Method of manufacturing multilayer electronic components and unit sheets

Abstract

According to one embodiment of the present invention, a multilayer electronic component includes a first external electrode, a second external electrode, and a plurality of unit sheets disposed between the first external electrode and the second external electrode, wherein each of the unit sheets includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, and the thickness ratio of the nickel (Ni) electrode layer to the barium titanate (BaTiO3) dielectric layer is 1:1 to 1:300.

Description

Technical Field

[0001] One embodiment of the present invention relates to a multilayer electronic component and a method for manufacturing a unit sheet for the electronic component. Background Technology

[0002] Semiconductor packaging is used in various fields such as vehicles, communications, and computers, and typically includes a printed circuit board (PCB), a semiconductor chip mounted on the PCB, and electronic components mounted on the PCB. Electronic components may include, for example, resistors, inductors, and capacitors. A capacitor is a device that stores and supplies electrical energy and allows a constant current to flow by blocking DC current and allowing only AC current to flow. Capacitors can also be called energy storage devices or capacitors. With advancements in semiconductor packaging, the demand for ultra-miniature capacitors with high performance and high reliability is increasing. The basic structure of a capacitor has two electrode plates facing each other parallel to each other with a dielectric material sandwiched between them. The amount of charge accumulated can vary depending on the spacing and area of ​​the electrode plates, the material of the dielectric, etc.

[0003] Multilayer ceramic capacitors (MLCCs) are ceramic capacitors that utilize ceramic-based dielectrics. They have multiple electrode layers and multiple dielectric layers stacked together, and the capacitance of MLCCs can increase with the increase of the number of stacked layers.

[0004] The cell sheet included in an MLCC comprises internal electrodes and a dielectric layer. Currently, manufacturing a cell sheet requires a complex process, thus incurring significant time and cost. Specifically, it necessitates the following multi-step process: first, preparing barium titanate ceramic powder as the main material; then adding additives, preparing a slurry, casting the dielectric layer, and printing the internal electrode layer.

[0005] Furthermore, the performance of MLCCs may degrade due to the high-temperature sintering process. For example, oxygen vacancies are formed during high-temperature sintering in a reducing atmosphere, and the capacitor coverage may decrease due to the physical differences between the dielectric layer and the electrode layer (Ni). Additionally, the performance of MLCCs may degrade due to degradation caused by external electric fields or Joule heating.

[0006] Therefore, there is a need to develop a method for manufacturing unit sheets that can prevent MLCC performance degradation caused by deterioration during high-temperature sintering processes, enable thinner internal electrodes, and shorten the manufacturing process to reduce costs and time. Summary of the Invention

[0007] [Technical Issues]

[0008] The technical problem that this invention aims to solve is to provide a small and high-capacity multilayer electronic component.

[0009] The technical problem to be solved by the present invention is to provide a method for manufacturing a unit sheet including a dielectric layer and internal electrodes using an alloy plating process.

[0010] The technical problem to be solved by the present invention is to provide a method for manufacturing multilayer ceramic capacitor (MLCC) cell sheets, which can reduce costs and time by shortening the manufacturing process and prevent performance degradation caused by high-temperature sintering.

[0011] [Technical Solution]

[0012] According to one embodiment of the present invention, a multilayer electronic component includes a first external electrode, a second external electrode, and a plurality of unit sheets disposed between the first external electrode and the second external electrode, wherein each of the unit sheets includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, and the nickel (Ni) electrode layer and the barium titanate (BaTiO3) dielectric layer have a thickness ratio in the range of 1:1 to 1:300.

[0013] The nickel (Ni) electrode layer may have a thickness ranging from 0.1 μm to 3 μm, and the barium titanate (BaTiO3) dielectric layer may have a thickness ranging from 3 μm to 30 μm.

[0014] The nickel (Ni) electrode layer can have a thickness ranging from 0.1 μm to 3 μm.

[0015] The nickel (Ni) electrode layer may have a porosity of 1% or lower.

[0016] The unit sheet can have 2 to 500 layers.

[0017] The multilayer electronic component may further include an adhesive sheet for bonding the plurality of unit sheets, and the adhesive sheet for bonding may include one or more thermosetting resins selected from polyurethane, polyimide, silicone and epoxy resins.

[0018] According to one embodiment of the present invention, a method for manufacturing a unit sheet may include: providing an electrolyte comprising barium (Ba) ions and titanium (Ti) ions; immersing a nickel (Ni) sheet in the electrolyte; plating a barium-titanium alloy on the nickel (Ni) sheet; and oxidizing the plated barium-titanium alloy to form a barium titanate (BaTiO3) dielectric layer.

[0019] The electrolyte may further include one or more metal ions selected from calcium (Ca) or zirconium (Zr).

[0020] The nickel (Ni) sheet may further include a carrier film disposed on its lower portion, and the carrier film may be a polymer film selected from one or more of polyethylene terephthalate (PET), polyimide (PI), and polyethylene naphthalate (PEN).

[0021] The plating can be performed by electroplating.

[0022] The method of manufacturing unit sheets may further include patterning using a mask and removing the carrier film and mask after forming a barium titanate (BaTiO3) dielectric layer.

[0023] In the method of manufacturing the unit sheet, the nickel (Ni) sheet may have a thickness in the range of 0.1 μm to 3 μm, and the dielectric layer may have a thickness in the range of 3 μm to 30 μm.

[0024] In the method of manufacturing unit sheet, the nickel (Ni) sheet may have a thickness in the range of 0.1 μm to 3 μm.

[0025] [Beneficial Effects]

[0026] According to embodiments of the present invention, a method for manufacturing a multilayer ceramic capacitor (MLCC) cell sheet is provided, wherein the dielectric layer is formed by an alloy plating method, thereby preventing performance degradation caused by deterioration during the high-temperature sintering process and shortening the manufacturing process to reduce costs and time; and a high-capacity, miniaturized electronic component, such as a multilayer capacitor, is provided, comprising a cell sheet that enables thinning of internal electrodes and has an increased effective area. Attached Figure Description

[0027] Figure 1 It is a perspective view of a multilayer electronic component according to an implementation scheme.

[0028] Figure 2 It is a cross-sectional view of an electronic component according to an implementation scheme.

[0029] Figure 3 This is a top view of the dielectric and internal electrodes of an electronic component according to one embodiment.

[0030] Figure 4 This is a flowchart showing a method for manufacturing a unit sheet according to one implementation scheme.

[0031] Figure 5 This is a schematic diagram illustrating the process of manufacturing unit sheets using an alloy plating method according to one embodiment.

[0032] Figure 6 This is a display based on an embodiment (see example). Figure 6A) and comparative examples (see Figure 6 B) Cross-sectional view of the interlayer bonding state of the stacked unit sheets.

[0033] Figure 7 It is a cross-sectional view showing a multilayer electronic component manufactured by a pressing method after stacking unit sheets manufactured according to one embodiment. Detailed Implementation

[0034] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] However, the technical spirit of the present invention is not limited to the specific embodiments described herein, but can be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components can be selectively combined or substituted among the various embodiments.

[0036] Furthermore, unless otherwise explicitly and specifically defined, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the meaning commonly understood by one of ordinary skill in the art to which this invention pertains, and commonly used terms (e.g., terms defined in a dictionary) may be interpreted in conjunction with their contextual meaning in the relevant art.

[0037] Furthermore, the terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and not for limiting the invention.

[0038] In this specification, unless otherwise stated in the phrase, the singular form may include the plural form, and when described as “at least one (or one or more) of A, B and C”, it may include one or more of any combination that can be formed from A, B and C.

[0039] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b) may be used.

[0040] Such terms are only used to distinguish one component from another, and the nature, order, sequence, etc. of the corresponding components are not limited by such terms.

[0041] Furthermore, when describing a component as “connected,” “coupled,” or “attached” to another component, the component may be directly connected, coupled, or attached to the other component, or it may be “connected,” “coupled,” or “attached” through another component existing between the component and the other component.

[0042] Furthermore, when a component is described as being formed or arranged "on" or "below" other components, the terms "on" or "below" encompass situations where the two components are in direct contact, as well as situations where one or more other components are located between the two components. Additionally, the terms "on" or "below" can encompass both a downward direction and an upward direction based on a component.

[0043] The embodiments will be described in detail below with reference to the accompanying drawings, wherein the same or corresponding parts in all the drawings are indicated by the same reference numerals and repeated descriptions will be omitted.

[0044] Figure 1 This is a perspective view of a multilayer electronic component according to one embodiment of the present invention. Figure 2 This is a cross-sectional view of an electronic component according to an embodiment of the present invention, and Figure 3 This is a top view of the dielectric and internal electrodes of an electronic component according to one embodiment of the present invention. In this specification, the electronic component according to one embodiment of the present invention may be a multilayer ceramic capacitor (MLCC).

[0045] refer to Figures 1 to 3 According to one embodiment of the present invention, an electronic component 100 includes a first external electrode 110, a second external electrode 120, an internal electrode 130, and a dielectric 140.

[0046] The first pair of external electrodes 110 and the second pair of external electrodes 120 are arranged facing each other. In this specification, the direction from the first external electrode 110 toward the second external electrode 120 is referred to as the first direction. The first external electrode 110 and the second external electrode 120 may each comprise a metal. For example, the first external electrode 110 and the second external electrode 120 may each comprise at least one of nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), and silver-palladium (Ag-Pd) alloys, but are not limited thereto.

[0047] An internal electrode 130 is disposed between the first external electrode 110 and the second external electrode 120. The internal electrode 130 may include a plurality of first internal electrode layers 131 connected to the first external electrode 110 and stacked sequentially, and a plurality of second internal electrode layers 132 connected to the second external electrode 120 and stacked sequentially. The plurality of first internal electrode layers 131 and the plurality of second internal electrode layers 132 included in an electronic component 100 may each have tens of layers, hundreds of layers, or thousands of layers.

[0048] The plurality of first internal electrode layers 131 and the plurality of second internal electrode layers 132 may be spaced apart from each other and arranged alternately. For example, a second internal electrode layer 132A may be disposed above a first internal electrode layer 131A and spaced apart from it, a first internal electrode layer 131B may be disposed above a second internal electrode layer 132A and spaced apart from it, and a second internal electrode layer 132B may be disposed above a first internal electrode layer 131B and spaced apart from it.

[0049] The stacking direction of the plurality of first internal electrode layers 131 and the plurality of second internal electrode layers 132 may be perpendicular to the first direction. In this specification, the stacking direction of the plurality of first internal electrode layers 131 and the plurality of second internal electrode layers 132 may be referred to as the second direction.

[0050] According to one embodiment of the present invention, as the thickness of each of the plurality of first internal electrode layers 131 and the plurality of second internal electrode layers 132 decreases, the number of stacked layers can be increased, and the capacity of the electronic component 100 can be increased.

[0051] A dielectric 140 is disposed between the first external electrode 110 and the second external electrode 120. The dielectric 140 may be disposed between the first external electrode 110 and the second external electrode 120, located in the spacer region between a plurality of first internal electrode layers 131 and a plurality of second internal electrode layers 132. For example, the dielectric 140 may include a plurality of dielectric layers 141, 142, and 143, and may have a structure in which a first internal electrode layer 131A, a dielectric layer 141, a second internal electrode layer 132A, a dielectric layer 142, a first internal electrode layer 131B, a dielectric layer 143, and a second internal electrode layer 132B are stacked sequentially in a second direction.

[0052] According to one embodiment of the present invention, a multilayer electronic component may include a first external electrode, a second external electrode, and a plurality of unit sheets disposed between the first external electrode and the second external electrode.

[0053] The unit sheet includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer.

[0054] In the unit sheet, the nickel (Ni) electrode layer and the barium titanate (BaTiO3) dielectric layer can have a thickness ratio in the range of 1:1 to 1:300.

[0055] Figure 4 This is a flowchart showing a method for manufacturing a unit sheet according to one implementation scheme.

[0056] refer to Figure 4A method for manufacturing a unit sheet for electronic components includes: providing an electrolyte comprising barium (Ba) ions and titanium (Ti) ions (S401); immersing a nickel (Ni) sheet in the electrolyte (S402); depositing a barium-titanium alloy on the nickel (Ni) sheet (S403); and oxidizing the deposited barium-titanium alloy to form a barium titanate (BaTiO3) dielectric layer (S404).

[0057] The embodiment may further include, after forming the barium titanate (BaTiO3) dielectric layer (S404), patterning the dielectric layer using a mask (S405), and removing the carrier film and the mask (S406).

[0058] Figure 5 This is a schematic diagram illustrating the process of manufacturing unit sheets using an alloy plating method according to one embodiment.

[0059] like Figure 5 As shown in Figure A, an electrolyte comprising barium (Ba) ions and titanium (Ti) ions is prepared. The electrolyte substantially comprises Ba and Ti to form a barium titanate (BaTiO3) layer (which serves as the substrate material for the dielectric layer), and various other types of metal elements can be added thereto to enhance performance.

[0060] For example, an electrolyte comprising Ca and Zr can be used to form CaZrO3, which is a paraelectric material with low temperature sensitivity. Meanwhile, considering solubility, the electrolyte can be prepared by dissolving a metal salt such as Ba(CH3COOH)2.

[0061] like Figure 5 As shown in Figure B, nickel (Ni) sheets are immersed in an electrolyte containing barium (Ba) ions and titanium (Ti) ions.

[0062] Therefore, nickel (Ni) can typically be used for plating the base layer and can be replaced with other metal materials to improve the performance of capacitor chips or for process convenience.

[0063] A carrier film can be provided beneath the nickel (Ni) sheet, and the carrier film can be a polymer film selected from, for example, polyethylene terephthalate (PET), polyimide (PI), and polyethylene naphthalate (PEN), but is not limited thereto, and can be replaced with other polymer materials to improve the convenience of roll-to-roll or patterning processes.

[0064] Next, as Figure 5 As shown in Figure C, a barium-titanium alloy is plated onto a nickel (Ni) sheet. The plating method can include wet plating using aqueous solutions, such as electroplating. While electroless plating is also possible, high-quality thin films can be obtained by applying electroplating.

[0065] After the plating process, such as Figure 5 As shown in Figure D, when a barium-titanium (Ba-Ti) alloy is formed on a nickel (Ni) sheet by electroplating, the alloy is oxidized to prepare a BaTiO3 dielectric layer (S4O3). Thermal oxidation can be used as the oxidation method for the barium-titanium alloy, where oxidation is carried out by heat treatment under an oxidizing atmosphere. Although electrochemical oxidation methods are also possible, the application of thermal oxidation methods has the advantage of obtaining high-quality thin films.

[0066] After the oxidation process, such as Figure 5 As shown in E, a first etching process is performed to pattern the PET layer and nickel (Ni) layer, which serve as a carrier film, using a mask. The mask can be applied to the PET film by methods such as deposition or pressing.

[0067] After patterning process, such as Figure 5 As shown in Figure F, a second etching process is performed to remove the mask and the carrier film. During the removal of the mask and the PET layer serving as the carrier film, the nickel (Ni) layer and the dielectric layer (BaTiO3) should not be affected. For process convenience, two or more types of etching solutions can be used, or a process comprising two or more steps can be applied. In this process, a unit sheet comprising a nickel (Ni) layer and a BaTiO3 dielectric layer is fabricated.

[0068] According to one embodiment of the present invention, a unit sheet having a dielectric layer formed by an oxidation process following plating of a barium-titanium alloy is characterized in that it may include a thin nickel (Ni) electrode layer. Specifically, in the unit sheet, the thickness of the nickel (Ni) sheet, i.e., the nickel (Ni) electrode layer, can be in the range of 0.5 to 3 μm, and more preferably 1 μm or less.

[0069] Furthermore, in a unit sheet according to one embodiment, the thickness of the dielectric layer (BaTiO3) can range from 3 μm to 30 μm.

[0070] After manufacturing the unit sheet, such as Figure 5 As shown in G, cell sheets can be stacked to form external electrodes, and multilayer electronic components, i.e., MLCC chips, can be fabricated. The cell sheets can be adjusted according to the target performance of the chip, and can, for example, include 2 to 500 layers.

[0071] According to one embodiment, after stacking the unit sheets, a pressing process can be performed to densify them. Specifically, to enhance the bonding strength between the unit sheets, one or more processes selected from hot pressing, adhesive sheet bonding, and high-pressure pressing can be further included.

[0072] Furthermore, one or more metals selected from Cu, Sn, and Ni can be used as external electrodes, and two or more types of mixtures can be used depending on the target application of the chip.

[0073] According to one embodiment of the present invention, when using an alloy plating method to manufacture multilayer electronic components, the manufacturing process is improved and the performance of the electronic components can be enhanced.

[0074] Typically, the MLCC manufacturing process involves multiple steps, including raw material synthesis, raw material mixing, dielectric layer coating, internal electrode printing, lamination, compression, cutting, heat treatment (sintering), polishing, external electrode formation, external electrode heat treatment, plating, sorting, and packaging.

[0075] According to one embodiment of the present invention, the process for manufacturing a single unit sheet (a dielectric layer and an internal electrode layer) can be shortened, thereby simplifying the overall manufacturing process and saving the time and cost required for manufacturing.

[0076] Furthermore, according to one implementation scheme, the manufactured MLCC has improved coverage and increased effective area. (Reference) Figure 6 It can be confirmed based on the comparative example (see Figure 6 A) and Examples (see Figure 6 B) The interlayer bonding state of the unit sheet. Figure 6 A is a cross-sectional view showing the interlayer bonding state of the unit sheets manufactured and stacked using conventional sintering methods in the comparative example, while Figure 6 B is a cross-sectional view showing the interlayer bonding state of the unit sheets manufactured and stacked by the alloy plating method in the embodiment.

[0077] In traditional MLCC manufacturing processes, high-temperature sintering at 1,000 °C or higher is essential for densifying the particles. However, during this high-temperature sintering process, porosity and discontinuities are generated in the internal electrodes, leading to reduced coverage. When coverage decreases, the effective area for generating capacitance is reduced, thereby decreasing the chip's capacitance.

[0078] In contrast, when applying the alloy plating method according to one embodiment, the sintering process can be omitted, thereby improving coverage and preventing capacitance reduction. Specifically, according to one embodiment of the invention, when a dielectric layer is formed on a nickel electrode layer by the alloy plating method, the porosity of the nickel (Ni) electrode layer can be 1% or lower.

[0079] Furthermore, according to one implementation, when using an alloy plating method to manufacture MLCCs, chip performance degradation can be mitigated. In conventional MLCC manufacturing processes, high-temperature sintering in a reducing atmosphere is essential to prevent oxidation of the Ni electrode. Oxygen vacancies are formed in the dielectric layer during the high-temperature sintering process, which is a major cause of MLCC performance degradation. However, when using an alloy plating method, the sintering process can be omitted, preventing the formation of oxygen vacancies and reducing degradation.

[0080] Furthermore, according to one embodiment, when the unit sheet is manufactured using an alloy plating method, the internal electrodes and dielectric layers can be made thinner. The thickness of the BaTiO3 dielectric layer in the multilayer electronic component unit sheet varies depending on the specifications of the MLCC model, but can be in the range of approximately 3 μm to 30 μm. The thicknesses of the nickel (Ni) electrode layer and the BaTiO3 dielectric layer are designed differently according to the specifications of the MLCC chip, such as its size, capacitance, and rated voltage.

[0081] In traditional MLCC manufacturing processes, internal electrodes are fabricated by printing nickel (Ni) paste, which presents a challenge in printing internal electrodes with a thickness of 1 μm or less. When manufacturing unit sheets using conventional methods, the electrode thickness typically ranges from 0.5 μm to 3 μm, and the dielectric layer thickness ranges from 3 μm to 30 μm. Therefore, in unit sheets manufactured according to conventional processes, the nickel (Ni) electrode layer has a thickness ratio to the BaTiO3 dielectric layer ranging from 1:1 to 1:60.

[0082] On the other hand, according to one embodiment, when the unit sheet is manufactured using an alloy plating method, the thickness of the nickel (Ni) electrode layer can be achieved in the range of 0.1 μm to 3 μm, and since the dielectric layer has a thickness in the range of 3 μm to 30 μm, the thickness ratio of the nickel (Ni) electrode layer to the BaTiO3 dielectric layer can be in the range of 1:1 to 1:300.

[0083] One embodiment of the present invention has the following advantages: because it is easy to manufacture nickel layers with a thickness of 1 μm or less, it is possible to manufacture multilayer electronic components including thin nickel internal electrodes.

[0084] Simultaneously, to manufacture MLCCs, several to dozens of unit sheets (one layer of BaTiO3 dielectric + one layer of nickel (Ni) electrode) should be stacked. Compared to conventional manufacturing processes (where strong interlayer bonding is achieved through a calcination process after pressing), in the embodiment of the alloy plating manufacturing method according to the present invention, the interlayer bonding may be relatively weak due to the omission of the calcination process. Therefore, to prevent delamination caused by weakened bonding strength, the interlayer bonding strength can be enhanced by adding processes such as hot pressing, stacking of adhesive sheets for bonding, or repeated high-pressure pressing.

[0085] When hot pressing is performed, it should be carried out within a temperature and pressure range that will not damage the electrodes and dielectric layers. Furthermore, polymer sheets such as polyurethane and polyimide can be used as adhesive sheets to enhance the interlayer bonding strength between unit sheets, but are not limited to this. Additionally, a high-pressure repeated pressing process can be performed by repeatedly applying pressure at room temperature.

[0086] Figure 7 This is a cross-sectional view showing an MLCC manufactured by pressing after stacking unit sheets produced by an alloy plating method according to an embodiment of the present invention. Reference Figure 7 The boundaries between BaTiO3 layers in an MLCC manufactured according to one embodiment can be confirmed. While multiple unit sheets manufactured by conventional methods undergo a sintering process, resulting in unclear boundaries between BaTiO3 layers, in the case of manufacturing a dielectric by stacking unit sheets comprising a BaTiO3 dielectric layer formed by oxidizing a Ba-Ti alloy on a nickel (Ni) sheet according to one embodiment of the invention, a pressing process is required, and therefore, boundaries between the BaTiO3 dielectric layers may appear. Specifically, during the process of pressing the unit sheets comprising the BaTiO3 dielectric layer formed by oxidizing the Ba-Ti alloy, the BaTiO3 dielectric layer formed on the upper side of the nickel (Ni) sheet is pressed and fills the void spaces on the side surface of the nickel (Ni) sheet. Since the nickel (Ni) sheet used in this invention has a small thickness, the void spaces on the side surface of the sheet are also small, and the BaTiO3 can fill these void spaces through the pressing process. Therefore, as Figure 7 As shown, the boundary between the BaTiO3 dielectric layers of the MLCC manufactured according to one embodiment of the present invention confirms that the MLCC is manufactured by a pressing method. Accordingly, according to one embodiment of the present invention, when using an alloy plating method, the manufacturing process of the unit sheet can be shortened, thereby reducing the manufacturing cost and time of the MLCC and preventing the performance degradation of the MLCC caused by high-temperature sintering.

[0087] Although the invention has been described above with reference to exemplary embodiments, those skilled in the art will understand that various modifications and alterations can be made to the invention within the spirit and scope set forth in the claims below.

Claims

1. A multilayer electronic component, comprising: First external electrode; Second external electrode; as well as Multiple unit sheets are disposed between the first external electrode and the second external electrode. Each of the unit sheets includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, and The nickel (Ni) electrode layer and the barium titanate (BaTiO3) dielectric layer have a thickness ratio in the range of 1:1 to 1:

300.

2. The multilayer electronic device according to claim 1, wherein the nickel (Ni) electrode layer has a thickness in the range of 0.1 μm to 3 μm, and The barium titanate (BaTiO3) dielectric layer has a thickness ranging from 3 μm to 30 μm.

3. The multilayer electronic component according to claim 1, wherein the nickel (Ni) electrode layer has a porosity of 1% or less.

4. The multilayer electronic component according to claim 1, further comprising an adhesive sheet for bonding between the plurality of unit sheets.

5. A method for manufacturing a unit sheet, comprising: Provides an electrolyte containing barium (Ba) ions and titanium (Ti) ions; The nickel (Ni) sheet is immersed in the electrolyte; A barium-titanium alloy is plated onto the nickel (Ni) sheet; as well as The barium-titanium alloy is oxidized to form a barium titanate (BaTiO3) dielectric layer.

6. The method of claim 5, wherein the electrolyte further comprises one or more metal ions selected from calcium or zirconium.

7. The method of claim 5, wherein the nickel (Ni) sheet further comprises a carrier film disposed on its lower portion.

8. The method according to claim 5, wherein the plating is performed by an electroplating method.

9. The method of claim 5, further comprising, after forming the barium titanate (BaTiO3) dielectric layer, patterning using a mask, and removing the carrier film and the mask.

10. The method of claim 5, wherein the nickel (Ni) sheet has a thickness in the range of 0.1 μm to 3 μm, and The dielectric layer has a thickness ranging from 3 μm to 30 μm.

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