A new type of cooling cup

Abstract

The present application relates to a kind of novel refrigeration cups, including cup body and cup cover, the inside of cup body is equipped with accommodating cavity, the inside of cup cover is equipped with refrigeration mechanism, the side of refrigeration mechanism towards accommodating cavity is equipped with cold air guide fan assembly, and the bottom between cold air guide fan assembly and accommodating cavity forms inner circulation air duct for making airflow circulation between the two, and refrigeration mechanism cooperates with cold air guide fan assembly to enable different positions in accommodating cavity to form low-temperature airflow, so that the overall cooling effect in accommodating cavity is more uniform, improve the storage effect of the object needing low temperature preservation, while refrigeration mechanism and accommodating cavity do not need additional heat-conducting solid components, improve the storage capacity of accommodating cavity.

Description

Technical Field

[0001] This invention relates to the technical field of refrigeration equipment, and specifically to a novel refrigeration cup. Background Technology

[0002] A refrigerated cup is a device that creates a low-temperature storage environment inside the cup. It has a wide range of applications. For example, in daily life, some people need to use a refrigerated cup to carry medications that need to be stored at low temperatures, such as insulin, when they go out.

[0003] The cooling mechanism of a cooling cup is usually located on the lid. Since the distance between the bottom of the cup and the cooling mechanism is relatively far, the cooling effect at the bottom of the cup is relatively poor. Since most of the items stored in a cooling cup are concentrated at the bottom of the cup, it is not conducive to improving the storage effect of items that need to be kept at low temperatures.

[0004] Therefore, further improvements are needed. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a new type of cooling cup that can improve the cooling efficiency of the container cavity, enhance the storage effect of items that need to be preserved at low temperatures, and at the same time, eliminate the need for additional heat-conducting solid components between the cooling mechanism and the container cavity, thereby increasing the storage capacity of the container cavity.

[0006] The objective of this invention is achieved as follows: A novel cooling cup includes a cup body and a cup lid. The inner side of the cup body has a accommodating cavity, and the cup lid has a cooling mechanism. A cooling fan assembly is provided on the side of the cooling mechanism facing the accommodating cavity. An internal circulation air duct is formed between the cooling fan assembly and the bottom of the accommodating cavity to allow airflow to circulate between the two.

[0007] As a specific embodiment, the cooling fan assembly includes a semiconductor refrigeration chip, a first fan, and a cooling support bracket. The upper side of the cooling support bracket is connected and cooperates with the semiconductor refrigeration chip, and the lower side of the cooling support bracket is installed and fixed to the first fan.

[0008] As a specific solution, an exhaust cavity is formed between the upper side of the first fan and the cooling guide bracket. The cooling guide bracket is distributed with several air guide slots. The exhaust cavity is connected to the accommodating cavity through the air outlet of the first fan and the air guide slots. The air guide slots are distributed radially outward from the exhaust cavity as the center.

[0009] As a specific embodiment, a cooling block is provided between the semiconductor cooling chip and the cooling support, the upper side of the cooling block is in contact with the semiconductor cooling chip, and the cooling block is connected and fixed to the cooling support.

[0010] As a specific embodiment, an air outlet plate is provided on the lower side of the first fan, and the air outlet end of the first fan is connected to the accommodating cavity through the air outlet plate.

[0011] As a specific embodiment, the outer side of the semiconductor cooling chip is provided with a mounting plate, the mounting plate is provided with a limiting hole corresponding to the semiconductor cooling chip, the mounting plate is provided with a clearance hole, and the cooling block and the air outlet plate are connected and fixed by a screw device, with the screw device extending at least partially into the clearance hole from bottom to top.

[0012] As a specific embodiment, the upper side of the semiconductor cooling chip is provided with a heat sink, a second fan is provided above the heat sink, and the cup lid is provided with heat dissipation holes. A heat dissipation air duct is formed between the heat dissipation holes and the heat sink through the second fan.

[0013] As a specific embodiment, the inner side of the cup lid is provided with a support part and a lower mounting part, the outer side of the cooling block is provided with an outward flange, the outward flange abuts against the support part, the heat sink is provided with an upper mounting part corresponding to the lower mounting part, the upper part of the cup lid is open, the upper opening of the cup lid is connected to a detachable cover, the cooling mechanism can enter or leave the cup lid from the upper opening of the cup lid, the upper mounting part and the lower mounting part are connected and fixed by a screw device, so that the heat sink and the cooling block clamp the mounting plate.

[0014] As a specific embodiment, the cooling support includes a base plate and cooling fins. The inner side of the cup lid is provided with a support part. The lower side of the base plate abuts against the support part. The lower side of the support part is connected to an air outlet hood. The inner side of the air outlet hood has an air hood cavity that can accommodate the cooling fins and the first fan. The support part is connected and fixed to the air outlet hood and the base plate respectively by a screw device.

[0015] As a specific embodiment, the cup body is provided with a first heat preservation cavity and a second heat preservation cavity distributed sequentially from the inside to the outside, with the inner and outer sides of the first heat preservation cavity being spaced apart from the receiving cavity and the second heat preservation cavity, respectively.

[0016] As a specific embodiment, the first insulation cavity and / or the second insulation cavity are filled with a cooling fluid.

[0017] The beneficial effects of this invention are: The refrigeration mechanism, in conjunction with the cooling fan assembly, can generate low-temperature airflow at different locations within the storage cavity, thereby making the overall cooling effect within the storage cavity more uniform and improving the storage effect of items requiring low-temperature preservation. At the same time, no additional heat-conducting solid components are needed between the refrigeration mechanism and the storage cavity, increasing the storage capacity of the storage cavity. Attached Figure Description

[0018] Figure 1 This is a cross-sectional schematic diagram of the first embodiment of the present invention.

[0019] Figure 2 This is an exploded view of the first embodiment of the present invention. Figure 1 .

[0020] Figure 3This is an exploded view of the first embodiment of the present invention. Figure 2 .

[0021] Figure 4 This is an exploded view of the first embodiment of the present invention. Figure 3 .

[0022] Figure 5 This is a schematic diagram of the structure of the cooling support in the first embodiment of the present invention.

[0023] Figure 6 This is an enlarged view of point A in the first embodiment of the present invention.

[0024] Figure 7 This is a cross-sectional schematic diagram of the second embodiment of the present invention.

[0025] Figure 8 This is an enlarged view of section B in the second embodiment of the present invention. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] First embodiment: See Figures 1-6 This novel refrigerated cup includes a cup body 1 and a cup lid 2. The inner side of the cup body 1 is provided with a accommodating cavity 11, and the cup lid 2 is provided with a refrigeration mechanism. A cooling fan assembly is provided on the side of the refrigeration mechanism facing the accommodating cavity 11. An internal circulation air duct is formed between the cooling fan assembly and the bottom of the accommodating cavity 11 to allow airflow to circulate between the two. The refrigeration mechanism, together with the cooling fan assembly, can generate low-temperature airflow at different positions within the accommodating cavity 11, thereby making the overall cooling effect within the accommodating cavity 11 more uniform and improving the storage effect of items that need to be preserved at low temperatures. At the same time, no additional heat-conducting solid components are required between the refrigeration mechanism and the accommodating cavity 11, increasing the storage capacity of the accommodating cavity 11.

[0028] Furthermore, the cooling fan assembly includes a thermoelectric cooler 3, a first fan 41, and a cooling bracket 5. The upper side of the cooling bracket 5 is connected and cooperates with the thermoelectric cooler 3, and the lower side of the cooling bracket 5 is installed and fixed to the first fan 41. The cooling bracket 5 can both conduct heat and position the first fan 41.

[0029] Furthermore, an exhaust chamber 51 is formed between the upper side of the first fan 41 and the cooling guide bracket 5. The cooling guide bracket 5 has several air guide slots 52. The exhaust chamber 51 is connected to the accommodating cavity 11 through the air outlet of the first fan 41 and the air guide slots 52. Under the action of the first fan 41, the airflow in the accommodating cavity 11 can enter the exhaust chamber 51 from the air guide slots 52 and then enter the accommodating cavity 11 through the air outlet of the first fan 41 to form a circulation. This achieves the effect of uniformly cooling different positions in the accommodating cavity 11. Moreover, the exhaust chamber 51 can concentrate the airflow, allowing the airflow to converge in the cooling guide bracket 5 and fully contact the cooling guide bracket 5, making the airflow generated by the first fan 41 more stable and the airflow can be fully cooled in the cooling guide bracket 5.

[0030] Furthermore, the air guide slots 52 are radially distributed outward from the exhaust cavity 51, which can relatively increase the length from the air guide slots 52 to the exhaust cavity 51, allowing the airflow to move within the air guide slots 52 for a longer time without needing to increase the overall volume of the cooling support 5, thus improving the heat exchange efficiency between the cooling support 5 and the airflow.

[0031] Furthermore, a cooling block 6 is provided between the thermoelectric cooler 3 and the cooling support 5. The upper side of the cooling block 6 is in contact with the thermoelectric cooler 3, and the cooling block 6 is connected and fixed to the cooling support 5. The cooling block 6 is used for installation and fixation with the cooling support 5, and at the same time plays a role in heat conduction between the thermoelectric cooler 3 and the cooling support 5.

[0032] Furthermore, an air outlet plate 7 is provided on the lower side of the first fan 41. The air outlet end of the first fan 41 is connected to the accommodating cavity 11 through the air outlet plate 7. The air outlet plate 7 can support the first fan 41 and also provide a certain degree of protection for the first fan 41.

[0033] Furthermore, a mounting plate 8 is provided on the outer side of the thermoelectric cooler 3. The mounting plate 8 is provided with a limiting hole corresponding to the thermoelectric cooler 3 and a clearance hole 81. The mounting plate 8 can play the role of mounting and positioning the thermoelectric cooler 3.

[0034] The cooling block 6 and the air outlet plate 7 are connected and fixed by a screw device. The screw device extends at least partially into the clearance hole 81 from bottom to top. The clearance hole 81 ensures that the mounting plate 8 will not affect the installation connection between the cooling bracket 5 and the air outlet plate 7.

[0035] Furthermore, a heat sink 9 is provided on the upper side of the thermoelectric cooler 3, and a second fan 42 is provided above the heat sink 9. The cup lid 2 is provided with heat dissipation holes. The heat dissipation holes and the heat sink 9 are connected by the second fan 42 to form a heat dissipation channel. The heat sink 9, together with the second fan 42, can reduce the operating temperature of the thermoelectric cooler 3, making it less prone to overheating and damage, and improving its stability.

[0036] Furthermore, the inner side of the cup lid 2 is provided with a support part 21 and a lower mounting part 22, and the outer side of the cooling block 6 is provided with an outward flange 61, which abuts against the support part 21. The heat sink 9 is provided with an upper mounting part 91 corresponding to the lower mounting part 22. The upper part of the cup lid 2 is open, and the upper opening of the cup lid 2 is connected to a detachable cover 23. The cooling mechanism can enter or leave the cup lid 2 through the upper opening. The upper mounting part 91 and the lower mounting part 22 are connected and fixed by a screw device, so that the heat sink 9 and the cooling block 6 clamp the mounting plate 8. During assembly, the first fan 41, the cooling bracket 5, the air outlet plate 7, the cooling block 6, and the semiconductor cooling chip 3 can be pre-installed on the outside of the cup lid 2 and installed as a whole with the cup lid 2 in a modular manner, which reduces the assembly difficulty and improves the installation efficiency.

[0037] The specific installation procedure can be as follows: First, install and fix the first fan 41, the cooling bracket 5, the air outlet plate 7, the cooling block 6, and the semiconductor cooling chip 3. Then, place the entire assembly inside the cup lid 2 by cooperating with the support part 21 through the outer flange 61. Next, place the heat sink 9 on the mounting plate 8. Connect and fix the heat sink 9 to the cup lid 2 by cooperating with the lower mounting part 22 through the upper mounting part 91. Finally, install the face cover 23 into the opening of the cup lid 2.

[0038] Furthermore, the cup body 1 is provided with a first heat preservation cavity 121 and a second heat preservation cavity 122 distributed sequentially from the inside to the outside. The inner and outer sides of the first heat preservation cavity 121 are respectively spaced apart from the accommodating cavity 11 and the second heat preservation cavity 122, which can further improve the heat preservation effect of the cup body 1 and make the refrigeration cup more suitable for storing medicines and other items for a relatively long time.

[0039] Second embodiment: See Figure 7 , Figure 8 The difference between this embodiment and the first embodiment is that the cooling cup of this novel cooling cup has a cooling support 5 including a base plate 53 and cooling fins 54. The inner side of the cup lid 2 is provided with a support part 21. The lower side of the base plate 53 abuts against the support part 21. The lower side of the support part 21 is connected to an air outlet hood 10. The inner side of the air outlet hood 10 has an air hood cavity 101 that can accommodate the cooling fins 54 and the first fan 41. The support part 21 is connected and fixed to the air outlet hood 10 and the base plate 53 respectively by a screw device.

[0040] The remaining undescribed parts are the same as in the first embodiment and will not be repeated here.

[0041] Third embodiment: The difference between this embodiment and the first embodiment is that the first insulation cavity 121 and / or the second insulation cavity 122 of the novel cooling cup are filled with a cooling liquid. Preferably, both the first insulation cavity 121 and the second insulation cavity 122 are filled with a cooling liquid, which can further improve the overall insulation effect of the cup body 1.

[0042] The remaining undescribed parts are the same as in the first embodiment and will not be repeated here.

[0043] The above embodiments are merely preferred embodiments of the present invention, and the present invention may have other implementations. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope set forth in the claims of this application.

Claims

1. A novel cooling cup, comprising a cup body (1) and a cup lid (2), wherein the inner side of the cup body (1) is provided with a receiving cavity (11), and the cup lid (2) is provided with a cooling mechanism, characterized in that, The refrigeration mechanism is provided with a cooling fan assembly on the side facing the accommodating cavity (11), and an internal circulation duct is formed between the cooling fan assembly and the bottom of the accommodating cavity (11) to allow airflow to circulate between them.

2. The novel cooling cup according to claim 1, characterized in that: The cooling fan assembly includes a semiconductor refrigeration chip (3), a first fan (41), and a cooling bracket (5). The upper side of the cooling bracket (5) is connected and cooperates with the semiconductor refrigeration chip (3), and the lower side of the cooling bracket (5) is installed and fixed with the first fan (41).

3. The novel cooling cup according to claim 2, characterized in that: An exhaust cavity (51) is formed between the upper side of the first fan (41) and the cooling support (5). The cooling support (5) has several air guide grooves (52). The exhaust cavity (51) is connected to the accommodating cavity (11) through the air outlet of the first fan (41) and the air guide grooves (52). The air guide grooves (52) are radially distributed outward with the exhaust cavity (51) as the center.

4. The novel cooling cup according to claim 2, characterized in that: A cooling block (6) is provided between the semiconductor cooling chip (3) and the cooling support (5). The upper side of the cooling block (6) is attached to the semiconductor cooling chip (3), and the cooling block (6) is connected and fixed to the cooling support (5).

5. The novel cooling cup according to claim 4, characterized in that: The first fan (41) has an air outlet plate (7) on its lower side, and the air outlet end of the first fan (41) is connected to the accommodating cavity (11) through the air outlet plate (7).

6. The novel cooling cup according to claim 5, characterized in that: The outer side of the semiconductor cooling chip (3) is provided with a mounting plate (8), the mounting plate (8) is provided with a limiting hole corresponding to the semiconductor cooling chip (3), and the mounting plate (8) is provided with a clearance hole (81). The cooling block (6) and the air outlet plate (7) are connected and fixed by a screw device, and the screw device extends into the clearance hole (81) from bottom to top.

7. The novel cooling cup according to claim 6, characterized in that: The upper side of the semiconductor cooling chip (3) is provided with a heat sink (9), and a second fan (42) is provided above the heat sink (9). The cup lid (2) is provided with heat dissipation holes, and a heat dissipation air duct is formed between the heat dissipation holes and the heat sink (9) through the second fan (42).

8. The novel cooling cup according to claim 7, characterized in that: The inner side of the cup lid (2) is provided with a support part (21) and a lower mounting part (22). The outer side of the cooling block (6) is provided with an outward flange (61). The outward flange (61) abuts against the support part (21). The heat sink (9) is provided with an upper mounting part (91) corresponding to the lower mounting part (22). The upper part of the cup lid (2) is open. The upper opening of the cup lid (2) is connected to a detachable face cover (23). The refrigeration mechanism can enter or leave the cup lid (2) from the upper opening of the cup lid (2). The upper mounting part (91) and the lower mounting part (22) are connected and fixed by a screw device, so that the heat sink (9) and the cooling block (6) clamp the mounting plate (8).

9. The novel cooling cup according to claim 2, characterized in that: The cooling support (5) includes a base plate (53) and cooling fins (54). The inner side of the cup lid (2) is provided with a support part (21). The lower side of the base plate (53) abuts against the support part (21). The lower side of the support part (21) is connected to an air outlet hood (10). The inner side of the air outlet hood (10) has an air hood cavity (101) that can accommodate the cooling fins (54) and the first fan (41). The support part (21) is connected and fixed to the air outlet hood (10) and the base plate (53) respectively by screw devices.

10. The novel cooling cup according to any one of claims 1-8, characterized in that: The cup body (1) is provided with a first heat preservation cavity (121) and a second heat preservation cavity (122) arranged sequentially from the inside to the outside. The inner and outer sides of the first heat preservation cavity (121) are respectively spaced apart from the accommodating cavity (11) and the second heat preservation cavity (122). The first insulation cavity (121) and / or the second insulation cavity (122) are filled with cooling fluid.

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