Semiconductor lead frame plasma cleaning machine

Abstract

The application discloses a kind of semiconductor lead frame plasma cleaning machine, including rack, the rack is sequentially provided with feeding support, buffer area and discharging support along length direction;Feeding part, the feeding part is set to the rack near the feeding support one end;Material moving part, the material moving part is installed in one side of the buffer area, the material moving part includes material moving module, material moving rod and material moving block, the material moving module drives the material moving rod, and the material moving block is installed on the material moving rod;Cleaning part, the cleaning part is installed in the other side of the buffer area, and the cleaning part includes cleaning chamber and radio frequency power supply, and the cleaning chamber is provided with retractable cleaning support, and the radio frequency power supply generates plasma and cleans semiconductor lead frame.The application realizes the automation of semiconductor lead frame feeding, moving, cleaning whole process, without manual intervention feeding and discharging operation, avoid the pollution risk caused by human intervention to clean production environment.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor leadframe cleaning technology, and particularly relates to a semiconductor leadframe plasma cleaning machine. Background Technology

[0002] As the fundamental load-bearing component of semiconductor packaging, the leadframe plays a crucial role in chip fixation, electrical conduction, and heat transfer. Its surface cleanliness directly determines the chip bonding strength, molding compound adhesion performance, and long-term reliability of semiconductor devices. Leadframe substrates are mostly copper alloys. Copper is chemically reactive, and during processes such as stamping, electroplating, transport and storage, and dispensing pretreatment, a nano-scale natural oxide layer easily forms on its surface. Simultaneously, it absorbs various contaminants such as mold release agents, stamping oil stains, flux residue, dust particles, and organic adhesives. Currently, conventional leadframe cleaning methods in the industry include traditional processes such as solvent wiping, wet acid washing, and ultrasonic washing. Solvent wiping can only remove surface oil stains and cannot remove dense metal oxide layers; acid pickling process is prone to causing over-corrosion of copper and uneven surface roughness. After cleaning, residual chemical ions can easily cause pin oxidation and bonding point detachment; water washing process has limited ability to clean organic residues inside the gaps of micro pins and will also generate a large amount of industrial wastewater, resulting in high environmental costs. It is no longer suitable for the current packaging production standards of miniaturized, multi-pin, and high-precision semiconductor components.

[0003] Plasma dry cleaning, with its advantages of active particle bombardment-chemical reaction to remove contaminants, low-temperature and waste-free operation, no damage to the substrate, and simultaneous surface activation, has gradually become the mainstream pretreatment solution before leadframe bonding and molding processes. Currently, most plasma cleaning machines still rely on manual operation for loading and unloading semiconductor leadframes. This reliance on human intervention in the cleanroom easily introduces new sources of contamination such as external dust and particles into the ultra-clean environment. Furthermore, the overall sealing structure of the equipment cavity and the response speed of key valve modules are generally slow and sluggish, making it difficult to achieve precise, efficient, and rapid seamless docking with the high-efficiency semiconductor leadframe transfer robot configured in the front-end equipment (EFEM). This mismatch in speed and coordination severely restricts its ability to work collaboratively with upstream and downstream automated equipment, making it difficult to truly integrate into and adapt to the highly integrated and efficient fully automated production line operation mode required by modern semiconductor manufacturing lines. Summary of the Invention

[0004] This invention overcomes the shortcomings of the prior art and provides a semiconductor lead frame plasma cleaning machine to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a semiconductor lead frame plasma cleaning machine, comprising...

[0006] The frame is provided with a loading platform, a buffer area and a unloading platform in sequence along its length.

[0007] A loading section is provided at one end of the frame near the loading platform to push the semiconductor lead frame out from the loading platform position;

[0008] The transfer unit is installed on one side of the buffer area. The transfer unit includes a transfer module, a transfer rod, and a transfer block. The transfer module drives the transfer rod, and the transfer block is installed on the transfer rod to transfer the semiconductor lead frame from the loading stage to the buffer area.

[0009] A cleaning unit is installed on the other side of the buffer area. The cleaning unit includes a cleaning chamber and an RF power supply. A retractable cleaning stage is provided in the cleaning chamber. After the cleaning stage extends into the buffer area, it carries the semiconductor lead frame and moves it into the cleaning chamber. After the RF power supply is turned on, it generates plasma in the cleaning chamber to clean the semiconductor lead frame.

[0010] In a preferred embodiment of the present invention, the loading section includes a loading module and a loading pusher. The loading modules are multiple and arranged in parallel. The loading pusher is located on the surface of the loading stage to push multiple semiconductor lead frames out of the loading stage simultaneously.

[0011] In a preferred embodiment of the present invention, the loading platform is provided with a plurality of partition blocks to form a plurality of loading troughs, and the loading troughs correspond one-to-one with the transfer blocks.

[0012] In a preferred embodiment of the present invention, the material transfer module includes a lateral transfer module and a lifting module, and the material transfer rod is mounted on the lifting module to perform lifting and lateral movement.

[0013] In a preferred embodiment of the present invention, there are multiple transfer blocks that are spaced apart along the length of the transfer rod, and each transfer block has a protrusion at its end to push out the semiconductor lead frame.

[0014] In a preferred embodiment of the present invention, a drive cylinder is provided outside the cleaning chamber, and the drive cylinder is connected to the end of the cleaning platform to reciprocate the cleaning platform between the cleaning chamber and the buffer area.

[0015] In a preferred embodiment of the present invention, the cleaning stage includes a front end plate, a carrier plate, and a plurality of carrier blocks. The front end plate is connected to the piston rod of the driving cylinder, the carrier plate is fixedly connected to the front end plate, and the carrier blocks are spaced apart along the length of the carrier plate. A material groove is formed between adjacent carrier blocks to accommodate the semiconductor lead frame.

[0016] In a preferred embodiment of the present invention, a plurality of guide wheels are provided on the carrier plate, and the guide wheels cooperate with the guide groove located in the cleaning chamber to guide the movement of the carrier plate.

[0017] In a preferred embodiment of the present invention, a pressure cap is provided on the top of the cleaning chamber, and a vacuum connection pipe is connected to the bottom of the cleaning chamber to connect to an external vacuum pump.

[0018] In a preferred embodiment of the present invention, a first electrode is provided on the pressure cap, the first electrode is electrically connected to the radio frequency power supply, and a second electrode is provided in the cleaning chamber. The second electrode is a ground electrode. After the radio frequency power supply energizes the first electrode, it works with the second electrode to generate plasma in the cleaning chamber.

[0019] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0020] The semiconductor lead frame plasma cleaning machine of this invention adopts a structure in which the frame, loading section, transfer section and cleaning section cooperate with each other, realizing the full automation of the semiconductor lead frame loading, transfer and cleaning process. It eliminates the need for manual intervention in loading and unloading operations, avoiding the risk of pollution to the clean production environment caused by human intervention. At the same time, the response speed of each functional module is fast, which can quickly complete the receiving, transfer and cleaning operations of semiconductor lead frames. It can achieve precise and seamless docking with upstream and downstream automated transmission equipment, adapting to the highly integrated and efficient fully automated production line operation requirements of modern semiconductor manufacturing production lines, improving the overall efficiency and cleanliness of semiconductor lead frame cleaning operations, so as to ensure the stable use of semiconductor lead frames in the future. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0022] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0023] Figure 2 This is a partial structural diagram of a preferred embodiment of the present invention;

[0024] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0025] Figure 4 This is a first partially exploded view of a preferred embodiment of the present invention;

[0026] Figure 5 This is a second partially exploded view of a preferred embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the cleaning platform according to a preferred embodiment of the present invention;

[0028] In the diagram: 10. Frame; 11. Loading platform; 12. Buffer area; 13. Unloading platform; 20. Loading section; 21. Loading module; 22. Loading pusher; 30. Transfer section; 31. Transfer module; 311. Horizontal transfer module; 312. Lifting module; 32. Transfer rod; 33. Transfer block; 331. Protrusion block; 40. Cleaning section; 41. Cleaning chamber; 411. Second electrode; 42. RF power supply; 50. Cleaning platform; 51. Front end plate; 52. Carrier plate; 53. Carrier block; 60. Separator block; 70. Drive cylinder; 80. Guide wheel; 90. Pressure cap; 901. First electrode; 100. Vacuum connection tube. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0030] This embodiment provides a semiconductor lead frame plasma cleaning machine. The machine employs a structure in which a frame 10, a loading section 20, a transferring section 30, and a cleaning section 40 work together to automate the entire process of loading, transferring, and cleaning semiconductor lead frames. This eliminates the need for manual intervention in loading and unloading, avoiding the risk of contamination to the clean production environment caused by human intervention. Simultaneously, each functional module has a fast response speed, enabling rapid completion of semiconductor lead frame receiving, transferring, and cleaning operations. It can achieve precise and seamless integration with upstream and downstream automated transmission equipment, adapting to the highly integrated and efficient fully automated production line requirements of modern semiconductor manufacturing lines. This improves the overall efficiency and cleanliness of the semiconductor lead frame cleaning operation, ensuring stable use of the semiconductor lead frames subsequently.

[0031] Combination Figures 1 to 6As shown in this embodiment, the semiconductor lead frame plasma cleaning machine is mainly composed of four functional modules: a frame 10, a loading section 20, a transfer section 30, and a cleaning section 40. These modules work together to automate the process of semiconductor lead frames from the point of cleaning to the point of completion. Specifically, the frame 10 serves as the overall support frame of the equipment, with a loading platform 11, a buffer area 12, and an unloading platform 13 arranged sequentially along its length. The loading platform 11 primarily carries and neatly places the semiconductor lead frame raw materials awaiting cleaning. The buffer area 12 acts as a temporary transfer station, used for brief stops and positioning of the semiconductor lead frames during transfer between different processes. The unloading platform 13 is responsible for securely placing the semiconductor lead frames that have completed plasma cleaning. Its position is designed to facilitate direct and smooth material handling by downstream automated equipment, such as robotic arms or conveyor belts, ensuring the continuity of the production line.

[0032] The loading unit 20 is integrated into one end of the rack 10 near the loading platform 11. The core function of this module is to actively perform the loading action. Through a pushing mechanism, it smoothly pushes out the semiconductor lead frames to be cleaned, which were originally stationary on the loading platform 11, thus automatically and accurately completing the initial loading step of the semiconductor lead frames and preparing them for subsequent transfer processes. The transfer unit 30 is installed on one side of the buffer area 12, and it undertakes the crucial task of transferring materials within the rack 10. The transfer unit 30 includes a transfer module 31, a transfer rod 32 driven by this module, and a transfer block 33 fixed to the end of the transfer rod 32 for directly supporting the semiconductor lead frames. During operation, the transfer module 31 receives control signals and drives the transfer rod 32 to perform linear or rotary motion, enabling the transfer block 33 to accurately reach the push-out position of the loading platform 11, receive the pushed-out semiconductor lead frames, and then safely and efficiently transfer them to the designated buffer area 12 for temporary storage.

[0033] The cleaning unit 40, serving as the core process unit, is located on the other side of the buffer area 12, opposite the transfer unit 30. The cleaning unit 40 mainly includes a sealed cleaning chamber 41 and an RF power supply 42 for generating the active particles required for cleaning. A retractable cleaning stage 50 is designed within the cleaning chamber 41, a design that greatly enhances the flexibility and integration of the equipment. When the system commands material handling, the cleaning stage 50 extends from the cleaning chamber 41, its trajectory precisely extending into the buffer area 12 to smoothly receive the semiconductor lead frame temporarily stored therein. Subsequently, the cleaning stage 50, carrying the semiconductor lead frame, retracts completely into the sealed cleaning chamber 41. At this time, the radio frequency power supply 42 is turned on. After the first electrode 901 located in the cleaning chamber 41 is energized, it works with the second electrode 411 to generate high-energy, uniform plasma in the chamber. These active particles react physically or chemically with the contaminants on the surface of the semiconductor lead frame, thereby achieving efficient and non-destructive cleaning and completing the entire automated cleaning process.

[0034] In this embodiment, the loading unit 20 specifically includes a loading module 21 and several dedicated loading pushers 22. There are multiple loading modules 21, arranged in parallel within the loading area. This parallel layout allows multiple semiconductor lead frames to be processed simultaneously and synchronously. The loading pushers 22 are precisely arranged one-to-one above the surface of the loading platform 11, designed so that each pusher can accurately act on its corresponding semiconductor lead frame. When a loading command is issued, these loading pushers 22 move in a coordinated manner, pushing the multiple semiconductor lead frames supported on the loading platform 11 forward parallel and smoothly. This achieves simultaneous loading of multiple semiconductor lead frames, greatly optimizing the process cycle and significantly improving the overall loading efficiency and production capacity of the equipment.

[0035] To ensure that multiple semiconductor leadframes remain orderly, independent, and non-interfering during the loading process, several robust partition blocks 60 are installed on the plane of the loading stage 11. These partition blocks 60 are arranged according to a preset spacing rule, precisely dividing the surface of the loading stage 11 to form several independent loading slots of uniform size. Each loading slot precisely corresponds to and accommodates one semiconductor leadframe to be cleaned, providing it with a stable and standardized temporary storage position. Crucially, the layout of these loading slots is meticulously designed to achieve a one-to-one correspondence with the arrangement of the transfer blocks 33 in the transfer unit 30. This precise matching of positions fundamentally ensures that during the transfer process, each semiconductor leadframe can be accurately grasped or pushed by the corresponding transfer block 33, achieving continuity and precision from storage positioning to transfer execution, and ensuring high reliability and high accuracy of the entire automated process.

[0036] In this embodiment, the transfer module 31 is the core execution unit of the automated semiconductor leadframe transfer system. Its main structure includes a lateral movement module 311 responsible for lateral movement and a lifting module 312 responsible for vertical movement. The two work together to achieve three-dimensional spatial positioning of the semiconductor leadframe. Specifically, the transfer rod 32, as a direct load-bearing and connecting component, is fixedly installed on the main structure of the lifting module 312. During operation, the lateral movement module 311 provides driving power along the length of the frame 10, thereby driving the entire lifting module 312 and the transfer rod 32 to complete an overall lateral translational movement, realizing the horizontal position adjustment of the semiconductor leadframe. At the same time, the lifting module 312 works independently, and its built-in drive mechanism can precisely control the vertical lifting movement of the transfer rod 32. Through the combined motion of lateral movement and lifting, the transfer rod 32 ultimately achieves lifting and lateral movement in space. This enables the transfer block 33 carried at its end to be precisely positioned in the loading tank or buffer area 12 to the semiconductor lead frame. In this way, it works in coordination with the transfer block 33 to complete a series of automated operations such as precise and efficient gripping, transfer and placement of the semiconductor lead frame.

[0037] Furthermore, to meet the high-efficiency production requirements of simultaneously processing multiple semiconductor leadframes, multiple transfer blocks 33 are designed and evenly distributed along the length of the transfer rod 32 at a preset, regular interval. Each individual transfer block 33 has a carefully designed and machined protrusion 331 structure at its end. This protrusion 331 is a key contact component for performing the transfer action, and its shape and size are optimized to accurately contact the side edge of the semiconductor leadframe. During the transfer process, the protrusion 331 applies a smooth and uniform pushing or supporting force to the side of the semiconductor leadframe, thereby pushing or guiding the semiconductor leadframe to slide or move on a preset track, ensuring that the semiconductor leadframe maintains a stable posture throughout the entire transfer path, effectively avoiding the sliding, tilting, or collision of the semiconductor leadframe, and realizing the smooth and reliable transfer of the semiconductor leadframe from the starting position to the target position.

[0038] In this embodiment, to automate the transfer of semiconductor lead frames between the cleaning station and the buffer position, a drive cylinder 70 is installed outside the cleaning chamber 41. The output end of the drive cylinder 70, i.e., its piston rod, is directly connected to the front end plate 51 of the cleaning stage 50 via a robust mechanical connection. By controlling the extension and retraction of the drive cylinder 70, the entire cleaning stage 50 can be driven to reciprocate linearly between its working position inside the cleaning chamber 41 and the external buffer area 12, thereby reliably executing the key actions of receiving the semiconductor lead frames to be cleaned from the buffer area 12 and returning the cleaned semiconductor lead frames to the buffer area 12.

[0039] The cleaning stage 50, as the core component directly supporting and positioning the semiconductor leadframes, has a crucial structural design. It is specifically composed of a front-end plate 51, a carrier plate 52, and several independent and parallel carrier blocks 53. The front-end plate 51, as a force-bearing component directly connected to the piston rod of the drive cylinder 70, is responsible for transmitting the driving force to the entire stage. The carrier plate 52 is fixedly connected to the front-end plate 51 (e.g., by bolts or welding), forming a stable overall frame. Several carrier blocks 53 are regularly spaced and fixedly installed on the carrier plate 52 along its length, according to a preset, precise spacing. The gaps between adjacent carrier blocks 53 naturally form a matching accommodating space, i.e., a material slot. Each independent material slot is specifically designed to precisely accommodate and position one semiconductor leadframe. This parallel arrangement design enables the simultaneous and stable positioning and support of multiple semiconductor leadframes on the same stage, greatly improving the processing capacity for a single operation.

[0040] To ensure the cleaning platform 50 operates smoothly, accurately, and without jamming during its reciprocating stroke of several meters, several rolling guide wheels 80 are installed at key locations on the bottom or side of the carrier plate 52. These guide wheels 80 precisely engage with correspondingly shaped guide grooves pre-installed on the internal track of the cleaning chamber 41. When the drive cylinder 70 moves the platform, the guide wheels 80 roll within the guide grooves, forming a highly efficient rolling guide pair. This design effectively constrains the platform's degrees of freedom, ensuring it moves strictly along a preset straight path and correcting any lateral deviations or torsional sway, thereby guaranteeing the stability and smoothness of the entire transfer process and the accuracy of the final positioning.

[0041] The core energy for plasma cleaning comes from the radio frequency (RF) power supply 42. This RF power supply 42 acts on the first electrode 901, which is positioned opposite the second electrode 411, forming a capacitive coupling discharge structure. A high-frequency RF voltage is applied to the first electrode 901, forming a circuit with the second electrode 411 located in the cleaning chamber 41 and grounded, establishing an alternating electric field between the two electrodes. In a vacuum environment, the electric field accelerates free electrons, which collide with the process gas, causing ionization and generating plasma. This plasma is located within the sealed cleaning chamber 41. These highly reactive plasmas come into full contact with the surface of the semiconductor lead frame placed in the carrier tank, effectively removing organic contaminants, oxide particles, or micro-residues adhering to the surface through physical bombardment and / or chemical reactions, thereby completing a high-cleanliness cleaning operation.

[0042] To meet the specific environmental conditions required for efficient plasma generation and maintenance, a sealable cover 90 is designed and installed on the top of the cleaning chamber 41. The cover 90, in conjunction with multiple pressing cylinders, seals the cleaning chamber 41. A first electrode 901 is mounted on the cover 90. Furthermore, a vacuum connection pipe 100 connects the cleaning chamber 41 to an external vacuum pump. After the cleaning program is started, the external vacuum pump begins operation, continuously extracting air from the sealed cleaning chamber 41, rapidly reducing the internal pressure to the required vacuum level (10 Torr). This vacuuming process is crucial; it not only creates the necessary low-pressure environment for stable plasma generation and diffusion but also prevents airborne impurities from interfering with the cleaning process, ensuring the effectiveness and consistency of the plasma cleaning process.

[0043] In actual use, the semiconductor lead frame plasma cleaner of this embodiment uses upstream and downstream automated transmission equipment to sequentially deliver the semiconductor lead frames to be cleaned to the loading platform 11 of the equipment. Each semiconductor lead frame is separated and positioned in the corresponding loading slot by the separator 60, completing the loading preparation. Then, the loading module 21 drives the corresponding loading push block 22 to move synchronously, pushing multiple semiconductor lead frames out of the loading platform 11 at the same time. The transfer module 31 drives the transfer block 33 at the end of the transfer rod 32 to move precisely to the receiving position through a combination of horizontal and vertical movements. The protrusion 331 at the end of each transfer block 33 is aligned with the side of the corresponding semiconductor lead frame. After receiving the pushed-out semiconductor lead frame, the whole module moves laterally to transfer the semiconductor lead frame to the buffer area 12 for temporary storage. After the transfer is completed, the transfer module 31 is reset, waiting for the next transfer action. Meanwhile, the drive cylinder 70 outside the cleaning chamber 41 is activated, driving the cleaning stage 50 to extend from the cleaning chamber 41 into the buffer area 12. Each material tank on the cleaning stage 50 is precisely aligned with the semiconductor lead frame to be cleaned in the buffer area 12. After receiving the semiconductor lead frame, the drive cylinder 70 retracts, driving the entire cleaning stage 50 back into the sealed cleaning chamber 41. Subsequently, the external vacuum pump is activated to evacuate the cleaning chamber 41 to the required vacuum level. Then, the RF power supply 42 is activated, generating plasma in the chamber through the cooperation of the first electrode 901 and the second electrode 411 to perform cleaning operations on the surface of the semiconductor lead frame. After cleaning, the external vacuum pump breaks the chamber, and the drive cylinder 70 extends again to send the cleaned semiconductor lead frame back to the buffer area 12. Then, the transfer module 31 operates again to transfer the cleaned semiconductor lead frame to the unloading stage 13, and finally, the downstream automated equipment picks it up to complete the entire process. The entire operation requires no human intervention and is fully automated, meeting the continuous and efficient production needs of modern production lines.

[0044] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A semiconductor lead frame plasma cleaning machine, characterized in that, include The frame (10) is provided with a loading platform (11), a buffer area (12) and a unloading platform (13) in sequence along its length. The loading section (20) is disposed at one end of the frame (10) near the loading platform (11) to push the semiconductor lead frame out from the position of the loading platform (11); The transfer unit (30) is installed on one side of the buffer area (12). The transfer unit (30) includes a transfer module (31), a transfer rod (32), and a transfer block (33). The transfer module (31) drives the transfer rod (32), and the transfer block (33) is installed on the transfer rod (32) to transfer the semiconductor lead frame from the loading stage (11) to the buffer area (12). A cleaning unit (40) is installed on the other side of the buffer area (12). The cleaning unit (40) includes a cleaning chamber (41) and an RF power supply (42). A retractable cleaning stage (50) is provided in the cleaning chamber (41). After the cleaning stage (50) extends into the buffer area (12), it carries the semiconductor lead frame and moves it into the cleaning chamber (41). After the RF power supply (42) is turned on, it generates plasma in the cleaning chamber (41) to clean the semiconductor lead frame.

2. The semiconductor lead frame plasma cleaner according to claim 1, characterized in that, The loading section (20) includes a loading module (21) and a loading pusher (22). There are multiple loading modules (21) arranged in parallel. The loading pusher (22) is located on the surface of the loading platform (11) to push multiple semiconductor lead frames out of the loading platform (11) at the same time.

3. The semiconductor lead frame plasma cleaner according to claim 2, characterized in that, The loading platform (11) is provided with a number of partition blocks (60) to form a number of loading troughs, and the loading troughs correspond one-to-one with the material transfer blocks (33).

4. A semiconductor lead frame plasma cleaner according to claim 1, characterized in that, The material transfer module (31) includes a horizontal transfer module (311) and a lifting module (312). The material transfer rod (32) is installed on the lifting module (312) to perform lifting and horizontal movement.

5. A semiconductor lead frame plasma cleaner according to claim 4, characterized in that, The number of transfer blocks (33) is multiple and they are spaced apart along the length direction of the transfer rod (32). The end of each transfer block (33) has a protrusion (331) to push out the semiconductor lead frame.

6. A semiconductor lead frame plasma cleaner according to claim 1, characterized in that, A drive cylinder (70) is provided outside the cleaning chamber (41). The drive cylinder (70) is connected to the end of the cleaning platform (50) to move the cleaning platform (50) back and forth between the cleaning chamber (41) and the buffer area (12).

7. A semiconductor lead frame plasma cleaner according to claim 6, characterized in that, The cleaning stage (50) includes a front end plate (51), a carrier plate (52), and several carrier blocks (53). The front end plate (51) is connected to the piston rod of the drive cylinder (70). The carrier plate (52) is fixedly connected to the front end plate (51). The carrier blocks (53) are spaced apart along the length of the carrier plate (52), and a material groove is formed between adjacent carrier blocks (53) to accommodate the semiconductor lead frame.

8. A semiconductor lead frame plasma cleaner according to claim 7, characterized in that, The carrier plate (52) is provided with a plurality of guide wheels (80), which cooperate with the guide groove located in the cleaning chamber (41) to guide the movement of the carrier plate (52).

9. A semiconductor lead frame plasma cleaner according to claim 1, characterized in that, The cleaning chamber (41) is provided with a pressure cap (90) at the top and a vacuum connection pipe (100) is connected to the bottom of the cleaning chamber (41) to connect to an external vacuum pump.

10. A semiconductor lead frame plasma cleaner according to claim 9, characterized in that, The pressure cap (90) is provided with a first electrode (901), which is electrically connected to the radio frequency power supply (42). The cleaning chamber (41) is provided with a second electrode (411), which is a ground electrode. After the radio frequency power supply (42) powers on the first electrode (901), it works with the second electrode (411) to generate plasma in the cleaning chamber (41).

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