Wafer rotating cleaning device with ultrasonic vibration function

Abstract

The application discloses a wafer rotating cleaning device with ultrasonic vibration function water, which comprises: an outer shell body, an inner bearing turntable fixedly arranged in the outer shell body; a rotating seat rotatably arranged on the bearing turntable; two groups of clamping assemblies, which are arranged at intervals along the circumference of the rotating seat, each group of the clamping assemblies comprising a plurality of clamping units arranged in a radial sliding mode along the rotating seat; a driving turntable rotatably arranged in the rotating seat, used for driving the clamping units in the two groups of the clamping assemblies to alternately extend and retract; a cleaning liquid supply module mounted on the bearing turntable, comprising at least one nozzle and an ultrasonic wave generating unit, the ultrasonic wave generating unit being used for generating ultrasonic vibration of the cleaning liquid, and the nozzle being used for spraying the cleaning liquid with ultrasonic vibration to the surface of the clamped wafer; wherein the rotating seat is annular, and an isolation cover is fixedly arranged on the inner side of the rotating seat.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning equipment technology, specifically a wafer rotary cleaning device with ultrasonic vibration water. Background Technology

[0002] Wafer cleaning is a critical step in semiconductor manufacturing, and its cleanliness directly affects chip yield and reliability. The wafer manufacturing process involves dozens of steps, including photolithography, etching, deposition, and chemical mechanical polishing. Each step can introduce contaminants such as particles, metal ions, and organic matter. Therefore, thorough cleaning of the wafer surface is essential before and after each step.

[0003] Currently, single-wafer rotary cleaning devices have become one of the mainstream cleaning equipment due to their advantages such as avoiding cross-contamination and high cleaning efficiency. These devices typically include a high-speed rotating chuck for holding the wafer and spraying cleaning fluid onto the wafer surface through nozzles, while simultaneously using centrifugal force to dislodge contaminants. To hold the wafer, existing technologies mainly employ the following clamping methods: First, vacuum adsorption: the back of the wafer is adsorbed by a suction cup, which provides stable clamping and no obstruction of the front side, but it cannot clean the back of the wafer, and the suction cup itself can easily become a source of contamination.

[0004] Second, edge mechanical clamping (such as pin chucks and roller clamping): By contacting the edge of the wafer through several clamping points, double-sided cleaning can be achieved. However, the clamping points always exist throughout the cleaning process, forming fixed cleaning blind spots, which means that contaminants near the clamping points cannot be effectively removed.

[0005] Therefore, it is necessary to provide a wafer rotation cleaning device with ultrasonic vibration water to solve the problems mentioned in the background art. Summary of the Invention

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer rotary cleaning device with ultrasonic vibration water, comprising: an outer shell, wherein a carrier turntable is fixedly disposed inside; a rotating base, rotatably mounted on the carrier turntable; two sets of clamping assemblies, spaced apart circumferentially along the rotating base, each set of clamping assemblies including multiple clamping units slidably disposed radially along the rotating base; a drive turntable, rotatably disposed inside the rotating base, for driving the clamping units in the two sets of clamping assemblies to alternately extend and retract; a cleaning fluid supply module, mounted on the carrier turntable, including at least one nozzle and an ultrasonic generating unit, wherein the ultrasonic generating unit is used to generate ultrasonic vibration in the cleaning fluid, and the nozzle is used to spray the ultrasonically vibrating cleaning fluid onto the surface of the clamped wafer; wherein the rotating base is annular, an isolation cover is fixedly disposed on the inner side of the rotating base, and the clamping units are slidably penetrating the inner wall of the rotating base and extending toward the center of the rotating base.

[0007] Furthermore, preferably, the plurality of clamping units in each set of clamping assemblies are evenly distributed along the circumference of the rotating seat, and the clamping points of the two sets of clamping units are alternately spaced along the circumference of the wafer.

[0008] Furthermore, as a preferred embodiment, the clamping unit includes: a slide rod slidably disposed in the rotating seat, having a drive cavity inside; a support rod slidably disposed in the drive cavity; and a clamping end head detachably mounted to the extended end of the support rod and used for direct contact with the edge of the wafer, wherein the clamping end head is made of a wear-resistant and low-particle-generation polymer material.

[0009] Furthermore, as a preferred embodiment, two first gears are arranged on the rotating base along its height direction, one of which is fixedly connected to the rotating base, and the other is rotatably connected to the rotating base and fixedly connected to the drive turntable; two second gears are rotatably arranged in the bearing turntable, and the two second gears mesh with the two first gears one-to-one, and the two second gears are independently driven by two servo motors arranged on the bearing turntable.

[0010] Furthermore, as a preferred embodiment, a slider is slidably connected to the end of the slide rod away from the support rod; a T-shaped limiting plate is fixedly provided on the slide rod; a T-shaped limiting groove is provided on the slider, the limiting plate slides along the limiting groove, and a spring is provided between the slide rod and the slider.

[0011] Furthermore, as a preferred embodiment, a guide block is fixedly provided on the slider; a guide groove is provided on the drive turntable, and all the guide blocks on the slider are slidably arranged along the guide groove.

[0012] Furthermore, preferably, the guide groove includes a plurality of first annular grooves and second annular grooves distributed circumferentially, and the diameter of the second annular groove is larger than the diameter of the first annular groove. Adjacent first annular grooves and second annular grooves are connected by inclined grooves. The distribution of the first annular grooves, the second annular grooves and the inclined grooves is configured such that when two guide blocks in adjacent positions in the two sets of clamping units slide along the guide groove, only one guide block can slide along the inclined groove.

[0013] Furthermore, as a preferred embodiment, it also includes an air flotation platform, which is slidably mounted on the bottom of the housing and opposite to the lower surface of the clamped wafer. The air flotation platform includes: an air chamber for containing gas; an air supply pipeline for connecting the air chamber to an external clean gas source; a gas jetting platform facing the lower surface of the wafer, with multiple air outlets provided on its jetting surface; and an airflow control valve group for adjusting the gas jetting flow rate of the gas jetting platform.

[0014] Compared with the prior art, the present invention provides a wafer rotation cleaning device with ultrasonic vibration water, which has the following advantages: First, it completely eliminates cleaning blind spots and improves cleaning uniformity. By setting up two sets of clamping components arranged alternately along the circumference and using the cooperation of the drive turntable and the guide groove, the two sets of clamping units achieve a strict "clamp first, release later" alternating action. After each set of clamping units is removed from the wafer edge, its contact point is fully exposed to the spray range of the cleaning fluid and can be thoroughly cleaned. This eliminates the cleaning blind spots caused by the fixed clamping points in the traditional edge clamping method and achieves uniform cleaning of the entire wafer surface.

[0015] Secondly, the soft landing clamping effectively prevents damage to the wafer edge. A spring is set between the slider and the slide bar, and with the cooperation of the limiting plate and the limiting groove, the spring provides a buffer force when the clamping end contacts the wafer edge, and the final clamping force is formed only after the limiting structure makes rigid contact. This design can effectively absorb impact during the alternating clamping process and avoid chipping or scratching the fragile wafer edge.

[0016] Third, differential drive enables intermittent motion of the turntable, resulting in a compact structure. By using two independently driven first gears meshing with two second gears and controlling the slight speed difference between the two servo motors, the turntable is made to rotate intermittently relative to the rotating base. This method eliminates the need for additional motors or slip rings on the rotating parts, resulting in a compact structure, fast dynamic response, and easy implementation of precise timing control.

[0017] Fourth, it integrates air flotation and hot air drying functions to achieve integrated cleaning and drying. A liftable air flotation platform is set under the wafer, which not only provides an auxiliary air cushion during cleaning to reduce wafer deformation and back-side contamination, but also switches to hot air drying and cooling modes after cleaning. High-temperature and high-pressure nitrogen gas is used in conjunction with wafer rotation to quickly remove residual water film on the surface. The entire cleaning and drying process is completed continuously in the same station, avoiding the risk of secondary contamination caused by wafer transfer between different devices, and improving production efficiency and yield. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the outer shell in this invention; Figure 3 This is a schematic diagram of the rotating seat in this invention; Figure 4 This is a schematic diagram of the clamping component in the present invention; Figure 5 This is a schematic diagram of the clamping unit in this invention; Figure 6 This is a schematic diagram of the drive turntable in this invention; Figure 7a This is a schematic diagram of the alternating sliding structure of the two sets of clamping units in this invention. Figure 1 ; Figure 7b This is a schematic diagram of the alternating sliding structure of the two sets of clamping units in this invention. Figure 2 ; Figure 7c This is a schematic diagram of the alternating sliding structure of the two sets of clamping units in this invention. Figure 3 ; In the diagram: 1. Outer shell; 11. Load-bearing turntable; 12. Second gear; 13. Servo motor; 2. Rotating seat; 21. Isolation cover; 22. First gear; 3. Clamping assembly; 31. Slide rod; 311. Limiting plate; 32. Support rod; 33. Clamping end; 34. Slider; 341. Limiting groove; 342. Guide block; 35. Spring; 4. Drive turntable; 41. Guide groove; 411. First annular groove; 412. Second annular groove; 413. Inclined groove; 5. Cleaning fluid supply module; 6. Air flotation platform. Detailed Implementation

[0019] Please see Figure 1Figure 7 shows an embodiment of the present invention providing a wafer rotary cleaning device with ultrasonic vibration water, including an outer shell 1, the outer shell 1 having a detachable cover plate, and a carrier turntable 11 fixedly disposed inside the outer shell 11; an annular rotating seat 2 is rotatably mounted on the carrier turntable 11, and an isolation cover 21 is fixedly disposed on the inner side of the rotating seat 2 to isolate the driving component of the rotating seat 2 from the cleaning area to prevent particle contamination.

[0020] Two sets of clamping components 3 are arranged circumferentially on the rotating base 2. Each set of clamping components 3 includes multiple clamping units that slide radially along the rotating base 2. The clamping points of the two sets of clamping components are arranged alternately at intervals on the outer edge of the wafer. A drive turntable 4 is also rotatably arranged inside the rotating base 2. The drive turntable 4 is used to drive the clamping units in the two sets of clamping components 3 to extend and retract alternately, thereby realizing alternating clamping.

[0021] The carrier turntable 11 is also equipped with a cleaning fluid supply module 5, which includes at least one nozzle and an ultrasonic generating unit; the ultrasonic generating unit causes the cleaning fluid to generate ultrasonic vibrations, and the nozzle sprays the cleaning fluid with ultrasonic vibrations onto the surface of the clamped wafer.

[0022] An air flotation platform 6 is slidably mounted on the bottom of the outer casing 1. The air flotation platform 6 is opposite to the lower surface of the wafer and is used to provide air flotation support or assist in drying.

[0023] In this embodiment, each clamping unit includes a slide rod 31, a support rod 32, and a clamping end 33. The slide rod 31 is radially slidably disposed in the rotating seat 2, and a driving cavity is formed inside it. The support rod 32 is sealed and slidably disposed in the driving cavity, and a sealed air pressure chamber is formed between the rear end of the support rod 32 (the end away from the wafer) and the driving cavity. The clamping end 33 is detachably installed on the extended end of the support rod 32 for direct contact with the edge of the wafer. The clamping end 33 is made of a wear-resistant and low-particle-generation polymer material, such as semiconductor-grade PEEK, Vespel, or ceramic.

[0024] Furthermore, a slider 34 is slidably connected to the end of the slide rod 31 away from the support rod 32; specifically, a T-shaped limiting plate 311 is fixedly provided on the slide rod 31, and a T-shaped limiting groove 341 is provided on the slider 34, and the limiting plate 311 slides along the limiting groove 341; a spring 35 is provided between the slide rod 31 and the slider 34, one end of the spring 35 abuts against the slider 34, and the other end abuts against the slide rod 31.

[0025] A guide block 342 is fixedly installed on the slider 34, and a guide groove 41 is provided on the drive turntable 4. The guide blocks 342 on all sliders 34 are slidably installed along the guide groove 41. When the drive turntable 4 rotates, the guide groove 41 drives the slider 34 to move radially through the guide blocks 342.

[0026] Specifically, when the drive disk 4 rotates to drive the wafer of the clamping unit to slide, the slider 34 and the slide rod 31 are supported by the spring 35. After the clamping end 33 contacts the outer edge of the wafer, it does not immediately apply a strong clamping force. Instead, as the slider 34 continues to slide, the spring 35 is compressed, and at the same time, the limiting plate 311 slides towards the end of the limiting groove 341. Only when the limiting plate 311 slides to the end of the limiting groove 341 (that is, the slider 34 and the slide rod 31 form a rigid transmission through the limiting structure) will a strong clamping be formed. This design effectively avoids the impact on the wafer when the two sets of clamping units are clamped alternately.

[0027] Furthermore, the sliding range of the slider 34 is limited such that when the slider 34 slides to the closest position to the wafer, the limiting plate 311 contacts the end of the limiting groove 341, and the clamping end 33 contacts the outer edge of the wafer at the same time. At this time, since the spring 35 is in a compressed state, the slide rod 31 is always subjected to an inward clamping force. And under the push of the slider 34, the slide rod 31 cannot retract, thereby ensuring that the clamping unit can firmly clamp the wafer during the high-speed rotation of the rotating seat 2.

[0028] In this embodiment, the sliding of the support rod 32 is pneumatically driven, and its adjustment only occurs before clamping the wafer. It is used to set the initial extension amount of the support rod 32 according to the actual size of the wafer. After the adjustment is completed, the entire clamping unit (including the slide rod 31, the support rod 32, and the clamping end 33) will form a rigid whole. Specifically, in each clamping unit, the driving cavity at the rear end of the support rod 32 is connected to an external clean air source through a gas channel (opened inside the slide rod 31 or through a hose). The gas channel is equipped with a precision pressure regulating valve and a switching valve. The gas paths of all clamping units can be connected in parallel and controlled uniformly, or they can be controlled independently. Gas at a set pressure is introduced into the driving cavity through the external air source to push the support rod 32 outward (towards the wafer).

[0029] During implementation, the wafer is roughly placed in the center area of ​​the rotating seat 2 (either by a robotic arm or manually). At this time, the support rods 32 of one set of clamping units are fully extended, and all support rods 32 are retracted. Then, air pressure is applied to all drive cavities, causing the support rods 32 to extend outward. When the clamping end 33 in the extended clamping unit just contacts the outer edge of the wafer, the air pressure is stopped, and the switch valve is closed. Since the drive cavity is now sealed and there is a static seal between the support rod 32 and the slide rod 31, the entire clamping unit (including the slide rod 31, support rod 32, and clamping end 33) forms a rigid whole. Then, the drive turntable 4 rotates periodically, causing the sliders 34 in the two sets of clamping units to slide alternately along the radial direction of the rotating seat 2. This allows the two sets of clamping units to alternately clamp the wafer, effectively preventing the clamping mechanism from obstructing the outer edge of the wafer during the cleaning process and ensuring that the wafer is thoroughly cleaned.

[0030] In particular, this "adjustment before clamping" method avoids dynamic control of air pressure during high-speed rotation, simplifies the design of seals and air circuits, and improves reliability.

[0031] In this embodiment, two first gears 22 are arranged on the rotating seat 2 along its height direction: the lower first gear 22 is fixedly connected to the rotating seat 2, and the upper first gear 22 is rotatably connected to the rotating seat 2 and fixedly connected to the drive turntable 4; two second gears 12 are rotatably arranged in the bearing turntable 11, and the two second gears 12 mesh with the two first gears 22 respectively; the two second gears 12 are independently driven by two servo motors 13 arranged on the bearing turntable 11.

[0032] During the cleaning process, two servo motors 13 control the rotation of two second gears 12, which in turn drive the rotation of two first gears 22. The lower first gear 22 is fixed to the rotating seat 2, thereby driving the rotating seat 2 to rotate. The upper first gear 22 (fixed to the drive turntable 4) can be adjusted by the speed of the servo motor 13 to produce a small speed difference relative to the rotating seat 2.

[0033] When the speed difference is zero, the drive turntable 4 and the rotating seat 2 rotate synchronously, and there is no relative movement between the guide groove 41 and the slider 34, and the clamping state remains unchanged. When it is necessary to switch the clamping group, the servo motor 13 that drives the upper first gear 22 generates a preset speed difference relative to the servo motor 13 that drives the lower first gear 22, so that the drive turntable 4 rotates relative to the rotating seat 2 by a fixed angle, which is exactly equal to the interval angle between two adjacent clamping points. After the rotation is completed, the speed difference is adjusted back to zero, and the drive turntable 4 rotates synchronously with the rotating seat 2 again.

[0034] like Figure 6As shown, the guide groove 41 includes a plurality of first annular grooves 411 and a plurality of second annular grooves 412 distributed circumferentially, wherein the diameter of the second annular groove 412 is larger than the diameter of the first annular groove 411; adjacent first annular grooves 411 and second annular grooves 412 are connected by inclined grooves 413; the guide groove 41 is configured such that when two guide blocks 342 in adjacent positions in two sets of clamping units slide along the guide groove 41, only one guide block 342 can slide along the inclined groove 413.

[0035] For ease of understanding, the guide groove 41 can be divided into multiple continuous groove segments. The length of each groove segment corresponds to the number of clamping units in the same set of clamping components 3. Each groove segment includes the following loop path: inclined groove 413 - first annular groove 411 - inclined groove 413 - second annular groove 412. When the guide block 342 is located in the first annular groove 411, the corresponding clamping unit is in the innermost radial position (clamping the wafer); when the guide block 342 is located in the second annular groove 412, the corresponding clamping unit is in the outermost radial position (detaching from the wafer). In the initial state, the guide blocks 342 in one set of clamping components 3 are all located in the first annular groove 411, and the guide blocks 342 in the other set of clamping components 3 are all located in the second annular groove 412.

[0036] like Figure 7a , 7b As shown in Figure 7c, when the drive turntable 4 rotates forward relative to the rotating base 2, the first guide block 342a in the second annular groove 412 will preferentially slide along the inclined groove 413 in front of it and gradually enter the first annular groove 411; at the same time, the second guide block 342b in the first annular groove 411 will slide along the first annular groove 411 and temporarily maintain its radial position unchanged; when the first guide block 342a has completely entered the first annular groove 411, the drive turntable 4 continues to rotate, and the second guide block 342b will reach the inclined groove 413 in front of it and slide along the inclined groove into the second annular groove 412; in this way, the set of clamping units that were originally detached from the wafer first enters the clamping state, and then the set of clamping units that were originally clamping the wafer detaches from the wafer. This realizes that the clamping units in the two sets of clamping components 3 strictly follow the "clamp first, release later" logic to alternate, avoiding the dangerous working condition of "zero clamping" during the alternation process.

[0037] In this embodiment, the cleaning fluid supply module 5 includes a storage tank, a pump, a filter, a flow controller, at least one nozzle, and an ultrasonic generating unit. The ultrasonic generating unit is preferably a megohmonic generating unit with adjustable power. This unit can be installed inside the nozzle (e.g., a piezoelectric ceramic transducer is installed in the resonant cavity of the nozzle) or in a pipeline upstream of the nozzle (e.g., a tubular megohmonic generator). When the cleaning fluid flows through the ultrasonic generating unit, it is subjected to high-frequency vibration, thus becoming "water with ultrasonic vibration function".

[0038] The nozzle is mounted on a sliding and telescopic support arm, and a rotatable lifting column is set on the carrier turntable 11. The support arm is connected to the top of the lifting column, so that the nozzle can perform a reciprocating scanning motion along the wafer radial direction while the wafer rotates, ensuring that the cleaning fluid evenly covers the entire wafer surface. At the same time, when the wafer is loaded or unloaded, the nozzle can rotate to one side of the isolation cover 21 to avoid obstructing the wafer loading and unloading.

[0039] In this embodiment, the air flotation platform 6 is slidably installed on the bottom of the outer casing 1, and the gap between it and the lower surface of the wafer can be adjusted by a lifting mechanism (such as a cylinder or lead screw); the air flotation platform 6 includes: an internal air chamber, one or more air supply pipelines, a gas jetting station, and an airflow control valve group; the gas jetting station faces the lower surface of the wafer, and multiple air outlets are provided on its jetting surface; the air supply pipeline is connected to an external clean gas source (preferably high-purity nitrogen).

[0040] As another extended embodiment of the air flotation platform 6, in addition to providing basic auxiliary support functions, the air flotation platform 6 also extends to two working modes.

[0041] Basic operating mode - cleaning mode: During the cleaning process, high-purity nitrogen gas at room temperature and low pressure is introduced into the gas chamber through the airflow control valve group. The gas flows out evenly from the injection hole, forming an extremely thin air cushion between the lower surface of the wafer and the platform. This air cushion can offset most of the weight of the wafer, reduce the edge stress caused by the wafer sagging due to gravity, and also prevent the cleaning fluid from flowing around to the back of the wafer and causing contamination. Since the clamping mechanism of this device is already stable enough, this air cushion is only an auxiliary function.

[0042] Extended Mode 1 - Hot Air Drying Mode: After cleaning is completed and spraying stops, a layer of deionized water film remains on the wafer surface. At this time, the drying mode of the air flotation platform 6 is activated: the airflow control valve group switches the air path, so that the gas first flows through a gas heater (e.g., an electric heater) set in the pipeline, and then enters the gas chamber; high-temperature nitrogen gas is sprayed out at high speed from the injection hole, while the wafer continues to rotate at a high speed; the high-temperature gas accelerates evaporation through heat transfer; by controlling the heating power and gas flow rate, the wafer surface can be thoroughly dried without leaving water stains.

[0043] Extended Mode 2 - Cooling Mode: After the heat drying is completed, the wafer temperature is high. If it is taken out directly, it may affect the subsequent process or cause thermal stress. At this time, turn off the heater, introduce room temperature high-purity nitrogen gas, and continue to rotate the wafer to cool it to room temperature.

[0044] The three modes mentioned above are automatically switched by the solenoid valve, proportional regulating valve and temperature controller in the airflow control valve group, and the whole process does not require manual intervention.

[0045] Work process T1, Initial state: All the support rods 32 of the clamping units are fully retracted under pneumatic drive, and the drive turntable 4 is in the initial position, that is, the guide blocks 342 of one set of clamping units are located in the first annular groove 411 (radial innermost position), and the other set is located in the second annular groove 412 (radial outermost position).

[0046] T2. Loading the wafer: The robot places the wafer in the center of the rotating seat 2, and then synchronously inputs gas into all the drive cavities so that all the support rods 32 slide toward the wafer synchronously. When the clamping end 33 of the clamping unit in the first annular groove 411 contacts the outer edge of the wafer and the end of the limiting plate 311 contacts the end of the limiting groove 341, the gas supply is stopped and the switch valve is closed. At this time, the clamping unit in the first annular groove 412 will clamp the wafer, and the clamping unit in the second annular groove 412 will disengage from the outer edge of the wafer.

[0047] T3. Cleaning: Start the two servo motors 13 to rotate the rotating seat 2 to the process speed, start the cleaning fluid supply module 5, and the nozzle scans and sprays the cleaning fluid with ultrasonic vibration; then, through the differential speed control of the two servo motors 13, the drive turntable 4 rotates periodically relative to the rotating seat 2, thereby realizing the alternating clamping of the two sets of clamping units; each time switching, one set of clamping units retracts, and its clamping point is exposed to the cleaning fluid for thorough cleaning; the other set extends to take over the clamping, ensuring that the wafer is always stably fixed; and due to the buffering effect of the spring 35, the switching process can effectively avoid impact on the wafer.

[0048] T4. Drying: After the cleaning reaches the set time, the spraying stops, and the wafer continues to rotate at high speed to shake off most of the liquid; then the air flotation platform 6 enters the hot air drying mode and the cooling mode in sequence to complete the final drying.

[0049] T5. Unloading: After drying is complete, stop rotating seat 2, drive all support rods 32 to retract, and the robot arm takes away the wafer.

[0050] As another extended embodiment of the present invention, the volume of the outer shell 1 can be enlarged, and a rotating frame is integrated in the outer shell 1. The rotating seat 11 is rotated and mounted on the rotating frame, so that the rotating seat 11 can be rotated 180°. Then, the cleaning fluid supply module 5 is placed on the rotating frame. After the front side of the wafer is cleaned and dried, the air flotation platform 6 is retracted to the bottom of the outer shell 1 using a lifting mechanism. The rotating frame is used to rotate the entire rotating seat 2, the internal clamping assembly 3, and the wafer 180°, so that the back side of the wafer faces upward. Then, the air flotation platform 6 is raised again using a lifting mechanism to align it with the front side of the wafer and maintain a gap. Then, the back side of the wafer can be cleaned, thereby realizing the double-sided cleaning of the wafer. Since the clamping unit in the present invention clamps the outer edge of the wafer in an alternating clamping manner, a complete cleaning can be achieved regardless of whether the front or back side of the wafer is cleaned.

[0051] In summary, this invention eliminates the cleaning blind spots caused by fixed clamping points in traditional edge clamping methods by alternating clamping with two sets of clamping components 3; it achieves stable contact force control and avoids damage to the wafer edges by combining "pre-clamping air pressure adjustment" with spring 35 buffer; it achieves low-speed, precise intermittent movement within the high-speed rotating seat 2 by using gear differential drive to drive the turntable 4; and it reduces wafer gravitational deformation by setting up an air flotation platform 6 and providing auxiliary air cushions during cleaning, while also expanding the hot air drying function, realizing integrated cleaning and drying at the same workstation and reducing the risk of secondary contamination.

[0052] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer rotary cleaning device with ultrasonic vibration water, characterized in that, include: The outer shell (1) has a fixed load-bearing turntable (11) inside it; Rotary seat (2) is rotatably mounted on the bearing turntable (11); Two sets of clamping assemblies (3) are arranged circumferentially along the rotating seat (2), and each set of clamping assemblies (3) includes multiple clamping units that are slidably arranged radially along the rotating seat (2); The drive turntable (4) is rotatably disposed inside the rotating seat (2) and is used to drive the clamping units in the two sets of clamping assemblies (3) to extend and retract alternately. The cleaning fluid supply module (5) is installed on the carrier turntable (11) and includes at least one nozzle and an ultrasonic generating unit. The ultrasonic generating unit is used to generate ultrasonic vibrations in the cleaning fluid, and the nozzle is used to spray the cleaning fluid with ultrasonic vibrations onto the surface of the clamped wafer. The rotating seat (2) is annular, and an isolation cover (21) is fixedly provided on the inner side of the rotating seat (2). The clamping unit can slide through the inner wall of the rotating seat (2) and extend towards the center of the rotating seat (2).

2. The wafer rotary cleaning device with ultrasonic vibration water as described in claim 1, characterized in that, The plurality of clamping units in each set of clamping assemblies (3) are evenly distributed along the circumference of the rotating seat, and the clamping points of the two sets of clamping units are alternately arranged in the circumference of the wafer.

3. The wafer rotary cleaning device with ultrasonic vibration water as described in claim 1, characterized in that, The clamping unit includes: The slide rod (31) is slidably disposed in the rotating seat (2), and a drive cavity is provided inside it; The support rod (32) is slidably and sealed within the drive cavity; A clamping end (33) is detachably mounted to the extended end of the support rod (32) and used to directly contact the edge of the wafer. The clamping end (33) is made of a wear-resistant and low-particle-generation polymer material.

4. A wafer rotary cleaning device with ultrasonic vibration water as described in claim 1, characterized in that, Two first gears (22) are arranged on the rotating seat (2) along its height direction. One of the first gears (22) is fixedly connected to the rotating seat (2), and the other first gear (22) is rotatably connected to the rotating seat (2) and fixedly connected to the drive turntable (4). The carrier turntable (11) is rotatably equipped with two second gears (12), which mesh with two first gears (22) respectively, and the two second gears (12) are driven independently by two servo motors (13) set on the carrier turntable (11).

5. A wafer rotary cleaning device with ultrasonic vibration water as described in claim 3, characterized in that, A slider (34) is slidably connected to one end of the slide rod (31) away from the support rod (32); A T-shaped limiting plate (311) is fixedly installed on the slide rod (31); The slider (34) has a T-shaped limiting groove (341), the limiting plate (311) slides along the limiting groove (341), and a spring (35) is provided between the sliding rod (31) and the slider (34).

6. A wafer rotary cleaning device with ultrasonic vibration water as described in claim 5, characterized in that, A guide block (342) is fixedly provided on the slider (34); The drive turntable (4) is provided with a guide groove (41), and the guide blocks (342) on all the sliders (34) are slidably arranged along the guide groove (41).

7. A wafer rotary cleaning device with ultrasonic vibration water as described in claim 6, characterized in that, The guide groove (41) includes a plurality of first annular grooves (411) and second annular grooves (412) distributed along the circumference, and the diameter of the second annular groove (412) is larger than the diameter of the first annular groove (411). Adjacent first annular grooves (411) and second annular grooves (412) are connected by inclined grooves (413). The distribution of the first annular groove (411), the second annular groove (412), and the inclined groove (413) is configured such that when two guide blocks (342) in adjacent positions in the two sets of clamping units slide along the guide groove (41), only one guide block (342) can slide along the inclined groove (413).

8. A wafer rotary cleaning device with ultrasonic vibration water as described in claim 1, characterized in that, It also includes an air flotation platform (6), which is slidably mounted on the bottom of the housing (1) and opposite to the lower surface of the clamped wafer. The air flotation platform (6) includes: A gas chamber for containing gas; A gas supply line is provided to connect the gas chamber to an external clean gas source; A gas jetting station is positioned facing the lower surface of the wafer, and its jetting surface is provided with multiple gas outlets; An airflow control valve assembly is used to regulate the gas injection flow rate of the gas injection platform.

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