A production device of wafer BGA package micro-tin ball

Abstract

The application relates to the technical field of tin ball manufacturing, and discloses a production device for wafer BGA encapsulation micro-tin balls, which comprises a bottom plate and a conveying frame installed on the top of the bottom plate, a plurality of groups of tin ball production units are equidistantly arranged on the outer side of the conveying belt of the conveying frame along the running direction of the conveying belt, each tin ball production unit moves synchronously with the conveying belt, and a tin injection unit for injecting tin liquid into the tin ball production units is arranged on the top of the conveying frame. The device drives the tin ball production units to move in cycles through the conveying belt, realizes automatic mold closing and mold opening through cooperation with a mold closing and opening component, and greatly improves the production efficiency; the mold closing action synchronously drives the extrusion plate to press the cooling water into the mold cavity and the cooling cavity, the mold is cooled during mold closing, and the mold is backflowed during mold opening, the cooling response is rapid, and the energy consumption is low; the interval gradual change characteristic of the radial guide rods is used to automatically separate different particle size tin balls during rolling and falling and make the tin balls fall into corresponding collection boxes, and no additional screening equipment is needed.

Description

Technical Field

[0001] This invention relates to the field of solder ball manufacturing technology, specifically to a production apparatus for wafer BGA packaged micro solder balls. Background Technology

[0002] In BGA packaging technology, solder balls are the core components that enable electrical and mechanical connections between the chip and the circuit board. The performance of the solder balls directly determines the performance of the packaged chip, and the fabrication of solder balls is the most fundamental and crucial step in the entire BGA packaging process. In recent years, with the rapid development of electronic products towards lighter, thinner, smaller, higher-performance, and more multifunctional designs, increasingly higher requirements have been placed on the dimensional accuracy, sphericity, surface quality, and particle size uniformity of BGA solder balls. From the 0.25-0.76mm solder balls in traditional BGA packaging to the 75-150μm micro-solder balls in wafer-level packaging, the size of the solder balls continues to shrink, continuously increasing the precision requirements for the fabrication process and equipment.

[0003] Through in-depth research, the inventors of this application have discovered that current production equipment for spherical solder balls is not only cumbersome in structure and has a low degree of automation, heavily reliant on manual intervention, but also lacks supporting functions for sorting solder balls with significant size differences, making it difficult to meet the needs of large-scale production in terms of overall efficiency. Summary of the Invention

[0004] This invention provides a production apparatus for micro solder balls in wafer BGA packaging, which aims to solve the problems of existing production apparatuses for spherical solder balls, which are not only cumbersome in structure and have low automation, but also heavily rely on manual intervention and lack supporting functions for sorting solder balls with significant size differences, making it difficult to meet the needs of large-scale production in terms of overall efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer BGA packaging micro solder ball production apparatus, comprising a base plate and a conveyor frame mounted on top of the base plate. Several sets of solder ball production units are equidistantly arranged on the outer side of the conveyor belt along its running direction. Each solder ball production unit moves synchronously with the conveyor belt. A solder injection unit for injecting molten solder into the solder ball production unit is provided at the top of the conveyor frame. A screening unit for sieving the formed solder balls is provided at the bottom of the conveyor frame. A fixed mold fitting component that cooperates with the solder ball production unit is fixedly arranged on the outer side of the conveyor frame. The fixed mold fitting component is used to drive the solder ball production unit to automatically close or release the mold. The solder ball production unit includes a fixed mold fixing assembly fixedly connected to the top of the conveyor belt. A fixed mold moving assembly is movably connected to the outside of the fixed mold fixing assembly. The fixed mold moving assembly moves away from or closer to the fixed mold fixing assembly under the linkage of the fixed mold mating parts, thereby realizing mold opening and mold closing. A fixed mold cooling assembly is provided on the outside of the fixed mold moving assembly. The fixed mold cooling assembly cools and solidifies the molten solder inside the fixed mold moving assembly by cooperating with the fixed mold moving assembly.

[0006] By adopting the above technical solution, the movable component of the fixed mold moves away from the fixed component of the fixed mold under the linkage of the fixed mold mating parts, realizing automatic mold opening and demolding. The molded solder balls fall off by themselves under the action of gravity without manual intervention. At the same time, the moving away action drives the cooling water to flow back and reset, completing the cooling cycle and preparing for the next round of mold closing and soldering, ensuring continuous and efficient production.

[0007] Preferably, the fixed mold fixing assembly includes a fixed box body fixedly connected to the outer surface of the conveyor belt. Several sets of arc-shaped fixed templates are fixedly connected to the top of the fixed box body by bolts. A connecting pipe is provided on the outer side of each arc-shaped fixed template. A transverse sliding groove is opened on all sides of each set of arc-shaped fixed templates.

[0008] Preferably, the fixed mold movable component includes a frame located outside the plurality of arc-shaped fixed mold plates, a connecting plate fixedly connected to one side of the frame, and arc-shaped fixed mold plates II fixedly connected to the inner side of the frame by fixing blocks. A connecting pipe II is provided on the outer side of each arc-shaped fixed mold plate II, and a sliding plate is fixedly connected to the bottom of the arc-shaped fixed mold plate II. The sliding plate slides in the corresponding transverse sliding groove. The fixed mold movable component also includes an L-shaped plate fixedly connected to the outside of the connecting plate. A positioning block is fixedly connected to the side of the L-shaped plate away from the connecting plate, and a spring is fixedly connected between the outside of the connecting plate and the fixed box.

[0009] Preferably, both the first and second arc-shaped fixed templates are hollow shells, and cooling cavities are formed in the wall thickness region of their inner walls. The cooling cavities in the first and second arc-shaped fixed templates are respectively connected to the fixed box body through connecting pipe one and connecting pipe two.

[0010] Preferably, the fixed mold cooling assembly includes a refrigeration unit installed inside the fixed box. Vertical grooves are provided on both sides of the fixed box. An extrusion plate is slidably connected in the vertical groove. The extrusion plate is tightly fitted to the inner wall of the fixed box. The extrusion plate divides the fixed box into upper and lower cavities. The upper cavity contains cooling water, which, due to the extrusion plate, enters the cooling chambers of the arc-shaped fixed template one and the arc-shaped fixed template two through the connecting pipe one and the connecting pipe two. The lower cavity contains cold gas emitted by the refrigeration unit. The extrusion plate is made of a thermally conductive material.

[0011] Preferably, the fixed mold cooling assembly further includes a connecting rod fixedly connected to the L-shaped plate, the connecting rod extending into the fixed box and fixedly connected to a wedge block, a mating block slidably connected to the outside of the wedge block, and the top of the mating block fixedly connected to the extrusion plate.

[0012] Preferably, the soldering unit includes a guide rail, a soldering furnace is fixedly connected to the outside of the guide rail, the soldering furnace is filled with molten solder, a number of soldering nozzles are provided at the bottom of the soldering furnace, an electric valve electrically connected to the control console is provided in the soldering nozzle, and soldering grooves adapted to the soldering nozzles are provided at the top of the first and second arc-shaped fixed templates.

[0013] Preferably, the screening unit includes an inclined frame located below one side of the conveyor frame. The inclined frame is placed on top of the base plate by a bracket. The inclined side of the inclined frame is open. Several guide rods are fixedly connected to the inclined outer side of the inclined frame, and each guide rod extends inclinedly away from the center of the inclined frame.

[0014] Preferably, the fixed mold fitting includes an arc-shaped strip plate fixedly connected to the conveyor frame. The arc of the arc-shaped strip plate is adapted to the conveyor belt. A guide groove is provided on the top of the arc-shaped strip plate. An inclined guide plate is fixedly connected to one side of the arc-shaped strip plate. The guide groove is adapted to the positioning block.

[0015] Preferably, the bottom of the guide rod is provided with several sets of collection boxes.

[0016] This invention provides a production apparatus for wafer BGA packaging micro solder balls. It has the following advantages: 1. This invention uses a conveyor belt to drive the solder ball production unit to move in a cycle, and with the help of a fixed mold fitting part, it realizes automatic mold closing and demolding without manual intervention, which greatly improves production efficiency.

[0017] 2. This invention uses a synchronous drive extrusion plate to press cooling water into the mold cavity cooling chamber during the mold closing action. Cooling occurs immediately upon mold closing and the water flows back upon demolding, resulting in rapid cooling response and low energy consumption. 3. This invention utilizes the gradually changing spacing of the radial guide rods to automatically separate solder balls of different sizes during the rolling process and allow them to fall into the corresponding collection boxes, eliminating the need for additional screening equipment. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the entire invention; Figure 2 This is a three-dimensional schematic diagram of the solder ball production unit of the present invention; Figure 3 This is an exploded view of the solder ball production unit of the present invention; Figure 4 This is a three-dimensional schematic diagram of the mold fixing component of the present invention; Figure 5 This is a three-dimensional schematic diagram of the fixed mold movable component of the present invention; Figure 6 For the present invention Figure 5 Enlarged 3D view of part A in the middle; Figure 7 This is a three-dimensional cross-sectional view of the interior of the fixed housing of the present invention; Figure 8 This is a three-dimensional schematic diagram of the fixed mold cooling assembly of the present invention; Figure 9 This is a three-dimensional schematic diagram of the soldering unit of the present invention; Figure 10 This is a schematic diagram of the installation of the fixed mold fitting part of the present invention; Figure 11 This is a three-dimensional schematic diagram of the mold fitting part of the present invention; Figure 12 This is a three-dimensional schematic diagram of the screening unit of the present invention; Figure 13 This is a schematic cross-sectional view of the arc-shaped template of the present invention.

[0019] The components include: 1. base plate; 2. conveyor frame; 3. Solder ball production unit; 301. Fixed mold fixing assembly; 3011. Fixed housing; 30111. Vertical slide; 3012. Arc-shaped fixed mold plate one; 3013. Connecting pipe one; 3014. Horizontal slide; 302. Fixed mold movable assembly; 3021. Frame; 3022. Connecting plate; 3023. Fixing block; 3024. Arc-shaped fixed mold plate two; 3025. Connecting pipe two; 3026. Slide plate; 3027. L-shaped plate; 3028. Positioning block; 3029. Spring; 303. Fixed mold cooling assembly; 3031. Refrigeration unit; 3032. Extrusion plate; 3033. Connecting rod; 3034. Wedge block; 3035. Mating block; 304. Solder injection tank; 4. Soldering unit; 401. Guide rail; 402. Soldering furnace; 403. Soldering nozzle; 5. Screening unit; 501. Angled frame; 502. Support; 503. Guide rod; 6. Fixed mold mating parts; 601. Arc-shaped strip; 602. Guide groove; 603. Inclined guide plate; 7. Collection box. Detailed Implementation

[0020] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see the appendix Figure 1 -Appendix Figure 13 This invention provides a wafer BGA package micro solder ball production apparatus, including a base plate 1 and a conveyor frame 2 mounted on the top of the base plate 1. Several sets of solder ball production units 3 are equidistantly arranged on the outer side of the conveyor belt of the conveyor frame 2 along its running direction. Each solder ball production unit 3 moves synchronously with the conveyor belt. A solder injection unit 4 for injecting molten solder into the solder ball production unit 3 is provided on the top of the conveyor frame 2. A screening unit 5 for screening the formed solder balls is provided on the bottom of the conveyor frame 2. A fixed mold fitting part 6 that cooperates with the solder ball production unit 3 is fixedly arranged on the outer side of the conveyor frame 2. The fixed mold fitting part 6 is used to drive the solder ball production unit 3 to automatically close or demold. The solder ball production unit 3 includes a fixed mold fixing component 301 fixedly connected to the top of the conveyor belt. A fixed mold moving component 302 is movably connected to the outside of the fixed mold fixing component 301. The fixed mold moving component 302 moves away from or closer to the fixed mold fixing component 301 under the linkage of the fixed mold mating part 6, thereby realizing mold opening and mold closing. A fixed mold cooling component 303 is provided on the outside of the fixed mold moving component 302. The fixed mold cooling component 303 cools and solidifies the solder liquid in the fixed mold moving component 302 by cooperating with the fixed mold moving component 302.

[0022] Specifically, the conveyor frame 2 drives several sets of solder ball production units 3 to move cyclically along a circular path. When the solder ball production unit 3 moves above the conveyor frame 2, the fixed mold movable component 302 is driven to approach the fixed mold fixed component 301 through the fixed mold mating component 6, so that the two are combined to form a complete spherical mold cavity. After the mold is closed, the solder injection unit 4 injects molten solder into the mold cavity, and the fixed mold cooling component 303 rapidly cools the molten solder in the mold cavity, so that the molten solder solidifies and forms a shape. During this process, the conveyor belt continues to drive the solder ball production unit 3 to move to the demolding station. When the solder ball production unit 3 moves below the conveyor frame 2, the fixed mold movable component 302 moves away from the fixed mold fixed component 301 through the cooperation of the fixed mold mating component 6, thereby realizing the mold opening and demolding. The formed solder balls fall into the screening unit 5 under the action of gravity. The screening unit 5 screens the falling solder balls, separating the solder balls that meet the particle size requirements from the solder balls that do not meet the requirements, and guides them to the collection box 7, thus automating the entire process of solder ball manufacturing.

[0023] Please see the appendix Figure 4 -Appendix Figure 8 and attached Figure 10 -Appendix Figure 11The fixed mold fixing component 301 includes a fixed box 3011 fixedly connected to the outer surface of the conveyor belt. Several sets of arc-shaped fixed templates 3012 are fixedly connected to the top of the fixed box 3011 by bolts. A connecting pipe 3013 is provided on the outer side of the arc-shaped fixed templates 3012. A transverse sliding groove 3014 is provided on the periphery of each set of arc-shaped fixed templates 3012. The fixed mold moving component 302 includes a frame 3021 located outside the several arc-shaped fixed templates 3012. A connecting plate 3022 is fixedly connected to one side of the frame 3021. Arc-shaped fixed templates 3024 are fixedly connected to the inner side of the frame 3021 by fixing blocks 3023. A connecting pipe 3025 is provided on the outer side of each arc-shaped fixed template 3024. A sliding plate 3026 is fixedly connected to the bottom of the arc-shaped fixed template 3024. The sliding plate 3026 slides in the corresponding transverse sliding groove 3014.

[0024] Specifically, the second arc-shaped fixed template 3024 and the first arc-shaped fixed template 3012 are in a separated state (open mold state). The slide plate 3026 is located at the end of the transverse slide 3014 away from the first arc-shaped fixed template 3012. When the conveyor belt transports the solder ball production unit 3 to the mold closing station, the external driving force pushes the connecting plate 3022. The connecting plate 3022 drives the frame 3021 to move closer to the first arc-shaped fixed template 3012. The fixed block 3023, which is fixedly connected to the inner side of the frame 3021, simultaneously drives several second arc-shaped fixed templates 3024 to move. The slide plate 3026 slides along the transverse slide 3014 towards the first arc-shaped fixed template 3012 until the second arc-shaped fixed template 3024 and the first arc-shaped fixed template 3012 close together and together form a complete spherical mold cavity. After the solder injection unit 4 injects the molten solder into the spherical mold cavity and cools it, the external driving force is removed. The connecting plate 3022 drives the frame 3021 to move away from the arc-shaped fixed template 3012. The fixing block 3023 simultaneously drives the arc-shaped fixed template 3024 away from the arc-shaped fixed template 3012. The sliding plate 3026 slides along the transverse sliding groove 3014 away from the arc-shaped fixed template 3012. The arc-shaped fixed template 3024 separates from the arc-shaped fixed template 3012, the spherical mold cavity opens, and the formed solder ball leaves the mold cavity under the action of gravity.

[0025] The fixed mold moving assembly 302 also includes an L-shaped plate 3027 fixedly connected to the outside of the connecting plate 3022. A positioning block 3028 is fixedly connected to the side of the L-shaped plate 3027 away from the connecting plate 3022. A spring 3029 is fixedly connected between the outside of the connecting plate 3022 and the fixed box 3011. The fixed mold mating part 6 includes an arc-shaped strip 601 fixedly connected to the conveyor frame 2. The arc of the arc-shaped strip 601 is adapted to the conveyor belt. A guide groove 602 is opened on the top of the arc-shaped strip 601. An inclined guide plate 603 is fixedly connected to one side of the arc-shaped strip 601. The guide groove 602 is adapted to the positioning block 3028.

[0026] Specifically, when the conveyor belt drives the solder ball production unit 3 to move along the arc-shaped strip 601, the positioning block 3028 first contacts the inclined guide plate 603 at a relatively far position. Under the guidance of the inclined guide plate 603, the positioning block 3028 slowly gets stuck in the guide groove 602. The guide groove 602 limits and guides the positioning block 3028. During the process of the positioning block 3028 getting stuck in the guide groove 602, the positioning block 3028 drives the frame 3021 to move closer to the arc-shaped fixed template 3012 through the L-shaped plate 3027 and the connecting plate 3022. The spring 3029 is in a compressed state, and the slide plate 3026 slides along the transverse slide groove 3014 to move closer to the arc-shaped fixed template 3012. The arc-shaped fixed template 3024 and the arc-shaped fixed template 3012 gradually approach each other and finally close the mold. After the soldering and cooling are completed, the conveyor belt continues to drive the solder ball production unit 3 to move along the arc-shaped strip 601. When the positioning block 3028 moves to the end of the arc-shaped strip 601, the positioning block 3028 disengages from the guide groove 602, the limiting constraint of the guide groove 602 on the positioning block 3028 is released, the spring 3029 elastically resets, and drives the connecting plate 3022 and the frame 3021 to move away from the arc-shaped fixed template 3012. The slide plate 3026 slides along the transverse slide groove 3014 away from the arc-shaped fixed template 3012. The arc-shaped fixed template 3024 separates from the arc-shaped fixed template 3012, realizing automatic demolding.

[0027] Both the arc-shaped fixed mold plate 1 3012 and the arc-shaped fixed mold plate 2 3024 are hollow shells, with cooling chambers formed in the wall thickness area of ​​their inner walls. The cooling chambers in the arc-shaped fixed mold plate 1 3012 and the arc-shaped fixed mold plate 2 3024 are connected to the fixed housing 3011 through connecting pipe 1 3013 and connecting pipe 2 3025, respectively. The fixed mold cooling assembly 303 includes a refrigeration unit 3031 installed inside the fixed housing 3011. Vertical sliding grooves 30111 are opened on both opposite sides of the fixed housing 3011. An extrusion plate 3032 is slidably connected in the vertical sliding grooves 30111. The extrusion plate 3032 is tightly fitted to the inner wall of the fixed housing 3011, and the extrusion plate 3032 holds the fixed housing 3011 in place. The interior is divided into upper and lower chambers. The upper chamber contains cooling water, which, due to the extrusion plate 3032, enters the cooling chambers of the arc-shaped fixed mold plate 3012 and the arc-shaped fixed mold plate 3024 through the connecting pipe 3013 and the connecting pipe 3025. The lower chamber contains cold gas emitted by the refrigeration unit 3031. The extrusion plate 3032 is made of thermally conductive material. The fixed mold cooling assembly 303 also includes a connecting rod 3033 fixedly connected to the L-shaped plate 3027. The connecting rod 3033 extends into the fixed housing 3011 and is fixedly connected to a wedge block 3034. A mating block 3035 is slidably connected to the outside of the wedge block 3034. The top of the mating block 3035 is fixedly connected to the extrusion plate 3032.

[0028] Specifically, the refrigeration unit 3031 sends cold gas into the lower cavity, and the cold gas in the lower cavity cools the lower surface of the extrusion plate 3032. Since the extrusion plate 3032 is made of thermally conductive material, the gas is then transferred to the cooling water in the upper cavity through the extrusion plate 3032, so that the cooling water in the upper cavity is kept at a low temperature. When the positioning block 3028 is engaged in the guide groove 602 and moves the L-shaped plate 3027, the L-shaped plate 3027 simultaneously moves the connecting rod 3033 fixedly connected to it. The connecting rod 3033 moves the wedge block 3034 toward the direction of the arc-shaped fixed template 3012. The inclined surface of the wedge block 3034 pushes the mating block 3035 to slide along the inclined surface of the wedge block 3034. The mating block 3035 moves the extrusion plate 3032 to slide upward along the vertical slide groove 30111. The extrusion plate 3032 extrudes the low-temperature cooling water in the upper cavity upward, so that the cooling water enters the cooling cavity of the arc-shaped fixed template 3012 and the arc-shaped fixed template 3024 through the connecting pipe 3013 and the connecting pipe 3025 respectively, thereby cooling the molten tin in the mold cavity and causing the molten tin to quickly solidify into a spherical shape. After the tinning and cooling are completed, when the positioning block 3028 slides out of the guide groove 602, the spring 3029 resets and drives the L-shaped plate 3027 and the connecting rod 3033 to reset and move closer to the arc-shaped fixed template 3012. The wedge block 3034 resets simultaneously, and the mating block 3035 slides down along the inclined surface of the wedge block 3034, driving the extrusion plate 3032 to slide down and reset along the vertical slide groove 30111. After the extrusion plate 3032 moves down, the volume of the upper cavity increases and forms a negative pressure. The cooling water in the cooling cavity flows back to the upper cavity of the fixed box 3011 through the connecting pipe 3013 and the connecting pipe 3025, thereby cooling the cooling water as a whole again.

[0029] Please see the appendix Figure 9 The soldering unit 4 includes a guide rail 401, a soldering furnace 402 fixedly connected to the outside of the guide rail 401, the soldering furnace 402 is filled with molten solder, a number of soldering nozzles 403 are provided at the bottom of the soldering furnace 402, and an electric valve electrically connected to the control console is provided in the soldering nozzle 403. The top of the arc-shaped fixed template 1 3012 and the arc-shaped fixed template 2 3024 are provided with soldering tanks 304 adapted to the soldering nozzles 403.

[0030] Specifically, after the arc-shaped fixed template 2 3024 and the arc-shaped fixed template 1 3012 are closed, the soldering furnace 402 moves downward along the guide rail 401 to the soldering station, so that the soldering nozzle 403 at the bottom of the soldering furnace 402 is aligned with the soldering tank 304 at the top of the arc-shaped fixed template 1 3012 and the arc-shaped fixed template 2 3024. The control console opens the electric valve, and the molten solder in the soldering furnace 402 is injected into the spherical mold cavity formed by the arc-shaped fixed template 1 3012 and the arc-shaped fixed template 2 3024 through the soldering nozzle 403 and the soldering tank 304.

[0031] Please see the appendix Figure 12The screening unit 5 includes an inclined frame 501 located below one side of the conveyor frame 2. The inclined frame 501 is placed on the top of the base plate 1 by a bracket 502. The inclined side of the inclined frame 501 is open. Several guide rods 503 are fixedly connected to the inclined outer side of the inclined frame 501. Each guide rod 503 extends inclinedly away from the center of the inclined frame 501. Several sets of collection boxes 7 are provided at the bottom of the guide rods 503.

[0032] Specifically, after the arc-shaped fixed template 2 3024 and the arc-shaped fixed template 1 3012 separate from the mold, the solidified solder ball falls from the mold cavity under the action of gravity into the inclined frame 501 below one side of the conveyor frame 2. The inclined frame 501 is inclined and its top is an open structure. After the solder ball falls into the inclined frame 501, it rolls along the inclined direction and is dispersed onto each guide rod 503. Each guide rod 503 extends obliquely away from the center of the inclined frame 501, that is, each guide rod 503 is radially distributed. The further away from the center of the inclined frame 501, the greater the distance between adjacent guide rods 503. Smaller solder balls fall from the gap between adjacent guide rods 503 in the early stage of rolling, while larger solder balls continue to roll forward along the guide rods 503. Then, solder balls of different sizes detach from the guide rods 503 in different positions and then enter the collection box 7 below.

[0033] Workflow: First, the conveyor belt of the conveyor frame 2 drives several groups of solder ball production units 3, which are equidistantly arranged on its outer side along the running direction, to move synchronously in a circular path. When a group of solder ball production units 3 moves to the mold closing station above the conveyor frame 2, the arc-shaped strip 601 and inclined guide plate 603, which are fixedly set on the outer side of the conveyor frame 2, cooperate with the positioning block 3028 on the L-shaped plate 3027 in the solder ball production unit 3. Under the guidance of the inclined guide plate 603, the positioning block 3028 slowly inserts into the guide groove 602 at the top of the arc-shaped strip 601. The guide groove 602 limits and guides the positioning block 3028. During this process, the positioning block 3028 slowly inserts into the guide groove 602 at the top of the arc-shaped strip 601. The guide groove 602 limits and guides the positioning block 3028. Position block 3028 drives frame 3021 to move closer to arc-shaped fixed template 3012 in fixed mold fixing assembly 301 via L-shaped plate 3027 and connecting plate 3022. Spring 3029 between the outer side of connecting plate 3022 and fixed box 3011 is compressed. Slide plate 3026 at the bottom of arc-shaped fixed template 3024, which is fixedly connected to the inner side of frame 3021 via fixed block 3023, slides along the transverse sliding groove 3014 opened on the periphery of arc-shaped fixed template 3012 towards arc-shaped fixed template 3012 until arc-shaped fixed template 3024 and arc-shaped fixed template 3012 close together and together form a complete spherical mold cavity. At the same time, the movement of the L-shaped plate 3027 synchronously drives the connecting rod 3033 fixedly connected to it to move. The connecting rod 3033 drives the wedge block 3034 at its end to move towards the arc-shaped fixed template 3012. The inclined surface of the wedge block 3034 pushes the mating block 3035 slidably connected to it to slide upward along the inclined surface. The mating block 3035 then drives the extrusion plate 3032 fixedly connected to its top to slide upward along the vertical sliding grooves 30111 opened on opposite sides of the fixed box 3011. The extrusion plate 3032 divides the interior of the fixed box 3011 into upper and lower cavities. The upper cavity contains cold The lower cavity contains cold gas emitted by the refrigeration unit 3031, and the extrusion plate 3032 is made of thermally conductive material. The cold gas in the lower cavity continuously cools the lower surface of the extrusion plate 3032 and transfers it to the cooling water in the upper cavity through the extrusion plate 3032 to keep it at a low temperature. When the extrusion plate 3032 slides upward, it squeezes the low-temperature cooling water in the upper cavity upward, so that the cooling water enters the cooling cavity formed by the wall thickness area of ​​the hollow shell of the arc-shaped fixed template 3012 through the connecting pipe 3013 on the outside of the arc-shaped fixed template 3012 and the connecting pipe 3025 on the outside of the arc-shaped fixed template 3024 respectively. The soldering furnace 402 of the soldering unit 4 moves downward along the guide rail 401 to the soldering station, aligning the soldering nozzle 403 at the bottom of the soldering furnace 402 with the soldering tank 304 set at the top of the arc-shaped fixed template 1 3012 and the arc-shaped fixed template 2 3024. The control console opens the electric valve inside the soldering nozzle 403, and the molten solder in the soldering furnace 402 is injected into the spherical mold cavity formed by the arc-shaped fixed template 1 3012 and the arc-shaped fixed template 2 3024 through the soldering nozzle 403 and the soldering tank 304. The molten solder injected into the mold cavity quickly solidifies into a spherical shape under the cooling effect of the continuous flow of low-temperature cooling water through the cooling chamber. After the soldering and cooling are completed, the conveyor belt continues to drive the solder ball production unit 3 to move along the arc-shaped strip 601. When the positioning block 3028 moves to the end of the arc-shaped strip 601, the positioning block 3028 disengages from the guide groove 602, and the guide groove 602 aligns with the positioning block 302. When the limit constraint of 8 is released, the compressed spring 3029 is elastically reset, which drives the connecting plate 3022 and the frame 3021 to move away from the arc-shaped fixed template 3012. The sliding plate 3026 slides along the transverse slide groove 3014 away from the arc-shaped fixed template 3012. The arc-shaped fixed template 3024 separates from the arc-shaped fixed template 3012 to achieve automatic mold opening. At the same time, the L-shaped plate 3027 and the connecting rod 3033 are reset with the frame 3021. The wedge block 3034 is reset synchronously. The mating block 3035 slides down along the inclined surface of the wedge block 3034, which drives the extrusion plate 3032 to slide down along the vertical slide groove 30111 to reset. After the extrusion plate 3032 moves down, the volume of the upper cavity increases and a negative pressure is formed. The cooling water in the cooling cavity flows back to the upper cavity of the fixed box 3011 through the connecting pipe 3013 and the connecting pipe 3025 for overall cooling again. After solidification, the solder balls fall from the open mold cavity under gravity into the screening unit 5 located below one side of the conveyor frame 2. The screening unit 5 includes an inclined frame 501 located below one side of the conveyor frame 2. The inclined frame 501 is placed on top of the base plate 1 by a bracket 502. Its inclined side is open, and several guide rods 503 are fixedly connected to the inclined outer side, all extending inclinedly away from the center of the inclined frame 501. The guide rods 503 are radially distributed, and the distance between adjacent guide rods 503 gradually increases as they move away from the center of the inclined frame 501. After the solder balls fall into the inclined frame 501, they follow the inclined direction... The solder balls roll in a direction and disperse onto each guide rod 503. Smaller solder balls fall from the gaps between adjacent guide rods 503 into the corresponding collection box 7 below during the initial rolling phase. Larger solder balls continue to roll forward along the guide rods 503 until they detach from the guide rods 503 at the corresponding positions and fall into the corresponding collection box 7. This completes a set of automated micro solder ball production processes, from mold closing, solder injection, cooling and solidification, mold opening and detachment to collection by particle size screening. The conveyor belt operates continuously, allowing each solder ball production unit 3 to sequentially perform the above processes, achieving continuous large-scale production.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A production apparatus for wafer BGA packaged micro solder balls, comprising a base plate (1) and a conveyor frame (2) mounted on top of the base plate (1), characterized in that: Several sets of solder ball production units (3) are equidistantly arranged on the outer side of the conveyor belt of the conveyor frame (2) along its running direction. Each solder ball production unit (3) moves synchronously with the conveyor belt. A solder injection unit (4) for injecting molten solder into the solder ball production unit (3) is provided on the top of the conveyor frame (2). A screening unit (5) for screening the formed solder balls is provided on the bottom of the conveyor frame (2). A fixed mold fitting part (6) that cooperates with the solder ball production unit (3) is fixedly arranged on the outer side of the conveyor frame (2). The fixed mold fitting part (6) is used to drive the solder ball production unit (3) to automatically close or demold. The solder ball production unit (3) includes a fixed mold fixing component (301) fixedly connected to the top of the conveyor belt. A fixed mold moving component (302) is movably connected to the outside of the fixed mold fixing component (301). The fixed mold moving component (302) moves away from or closer to the fixed mold fixing component (301) under the linkage of the fixed mold mating part (6), thereby realizing mold opening and mold closing. A fixed mold cooling component (303) is provided on the outside of the fixed mold moving component (302). The fixed mold cooling component (303) cools and solidifies the solder liquid in the fixed mold moving component (302) by cooperating with the fixed mold moving component (302).

2. The wafer BGA packaging micro-tin ball production apparatus according to claim 1, characterized in that, The fixed mold fixing assembly (301) includes a fixed box (3011) fixedly connected to the outer surface of the conveyor belt. Several sets of arc-shaped fixed templates (3012) are fixedly connected to the top of the fixed box (3011) by bolts. A connecting pipe (3013) is provided on the outside of the arc-shaped fixed templates (3012). A transverse sliding groove (3014) is provided on the periphery of each set of arc-shaped fixed templates (3012).

3. The wafer BGA packaging micro-tin ball production apparatus according to claim 2, characterized in that, The fixed mold movable component (302) includes a frame (3021) located outside the plurality of arc-shaped fixed mold plates (3012). A connecting plate (3022) is fixedly connected to one side of the frame (3021). Arc-shaped fixed mold plates (3024) are fixedly connected to the inner side of the frame (3021) through fixing blocks (3023). A connecting pipe (3025) is provided on the outer side of each arc-shaped fixed mold plate (3024). A sliding plate (3026) is fixedly connected to the bottom of the arc-shaped fixed mold plate (3024). The sliding plate (3026) slides in the corresponding transverse sliding groove (3014). The fixed mold movable component (302) also includes an L-shaped plate (3027) fixedly connected to the outside of the connecting plate (3022). A positioning block (3028) is fixedly connected to the side of the L-shaped plate (3027) away from the connecting plate (3022). A spring (3029) is fixedly connected between the outside of the connecting plate (3022) and the fixed box (3011).

4. The wafer BGA packaging micro-tin ball production apparatus according to claim 3, characterized in that, Both the arc-shaped fixed template one (3012) and the arc-shaped fixed template two (3024) are hollow shells, and cooling cavities are formed in the wall thickness area of ​​their inner walls. The cooling cavities in the arc-shaped fixed template one (3012) and the arc-shaped fixed template two (3024) are respectively connected to the fixed box (3011) through connecting pipe one (3013) and connecting pipe two (3025).

5. The wafer BGA packaging micro-tin ball production apparatus according to claim 4, characterized in that, The fixed mold cooling assembly (303) includes a refrigeration unit (3031) installed inside a fixed housing (3011). The fixed housing (3011) has vertical grooves (30111) on both sides. An extrusion plate (3032) is slidably connected in the vertical grooves (30111). The extrusion plate (3032) is tightly fitted to the inner wall of the fixed housing (3011). The extrusion plate (3032) divides the interior of the fixed housing (3011) into upper and lower cavities. The upper cavity contains cooling water, which, due to the compression of the extrusion plate (3032), enters the cooling chambers of the arc-shaped fixed template (3012) and the arc-shaped fixed template (3024) through the connecting pipe one (3013) and the connecting pipe two (3025). The lower cavity contains cold gas emitted by the refrigerator (3031). The extrusion plate (3032) is made of a thermally conductive material.

6. The wafer BGA packaging micro-tin ball production apparatus according to claim 5, characterized in that, The fixed mold cooling assembly (303) also includes a connecting rod (3033) fixedly connected to the L-shaped plate (3027). The connecting rod (3033) extends into the fixed box (3011) and is fixedly connected to a wedge (3034). A mating block (3035) is slidably connected to the outside of the wedge (3034). The top of the mating block (3035) is fixedly connected to the extrusion plate (3032).

7. The wafer BGA packaging micro-tin ball production apparatus according to claim 6, characterized in that, The soldering unit (4) includes a guide rail (401), a soldering furnace (402) is fixedly connected to the outside of the guide rail (401), the soldering furnace (402) is filled with molten solder, a number of soldering nozzles (403) are provided at the bottom of the soldering furnace (402), an electric valve electrically connected to the control console is provided in the soldering nozzle (403), and the top of the arc-shaped fixed template one (3012) and the arc-shaped fixed template two (3024) are provided with soldering tanks (304) adapted to the soldering nozzles (403).

8. The wafer BGA packaging micro-tin ball production apparatus according to claim 1, characterized in that, The screening unit (5) includes an inclined frame (501) located below one side of the conveyor frame (2). The inclined frame (501) is placed on the top of the base plate (1) by a bracket (502). The inclined side of the inclined frame (501) is open. Several guide rods (503) are fixedly connected to the inclined outer side of the inclined frame (501). Each guide rod (503) extends inclinedly away from the center of the inclined frame (501).

9. The wafer BGA package micro solder ball production apparatus according to claim 7, characterized in that, The fixed mold fitting (6) includes an arc-shaped strip (601) fixedly connected to the conveyor frame (2). The arc of the arc-shaped strip (601) is adapted to the conveyor belt. A guide groove (602) is provided on the top of the arc-shaped strip (601). An inclined guide plate (603) is fixedly connected to one side of the arc-shaped strip (601). The guide groove (602) is adapted to the positioning block (3028).

10. The wafer BGA packaging micro-tin ball production apparatus according to claim 8, characterized in that, Several sets of collection boxes (7) are provided at the bottom of the guide rod (503).

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