disposed on a fourth plane inside the substrate 2. The second barrier layer 6 is disposed on a fifth plane inside the substrate 2. The second lead conductors 421 and 422 are disposed on a sixth plane inside the substrate 2. The first to sixth planes are arranged vertically and are parallel to each other. Furthermore, the term "parallel" in this disclosure is not limited to strict parallelism, but also includes cases where there is an error of approximately a few degrees.

[0051] In this embodiment, first lead conductors 321 and 322 are disposed between insulating layer 21 and insulating layer 22. A first barrier layer 5 is disposed between insulating layer 22 and insulating layer 23. A first helical conductor 31 is disposed between insulating layer 23 and insulating layer 24. A second helical conductor 41 is disposed between insulating layer 24 and insulating layer 25. A second barrier layer 6 is disposed between insulating layer 25 and insulating layer 26. Second lead conductors 421 and 422 are disposed between insulating layer 26 and insulating layer 27.

[0052] (2-3) First helical conductor

[0053] First, the first helical conductor 31 will be described. Viewed from above, the first helical conductor 31 is helical in shape. That is, the first helical conductor 31 is a conductor formed in a helical shape. More specifically, the first helical conductor 31 is a shape formed by winding the conductor multiple times along an elongated circle. The front-to-back length of the area occupied by the first helical conductor 31 is shorter than the left-to-right length of the area occupied by the first helical conductor 31. In the example shown, the first helical conductor 31 has 5 turns, but the number of turns is not particularly limited. Furthermore, the first helical conductor 31 is made of a conductive material such as silver.

[0054] More specifically, such as Figure 2C As shown, the first helical conductor 31 includes: a first turn portion 311, a second turn portion 312, a third turn portion 313, a fourth turn portion 314, and a fifth turn portion 315. The first turn portion 311 is located on the innermost side, and the fifth turn portion 315 is located on the outermost side. That is, the fifth turn portion 315 is the outermost periphery of the first helical conductor 31.

[0055] That is, the first helical conductor 31 has a plurality of first turn portions, which are contained in the outermost periphery 315 of the first helical conductor 31 when viewed from above. Each of the plurality of first turn portions is a shape in which the conductor is wound once along an elongated circle, that is, a portion corresponding to each circumference (each turn) of the first helical conductor 31. In this embodiment, the plurality of first turn portions are portions 311 to 315.

[0056] The first conductor portion 3 also has a through-hole pad 33 electrically connected to through-hole B1 and a through-hole pad 34 electrically connected to through-hole B2. The through-hole pads 33 and 34 are respectively disposed on the third plane inside the body 2, that is, on the same plane as the first helical conductor 31 (the same plane). The through-hole pads 33 and 34 are respectively disposed between the insulating layer 23 and the insulating layer 24. The through-hole pad 33 is disposed on the outer side of the first helical conductor 31, and the through-hole pad 34 is disposed on the inner side of the first helical conductor 31. Viewed from above, the through-hole pads 33 and 34 are each rectangular with rounded corners. The through-hole pads 33 and 34 are made of a conductive material such as silver.

[0057] The first end 316 of the fifth turn portion 315 (outermost periphery) of the first helical conductor 31 is seamlessly connected to the through-hole pad 33. That is, the through-hole pad 33 is a power-carrying through-hole pad that is electrically connected to the through-hole B1 and the first helical conductor 31.

[0058] Similarly, the second end 317 on the side of the first turn portion 311 in the first helical conductor 31 is seamlessly connected to the through-hole pad 34. That is, the through-hole pad 34 is a power-carrying through-hole pad that is electrically connected to the through-hole B2 and the first helical conductor 31.

[0059] (2-4) First lead-out conductor

[0060] Next, the first lead-out conductors 321 and 322 will be described. First lead-out conductor 321 leads the first end 316 of the first helical conductor 31 to the outer surface of the body 2. Similarly, first lead-out conductor 322 leads the second end 317 of the first helical conductor 31 to the outer surface of the body 2. As... Figure 2A As shown, the first lead conductors 321 and 322 are respectively disposed on the outer edge portion of the body 2. In this embodiment, the first lead conductors 321 and 322 are arranged in the left-right direction.

[0061] The first conductor portion 3 also has a through-hole pad 35 electrically connected to through-hole B1 and a through-hole pad 36 electrically connected to through-hole B2. The through-hole pads 35 and 36 are respectively disposed on a first plane inside the body 2, that is, on the same plane as the first lead-out conductors 321 and 322 (the same plane). The through-hole pads 35 and 36 are respectively disposed between the insulating layer 21 and the insulating layer 22. Viewed from above, the through-hole pad 35 is disposed at a position overlapping with the through-hole pad 33, and the through-hole pad 36 is disposed at a position overlapping with the through-hole pad 34. Viewed from above, the through-hole pads 35 and 36 are each rectangular with rounded corners. The through-hole pads 35 and 36 are made of a conductive material such as silver.

[0062] like Figure 2A As shown, viewed from above, the first lead conductor 321 of this embodiment has a rounded rectangular shape. A portion of the lower edge of the first lead conductor 321 is seamlessly connected to the through-hole pad 35. That is, the through-hole pad 35 is a power-carrying through-hole pad that is electrically connected to the through-hole B1 and the first lead conductor 321. From above, the first lead conductor 321 is electrically connected to the portion 315 of the fifth turn (the outermost periphery of the first spiral conductor 31) via the through-hole pad 35, the through-hole B1, and the through-hole pad 33.

[0063] On the other hand, the first lead conductor 322 in this embodiment has a first portion 323 and a second portion 324. Viewed from above, the first portion 323 is a rectangular shape with rounded corners. The second portion 324 extends and protrudes from a portion of the lower edge of the first portion 323, and is seamlessly connected to the through-hole pad 36. That is, the through-hole pad 36 is a power-conducting through-hole pad that is electrically connected to the through-hole B2 and the first lead conductor 322. Thus, the first lead conductor 322 is electrically connected to the portion 311 of the first turn via the through-hole pad 36, the through-hole B2, and the through-hole pad 34.

[0064] In summary, the first lead conductor 321 has a shorter conductive distance from the outermost periphery 315 of the first spiral conductor 31 compared to the first lead conductor 322. That is, the first lead conductor 322 has a longer conductive distance from the outermost periphery 315 of the first spiral conductor 31 compared to the first lead conductor 321.

[0065] (2-5) Second helical conductor

[0066] The second helical conductor 41 will be described. Viewed from above, the second helical conductor 41 is helical in shape. That is, the second helical conductor 41 is a conductor formed in a helical shape. More specifically, the second helical conductor 41 is a shape formed by winding the conductor multiple times along an elongated circle. The front-to-back length of the area occupied by the second helical conductor 41 is shorter than the left-to-right length of the area occupied by the second helical conductor 41. In the example shown, the second helical conductor 41 has 5 turns, but the number of turns is not particularly limited. Furthermore, the second helical conductor 41 is made of a conductive material such as silver.

[0067] More specifically, such as Figure 2D As shown, the second helical conductor 41 includes: a first turn portion 411, a second turn portion 412, a third turn portion 413, a fourth turn portion 414, and a fifth turn portion 415. The first turn portion 411 is located on the innermost side, and the fifth turn portion 415 is located on the outermost side. That is, the fifth turn portion 415 is the outermost periphery of the second helical conductor 41.

[0068] That is, the second helical conductor 41 has a plurality of second-turn portions, which are contained in the outermost periphery 415 of the second helical conductor 41 when viewed from above. Each of the plurality of second-turn portions is a shape in which the conductor is wound once along an elongated circle, that is, a portion corresponding to each circumference (each turn) of the second helical conductor 41 formed into a spiral. In this embodiment, the plurality of second-turn portions are portions 411 to 415.

[0069] like Figure 2D As shown, the second conductor portion 4 also has a through-hole pad 43 electrically connected to through-hole B3 and a through-hole pad 44 electrically connected to through-hole B4. The through-hole pads 43 and 44 are respectively disposed on the fourth plane inside the body 2, that is, on the same plane as the second spiral conductor 41 (the same plane). The through-hole pads 43 and 44 are respectively disposed between the insulating layer 24 and the insulating layer 25. The through-hole pad 43 is disposed on the outer side of the second spiral conductor 41, and the through-hole pad 44 is disposed on the inner side of the second spiral conductor 41. Viewed from above, the through-hole pads 43 and 44 are each rectangular with rounded corners. The through-hole pads 43 and 44 are made of a conductive material such as silver.

[0070] The first end 416 of the fifth turn portion 415 (outermost periphery) of the second helical conductor 41 is seamlessly connected to the through-hole pad 43. The through-hole pad 43 is a power-carrying through-hole pad that is electrically connected to the through-hole B3 and the second helical conductor 41.

[0071] Similarly, the second end 417 on the side of the first turn portion 411 in the second helical conductor 41 is seamlessly connected to the through-hole pad 44. The through-hole pad 44 is a power-carrying through-hole pad that is electrically connected to the through-hole B4 and the second helical conductor 41.

[0072] (2-6) Second lead-out conductor

[0073] Next, the second lead-out conductors 421 and 422 will be described. The second lead-out conductor 421 leads the first end 416 of the second helical conductor 41 to the outer surface of the substrate 2. Similarly, the second lead-out conductor 422 leads the second end 417 of the second helical conductor 41 to the outer surface of the substrate 2. Viewed from above, the second lead-out conductors 421 and 422 are respectively disposed on the outer side of the second helical conductor 41. More specifically, the second lead-out conductors 421 and 422 are respectively disposed on the outer edge portion of the substrate 2. Figure 2F As shown, the second lead conductors 421 and 422 in this embodiment are arranged in the left-right direction.

[0074] The second conductor portion 4 also has a through-hole pad 45 electrically connected to through-hole B3 and a through-hole pad 46 electrically connected to through-hole B4. Through-hole pads 45 and 46 are respectively disposed on the sixth plane inside the body 2, that is, on the same plane as the second lead conductors 421 and 422 (the same plane). Through-hole pads 45 and 46 are respectively disposed between insulating layer 26 and insulating layer 27. Viewed from above, through-hole pad 45 is disposed at a position overlapping with through-hole pad 43, and through-hole pad 46 is disposed at a position overlapping with through-hole pad 44. Viewed from above, the shapes of through-hole pads 45 and 46 are both rectangular with rounded corners. Through-hole pads 45 and 46 are made of a conductive material such as silver.

[0075] like Figure 2F As shown, viewed from above, the second lead conductor 421 of this embodiment is a rectangular shape with rounded corners. A portion of the upper edge of the second lead conductor 421 is seamlessly connected to the through-hole pad 45. The through-hole pad 45 is a power-carrying through-hole pad that is electrically connected to the through-hole B3 and the second lead conductor 421. From above, the second lead conductor 421 is electrically connected to the portion 415 of the fifth turn (the outermost periphery of the second spiral conductor 41) via the through-hole pad 45, the through-hole B3, and the through-hole pad 43.

[0076] On the other hand, the second lead conductor 422 in this embodiment has a first portion 423 and a second portion 424. Viewed from above, the first portion 423 is a rectangular shape with rounded corners. The second portion 424 extends and protrudes from a portion of the upper edge of the first portion 423 and is seamlessly connected to the through-hole pad 46. That is, the through-hole pad 46 is a power-carrying through-hole pad that is electrically connected to the through-hole B4 and the second lead conductor 422. From this, the second lead conductor 422 is electrically connected to the portion 411 of the first turn via the through-hole pad 46, the through-hole B4, and the through-hole pad 44.

[0077] In summary, compared to the second lead conductor 422, the second lead conductor 421 has a shorter conductive distance from the outermost periphery 415 of the second spiral conductor 41. That is, compared to the second lead conductor 421, the second lead conductor 422 has a longer conductive distance from the outermost periphery 415 of the second spiral conductor 41.

[0078] (2-7) Through hole

[0079] Through holes B1, B2, B3, and B4 each have lengths in the vertical direction. The shape of each through hole B1, B2, B3, and B4 is a cylinder with the vertical direction as its axis.

[0080] like Figure 1 As shown, through-hole B1 electrically connects through-hole pad 33 and through-hole pad 35. That is, through-hole B1 electrically connects the first helical conductor 31 and the first lead conductor 321 via through-hole pad 33 and through-hole pad 35. Here, an insulating layer 23 is disposed between the first helical conductor 31 and the first lead conductor 321. Figure 2B As shown, through hole B1 passes through the insulating layer 23 and electrically connects the first spiral conductor 31 and the first lead conductor 321 via through hole pad 33 and through hole pad 35.

[0081] Similarly, as Figure 1 As shown, through-hole B2 electrically connects through-hole pad 34 and through-hole pad 36. That is, through-hole B2 electrically connects the first spiral conductor 31 and the first lead conductor 322 via through-hole pad 34 and through-hole pad 36. Here, an insulating layer 23 is disposed between the first spiral conductor 31 and the first lead conductor 322. Figure 2B As shown, through hole B2 passes through the insulating layer 23 and connects the first spiral conductor 31 and the first lead conductor 322 via through hole pad 34 and through hole pad 36.

[0082] Furthermore, such as Figure 1 As shown, through-hole B3 electrically connects through-hole pad 43 and through-hole pad 45. That is, through-hole B3 electrically connects the second helical conductor 41 and the second lead conductor 421 via through-hole pad 43 and through-hole pad 45. Here, an insulating layer 26 is disposed between the second helical conductor 41 and the second lead conductor 421. Figure 2E As shown, through hole B3 passes through the insulating layer 26 and electrically connects the second spiral conductor 41 and the second lead conductor 421 via through hole pad 43 and through hole pad 45.

[0083] Similarly, as Figure 1As shown, through-hole B4 electrically connects through-hole pad 44 and through-hole pad 46. That is, through-hole B4 electrically connects the second helical conductor 41 and the second lead conductor 422 via through-hole pad 44 and through-hole pad 46. Here, an insulating layer 26 is disposed between the second helical conductor 41 and the second lead conductor 422. Figure 2E As shown, through hole B4 passes through the insulating layer 26 and electrically connects the second spiral conductor 41 and the second lead conductor 422 via through hole pad 44 and through hole pad 46.

[0084] (2-8) First barrier layer

[0085] The first barrier layer 5 is disposed between the insulating layer 22 and the insulating layer 23. That is, the first barrier layer 5 is disposed between the first helical conductor 31 and the first lead conductors 321 and 322 in the vertical direction. Figure 2B As shown, when viewed from above and below, the first barrier layer 5 of this embodiment is L-shaped.

[0086] like Figure 3 As shown, the first barrier layer 5 is disposed between the first helical conductor 31 and the first lead-out conductors 321 and 322 in the vertical direction, at the position where the first lead-out conductors 321 and 322 overlap with the outermost periphery 315 of the first helical conductor 31. Assuming a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, cracks or fissures may occur between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322, which has a longer conductive distance from the outermost periphery 315. Even in such a case, according to the above structure, the aforementioned cracks or fissures can be prevented from connecting to both the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322. That is, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 has the effect of suppressing the electrical connection between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of suppressing the reduction in tolerance to high voltage.

[0087] In this embodiment, the first barrier layer 5 is configured to include positions where portions 311, 312, 313, 314, and 315 of the first lead conductor 32 and the first spiral conductor 31 overlap when viewed from above. That is, in this embodiment, the first barrier layer 5 is configured to include positions where the aforementioned plurality of first turns of the first lead conductor 322 and the first spiral conductor 31 overlap when viewed from above. Assuming that a high voltage is applied to the first spiral conductor 31 and the first lead conductors 321 and 322, for example, cracks or fissures may occur between portion 314 of the first spiral conductor 31 and the first lead conductor 322 (which has a longer conductive distance from the outermost periphery 315) (i.e., obliquely). Even in such a case, according to the above structure, the aforementioned cracks or fissures can be prevented from connecting to both portions 314 of the first spiral conductor 31 and the first lead conductor 322. That is, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 can further suppress the electrical connection of portions 314 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. Similarly, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 can further suppress the electrical connection of portions 311, 312, 313 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of further suppressing the reduction in tolerance to high voltage.

[0088] The first barrier layer 5 is made of a material having a greater tensile strength than the base material 2. For example, the insulating layers 21-27 and 201-204 contain glass ceramic as a material, therefore the first barrier layer 5 is made of a material having a greater tensile strength than glass ceramic. Specifically, the first barrier layer 5 is made of a metallic material or a resin material. In this embodiment, the first barrier layer 5 is made of a conductive material such as silver, which is the same material as the first helical conductor 31 and the first lead conductor 32. Furthermore, the term "tensile strength" as used in this disclosure refers to the degree of resistance to fracture, that is, the degree to which fracture is difficult to occur. In other words, the greater the tensile strength, the more difficult it is to fracture, that is, the lower the probability of fracture.

[0089] Thus, in the common-mode noise filter 1, the first blocking layer 5 is made of a material with a greater breaking strength than the base material 2. Consequently, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 effectively suppresses electrical connections between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of easily suppressing the reduction in tolerance to high voltages.

[0090] like Figure 4 As shown, the distance between the first lead-out conductor 322 and the first barrier layer 5 in the vertical direction, i.e., the first distance D1, and the distance between the first barrier layer 5 and the first spiral conductor 31 in the vertical direction, i.e., the second distance D2, are the same. More specifically, the first distance D1 is the distance between the lower surface of the first lead-out conductor 322 and the upper surface of the first barrier layer 5 in the vertical direction. Similarly, the second distance D2 is more specifically the distance between the lower surface of the first barrier layer 5 and the upper surface of the outermost periphery 315 of the first spiral conductor 31 in the vertical direction. In summary, the thickness of the insulating layer 22 is the same as the thickness of the insulating layer 23, and the first barrier layer 5 is disposed at the center of the first spiral conductor 31 and the first lead-out conductor 322 in the vertical direction. Furthermore, the term "same" in this disclosure is not limited to a completely identical state, but also includes situations where there are no practical problems. For example, this disclosure may be applied if the difference between two distances is less than 5% of the value of either one.

[0091] According to the above structure, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 more easily suppresses the electrical connection between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of more easily suppressing the reduction in tolerance to high voltage.

[0092] (2-9) Second barrier layer

[0093] The second barrier layer 6 is disposed between the insulating layer 25 and the insulating layer 26. That is, the second barrier layer 6 is disposed between the second helical conductor 41 and the second lead conductor 422 in the vertical direction. Figure 2E As shown, when viewed from above and below, the second barrier layer 6 of this embodiment has an L-shaped shape.

[0094] The second barrier layer 6 is disposed between the second spiral conductor 41 and the second lead conductor 422 in the vertical direction. When viewed from the vertical direction, the outermost periphery 415 of the second lead conductor 422 and the second spiral conductor 41 (see reference) Figure 2D The overlapping positions of the two leads are considered. Suppose that a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, and a crack or fissure occurs between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422, which has a longer conductive distance from the outermost periphery 415. Even in such a case, according to the above structure, the connection between the aforementioned crack or fissure and both sides of the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 can be suppressed. That is, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 has the effect of suppressing the electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 via the side of the crack or fissure. In summary, the common-mode noise filter 1 of this embodiment has the advantage of suppressing the reduction in tolerance to high voltage.

[0095] In this embodiment, the second barrier layer 6 is configured to include positions where portions 411, 412, 413, 414, and 415 of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above. That is, in this embodiment, the second barrier layer 6 is configured to include positions where the aforementioned plurality of second-turn portions of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above. When a high voltage is applied to the second spiral conductor 41 and the second lead conductors 421 and 422, for example, suppose that a crack or fissure occurs between portion 414 of the second spiral conductor 41 and the second lead conductor 422 (which has a longer conductive distance from the outermost periphery 415) (i.e., obliquely). Even in such a case, according to the above structure, it is possible to further suppress the aforementioned crack or fissure from connecting to both portions 414 of the second spiral conductor 41 and the second lead conductor 422. That is, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 has the effect of further suppressing the electrical connection of portions 414 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. Similarly, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 has the effect of further suppressing the electrical connection of portions 411, 412, 413 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of further suppressing the reduction in tolerance to high voltage.

[0096] The second barrier layer 6 is made of a material having a greater tensile strength than the base material 2. For example, the insulating layers 21-27 and 201-204 contain glass ceramic as a material, therefore the second barrier layer 6 is made of a material having a greater tensile strength than glass ceramic. Specifically, the second barrier layer 6 is made of a metallic material or a resin material. In this embodiment, the second barrier layer 6 is made of a conductive material such as silver, which is the same material as the second helical conductor 41 and the second lead conductor 42.

[0097] Thus, in the common-mode noise filter 1, the second blocking layer 6 is made of a material with a greater breaking strength than the base material 2. Consequently, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 effectively suppresses electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of easily suppressing the reduction in tolerance to high voltages.

[0098] like Figure 5 As shown, the distance between the second helical conductor 41 and the second barrier layer 6 in the vertical direction, i.e., the third distance D3, and the distance between the second barrier layer 6 and the second lead conductor 422 in the vertical direction, i.e., the fourth distance D4, are the same. More specifically, the third distance D3 is the distance between the lower surface of the outermost periphery 415 of the second helical conductor 41 and the upper surface of the second barrier layer 6 in the vertical direction. Similarly, the fourth distance D4 is more specifically the distance between the lower surface of the second barrier layer 6 and the upper surface of the second lead conductor 422 in the vertical direction. In summary, the thickness of the insulating layer 25 is the same as the thickness of the insulating layer 26, and the second barrier layer 6 is disposed at the center of the second helical conductor 41 and the second lead conductor 422 in the vertical direction.

[0099] According to the above structure, when a high voltage is applied to the second helical conductor 41 and the second lead conductors 421 and 422, the common-mode noise filter 1 more easily suppresses the electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of more easily suppressing the reduction in tolerance to high voltage.

[0100] (2-10) Magnetic components

[0101] A magnetic component 7 is provided in the central portion of the first helical conductor 31 and the second helical conductor 41. For example... Figure 1 As shown, the magnetic component 7 of this embodiment is cylindrical with the vertical direction as its axial direction. The magnetic component 7 is made of magnetic materials such as ferrite. Therefore, the magnetic component 7 is also called a ferrite through-hole.

[0102] A magnetic component 7 is provided in the central portion of the first helical conductor 31 and the second helical conductor 41, thereby improving the performance of the common-mode noise filter 1 in attenuating common-mode noise components.

[0103] In this embodiment, the upper end of the magnetic component 7 is connected to the insulating layer 2c, and the lower end of the magnetic component 7 is connected to the insulating layer 2d.

[0104] (3) Effects

[0105] In the common-mode noise filter 1 of this embodiment, a first blocking layer 5 is disposed between a first helical conductor 31 and a first lead-out conductor 322 in the vertical direction, at a position where the first lead-out conductor 322 overlaps with the outermost periphery 315 of the first helical conductor 31 when viewed from the vertical direction. Furthermore, a second blocking layer 6 is disposed between a second helical conductor 41 and a second lead-out conductor 422 in the vertical direction, at a position where the second lead-out conductor 422 overlaps with the outermost periphery 415 of the second helical conductor 41 when viewed from the vertical direction.

[0106] Therefore, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 can suppress the electrical connection between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. Similarly, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 can suppress the electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of suppressing the reduction in tolerance to high voltage.

[0107] Furthermore, in the common-mode noise filter 1 of this embodiment, the first helical conductor 31 has a plurality of first turn portions, which are included in the outermost periphery 315 of the first helical conductor 31 when viewed from above. The first barrier layer 5 is configured to include the position where the aforementioned plurality of first turn portions of the first lead conductor 322 and the first helical conductor 31 overlap when viewed from above. Furthermore, the second helical conductor 41 has a plurality of second turn portions, which are included in the outermost periphery 415 of the second helical conductor 41 when viewed from above. The second barrier layer 6 is configured to include the position where the aforementioned plurality of second turn portions of the second lead conductor 422 and the second helical conductor 41 overlap when viewed from above.

[0108] Therefore, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 can further suppress the electrical connection of the portions 311, 312, 313, and 314 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. Similarly, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 can further suppress the electrical connection of the portions 411, 412, 413, and 414 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of further suppressing the reduction in tolerance to high voltage.

[0109] Furthermore, in the common-mode noise filter 1 of this embodiment, the distance between the first lead-out conductor 322 and the first blocking layer 5 in the vertical direction, i.e., the first distance D1, and the distance between the first blocking layer 5 and the first spiral conductor 31 in the vertical direction, i.e., the second distance D2, are the same. Furthermore, the distance between the second spiral conductor 41 and the second blocking layer 6 in the vertical direction, i.e., the third distance D3, and the distance between the second blocking layer 6 and the second lead-out conductor 422 in the vertical direction, i.e., the fourth distance D4, are the same.

[0110] Therefore, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 more easily suppresses electrical connection between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. Similarly, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 more easily suppresses electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of more easily suppressing the reduction in tolerance to high voltage.

[0111] Furthermore, in the common-mode noise filter 1 of this embodiment, the first blocking layer 5 and the second blocking layer 6 are respectively made of materials having a greater fracture strength than the base material 2.

[0112] Therefore, when a high voltage is applied to the first helical conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1 effectively suppresses electrical connection between the outermost periphery 315 of the first helical conductor 31 and the first lead-out conductor 322 via cracks or fissures. Similarly, when a high voltage is applied to the second helical conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1 effectively suppresses electrical connection between the outermost periphery 415 of the second helical conductor 41 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1 of this embodiment has the advantage of easily suppressing the reduction in tolerance to high voltage.

[0113] (4) Variations

[0114] The above-described embodiments are merely one of the various embodiments of this disclosure. Various modifications can be made to the above-described embodiments based on design, etc., as long as they achieve the purpose of this disclosure. The following variations can also be implemented through appropriate combinations. Structures identical to those in the above embodiments are labeled with the same reference numerals, and descriptions are omitted.

[0115] (4-1) First variation

[0116] First, refer to Figure 6A as well as Figure 6B The common-mode noise filter 1A involved in the first modified example will be described. Figure 6A This is a top view of the first blocking layer 5A in the common-mode noise filter 1A of the first modified example. Figure 6B This is a top view of the second blocking layer 6A in the common-mode noise filter 1A of the first modified example.

[0117] In the common-mode noise filter 1 of the above-described embodiment, when viewed from above, the first blocking layer 5 and the second blocking layer 6 are each L-shaped. However, as... Figure 6A as well as Figure 6B As shown, in the common-mode noise filter 1A of the first modified example, viewed from the top and bottom, the shape of the first blocking layer 5A is along the first lead conductor 322 (refer to...). Figure 2A The second barrier layer 6A is shaped like a curved line along the second lead conductor 422 (see reference). Figure 2F The first barrier layer 5A is shaped like a curved line. More specifically, viewed from above, the first barrier layer 5A is shaped like the second portion 324 along the first lead-out conductor 322 (see reference). Figure 2A The second barrier layer 6A is shaped like a curved line, and its shape is along the second portion 424 of the second lead conductor 422 (see reference). Figure 2F (A curved shape)

[0118] Based on the above structure, compared with the first barrier layer 5 of the embodiment, the area of ​​the first barrier layer 5A can be reduced. Furthermore, when a high voltage is applied to the first spiral conductor 31 and the first lead-out conductors 321 and 322, the common-mode noise filter 1A of the first modified example further suppresses electrical connections between the portions 311, 312, 313, 314 of the first spiral conductor 31 and the outermost periphery 315 and the first lead-out conductor 322 via cracks or fissures. Similarly, compared with the second barrier layer 6 of the embodiment, the area of ​​the second barrier layer 6A can be reduced. Furthermore, when a high voltage is applied to the second spiral conductor 41 and the second lead-out conductors 421 and 422, the common-mode noise filter 1A of the first modified example further suppresses electrical connections between the portions 411, 412, 413, 414 of the second spiral conductor 41 and the outermost periphery 415 and the second lead-out conductor 422 via cracks or fissures. In summary, the common-mode noise filter 1A of the first modified example has the following advantages: it can reduce the area of ​​the first blocking layer 5A and the second blocking layer 6A, while further suppressing the reduction in tolerance to high voltage.

[0119] (4-2) Second variation

[0120] Next, refer to Figure 7A as well as Figure 7B The common-mode noise filter 1B involved in the second variation will be explained. Figure 7A This is a top view of the first blocking layer 5B in the common-mode noise filter 1B of the second variant. Figure 7B This is a top view of the second blocking layer 6B in the common-mode noise filter 1B of the second variant.

[0121] In the common-mode noise filter 1 of the above-described embodiment, when viewed from above, the first blocking layer 5 and the second blocking layer 6 are each L-shaped. However, as... Figure 7A as well as Figure 7B As shown, in the common-mode noise filter 1B of the second modified example, when viewed from the top and bottom, the first blocking layer 5B and the second blocking layer 6B are each rectangular in shape.

[0122] According to the above structure, it has the advantage that the first barrier layer 5B and the second barrier layer 6B are each easy to install.

[0123] (4-3) Other variations

[0124] The following are other variations of the above embodiments. These variations can also be implemented through appropriate combinations.

[0125] In the above embodiment, the first barrier layer 5 is disposed at a position where the portions 311, 312, 313, 314, and 315 of the first lead conductor 32 and the first spiral conductor 31 overlap when viewed from above. However, the first barrier layer 5 may not be disposed at a position where the portions 311, 312, 313, and 314 of the first lead conductor 32 and the first spiral conductor 31 overlap when viewed from above. That is, the first barrier layer 5 only needs to be disposed at a position where at least a portion 315 (outermost periphery 315) of the first lead conductors 321 and 322 and the first spiral conductor 31 overlap when viewed from above. As an example, the first barrier layer 5 may also be disposed at a position where the portions 314 and 315 of the first lead conductor 32 and the first spiral conductor 31 overlap when viewed from above. In other words, the first barrier layer 5 may not be disposed at a position where the portions 311, 312, and 313 of the first lead conductor 32 and the first spiral conductor 31 overlap when viewed from above.

[0126] Similarly, in the above embodiment, the second barrier layer 6 is disposed at a position where the portions 411, 412, 413, 414, and 415 of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above. However, the second barrier layer 6 may not be disposed at a position where the portions 411, 412, 413, and 414 of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above. That is, the second barrier layer 6 only needs to be disposed at a position where at least a portion 415 (outermost periphery 415) of the second lead conductor 422 and the second spiral conductor 41 overlaps when viewed from above. As an example, the second barrier layer 6 may also be disposed at a position where the portions 414 and 415 of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above. In other words, it may not be disposed at a position where the portions 411, 412, and 413 of the second lead conductor 422 and the second spiral conductor 41 overlap when viewed from above.

[0127] In the above embodiment, when viewed from the top and bottom, the first barrier layer 5 and the second barrier layer 6 are each L-shaped. However, the shape of the first barrier layer 5 is not limited as long as it is positioned where at least a portion 315 (outermost periphery 315) of the first lead conductors 321 and 322 and the first spiral conductor 31 overlaps when viewed from the top and bottom. Similarly, the shape of the second barrier layer 6 is not limited as long as it is positioned where at least a portion 415 (outermost periphery 415) of the second lead conductor 422 and the second spiral conductor 41 overlaps when viewed from the top and bottom.

[0128] The following are other variations related to the positions of the first barrier layer 5 and the second barrier layer 6.

[0129] First, refer to Figure 8 The common-mode noise filter 1C involved in other variations will be described. Figure 8 The common-mode noise filter 1C, which relates to other variations, is a main partial cross-sectional view of the first blocking layer 5C being positioned closer to the first lead-out conductor 322 than the first helical conductor 31.

[0130] In the above-described embodiments, such as Figure 4 As shown, the distance between the first lead-out conductor 322 and the first blocking layer 5 in the vertical direction, i.e., the first distance D1, and the distance between the first blocking layer 5 and the first spiral conductor 31 in the vertical direction, i.e., the second distance D2, are the same. However, as Figure 8 As shown, in the common-mode noise filter 1C, the distance between the first lead conductor 322 in the vertical direction and the first blocking layer 5C, i.e., the fifth distance D5, can also be smaller than the distance between the first blocking layer 5C in the vertical direction and the first spiral conductor 31, i.e., the sixth distance D6.

[0131] In summary, in the above-described implementation methods, such as Figure 4 As shown, the thickness of insulating layer 22 is the same as the thickness of insulating layer 23, and the first barrier layer 5 is disposed in the vertical direction at the center of the first spiral conductor 31 and the first lead conductor 322. However, as... Figure 8 As shown, the thickness of the insulating layer 22C may be smaller than that of the insulating layer 23C, and the first barrier layer 5C may be positioned in the vertical direction closer to the first lead-out conductor 322 than the first spiral conductor 31.

[0132] Similarly, in the above-described embodiments, such as Figure 5 As shown, the thickness of the insulating layer 25 is the same as the thickness of the insulating layer 26, and the second barrier layer 6 is disposed in the center of the second spiral conductor 41 and the second lead conductor 422 in the vertical direction. However, it is also possible that the second barrier layer 6 is disposed in the vertical direction closer to the second lead conductor 422 than the second spiral conductor 41.

[0133] Next, refer to Figure 9 The common-mode noise filter 1D involved in other variations will be explained. Figure 9 The common-mode noise filter 1D, which relates to other variations, is a main partial cross-sectional view of the first blocking layer 5D positioned closer to the first spiral conductor 31 than the first lead conductor 322.

[0134] In the above implementation methods, such as Figure 4As shown, the distance between the first lead-out conductor 322 and the first blocking layer 5 in the vertical direction, i.e., the first distance D1, and the distance between the first blocking layer 5 and the first spiral conductor 31 in the vertical direction, i.e., the second distance D2, are the same. However, as Figure 9 As shown, in the common-mode noise filter 1D, the distance between the first lead conductor 322 in the vertical direction and the first blocking layer 5D, i.e., the seventh distance D7, can also be greater than the distance between the first blocking layer 5D in the vertical direction and the first spiral conductor 31, i.e., the eighth distance D8.

[0135] In summary, in the above embodiments, the thickness of the insulating layer 22 is the same as the thickness of the insulating layer 23, and the first barrier layer 5 is disposed in the vertical direction at the center of the first spiral conductor 31 and the first lead conductor 322. However, as... Figure 9 As shown, the thickness of the insulating layer 22D can also be greater than the thickness of the insulating layer 23D, and the first barrier layer 5D can be positioned in the vertical direction closer to the first spiral conductor 31 than the first lead conductor 322.

[0136] Similarly, in the above-described embodiments, such as Figure 5 As shown, the thickness of the insulating layer 25 is the same as the thickness of the insulating layer 26, and the second barrier layer 6 is disposed in the center of the second spiral conductor 41 and the second lead conductor 422 in the vertical direction. However, it is also possible that the second barrier layer 6 is disposed in the vertical direction closer to the second spiral conductor 41 than the second lead conductor 422.

[0137] In the above embodiments, the first helical conductor 31 and the second helical conductor 41 are respectively shaped by winding the conductor multiple times along an elongated circle. However, the first helical conductor 31 and the second helical conductor 41 can also be shaped by winding the conductor multiple times along a circle or a rectangle.

[0138] In the above embodiment, viewed from the top and bottom, the first lead conductor 321 is a rectangular shape with rounded corners. However, the first lead conductor 321 is not limited to the shape of the embodiment described above, as long as it can lead the first end 316 of the first helical conductor 31 to the outer surface of the body 2. Similarly, the first lead conductor 322 is not limited to the shape of the embodiment described above, as long as it can lead the second end 317 of the first helical conductor 31 to the outer surface of the body 2.

[0139] In the above embodiment, viewed from the top and bottom, the second lead conductor 421 is a rectangular shape with rounded corners. However, the second lead conductor 421 is not limited to the shape of the embodiment described above, as long as it can lead the first end 416 of the second helical conductor 41 to the outer surface of the body 2. Similarly, the second lead conductor 422 is not limited to the shape of the embodiment described above, as long as it can lead the second end 417 of the second helical conductor 41 to the outer surface of the body 2.

[0140] In the above embodiment, through-hole B1 electrically connects the first spiral conductor 31 and the first lead conductor 321 via through-hole pads 33 and 35. However, through-hole B1 may also electrically connect the first spiral conductor 31 and the first lead conductor 321 without via through-hole pads 33 and 35. Similarly, through-hole B2 may also electrically connect the first spiral conductor 31 and the first lead conductor 322 without via through-hole pads 34 and 36. That is, the first conductor portion 3 may not have through-hole pads 33, 34, 35, and 36.

[0141] Furthermore, in the above embodiment, through-hole B3 electrically connects the second spiral conductor 41 and the second lead conductor 421 via through-hole pads 43 and 45. However, through-hole B3 may also electrically connect the second spiral conductor 41 and the second lead conductor 421 without via through-hole pads 43 and 45. Similarly, through-hole B4 may also electrically connect the second spiral conductor 41 and the second lead conductor 422 without via through-hole pads 44 and 46. That is, the second conductor portion 4 may not have through-hole pads 43, 44, 45, and 46.

[0142] In the above embodiments, the common-mode noise filter 1 includes a magnetic component 5, but it may not include it.

[0143] In the above embodiments, the common-mode noise filter 1 is a cuboid with the vertical direction as the axis, but it can also be a cylinder, a pyramid, or a frustum with the vertical direction as the axis.

[0144] (Summarize)

[0145] The common-mode noise filter (1, 1A-1D) of the first type comprises: a base body (2), a first conductor portion (3) and a second conductor portion (4), a first blocking layer (5, 5A-5D) and a second blocking layer (6, 6A, 6B). The first conductor portion (3) and the second conductor portion (4) are disposed inside the base body (2) and arranged in the vertical direction. The first blocking layer (5, 5A-5D) is disposed inside the base body (2) and is electrically insulated from the first conductor portion (3). The second blocking layer (6, 6A, 6B) is disposed inside the base body (2) and is electrically insulated from the second conductor portion (4). The first conductor portion (3) has a first helical conductor (31) and a first lead-out conductor (32). The first helical conductor (31) extends in a helical shape. The first lead-out conductor (32) is disposed in a plane different from the first helical conductor (31) in the vertical direction, and leads the two ends of the first helical conductor (31) to the outer surface of the base body (2). The second conductor section (4) has a second spiral conductor (41) and a second lead-out conductor (42). The second spiral conductor (41) extends in a spiral shape. The second lead-out conductor (42) is disposed in a plane different from the second spiral conductor (41) in the vertical direction, and leads both ends of the second spiral conductor (41) to the outer surface of the body (2). The first barrier layer (5, 5A to 5D) is disposed between the first spiral conductor (31) and the first lead-out conductor (32) in the vertical direction, at a position where the outermost periphery (315) of the first lead-out conductor (32) and the first spiral conductor (31) overlap when viewed from the vertical direction. The second barrier layer (6, 6A, 6B) is disposed between the second spiral conductor (41) and the second lead-out conductor (42) in the vertical direction, at a position where the outermost periphery (415) of the second lead-out conductor (42) and the second spiral conductor (41) overlap when viewed from the vertical direction.

[0146] According to this method, it has the advantage of being able to suppress the decrease in tolerance to high voltage.

[0147] In the second type of common-mode noise filter (1, 1A-1D), in the first type, the first helical conductor (31) has a plurality of first turn portions, which are contained in the outermost periphery (315) of the first helical conductor (31) when viewed from above. The first barrier layer (5, 5A-5D) is configured to include the position where the plurality of first turn portions of the first lead conductor (32) and the first helical conductor (31) overlap when viewed from above. The second helical conductor (41) has a plurality of second turn portions, which are contained in the outermost periphery (415) of the second helical conductor (41) when viewed from above. The second barrier layer (6, 6A, 6B) is configured to include the position where the plurality of second turn portions of the second lead conductor (42) and the second helical conductor (41) overlap when viewed from above.

[0148] According to this method, it has the advantage of being able to further suppress the decrease in tolerance to high voltage.

[0149] In the third-party common-mode noise filter (1, 1A, 1B), in either the first or second configuration, the first distance (D1) and the second distance (D2) are the same. The first distance (D1) is the distance between the first lead-out conductor (32) and the first blocking layer (5, 5A, 5B) in the vertical direction. The second distance (D2) is the distance between the first blocking layer (5, 5A, 5B) and the first helical conductor (31) in the vertical direction. The third distance (D3) and the fourth distance (D4) are the same. The third distance (D3) is the distance between the second helical conductor (41) and the second blocking layer (6, 6A, 6B) in the vertical direction. The fourth distance (D4) is the distance between the second blocking layer (6, 6A, 6B) and the second lead-out conductor (42) in the vertical direction.

[0150] According to this method, it has the advantage of making it easier to suppress the decrease in tolerance to high voltage.

[0151] In the common-mode noise filter (1, 1A to 1D) of the fourth type, in any of the first to third types, the first blocking layer (5, 5A, 5B) and the second blocking layer (6, 6A, 6B) are respectively made of materials with greater fracture strength than the base body (2).

[0152] According to this method, it has the advantage of making it easier to suppress the decrease in tolerance to high voltage.

[0153] -Explanation of Figure Markers-

[0154] 1. 1A~1D Common Mode Noise Filter

[0155] 2 body

[0156] 3 First Conductor Section

[0157] 31 First Helical Conductor

[0158] 315 outermost periphery

[0159] 32 First lead conductor

[0160] 4 Second conductor section

[0161] 41 Second Helical Conductor

[0162] 42 Second lead conductor

[0163] 5. 5A~5D First Barrier Layer

[0164] 6, 6A, 6B Second Barrier Layer

[0165] D1 First Distance

[0166] D2 Second Distance

[0167] D3 Third Distance

[0168] D4 is the fourth distance.

Claims

1. A common-mode noise filter, comprising: body; The first conductor portion and the second conductor portion are disposed inside the body and arranged in the vertical direction; A first barrier layer is disposed inside the body and is electrically insulated from the first conductor portion; and The second barrier layer is disposed inside the body and is electrically insulated from the second conductor portion. The first conductor portion has: The first helical conductor extends in a spiral shape; and A first lead-out conductor is disposed in a plane different from the first helical conductor in the vertical direction, and the two ends of the first helical conductor are respectively led out to the outer surface of the body. The second conductor portion has: The second helical conductor extends in a spiral shape; and The second lead-out conductor is disposed in a plane different from the second helical conductor in the vertical direction, and leads both ends of the second helical conductor to the outer surface of the body. The first barrier layer is disposed between the first helical conductor and the first lead conductor in the vertical direction, at the position where the outermost circumferences of the first lead conductor and the first helical conductor overlap when viewed from the vertical direction. The second barrier layer is disposed between the second spiral conductor and the second lead conductor in the vertical direction, at the position where the outermost peripheries of the second lead conductor and the second spiral conductor overlap when viewed from the vertical direction.

2. The common-mode noise filter according to claim 1, wherein, The first helical conductor has a plurality of first turn portions, said plurality of first turn portions being contained in the outermost periphery of the first helical conductor as viewed from above in the above and below directions. The first barrier layer is configured to include the locations where the plurality of first turn portions of the first lead conductor and the first helical conductor overlap when viewed from the vertical direction. The second helical conductor has a plurality of second turn portions, said plurality of second turn portions being contained in the outermost periphery of the second helical conductor as viewed from the top and bottom directions. The second barrier layer is configured to include the locations where the plurality of second turns in the second lead conductor and the second helical conductor overlap when viewed from the above and below directions.

3. The common-mode noise filter according to claim 1 or 2, wherein, The distance between the first lead-out conductor and the first blocking layer in the vertical direction, i.e., the first distance, and the distance between the first blocking layer and the first spiral conductor in the vertical direction, i.e., the second distance, are the same. The distance between the second spiral conductor and the second blocking layer in the vertical direction, i.e., the third distance, is the same as the distance between the second blocking layer and the second lead conductor in the vertical direction, i.e., the fourth distance.

4. The common-mode noise filter according to claim 1 or 2, wherein, The first barrier layer and the second barrier layer are each made of a material having a greater fracture strength than the base material.

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