Chip dispensing die bonding equipment

Abstract

The present application relates to the technical field of structure fixing, and in particular to a chip dispensing and die bonding device, which comprises a device carrier, a recognition mechanism, a wafer carrier, a conveying part and a dispensing mechanism; the conveying part is arranged on the bearing surface of the device carrier, the dispensing mechanism and the recognition mechanism are sequentially arranged above the conveying part along a transfer direction, the wafer carrier is arranged between the recognition mechanism and the device carrier, and is used to carry wafers to facilitate the recognition mechanism to transfer the wafers to the required positions of the conveying part; the wafer carrier comprises a translation carrier and a wafer disc; the translation carrier can move in the parallel direction of the bearing surface of the device carrier, and the wafer disc is used to place a plurality of wafers; the dispensing mechanism comprises a moving slide and a plurality of device supports; the moving slide can move in a first moving direction; the device supports are provided with glue pipe supports; and the glue pipe supports are provided with glue pipe grippers for clamping glue pipes.

Description

Technical Field

[0001] This invention relates to the technical field of structural fixation, and more specifically to a chip dispensing and die bonding device. Background Technology

[0002] As semiconductor and optoelectronic devices evolve towards higher integration and precision, chip dispensing and die bonding have become critical packaging processes determining device performance and reliability. Traditional chip dispensing and die bonding typically involves: applying a photocurable adhesive (such as UV adhesive) to a designated area on the substrate; and using a nozzle to precisely bond the wafer / chip over the adhesive for fixation. However, traditional die bonding equipment often uses soft suction cups such as rubber to pick up the chip. These soft materials are prone to elastic deformation or slight displacement during negative pressure suction and bonding, leading to reduced chip placement accuracy and failing to meet the requirements of high-precision dispensing and die bonding. After chip bonding, due to the chip's own shielding and the limited angle of external light source illumination, the curing light can only preferentially illuminate the adhesive exposed around the chip's periphery. The still-liquid adhesive inside is pulled outwards by the curing shrinkage stress, forming severe internal voids in the center of the chip, significantly reducing the bonding strength and heat dissipation performance. Summary of the Invention

[0003] In order to solve the above-mentioned problems in the existing technology, the present invention aims to provide a chip dispensing and die bonding device with a simple structure that effectively improves the accuracy of wafer bonding and at the same time effectively improves the bonding effect of adhesive curing.

[0004] The technical solution adopted in this invention is as follows: a chip dispensing and die bonding device, including a device stage, an identification mechanism, a wafer stage, a conveying component, and a dispensing mechanism; the conveying component is disposed on the bearing surface of the device stage, and the dispensing mechanism and the identification mechanism are sequentially arranged above the conveying component along the transfer direction; the wafer stage is disposed between the identification mechanism and the device stage to carry the wafer and facilitate the identification mechanism to transfer the wafer to the required position of the conveying component; The wafer stage includes a translation stage and a tray; the translation stage can move in a parallel direction to the stage bearing surface, and several wafers are placed on the tray; The dispensing mechanism includes a movable slide and several equipment supports. The movable slide can move in a first direction. The equipment supports are equipped with tube supports and tube grippers for holding the tubes.

[0005] In one embodiment, the identification mechanism includes a plurality of visual positioning modules, a guide carriage, and a plurality of suction modules. The visual positioning modules and the suction modules are disposed on the guide carriage. The guide carriage guides the visual positioning modules and the suction modules to move along a second moving direction. The suction module is provided with a suction tube head, and the suction tube head is supported by the bottom identification mechanism to move along a third moving direction.

[0006] In one embodiment, the suction tube head is made of hard ceramic material.

[0007] In one embodiment, the suction module is further provided with a plurality of positioning and identification cameras, which are used to assist the suction tube head in picking up and placing wafers.

[0008] In one embodiment, the conveying component includes multiple sets of guide rails, with several chip clips placed between adjacent guide rails. Multiple sets of fixing slots are provided on both sides of the chip clips, and several fastening blocks are provided on the side of the guide rails. Each fastening block is equipped with an upgrading and moving mechanism. The upgrading and moving mechanism moves the fastening block along a third moving direction to enter the fixing slot of the adjacent guide rail, thereby fixing the chip clips to the relative position of the guide rails.

[0009] In one embodiment, the movable slide is further provided with a fiber retention mechanism, which includes a fiber winding roll, a feeding component, a rotating component, and a fiber cutting component. The fiber winding roll has a fiber wound on it and is supported on the bearing surface of the movable slide by a fixed bracket. The rotating component includes a torsion motor and a motor connecting frame. The torsion motor is connected to the fiber retention bracket by the motor connecting frame. The torsion motor is used to rotate the output end of the feeding component to point to the chip position in the middle of the chip magazine. The fiber cutting component is used to cut the optical fiber output by the feeding component.

[0010] In one embodiment, the feeding component includes a guide arm, a feeding pipe, a feeding motor, a rotating cone, and a fiber guide; the guide arm is fixed to the drive shaft of the torsion motor, the guide arm clamps the middle part of the feeding pipe, the inner cavity of the feeding pipe is provided with a pointed conical through-conical groove, the through-conical groove is provided with fiber guiding threads for guiding fiber movement, the through-conical groove is sleeved and rotatably connected to the rotating cone, the circumference of the rotating cone is provided with threaded grooves, and the wide end of the rotating cone is provided with a larger diameter than the rotating cone. A limiting plate with a cross-sectional area at the opening is provided. The fiber on the fiber roll passes through the gap between the limiting plate and the feed pipe into the fiber guide thread. The feed motor is fixedly connected to the feed pipe by a motor clamp. The drive shaft of the feed motor drives the rotating shaft on the rotating cone to rotate the rotating cone. The fiber guide is provided at the narrow opening of the conveying end that passes through the conical groove to guide the fiber. The end of the fiber guide facing the feed pipe is provided with a conical flare and a gap is left between it and the feed pipe. The fiber guide is supported on the feed pipe by a guide support.

[0011] In one embodiment, the feed tube is further provided with a plurality of recessed guide shafts on its periphery. The recessed guide shafts are rotatably supported on the feed tube by a guide shaft fixing frame. The recessed guide shafts are used to guide the fiber to fall between the limiting plate and the feed tube.

[0012] In one embodiment, the fiber breaking component includes a fiber breaking ring and a movable mechanism. The fiber breaking ring is disposed between the feed pipe and the conical flare. The inner ring side of the fiber breaking ring is provided with a slanted cut. The fiber breaking ring is moved by the movable mechanism to cut off the fiber output at the tip of the through conical groove.

[0013] In one embodiment, the movable mechanism includes a drive motor, a rotating ring, and a guide pin. The fiber break ring is provided with an extension block, and the extension block has a movable groove in the middle in a guiding direction away from the axis of the fiber break ring. The guide pin passes through and is slidably connected to the movable groove. The guide pin is fixed to the feed pipe. The rotating ring is located on the other half of the fiber break ring away from the extension block. The rotating ring is rotatably connected to the oblique cut ring surface. The drive shaft of the drive motor is eccentrically and rotatably connected to the plane of the rotating ring. The drive motor is connected to the feed pipe by a motor positioning bracket.

[0014] The beneficial effects of this invention are as follows: 1. Introducing a fiber retention mechanism, ultra-fine optical fibers are pre-laid in the dispensing area. After the chip is bonded, ultraviolet light, lasers, etc. can be directly introduced into the center area of ​​the adhesive through the optical fiber to preferentially cure the central adhesive. This avoids stress concentration caused by the adhesive hardening too quickly, and significantly improves the bonding strength, heat dissipation performance and long-term reliability of the chip bonding. 2. A feeding component with a combination of "through conical groove with fiber guide thread and rotating cone" is used. The feeding motor drives the rotating cone to rotate. Relying on the friction between the threaded groove and the conical groove, the optical fiber is pushed out smoothly in the form of "torsional spiral", avoiding the problem of traditional mechanical grippers crushing or jamming the optical fiber. 3. The soft suction cups that are prone to elastic deformation have been abandoned. The suction tube head is made of hard ceramic material, which effectively solves the problem of small displacement and offset during the adsorption and pressing process, ensuring the absolute fixation of the wafer placement position. In conjunction with the visual positioning module of the guide carriage, a near-field positioning and recognition camera is added to the suction module to realize secondary precise positioning calibration during the picking and placement process, which effectively improves the fixation accuracy. Attached Figure Description

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure of the wafer carrier of the present invention; Figure 3 This is a three-dimensional structural diagram of the conveying component of the present invention; Figure 4 This is a three-dimensional structural diagram of the dispensing mechanism of the present invention; Figure 5This is a three-dimensional structural diagram of the identification mechanism of the present invention; Figure 6 This is a three-dimensional structural diagram of the fiber retention mechanism of the present invention; Figure 7 This is a three-dimensional structural diagram of the fiber retention mechanism of the present invention; Figure 8 This is a three-dimensional cross-sectional structural diagram of the fiber retention mechanism of the present invention; Figure 9 This is a second partial cross-sectional three-dimensional structural schematic diagram of the fiber retention mechanism of the present invention; Figure 10 This is a partial three-dimensional structural schematic diagram of the fiber retention mechanism of the present invention.

[0017] Reference numerals: 1. Equipment platform; 2. Identification mechanism; 201. Guide carriage; 21. Visual positioning module; 22. Suction module; 23. Suction tube head; 24. Positioning and identification camera; 3. Wafer platform; 31. Translation platform; 301. Wafer; 32. Carrying tray; 4. Conveying component; 41. Guide rail; 42. Chip magazine; 421. Fixed barrel slot; 43. Fastening block; 44. Upgrading and moving mechanism; 5. Dispensing mechanism; 51. Moving slide; 52. Equipment bracket; 53. Hose bracket; 54. Hose gripper; 7. Fiber retention mechanism; 71. Fiber retention bracket; 72. Fiber winding coil; 721. Fixed bracket; 73. Torsion motor; 731. Motor connecting bracket; 74. Conduit 75. Clamping arm; 751. Feeding motor; 76. Motor clamp; 77. Guide shaft fixing bracket; 78. Notched guide shaft; 79. Feeding pipe; 70. Through conical groove; 71. Fiber guide thread; 72. Rotating cone; 73. Threaded groove; 74. Limiting plate; 75. Rotating shaft; 76. Fiber guide tube; 77. Fiber guide tube; 78. Conical flare; 79. Fiber guide tube support; 70. Fiber break ring; 71. Bevel cut; 72. Extension block; 73. Movable slide; 74. Guide pin; 75. Drive motor; 76. Rotating ring; 77. Fiber positioning bracket. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention; that is, the described embodiments are merely some embodiments of the invention, and not all embodiments. The components of the embodiments of the invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0020] The following is combined with Figure 1-10 The present invention describes a chip dispensing and die bonding device for the purpose of quickly placing and mounting a wafer 301 onto a chip. The device includes a stage 1, an identification mechanism 2, a wafer stage 3, a transport component 4, and a dispensing mechanism 5. The transport component 4 is located on the bearing surface of the stage 1. The dispensing mechanism 5 and the identification mechanism 2 are sequentially arranged above the transport component 4 along the transport direction. The wafer stage 3 is located between the identification mechanism 2 and the stage 1 to support the wafer 301, facilitating the identification mechanism 2 to transport the wafer 301 to the required position on the transport component 4. Specifically, the wafer 301 needs to be placed on the required position on the chip using adhesive, and then fixed with adhesive for subsequent use. The wafer stage 3 includes a translation stage 31 and a tray 32. The tray 32 is placed above the bearing plane of the translation stage 31 and can be fixed or not fixed according to the actual situation. The translation stage 31 can move in the parallel direction to the bearing surface of the equipment stage 1. The wafer 301 can be dropped below the pick-up tube head 23 by moving. Specifically, the movement can be achieved by existing technologies such as hinges, cylinders and sliding rod guides. The above and below movements can all adopt similar methods. Since the movement between equipment is usually existing technology and is not the inventive point of this invention, it will not be described in detail. Several wafers 301 are placed on the tray 32. The dispensing mechanism 5 includes a movable slide 51 and several equipment supports 52. The movable slide 51 can move in a first moving direction, specifically, the first moving direction is in the same direction as the guiding direction of the conveyor 4. The equipment supports 52 are provided with tube supports 53, and the tube supports 53 are provided with tube grippers 54 for holding the tubes. The tubes are traditional UV tubes or other glue-making tubes, and the glue can be dispensed by extrusion or air pump. At the same time, the tube grippers 54 on the multiple sets of tube supports 53 can use the movement of the movable slide 51 to drop the glue dripped onto the chip into the same position for mixing into different components, etc., to achieve different functions, depending on the actual situation. Specifically, since the method of dispensing glue through the tubes can be automated or manual, and is not the inventive point of this invention, it is not shown in the attached drawings. Understanding the implementation location and function is sufficient.

[0021] Beneficially, the identification mechanism 2 includes several visual positioning modules 21, a guide carriage 201, and several suction modules 22. The visual positioning modules 21 and suction modules 22 are mounted on the guide carriage 201. Specifically, the visual positioning module 21 includes a high-speed camera and a supporting control system. After positioning by the high-speed camera, the control system positions the chip and the wafer 301, etc. The above implementation is prior art and will not be described in detail. The specific structure of the visual positioning module 21 can be used to achieve the above functions. The guide carriage 201 guides the visual positioning module 21 and the suction module 22 to move along a second moving direction. Specifically, the second moving direction is the direction between the wafer stage 3 and the conveyor belt. The movement direction between the feeders 4 is such that the second movement direction can drive the suction module 22 to pick up the wafer 301 and place it above the chip. The suction module 22 is equipped with a suction tube head 23. The suction module 22 mainly consists of an air pump and the suction tube head 23. The air pump creates a negative pressure inside the suction tube head 23, and the negative pressure is used to pick up the wafer 301 and make it adhere to the suction tube head 23 to achieve the purpose of the suction tube head 23 picking up the wafer 301. The suction tube head 23 is supported by the bottom identification mechanism 2 and moves along the third movement direction. Specifically, the third movement direction is the perpendicular direction of the bearing surface of the equipment platform 1. The moving structure provided by the identification mechanism 2 drives the suction module 22 to move the suction tube head 23, which facilitates multiple pick-ups.

[0022] The advantage is that the suction head 23 is made of hard ceramic material. The soft suction cup material will have a partial offset effect when it is sucked up or dropped, so that the suction position is not fixed, thereby reducing the accuracy of the placement. Beneficially, the suction module 22 is also equipped with several positioning and recognition cameras 24. The positioning and recognition cameras 24 are used to assist the suction tube head 23 in picking up and placing the wafer 301. By using the positioning and recognition cameras 24 again for position positioning, the accuracy of picking up and placing the wafer 301 can be improved, and the accuracy of the positioning and placement effect can be effectively improved.

[0023] Beneficially, the conveyor 4 includes multiple sets of guide rails 41, and several chip clips 42 are placed between adjacent guide rails 41. The chip clips 42 are of a general structure, mainly for carrying and fixing chips. Multiple sets or a single set can be placed independently. During use, the guide rails 41 are used for guiding and moving. The specific movement and placement can be determined by the moving structure installed on the guide rails 41, or by manual movement, etc., which is not the point of invention of this invention. Therefore, the movement can be achieved by moving from the dispensing mechanism 5 to below the identification mechanism 2, so it will not be described in detail. Multiple sets of fixing slots 421 are provided on both sides of the chip clips 42. Several fastening blocks 43 are provided on the side of the guide rails 41. The fastening blocks 43 are provided with an upgrading and moving mechanism 44. The upgrading and moving mechanism 44 moves the fastening blocks 43 along the third moving direction to enter the fixing slots 421 of the adjacent guide rails 41 to fix the chip clips 42 in the relative position of the guide rails 41.

[0024] Specifically, the movable slide 51 is also equipped with a fiber retention mechanism 7. When fixing the wafer 301 by dispensing, UV adhesive is often used, and the adhesive is cured by irradiation with a light source. For example, UV adhesive is used. However, due to the obstruction of the wafer 301 and the limitations of the light source, the periphery of the wafer 301 is fixed first when irradiated by the light source. This causes the center of the wafer 301 to be subjected to stress after the adhesive cures, resulting in voids. In addition, the light transmittance of some adhesives decreases significantly after curing, and the adhesive in the center cannot cure quickly, which seriously affects the effect of fixing the wafer 301. Therefore, the fiber retention mechanism 7 is set up. The fiber retention mechanism 7 includes fiber winding. The components include a coil 72, a feeding component, a rotating component, and a fiber-cutting component. The fiber coil 72 is wound with a fiber, which is usually an extremely thin optical fiber. The optical fiber is not conductive and has a very small cross-sectional radius, so it does not affect the bonding and connection between the chip and the wafer 301. The fiber coil 72 is supported on the bearing surface of the movable slide table 51 by a fixed bracket 721. The rotating component includes a torsion motor 73 and a motor connecting frame 731. The torsion motor 73 is connected to the fiber retaining bracket 71 by the motor connecting frame 731. The torsion motor 73 is used to rotate the output end of the feeding component to point to the chip position in the middle of the chip clip 42. The fiber-cutting component is used to cut the optical fiber output by the feeding component.

[0025] Specifically, the feeding components include a guide arm 74, a feeding pipe 77, a feeding motor 75, a rotating cone 772, and a fiber guide 774. The guide arm 74 is fixed to the drive shaft of the torsion motor 73 and clamps the middle part of the feeding pipe 77. The inner cavity of the feeding pipe 77 is provided with a pointed conical through-conical groove 771, and the through-conical groove 771 is provided with a fiber guiding thread 7711 to guide the movement of the fiber. The through-conical groove 771 is sleeved and rotatably connected to the rotating cone 772. The circumference of the rotating cone 772 is provided with a threaded groove 7721, and the wide end of the rotating cone 772 is provided with a limiting area larger than the cross-sectional area of ​​the wide end of the rotating cone 772. Position plate 7722, the fiber on the fiber roll 72 passes through the gap between the positioning plate 7722 and the feed tube 77 and enters the fiber guide thread 7711. The feed motor 75 is fixedly connected to the feed tube 77 by the motor clamp 751. The drive shaft of the feed motor 75 drives the rotating shaft 7723 on the rotating cone 772 to rotate the rotating cone 772. The fiber guide tube 774 is provided at the narrow end of the through-conical groove 771 to guide the fiber. The fiber guide tube 774 has a tapered flared end 7741 facing the feed tube 77 and leaves a gap between it and the feed tube 77. The fiber guide tube 774 is supported on the feed tube 77 by the guide tube bracket 7742. Due to the extreme thinness of the fiber, traditional conveying structures offer poor clamping performance and cannot effectively supply the fiber, failing to ensure it falls into the dispensing area. In practice, the fiber is first guided through the fiber guide thread 7711 between the limiting plate 7722 and the conveying pipe 77. Then, the conveying motor 75 is started, driving the rotating cone 772 to rotate. Because the fiber is extremely thin and falls into the rotating cone 772, the repeated contact with the fiber during the rotation of the conical groove 771 causes it to rotate within the cone 772. This pulls the fiber out of the conveying pipe 77 through the guide of the rotating cone 772. Relying on the repeated rotation of the cone 772 and the guiding force of the threaded groove 7721, the fiber exits the fiber guide thread 7711 in a twisting spiral motion, effectively achieving precise output control of the fiber. Afterwards, the fiber exits through the fiber guide tube 774 through the guide of the conical flare 7741. Then, the conveying motor 75 is started. The torsion motor 73 rotates the guide clamp arm 74, which drives the feed tube 77 to point the fiber guide tube 774 towards the chip dispensing area. After the fiber falls into the middle of the dispensing area, the dispensing mechanism 5 is activated to dispense the adhesive. Then, the fiber is cut off, leaving one end of the fiber in the dispensing area. After the wafer 301 is precisely positioned and placed through the subsequent structure, the light source is introduced into the dispensing area by means of laser or other methods using the fiber, and the curing is carried out from the inside out. This effectively solves the problem of stress compression of the wafer 301 caused by shrinkage during curing, resulting in voids in the middle. Afterward, the light source is repeatedly irradiated around the wafer 301 to complete the curing of the dispensing area, which effectively improves the fixation effect. Specifically, the light source that introduces the light source into the dispensing area by means of laser or other methods using the fiber can be set independently, and the fiber can be used for guidance. It can be in the form of clamping or light pen, which is existing technology, so it will not be described in detail.

[0026] Specifically, the conveying pipe 77 is also provided with several recessed guide shafts 761 around its periphery. The recessed guide shafts 761 are rotatably supported on the conveying pipe 77 by the guide shaft fixing frame 76. The recessed guide shafts 761 are used to guide the fiber to fall between the limiting plate 7722 and the conveying pipe 77. The recesses can better guide the fiber to fall around the recessed guide shafts 761, and then fall between the limiting plate 7722 and the conveying pipe 77.

[0027] Beneficially, the fiber breaking component includes a fiber breaking ring 78 and a movable mechanism. The fiber breaking ring 78 is disposed between the feed pipe 77 and the conical flare 7741. The inner ring side of the fiber breaking ring 78 is provided with a slanted cut 781. The fiber breaking ring 78 is moved by the movable mechanism to cut off the fiber output from the tip of the through conical groove 771.

[0028] Specifically, the moving mechanism includes a drive motor 784, a rotating ring 7841, and a guide pin 783. The fiber break ring 78 is provided with an extension block 782. The middle of the extension block 782 is provided with a movable groove 7821 in a guiding direction away from the axis of the fiber break ring 78. The guide pin 783 passes through and is slidably connected to the movable groove 7821. The guide pin 783 is fixed to the feed pipe 77. The rotating ring 7841 is provided on the other half of the ring surface of the fiber break ring 78 away from the extension block 782. The rotating ring 7841 is rotatably connected to the ring surface of the oblique cut 781. The drive shaft of the drive motor 784 is eccentrically and rotatably connected to the plane of the rotating ring 7841. The drive motor 784 is connected to the feed pipe 77 by the motor positioning bracket 7842. In practice, the drive motor 784 is started to drive the rotating ring 7841 to rotate. Since the drive motor 784 and the rotating ring 7841 are eccentrically connected, the rotation drives the fiber break ring 78 to swing along the connection direction of the guide pin 783. During the swing, since the guide pin 783 is placed in the movable slide groove 7821, the fiber break ring 78 performs a circular motion, generating an elliptical motion pattern that crosses the output port of the conical groove 771. Since the output port of the conical groove 771 outputs the fiber, the oblique cut 781 produces a shearing effect when the fiber break ring 78 crosses the conical groove 771, thus cutting the fiber. Repeating the above output function can output the segmented fiber multiple times and leave it above the chip.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the invention or the scope defined by the claims of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A chip dispensing and die bonding device, characterized in that: The device includes a device platform (1), an identification mechanism (2), a wafer platform (3), a transport component (4), and a dispensing mechanism (5). The transport component (4) is located on the bearing surface of the device platform (1). The dispensing mechanism (5) and the identification mechanism (2) are sequentially arranged above the transport component (4) along the transport direction. The wafer platform (3) is located between the identification mechanism (2) and the device platform (1) to carry the wafer (301) so that the identification mechanism (2) can transport the wafer (301) to the required position of the transport component (4). The wafer stage (3) includes a translation stage (31) and a loading disk (32); the translation stage (31) can move in a parallel direction to the bearing surface of the equipment stage (1), and a plurality of wafers (301) are placed on the loading disk (32); The dispensing mechanism (5) includes a movable slide (51) and several equipment supports (52). The movable slide (51) can move in a first moving direction. The equipment supports (52) are provided with tube supports (53), and the tube supports (53) are provided with tube grippers (54) for holding tubes.

2. The chip dispensing and die bonding equipment according to claim 1, characterized in that: The identification mechanism (2) includes several visual positioning modules (21), a guide carriage (201), and several suction modules (22). The visual positioning modules (21) and the suction modules (22) are mounted on the guide carriage (201). The guide carriage (201) guides the visual positioning modules (21) and the suction modules (22) to move along a second moving direction. The suction modules (22) are provided with suction tube heads (23). The suction tube heads (23) are supported by the bottom identification mechanism (2) and move along a third moving direction.

3. The chip dispensing and die bonding equipment according to claim 2, characterized in that: The suction tube head (23) is made of hard ceramic material.

4. The chip dispensing and die bonding equipment according to claim 3, characterized in that: The suction module (22) is also equipped with several positioning and identification cameras (24), which are used to assist the suction tube head (23) in picking up and placing the wafer (301).

5. The chip dispensing and die bonding equipment according to claim 2, characterized in that: The conveying component (4) includes multiple sets of guide rails (41), and several chip clips (42) are placed between adjacent guide rails (41). Multiple sets of fixing slots (421) are provided on both sides of the chip clips (42). Several fastening blocks (43) are provided on the side of the guide rails (41). An upgrading and moving mechanism (44) is provided on the fastening block (43). The upgrading and moving mechanism (44) moves the fastening block (43) along the third moving direction to enter the fixing slot (421) of the adjacent guide rail (41) to fix the chip clips (42) in the relative position of the guide rails (41).

6. The chip dispensing and die bonding equipment according to claim 1, characterized in that: The movable slide (51) is also provided with a fiber retention mechanism (7). The fiber retention mechanism (7) includes a fiber winding (72), a feeding component, a rotating component, and a fiber cutting component. The fiber winding (72) is wound with a fiber. The fiber winding (72) is supported on the bearing surface of the movable slide (51) by a fixed bracket (721). The rotating component includes a torsion motor (73) and a motor connecting frame (731). The torsion motor (73) is connected to the fiber retention bracket (71) by the motor connecting frame (731). The torsion motor (73) is used to rotate the output end of the feeding component to point to the chip position in the middle of the chip clip (42). The fiber cutting component is used to cut the optical fiber output by the feeding component.

7. The chip dispensing and die bonding equipment according to claim 6, characterized in that: The feeding component includes a guide arm (74), a feeding pipe (77), a feeding motor (75), a rotating cone (772), and a fiber guide (774); the guide arm (74) is fixed to the drive shaft of the torsion motor (73), the guide arm (74) clamps the middle part of the feeding pipe (77), the feeding pipe (77) has a pointed conical through conical groove (771) in its inner cavity, the through conical groove (771) has a fiber guiding thread (7711) in its inner cavity to guide the movement of the fiber, the through conical groove (771) is sleeved and rotatably connected to the rotating cone (772), the rotating cone (772) has a threaded groove (7721) on its periphery, and the wide end of the rotating cone (772) has a limiting plate with a cross-sectional area larger than that of the wide end of the rotating cone (772). 7722), the fiber on the winding (72) is passed into the fiber guide thread (7711) through the gap between the limiting plate (7722) and the feed tube (77), the feed motor (75) is fixedly connected to the feed tube (77) by the motor clamp (751), the drive shaft of the feed motor (75) drives the rotating shaft (7723) on the rotating cone (772) to rotate the rotating cone (772), the fiber guide (774) is provided at the narrow end of the through conical groove (771) to guide the fiber, the end of the fiber guide (774) facing the feed tube (77) is provided with a conical flare (7741) and a gap is left between it and the feed tube (77), the fiber guide (774) is supported on the feed tube (77) by the guide bracket (7742).

8. The chip dispensing and die bonding equipment according to claim 7, characterized in that: The feed pipe (77) is also provided with several recessed guide shafts (761) around its periphery. The recessed guide shafts (761) are rotatably supported on the feed pipe (77) by the guide shaft fixing frame (76). The recessed guide shafts (761) are used to guide the fiber to fall between the limiting plate (7722) and the feed pipe (77).

9. The chip dispensing and die bonding equipment according to claim 8, characterized in that: The fiber breaking component includes a fiber breaking ring (78) and a movable mechanism. The fiber breaking ring (78) is disposed between the feed pipe (77) and the conical flare (7741). The inner ring side of the fiber breaking ring (78) is provided with a slanted cut (781). The fiber breaking ring (78) is moved by the movable mechanism to cut off the fiber output at the tip of the through conical groove (771).

10. The chip dispensing and die bonding equipment according to claim 9, characterized in that: The movable mechanism includes a drive motor (784), a rotating ring (7841), and a guide pin (783). The fiber break ring (78) is provided with an extension block (782). The extension block (782) has a movable groove (7821) in the middle, which is in a guiding direction away from the axis of the fiber break ring (78). The guide pin (783) passes through and is slidably connected to the movable groove (7821). The guide pin (783) is fixed to the feed pipe (77). The rotating ring (7841) is located on the other half of the ring surface of the fiber break ring (78) away from the extension block (782). The rotating ring (7841) is rotatably connected to the oblique cut (781) ring surface. The drive shaft of the drive motor (784) is eccentrically connected to the plane of the rotating ring (7841). The drive motor (784) is connected to the feed pipe (77) by the motor positioning bracket (7842).

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