Power management integrated circuit

Abstract

Embodiments of the present invention provide a power management integrated circuit, comprising: a sensing unit that supplies a bias current to a temperature sensor for turning on the temperature sensor included in an external driving component, and the sensing unit receives a sensing voltage detected from the temperature sensor by means of the bias current and detects a temperature value; and a power supply unit that adjusts a driving voltage for driving a core included in the external driving component based on the temperature value detected by the sensing unit, wherein the driving voltage varies according to the temperature value.

Description

Technical Field

[0001] This disclosure relates to a power management integrated circuit. Background Technology

[0002] Display devices include power management circuitry. This power management circuitry may be referred to as a power management integrated circuit (PMIC).

[0003] Power management integrated circuits primarily perform the function of converting system power supplied from commercial power sources, batteries, etc., into power suitable for the characteristics of components included in a display device, and then supplying the converted power to the components. For example, when the voltage of the system power differs from the operating voltage of the components, the power management integrated circuit can convert the voltage of the system power and then supply the converted voltage to the appropriate components.

[0004] Figure 1 This is a diagram showing the configuration of a conventional power management integrated circuit and external drive components.

[0005] The power management integrated circuit 10 primarily performs the function of converting system power supplied from commercial power sources, batteries, etc., into power suitable for the characteristics of the drive components and supplying the converted power. Specifically, the power management integrated circuit 10 can manage the power supplied to the external drive components 20.

[0006] The external driving component 20 can be a system-on-a-chip (SoC) or another application. An SoC includes a processor for controlling connected semiconductor devices. The processor of the SoC can control the operation of the semiconductor devices by performing calculations and transmitting and receiving signals.

[0007] refer to Figure 1 The power management integrated circuit 10 may include a power supply unit 11, and the external drive unit 20 may include a core 21. The power supply unit 11 may be used to convert the input voltage into a desired output voltage. The core 21 may perform calculations required for the external drive unit 20 or the system-on-a-chip to operate as a processor in the final product.

[0008] In this case, the power supply unit 11 of the power management integrated circuit 10 outputs a driving voltage V for driving the core 21 of the external driving component 20. CORE However, the problem is that the power supply unit 11 outputs a constant drive voltage V regardless of the heat level in the product. CORE .

[0009] Recently, research has been ongoing to adjust the drive voltage V based on the heat level in the product. CORE . Summary of the Invention

[0010] Technical issues

[0011] Embodiments of this disclosure provide a power management integrated circuit capable of adjusting the drive voltage according to the heat level.

[0012] Technical solution

[0013] Embodiments of this disclosure provide a power management integrated circuit, the power management integrated circuit comprising: a sensing unit configured to supply a bias current for turning on a temperature sensor included in an external driving component to the temperature sensor, receive a sensing voltage detected from the temperature sensor by the bias current, and detect a temperature value; and a power supply unit configured to adjust a driving voltage for driving a core included in the external driving component based on the temperature value detected by the sensing unit, wherein the driving voltage varies according to the temperature value.

[0014] Another embodiment of this disclosure provides a power management integrated circuit, the power management integrated circuit comprising: a temperature sensor configured to output a sensing voltage corresponding to a bias current; a sensing unit configured to supply a bias current for turning on the temperature sensor to the temperature sensor, receive a sensing voltage detected from the temperature sensor by the bias current, and detect a temperature value; and a power supply unit configured to adjust a drive voltage for driving a core included in an external drive component based on the temperature value detected by the sensing unit, wherein the drive voltage varies according to the temperature value.

[0015] Beneficial effects

[0016] The power management integrated circuit according to embodiments of the present disclosure includes a sensing unit, thereby allowing the drive voltage to be adjusted according to the heat level.

[0017] In addition to the effects described above, other features and advantages of this disclosure will be described below, or may be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0018] Figure 1 This is a diagram illustrating the configuration of the power management integrated circuit and external drive components according to a comparative example.

[0019] Figure 2 This is a diagram illustrating the configuration of a power management integrated circuit and an external drive component according to an embodiment of the present disclosure.

[0020] Figure 3 This is a diagram illustrating a portion of the configuration of a power management integrated circuit and an external drive component according to an embodiment of the present disclosure.

[0021] Figure 4 It is a graph showing the relationship between temperature and sensing voltage.

[0022] Figure 5 This is a diagram illustrating the configuration of a power management integrated circuit and an external drive component according to another embodiment of the present disclosure.

[0023] Figure 6 This is a diagram illustrating the configuration of a power management integrated circuit and an external drive component according to yet another embodiment of the present disclosure.

[0024] Figure 7 This is a diagram illustrating the configuration of a display device according to an embodiment of the present disclosure. Detailed Implementation

[0025] The advantages and features of this disclosure, as well as the methods for implementing them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below and can be implemented in various different forms. The embodiments are provided merely to complete the disclosure and to fully inform those skilled in the art of its scope.

[0026] The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the accompanying drawings for describing embodiments of this disclosure are merely illustrative, and therefore this disclosure is not limited to what is shown in the drawings. Throughout the specification, the same components may be represented by the same reference numerals. Furthermore, in describing this disclosure, detailed descriptions of relevant known technologies may be omitted when it is determined that such detailed descriptions may unnecessarily obscure the subject matter of this disclosure.

[0027] When this document uses terms such as “including,” “having,” and “contains,” additional parts may be added unless the term “only” is used. When parts are expressed in the singular, the expression may include multiple parts unless otherwise expressly stated.

[0028] When interpreting a component, even without an explicit description, the component is interpreted as including a tolerance range.

[0029] For example, when using terms such as “above,” “over,” “below,” or “beside” to describe the positional relationship between two parts, one or more other parts may be positioned between the two parts unless the terms “immediately adjacent” or “directly” are used.

[0030] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” can be used to readily describe the relationship between one element or component and another, as shown in the figures. Spatial relative terms should be understood to include terms describing different orientations of the elements in use or operation, in addition to those shown in the figures. For example, when the elements shown in the figures are flipped, an element described as “below” or “under” another element can be positioned “above” another element. Thus, the exemplary term “below” can encompass both lower and upper orientations. Similarly, the exemplary terms “above” or “upper” can encompass both upper and lower orientations.

[0031] In the description of temporal relationships, for example, when using terms such as “after,” “following,” “next,” “before” to describe temporal sequence, temporal relationships can include non-continuous relationships unless the terms “immediately following” or “directly” are used.

[0032] Although terms such as "first" and "second" are used to describe various components, the components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component described below can be a second component within the technical spirit of this disclosure.

[0033] The term "at least one" should be understood to include all possible combinations that can be presented from one or more related items. For example, "at least one of the first, second, and third items" can mean not only each of the first, second, and third items, but also all combinations of two or more of the first, second, and third items.

[0034] The corresponding features of the various embodiments of this disclosure may be partially or completely linked or combined with each other, may be technically interlocked and driven in various ways, and the corresponding embodiments may be implemented independently of each other or may be implemented together in association with each other.

[0035] When assigning reference numerals to components in the drawings used to describe embodiments of the present disclosure, the same components may have as many identical reference numerals as possible, even if shown in different drawings.

[0036] Figure 2 This is a diagram illustrating the configuration of a power management integrated circuit 100 and an external drive component 200 according to an embodiment of the present disclosure. Figure 3 This is a diagram showing a portion of the configuration of a power management integrated circuit 100 and an external drive component 200 according to an embodiment of the present disclosure.

[0037] In the description of the power management integrated circuit 100 and the external drive component 200, the terms related to... will be omitted. Figure 1 The descriptions of the power management integrated circuit 10 and the external drive component 20 overlap.

[0038] According to embodiments of this disclosure, the power management integrated circuit 100 may include a power supply unit 110, a first interface 120, and a sensing unit 130. The external driving component 200 may include a core 210, a second interface 220, and a temperature sensor 230.

[0039] The components of the power management integrated circuit 100 and the external drive component 200 will be described in detail below.

[0040] According to embodiments of this disclosure, the power supply unit 110 can be used to convert an input voltage into a desired output voltage. Specifically, the power supply unit 110 can output a drive voltage V for driving the core 210 of the external drive component 200. CORE .

[0041] In embodiments of this disclosure, the power supply unit 110 may include a reference voltage source 111, an amplifier 112, a transistor 113, and a voltage divider circuit 114.

[0042] Reference voltage source 111 can output a reference voltage V that varies according to the temperature value input from sensing unit 130. REF .

[0043] Amplifier 112 will use the reference voltage V REF With feedback voltage V FEED The difference between the reference voltages is compared, amplified, and the amplified result is output to the gate terminal of transistor 113. Specifically, the reference voltage V... REF The feedback voltage V is input to the first input terminal of amplifier 112. FEED It is input to the second input terminal of amplifier 112, and reference voltage V REF and feedback voltage V FEED The amplified value of the difference between them is output through the output terminal of amplifier 112.

[0044] Transistor 113 includes a first terminal, a second terminal, and a third terminal. The first terminal of transistor 113 is connected to the output terminal of amplifier 112, the second terminal of transistor 113 is connected to a node to which a power supply voltage Vcc is applied, such that the power supply voltage Vcc is applied to the second terminal, and the third terminal of transistor 113 is connected to voltage divider circuit 114.

[0045] According to an embodiment of the present disclosure, when the voltage output from amplifier 112 is applied to the first terminal of transistor 113, transistor 113 is turned on, causing the current generated by the power supply voltage Vcc to flow through transistor 113 to voltage divider circuit 114.

[0046] Voltage divider circuit 114 uses a series of resistors connected in series to divide the power supply voltage Vcc and outputs a drive voltage V. CORE and feedback voltage V FEED Drive voltage V CORE The voltage level can be lower than the supply voltage Vcc. One end of the resistor string included in the voltage divider circuit 114 is connected to the third terminal of transistor 113, and the other end of the resistor string is connected to the ground terminal. Drive voltage V CORE The output is from a tap connected to one of the nodes between the resistors forming the resistor string, and the feedback voltage V is... FEED The output is from the tap of another node connected between the resistors.

[0047] According to embodiments of this disclosure, amplifier 112 can amplify the reference voltage V. REF The feedback voltage V fed back from the voltage divider circuit 114 FEED The difference between them, and allows adjustment of the drive voltage V based on the result. CORE This enables control over the driving voltage V. CORE Precise control.

[0048] In embodiments of this disclosure, the driving voltage V CORE It is output through the first terminal 115 of the power supply unit 110 and transmitted to the core 210 through the third terminal 211 of the core 210.

[0049] According to embodiments of this disclosure, the driving voltage V CORE The power supply unit 110 can vary according to the temperature value detected by the sensing unit 130. Specifically, the power supply unit 110 can output a drive voltage V for driving the core 210 based on the temperature value detected by the sensing unit 130. CORE .

[0050] According to embodiments of this disclosure, the sensing unit 130 can transmit a bias current I for turning on the temperature sensor 230. B Supply to temperature sensor 230, receiving corresponding bias current I B And the sensing voltage V detected by temperature sensor 230 BE And then the corresponding sensing voltage V BE The temperature value is output to the power supply unit 110.

[0051] According to embodiments of the present disclosure, the sensing unit 130 may include a current source 131, an analog-to-digital converter (ADC) 132, and a digital processing circuit 133.

[0052] Current source 131 provides bias current I to temperature sensor 230B Output. The current source 131 requires a high-level supply voltage VDD to output a bias current I. B .

[0053] Bias current I B The signal can be transmitted to the temperature sensor 230 via the second terminal 134 of the sensing unit 130 and the fourth terminal 232 of the temperature sensor 230.

[0054] ADC 132 can detect the sensing voltage V output from temperature sensor 230. BE Convert to a digital value. Sensing voltage V BE It can be transmitted to ADC 132 through the fourth terminal 232 and the second terminal 134.

[0055] The digital processing circuit 133 can output the temperature value corresponding to the digital value converted by the ADC 132 to the power supply unit 110.

[0056] According to embodiments of this disclosure, the temperature value can change with the sensing voltage V output from the temperature sensor 230. BE It changes with the changes.

[0057] According to embodiments of this disclosure, core 210 can perform calculations required for external drive unit 200 to operate as a processor in the final product. Core 210 can use the drive voltage V output from power supply unit 110. CORE Let's operate it.

[0058] In embodiments of this disclosure, the power supply unit 110 and the core 210 can be connected via a first terminal 115 and a third terminal 211. Therefore, the power management integrated circuit 100 and the external drive component 200 can be connected to each other.

[0059] According to embodiments of this disclosure, the temperature sensor 230 can output a bias current I to the sensing unit 130 and output from the sensing unit 130. B The corresponding sensing voltage V BE Sensing voltage V BE It can also be referred to as base-emitter voltage.

[0060] According to embodiments of this disclosure, the temperature sensor 230 may include any one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field-effect transistor (MOSFET). Figure 3 An example of a temperature sensor 230 including a thermal diode 231 is shown. For example, the temperature sensor 230 may correspond to a thermal diode 231.

[0061] According to embodiments of this disclosure, the sensing unit 130 and the temperature sensor 230 can be connected via the second terminal 134 and the fourth terminal 232. Therefore, the power management integrated circuit 100 and the external drive component 200 can be connected to each other.

[0062] According to embodiments of the present disclosure, the power management integrated circuit 100 may include a first interface 120, and the external driving component 200 may include a second interface 220.

[0063] The first interface 120 and the second interface 220 can each be used as a path through which temperature information corresponding to a temperature value is transmitted. For example, when the external drive component 200 requests temperature information from the power management integrated circuit 100, the power management integrated circuit 100 can provide the external drive component 200 with the temperature information corresponding to the temperature value. However, even when the external drive component 200 does not request temperature information, the temperature information corresponding to the temperature value can still be provided to the external drive component 200 when the temperature value detected by the sensing unit 130 is equal to or greater than a preset reference value.

[0064] Figure 4 This shows the temperature and sensing voltage V of the temperature sensor 230. BE A graph showing the relationship between the sensed voltage V and the sensed voltage V. BE It depends on the temperature of the temperature sensor 230. As shown in the figure, as the temperature of the temperature sensor 230 increases, the sensing voltage V... BE Reduced. According to embodiments of this disclosure, the sensed voltage V BE It can have separate code information.

[0065] According to embodiments of the present disclosure, the sensing unit 130 may further include a diode detector 135, which is configured to detect whether the temperature sensor 230 is located in the external driving component 200.

[0066] When based on the bias current I output from the sensing unit 130 B The sensing voltage V obtained from the external driving component 200 BE Equal to the bias current I supplied B When the high potential power supply voltage VDD is reached, the diode detector 135 can determine that the temperature sensor 230 is not installed in the external drive component 200.

[0067] For example, when based on the bias current I output from the sensing unit 130 B The sensing voltage V obtained from the external driving component 200 BE Lower than the bias current I used to supply BWhen the high potential power supply voltage VDD is reached, the diode detector 135 can determine that the temperature sensor 230 is located in the external drive component 200.

[0068] According to embodiments of this disclosure, the sensing unit 130 may further include a controller 136, the controller 136 being configured to compare a voltage value stored in the power management integrated circuit 100 with a bias current I. B The sensed voltage V detected by temperature sensor 230 BE The voltage offset value is controlled by comparison. In this case, considering the differences in device characteristics, the voltage value stored in the power management integrated circuit 100 can be a voltage value corresponding to an ideal temperature value.

[0069] Specifically, the controller 136 of the sensing unit 130 can compare the voltage value stored in the power management integrated circuit 100 with the sensing voltage V sensed by the temperature sensor 230 in the external drive component 200. BE The comparison is performed, the offset value is calculated based on the comparison, and the offset value is compensated.

[0070] Figure 5 This is a diagram illustrating the configuration of a power management integrated circuit 300 and an external drive component 200 according to another embodiment of the present disclosure.

[0071] Reference Figure 5 The power management integrated circuit 300 according to embodiments of the present disclosure may include a power supply unit 310, a first interface 320, a sensing unit 330, and a temperature sensor 340.

[0072] The power supply unit 310, the first interface 320, and the sensing unit 330 of the power management integrated circuit 300 respectively correspond to Figure 2 The power supply unit 110, the first interface 120, and the sensing unit 130 are shown.

[0073] Except for the temperature sensor 340 of the power management integrated circuit 300, its description is the same as Figure 2 The description of the temperature sensor 230 shown overlaps.

[0074] Specifically, the temperature sensor 340 can output a value corresponding to the bias current I. B Sensing voltage V BE Furthermore, the sensing unit 330 can use the bias current I for turning on the temperature sensor 340. B Supply to temperature sensor 340, receiving bias current I B The sensed voltage V detected by temperature sensor 340 BE And based on the sensing voltage V BE Detect the temperature value.

[0075] like Figure 5 As shown, when the external drive component 200 does not include a temperature sensor and the power management integrated circuit 300 includes a temperature sensor 340, the sensing voltage V detected from the temperature sensor 340 is received. BE The detected temperature value can be regarded as the temperature value of the external drive component 200.

[0076] Figure 6 This is a diagram illustrating the configuration of a power management integrated circuit 300 and an external drive component 200 according to yet another embodiment of the present disclosure.

[0077] and Figure 5 compared to, Figure 6 The external drive component 200 is shown to include a temperature sensor 230.

[0078] According to an embodiment of this disclosure, when the power management integrated circuit 300 and the external drive component 200 respectively include temperature sensors 340 and 230, the temperature sensor 340 disposed in the power management integrated circuit 300 can be disabled.

[0079] The remote temperature sensing method according to this disclosure will now be described in detail.

[0080] According to embodiments of this disclosure, a remote temperature sensing method may include: transmitting a bias current I through the sensing unit 130 of the power management integrated circuit 100. B Temperature sensor 230 is supplied to external drive component 200; sensing unit 130 receives data corresponding to bias current I from temperature sensor 230. B Sensing voltage V BE The sensing unit 130 transmits the signal corresponding to the sensing voltage V. BE The temperature value is output to the power supply unit 110 of the power management integrated circuit 100; and the power supply unit 110 outputs a drive voltage V for driving the core 210 of the external drive component 200 based on the temperature value detected by the sensing unit 130. CORE .

[0081] Figure 7 This is a configuration diagram of a display device 1000 according to an embodiment of the present disclosure.

[0082] Reference Figure 7 The display device 1000 may include display driving devices 410, 420, 430, 440 and 460 and a display panel 450.

[0083] Multiple data lines DL and multiple gating lines GL can be set in the display panel 450, and multiple pixels P connected to the data lines DL and gating lines GL can be set therein.

[0084] Display driving devices 410, 420, 430, 440 and 460 are devices configured to generate signals for displaying images on display panel 450, and host 410, data driving device 420, gating driving device 430, data processing device 440 and power management device 460 may correspond to display driving devices 410, 420, 430, 440 and 460.

[0085] The gating drive device 430 can supply a gating drive signal with an on or off voltage to the gating line GL. When a gating drive signal with an on voltage is provided to pixel P, pixel P is connected to the data line DL. When a gating drive signal with an off voltage is provided to pixel P, the connection between pixel P and the data line DL is released. The gating drive device 430 can also be referred to as a gating driver.

[0086] The data driving device 420 can supply a data voltage Vp to the pixel P via the data line DL. The data voltage Vp supplied to the data line DL can be supplied to the pixel P according to a strobe drive signal. The data driving device 420 can also be referred to as a source driver.

[0087] The data processing unit 440 can supply control signals to the gating drive unit 430 and the data drive unit 420, and can transmit image data IMG to the data drive unit 420. For example, the data processing unit 440 can transmit a gating control signal GCS for initiating a scan to the gating drive unit 430. Furthermore, the data processing unit 440 can transmit a data control signal DCS to control the data drive unit 420 to provide a data voltage Vp to each pixel P. The data processing unit 440 can also be referred to as a timing controller.

[0088] The host 410 can generate image data (IMG) and transmit the image data (IMG) to the data processing device 440. According to embodiments of this disclosure, Figure 7 The host 410 shown may include an external drive component 200 according to this disclosure.

[0089] The power management device 460 can provide voltage (power) to corresponding components in the display device. For example, the power management device 460 can provide a common electrode voltage VCOM to the display panel 450. In addition, the power management device 460 can provide a low gate voltage VGL and a high gate voltage VGH to the gate drive device 430, and can provide a drive voltage AVDD to the data drive device 420.

[0090] According to embodiments of this disclosure, Figure 7 The power management device 460 shown may include a power management integrated circuit 100 according to the present disclosure.

[0091] Meanwhile, the power management device 460 according to embodiments of this disclosure can supply multiple voltages to the display panel 450, the gating drive device 430, and the data drive device 420 during each frame's drive cycle, and can reduce or cut off some or all of the supply of the multiple voltages during each frame's non-drive cycle, or can supply the aforementioned multiple voltages in a low-current mode. Here, the non-drive cycle can be understood as a state in which image data IMG is continuously displayed on the display panel 450, while the display drive devices 410, 420, 430, 440, and 460 that facilitate the display of image data IMG are driven or not driven at a minimum. In this way, the power management device 460 can minimize power consumption during the non-drive cycle.

[0092] The content of this disclosure is not limited to the above-described embodiments and drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and alterations can be made without departing from the technical spirit of this disclosure. Therefore, the scope of this disclosure is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be interpreted as being included within the scope of this disclosure.

Claims

1. A power management integrated circuit, wherein the power management integrated circuit comprises: The sensing unit shown is configured to supply a bias current for turning on a temperature sensor included in an external drive component to the temperature sensor, receive a sensing voltage detected from the temperature sensor by the bias current, and detect a temperature value. as well as The power supply unit shown is configured to adjust the drive voltage for driving the core included in the external drive component based on the temperature value detected by the sensing unit. The driving voltage varies according to the temperature value.

2. The power management integrated circuit according to claim 1, wherein, The sensing unit includes: A current source, wherein the current source is configured to output the bias current; An analog-to-digital converter (ADC) configured to convert the sensed voltage output from the temperature sensor into a digital value; and A digital processing circuit configured to provide the power supply unit with a temperature value corresponding to the digital value.

3. The power management integrated circuit according to claim 1, wherein, The power supply unit includes a reference voltage source configured to output a reference voltage that varies according to the temperature value, and The drive voltage output from the power supply unit varies according to the reference voltage.

4. The power management integrated circuit according to claim 1, further comprising a first interface, the first interface being connected to the external driving component via a terminal. in, The external drive component includes a second interface connected to the first interface, and Temperature information corresponding to the temperature value is transmitted to the external drive component through the first interface and the second interface.

5. The power management integrated circuit according to claim 1, wherein, The temperature sensor includes any one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field-effect transistor (MOSFET).

6. The power management integrated circuit according to claim 1, wherein, The sensing unit further includes a diode detector configured to detect whether a temperature sensor is provided in the external driving component, and When the sensing voltage obtained from the external driving component based on the bias current output from the sensing unit is lower than the high-potential power supply voltage used to supply the bias current, the diode detector determines that the temperature sensor is provided in the external driving component.

7. The power management integrated circuit according to claim 1, wherein, The sensing unit is connected to the temperature sensor of the external driving component via a terminal, and The power supply unit is connected to the core of the external drive component via terminals.

8. The power management integrated circuit according to claim 1, wherein, The sensing unit further includes a controller configured to control a voltage offset value by comparing a voltage value stored in the power management integrated circuit with the sensed voltage detected from the temperature sensor by the bias current.

9. A power management integrated circuit, the power management integrated circuit comprising: A temperature sensor configured to output a sensing voltage corresponding to a bias current; A sensing unit configured to supply a bias current for turning on the temperature sensor to the temperature sensor, receive a sensing voltage detected from the temperature sensor through the bias current, and detect a temperature value; as well as A power supply unit configured to adjust the drive voltage for driving a core included in an external drive component based on the temperature value detected by the sensing unit. The driving voltage varies according to the temperature value.

10. The power management integrated circuit according to claim 9, wherein, When the external driving component includes a temperature sensor configured to output a sensing voltage that corresponds to the bias current supplied by the sensing unit and is the same as or different from the sensing voltage, the temperature sensor included in the power management integrated circuit is deactivated.

11. The power management integrated circuit according to claim 9, wherein, The sensing unit includes: A current source configured to output the bias current; An analog-to-digital converter (ADC) configured to convert the sensed voltage output from the temperature sensor into a digital value; and A digital processing circuit configured to provide the power supply unit with a temperature value corresponding to the digital value.

12. The power management integrated circuit according to claim 9, wherein, The power supply unit includes a reference voltage source configured to output a reference voltage that varies according to the temperature value, and The drive voltage output from the power supply unit varies according to the reference voltage.

13. The power management integrated circuit according to claim 9, further comprising a first interface, the first interface being connected to the external driving component via a terminal. in, The external drive component includes a second interface connected to the first interface, and Temperature information corresponding to the temperature value is transmitted to the external drive component through the first interface and the second interface.

14. The power management integrated circuit according to claim 9, wherein, The temperature sensor includes any one of a thermal diode, a bipolar junction transistor (BJT), and a metal-oxide-semiconductor field-effect transistor (MOSFET).

15. The power management integrated circuit according to claim 9, wherein, The power supply unit is connected to the core of the external drive component via terminals.

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