Bent-leg unit, bent-leg device, and mounting device

Abstract

Provided are a bent pin unit, a bent pin device, and a mounting device, which suppresses elements from toppling. The bent pin unit is for a bent pin device that bends first and second pins of an element inserted into a substrate, and includes: a bent pin portion having a first inclined surface that bends the first pin in a first direction and a second inclined surface that bends the second pin in a second direction different from the first direction; and a magnet portion provided to the bent pin portion and having at least one magnet.

Description

Technical Field

[0001] This disclosure relates to a bendable leg unit, a bendable leg device, and an installation device. Background Technology

[0002] Conventionally, as such a bending unit, a structure has been proposed for use in a bending device for bending the first and second pins of an element inserted into a substrate (see, for example, Patent Document 1). This bending unit includes a bending portion having a first guide groove and a second guide groove formed on an inclined surface in the inclined direction. The bending portion bends the first and second pins while guiding the first pin using the first guide groove and the second guide groove using the second guide groove.

[0003] Patent document 1: International Publication No. 2014 / 207802. Summary of the Invention The problem that the invention aims to solve

[0004] In the aforementioned bent-pin unit, when the first and second pins are bent and separated from each other at the bent-pin portion, the component may sometimes float off the substrate due to the elasticity of the first and second pins, causing the component to tip over. If such a component tipping occurs, it may sometimes interfere with other components mounted on the substrate after this component.

[0005] The bent leg unit, bent leg device and mounting device disclosed herein are primarily intended to prevent components from tipping over. Methods for solving problems

[0006] The bent leg unit, bent leg device, and mounting device disclosed herein employ the following means to achieve the aforementioned main objectives.

[0007] The first bending unit disclosed herein is used for a bending device that bends a first pin and a second pin of an element inserted into a substrate. The key feature of the bending unit is that it comprises: a bending portion having a first inclined surface for bending the first pin in a first direction and a second inclined surface for bending the second pin in a second direction different from the first direction; and a magnet portion disposed in the bending portion having at least one magnet.

[0008] The first bent-pin unit disclosed herein includes: a bent-pin portion having a first inclined surface for bending a first pin in a first direction and a second inclined surface for bending a second pin in a second direction different from the first direction; and a magnet portion disposed in the bent-pin portion having at least one magnet. In this bent-pin unit, after the first pin and the second pin are bent in the bent-pin portion, the magnetic force generated by the magnet in the magnet portion is used to restrict the movement of the first pin and the second pin, thereby suppressing the component from floating off the substrate. As a result, the bent-pin unit can suppress the component from tipping over.

[0009] The second bending unit disclosed herein is used for a bending device that bends a first pin and a second pin of an element inserted into a substrate. The key feature of the bending unit is that it has a bending portion having a first inclined surface that bends the first pin in a first direction and a second inclined surface that bends the second pin in a second direction different from the first direction. The first inclined surface and the second inclined surface are inclined in directions that are not opposite to each other.

[0010] The second bent-pin unit disclosed herein includes a bent-pin portion having a first inclined surface for bending a first pin in a first direction and a second inclined surface for bending a second pin in a second direction different from the first direction. The first and second inclined surfaces are inclined in directions that are not opposite to each other. Because the first and second inclined surfaces are inclined in directions that are not opposite to each other, the first and second pins can be bent in directions that are not opposite to each other. As a result, the bent-pin unit can suppress component tilting.

[0011] The bending device disclosed herein bends a first pin and a second pin of an element inserted into a substrate. The key feature of the bending device is that it comprises: a bending unit having a first inclined surface for bending the first pin in a first direction and a second inclined surface for bending the second pin in a second direction different from the first direction; a moving part for moving the element relative to the bending unit; and a control part for controlling the moving part such that after the element is brought into contact with the bending unit to bend the first pin and the second pin, the element is separated from the bending unit.

[0012] In this disclosed bending device, the moving part is controlled so that after the component is brought into contact with the bending unit to bend the first and second pins, the component is separated from the bending unit. If the component separates from the bending unit after the first and second pins are bent, the component will move towards the direction in which the first and second pins are inserted into the substrate due to its own weight. This prevents the component from floating off the substrate. As a result, the bending device can prevent the component from tipping over.

[0013] The essence of the mounting apparatus disclosed herein is that it includes a bending device according to any of the above-described embodiments, that is, a bending device that bends a first pin and a second pin of an element inserted into a substrate, and includes: a bending unit having a first inclined surface for bending the first pin in a first direction and a second inclined surface for bending the second pin in a second direction different from the first direction; a moving part for moving the element relative to the bending unit; and a control part for controlling the moving part such that after the first pin and the second pin are bent by contacting the element with the bending unit, the element is separated from the bending unit, and the mounting apparatus mounts the element onto the substrate.

[0014] The installation device disclosed herein, having a bent leg device of any of the above-described manner, can achieve the same effect as the bent leg device of this disclosure, such as the effect of preventing the component from tipping over. Attached Figure Description

[0015] Figure 1 This is a perspective view showing a schematic structure of the mounting device 10 according to the first embodiment. Figure 2 This is a block diagram showing the electrical connection relationships of the mounting device 10 according to the first embodiment. Figure 3 This is a perspective view of the base plate 62 of the first embodiment. Figure 4 This is a perspective view of the bending leg device 70 according to the first embodiment. Figure 5 This is a schematic cross-sectional view showing a schematic cross-section of the bending leg device 70 of the first embodiment. Figure 6 This is a flowchart illustrating an example of the installation process routine executed by the control device 90. Figure 7 This is a perspective view of the bending foot device 70 when component P is pressed in. Figure 8 This is a schematic cross-sectional view showing the bending leg device 70 when component P is pressed in. Figure 9 This is a perspective view of the bent-leg device 70 according to the second embodiment. Figure 10 This is a schematic top view of the bent-leg device 70 of the second embodiment as viewed from above. Figure 11 This is a perspective view of the bending foot device 70 when component P is pressed in. Figure 12 This is a rough top view of the bent leg device 70 when the component P is pressed in. Figure 13This is a schematic view showing the appearance of the bent-leg device 70C when viewed from the front. Figure 14 This is a schematic view showing the approximate appearance of the bent-leg device 70C when viewed from the right side. Figure 15 This is a flowchart illustrating an example of the installation process routine executed by the control device 90. Figure 16 This is a schematic diagram of the bent leg device 70C when the component P is pressed in, viewed from the front. Figure 17 This is an explanatory diagram showing an example of the bent-leg unit 72C detaching. Figure 18 This is an explanatory diagram used to illustrate the bending action of the bending device 70D. Figure 19 This is an explanatory diagram used to illustrate the disengagement action of the bending foot device 70D. Detailed Implementation

[0016] Embodiments of this disclosure will be described using the accompanying drawings. Figure 1 This is a perspective view showing a schematic structure of the mounting device 10 according to the first embodiment. Figure 2 This is a block diagram showing the electrical connection relationships of the mounting device 10 according to the first embodiment. Figure 3 This is a perspective view of the base plate 62 of the first embodiment. Figure 4 This is a perspective view of the bending leg device 70 according to the first embodiment. Figure 5 This is a schematic cross-sectional view showing a section of the bent leg device 70 of the first embodiment cut along a straight line parallel to the X-axis. Furthermore, in the first embodiment and the second and third embodiments described later, Figure 1 The left-right direction is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction. Furthermore, in the first embodiment and the second and third embodiments described later, the inclination direction of the inclined surface is set to be perpendicular to the intersection of the inclined surface and the horizontal plane. The horizontal plane is set to be perpendicular to... Figure 1 A plane that is parallel to the left and right directions.

[0017] Installation device 10 Figure 1 As shown, it includes a component supply device 20, a substrate handling device 30, a moving device 40, a head unit 50, a support device 60, a component camera 63, a marking camera 64, a nozzle storage device 66, and a control device 90 (see reference). Figure 2 ).

[0018] The component supply device 20 is provided at the front of the base 12 of the mounting device 10. It is, for example, a belt feeder with a belt reel 22 that holds components at predetermined intervals on the belt. Driven by a motor (not shown), the belt is pulled out from the belt reel 22 and components are supplied to the component supply position.

[0019] The substrate transport device 30 includes, for example, a pair of conveyor belts 32 that are spaced apart on the base 12 in the front-to-back direction (Y-axis direction) and mounted in the left-to-right direction. The belts 32 are driven by a motor (not shown), thereby transporting the substrate S from... Figure 1 Move the items from left to right.

[0020] The moving device 40 includes a guide rail 46 arranged along the Y-axis, a Y-axis slider 48 that moves along the guide rail 46, a guide rail 42 arranged on the Y-axis slider 48 along the X-axis, and an X-axis slider 44 that moves along the guide rail 42. A head unit 50 is mounted on the X-axis slider 44. The moving device 40 moves the head unit 50 in the XY direction by moving the X-axis slider 44 and the Y-axis slider 48.

[0021] The head unit 50 is configured, for example, as a single suction head with a suction nozzle 52 mounted on the axis, and includes an R-axis actuator 54 and a Z-axis actuator 56 (see reference). Figure 2 The head unit 50 is driven by the R-axis actuator 54, causing the nozzle 52 to rotate about the axis of the head unit 50. Furthermore, the head unit 50 is driven by the Z-axis actuator 56, causing the Z-axis slider 57 (see reference) to rotate. Figure 2 The suction nozzle 52 moves up and down along the Z-axis. A suction nozzle holding part 51 is provided at the lower end of the Z-axis slider 57 to hold the suction nozzle 52. Driven by the Z-axis actuator 56, the suction nozzle 52 moves up and down along the Z-axis. The suction nozzle 52 uses negative pressure to attract components to its front end and uses positive pressure to release the components. The suction nozzle 52 is held in the suction nozzle holding part 51 by negative pressure.

[0022] The support device 60 includes a support plate 61 that can be raised and lowered via a lifting device (not shown), and a base plate 62 mounted on the upper surface of the support plate 61. The base plate 62 is configured to be detachable from the support plate 61. A bending device 70 can be provided on the surface of the base plate 62. The bending device 70 is used to bend the first pin L1 and the second pin L2 of the element P inserted into the substrate S inward when the element P, which is a radial element, is mounted onto the substrate S. In an embodiment, three bending devices 70 can be provided on the surface of the base plate 62 to bend the pins of the elements P arranged in three rows on the substrate S. However, the number of elements P arranged on the substrate S is not limited to three rows; it can be two or fewer rows, or four or more rows. Multiple support pins 62a are appropriately erected on the base plate 62 in a portion that does not interfere with the bending devices 70 for supporting the substrate S from the back side. Figure 3 In the example, the support pin 62a is erected on the periphery, but if it is in a position that does not interfere with the bent foot device 70, the support pin 62a can also be erected on the inner side of the periphery.

[0023] The component camera 63 is positioned between the component supply device 20 and the substrate transport device 30. The area above the component camera 63 is the shooting range, and it takes pictures of the components and other objects being picked up by the suction nozzle 52 from below to generate images.

[0024] A marking camera 64 is mounted on the lower surface of the X-axis slider 44. The marking camera 64 captures an image of the object from above. Examples of objects that can be captured by the marking camera 64 include components supplied by the belt feeder of the component supply device 20, markings attached to the substrate S, and markings on the nozzles 52 in the nozzle storage 66.

[0025] The nozzle storage 66 is configured to accommodate various nozzles 52 of different sizes and shapes in each receiving section. The nozzles 52 stored in the nozzle storage 66 can be automatically replaced by the head unit 50. In addition, during the downtime of the installation device 10, the operator can remove the type of nozzle 52 stored in the nozzle storage 66 that is not needed for installation and accept the type of nozzle 52 that is needed for installation.

[0026] Bend-leg device 70 Figure 3 The device shown includes a base 71 and a bent-leg unit 72. The base 71 is a cuboid component with a magnet built into it, the lower surface of which can be attached to the upper surface of a base plate 62. The bent-leg unit 72 is erected on the upper surface of the base 71. The bent-leg unit 72 is as follows... Figure 4 , Figure 5The device shown includes a bent leg portion 73 and a magnet portion 74. The bent leg portion 73 is configured such that its upper part protrudes into two mountain shapes via a first inclined surface P1 and a second inclined surface P2, which are inclined relative to a horizontal plane parallel to the X-axis direction. A first guide groove G1 is formed on the first inclined surface P1 along the inclined direction. A second guide groove G2 is formed on the second inclined surface P2 along the inclined direction. The magnet portion 74 includes a first magnet M1 and a second magnet M2. The first magnet M1 is disposed within the bent leg portion 73 along the first guide groove G1. The second magnet M2 is disposed within the bent leg portion 73 along the second guide groove G2.

[0027] Control device 90, such as Figure 2 As shown, the microprocessor is configured with CPU 91 as its core. In addition to CPU 91, it also includes ROM 92, HDD 93, RAM 94, input / output interface (I / F) 95, etc. These are connected via bus 96. Control device 90 controls mounting device 10 to perform component mounting processing based on the production task of substrate S obtained from a management device (not shown). The production task includes data such as the mounting condition information, including the order in which components are mounted on substrate S in mounting device 10, and the number of substrates S with such mounted components to be produced. Furthermore, control device 90 automatically replaces the nozzle 52 mounted on head unit 50 with a nozzle 52 of a suitable size (diameter) and shape for component mounting, and obtains information about the size and shape of the mounted nozzle 52.

[0028] Furthermore, the control device 90 receives image signals from the part camera 63 and the marker camera 64 via the input / output interface 95. It should be noted that position sensors (not shown) are respectively installed on the X-axis slider 44, Y-axis slider 48, and Z-axis slider 57, and the control device 90 also receives position information from these position sensors. In addition, the control device 90 outputs drive signals to the component supply device 20, the substrate transport device 30, the X-axis actuator 45 that moves the X-axis slider 44, the Y-axis actuator 49 that moves the Y-axis slider 48, and the Z-axis actuator 56 that moves the Z-axis slider 57 via the input / output interface 95.

[0029] Next, the operation of the mounting device 10 of the first embodiment thus configured will be described, especially the mounting process of mounting element P on substrate S. Figure 6 This is a flowchart illustrating an example of an installation process routine executed by the control device 90 of the installation apparatus 10. This routine is stored in ROM 92 and is executed when the operator inputs an installation start using a management device (not shown). Before inputting such an installation start, the operator sets up the bending leg device 70 and the support pin 62a on the surface of the base plate 62.

[0030] If the routine begins, the control device 90 first obtains the mounting condition information of the substrate S from a management device (not shown) (S100), and causes the substrate transport device 30 to transport and fix the substrate S (S110). Next, the control device 90 sets the component P to be picked up by the suction nozzle 52 based on the configuration sequence of the mounting condition information (S120). If the component P is set, the control device 90 installs or replaces the suction nozzle 52 as needed, and causes the moving device 40 to pick up and transfer the component P (S130). At this time, the control device 90 moves the head unit 50 so that it passes over the imaging unit 18.

[0031] Next, the control device 90 causes the head unit 50 to perform a pressing process (S140) to press the first pin L1 and the second pin L2 of the component P into the substrate S. In this pressing process, after the control device 90 inserts the first pin L1 and the second pin L2 of the component P into the substrate S and causes the head unit 50 to press the component P, the head unit 50 is raised to a standby position above the component P. Figure 7 This is a perspective view of the bending foot device 70 when component P is pressed in. Figure 8 This is a schematic cross-sectional view showing the section of the bent leg device 70 when it is pressed into component P using a straight line parallel to the X-axis. (See attached image.) Figure 7 , Figure 8 As shown, the first pin L1 of component P abuts against and is guided by the first guide groove G1 of the first inclined surface P1, and bends inward and in a first direction along the inclination direction of the first inclined surface P1. Figure 7 , Figure 8As shown, the second pin L2 of component P abuts against and is guided by the second guide groove G2 of the second inclined surface P2, bending inward and in a second direction different from the first direction along the inclined direction of the second inclined surface P2. At this time, since the first pin L1 and the second pin L2 abut against the first guide groove G1 and the second guide groove G2 respectively, component P will float off the substrate S due to the elasticity of the first pin L1 and the second pin L2. In the embodiment, the first pin L1 and the second pin L2 are restricted from moving by the magnetic force generated by the first magnet M1 and the second magnet M2 of the magnet part 74, thus preventing component P from floating off the substrate S. As a result, the bending device 70 can prevent the component from tipping over. Furthermore, in the bending device 70, the bending of the first pin L1 and the second pin L2 is guided by the first guide groove G1 and the second guide groove G2, thus the first pin L1 and the second pin L2 can be bent into a more suitable shape. Furthermore, the magnet portion 74 includes a first magnet M1 disposed along the first guide groove G1 within the bent portion 73, and a second magnet M2 disposed along the second guide groove G2 within the bent portion 73. Therefore, in the bent portion device 70, separation of the first pin L1 and the second pin L2 from the first guide groove G1 and the second guide groove G2 can be suppressed. Consequently, in the bent portion device 70, the first pin L1 and the second pin L2 can be bent into a more suitable shape.

[0032] After S140, the control device 90 determines whether the current substrate mounting process is complete (S150). If not, it executes the process after S120. That is, the control device 90 sets the next component P to be picked up, moves the head unit 50, replaces the suction nozzle 52 as needed, and causes the moving device 40 to perform the suction and transfer process of component P. When the mounting process is completed in S150, the routine ends. If the mounting process routine ends, the operator removes the base plate 62 from the support plate 61 and inputs a discharge command for the substrate S into the management device (not shown). The control device 90 causes the substrate transport device 30 to perform the discharge process of the substrate S, which has been mounted. In the mounting device 10 of the first embodiment, component tipping can be suppressed, so it is possible to more appropriately mount multiple components P to the substrate, such as mounting three or more rows of components P to the substrate S.

[0033] Here, the correspondence between the constituent elements of the first embodiment and the constituent elements of this disclosure is clarified. The bending leg device 70 of the first embodiment is an example of the bending leg device of this disclosure, the bending leg unit 72 is an example of the bending leg unit, the bending leg portion 73 is an example of the bending leg portion, and the magnet portion 74 is an example of the magnet portion.

[0034] The mounting device 10 according to the first embodiment described above includes: a bent leg portion 73 having a first inclined surface P1 for bending the first pin L1 in a first direction and a second inclined surface P2 for bending the second pin L2 in a second direction different from the first direction; and a magnet portion 74 disposed on the bent leg portion 73 having a first magnet M1 and a second magnet M2, thereby suppressing the tilting of the component.

[0035] Furthermore, in the mounting device 10, a first guide groove G1 is formed on the first inclined surface P1 to guide the bending of the first pin L1, and a second guide groove G2 is formed on the second inclined surface P2 to guide the bending of the second pin L2, thereby enabling the first pin L1 and the second pin L2 to be bent into a more suitable shape.

[0036] Furthermore, in the mounting device 10, the magnet part 74 has a first magnet M1 disposed along the first guide groove G1 in the bent leg part 73, and a second magnet M2 disposed along the second guide groove G2 in the bent leg part 73, thereby enabling the first pin L1 and the second pin L2 to be bent into a more suitable shape.

[0037] In the first embodiment described above, the magnet portion 74 has a first magnet M1 and a second magnet M2 within the bent leg portion 73. However, the magnet portion 74 only needs to have at least one magnet; therefore, for example, it may have only one of the first magnet M1 and the second magnet M2, or it may have three or more magnets. Furthermore, the magnet portion 74 is not limited to a structure disposed within the bent leg portion 73, but may also be disposed on the surface of the bent leg portion 73.

[0038] In the first embodiment described above, a first guide groove G1 and a second guide groove G2 are formed on the first inclined surface P1 and the second inclined surface P2. However, the first guide groove G1 and the second guide groove G2 may not be formed on the first inclined surface P1 and the second inclined surface P2.

[0039] Next, the second embodiment will be described. Furthermore, the mounting device 10 of the second embodiment is structurally identical to the mounting device 10 of the first embodiment, except that the bending leg device 70 has a bending leg unit 72B instead of the bending leg unit 72. Furthermore, the control device 90 of the second embodiment performs the same processing as the control device 90 of the first embodiment. Therefore, for structures and processes in the mounting device 10 of the second embodiment that are identical to those in the mounting device 10 of the first embodiment, the same reference numerals are used and descriptions are omitted.

[0040] Figure 9 This is a perspective view of the bent-leg device 70 according to the second embodiment. Figure 10 This is a schematic top view showing the bent-leg device 70 of the second embodiment as viewed from above. Figure 9, Figure 10 In the diagram, the thick arrows indicate the inclination directions of the first inclined surface P1B and the second inclined surface P2B. The bent-leg unit 72B includes a bent-leg portion 73B. The bent-leg portion 73B is configured such that its upper part protrudes into two mountain shapes via the first inclined surface P1B and the second inclined surface P2B. The first inclined surface P1B is inclined in both the horizontal and front-back directions. The second inclined surface P2B is inclined in both the horizontal and front-back directions in a direction not opposite to the first inclined surface P1B.

[0041] In the mounting device 10 configured in this second embodiment, the control device 90 performs... Figure 5 The illustrated installation procedure. Figure 11 This is a perspective view of the bending device 70 when component P is pressed in. Figure 12 This is a schematic top view showing the bent leg device 70 when viewed from above as element P is pressed in. If control device 90 executes S140, then as Figure 11 , Figure 12 As shown, the first pin L1 of component P abuts against the first inclined surface P1B, and is bent in a twisting manner in a third direction, namely inward and backward, which is the direction of inclination. Figure 11 , Figure 12 As shown, the second pin L2 of component P abuts against the second inclined surface P2B and is bent in a twisting manner in the fourth direction, which is the inclination direction, i.e., inward and forward. That is, the first pin L1 and the second pin L2 are bent in directions that are not opposite to each other. In this way, in the bending device 70, by bending the first pin L1 and the second pin L2 in directions that are not opposite to each other, it is possible to prevent component P from floating off the substrate S due to the elasticity of the first pin L1 and the second pin L2. As a result, the bending device 70 can prevent the component from tipping over. Furthermore, in the mounting device 10 of the second embodiment, since the component tipping over can be prevented, it is possible to more appropriately mount multiple components P onto the substrate, such as mounting three or more rows of components P onto the substrate S.

[0042] Here, the correspondence between the constituent elements of the second embodiment and the constituent elements of this disclosure is clarified. The bending leg device 70 of the second embodiment is an example of the bending leg device of this disclosure, the bending leg unit 72B is an example of the bending leg unit, and the bending leg portion 73B is an example of the bending leg portion.

[0043] The mounting device 10 according to the second embodiment described above includes a bent leg portion 73B, which has a first inclined surface P1B that bends the first pin L1 in a third direction and a second inclined surface P2B that bends the second pin L2 in a fourth direction different from the third direction. The first inclined surface P1B and the second inclined surface P2B are inclined in directions that are not opposite to each other, thereby suppressing the tilting of the component.

[0044] In the second embodiment described above, the bent-leg unit 72B does not include a magnet portion with a magnet. However, the bent-leg unit 72B may also include a magnet portion. In this case, the magnet portion can be disposed at any position in the bent-leg portion 73B, such as inside the bent-leg portion 73B or on the surface of the bent-leg portion 73B, as long as the magnetic force generated by the magnet in the magnet portion is used to restrict the movement of the first pin L1 and the second pin L2. In this way, the component P can be prevented from floating off the substrate S by using the magnetic force generated by the magnet in the magnet portion. Thus, the tilting of the component can be prevented in the bent-leg unit 72B.

[0045] Next, the third embodiment will be described. The mounting device 10 of the third embodiment is structurally identical to the mounting device 10 of the first embodiment, except that it includes a bending leg device 70C instead of a bending leg device 70. Therefore, for structures in the mounting device 10 of the third embodiment that are identical to those in the mounting device 10 of the first embodiment, the same reference numerals will be used and descriptions will be omitted.

[0046] Figure 13 This is a schematic diagram showing the approximate appearance of the curved leg device 70C when viewed from the front. Figure 13 In the diagram, the blank arrows indicate the tilting directions of the first inclined surface P1 and the second inclined surface P2. Figure 14 This is a schematic diagram showing the approximate appearance of the bent-leg device 70C when viewed from the right side. Figure 14 In the diagram, the thick arrow indicates the rotation direction of the conveyor belt B of the moving part 76C, and the blank arrow indicates the movement direction of the bending unit 72C. The bending device 70C includes the bending unit 72C and the moving part 76C. The bending unit 72C is structurally identical to the bending unit 72 in the first embodiment, except that it lacks the magnet part 74, the first guide groove G1, and the second guide groove G2. The bending unit 72C includes a bending part 73C. The bending part 73C is configured as a component whose upper part protrudes into two mountain shapes through the first inclined surface P1 and the second inclined surface P2. The moving part 76C includes the conveyor belt B and the roller R. The bending unit 72C is placed on the conveyor belt B. The conveyor belt B is driven to rotate by the roller R, causing the bending unit 72C to move in a direction perpendicular to the inclination direction of the first inclined surface P1 and the second inclined surface P2, that is, in the direction of the intersection of the first inclined surface P1 and the second inclined surface P2 and the horizontal plane. In this embodiment, the conveyor belt B moves the bending unit 72C in the back-and-forth direction. Roller R is controlled by control device 90.

[0047] Next, the operation of the mounting device 10 configured in this third embodiment will be described, especially the mounting process for mounting the element P on the substrate S. Figure 15This is a flowchart illustrating an example of an installation processing routine executed by the control device 90 of the installation apparatus 10 according to the third embodiment. This routine is stored in ROM 92 and is executed when the operator inputs the start of installation using a management device (not shown). In the description of the installation processing routine executed by the control device 90 of the installation apparatus 10 according to the third embodiment, processes identical to those executed by the control device 90 of the installation apparatus 10 according to the first embodiment are marked with the same symbols as those executed by the control device 90 of the installation apparatus 10 according to the first embodiment, and detailed descriptions are omitted.

[0048] If the routine begins, the control device 90 first obtains the mounting condition information of the substrate S from a management device (not shown) (S100), and causes the substrate transport device 30 to transport and fix the substrate S (S110). Next, the control device 90 sets the component P to be picked up by the suction nozzle 52 based on the configuration sequence of the mounting condition information (S120). If the component P is set, the control device 90 controls the moving unit 76C to move the bent leg unit 72C below the mounting position of the component P based on the configuration sequence and mounting position of the mounting condition information (S200). Furthermore, the control device 90 installs or replaces the suction nozzle 52 as needed, and causes the moving device 40 to pick up and transfer the component P (S130). At this time, the control device 90 controls the head unit 50 to move so that it passes above the imaging unit 18.

[0049] Next, the control device 90 causes the head unit 50 to perform a pressing process (S140) to press the first pin L1 and the second pin L2 of the component P into the substrate S. Figure 16 This is a schematic diagram showing the bending device 70C when the component P is pressed in, viewed from the front. The first lead L1 of the component P abuts against the first inclined surface P1 and is bent inward along a fifth direction, which is the inclination direction of the first inclined surface P1. The second lead L2 of the component P abuts against the second inclined surface P2 and is bent along a sixth direction, which is the inclination direction of the second inclined surface P2. Furthermore, the control device 90 controls the moving part 76C to disengage the bending unit 72C from below the mounting position of the component P, thereby separating the bending unit 72C from the first lead L1 and the second lead L2 (S210). Figure 17This is an explanatory diagram showing an example of the bent-leg unit 72C detaching from the mounting position of component P. In the diagram, the thick solid arrow indicates the rotation direction of the transport belt B, the thick dashed arrow indicates the movement direction of the bent-leg unit 72C, and the thin dashed line represents the bent-leg unit 72C and component P after detachment. At this time, the control device 90 controls the moving part 76C to move the bent-leg unit 72C in the opposite direction to that in S200, causing relative movement between component P and the bent-leg unit 72C. Since the detachment of the bent-leg unit 72C occurs in a direction perpendicular to the tilt direction, interference between the first pin L1, the second pin L2, and the bent-leg unit 72C during detachment can be suppressed. Furthermore, since the bent-leg unit 72C detaches, the first pin L1 and the second pin L2 are no longer in contact with the first tilt surface P1 and the second tilt surface P2, and component P moves downward due to its own weight. Therefore, it is possible to prevent component P from floating off the substrate S. Thus, the bent-leg device 70 can suppress component tilting.

[0050] After S210, the control device 90 determines whether the current substrate mounting process is complete (S150). If not, it executes the process after S120. When the current substrate mounting process is complete in S150, the control device 90 controls the substrate transport device 30 to discharge the mounted substrate (S220). Furthermore, based on the mounting condition information, the control device 90 determines whether the production of the substrate S for which the mounting process should be performed is complete (S230). If not, it executes the process after S110. When the production is completed in S230, the control device 90 ends the routine. In the third embodiment, if the mounting process routine ends, the operator can start the next production without having to remove the base plate 62 from the support plate 61. Thus, production efficiency can be improved in the mounting device 10. In addition, in the third embodiment, since component tipping can be suppressed, the mounting of multiple components P onto the substrate S can be performed more appropriately, such as mounting of three or more rows of components P onto the substrate S.

[0051] Here, the correspondence between the constituent elements of the third embodiment and the constituent elements of this disclosure is clarified. The bending leg device 70 of the third embodiment is an example of the bending leg device of this disclosure, the bending leg unit 72C is an example of the bending leg unit, the moving part 76C is an example of the moving part, and the control device 90 is an example of the control part.

[0052] The mounting device 10 of the third embodiment described above includes: a bending unit 72C having a first inclined surface P1 that bends the first pin L1 in a fifth direction and a second inclined surface P2 that bends the second pin L2 in a sixth direction different from the fifth direction; and a moving part 76C that allows the component P to move relative to the bending unit 72C. Furthermore, the control device 90 controls the moving part 76C so that after the component P is brought into contact with the bending unit 72C to bend the first pin L1 and the second pin L2, the component P is separated from the bending unit 72C. Therefore, the component tilting can be suppressed in the mounting device 10.

[0053] Furthermore, the moving part 76C moves the element P and the bent leg unit 72C relative to each other in a direction perpendicular to the inclination direction of the first inclined surface P1 and the second inclined surface P2, thereby enabling the element P to come into contact with the bent leg unit 72C and to separate the element P from the bent leg unit 72C.

[0054] In the third embodiment described above, the moving part 76C moves the element P relative to the bent-leg unit 72C in a direction perpendicular to the tilting direction of the first tilting surface P1 and the second tilting surface P2. However, the direction in which the element P moves relative to the bent-leg unit 72C is not limited to a direction perpendicular to the tilting direction of the first tilting surface P1 and the second tilting surface P2. For example, it can also be set to the insertion direction in which the first pin L1 and the second pin L2 are inserted into the substrate S. Figure 18 This is an explanatory diagram illustrating the bending device 70D of the mounting apparatus 10 in other embodiments when bending the first pin L1 and the second pin L2. In the diagram, the blank arrows indicate the direction of movement of the bending unit 73C. Figure 19 This is an explanatory diagram illustrating the situation when the bending device 70D of the mounting apparatus 10 in another embodiment is separated from the first pin L1 and the second pin L2. In the diagram, blank arrows indicate the movement direction of the bending unit 73C, and thick arrows indicate the movement direction of the component P. The bending device 70D is structurally the same as the bending device 70C in the third embodiment, except that it has a moving part 76D instead of the moving part 76C. The moving part 76D is an actuator that moves the bending unit 72C in the vertical direction, that is, in the insertion direction in which the first pin L1 and the second pin L2 are inserted into the substrate S. Figure 18 As shown, the control device 90 controls the moving part 76D to move the bending unit 72C upward, causing the first inclined surface P1 and the second inclined surface P2 to abut against the first pin L1 and the second pin L2, thus bending the first pin L1 and the second pin L2. Once the bending of the first pin L1 and the second pin L2 is complete, then... Figure 19As shown, the control device 90 controls the moving part 76D to move the bending unit 72C downward, causing the first inclined surface P1 and the second inclined surface P2 to separate from the first pin L1 and the second pin L2. When the first inclined surface P1 and the second inclined surface P2 separate from the first pin L1 and the second pin L2, the component P moves downward due to its own weight. Therefore, it is possible to prevent the component P from floating off the substrate S. Thus, the bending device 70 can prevent the component from tipping over.

[0055] In the third embodiment described above, the bent-leg unit 72C includes a bent-leg portion 73C and a moving portion 76C. However, the bent-leg unit 72C may also include a magnet portion having a first magnet M1 and a second magnet M2 in the bent-leg portion 73C. In this case, the first magnet M1 may be disposed within the bent-leg portion 73 along the first inclined surface P1, and the second magnet M2 may be disposed within the bent-leg portion 73 along the second inclined surface P2. Alternatively, the first magnet M1 and the second magnet M2 may be mounted on the surface of the bent-leg portion 73. Furthermore, this magnet portion only needs to have at least one magnet; therefore, for example, it may have only one of the first magnet M1 and the second magnet M2, or it may have three or more magnets.

[0056] In the third embodiment described above, the bent leg portion 73C has a first inclined surface P1 and a second inclined surface P2. However, the bent leg portion 73C may also have a first inclined surface P1B and a second inclined surface P2B that is not opposite to the first inclined surface P1B, similar to the bent leg portion 73B in the second embodiment.

[0057] This disclosure is not limited to the above-described embodiments. It goes without saying that anything within the technical scope of this disclosure can be implemented in various ways.

[0058] Industrial applicability This disclosure can be applied to industries such as the manufacture of bent leg units, bent leg devices, or mounting devices. Symbol Explanation

[0059] 10 Mounting device, 12 Base, 18 Imaging unit, 20 Component supply device, 22 Reel, 30 Substrate handling device, 32 Conveyor belt, 40 Moving device, 42 Guide rail, 44 X-axis slider, 45 X-axis actuator, 46 Guide rail, 48 Y-axis slider, 49 Y-axis actuator, 50 Head unit, 51 Nozzle holder, 52 Nozzle, 54 R-axis actuator, 56 Z-axis actuator, 57 Z-axis slider, 60 Support device, 61 Support plate, 62 Base plate, 62a Support pin, 63 Part camera, 64 Marking camera, 66 Nozzle storage, 70 Bend-leg device, 70C Bend-leg device, 70D Bend-leg device, 71 Base, 72 Bend-leg unit, 72B Bend-leg unit, 72C Bend-leg unit, 73 Bend-leg part, 73B 73C Bent leg, 74 Magnet part, 74C Moving part, 76C Moving part, 76D Moving part, 90 Control device, 91 CPU, 92 ROM, 93 HDD, 94 RAM, 95 Input / output interface, 96 Bus, B Transport belt, G1 First guide groove, G2 Second guide groove, L1 First pin, L2 Second pin, M1 First magnet, M2 Second magnet, P Element, P1 First inclined surface, P1B First inclined surface, P2 Second inclined surface, P2B Second inclined surface, R Roller, S Substrate.

Claims

1. A lead bending unit for a lead bending device, the lead bending device bending a first lead and a second lead of an element inserted into a substrate, The bent leg unit has: The bent-pin portion has a first inclined surface that bends the first pin in a first direction, and a second inclined surface that bends the second pin in a second direction different from the first direction; and The magnet part, disposed in the bent leg part, has at least one magnet.

2. The bent leg unit according to claim 1, wherein, A first guide groove is formed on the first inclined surface to guide the bending of the first pin. A second guide groove is formed on the second inclined surface to guide the bending of the second pin.

3. The bent leg unit according to claim 2, wherein, The magnet part has: A first magnet is disposed within the bent leg portion along the first guide groove; as well as The second magnet is disposed within the bent leg portion along the second guide groove.

4. A lead bending unit for a lead bending device, the lead bending device bending a first lead and a second lead of a component inserted into a substrate. The bent-leg unit has a bent-leg portion. The bent portion has a first inclined surface that bends the first pin in a first direction, and a second inclined surface that bends the second pin in a second direction different from the first direction. The first inclined surface and the second inclined surface are inclined in directions that are not opposite to each other.

5. The bent leg unit according to claim 4, wherein, The bent leg unit includes a magnet portion disposed on the bent leg portion and having at least one magnet.

6. A bending device for bending a first pin and a second pin of a component inserted into a substrate. The bending leg device includes: The bent-pin unit has a first inclined surface that bends the first pin in a first direction, and a second inclined surface that bends the second pin in a second direction different from the first direction; The moving part allows the component to move relative to the bent leg unit; as well as The control unit controls the moving part so that after the element abuts against the bent-pin unit to bend the first pin and the second pin, the element is separated from the bent-pin unit.

7. The bending leg device according to claim 6, wherein, The moving part moves the element relative to the bent-leg unit in the insertion direction in which the first pin and the second pin are inserted into the substrate.

8. The bending leg device according to claim 6, wherein, The moving part moves the element relative to the bent leg unit in a direction perpendicular to the inclination direction of the first inclined surface and the second inclined surface.

9. A mounting device comprising the bending leg device of claim 6 or 7 for mounting the element to the substrate.

10. The installation device according to claim 9, wherein, Multiple of the aforementioned elements are mounted on the substrate in at least three columns.

Images