Method for manufacturing cut product, fixing jig, and cutting device

Abstract

The manufacturing method of the cut item (Sc) includes: a single-piece process, in which the object to be cut is cut into multiple cut items (Sc) by using a cutting mechanism; a fixing process, in which the multiple cut items (Sc) are transferred together and fixed to a fixing fixture (75) while maintaining the configuration of the multiple cut items (Sc) after single-piece cutting; a first conveying process, in which the fixing of a first cut item group (Sc1) consisting of a portion of the multiple cut items (Sc) fixed to the fixing fixture (75) is released, and the first cut item group (Sc1) is adsorbed by a conveying mechanism (15) and conveyed to a receiving part; and a second conveying process, after the first conveying process, in which the fixing of a second cut item group (Sc2) consisting of a portion of the multiple cut items (Sc) fixed to the fixing fixture (75) that is different from the first cut item group (Sc1) is released, and the second cut item group (Sc2) is adsorbed by a conveying mechanism (15) and conveyed to a receiving part.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing cut articles, a fixing fixture, and a cutting device. Background Technology

[0002] Generally, substrates with semiconductor chips or the like fixed on them are cut into single-piece units after being sealed with resin and used as electronic components. Conventionally, there are known cutting devices that cut resin-sealed substrates to form electronic components, and after cleaning, drying, and inspecting the electronic components, adsorb and transport the electronic components, housing them in a receiving section.

[0003] Patent Document 1 discloses a cutting device with a conveying mechanism. This conveying mechanism, after cutting a resin-sealed substrate (in Patent Document 1, a sealed substrate) to obtain multiple cut pieces (electronic components in Patent Document 1) in an alternating pattern on a mounting table (in Patent Document 1, a worktable), picks up and conveys the multiple cut pieces one by one. In the cutting device of Patent Document 1, when picking up and conveying the multiple cut pieces one by one, none of the cut pieces are fixed relative to the mounting table. It should be noted that "arranged in an alternating pattern" means that multiple cut pieces are placed in positions corresponding to one color in a checkerboard pattern.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-135259 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] For example, when a resin-sealed substrate with a film adhered to it is cut to form multiple cut pieces, the flash of the cut film may sometimes come into contact with and connect with the cut pieces adjacent to it on the front, back, left, and right sides. In such cases, when multiple cut pieces are adsorbed and transported every other one as described in Patent Document 1, the cut pieces connected to the adsorbed cut pieces on the front, back, left, and right sides (non-adsorbed) cut pieces via the flash may sometimes be transported together with the adsorbed cut pieces, leaving room for improvement. Furthermore, even if the non-adsorbed cut pieces are not transported, they may sometimes be pulled by the flash and moved from their proper positions, leaving room for improvement.

[0009] Therefore, it is desirable to have a method for manufacturing cut-off items, a fixture, and a cutting device that can only adsorb the desired cut-off items for transport and prevent other cut-off items from moving.

[0010] Solution for solving the problem

[0011] One embodiment of the method for manufacturing cut-up items disclosed herein includes: a single-piece step, in which a cut-up object is cut into multiple cut-up items by using a cutting mechanism; a fixing step, in which the multiple cut-up items are transferred together and fixed to a fixing fixture while maintaining the configuration of the single-piece cut-up items; a first conveying step, in which the fixing of a first cut-up item group consisting only of a portion of the multiple cut-up items fixed to the fixing fixture is released, and the first cut-up item group is adsorbed and conveyed to a receiving portion by a conveying mechanism; and a second conveying step, after the first conveying step, in which the fixing of a second cut-up item group consisting of a portion of the multiple cut-up items fixed to the fixing fixture that is different from the first cut-up item group is released, and the second cut-up item group is adsorbed and conveyed to the receiving portion by the conveying mechanism.

[0012] One embodiment of the fixing fixture disclosed herein fixes a plurality of cut pieces obtained by cutting a cutting object having a plurality of intersecting linear cutting portions in a state of maintaining the post-cutting configuration. The fixing fixture has a plurality of suction holes capable of individually fixing the plurality of cut pieces by suctioning air, and has a first suction path and a second suction path capable of independently allowing the suctioned air to flow through each other. Each of the plurality of suction holes is connected to the first suction path or the second suction path, and the suction hole corresponding to each of the plurality of non-adjacent cut pieces is connected to either the first suction path or the second suction path.

[0013] One embodiment of the cutting device disclosed herein includes: a cutting mechanism for cutting a plate-shaped object to be cut into a plurality of cut pieces by cutting the cutting portions of the object having a plurality of intersecting straight cutting portions; and a mounting platform including the aforementioned fixing fixture.

[0014] Invention Effects

[0015] According to embodiments of the present disclosure, a method for manufacturing cut-off items, a fixture, and a cutting device can be provided that can only adsorb and transport the desired cut-off items without moving other cut-off items. Attached Figure Description

[0016] Figure 1 It is a three-dimensional view showing the completed substrate and electronic components.

[0017] Figure 2 This is a top view showing the cutting device.

[0018] Figure 3 This is a top view showing the composition of the first plate.

[0019] Figure 4This is a top view showing the structure of the second plate.

[0020] Figure 5 This is a top view showing the composition of the third plate.

[0021] Figure 6 This is a top view showing the composition of the fourth panel.

[0022] Figure 7 This is a top view showing the structure of the base.

[0023] Figure 8 This is a sectional view of the mounting platform.

[0024] Figure 9 This is an explanatory diagram showing the adsorption state of the first and second cut-off groups onto the stage. Detailed Implementation

[0025] The following detailed description, using accompanying drawings, illustrates embodiments of the method for manufacturing the cut article, the fixing fixture, and the cutting device of this disclosure. It should be noted that the embodiments described below are merely examples for illustrating the method for manufacturing the cut article, the fixing fixture, and the cutting device; the method for manufacturing the cut article, the fixing fixture, and the cutting device are not limited to these embodiments. Therefore, the method for manufacturing the cut article, the fixing fixture, and the cutting device of this disclosure can be implemented in various ways without departing from their spirit.

[0026] A substrate containing semiconductor chips and other components is cut into monolithic pieces after being sealed in resin, and then used as an electronic component. A specialized cutting device is used to cut the resin-sealed substrate.

[0027] Resin sealing of a substrate is performed by fixing the substrate to a molding die (not shown) of a resin molding apparatus and molding the substrate with liquid molten resin supplied to the molding die. The molten resin can be either a thermoplastic resin or a thermosetting resin. Thermosetting resins decrease in viscosity upon heating and polymerize and solidify upon further heating, becoming cured resins. Ideally, thermosetting resins should be used for resin sealing of substrates with components such as semiconductor chips. The sealed resin protects the components fixed to the substrate.

[0028] [The structure of the completed substrate]

[0029] like Figure 1 As shown, the cutting device 1 in this embodiment (refer to...) is to be passed through... Figure 2The cut-off molded substrate Sb (an example of the object to be cut) is a lead frame 63 on which multiple components 61 are fixed. A resin layer 65 is formed on the side of the lead frame 63 where the multiple components 61 are fixed by a resin seal, and a protective film 67 (an example of a film) is adhered to this resin layer 65. The components 61 are, for example, integrated circuits (semiconductor chips). The protective film 67 has an adhesive layer (not shown) on its back side, composed of an adhesive or the like, thereby allowing it to adhere to the resin layer 65. Electrodes (not shown) are formed in the lead frame 63 and electrically connected to the components 61. The electrodes are exposed in the lead frame 63 on the side opposite to the resin layer 65.

[0030] exist Figure 1 In the diagram, multiple intersecting straight lines with double-dotted lines represent the cutting section 68 to be cut by the cutting device 1 (described later). It should be noted that in... Figure 1 In the upper right corner, the three items represent electronic components Sc (an example of cut products) cut from the molded substrate Sb by the cutting device 1 of this embodiment. It should be noted that, in addition to the lead frame 63, other substrates include semiconductor substrates such as silicon wafers, printed wiring substrates, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate can also be a carrier for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Wiring may or may not be implemented on the substrate. Each electronic component Sc has one element 61. Examples of electronic components Sc include BGA (Ball Grid Array), LGA (Land Grid Array), CSP (Chip Size Package), LED (Light Emitting Diode), and QFN (Quad Flat No-leaded). Furthermore, the molded substrate Sb in this embodiment is not limited to the lead frame 63 with the component 61 fixed and sealed with resin. The molded substrate Sb may be, for example, a wiring substrate with single or multiple layers of wiring implemented without the component 61 fixed and then sealed with resin. Furthermore, the object to be cut in this embodiment is not limited to the molded substrate Sb, and may also be a substrate that has not been sealed with resin.

[0031] exist Figure 1In the diagram, the cut electronic component Sc (diagonally above to the right) indicates a state where the protective film 67 still has residual flash 67a. The flash 67a is connected to the protective films 67 of other adjacent electronic components Sc (or the remaining molded substrate Sb) in the front, back, left, and right directions. That is, the electronic component Sc is connected to other adjacent electronic components Sc (or the remaining molded substrate Sb) in the front, back, left, and right directions via the flash 67a. Here, the electronic components Sc being "connected" to each other does not mean that the protective film 67 was not completely cut, but rather that the adhesive layer of the flash 67a of an electronic component Sc, created by cutting the protective film 67, is in contact with the protective films 67 or flash 67a of other adjacent electronic components Sc (or the remaining molded substrate Sb before monolithization) in a state of adhesive force.

[0032] [Composition of the cutting device]

[0033] Figure 2 This is a schematic top view of the cutting device 1 according to this embodiment. The cutting device 1 is configured to cut the molded substrate Sb into multiple electronic components Sc (see reference). Figure 1 Next, on both sides of the molded substrate Sb, the side protected by the protective film 67 will be sealed with resin. Figure 1 The side containing the resin layer 65 and the protective film 67 is called the surface, and the side opposite the surface is called the other side. Figure 1 The side of the plate containing the electrodes is called the back side. It should be noted that... Figure 2 The Z direction shown is the up-down direction. The arrangement direction of the cutting module A1 and the inspection and storage module B1 is the X direction. The direction perpendicular to the X and Z directions (the depth direction of each module) is the Y direction.

[0034] The cutting device 1 comprises a cutting module A1 and an inspection and storage module B1. The cutting module A1 manufactures multiple electronic components Sc by cutting the molded substrate Sb. The inspection and storage module B1 inspects each of the manufactured electronic components Sc, and then stores each electronic component Sc in a good product tray 15a (an example of a receiving section) or a defective product tray 15b (an example of a receiving section). In the cutting device 1, the cutting module A1 and the inspection and storage module B1 are detachable and interchangeable.

[0035] The control unit 50 of the cutting device 1 includes a processor such as a CPU (Central Processing Unit) and a storage device such as RAM (Random Access Memory) or ROM (Read Only Memory). The control unit 50 controls the operation of each part of the cutting module A1 and the inspection and storage module B1 of the cutting device 1 by executing a control program stored in the storage device using the processor. Unless otherwise specified, the operation of the cutting device 1 described below is based on the operating instructions of the control unit 50. In the following description, the operating instructions of the control unit 50 are generally omitted, but will be described as needed. It should be noted that in the cutting device 1 of this embodiment, the control unit 50, the monitor 20, and the sound output unit 25 are located in the cutting module A1, but they can be located in the cutting device 1 or in the inspection and storage module B1.

[0036] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting worktable 5, a spindle unit 6 (an example of a cutting mechanism), and a transfer unit 7. Furthermore, the cutting module A1 includes a portion of a first vacuum pump D1 and a second vacuum pump D2. It should be noted that the cutting device 1 may also include a water circulation device for circulating water. This water circulation device may be used, for example, to circulate cooling water for the cooling motor 6a, or to circulate cutting fluid or cleaning water used in the cutting process.

[0037] The substrate supply unit 3 pushes out the molded substrates Sb one by one from the hopper M1 that contains multiple molded substrates Sb and supplies them one by one to the positioning unit 4 with their surfaces (the side with the protective film 67) facing down.

[0038] The positioning unit 4 positions the molded substrate Sb by placing it on the guide rail 4a after it has been pushed out from the substrate supply unit 3. Then, the positioning unit 4 transfers the positioned molded substrate Sb to the cutting table 5.

[0039] The cutting stage 5 holds the molded substrate Sb to be cut. In this embodiment, the cutting module A1 has two cutting stages 5. A second vacuum pump D2 is connected to each of the two cutting stages 5 via a second flow path VR2.

[0040] Each cutting worktable 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the molded substrate Sb by adsorbing it from below and transferring it from the positioning part 4. Thus, the molded substrate Sb is fixed to the cutting worktable 5. Each cutting worktable 5 can move in the Y direction via the moving mechanism 5c.

[0041] Rotating mechanism 5b can cause retaining member 5a to move towards Figure 2 Rotate in the θ1 direction (i.e., make it in) Figure 2 (Rotation in the XY plane). The moving mechanism 5c enables the holding member 5a to rotate along... Figure 2 The movement along the Y-axis. The direction θ1 is the direction of rotation about the Z-axis.

[0042] The spindle section 6 comprises a motor 6a, a rotating shaft 6b, and a blade 8. The rotating shaft 6b outputs the rotational driving force of the motor 6a to the outside. The blade 8 is disposed at the top of the rotating shaft 6b. The spindle section 6 rotates the rotating shaft 6b by the rotational driving force, and the blade 8 rotates by the rotation of the rotating shaft 6b. The blade 8 rotates at high speed to cut the molded substrate Sb along the cutting section 68 (see reference). Figure 1 The substrate Sb is cut off, thereby monolithically dividing the formed substrate Sb into multiple electronic components Sc.

[0043] In this embodiment, the cutting module A1 has two spindle sections 6. The spindle sections 6 can move along... Figure 2 The X and Z axes can move. It should be noted that the cutting module A1 can also be configured to have a main spindle section 6.

[0044] The spindle section 6 is equipped with nozzles for cutting fluid, cooling water, and cleaning water (none shown). The cutting fluid nozzles spray cutting fluid onto the high-speed rotating cutting blade 8. The cooling water nozzles spray cooling water onto the cutting blade 8, which is heated by the cutting process, and the formed substrate Sb. The cleaning water nozzles spray cleaning water to remove chips and other debris. The sprayed cutting fluid, cooling water, and cleaning water are discharged to the outside of the cutting module A1.

[0045] The transfer unit 7 transfers all (if) the multiple electronic components Sc held on the cutting table 5 and cut into single pieces from above. Figure 1 For example, 21 components are adsorbed and maintained in their cut arrangement before being transferred together to the inspection workbench 11 of the inspection and storage module B1. A first vacuum pump D1 is connected to the transfer unit 7 via a first flow path VR1. The transfer unit 7 uses the first vacuum pump D1 to draw air to adsorb and maintain all of the multiple electronic components Sc.

[0046] The inspection and storage module B1 mainly comprises an inspection workbench 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15 (an example of a conveying mechanism). It should be noted that the first optical inspection camera 12 may also be located in the cutting module A1. Furthermore, the inspection and storage module B1 includes a portion of the first vacuum pump D1. That is, the first vacuum pump D1 exists across both the cutting module A1 and the inspection and storage module B1.

[0047] The inspection table 11 holds multiple electronic components Sc for optical inspection of the electronic components Sc. The inspection table 11 can move along... Figure 2 The X-axis movement is possible. Furthermore, the inspection stage 11 can be reversed vertically. The inspection stage 11 is equipped with a holding member (not shown) that holds multiple electronic components Sc by suction from a first vacuum pump D1.

[0048] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both sides (front and back) of the electronic component Sc. Various inspections of the electronic component Sc are performed based on the image data captured by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each configured to capture images from above near the inspection workbench 11.

[0049] Configuration unit 14 has a mounting platform 70, on which multiple electronic components Sc (refer to) are inspected. Figure 1 The cut arrangement is maintained and placed on the mounting stage 70. A first vacuum pump D1 is connected to the mounting stage 70 via a first flow path VR1. The configuration of the configuration unit 14 will be described later.

[0050] The extraction unit 15 adsorbs and holds a portion of the plurality of electronic components Sc disposed in the configuration unit 14, and conveys them to a tray. Electronic component Sc (refer to...) Figure 1 The extraction unit 15 classifies electronic components Sc into "good" or "defective" products based on the inspection results obtained using the first optical inspection camera 12 and the second optical inspection camera 13. Electronic components Sc judged as good are transported by the extraction unit 15 to the good product tray 15a, while electronic components Sc judged as defective are transported by the extraction unit 15 to the defective product tray 15b. The extraction unit 15 does not collect and transport all of the multiple electronic components Sc at once; instead, it repeatedly collects and transports portions of the multiple electronic components Sc to transport all of them.

[0051] The cutting device 1 also includes a monitor 20 and a sound output unit 25. The monitor 20 is configured to display images. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is, for example, a sound output device such as a speaker, a buzzer, or a bell.

[0052] [The Composition of the Configuration Department]

[0053] Next, use Figures 2 to 8 The configuration unit 14 will be explained. For example... Figure 2As shown, the configuration unit 14 comprises a mounting stage 70, a first flow path VR1, a first vacuum pump D1, and a switching valve 78. In this embodiment, the configuration unit 14 uses the first vacuum pump D1 to draw air in order to adsorb and fix multiple electronic components Sc onto the mounting stage 70. The mounting stage 70 has two independent suction paths for the drawn air to flow through. In this embodiment, the cutting device 1 for the electronic components Sc comprises at least a cutting worktable 5, a spindle 6, and the mounting stage 70.

[0054] like Figure 8 As shown, the mounting stage 70 includes a fixing fixture 75 and a base 76. The fixing fixture 75 is fixed to the base 76 by fixing members (screws, etc.). The fixing fixture 75 includes a fourth plate 74, a third plate 73, a second plate 72, a first plate 71, and a contact plate 77. These plates are stacked in this order and integrated by bonding or joining. The first plate 71 to the fourth plate 74 and the base 76 are all rectangular plates made of metal. Specifically, the first plate 71, the second plate 72, and the third plate 73 are made of stainless steel, and the fourth plate 74 and the base 76 are made of aluminum. The first plate 71, the second plate 72, and the third plate 73 are all of approximately the same thickness. The fourth plate 74 and the base 76 are thicker than the combined thickness of the first plate 71, the second plate 72, and the third plate 73. When viewed along the Z direction, the contact plate 77 has a smaller area than the first plate 71 and is rectangular in shape. In this embodiment, the short side of the rectangle of the mounting platform 70 is in the X direction, the long side is in the Y direction, and the stacking direction of the base 76, the fourth plate 74, the third plate 73, the second plate 72, the first plate 71, and the contact plate 77 is in the Z direction (see also...). Figure 2 ).

[0055] [Construction of the contact plate]

[0056] like Figure 8 As shown, the contact plate 77 of the fixing fixture 75 has an upper surface 77a (an example of a mounting surface) and a lower surface 77b, which is the opposite side of the upper surface 77a. The contact plate 77 is a plate-shaped member on which multiple electronic components Sc, after inspection, are fixed on the upper surface 77a. A suction hole 77c (an example of a suction hole) with a circular cross-section, extending from the upper surface 77a to the lower surface 77b, is formed on the contact plate 77 to suction each electronic component Sc. The suction holes 77c are formed at locations corresponding to each of the multiple electronic components Sc fixed to the contact plate 77, and the number of suction holes 77c is the same as the number of multiple electronic components Sc fixed. The multiple suction holes 77c are arranged side-by-side along the X and Y directions, respectively, and all have the same inner diameter. By using the resin-constructed contact plate 77, the electronic components Sc can be easily suctioned onto the fixing fixture 75 (contact plate 77).

[0057] [The Composition of the First Board]

[0058] like Figure 3 As shown, the first plate 71 of the fixing fixture 75 has a first upper surface 71a bonded to the lower surface 77b of the contact plate 77 and a first lower surface 71b that is the opposite side of the first upper surface 71a. Figures 3 to 5 In this embodiment, the area enclosed by the double-dotted line is the area for fixing multiple electronic components Sc. There are two areas enclosed by the double-dotted line, but the shape is not limited to this; there may be one area or three or more areas for fixing multiple electronic components Sc. The area enclosed by the double-dotted line is appropriately configured to match the number of areas for fixing multiple electronic components Sc formed on a molded substrate Sb.

[0059] The first plate 71 has a plurality of first suction holes 71c (an example of suction holes) that are circular through holes for drawing air. The first suction holes 71c, like the adsorption suction holes 77c of the contact plate 77, are formed at locations corresponding to each of the plurality of electronic components Sc, and the number of first suction holes 71c is the same as the number of the plurality of electronic components Sc fixed. The plurality of first suction holes 71c are arranged side-by-side along the X and Y directions, respectively, and all have the same inner diameter. That is, when the first plate 71 and the contact plate 77 are stacked, a through hole consisting of the adsorption suction holes 77c and the first suction holes 71c is formed from the upper surface 77a of the contact plate 77 to the first plate 71. By drawing air from the adsorption suction holes 77c and the first suction holes 71c, each of the plurality of electronic components Sc is adsorbed and fixed to the first upper surface 71a of the first plate 71 of the mounting stage 70.

[0060] A plurality of first grooves 71d (an example of a first suction path) are formed on the first lower surface 71b of the first plate 71. The plurality of first grooves 71d are formed at an angle in two directions relative to the Y direction.

[0061] Multiple first grooves 71d in the same direction are separated from each other. These multiple first grooves 71d in the same direction are interconnected via multiple first grooves 71d in other intersecting directions. Therefore, all the multiple first grooves 71d are interconnected. It should be noted that the groove depth of the first groove 71d is, for example, approximately half the thickness of the first plate 71. In the following description of the first plate 71 to the base 76, "connected" grooves and holes mean that air can flow through them.

[0062] The first groove 71d is formed parallel to the arrangement direction of the plurality of first suction holes 71c arranged side-by-side along the X and Y directions, which are positioned at mutually inclined positions. The first groove 71d and the plurality of first suction holes 71c positioned at mutually inclined positions overlap when viewed along the Z direction. In this embodiment, the width of the first groove 71d is equal to or slightly larger than the inner diameter of the first suction hole 71c. That is, the plurality of first suction holes 71c, which overlap with the first groove 71d, extend from the first upper surface 71a of the first plate 71 to the first groove bottom 71d1 of the first groove 71d (see reference). Figure 8 It is connected to the first groove 71d. Hereinafter, the first suction hole 71c that overlaps with the first groove 71d among the plurality of first suction holes 71c is referred to as the first suction hole 71c1 (an example of a suction hole).

[0063] By forming multiple first grooves 71d, a first protrusion 71e is formed in the portion adjacent to the first groove 71d but not in the first groove 71d. The first protrusion 71e protrudes relative to the first groove bottom 71d1 of the first groove 71d, and the top surface of the first protrusion 71e is the first lower surface 71b. The first protrusion 71e has a rhomboid shape when viewed along the Z direction. Multiple first protrusions 71e are formed on the first lower surface 71b of the first plate 71, and each first protrusion 71e is arranged separately from each other. This is because each of the multiple first protrusions 71e is divided by four first grooves 71d. Therefore, the multiple first protrusions 71e are arranged in two inclined directions relative to the X direction, along the direction in which the first groove 71d extends. In other words, a first groove 71d intersecting the inclined direction is arranged between two first protrusions 71e located in the inclined direction.

[0064] Each of the plurality of first protrusions 71e has a first suction hole 71c. That is, the first suction hole 71c disposed on the first protrusion 71e extends from the first upper surface 71a of the first plate 71 to the first lower surface 71b. Hereinafter, the first suction hole 71c disposed on the first protrusion 71e among the plurality of first suction holes 71c is referred to as the first suction hole 71c2 (an example of a suction hole).

[0065] In summary, among the plurality of first suction holes 71c arranged side by side along the X and Y directions, the first suction hole 71c located adjacent to any first suction hole 71c1 in both the X and Y directions is designated as the first suction hole 71c2, and the first suction hole 71c located in the inclined direction of the first suction hole 71c1 is designated as the first suction hole 71c1. Furthermore, among the plurality of first suction holes 71c arranged side by side along the X and Y directions, the first suction hole 71c located adjacent to any first suction hole 71c2 in both the X and Y directions is designated as the first suction hole 71c1, and the first suction hole 71c located in the inclined direction of the first suction hole 71c2 is designated as the first suction hole 71c2.

[0066] Four first suction ends 71f connected to the first groove 71d are formed near the long rectangular side of the first lower surface 71b of the first plate 71. The first suction ends 71f are grooves of the same depth as the first groove 71d, and the bottom of the first suction ends 71f is at the same depth as the bottom of the first groove 71d1.

[0067] [The Composition of the Second Board]

[0068] like Figure 4 As shown, the second plate 72 of the fixing fixture 75 has a second upper surface 72a and a second lower surface 72b, which is the opposite side of the second upper surface 72a. The second upper surface 72a of the second plate 72 has the same shape as the first lower surface 71b of the first plate 71. Specifically, when the second plate 72 and the first plate 71 are stacked, a second groove 72d (an example of a first suction path) with the same shape as the first groove 71d is formed in the second plate 72 at each location opposite to the plurality of first grooves 71d of the first plate 71. The groove depth of the second groove 72d is, for example, approximately half the thickness of the second plate 72. Furthermore, a second protrusion 72e with the same shape as the first protrusion 71e is formed in the second plate 72 at each location opposite to the plurality of first protrusions 71e of the first plate 71. Moreover, a second suction end 72f with the same shape as the first suction end 71f is formed in the second plate 72 at each location opposite to the four first suction ends 71f of the first plate 71. The second suction end 72f is connected to the second groove 72d. The shape of each of the second groove 72d, the second protrusion 72e, and the second suction end 72f is the same as the shape of each of the first groove 71d, the first protrusion 71e, and the first suction end 71f, so detailed description is omitted.

[0069] Each of the second protrusions 72e has a second suction hole 72c (an example of a suction hole) extending from the second upper surface 72a of the second plate 72 to the second lower surface 72b. The inner diameter of the second suction hole 72c is the same as the inner diameter of the adsorption suction hole 77c and the first suction hole 71c2. When the second plate 72, the first plate 71, and the contact plate 77 are stacked, the second suction hole 72c completely overlaps with the adsorption suction hole 77c and the first suction hole 71c2 when viewed along the Z direction. That is, when the second plate 72, the first plate 71, and the contact plate 77 are stacked, a through hole consisting of the adsorption suction hole 77c, the first suction hole 71c2, and the second suction hole 72c is formed from the upper surface 77a of the contact plate 77 to the second lower surface 72b of the second plate 72.

[0070] However, the second plate 72 and the second upper surface 72a differ from the first lower surface 71b of the first plate 71 in the following aspects. Specifically, a first suction hole 71c2 is formed in the first groove bottom 71d1 of the first groove 71d, while no through hole corresponding to the first suction hole 71c2 is formed in the second groove bottom 72d1 of the second groove 72d. Furthermore, in each of the four second suction ends 72f formed on the second upper surface 72a of the second plate 72, unlike the first suction ends 71f, a second suction end hole 72g (an example of the first suction path) is formed, extending from the second groove bottom 72d1 to the second lower surface 72b. The inner diameter of the second suction end hole 72g is larger than the inner diameter of the second suction hole 72c, for example, about 8 times.

[0071] [The Composition of the Third Board]

[0072] like Figure 5 As shown, the third plate 73 of the fixing fixture 75 has a third upper surface 73a and a third lower surface 73b, which is the opposite side of the third upper surface 73a. In the third upper surface 73a of the third plate 73, when the third plate 73 and the second plate 72 are stacked, a third suction end hole 73g (an example of the first suction path) is formed at a location opposite to each of the four second suction end holes 72g of the second plate 72, extending from the third upper surface 73a of the third plate 73 to the third lower surface 73b. That is, a total of four third suction end holes 73g are formed. The inner diameter of the third suction end hole 73g is the same as the inner diameter of the second suction end hole 72g. Therefore, in the state where the third plate 73 and the second plate 72 are stacked, a through hole formed by the second suction end hole 72g and the third suction end hole 73g is formed from the second groove bottom 72d1 of the second plate 72 to the third lower surface 73b of the third plate 73.

[0073] A plurality of third grooves 73d (an example of a second suction path) parallel to the Y direction of the third plate 73 are formed on the third lower surface 73b of the third plate 73. Furthermore, when the third plate 73 and the second plate 72 are stacked, a third suction hole 73c (an example of a suction hole) with the same diameter as the second suction hole 72c is formed at each location opposite to the plurality of second suction holes 72c. The third groove 73d is formed in the third suction hole 73c, extending from the third upper surface 73a of the third plate 73 to the bottom of the third groove 73d (see reference). Figure 8 Therefore, with the third plate 73, the second plate 72, the first plate 71, and the contact plate 77 stacked, a through hole (an example of a suction hole) consisting of interconnected suction holes 77c, first suction hole 71c2, second suction hole 72c, and third suction hole 73c is arranged from the upper surface 77a of the contact plate 77 to the bottom 73d1 of the third groove 73d of the third plate 73, and is connected to the third groove 73d. It should be noted that the third groove 73d is not connected to the third suction end hole 73g.

[0074] [The Composition of the Fourth Board]

[0075] like Figure 6 As shown, the fourth plate 74 of the fixing fixture 75 has a fourth upper surface 74a and a fourth lower surface 74b, which is the opposite side of the fourth upper surface 74a. In the fourth upper surface 74a of the fourth plate 74, when the fourth plate 74 and the third plate 73 are stacked, a fourth suction end hole 74g (an example of the first suction path) is formed at a location opposite to each of the four third suction end holes 73g of the third plate 73, extending from the fourth upper surface 74a to the fourth lower surface 74b. That is, a total of four fourth suction end holes 74g are formed. The inner diameter of the fourth suction end hole 74g is the same as the inner diameter of the third suction end hole 73g. Thus, with the fourth plate 74, the third plate 73 and the second plate 72 stacked, a through hole consisting of the second suction end hole 72g, the third suction end hole 73g and the fourth suction end hole 74g is formed from the second groove bottom 72d1 of the second plate 72 to the fourth lower surface 74b of the fourth plate 74.

[0076] With the fourth plate 74 and the third plate 73 stacked, in the fourth plate 74, in a suction region 74h that is opposite to the region of the third plate 73 where multiple third grooves 73d are formed, multiple fourth suction holes 74c (an example of a second suction path) are formed extending from the fourth upper surface 74a to the fourth lower surface 74b of the fourth plate 74. When viewed along the Z direction, the fourth suction holes 74c have a rectangular or triangular cross-sectional shape. The fourth suction holes 74c are formed approximately without gaps throughout the entire suction region 74h.

[0077] Multiple beams 74i are formed between adjacent fourth suction holes 74c. The multiple beams 74i are formed inclined in two directions relative to the Y direction. Multiple beams 74i in the same direction are separated from each other. Multiple beams 74i in the same direction are connected to each other via multiple beams 74i in other intersecting directions. The rectangular fourth suction hole 74c is divided by four beams 74i.

[0078] With the fourth plate 74 and the third plate 73 stacked, the third lower surface 73b of the third plate 73 (the top surface of the wall dividing the third groove 73d) contacts the fourth upper surface 74a (beam 74i) of the fourth plate 74. However, the opening on the third lower surface 73b side of the third suction hole 73c is exposed at the third groove bottom 73d1 of the third groove 73d. Therefore, even when the third lower surface 73b of the third plate 73 contacts the fourth upper surface 74a of the fourth plate 74, the opening on the third lower surface 73b side of the third suction hole 73c will not be blocked by the beam 74i of the fourth plate 74, and all the third suction holes 73c are connected to the fourth suction hole 74c. Therefore, when the fourth plate 74, the third plate 73, the second plate 72, the first plate 71 and the contact plate 77 are stacked, a through hole formed by the adsorption suction hole 77c, the first suction hole 71c2, the second suction hole 72c and the third suction hole 73c are connected to the fourth suction hole 74c from the upper surface 77a of the contact plate 77 to the fourth lower surface 74b of the fourth plate 74.

[0079] [The structure of the base]

[0080] like Figure 7 As shown, the base 76 of the mounting stage 70 has an upper surface 76a and a lower surface 76b, which is the opposite side of the upper surface 76a. In the upper surface 76a of the base 76, when the base 76 and the fourth plate 74 are stacked, a suction end hole 76g (an example of a first suction path) is formed at a location opposite each of the four fourth suction end holes 74g of the fourth plate 74, as a bottomed hole extending from the upper surface 76a of the base 76 to the middle of the thickness direction of the base 76. That is, a total of four suction end holes 76g are formed. The inner diameter of the suction end hole 76g is the same as the inner diameter of the fourth suction end hole 74g. Thus, with the base 76, the fourth plate 74, the third plate 73 and the second plate 72 stacked, a bottomed hole is formed from the second groove bottom 72d1 of the second plate 72 to the base 76, consisting of the second suction end hole 72g, the third suction end hole 73g, the fourth suction end hole 74g and the suction end hole 76g.

[0081] In the base 76, a first discharge hole 76m (an example of a first suction path) with a bottomed hole and a circular cross-section is formed from the lower surface 76b to the midway along the thickness direction. That is, the first discharge hole 76m does not extend to the upper surface 76a. Furthermore, a plurality of connecting holes 76p are formed between the upper surface 76a and the lower surface 76b of the base 76, connecting the four suction end holes 76g and the first discharge hole 76m. Specifically, two connecting holes 76p1 (an example of a first suction path) with bottomed connecting holes 76p are formed along the X direction in such a way that two suction end holes 76g arranged along the X direction are connected. In addition, two connecting holes 76p2 (an example of a first suction path) with bottomed connecting holes 76p are formed along the Y direction from the short side of the base 76 parallel to the X direction, in such a way that they intersect and connect with each of the two connecting holes 76p1. Furthermore, a connecting hole 76p3 (an example of the first suction path) is formed such that the bottom of each of the two connecting holes 76p2 is connected to the first discharge hole 76m, which is inclined relative to the Y direction. It should be noted that a plug 76q is provided at the end of the connecting holes 76p1, 76p2, and 76p3 that protrudes from the base 76. The plug 76q prevents air flowing in the connecting holes 76p from leaking to the outside of the mounting stage 70.

[0082] In the upper surface 76a of the base 76, a recess 76d (an example of the second suction path) is formed at the location opposite the suction region 74h of the fourth plate 74 when the base 76 and the fourth plate 74 are stacked. Multiple separately arranged support portions 76e are formed throughout the recess 76d. The top surface of the support portion 76e is the upper surface 76a, and the suction region 74h on the fourth lower surface 74b side of the fourth plate 74 is supported by the support portion 76e. Furthermore, a recessed bottom 76d1 (refer to) is formed at the bottom surface of the recess 76d of the base 76. Figure 8 A second discharge hole 76n (an example of a second suction path) with a circular cross-section is formed, extending from the concave bottom 76d1 to the lower surface 76b of the base 76.

[0083] Based on the above content, such as Figure 8As shown, with the base 76, the fourth plate 74, the third plate 73, the second plate 72, the first plate 71, and the contact plate 77 stacked, air can circulate from the upper surface 77a of the contact plate 77 to the lower surface 76b of the base 76 through the adsorption suction hole 77c, the first suction hole 71c1, the space divided by the first groove 71d and the second groove 72d, the second suction end hole 72g, the third suction end hole 73g, the fourth suction end hole 74g, the suction end hole 76g, the connecting hole 76p1, the connecting hole 76p2, the connecting hole 76p3, and the first discharge hole 76m. Hereinafter, the airflow path formed by the space divided by the first groove 71d and the second groove 72d, the second suction end hole 72g, the third suction end hole 73g, the fourth suction end hole 74g, the suction end hole 76g, the connecting hole 76p1, the connecting hole 76p2, the connecting hole 76p3, and the first discharge hole 76m will be referred to as the first suction path. The first suction path is connected to the adsorption suction hole 77c and the first suction hole 71c1. As described above, the first suction hole 71c, which is located in the inclined direction of the first suction hole 71c1, is the first suction hole 71c1. Therefore, the first suction path is configured to connect a plurality of first suction holes 71c1 that are located in the inclined direction when viewed along the Z direction.

[0084] Furthermore, with the base 76, fourth plate 74, third plate 73, second plate 72, first plate 71, and contact plate 77 stacked, air can circulate from the upper surface 77a of the contact plate 77 to the lower surface 76b of the base 76 via the adsorption suction hole 77c, first suction hole 71c2, second suction hole 72c, third suction hole 73c, third groove 73d, fourth suction hole 74c, recess 76d, and second discharge hole 76n. Hereinafter, the airflow path formed by the third groove 73d, fourth suction hole 74c, recess 76d, and second discharge hole 76n will be referred to as the second suction path. The second suction path is connected to the adsorption suction hole 77c, first suction hole 71c2, second suction hole 72c, and third suction hole 73c. ​​As described above, the first suction hole 71c, located in the inclined direction of the first suction hole 71c2, is called the first suction hole 71c2. Therefore, the second suction path is configured to connect a plurality of first suction holes 71c2 that are arranged in an inclined direction when viewed along the Z direction.

[0085] A first branch flow path VR11, which is part of the first flow path VR1, is connected to the opening on the lower surface 76b of the base 76 of the first discharge port 76m. That is, the first suction flow path is connected to the first branch flow path VR11. Furthermore, a second branch flow path VR12, which is part of the first flow path VR1, is connected to the opening on the lower surface 76b of the base 76 of the second discharge port 76n. That is, the second suction flow path is connected to the second branch flow path VR12. A switching valve 78 is connected to the ends of the first branch flow path VR11 and the second branch flow path VR12 on the opposite side of the mounting platform 70. Only one first flow path VR1 is arranged between the switching valve 78 and the first vacuum pump D1 (see reference). Figure 2 That is, the first branch flow path VR11 and the second branch flow path VR12 merge through the switching valve 78. In other words, the first flow path VR1 is branched into the first branch flow path VR11 and the second branch flow path VR12 through the switching valve 78 and connected to the base 76. The switching valve 78 is controlled by the control unit 50 to switch the airflow and blockage (stop flow) of the first branch flow path VR11 and the airflow and blockage (stop flow) of the second branch flow path VR12.

[0086] [Manufacturing methods for electronic components]

[0087] Next, use Figure 1 , Figure 2 , Figure 8 as well as Figure 9 A method for manufacturing electronic component Sc by cutting the molded substrate Sb using a cutting device 1 will be described. The method for manufacturing electronic component Sc includes a monolithization process, a fixing process, a first transport process, and a second transport process.

[0088] like Figure 2 As shown, the monolithization process is a process in which the molded substrate Sb is cut using the spindle section 6 to monolithize into multiple electronic components Sc. The fixing process is a process in which the multiple electronic components Sc are transferred and fixed together on the mounting stage 70 while maintaining the configuration of the monolithized electronic components Sc. The first transport process is to release the first cut group Sc1 (refer to) consisting of a portion of the multiple electronic components Sc fixed on the mounting stage 70. Figure 9 The first cut product group Sc1 is fixed in place, and the extraction unit 15 adsorbs and transports it to the good product tray 15a or the defective product tray 15b. The second transport step is to release the second cut product group Sc2 (refer to) which is composed of a portion of electronic components Sc that are different from the first cut product group Sc1 among the multiple electronic components Sc fixed to the mounting stage 70. Figure 9The first cut product group Sc1 and the second cut product group Sc2 are fixed, and the second cut product group Sc2 is adsorbed by the extraction unit 15 and transported to the good product tray 15a or the defective product tray 15b. Details about the first cut product group Sc1 and the second cut product group Sc2 will be described later.

[0089] first, Figure 1 After molding, the substrate Sb is placed with the side (surface) with the protective film 67 attached facing down. Figure 2 The cutting device 1 shown has a material box M1. The substrate supply unit 3 pushes out the molded substrates Sb one by one from the material box M1, which contains a plurality of molded substrates Sb, and supplies the molded substrates Sb one by one to the positioning unit 4.

[0090] The positioning unit 4 positions the molded substrate Sb by placing it on the guide rail 4a after it has been pushed out from the substrate supply unit 3. Then, the positioning unit 4 transfers the positioned molded substrate Sb to the cutting table 5.

[0091] After the molded substrate Sb is transferred to the cutting stage 5 or before the transfer, the second vacuum pump D2 is activated. When the second vacuum pump D2 is activated, the molded substrate Sb is adsorbed onto the holding member 5a and fixed to the cutting stage 5.

[0092] When the molded substrate Sb is adsorbed and fixed on the cutting table 5, the position of the molded substrate Sb is confirmed by taking a picture of the molded substrate Sb using a first position confirmation camera 5d. Then, the cutting table 5 moves along the Y-axis toward the spindle section 6. After the cutting table 5 moves downward toward the spindle section 6, the molded substrate Sb is moved along the cutting section 68 (see reference 68) by moving the cutting table 5 and the spindle section 6 relative to each other. Figure 1 The process involves cutting the components to obtain multiple monolithically processed electronic components Sc (monolithography process). Then, as needed, a second position confirmation camera 6c captures images of the multiple electronic components Sc to confirm their cut positions and widths.

[0093] After the substrate Sb is cut, the cutting table 5 moves along the Y-axis away from the main shaft 6 while holding multiple monolithized electronic components Sc. During this movement, the back side of the electronic components Sc is cleaned and dried by the first cleaner 5e.

[0094] Next, the transfer unit 7 picks up the electronic component Sc held on the cutting worktable 5 from above. The transfer unit 7 picks up the electronic component Sc and transfers it to the inspection worktable 11 of the inspection and storage module B1. During this transfer process, the surface of the electronic component Sc is cleaned and dried by the second cleaner 7a.

[0095] The inspection stage 11 holds the electronic component Sc so that it can be optically inspected by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection stage 11 is movable along the X-axis. In addition, the inspection stage 11 is capable of vertical rotation.

[0096] The first optical inspection camera 12 photographs the surface of the electronic component Sc, which is transferred to the inspection table 11 by the transfer unit 7. Then, the transfer unit 7 places the electronic component Sc on the holding member (not shown) of the inspection table 11. After the holding member holds the electronic component Sc, the inspection table 11 is reversed vertically. After the reversed inspection table 11 moves above the second optical inspection camera 13, the second optical inspection camera 13 photographs the back of the electronic component Sc.

[0097] After inspection, the multiple electronic components Sc, arranged as cut by the spindle section 6, are fixed to the contact plate 77 of the fixing fixture 75 on the mounting stage 70 of the placement section 14. In this embodiment, the multiple electronic components Sc are positioned with their back sides facing outwards. Figure 1 The electrode side of the mounting stage 70 is fixed to the contact plate 77 of the fixture 75 opposite to the electrode side of the mounting stage 70, and is placed in contact with the contact plate 77 (see also...). Figure 8 ). Figure 9 This diagram shows a plurality of electronic components Sc disposed on the mounting stage 70. The aforementioned first cut-off group Sc1 is one of the plurality of electronic components Sc disposed on the mounting stage 70. Figure 9 The group marked with an "×" indicates a collection of multiple electronic components Sc that are in a mutually inclined position (the cut-off portions 68 are not opposite each other). Furthermore, the second cut-off group Sc2 is... Figure 9 The collection of multiple electronic components Sc that are not marked with an × and are in a mutually inclined positional relationship (the cut sections 68 are not opposite each other). That is, each of the multiple electronic components Sc disposed on the stage 70 is included in the first cut section group Sc1 or the second cut section group Sc2.

[0098] Each of the multiple non-adjacent electronic components Sc is connected to either the first suction path or the second suction path via a corresponding suction hole. Specifically, the electronic components Sc of the first non-adjacent cut-off group Sc1 are disposed on the hole in the suction hole 77c of the contact plate 77 connected to the first suction path, which is connected to the first suction hole 71c1. The electronic components Sc of the first non-adjacent cut-off group Sc1 are disposed in a position that is inclined to each other. Furthermore, the electronic components Sc of the second non-adjacent cut-off group Sc2 are disposed on the hole in the suction hole 77c of the contact plate 77 connected to the second suction path, which is connected to the first suction hole 71c2. The electronic components Sc of the second non-adjacent cut-off group Sc2 are disposed in a position that is inclined to each other. That is, an electronic component Sc of a second cutting group Sc2 is disposed adjacent to the electronic component Sc of any first cutting group Sc1 in both the X and Y directions, and an electronic component Sc of the first cutting group Sc1 is disposed at an angle to the electronic component Sc of the first cutting group Sc1. In other words, the cutting portion 68 (refer to the main shaft portion 68) after the electronic components Sc of the first cutting group Sc1 and the electronic components Sc of the second cutting group Sc2, which are adjacent to each other in the X or Y directions, are cut by the main shaft portion 6. Figure 1 They are opposite to each other. In the first cut-off group Sc1, where the electronic components Sc are positioned in an inclined direction, or in the second cut-off group Sc2, the cut-off portions 68 are not opposite to each other.

[0099] In this state, within the mounting stage 70, the control unit 50 operates the first vacuum pump D1 and switches the switching valve 78 to draw air from both the first branch flow path VR11 connected to the first suction path and the second branch flow path VR12 connected to the second suction path. Thus, as... Figure 9 As shown in the left figure, the electronic components Sc of the first cut-off item group Sc1 and the electronic components Sc of the second cut-off item group Sc2 are both adsorbed and fixed on the stage 70 (adsorption ON).

[0100] Next, the control unit 50 switches the switching valve 78 in a manner that stops suction from the first branch flow path VR11 and only allows suction from the second branch flow path VR12 to continue. Thus, as... Figure 9 As shown in the right figure, the fixation of the first cut-off group Sc1 to the stage 70 is released (adsorption off), while the fixation of the second cut-off group Sc2 to the stage 70 continues (adsorption on).

[0101] like Figure 8As shown, with the first cut-up group Sc1 released from its fixation on the mounting table 70, the extraction unit 15 conveys the multiple electronic components Sc included in the first cut-up group Sc1, which are disposed on the mounting table 70, to the tray (first conveying step). The extraction unit 15 repeatedly performs the process of adsorbing and conveying a portion of the multiple electronic components Sc, thereby conveying all the electronic components Sc of the first cut-up group Sc1. At this time, the multiple electronic components Sc of the second cut-up group Sc2 are fixed to the mounting table 70. Therefore, even if the electronic components Sc of the first cut-up group Sc1 are connected to the electronic components Sc of the second cut-up group Sc2 via the burr 67a of the protective film 67, the electronic components Sc of the second cut-up group Sc2 will not move due to the conveying of the electronic components Sc of the first cut-up group Sc1. The burr 67a falls off from the electronic components Sc of the second cut-up group Sc2 and is conveyed together with the electronic components Sc of the first cut-up group Sc1.

[0102] Each electronic component Sc of the first cut-out group Sc1 conveyed to the extraction unit 15 is conveyed and contained in either a good product tray 15a or a defective product tray 15b based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. That is, the electronic components Sc of good products are contained in the good product tray 15a, and the electronic components Sc of defective products are contained in the defective product tray 15b.

[0103] When all the electronic components Sc included in the first cut-out group Sc1 are conveyed to the tray, the control unit 50 switches the switching valve 78 to stop suction from both the first branch flow path VR11 and the second branch flow path VR12. This releases the fixation of the second cut-out group Sc2 to the placement stage 70 (adsorption shutdown). Similarly to the first cut-out group Sc1, the extraction unit 15 conveys the multiple electronic components Sc included in the second cut-out group Sc2, disposed on the placement stage 70, to the good product tray 15a and the defective product tray 15b in a manner distinguishing between good and defective products (second conveying process). At this time, the extraction unit 15 also repeatedly performs the process of adsorbing and conveying a portion of the multiple electronic components Sc, thereby conveying all the electronic components Sc of the second cut-out group Sc2. Thus, all the multiple electronic components Sc obtained by monolithizing the molded substrate Sb are conveyed and accommodated in the good product tray 15a or the defective product tray 15b.

[0104] Thus, when multiple electronic components Sc are transported through the extraction unit 15, multiple electronic components Sc of the first cut-out group Sc1 are transported while the second cut-out group Sc2 is fixed in place by adsorption onto the mounting stage 70. Therefore, even if the burr 67a of the protective film 67 of the electronic component Sc of the first cut-out group Sc1 is connected to the protective film 67 or burr 67a of the electronic component Sc of the second cut-out group Sc2, which are positioned adjacent to each other in the X and / or Y directions, the electronic component Sc of the second cut-out group Sc2 will not move from the fixed position on the mounting stage 70 when the electronic component Sc of the first cut-out group Sc1 is transported. Therefore, the burr 67a of the electronic component Sc of the first cut-out group Sc1 separates from the electronic component Sc of the second cut-out group Sc2 and is transported together with the electronic component Sc of the first cut-out group Sc1. In this way, the electronic component Sc of the first cut-out group Sc1 can be adsorbed and transported without moving the electronic component Sc of the second cut-out group Sc2.

[0105] [Other Implementation Methods]

[0106] Hereinafter, other embodiments of the above-described embodiments will be described. It should be noted that, for ease of understanding, the same terms and reference numerals are used to describe the same components as in the above embodiments.

[0107] (1) In the above embodiment, the multiple electronic components Sc are configured such that the side with the electrode is facing and in contact with the first plate 71 of the stage 70, that is, the protective film 67 is disposed on the stage 70 in an upward state, but it can also be configured such that the protective film 67 is facing and in contact with the first plate 71.

[0108] (2) In the above embodiment, the multiple electronic components Sc are divided into a first cutting group Sc1 and a second cutting group Sc2. However, if the electronic components Sc of the same cutting group are not arranged in positions adjacent to the X and Y directions of the multiple electronic components Sc, they can also be divided into three or more cutting groups. In this case, the suction path also needs to be formed accordingly to the number of cutting groups.

[0109] (3) In the above embodiment, the electronic component Sc is disposed and fixed on the contact plate 77 of the stage 70, but it can also be configured such that the contact plate 77 is not provided, and the electronic component Sc is directly disposed on the first plate 71.

[0110] (4) In the above embodiment, a first groove 71d is formed in the first plate 71 and a second groove 72d is formed in the second plate 72 to form a first suction path. However, if the pressure loss of the suctioned air in the first suction path is small enough, the first suction path may be formed only in either the first groove 71d or the second groove 72d.

[0111] (5) In the above embodiment, one first suction hole 71c is provided relative to one electronic component Sc, but two or more first suction holes 71c may be provided relative to one electronic component Sc. In addition, the number of first suction holes 71c1 and first suction holes 71c2 relative to one electronic component Sc may be different.

[0112] (6) In the above embodiment, the electronic component Sc of the first cut-off group Sc1 is disposed on the adsorption suction hole 77c connected to the first suction hole 71c1, and the electronic component Sc of the second cut-off group Sc2 is disposed on the adsorption suction hole 77c connected to the first suction hole 71c2, but is not limited thereto. Alternatively, the electronic component Sc of the first cut-off group Sc1 may be disposed on the adsorption suction hole 77c connected to the first suction hole 71c2, and the electronic component Sc of the second cut-off group Sc2 may be disposed on the adsorption suction hole 77c connected to the first suction hole 71c1.

[0113] (7) In the above embodiment, the protective film 67 is only pasted on one side of the molded substrate Sb (the object to be cut), but it can also be pasted on both sides.

[0114] (8) In the above embodiment, a protective film 67 is attached to the molded substrate Sb (the object to be cut), but the cutting device 1 of the above embodiment is also effective for objects to be cut without the protective film 67 attached. In particular, it is useful when the object to be cut is a material that is prone to burrs when the object to be cut is monolithically processed, or when the burrs of adjacent electronic components are large and easy to join.

[0115] [Summary of the above embodiments]

[0116] Hereinafter, the manufacturing method of the cut-off piece (Sc), the fixing fixture (75), and the cutting device (1) described in the above embodiments will be explained in general.

[0117] <1> One embodiment of the manufacturing method for cut-off items (Sc) includes: a single-piece process, in which the object to be cut (Sb) is cut into multiple cut-off items (Sc) by using a cutting mechanism (5, 6); a fixing process, in which the multiple cut-off items (Sc) are transferred together and fixed to a fixing fixture (75) while maintaining the configuration of the multiple cut-off items (Sc) after single-piece cutting; and a first conveying process, in which only a portion of the multiple cut-off items (Sc) fixed to the fixing fixture (75) are released from the first group of cut-off items (Sc). The first cut item group (Sc1) is fixed, and the first cut item group (Sc1) is adsorbed by the conveying mechanism (15) and conveyed to the receiving part (15a, 15b); and the second conveying process is, after the first conveying process, the second cut item group (Sc2) consisting of a portion of cut items (Sc) that are different from the first cut item group (Sc1) among the multiple cut items (Sc) fixed to the fixing fixture (75) is released, and the second cut item group (Sc2) is adsorbed by the conveying mechanism (15) and conveyed to the receiving part (15a, 15b).

[0118] The manufacturing method of the cut-off piece (Sc) in this solution includes: a first conveying step in which the fixation of a first cut-off piece group (Sc1), consisting of only a portion of the cut-off pieces (Sc) fixed to the fixing fixture (75), is released, and the first cut-off piece group (Sc1) is adsorbed by the conveying mechanism (15) and conveyed to the receiving portion (15a, 15b); and a second conveying step in which, after the first conveying step, the fixation of a second cut-off piece group (Sc2), consisting of a portion of the cut-off pieces (Sc) different from the first cut-off piece group (Sc1) fixed to the fixing fixture (75), is released, and the second cut-off piece group (Sc2) is adsorbed by the conveying mechanism (15) and conveyed to the receiving portion (15a, 15b). Therefore, when conveying the cut-off pieces (Sc) included in the first cut-off piece group (Sc1), the cut-off pieces (Sc) included in the second cut-off piece group (Sc2) are kept fixed to the fixing fixture (75) by adsorption. Therefore, even if the cut items (Sc) included in the first cut item group (Sc1) and the cut items (Sc) included in the second cut item group (Sc2) are connected after being cut for some reason, the occurrence of adverse situations such as the cut items (Sc) included in the second cut item group (Sc2) being transported together or moved from the fixed location will be prevented when transporting the cut items (Sc) included in the first cut item group (Sc1).

[0119] <2> In the manufacturing method of the cut-off article (Sc) described in <1> above, it is preferable that the cut-off object (Sb) is plate-shaped, and a protective film (67) for the cut-off object (Sb) is attached to at least one plate surface of the cut-off object.

[0120] When the film (67) is adhered to the object to be cut (Sb), even after the object to be cut (Sb) is cut, there is a possibility that the flash (67a) of the film (67) of the cut pieces (Sc) included in the first cut pieces group (Sc1) remains connected to the cut pieces (Sc) included in the second cut pieces group (Sc2) in an adhesive state. In such a case, when transporting the cut pieces (Sc) included in the first cut pieces group (Sc1), an undesirable situation may occur where the cut pieces (Sc) included in the second cut pieces group (Sc2) are transported together or moved from their fixed location. However, according to the manufacturing method of the cut-off piece (Sc) of this solution, even when the cut-off piece (Sc) included in the first cut-off piece group (Sc1) and the cut-off piece (Sc) included in the second cut-off piece group (Sc2) are connected after being cut, the cut-off piece (Sc) included in the second cut-off piece group (Sc1) remains fixed to the fixing fixture (75) when the cut-off piece (Sc) included in the first cut-off piece group (Sc1) is being transported together or moved from the fixed location. Therefore, it is prevented that adverse situations such as the cut-off piece (Sc) included in the second cut-off piece group (Sc2) being transported together or moved from the fixed location are prevented.

[0121] <3> In the manufacturing method of the cut-off piece (Sc) described in <1> or <2> above, it is preferable that the fixing fixture (75) has a plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) that can individually fix the plurality of cut-off pieces (Sc) on the fixing fixture (75) by suctioning air. Each of the plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) is connected to a first suction path or a second suction path that can independently allow the suctioned air to flow through each other. In the first conveying process, the air flow in the first suction path is stopped, and in the second conveying process, the air flow in the second suction path is stopped.

[0122] Thus, the fixation and release of the cut-off items (Sc) included in the first cut-off item group (Sc1) to the fixing fixture (75) and the fixation and release of the cut-off items (Sc) included in the second cut-off item group (Sc2) to the fixing fixture (75) can be achieved by the simple method of independently controlling the airflow by setting the first suction path and the second suction path.

[0123] <4> One embodiment of the fixing fixture (75) fixes multiple cut pieces (Sc) obtained by cutting the cut portion (68) of a plate-shaped object (Sb) having multiple intersecting straight cut portions (68) in a state of maintaining the configuration after cutting, wherein the fixing fixture (75) has multiple suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) that can individually fix the multiple cut pieces (Sc) by suctioning air and has There are a first suction path and a second suction path that can independently allow air to be drawn in. Each of the plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) is connected to either the first suction path or the second suction path. Each of the plurality of non-adjacent cut-off pieces (Sc) has a corresponding suction hole (77c, 71c, 71c1, 71c2, 72c, 73c) connected to either the first suction path or the second suction path.

[0124] Therefore, the suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) of the corresponding fixing fixture (75) of each of the multiple cut pieces (Sc) that are not opposite to the cut portion (68) are connected to either the first suction path or the second suction path. Thus, by releasing the fixing fixture (75) from either the first suction path or the second suction path, the multiple cut pieces (Sc) whose cut portions (68) are not opposite to each other can be transported. Conversely, the multiple cut pieces (Sc) whose cut portions (68) are opposite to each other are kept in a state where one of them is fixed to the fixing fixture (75), so multiple cut pieces (Sc) are not transported at the same time. Therefore, even if the cut pieces (Sc) arranged in adjacent positions opposite to each other of the cut portions (68) are connected to each other after being cut by the cutting mechanism (6) for some reason, the occurrence of adverse situations such as the cut pieces (Sc) arranged in adjacent positions being transported together or moving from the fixed location is suppressed.

[0125] <5> In the fixing fixture (75) described in <4> above, it is preferable to have a contact plate (77), a first plate (71), a second plate (72), a third plate (73), and a fourth plate (74). The fixing fixture (75) is constructed by stacking the fourth plate (74), the third plate (73), the second plate (72), the first plate (71), and the contact plate (77) in this order from bottom to top. The side of the contact plate (77) opposite to the side where the first plate (71) is stacked is for placing the cut item (Sc). The mounting surface (77a) has a first suction path formed on at least one of the first plate (71) and the second plate (72), a second suction path formed on at least one of the third plate (73) and the fourth plate (74), suction holes (77c, 71c, 71c1) connected to the first suction path are formed on the contact plate (77) and the first plate (71), and suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are formed from the contact plate (77) to the third plate (73).

[0126] Thus, the first and second suction paths can be made independent of each other in the fixture (75) by simply stacking multiple plates.

[0127] <6> In the fixing fixture (75) described in <5> above, it is preferable that the first suction path is formed throughout the first plate (71) and the second plate (72).

[0128] Thus, a fixture (75) for fixing the cut-off piece (Sc) can be obtained, which increases the flow path cross-sectional area of ​​the first suction path and reduces the pressure loss of the air flowing through it.

[0129] <7> In the fixing fixture (75) described in <5> or <6> above, it is preferable that a plurality of grooves (73d) serving as a second suction path are formed on the surface of the third plate (73) opposite to the fourth plate (74), and the suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are connected to the plurality of grooves (73d).

[0130] Therefore, in the fixed fixture (75), when the third plate (73) and the fourth plate (74) are stacked, even if the third plate (73) and the fourth plate (74) are in contact, the suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are connected to multiple slots (73d), so the suction holes (77c, 71c, 71c2, 72c, 73c) will not be blocked by the fourth plate (74).

[0131] <8> One embodiment of the cutting device (1) includes: a cutting mechanism (6) that cuts the cutting portion (68) of a plate-shaped object (Sb) having multiple intersecting straight cutting portions (68) to cut it into a plurality of cut pieces (Sc); and a mounting table (70) including a fixing fixture (75) as described in any one of <4> to <7> above.

[0132] Thus, the cutting device (1) includes: a cutting mechanism (6) for cutting the cutting portion (68) of the plate-shaped object (Sb) into a plurality of cut pieces (Sc); and a mounting table (70) including a fixing fixture (75) for fixing the cut pieces (Sc). Thus, after moving and fixing the plurality of cut pieces (Sc) to the fixing fixture (75) on the mounting table (70) while maintaining the arrangement of the plurality of cut pieces (Sc), the plurality of cut pieces (Sc) with the cutting portion (68) not facing each other can be transported by releasing the fixing fixture (75) from either the first suction path or the second suction path.

[0133] This disclosure can be used for a method of manufacturing cut articles, a fixing fixture, and a cutting device.

[0134] Explanation of reference numerals in the attached figures

[0135] 1: Cutting device; 6: Main shaft (cutting mechanism); 15: Extraction section (conveying mechanism); 15a: Good product tray (accommodating section); 15b: Defective product tray (accommodating section); 61: Component; 67: Protective film (film); 68: Cutting section; 70: Placement stage; 71: First plate; 71c, 71c1, 71c2: First suction hole (suction hole); 71d: First groove (first suction path); 72: Second plate; 72c: Second suction hole (suction hole); 72d: Second groove (first suction path); 72g: Second suction end hole (first suction path); 73: Third plate; 73c: Third suction hole (suction hole); 73d: Third groove (second suction path); 73g: Third suction end hole (first suction path); 7 4: Fourth plate; 74c: Fourth suction hole (second suction path); 74g: Fourth suction end hole (first suction path); 75: Fixing fixture; 76d: Recess (second suction path); 76g: Suction end hole (first suction path); 76m: First discharge hole (first suction path); 76n: Second discharge hole (second suction path); 76p1: Connecting hole (first suction path); 76p2: Connecting hole (first suction path); 76p3: Connecting hole (first suction path); 77: Contact plate; 77a: Upper surface (placement surface); 77c: Adsorption suction hole (suction hole); Sb: Molded substrate (cutting object); Sc: Electronic component (cutting product); Sc1: First cutting product group; Sc2: Second cutting product group.

Claims

1. A method for manufacturing a cut article, comprising: The single-piece process involves using a cutting mechanism to cut the object into multiple pieces; In the fixing process, while maintaining the configuration of the multiple cut items after single-piece cutting, the multiple cut items are transferred together and fixed to the fixing fixture; In the first conveying process, the fixation of the first cut item group, which consists of a portion of the cut items among the plurality of cut items fixed to the fixing fixture, is released, and the first cut item group is adsorbed by the conveying mechanism and conveyed to the receiving part. as well as The second conveying process, after the first conveying process, involves releasing the fixation of a second cutting group, which is composed of a portion of the cutting items that are different from the first cutting group among the plurality of cutting items fixed to the fixing fixture, and then using the conveying mechanism to pick up the second cutting group and convey it to the receiving part.

2. The method for manufacturing a cut article according to claim 1, wherein, The object to be cut is plate-shaped, and a protective film is attached to at least one side of the plate surface of the object to be cut.

3. The method for manufacturing a cut article according to claim 1 or 2, wherein, The fixing fixture has multiple suction holes that can individually fix the multiple cut items to the fixing fixture by suctioning air, and each of the multiple suction holes is connected to a first suction path or a second suction path that allows the suctioned air to flow independently. In the first conveying process, the airflow in the first suction path is stopped; in the second conveying process, the airflow in the second suction path is stopped.

4. A fixing fixture that fixes a plurality of cut pieces obtained by cutting a cutting object having a plurality of intersecting linear cutting portions in a state that maintains the post-cutting arrangement, wherein, The fixing fixture has multiple suction holes that can individually fix the multiple cut items by suctioning air, and has a first suction path and a second suction path that allow the suctioned air to flow independently of each other. Each of the plurality of suction holes is connected to either the first suction path or the second suction path. The suction hole corresponding to each of the plurality of non-adjacent cut items is connected to either the first suction path or the second suction path.

5. The fixing fixture according to claim 4, wherein, The fixing fixture includes a contact plate, a first plate, a second plate, a third plate, and a fourth plate. The fixing fixture is constructed by stacking the fourth plate, the third plate, the second plate, the first plate, and the contact plate in this order from bottom to top. The side of the contact plate opposite to the side on which the first plate is stacked is the mounting surface for placing the cut item. The first suction path is formed in at least one of the first plate and the second plate, and the second suction path is formed in at least one of the third plate and the fourth plate. The suction hole connected to the first suction path is formed on the contact plate and the first plate, and the suction hole connected to the second suction path is formed from the contact plate to the third plate.

6. The fixing fixture according to claim 5, wherein, The first suction path is formed across the first plate and the second plate.

7. The fixing fixture according to claim 5 or 6, wherein, On the surface of the third plate opposite to the fourth plate, a plurality of grooves are formed to serve as the second suction path, and the suction holes connected to the second suction path are connected to the plurality of grooves.

8. A cutting device comprising: A cutting mechanism cuts a plate-shaped object to be cut into multiple cut pieces by cutting off the cutting portions of the plate-shaped object having multiple intersecting straight cutting portions; and The mounting platform includes the fixing fixture as described in any one of claims 4 to 7.

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