Substrate processing apparatus and substrate processing method

Abstract

The technology disclosed in this application is a separation technology for mixed vapor of IPA vapor and water vapor that has not been solved in the prior art. The substrate processing apparatus disclosed in this application includes: a processing chamber containing a processing tank storing pure water, wherein the substrate is immersed in the pure water for processing; an organic solvent vapor supply unit supplying organic solvent vapor into the processing chamber; a lift lifting the substrate while contacting the substrate with organic solvent vapor when removing the substrate immersed in pure water from the processing tank; a suction unit drawing in the mixed vapor generated in the processing chamber; and a separation membrane separating the pure water vapor and the organic solvent vapor in the mixed vapor drawn in by the suction unit; the mixed vapor includes pure water vapor and organic solvent vapor.

Description

Technical Field

[0001] The technology disclosed in this application relates to a technique for extracting organic solvents from a mixture of pure water and organic solvent vapors discharged during substrate processing. Substrates targeted for processing include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, substrates for flat panel displays (FPDs) such as organic EL (electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, substrates for optical disc drives, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FEDs), or substrates for solar cells. Background Technology

[0002] Previously, there was a known immersion-type substrate processing apparatus that immersed the substrate in a processing solution such as pure water (DIW) or a chemical solution during the substrate manufacturing process to process the substrate.

[0003] The immersion-type substrate processing apparatus includes a processing tank for storing a processing solution used to process the substrate. The substrate is then cleaned or subjected to other processing procedures within the processing tank.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2002-85943 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] While Patent Document 1 discloses a technique for concentrating IPA liquid from a mixture of IPA (isopropyl alcohol) liquid and pure water, it does not disclose a technique for concentrating a mixture of IPA vapor and water vapor.

[0009] The technology disclosed in this application was developed in view of the above-mentioned problems, and it focuses on the separation of mixed vapors of organic solvent vapor (IPA vapor) and water vapor, which has not been solved in the prior art.

[0010] Means for solving technical problems

[0011] The first aspect of the technology disclosed in this application is a substrate processing apparatus comprising: a processing chamber housing a processing tank containing pure water, wherein a substrate is immersed in the pure water for processing; an organic solvent vapor supply unit supplying organic solvent vapor to the processing chamber; a lifter lifting the substrate while contacting the organic solvent vapor with the substrate when removing the substrate immersed in the pure water from the processing tank; a suction unit drawing in mixed vapor generated in the processing chamber; and a separation membrane separating the pure water vapor and the organic solvent vapor from the mixed vapor drawn in by the suction unit; wherein the mixed vapor comprises both the pure water vapor and the organic solvent vapor.

[0012] The second aspect of the substrate processing apparatus disclosed in this application is the substrate processing apparatus as described in the first aspect, wherein the separation membrane is housed within a housing; the suction unit includes: a pipe that directly connects the processing chamber to the housing; a suction port installed at the connection between the processing chamber and the pipe; a pump that draws in the mixed vapor from the processing chamber via the suction port; and a valve that regulates the amount of mixed vapor drawn in by the pump.

[0013] The third-party substrate processing apparatus disclosed in this application is a substrate processing apparatus as described in the first or second embodiment, wherein the separation membrane is a zeolite membrane.

[0014] The fourth type of substrate processing apparatus disclosed in this application is a substrate processing apparatus as described in any of the first to third types, wherein it further comprises: a heater for heating the mixed vapor drawn in by the suction section; and a separation membrane for separating the vapor of pure water from the vapor of the organic solvent in the mixed vapor that has been heated by the heater.

[0015] The fifth type of substrate processing apparatus disclosed in this application is a substrate processing apparatus as described in any of the first to fourth types, wherein it further comprises: a cooler for cooling the vapor of the organic solvent that has been separated by the separation membrane.

[0016] The sixth aspect of the substrate processing apparatus disclosed in this application specification is a substrate processing apparatus as described in the first or second aspect, wherein it further comprises: a first tank for storing the organic solvent that has been separated by the separation membrane.

[0017] The seventh embodiment of the substrate processing apparatus disclosed in this application is a substrate processing apparatus as described in the first or second embodiment, wherein it further comprises: a second tank for storing the pure water that has been separated by the separation membrane.

[0018] The eighth aspect of the substrate processing apparatus disclosed in this application is a substrate processing apparatus as described in the first or second aspect, wherein the separation membrane allows the vapor of the pure water to pass through but does not allow the vapor of the organic solvent to pass through.

[0019] The ninth aspect of the technology disclosed in this application is a substrate processing method, comprising: a substrate immersion step, wherein the substrate is immersed in a processing tank containing pure water and housed in a processing chamber; an organic solvent vapor introduction step, performed concurrently with the substrate immersion step, wherein organic solvent vapor is supplied to the processing chamber; a lifting step, wherein the substrate immersed in the pure water is lifted from the processing tank; an organic solvent vapor replacement step, performed concurrently with the lifting step, wherein the pure water adhering to the substrate is replaced by the organic solvent vapor by supplying the organic solvent vapor to the processing chamber; and an organic solvent separation step, wherein at least a portion of the mixed vapor generated in the processing chamber by the organic solvent vapor replacement step is contacted with a separation membrane, thereby separating the organic solvent vapor from the mixed vapor; the organic solvent vapor replacement step and the organic solvent separation step are performed in parallel; the mixed vapor comprises vapor of the pure water and vapor of the organic solvent.

[0020] Invention Effects

[0021] According to at least a first method of the technology disclosed in this application, it is possible to separate the mixed vapor of IPA vapor and water vapor.

[0022] Furthermore, the objectives, features, aspects, and advantages related to the technology disclosed in this application will become clearer through the following detailed description and accompanying drawings. Attached Figure Description

[0023] Figure 1 This is a diagram that schematically illustrates the structure of a substrate processing apparatus according to an embodiment.

[0024] Figure 2 It is to show in detail Figure 1 A diagram illustrating an example of the structure of the dehydration section in the structure shown.

[0025] Figure 3 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0026] Figure 4This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0027] Figure 5 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0028] Figure 6 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0029] Figure 7 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0030] Figure 8 This is a diagram illustrating the operation of a substrate processing apparatus according to an embodiment.

[0031] Figure 9 This is a flowchart illustrating the operation of the substrate processing apparatus according to an exemplary embodiment.

[0032] Figure 10 This is a diagram illustrating the controlled objects of the control unit.

[0033] Figure 11 This is a graph showing the experimental results of the relationship between the change in IPA concentration and temperature in a mixture of IPA liquid (70 wt%) and pure water. Detailed Implementation

[0034] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features are shown for the purpose of technical explanation, but they are illustrative and not all of them are necessary for carrying out the embodiments.

[0035] Furthermore, the accompanying drawings are schematic; for ease of explanation, structures may be omitted or simplified as appropriate. Also, the relative sizes and positions of structures shown in different drawings are not necessarily accurately depicted and can be appropriately modified. Additionally, in drawings other than sectional views, such as top views, shading lines are sometimes used to facilitate understanding of the embodiments.

[0036] Furthermore, in the following description, the same structural elements are illustrated with the same reference numerals, and their names and functions are also the same. Therefore, to avoid repetition, detailed descriptions of them are sometimes omitted.

[0037] Furthermore, in the descriptions contained in this application, when a structural element is described as "possessing," "comprises," or "has," unless otherwise specified, it does not constitute an exclusive statement excluding the existence of other structural elements.

[0038] Furthermore, in the description described in this application, even if ordinal numbers such as "first" or "second" are sometimes used, these terms are used to facilitate understanding of the content of the embodiments, and the content of the embodiments is not limited to the order that may arise from these ordinal numbers.

[0039] [Implementation Method]

[0040] The substrate processing apparatus of this embodiment will now be described.

[0041] [Structure of the substrate processing device]

[0042] Figure 1 This is a schematic diagram illustrating the structure of the substrate processing apparatus according to this embodiment. Figure 1 In the figure, a plurality of substrates 12 are arranged parallel to the drawing surface. Furthermore, substrates 12 arranged in the same manner can also be used in… Figure 1 The Y-axis direction is arranged in multiples.

[0043] like Figure 1 As illustrated, the substrate processing apparatus 1 includes a substrate processing unit 18, an IPA vaporization unit 16, a dehydration unit 20, and a control unit 22. The substrate processing unit 18 includes a processing tank 14.

[0044] The substrate processing unit 18 includes a processing chamber 18A and a processing tank 14. In the substrate processing unit 18, a substrate 12 is immersed in a processing liquid in the processing tank 14 to process the substrate 12. The substrate 12 is lowered while being held in an upright position by a lift 14C, and for example, multiple substrates 12 are immersed in the processing liquid at one time for processing.

[0045] The processed substrate 12 is lifted vertically upward by the elevator 14C and removed from the processing tank 14.

[0046] The processing tank 14 is a container for storing the processing solution 30 used to process the substrate 12. The substrate 12 is immersed in the processing solution 30 stored in the processing tank 14, thereby performing cleaning and other processes on the substrate 12. The processing solution 30 is, for example, pure water or phosphoric acid used as an etching solution.

[0047] A processing liquid discharge section 14A and a drain pipe 14B are provided at the bottom of the processing tank 14, with the drain pipe 14B connected to the processing liquid discharge section 14A. During quick dump rinsing (QDR) processing, the processing liquid discharge section 14A rapidly discharges the processing liquid in the processing tank 14 through the drain pipe 14B. The quick dump rinsing is repeated, for example, three times, for multiple substrate assemblies.

[0048] like Figure 1As illustrated, the substrate processing unit 18 is connected to the supply pipe 42, the branch pipe 44, the branch pipe 46, and the branch pipe 48. Then, IPA (isopropyl alcohol) vapor is supplied to the substrate processing unit 18 from the pipe 40, and nitrogen (N2) is supplied to the substrate processing unit 18 from the nitrogen supply pipe 50.

[0049] Furthermore, the processing chamber 18A of the substrate processing unit 18 is directly connected to the discharge pipe 54. An intake port 18B is installed at the connection between the processing chamber 18A and the discharge pipe 54. The substrate processing unit 18 discharges gas from the processing chamber 18A via the discharge pipe 54. That is, gas from the processing chamber 18A is exhausted through the discharge pipe 54.

[0050] like Figure 10 As shown, the control unit 22 appropriately controls the operation of the substrate processing unit 18 (e.g., processing liquid discharge unit 14A, elevator 14C), the IPA vaporization unit 16 (e.g., heating device (HE) 16A), the dehydration unit 20 (e.g., heater 24, cooler 26 described later), and the valves and pumps 54A provided in each pipe.

[0051] The control unit 22 is configured, for example, by a conventional computer with electrical circuitry. As an example, the control unit 22 may include the following components: a CPU (Central Processing Unit), which serves as a central processing unit for performing various arithmetic operations (data processing); ROM (Read Only Memory), which stores basic programs; RAM (Random Access Memory), which is used as a working area when the CPU performs predetermined processing (data processing); a storage device, which is a non-volatile storage device such as flash memory or hard disk drive; and bus lines that connect these components to each other. A program may also be stored in the storage device or RAM, specifying the processing to be performed by the control unit 22. In this case, for example, the CPU may execute the program, thereby controlling each part of the board processing apparatus 1 and performing the processing specified by the program within the board processing apparatus 1. That is, the CPU may execute the program, thereby implementing circuitry in the control unit 22 for performing the processing specified by the program. In addition, the control unit 22 can also execute (implement) part or all of the control performed by the control unit 22 (part or all of the circuit implemented by the control unit 22) through dedicated logic circuits or other hardware.

[0052] exist Figure 1In this process, nitrogen supply source 2 supplies nitrogen via nitrogen supply pipe 50. Nitrogen supply pipe 50 is equipped with: a filter 50A to remove particles from the supplied nitrogen; a valve 50B to regulate the flow rate of the supplied nitrogen via control unit 22; and a heating device 50C to heat the supplied nitrogen via control unit 22. The set temperature of heating device 50C is, for example, 60°C. Nitrogen supply pipe 50 is connected to supply pipe 42, and the nitrogen flowing in nitrogen supply pipe 50 further flows towards supply pipe 42. Furthermore, nitrogen is supplied to substrate processing unit 18 via branch pipes 44 and 46 branching from supply pipe 42. Supply pipe 42 is equipped with: a heating device 42B to heat the gas flowing in supply pipe 42 via control unit 22; and a valve 42A to regulate the flow rate of the gas flowing in supply pipe 42 via control unit 22. The set temperature of the heating device 42B is, for example, 80°C. A valve 44A is provided in the branch pipe 44, which regulates the flow rate of gas flowing from the supply pipe 42 branching to the branch pipe 44 under the control of the control unit 22. A valve 46A is provided in the branch pipe 46, which regulates the flow rate of gas flowing from the supply pipe 42 branching to the branch pipe 46 under the control of the control unit 22; and a heating device 46B is provided to heat the gas flowing in the branch pipe 46 under the control of the control unit 22. The set temperature of the heating device 46B is, for example, 80°C. Furthermore, a branch pipe 48 branches from the branch pipe 46; nitrogen flowing in the branch pipe 48 is supplied to the substrate processing unit 18. A valve 48A is provided in the branch pipe 48, which regulates the flow rate of gas flowing from the branch pipe 46 branching to the branch pipe 48 under the control of the control unit 22.

[0053] IPA supply source 4 supplies IPA (liquid) via IPA supply piping 38. IPA supply piping 38 is equipped with: valve 38A, which regulates the flow rate of the supplied IPA liquid by control unit 22; and filter 38B, which removes particles and the like from the supplied IPA liquid.

[0054] The IPA vaporization unit 16 includes a heating device 16A, a tank 16B, a valve 38A, a filter 38B, and a valve 40A. It vaporizes liquid IPA supplied from the IPA supply source 4 via the IPA supply pipe 38 and supplies the IPA vapor to the processing chamber 18A via the pipe 40. The IPA vaporization unit 16 is connected to the heating device 16A; in the IPA vaporization unit 16, the heating device 16A heats the liquid IPA, thereby vaporizing the IPA. The set temperature of the heating device 16A is, for example, 70°C.

[0055] IPA vapor, already vaporized in the IPA vaporization section 16, flows from pipe 40 to supply pipe 42, and is further supplied to substrate processing section 18 via branch pipes 44 and 46, which branch off from supply pipe 42. Furthermore, branch pipe 48 branches off from branch pipe 46; IPA vapor flowing in branch pipe 48 is supplied to processing chamber 18A. The organic solvent vapor supply section includes the IPA vaporization section 16, pipe 40, supply pipe 42, branch pipe 44, and branch pipe 46.

[0056] The IPA vapor supplied to the processing chamber 18A mixes with water vapor to form a mixed vapor, which is then drawn into the dehydration section 20 via the intake port 18B and the discharge pipe 54. The discharge pipe 54 is equipped with a pump 54A, which introduces the mixed vapor from the processing chamber 18A and directs it to the dehydration section 20; and a valve 54B, which regulates the flow rate of the mixed vapor flowing to the discharge pipe 54 under the control of the control unit 22. The intake section 1005 is constituted by the discharge pipe 54, the intake port 18B, the pump 54A, and the valve 54B. The intake section 1005 draws in the mixed vapor from the processing chamber 18A. Furthermore, the reason for generating water vapor in the processing chamber 18A will be explained later.

[0057] The dehydration unit 20 dehydrates the mixture of water vapor and IPA vapor drawn in through the discharge pipe 54, ultimately separating it into pure water and IPA. Next, the separated pure water (water vapor) is vented through the exhaust pipe 58, and the separated IPA vapor is recovered to the recovery tank 1000 through the recovery pipe 56. Alternatively, the IPA concentrate can be discharged from the recovery tank 1000 via a drain pipe (not shown) instead of being reused in substrate processing; the IPA concentrate recovered to the recovery tank 1000 can also be reused in substrate processing as needed. Specifically, when the IPA concentrate is reused in substrate processing, the control unit 22 controls the supply of IPA (liquid) through the connecting pipe 1000A (connecting the recovery tank 1000 and the IPA supply source 4) using the valve 1000B provided on the connecting pipe 1000A, while simultaneously supplying IPA liquid for substrate processing. Pure water (water vapor), separated from the mixed vapor by the dehydration unit 20, is exhausted to the exhaust tank 1002 via the exhaust pipe 58. A valve 56A is provided in the recovery pipe 56, which regulates the flow rate of IPA vapor flowing to the recovery pipe 56 under the control of the control unit 22. A valve 58A is provided in the exhaust pipe 58, which regulates the flow rate of water vapor flowing to the exhaust pipe 58 under the control of the control unit 22. Valves 56A and 58A are switched on and off. This switching allows control, for example, to open valve 56A only when the mixed gas containing IPA vapor is dehydrated by the dehydration unit 20, thereby recovering only IPA (liquid) to the recovery tank 1000.

[0058] Figure 2 To express in detail Figure 1 A diagram illustrating an example of the structure of the dehydration section 20 in the shown structure. (See diagram for example.) Figure 2In the example shown, the dehydration unit 20 mainly includes: a heater 24 for heating the mixed steam supplied via the discharge pipe 54; a separation membrane 23 for separating pure water (water vapor) and IPA (vapor) from the mixed steam heated by the heater 24; and a cooler 26 for cooling the IPA vapor separated by the separation membrane 23. Furthermore, within the dehydration unit 20, a branch pipe 1004, branching from the discharge pipe 54, connects the upstream side of the heater 24 and the downstream side of the separation membrane 23, forming a detour path. This detour path is used to exhaust the gas supplied from the discharge pipe 54 without passing through the separation membrane 23. Downstream of the section connecting the discharge pipe 54 and the branch pipe 1004, a valve 54C is provided on the discharge pipe 54, and a valve 1004A is provided on the branch pipe 1004. The opening and closing of these valves are controlled by the control unit 22, thereby allowing selection of the path via the separation membrane 23 and the path without passing through the separation membrane 23. The heater 24, the separator 23, and the cooler 26 are housed within the casing 20A. The casing 20A is directly connected to the discharge pipe 54. The pure water (water vapor) separated by the separator 23 is discharged via the exhaust pipe 58. The IPA liquid, which has been liquefied by the cooler 26, is recovered to the recovery tank 1000 via the recovery pipe 56.

[0059] The separation membrane 23 is, for example, a zeolite membrane formed from zeolite. The separation membrane 23 allows water vapor to pass through but prevents IPA vapor from passing through. Zeolite, for example, has a tetrahedral basic unit (e.g., containing (SiO4)). 4- And (AlO4) 5- A crystalline structure formed by linking together at least one of the basic units of the zeolite membrane. The IPA concentration corresponding to the zeolite membrane is 50 wt% to 99 wt%. The separation membrane 23 is assumed to separate water molecules from IPA molecules by utilizing the size difference between water molecules and IPA molecules (allowing only water molecules to pass through), and is used when the IPA concentration (reference concentration) in the liquid is 50 wt% or higher. The higher the temperature of the liquid or gas through which the separation membrane 23 passes, the better the separation performance. According to this embodiment, the higher the temperature of the mixed vapor passing through the separation membrane 23, the better the adsorption of water molecules in the mixed vapor to the pores (crystallization gaps) of the separation membrane 23.

[0060] Furthermore, the separation membrane 23 is not limited to a zeolite membrane. For example, the separation membrane 23 can also be an organic separation membrane. Organic separation membranes are, for example, organic membranes formed from polyvinyl alcohol, chitosan, polyimide, etc. The IPA concentration corresponding to the organic separation membrane is 70 wt% to 99 wt%. Furthermore, the separation membrane 23 can also be a CNT (carbon nanotube) separation membrane. CNT separation membranes are, for example, membranes obtained by adding carbon nanotubes to a membrane such as polyamide. The IPA concentration corresponding to the CNT separation membrane is 5 wt% to 10 wt%. Furthermore, the separation membrane 23 can also be formed of a two-dimensional material. Two-dimensional materials are materials composed of a single atomic layer, specifically, composite atomic layer compounds composed of molybdenum sulfide (MOS2), early transition metals (titanium, vanadium, etc.), and light elements (carbon or nitrogen). The IPA concentration corresponding to the two-dimensional material separation membrane is 70 wt% to 99 wt%. Furthermore, the separation membrane 23 can also be formed of MOF (Metal Organic Frameworks) materials or carbon materials (such as graphene, graphene oxide, etc.). The IPA concentration corresponding to the MOF material separation membrane is 5 wt% to 99 wt%. The IPA concentration corresponding to the carbon material separation membrane is 70 wt% to 99 wt%. The type of separation membrane 23 can be set according to the IPA concentration of the mixed vapor.

[0061] [Operation of the substrate processing device]

[0062] Next, refer to Figures 3 to 9 The operation of the substrate processing apparatus in this embodiment will be explained. Here, Figures 3 to 8 This is a diagram illustrating the operation of the substrate processing apparatus according to this embodiment. Furthermore, Figure 9 This is a flowchart illustrating the operation of the substrate processing apparatus according to this embodiment. Furthermore, the operation of the substrate processing apparatus is performed by the control unit 22.

[0063] First, a substrate immersion process is performed on the multiple substrates 12 after the chemical treatment is completed. The substrate immersion process involves immersing the multiple substrates 12 in pure water in the processing tank 14 of the substrate processing unit 18 for cleaning.

[0064] like Figure 3In the example shown, while multiple substrates 12 are immersed in the processing liquid, nitrogen gas is supplied to the processing chamber 18A of the substrate processing section 18 while the pressure inside the processing chamber 18A of the substrate processing unit 18 is reduced by a pump 54A via a discharge pipe 54. Figure 9 Step ST1). In Figure 3 In this process, nitrogen gas is supplied from nitrogen supply source 2 to the processing chamber 18A of substrate processing unit 18 via nitrogen supply pipe 50, supply pipe 42, branch pipe 44, and branch pipe 46 (the path where valves 50B, 44A, and 46A are open). However, nitrogen gas may also be supplied to processing chamber 18A via a path other than those described above. For example, nitrogen gas may be supplied to processing chamber 18A via a path that does not branch from supply pipe 42, or nitrogen gas may be supplied to processing chamber 18A via the path supplied from branch pipe 48 (the path where valves 42A and 48A are open). The gas in processing chamber 18A that is vented from exhaust pipe 54 is vented from exhaust pipe 58 in dehydration unit 20 via branch pipe 1004 (the path where valves 54B, 1004A, and 58A are open). Through this process, processing chamber 18A is filled with nitrogen gas. The process in step ST1 takes, for example, 40 to 45 seconds.

[0065] Next, as Figure 4 The example shown performs the following: In the organic solvent vapor introduction process, while multiple substrates 12 are immersed in the processing liquid, IPA vapor is supplied to the processing chamber 18A of the substrate processing section 18 via a discharge pipe 54 after the pressure inside the chamber is reduced by a pump 54A. Figure 4 In this process, IPA, which is pre-supplied from IPA supply source 4 to IPA vaporization unit 16, is heated and vaporized by heating device 16A, and then supplied to processing chamber 18A of substrate processing unit 18 via pipe 40, supply pipe 42, branch pipe 44, and branch pipe 46 (the path where valves 40A, 44A, and 46A are open). However, IPA vapor may also be supplied to processing chamber 18A via a path other than the above-mentioned path. For example, IPA vapor may be supplied to processing chamber 18A via a path that does not branch from supply pipe 42, or IPA vapor may be supplied to processing chamber 18A via a path supplied from branch pipe 48 (the path where valves 42A and 48A are open). The gas (nitrogen) in the processing chamber 18A, which is vented from the exhaust pipe 54, is vented from the dehydration section 20 via the branch pipe 1004 and then from the exhaust pipe 58 (the path of valve 54B, valve 1004A, and the opening of valve 58A). This process ( Figure 9 In step ST2, the nitrogen in the treatment chamber 18A is replaced with high-temperature IPA vapor.

[0066] Next, as Figure 5 In the example shown, IPA vapor is supplied into the processing chamber 18A while venting is stopped from the processing chamber 18A of the substrate processing unit 18. Figure 9 (Step ST3 process). Figure 5 In this process, the IPA in the IPA vaporization section 16 is heated and vaporized by the heating device 16A, and then supplied to the processing chamber 18A of the substrate processing section 18 via the paths of pipe 40, supply pipe 42, branch pipe 44, and branch pipe 46. However, IPA vapor can also be supplied to the processing chamber 18A via paths other than those described above. For example, IPA vapor can be supplied to the processing chamber 18A via a path that does not branch from the supply pipe 42, or IPA vapor can be supplied to the processing chamber 18A via a path supplied from the branch pipe 48. Through this process, the processing chamber 18A is filled with IPA vapor.

[0067] Next, as Figure 6 The example shown involves performing a lifting process and simultaneously performing an organic solvent vapor replacement process. Figure 9 In step ST4), the lifting process removes the plurality of substrates 12 from the processing tank 14 into the processing chamber 18A, and the organic solvent vapor replacement process supplies IPA vapor into the processing chamber 18A. Figure 6 In the process, the IPA in the IPA vaporization section 16 is heated and vaporized by the heating device 16A, and then supplied to the processing chamber 18A of the substrate processing section 18 via the paths of pipe 40, supply pipe 42, branch pipe 44, and branch pipe 46. However, IPA vapor can also be supplied to the processing chamber 18A via paths other than those described above. For example, IPA vapor can be supplied to the processing chamber 18A via a path that does not branch from the supply pipe 42, or IPA vapor can be supplied to the processing chamber 18A via a path supplied from the branch pipe 48. Through this organic solvent vapor replacement process, the pure water adhering to the substrate 12 lifted from the processing tank 14 is replaced with IPA vapor. At this time, the high-temperature IPA vapor in the processing chamber 18A comes into contact with the pure water, thereby heating and evaporating the pure water adhering to the substrate 12, and generating a mixed vapor of IPA vapor and water vapor. The organic solvent vapor replacement process continues for a predetermined replacement time (e.g., 10 seconds to 50 seconds).

[0068] In this embodiment, the gas extraction process is performed in parallel with the organic solvent vapor replacement process. Figure 9In step ST5), during the suction process, while the pressure inside the processing chamber 18A of the substrate processing unit 18 is reduced using pump 54A via discharge pipe 54, valve 54B is opened to draw in (exhaust) a mixture of IPA vapor and water vapor from the processing chamber 18A through suction port 18B to discharge pipe 54. The mixed vapor drawn in from suction port 18B is then transported to the dehydration unit 20 via discharge pipe 54.

[0069] When valve 54C is opened, the mixture of IPA vapor and water vapor in the processing chamber 18A, which is vented from the discharge pipe 54 (and drawn in from the intake port 18B), is transported to the dehydration section 20 and a heating process is performed. Figure 9 Step ST6), the heating process involves heating the mixed vapor in heater 24. The mixed vapor heated in step ST6 is then brought into contact with at least a portion of the separation membrane 23, thereby separating (extracting) the vapor of the organic solvent (IPA). Figure 9 Step ST7). That is, an organic solvent separation process is performed, in which the mixed vapor is brought into contact with at least a portion of the separation membrane 23, thereby separating (extracting) the vapor of the organic solvent from the mixed vapor. Next, the separated water vapor is vented via exhaust pipe 58 (the path where valves 54B, 54C, and 58A are open), and a cooling process is performed on the separated IPA vapor via cooler 26 to liquefy the IPA vapor, which is then recovered as IPA liquid to recovery tank 1000 via recovery pipe 56 (with valve 56A open). Figure 9 In step ST8).

[0070] Furthermore, the process of step ST4 is performed in parallel with the processes of steps ST5 to ST8. Therefore, in this embodiment, the mixed vapor generated in the processing chamber 18A in the organic solvent vapor replacement process (step ST4) is separated into IPA vapor and water vapor. The IPA vapor is liquefied and stored as IPA liquid, and the water vapor is vented.

[0071] In the organic solvent vapor replacement process, if the replacement time has elapsed, the supply of IPA vapor to the processing chamber 18A shall be stopped.

[0072] Next, the IPA vapor removal process is performed. Figure 9In step ST9), while the substrate 12 is lifted, nitrogen gas is supplied to the processing chamber 18A of the substrate processing unit 18 by depressurizing the pressure inside the processing chamber 18A of the substrate processing unit 18 via the discharge pipe 54 using the pump 54A, thereby replacing the IPA vapor in the processing chamber 18A with nitrogen gas. Nitrogen gas is supplied to the processing chamber 18A of the substrate processing unit 18 from the nitrogen supply source 2 via the nitrogen supply pipe 50, supply pipe 42, branch pipe 44, and branch pipe 46 (the path where valves 50B, 44A, and 46A are open). However, nitrogen gas may also be supplied to the processing chamber 18A via a path other than the above-mentioned path. For example, nitrogen gas may be supplied to the processing chamber 18A via a path that does not branch from the supply pipe 42, or nitrogen gas may be supplied to the processing chamber 18A via the path supplied from the branch pipe 48 (the path where valves 42A and 48A are open). Through this process, the processing chamber 18A is filled with nitrogen. Step ST9 is performed for, for example, 90 seconds.

[0073] Next, as Figure 8 The example shown performs a drying process, in which nitrogen is supplied to the processing chamber 18A while the exhaust of gas (nitrogen) from the discharge pipe 54 is stopped. This drying process is performed for a predetermined drying time, for example, from 5 seconds to 40 seconds. This drying process is performed, thereby drying a plurality of substrates 12. Figure 8 In this process, nitrogen gas is supplied from nitrogen supply source 2 through nitrogen supply pipe 50, supply pipe 42, branch pipe 44, branch pipe 46, and branch pipe 48 (the path through which valves 50B, 44A, 46A, 42A, and 48A are open) to the processing chamber 18A of the substrate processing unit 18. After the drying process is completed, a plurality of substrates 12 are removed from the processing chamber 18A, the nitrogen gas is exhausted, and the processing is completed.

[0074] Here, it is believed that the higher the temperature of the mixed steam, the greater the degree of water vapor separation (separation performance) from the mixed steam of the separation membrane 23. Figure 11 This is a graph showing the experimental results of the relationship between the change in IPA concentration and temperature in a mixture of 70 wt% IPA liquid and pure water. Figure 11 In the graph, the vertical axis represents the change in IPA concentration (in wt%), and the horizontal axis represents the temperature of the mixture (in deg°C). Figure 11 In this configuration, the volume of the mixture is set to 1000 ml, and the value represents the change in IPA concentration at various temperatures after the mixture has been circulated in a predetermined piping system for one hour. The configuration is as follows: the separation membrane 23 is a zeolite membrane, and the IPA liquid in the mixture is in contact with the separation membrane 23.

[0075] like Figure 11As the example shows, the higher the temperature of the circulating mixture, the greater the change in IPA concentration. Based on this experimental result, it can be inferred that, similarly to IPA liquid, in IPA vapor, the higher the temperature of the mixed vapor, the higher the separation performance of the separation membrane 23.

[0076] As described above, the substrate processing apparatus 1 in this embodiment includes a processing tank 14, a lift 14C, an IPA vaporization section 16, a processing chamber 18A, a dehydration section 20, and a suction section 1005. According to this substrate processing apparatus 1, after a plurality of substrates 12 are immersed in pure water in the processing tank 14, the processing chamber 18A is filled with IPA vapor supplied from the IPA vaporization section 16, and then the plurality of substrates 12 are lifted using the lift 14C. Through this lifting process, the pure water adhering to the plurality of substrates 12 is replaced with IPA vapor, thus generating a mixed vapor of IPA vapor and pure water vapor.

[0077] The mixed vapor is drawn in by the suction unit 1005 and conveyed to the dehydration unit 20. The dehydration unit 20 has a separation membrane 23, which can separate the mixed vapor into IPA vapor and water vapor.

[0078] In addition, the dehydration section 20 has a cooler 26, which can liquefy IPA vapor by supercooling.

[0079] [Examples of variations to the implementation methods described above]

[0080] In the embodiments described above, although the material, size, shape, relative configuration relationship or implementation conditions of each component are described, these descriptions are only examples in all embodiments and are not intended to be limiting.

[0081] Therefore, numerous variations and equivalents, not shown, are contemplated within the scope of the technology disclosed in this invention. For example, the substrate being processed may be a single piece rather than multiple pieces.

[0082] Furthermore, in cases where the material name is not specifically specified in at least one of the embodiments described above, this also includes cases where the material contains other additives, such as alloys, as long as there is no contradiction.

[0083] Explanation of reference numerals in the attached figures

[0084] 1: Substrate processing device

[0085] 12: Substrate

[0086] 14: Processing tank

[0087] 14C: Elevator

[0088] 16: IPA Gasification Section

[0089] 18: Substrate Processing Section

[0090] 18A: Processing Chamber

[0091] 20A: Housing

[0092] 22: Control Department

[0093] 23: Separation membrane

[0094] 1005: Inhalation section

Claims

1. A substrate processing apparatus, wherein, The substrate processing apparatus includes: The processing chamber contains a processing tank filled with pure water, through which the substrate is immersed to process the substrate. An organic solvent vapor supply unit supplies organic solvent vapor to the processing chamber; The elevator lifts the substrate while contacting the substrate with the vapor of the organic solvent as it is being removed from the processing tank and immersed in the pure water. The intake section draws in the mixed vapor generated within the processing chamber. as well as A separation membrane separates the vapor of pure water from the vapor of the organic solvent in the mixed vapor drawn in by the suction section; The mixed vapor contains vapor of the pure water and vapor of the organic solvent.

2. The substrate processing apparatus according to claim 1, wherein, The separation membrane is housed within the housing; The intake section has: Piping is used to directly connect the processing chamber to the housing; An air intake is installed at the connection between the processing chamber and the piping. The pump draws in the mixed vapor from the processing chamber via the intake port; and A valve that regulates the intake of the mixed vapor by the pump.

3. The substrate processing apparatus according to claim 1 or 2, wherein, The separation membrane is a zeolite membrane.

4. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus further includes: a heater for heating the mixed vapor drawn in by the suction section; The separation membrane separates the vapor of pure water from the vapor of the organic solvent in the mixed vapor that has been heated by the heater.

5. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus further includes a cooler for cooling the vapor of the organic solvent that has been separated by the separation membrane.

6. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus further comprises: a first tank for storing the organic solvent that has been separated by the separation membrane.

7. The substrate processing apparatus according to claim 1 or 2, wherein, The substrate processing apparatus further comprises: a second tank for storing the pure water that has been separated by the separation membrane.

8. The substrate processing apparatus according to claim 1 or 2, wherein, The separation membrane allows the vapor of the pure water to pass through but not the vapor of the organic solvent.

9. A substrate processing method, wherein, The substrate processing method includes the following steps: The substrate immersion process involves immersing the substrate in a processing tank containing pure water and housed within a processing chamber. The organic solvent vapor introduction process is performed together with the substrate impregnation process, in which organic solvent vapor is supplied into the processing chamber; The lifting process involves removing the substrate, which has been immersed in the pure water, from the processing tank. An organic solvent vapor replacement process, performed concurrently with the lifting process, involves supplying the vapor of the organic solvent into the processing chamber, thereby replacing the pure water adhering to the substrate with the vapor of the organic solvent; and An organic solvent separation process involves contacting at least a portion of a separation membrane with a mixed vapor generated in the processing chamber during the organic solvent vapor replacement process, thereby separating the vapor of the organic solvent from the mixed vapor. The organic solvent vapor replacement process and the organic solvent separation process are performed in parallel; The mixed vapor contains vapor of the pure water and vapor of the organic solvent.

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