Wafer vacuum reflow soldering device

Abstract

The present application relates to a kind of wafer vacuum reflow soldering tooling equipment, belong to wafer reflow soldering technical field, solve the problem that existing wafer vacuum reflow soldering tooling equipment is not high in integration, the tooling equipment includes box structure, box structure is installed with module structure, getter unit and gas path unit, getter unit can discharge the gas in the welding storehouse in module structure on one hand, on the other hand can also be injected into the welding storehouse as formic acid injection power component, improve the integrated effect of tooling equipment, in addition, module structure includes cooling disc seat in welding storehouse, heating pipe and heating plate and the wafer drive component of wafer bearing and the heating plate drive component of drive heating plate movement, the uniform heating of heating plate by heating pipe can be realized to wafer uniform heating, after the uniform cooling of heating plate by cooling disc seat, wafer can be uniformly cooled, to guarantee the effect of wafer reflow soldering.

Description

Technical Field

[0001] This invention relates to the field of wafer reflow soldering technology, and more specifically, to a wafer vacuum reflow soldering fixture. Background Technology

[0002] Wafer reflow soldering is a processing method that melts and solidifies the metal material on the surface of a wafer to form spherical bumps. Traditional soldering processes cannot solder spherical bumps with microstructures onto the wafer surface. Therefore, reflow soldering technology is needed to process the wafer to form spherical bumps on the wafer surface. Before reflow soldering, the surface of the wafer is distributed with copper pillars and tin caps. The surface of the tin caps is flush. In order to form spherical bumps, reflow soldering uses a heating and cooling method. When heated, the tin caps are melted. The molten tin caps form bumps due to the surface tension of the liquid. After solidification, a spherical bump structure is formed on the wafer surface.

[0003] Therefore, wafer reflow soldering is widely used in the wafer manufacturing and processing field. Currently, there is a lot of research on wafer reflow soldering. For example, in order to ensure the effect of wafer reflow soldering and remove the metal oxides on the wafer surface, formic acid gas needs to be injected during wafer reflow soldering. Formic acid gas can reduce metal oxides to form metal elements, thereby ensuring the effect of wafer reflow soldering. For example, Chinese invention patent CN114029578A discloses a reflow soldering process and its module structure. This structure includes a lower sealing cavity and an upper sealing cavity. The upper sealing cavity descends and contacts the lower sealing cavity, and is sealed to form a vacuum cavity under the action of a sealing ring. An upper heating plate is provided on the upper sealing cavity, and a lower heating plate and a cold plate unit are provided on the lower sealing cavity. After the wafer is transferred to the lower heating plate, the lower heating plate rises and forms a closed process cavity with the upper heating plate. Nitrogen gas containing formic acid enters the process cavity through the inlet on the upper heating plate, and excess nitrogen gas is discharged into the exhaust duct of the equipment through the exhaust pipe on the upper heating plate. As can be seen from the structure of this module, formic acid needs to be injected during wafer reflow soldering to remove metal oxides from the wafer surface.

[0004] In addition, Chinese invention patent CN120400751A discloses an apparatus, method, and process equipment for removing and degassing wafer oxides. The apparatus includes a processing chamber, a heating module, a first air inlet, a second air inlet, and a first exhaust port. The processing chamber is used to perform a first-time surface metal oxide removal treatment on the wafer at a first temperature and a first pressure. The same processing chamber is also used to perform a second-time degassing treatment on the same wafer at a second temperature and a second pressure to remove surface oxygen and moisture. The first air inlet is located on one side of the processing chamber and is used to introduce formic acid gas into the processing chamber to remove surface oxygen and moisture. Under temperature and first pressure, it reacts with the metal oxides on the wafer surface to remove the metal oxides. The second air inlet is located on the side wall of the processing chamber and is used to introduce nitrogen or inert gas into the processing chamber when the first air inlet is closed, i.e., when the processing stage is not in which metal oxide removal is being performed, so as to perform degassing treatment on the wafer under the second temperature and second pressure. The first air extraction port is located on the bottom of the processing chamber and is used to control the first pressure or the second pressure inside the processing chamber by controlling the opening of the first air extraction port, so as to perform metal oxide removal treatment and degassing treatment respectively.

[0005] Although the above-mentioned module structure and device remove metal oxides from the wafer surface using formic acid, different power mechanisms are used for formic acid injection and venting. That is, one power mechanism is used for formic acid injection and another power mechanism is used for venting, resulting in a low degree of integration of the structure and failing to meet the requirements of system integration.

[0006] Therefore, the present invention provides a wafer vacuum reflow soldering fixture with a high degree of system integration, which meets the needs of wafer reflow soldering. Summary of the Invention

[0007] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of the invention, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0008] To address the technical problem of low integration in existing wafer vacuum reflow soldering technologies, the present invention adopts the following technical solution.

[0009] A wafer vacuum reflow soldering fixture includes a housing structure, a modular structure, an air intake unit, and an air path unit installed within the housing structure. The modular structure includes a frame unit, which includes a support platform. A welding chamber is provided on the surface of the support platform. The welding chamber includes a fixed chamber, and an inner cavity is formed within the fixed chamber. The wafer is placed in the inner cavity to complete the reflow soldering operation. The fixture is characterized in that the air intake unit is connected to the fixed chamber, and its operation can extract gas from the fixed chamber. Furthermore, the air intake unit is also connected to the air path unit to generate negative pressure on the air path unit, thereby facilitating the intake of formic acid into the welding chamber.

[0010] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture equipment, the bottom of the support platform is connected to an air extraction connector, which is connected to the interior of the fixed chamber. The air extraction unit includes an air extraction power component and an air extraction pipe. The air extraction pipe is connected to the fixed chamber through the air extraction connector. The air extraction power component can discharge the gas in the fixed chamber through the air extraction pipe. The gas path unit includes a formic acid pipeline assembly, which includes a formic acid tank, a buffer tank, and an atomizer. The formic acid tank and the buffer tank are siphonically connected, and the buffer tank is connected to the atomizer. The output end of the atomizer is connected to the soldering chamber. The air extraction unit also includes an air extraction pipe, one end of which is connected to the air extraction power component, and the other end is connected to the buffer tank. The air extraction power component can generate negative pressure in the buffer tank through the air extraction pipe. The negative pressure environment in the buffer tank, combined with the siphon method, draws the formic acid in the formic acid tank into the buffer tank.

[0011] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture equipment, the module structure further includes an upper cover unit. The upper cover unit includes a cover plate, which is movably disposed above the fixed chamber. An air pipe interface is installed on the cover plate. The output end of the atomizer is connected to the air pipe interface through a pipe. A uniform distribution disk I and a uniform distribution disk II are arranged sequentially from top to bottom inside the cover plate. Through holes are evenly distributed on the uniform distribution disk I and the uniform distribution disk II, and the through holes on the uniform distribution disk I and the uniform distribution disk II are staggered. After the formic acid gas enters the cover plate through the air pipe interface, it is evenly distributed through the uniform distribution disk I and the uniform distribution disk II before entering the fixed chamber.

[0012] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture equipment, the gas path unit further includes a gas source connection pipe. One end of the gas source connection pipe is connected to an inert gas tank, and the other end is connected to a connecting pipe through a valve island assembly. The connecting pipe is connected to a buffer tank. After the valve on the valve island assembly is opened, the inert gas enters the buffer tank through the gas source connection pipe and the connecting pipe, pressurizing the buffer tank. This allows the formic acid to enter the atomizer, be atomized, and then evenly distributed in the cover plate before entering the inner cavity. The formic acid reduces the metal oxides on the wafer surface. The gas path unit also includes gas pipe I and gas pipe II. One end of gas pipe I is connected to the gas source connection pipe through the valve island assembly, and the other end is connected to the gas pipe interface on the cover plate, allowing the inert gas to enter the inner cavity synchronously with the formic acid. Gas pipe II is connected to the gas source connection pipe through the valve island assembly, and the other end is connected to the fixed chamber. When the suction power assembly draws gas from the inner cavity, the inert gas enters the inner cavity through the gas source connection pipe and gas pipe II and is discharged from the inner cavity.

[0013] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture, a cooling plate is provided in the fixed chamber. The cooling plate has a ring structure, and a heating tube is installed in the groove of the cooling plate. A heating plate is provided above the cooling plate. The heating plate is supported by a support ring, which can move up and down in the fixed chamber to move the heating plate away from or closer to the cooling plate. When the wafer is heated, the heating plate moves away from the cooling plate, and the heating tube heats the heating plate. After being heated, the heating plate heats the wafer evenly. When the wafer is cooled, the heating plate moves the wafer down until the heating plate is in contact with the surface of the cooling plate. The cooling plate cools the heating plate and thus cools the wafer.

[0014] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture, the cooling plate cavity is filled with a cooling medium, and the bottom of the support platform is provided with an interface. There are two interfaces, one of which is connected to the cooling medium injection pipe and the other is connected to the cooling medium discharge pipe. The gas path unit also includes two cooling pipes, one of which is the cooling medium injection pipe and the other is the cooling medium discharge pipe. The cooling medium is injected into the cooling plate through one of the cooling pipes and the interface to facilitate subsequent wafer cooling operations. The cooling medium can be discharged through the other interface and the other cooling pipe, so that the cooling medium can continuously enter the cooling plate.

[0015] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture equipment, the module structure further includes a drive unit, which is mainly composed of a wafer drive unit. The wafer drive unit is used to support the wafer. The wafer drive unit includes a power component I. The power end of the power component I is connected to a moving plate. Multiple moving rods are connected to the surface of the moving plate. The ends of the moving rods extend into the fixed chamber and are slidably sealed with the fixed chamber. The ends of the moving rods are connected to a carrier. When it is necessary to support the wafer, the power component I operates to drive the moving plate to move, which in turn drives the moving rods to rise, causing the carrier to rise to support the wafer. After supporting the wafer, the power component I operates to drive the moving plate to descend, which in turn drives the moving rods, the carrier, and the wafer to descend.

[0016] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture, the drive unit further includes a heating plate drive unit. The heating plate drive unit consists of a power component II, a support plate, and a movable rod. The output end of the power component II is connected to the support plate, and the movable rod is connected to the support plate. The top of the movable rod extends into the fixed chamber and is slidably sealed to the fixed chamber. The top of the movable rod is connected to the support ring. When the wafer is heated, the power component II drives the support plate to move, thereby driving the movable rod to rise. The rising of the movable rod is used to drive the support ring, the heating plate, and the wafer on its surface to rise, so that the heating plate moves away from the cooling plate. When the wafer is cooled, the power component II drives the support plate to move, thereby driving the movable rod to fall. The falling of the movable rod is used to drive the support ring, the heating plate, and the wafer on its surface to fall, so that the heating plate is in contact with the surface of the cooling plate and the cooling plate cools the heating plate and the wafer on its surface.

[0017] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture, the support ring and the heating plate are provided with clearance grooves on the surface directly below the carrier. In the initial state, the carrier is located in the clearance groove. When it is necessary to carry the wafer, the power component I drives the moving plate to move, which in turn drives the moving rod to rise, causing the carrier to rise and extend out of the clearance groove, so that the carrier is away from the heating plate, so that the wafer can be placed on the carrier for carrying the wafer. Then, the power component I drives the moving plate to move, which in turn drives the moving rod to fall, causing the carrier to carry the wafer to fall synchronously, until the carrier enters the clearance groove so that the wafer is carried on the surface of the heating plate. At this time, there is still a distance between the carrier and the bottom of the clearance groove for the support ring and the heating plate to rise.

[0018] Preferably, in the above-mentioned wafer vacuum reflow soldering fixture, the wafer driving unit and the heating plate driving unit further include a telescopic sealing sleeve. The telescopic sealing sleeve is fitted onto the moving rod in the wafer driving unit, and one end of the telescopic sealing sleeve is connected to the lower surface of the support platform, and the other end is connected to the surface of the moving plate. When the moving plate rises and drives the moving rod to rise, the telescopic sealing sleeve retracts. In addition, the telescopic sealing sleeve is also fitted onto the movable rod in the heating plate driving unit, and one end of the telescopic sealing sleeve is connected to the lower surface of the support platform, and the other end is connected to the surface of the support plate. When the support plate rises, the telescopic sealing sleeve retracts.

[0019] Compared with the prior art, the beneficial effects of the present invention are: The suction power component in this invention can extract gas from the welding chamber, creating a vacuum environment. It can also draw formic acid from the formic acid tank into a buffer tank, eliminating the need for an additional power unit to inject formic acid into the welding chamber. This significantly improves the integration of the reflow soldering fixture and facilitates reflow soldering operations. Furthermore, during gas extraction from the welding chamber, nitrogen can enter through the valve island assembly and gas pipes, further expelling air from the welding chamber and preventing the risk of wafer oxidation, thus ensuring the effectiveness of wafer reflow soldering.

[0020] In addition, the tooling equipment of the present invention also includes a modular structure, which includes a cooling tray and heating tubes in the welding chamber. A heating plate is provided above the cooling tray. The modular structure also includes a wafer driving unit for carrying the wafer and a heating plate driving unit for driving the heating plate to move. When the wafer needs to be carried, the wafer driving unit is used to drive the carrier away from the heating plate, so that a distance is created between the carrier and the heating plate, so that the robot can place the wafer on the carrier. In addition, the wafer driving unit drives the carrier to lower the wafer, which can carry the wafer on the heating plate. When the wafer is heated, the heating plate is moved away from the cooling tray, and the heating tubes heat the heating plate. The good thermal conductivity of the heating plate is used to heat the wafer evenly. When the wafer is cooled, the heating plate drives the wafer to fall and fit against the surface of the cooling tray for even cooling. The uniform heating and uniform cooling ensure the effect of wafer reflow soldering. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the external structure of the wafer vacuum reflow soldering fixture equipment in this invention; Figure 2 This is a schematic diagram of the internal structure of the wafer vacuum reflow soldering fixture equipment in this invention; Figure 3 for Figure 2 The front view; Figure 4This is an assembly diagram of the module structure of the suction unit and the wafer reflow soldering in this invention; Figure 5 This is a schematic diagram of the intake unit in this invention; Figure 6 This is a schematic diagram of the module structure for wafer reflow soldering in this invention; Figure 7 for Figure 1 The front view; Figure 8 This is a diagram illustrating the effect of placing wafers in the module structure of this invention. Figure 9 This is a diagram showing the state of the module structure in this invention without a wafer placed on it. Figure 10 This is a schematic diagram of the frame unit in this invention; Figure 11 for Figure 10 The front view; Figure 12 This is a schematic diagram of the power unit in this invention; Figure 13 This is a diagram illustrating the effect of loading the power unit onto the wafer in this invention. Figure 14 for Figure 13 The front view; Figure 15 This is a schematic diagram of the wafer driving unit in this invention; Figure 16 This is a schematic diagram of the heating plate driving unit in this invention; Figure 17 This is a schematic diagram of the welding chamber structure in this invention; Figure 18 This is a schematic diagram of the disassembled structure of the welding chamber in this invention; Figure 19 This is a schematic diagram of the internal structure of the welding chamber in this invention; Figure 20 This is a cross-sectional view of the welding chamber in the wafer heating state of this invention; Figure 21 for Figure 20 Enlarged view of the structure at point A in the middle; Figure 22 This is a cross-sectional view of the welding chamber in the wafer cooling state of this invention; Figure 23 for Figure 22 Enlarged view of the structure at point B in the middle; Figure 24 This is a schematic diagram of the assembly of the welding chamber and the air extraction connector in this invention; Figure 25 This is a schematic diagram of the bottom structure of the welding chamber in this invention; Figure 26This is a schematic diagram of the upper cover unit in this invention; Figure 27 This is a schematic diagram of the disassembled structure of the upper cover unit in this invention; Figure 28 This is a schematic diagram of the assembly of the air passage unit and the intake unit in this invention; Figure 29 This is a schematic diagram of the formic acid pipeline assembly in this invention; Figure 30 This is a schematic diagram of the assembly of the formic acid pipeline assembly and the gas source connection pipe in this invention; Figure 31 This is a schematic diagram of the gas path unit in this invention.

[0022] The correspondence between the reference numerals and component names in the attached drawings is as follows.

[0023] M, enclosure structure; N, modular structure; Z, fan unit; 100. Frame unit; 200. Drive unit; 300. Top cover unit; 400. Welded chamber; 500. Suction unit; 600. Air passage unit; 101. Fixed base; 102. Supporting platform; 103. Connecting rod; 104. Guide column; 201. Wafer driving unit; 202. Heating plate driving unit; 203. Telescopic sealing sleeve; 201a, Power Component I; 201b, Moving Plate; 201c, Moving Rod; 201d, Load-bearing Component; 202a, Fixed Platform; 202b, Power Component II; 202c, Load-bearing Plate; 202d, Movable Rod; 301. Cover plate; 302. Power assembly III; 303. Distribution plate I; 304. Distribution plate II; 301a, endotracheal inlet; 401. Fixed chamber; 402. Heating plate; 403. Cooling tray base; 404. Heating tube; 405. Air extraction connector; 401a, Inner cavity; 401b, Air passage; 402a, Support ring; 402b, Clearance groove; 403a, Interface; 404a, Connector; 404b, Thermocouple; 501. Inhalation power assembly; 502. Suction pipe; 503. Inhalation pipe; 601. Formic acid piping assembly; 602. Gas source connection pipe; 603. Valve island assembly; 604. Cooling pipe; 601a, Formic acid tank; 601b, Buffer tank; 601c, Nebulizer; 602a, Connecting tube; 602b, Air tube I; 602c, Air tube II. Detailed Implementation

[0024] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0026] like Figure 1 as well as Figure 2 The diagram shows the structure of the wafer vacuum reflow soldering fixture of this invention. The vacuum reflow soldering fixture of this invention aims to melt the solder caps on the wafer surface. After melting, the solder caps form a liquid. Due to the surface tension of the liquid and after cooling and solidification, spherical bumps are formed on the wafer surface. The fixture of this invention includes a housing structure M, within which a module structure N, a fan unit Z, a suction unit 500, and a gas path unit 600 are installed. In this invention, the wafer undergoes reflow soldering heating and cooling operations within the module structure N. The suction unit 500 removes gas from the module structure N to prevent residual gas from oxidizing the metal on the wafer surface due to oxygen in the air. The gas path unit 600 injects formic acid and nitrogen into the module structure N. Nitrogen creates an inert environment within the module structure N, preventing oxidation of the metal on the wafer surface. Furthermore, the formic acid, upon entering the module structure N, reduces the metal oxides on the wafer surface, ensuring the effectiveness of the wafer reflow soldering.

[0027] In addition, such as Figure 3 As shown, the tooling equipment in this invention also includes a fan unit Z, which is used to introduce air from the environment, filter it, and blow it downwards towards the module structure N to ensure that the module structure N is in a clean environment and to prevent external impurities from entering the module structure N and contaminating the wafer.

[0028] like Figure 4 as well as Figure 5 As shown, this is a schematic diagram of the suction unit 500 in this invention. The suction unit 500 includes a suction power assembly 501, and a suction pipe 502 is connected to the suction power assembly 501. The suction pipe 502 is connected to the module structure N. The suction power assembly 501 can discharge the gas in the module structure N through the suction pipe 502, thus preventing the wafer in the module structure N from being oxidized by oxygen. The module structure N in this invention is installed in the housing structure M, and the suction unit 500 is connected to the bottom of the module structure N. Figure 6 , Figure 7 as well as Figure 10 and Figure 11As shown, the module structure N in this invention includes a frame unit 100, which includes a fixed base 101 and a support platform 102 located above the fixed base 101. In this invention, the fixed base 101 and the support platform 102 are connected by a connecting rod 103 and a guide post 104 to form a frame structure. A welding chamber 400 is installed on the surface of the support platform 102. The wafer is heated and cooled in the welding chamber 400 to complete the reflow soldering operation in this invention. After the wafer is loaded into the welding chamber 400, the wafer is heated in the welding chamber 400, and the solder cap on the surface of the wafer melts. Then the wafer is cooled in the welding chamber 400, and the melted solder cap cools and solidifies to form a spherical bump, thus completing the reflow soldering operation.

[0029] like Figure 8 as well as Figure 9 As shown, the welding chamber 400 of the present invention includes a fixed chamber 401, which is fixed on the surface of the support platform 102 and forms an inner cavity 401a. The wafer is placed in the inner cavity 401a by a robot arm, and the wafer in the inner cavity 401a is heated and cooled to complete the reflow soldering operation of the present invention.

[0030] like Figures 17-19 As shown, a cooling plate seat 403 is provided in the inner cavity 401a of the fixed chamber 401 in this invention. The cooling plate seat 403 in this invention has an annular structure, and multiple rings of heating tubes 404 are arranged in the annular grooves between the cooling plate seats 403, such as... Figure 25 As shown, the bottom of the support platform 102 in this invention is provided with an interface 403a. There are two interfaces 403a, one connected to a cooling medium injection pipe and the other connected to a cooling medium discharge pipe, as shown. Figure 31 As shown, this is a schematic diagram of the gas path unit 600 in this invention. The gas path unit 600 includes a cooling pipe 604, which is mounted on the housing structure M in this invention. Two cooling pipes 604 are provided, one for injecting cooling medium and the other for discharging cooling medium. Cooling medium is injected into the cooling tray 403 through one of the cooling pipes 604 and interface 403a to facilitate subsequent wafer cooling operations. The cooling medium can be discharged through the other interface 403a and the other cooling pipe 604, thus ensuring a continuous flow of cooling medium into the cooling tray 403 and guaranteeing the cooling effect of the cooling tray 403 on the wafer. Additionally, the heating pipe 404 uses infrared heating for heating, such as... Figure 25As shown, a connector 404a is provided at the bottom of the support platform 102. The heating tube 404 is electrically connected to the power supply and control system through the connector 404a. When the power is turned on, the heating tube 404 is heated by infrared heating to facilitate subsequent heating of the wafer. It is worth noting that each annular heating tube 404 is equipped with a thermocouple 404b. The heating temperature of each heating tube 404 is detected by the thermocouple 404b, so as to facilitate the adjustment of the heating temperature of the heating tube 404, so that the heating temperature of multiple heating tubes 404 is the same, ensuring the temperature uniformity in the welding chamber 400, so as to uniformly heat the wafer.

[0031] like Figures 17-18 As shown, the fixed chamber 401 of the present invention is further provided with a heating plate 402 and a support ring 402a for supporting the heating plate 402. The inner wall of the support ring 402a is provided with a raised step, which supports the heating plate 402. The support ring 402a can move up and down in the fixed chamber 401. When the support ring 402a moves upward, it can drive the heating plate 402 to move upward. When the support ring 402a moves downward, it can drive the heating plate 402 to move downward, thereby facilitating the operation of the heating plate 402 away from the cooling plate seat 403 or attached to the surface of the cooling plate seat 403.

[0032] like Figure 9 As shown, the module structure N in this invention also includes a drive unit 200. The drive unit 200 includes a wafer drive unit 201 and a heating plate drive unit 202. The wafer drive unit 201 is used to receive the wafer and drive the wafer to descend. When the robot loads the wafer into the welding chamber 400, the wafer drive unit 201 is used to receive the wafer and then drive the wafer to move downward until the wafer is placed on the surface of the heating plate 402, and the heating plate 402 supports the wafer.

[0033] like Figures 12-16As shown, the wafer driving unit 201 of this invention includes a power assembly I 201a, which is mounted on a fixed base 101. The power end of the power assembly I 201a extends above the fixed base 101 and connects to a movable plate 201b. Additionally, a guide post 104 connects the fixed base 101 and the support platform 102. The movable plate 201b is slidably assembled with the guide post 104. The operation of the power assembly I 201a drives the movable plate 201b to move up and down. The guide post 104 ensures the stability of the movable plate 201b during lifting and lowering, enabling vertical lifting and lowering. A movable rod 201c is connected to the surface of the movable plate 201b. The movable rod 201c passes through the support platform 102 and extends into the fixed chamber 401, and is slidably and sealed to the fixed chamber 401. When the power assembly I 201a drives the movable plate 201b to move, the movable plate 201b drives the movable rod 201c to rise and fall within the fixed chamber 401. Figure 8 as well as Figure 9 As shown, the top of the moving rod 201c in this invention is connected to a support member 201d, which is used to support the wafer. It is worth noting that there are multiple moving rods 201c in this invention, and the support members 201d on the top of the multiple moving rods 201c are arranged opposite to each other. The multiple support members 201d are used to support the wafer. In this invention, when the robot arm loads the wafer, the power component I 201a drives the moving plate 201b to rise, thereby driving the moving rod 201c to rise, so that the support member 201d moves away from the heating plate 402, and the gap between the support member 201d and the heating plate 402 increases, so that the robot arm can place the wafer on the support member 201d, thereby facilitating the loading of the wafer into the fixed chamber 401.

[0034] In addition, the driving unit 200 in this invention also includes a heating plate driving unit 202, such as Figure 13 , Figure 15 as well as Figure 16 As shown, the heating plate driving unit 202 of this invention includes a fixed platform 202a fixedly mounted on the surface of the fixed base 101. A power assembly II 202b is mounted on the fixed platform 202a. In this invention, the power end of the power assembly II 202b is connected to a support plate 202c. The support plate 202c is slidably assembled with a guide column 104. When the power assembly II 202b operates, it can drive the support plate 202c to move up and down. The support plate 202c and the guide column 104 are in sliding engagement, and the guide column 104 ensures the vertical lifting and lowering of the support plate 202c, preventing the support plate 202c from shifting during movement. Figure 16As shown, the top of the support plate 202c in this invention is connected to a movable rod 202d. The movable rod 202d passes through the support platform 102 and extends into the fixed chamber 401. The movable rod 202d is slidably and sealed to the fixed chamber 401. The top of the movable rod 202d is connected to the support ring 402a. When the power component II 202b drives the support plate 202c to move up and down, the support plate 202c drives the movable rod 202d to move up and down. The movable rod 202d can drive the support ring 402a to move up and down in the fixed chamber 401, thereby driving the heating plate 402 to move up and down. In this invention, multiple movable rods 202d are provided. All of the multiple movable rods 202d extend into the fixed chamber 401 and are connected to the support ring 402a. Since the support ring 402a supports the heating plate 402, when the movable rod 202d moves up and down, it drives the support ring 402a and the heating plate 402 to move synchronously.

[0035] In addition, such as Figure 16 as well as Figure 18 As shown, the support ring 402a and heating plate 402 of the present invention are provided with clearance grooves 402b for avoiding the carrier 201d. In the initial state, the carrier 201d is located in the clearance groove 402b. When the wafer is loaded, the power component I 201a drives the moving plate 201b to rise. The moving plate 201b drives the moving rod 201c and the carrier 201d to rise. The carrier 201d extends out of the clearance groove 402b away from the heating plate 402. The robotic arm picks up the wafer and extends it into the fixing chamber 401, so that the wafer can be placed on the carrier 201d. On 01d, after the robotic arm retracts, the power assembly I 201a drives the moving plate 201b to descend. After the moving plate 201b descends, it drives the moving rod 201c and the carrier 201d to descend. Therefore, the wafer descends synchronously until it is placed on the surface of the heating plate 402. At this time, the carrier 201d retracts into the clearance groove 402b. It is worth noting that the carrier 201d has not yet reached the bottom of the clearance groove 402b. There is still a distance between the carrier 201d and the bottom of the clearance groove 402b for the support ring 402a and the heating plate 402 to rise.

[0036] In this invention, the heating plate 402 extends out through the carrier 201d so that the robot can place the wafer on the carrier 201d. This avoids the problem of wafer damage caused by collision between the wafer and the heating plate 402 when the robot places the wafer directly on the heating plate 402, making the wafer loading and fixing chamber 401 safer and facilitating the processing of the wafer after loading.

[0037] It is worth noting that this invention does not use heating tube 404 to directly heat the wafer, thus avoiding uneven heating. To ensure uniform heating of the wafer, the module structure N in this invention first heats the heating plate 402, and then the heating plate 402 heats the wafer. Since the wafer is attached to the surface of the heating plate 402, the heating plate 402 can heat the wafer uniformly, melting the tin cap on the wafer surface to form spherical bumps. It is worth noting that the heating plate 402 in this invention is a carbon plate. When the heating tube 404 is applied to the heating plate 402, the heating plate 402 has good thermal conductivity, thereby achieving uniform heating of the heating plate 402, which facilitates uniform heating of the wafer in the later stages and ensures the heating effect of the wafer.

[0038] Other examples Figure 25 As shown, each heating tube 404 in this invention is equipped with a thermocouple 404b to detect its temperature, thus ensuring that the heating temperature of each heating tube 404 is uniform. Combined with the good thermal conductivity of the carbon plate, it ensures that the heating plate 402 can be heated evenly, so that the wafer can be heated evenly in the later stage, so that all the tin caps on the wafer surface can be melted by heat and solidified on the wafer surface after cooling to form spherical bumps.

[0039] like Figure 20 as well as Figure 21 As shown, this is a diagram of the wafer heating state in this invention. After the support member 201d descends and the wafer is placed on the surface of the heating plate 402, the power component II 202b drives the support plate 202c to rise. The rise of the support plate 202c drives the movable rod 202d to rise, which in turn drives the support ring 402a and the heating plate 402 to rise, so that the heating plate 402 moves away from the cooling plate 403. The heating tube 404 works to heat the heating plate 402. After the heating plate 402 is heated, it heats the wafer to ensure that the wafer can be heated evenly, so that the tin cap on its surface melts into a liquid state.

[0040] In addition, such as Figure 22 as well as Figure 23 As shown, this is a diagram of the wafer cooling state in this invention. When the wafer needs cooling, the power component II 202b drives the support plate 202c to descend. The descent of the support plate 202c causes the movable rod 202d to descend, which in turn drives the support ring 402a and the heating plate 402 and the wafer on its surface to descend until the heating plate 402 is in contact with the surface of the cooling plate 403. Since the cooling plate 403 is filled with cooling medium, the cooling plate 403 cools the heating plate 402. After the temperature of the heating plate 402 drops uniformly, it is used to cool the wafer, so that the temperature of the molten solder cap on the wafer surface drops and solidifies to form spherical bumps, completing the reflow soldering operation.

[0041] In this invention, the excellent heat conduction of the heating plate 402 ensures uniform heating or cooling of the wafer, thereby guaranteeing the effect of wafer reflow soldering. This results in a uniform distribution of spherical bumps on the wafer surface, ensuring good wafer manufacturing and processing performance. Since the wafer is attached to the surface of the heating plate 402, the heating plate 402 heats the wafer, preventing the wafer from shaking in the soldering chamber 400, which could lead to poor stability and wafer damage. After the wafer is heated, it descends until the heating plate 402 is attached to the surface of the cooling plate 403. The cooling plate 403 cools the heating plate 402, thus achieving uniform cooling of the wafer, which facilitates the cooling and solidification of the molten solder cap to form spherical bumps. In this invention, the heating tube 404 heats the heating plate 402, and the excellent thermal conductivity of the heating plate 402 ensures uniform heating. The heating plate 402 then uniformly heats the wafer, melting the solder cap on the wafer surface. The heating plate 402 then descends and adheres to the surface of the cooling tray 403, cooling the wafer and causing the metal on the wafer surface to solidify and form spherical bumps. This completes the wafer reflow soldering operation, ensuring the effectiveness of the reflow soldering. Furthermore, the wafer exhibits good stability during heating and cooling, preventing wafer breakage due to collisions and improving the overall efficiency of the wafer reflow soldering process.

[0042] In addition, such as Figure 13 , Figure 15 as well as Figure 16 As shown, the wafer driving unit 201 and the heating plate driving unit 202 of the present invention also include a telescopic sealing sleeve 203. The telescopic sealing sleeve 203 is sleeved on the moving rod 201c in the wafer driving unit 201, and one end of the telescopic sealing sleeve 203 is connected to the lower surface of the support platform 102, and the other end is connected to the surface of the moving plate 201b. When the moving plate 201b rises and drives the moving rod 201c to rise, the telescopic sealing sleeve 203 retracts. In addition, the telescopic sealing sleeve 203 is also sleeved on the movable rod 202d in the heating plate driving unit 202. One end of the telescopic sealing sleeve 203 is connected to the lower surface of the support platform 102, and the other end is connected to the surface of the support plate 202c. When the support plate 202c rises, the telescopic sealing sleeve 203 retracts. In this invention, the telescopic sealing sleeve 203 is used to seal the moving rod 201c and the movable rod 202d respectively, to prevent the moving rod 201c and the movable rod 202d from bringing impurities into the fixed chamber 401 and causing wafer contamination, thus ensuring the effect of wafer production and processing.

[0043] In addition, such as Figure 26 as well as Figure 27As shown, the module structure N in this invention also includes an upper cover unit 300 that is fastened to the top of the welding chamber 400. The upper cover unit 300 is fastened to the welding chamber 400 to seal the welding chamber 400, thereby preventing external impurities from entering the fixed chamber 401 and contaminating the wafer.

[0044] In this invention, the upper cover unit 300 includes a cover plate 301, and a sealing ring is provided on the lower surface of the cover plate 301. When the cover plate 301 is fastened onto the fixing chamber 401, the sealing ring is used to seal the gap between the cover plate 301 and the fixing chamber 401, ensuring the sealing effect of the fixing chamber 401. The upper cover unit 300 also includes a power component III 302 for driving the cover plate 301 to move up and down. The power end of the power component III 302 is connected to the cover plate 301. The operation of the power component III 302 drives the cover plate 301 to move up and down, so that the cover plate 301 can be fastened onto the fixing chamber 401. Figure 27 As shown, the cover plate 301 in this invention has an internal hollow structure. From top to bottom, uniform distribution disks I 303 and II 304 are arranged sequentially inside the cover plate 301. Uniform distribution disks I 303 and II 304 have through holes evenly distributed on them, and the through holes on uniform distribution disks I 303 and II 304 are staggered. A gas pipe interface 301a is also provided at the top of the cover plate 301. The gas pipe interface 301a is connected to the gas path unit 600. Formic acid gas is injected into the cover plate 301 through the gas path unit 600 from the gas pipe interface 301a. The formic acid gas is then evenly injected into the fixed chamber 401 through the uniform distribution disks I 303 and II 304. The formic acid reduces the metal oxides on the wafer surface, thereby removing the metal oxides from the wafer surface.

[0045] To further ensure the effectiveness of wafer reflow soldering in this invention and prevent oxidation of the wafer surface metal, the wafer reflow soldering process in this invention involves heating and cooling the wafer within a vacuum environment, such as... Figure 24 As shown, the fixed chamber 401 of the present invention has an air duct 401b inside, and the lower surface of the support platform 102 is connected to an air extraction connector 405. The air extraction connector 405 is connected to the air duct 401b and to the air extraction pipe 502 in the external suction unit 500. When the cover plate 301 on the upper cover unit 300 is closed onto the surface of the fixed chamber 401, it seals the cavity of the inner cavity 401a. The suction power component 501 in the suction unit 500 works, and the gas in the inner cavity 401a is extracted through the air extraction pipe 502 and the air extraction connector 405, thereby avoiding the gas residue in the inner cavity 401a from causing the metal on the wafer surface to be oxidized. Then, formic acid gas is injected into the inner cavity 401a through the air pipe interface 301a to reduce the metal oxide on the wafer surface, thereby ensuring the effect of wafer reflow soldering.

[0046] In addition, to ensure that formic acid gas can enter the inner cavity 401a, such as Figure 29 As shown, the air path unit 600 of this invention also includes a formic acid pipeline assembly 601. The formic acid pipeline assembly 601 includes a formic acid tank 601a, a buffer tank 601b, and an atomizer 601c. The formic acid tank 601a and the buffer tank 601b are connected by a pipe, and the buffer tank 601b and the atomizer 601c are connected by a pipe. The output end of the atomizer 601c is connected to the air pipe interface 301a on the cover plate 301 by a pipe. It is worth noting that the inhalation unit 500 of this invention also includes an inhalation pipe 503, which is connected to the buffer tank 601b. When it is necessary to remove gas from the inner cavity 401a, the valve on the inhalation pipe 503 is closed, and the valve on the suction pipe 502 is opened, and the inhalation power is activated. Component 501 operates by extracting gas from the inner cavity 401a through the extraction pipe 502 and extraction connector 405, preventing oxygen in the inner cavity 401a from oxidizing the metal on the wafer surface. When formic acid gas needs to be injected, the valve on the extraction pipe 502 closes, and the valve on the suction pipe 503 opens. Therefore, the suction power component 501 operates by extracting gas from the buffer tank 601b through the suction pipe 503, creating a negative pressure inside the buffer tank 601b. The buffer tank 601b and the formic acid tank 601a are connected by a siphon. Therefore, when a negative pressure is created inside the buffer tank 601b, formic acid from the formic acid tank 601a can be drawn into the buffer tank 601b through siphon, and then the suction unit 500 stops working. Additionally, as... Figure 30 As shown, the gas circuit unit 600 of the present invention also includes a gas source connecting pipe 602 connected to an outer nitrogen tank, and the end of the gas source connecting pipe 602 is connected to a connecting pipe 602a through a valve island assembly 603. The connecting pipe 602a is connected to a buffer tank 601b, and a pressure regulating valve is provided on the connecting pipe 602. When the pressure regulating valve is opened, the nitrogen in the nitrogen tank enters the buffer tank 601b through the gas source connecting pipe 602 and the connecting pipe 602a. The nitrogen is used to pressurize the formic acid so that the formic acid enters the atomizer 601c for atomization. The atomized formic acid gas enters the inner cavity 401a through the pipe and the gas pipe interface 301a to reduce the metal oxide on the wafer surface in the inner cavity 401a.

[0047] In this invention, the suction power component 501 can function as an exhaust unit to expel gas from the inner cavity 401a, and also as a power unit to draw formic acid into the buffer tank 601b and then into the inner cavity 401a. Therefore, it avoids the problem of low system integration caused by the need for both suction power components and injection power components for formic acid injection. The suction unit 500 in this invention can be used as both a suction power component and an injection power component, which improves the system integration and ensures the effectiveness of the tooling equipment.

[0048] In addition, such as Figure 31 As shown, the gas circuit unit 600 of the present invention also includes gas pipe I 602b and gas pipe II 602c. In the present invention, gas pipe I 602b is connected to the gas source connection pipe 602 through the valve island assembly 603, and the other end of gas pipe I 602b is connected to the gas pipe interface 301a on the cover plate 301. Therefore, when it is necessary to inject a mixture of formic acid and nitrogen into the inner cavity 401a, the valve on the valve island assembly 603 is opened. Nitrogen enters the inner cavity 401a through gas pipe I 602b and gas pipe interface 301a, and formic acid enters the inner cavity 401a through the pipe and gas pipe interface 301a after being atomized by the atomizer 601c. Thus, the metal oxide on the wafer surface can be removed during the reflow soldering operation, ensuring the reflow soldering effect of the wafer.

[0049] Furthermore, in this invention, the air pipe II 602c is connected to the air source connection pipe 602 via the valve island assembly 603, and the other end of the air pipe II 602c is connected to the fixed chamber 401 and communicates with the inner cavity 401a. When the gas in the inner cavity 401a is discharged, the suction power component 501 in the suction unit 500 works to discharge the gas in the inner cavity 401 through the suction pipe 502. In order to further ensure the inert environment effect in the inner cavity 401a, the valve on the valve island assembly 603 is opened, and nitrogen enters the inner cavity 401a of the fixed chamber 401 through the air source connection pipe 602 and the air pipe II 602c, further discharging the air in the inner cavity 401a, thereby ensuring the inert environment in the inner cavity 401a, avoiding the problem of oxidation of the metal on the wafer surface caused by residual oxygen, thus ensuring a good inert environment in the inner cavity 401a and improving the wafer reflow soldering effect.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer vacuum reflow soldering fixture, comprising a housing structure (M), a modular structure (N) and an air intake unit (500) and an air passage unit (600) installed in the housing structure (M), the modular structure (N) comprising a frame unit (100), the frame unit (100) comprising a support platform (102), a welding chamber (400) disposed on the surface of the support platform (102), the welding chamber (400) comprising a fixing chamber (401), an inner cavity (401a) formed within the fixing chamber (401), a wafer being placed in the inner cavity (401a) to complete the reflow soldering operation, characterized in that, The suction unit (500) is connected to the fixed chamber (401) and the suction unit (500) can extract the gas in the fixed chamber (401) when it is working. The suction unit (500) is also connected to the gas passage unit (600) to generate negative pressure on the gas passage unit (600) so as to facilitate the suction of formic acid into the welding chamber (400).

2. The wafer vacuum reflow soldering fixture equipment according to claim 1, characterized in that, The bottom of the support platform (102) is connected to an air extraction connector (405), which is connected to the interior of the fixed chamber (401). The air intake unit (500) includes an air intake power assembly (501) and an air extraction pipe (502). The air extraction pipe (502) is connected to the fixed chamber (401) through the air extraction connector (405). The air intake power assembly (501) can discharge the gas in the fixed chamber (401) through the air extraction pipe (502). The gas path unit (600) includes a formic acid pipeline assembly (601), which includes a formic acid tank (601a), a buffer tank (601b), and an atomizer (601c). The acid tank (601a) is siphonically connected to the buffer tank (601b), and the buffer tank (601b) is connected to the atomizer (601c). The output end of the atomizer (601c) is connected to the welding chamber (400). The air intake unit (500) also includes an air intake pipe (503). One end of the air intake pipe (503) is connected to the air intake power assembly (501), and the other end is connected to the buffer tank (601b). When the air intake power assembly (501) is working, it can generate negative pressure on the buffer tank (601b) through the air intake pipe (503). The negative pressure environment in the buffer tank (601b) and the siphon method draw the formic acid in the formic acid tank (601a) into the buffer tank (601b).

3. The wafer vacuum reflow soldering fixture equipment according to claim 2, characterized in that, The module structure (N) also includes an upper cover unit (300), which includes a cover plate (301). The cover plate (301) is movably disposed above the fixed chamber (401), and an air pipe interface (301a) is installed on the cover plate (301). The output end of the atomizer (601c) is connected to the air pipe interface (301a) through a pipe. The cover plate (301) is provided with a uniform distribution disk I (303) and a uniform distribution disk II (304) arranged sequentially from top to bottom. The uniform distribution disk I (303) and the uniform distribution disk II (304) are evenly distributed with through holes, and the through holes on the uniform distribution disk I (303) and the uniform distribution disk II (304) are staggered. After the formic acid gas enters the cover plate (301) through the air pipe interface (301a), it is evenly distributed through the uniform distribution disk I (303) and the uniform distribution disk II (304) and then enters the fixed chamber (401).

4. The wafer vacuum reflow soldering fixture equipment according to claim 3, characterized in that, The gas path unit (600) further includes a gas source connection pipe (602), one end of which is connected to an inert gas tank, and the other end is connected to a connecting pipe (602a) via a valve island assembly (603). The connecting pipe (602a) is connected to a buffer tank (601b). After the valve on the valve island assembly (603) is opened, the inert gas enters the buffer tank (601b) through the gas source connection pipe (602) and the connecting pipe (602a), pressurizing the buffer tank (601b). This causes the formic acid to enter the atomizer (601c), be atomized, and then enter the cover plate (301) for even distribution before entering the inner cavity (401a). The formic acid reduces the metal oxides on the wafer surface. The gas path unit (600) also includes a gas pipe. I (602b) and trachea II (602c). One end of trachea I (602b) is connected to the gas source connection pipe (602) through the valve island assembly (603), and the other end is connected to the trachea interface (301a) on the cover plate (301), so that the inert gas enters the inner cavity (401a) synchronously with the formic acid. One end of trachea II (602c) is connected to the gas source connection pipe (602) through the valve island assembly (603), and the other end is connected to the fixed chamber (401). When the suction power assembly (501) draws the gas in the inner cavity (401a), the inert gas enters the inner cavity (401a) through the gas source connection pipe (602) and trachea II (602c) and discharges the gas in the inner cavity (401a).

5. The wafer vacuum reflow soldering fixture equipment according to any one of claims 1 to 4, characterized in that, The fixed chamber (401) is provided with a cooling plate base (403), which is an annular structure. A heating tube (404) is installed in the groove of the cooling plate base (403). A heating plate (402) is provided above the cooling plate base (403). The heating plate (402) is supported by a supporting ring (402a), which can move up and down in the fixed chamber (401) to move the heating plate (402) away from the cooling plate base. 403) or near the cooling plate (403), when the wafer is heated, the heating plate (402) moves away from the cooling plate (403), the heating tube (404) heats the heating plate (402), and the heating plate (402) heats the wafer uniformly after being heated. When the wafer is cooled, the heating plate (402) drives the wafer to descend until the heating plate is attached to the surface of the cooling plate (403), and the cooling plate (403) cools the heating plate (402) and then cools the wafer.

6. The wafer vacuum reflow soldering fixture equipment according to claim 5, characterized in that, Cooling medium is injected into the cavity of the cooling tray (403), and an interface (403a) is provided at the bottom of the support platform (102). There are two interfaces (403a), one of which is connected to the cooling medium injection pipe and the other is connected to the cooling medium discharge pipe. The air circuit unit (600) also includes a cooling pipe (604). There are two cooling pipes (604), one of which is the cooling medium injection pipe and the other is the cooling medium discharge pipe. Cooling medium is injected into the cooling tray (403) through one of the cooling pipes (604) and the interface (403a) to facilitate subsequent wafer cooling operations. The cooling medium can be discharged through the other interface (403a) and the other cooling pipe (604), so that the cooling medium can continuously enter the cooling tray (403).

7. The wafer vacuum reflow soldering fixture equipment according to claim 5, characterized in that, The module structure (N) also includes a drive unit (200), which is mainly composed of a wafer drive unit (201). The wafer drive unit (201) is used to support the wafer. The wafer drive unit (201) includes a power component I (201a). The power end of the power component I (201a) is connected to a moving plate (201b). Multiple moving rods (201c) are connected to the surface of the moving plate (201b). The ends of the moving rods (201c) extend into the fixed compartment (401). It is also slidably sealed to the fixed chamber (401). The end of the moving rod (201c) is connected to the bearing (201d). When it is necessary to carry the wafer, the power component I (201a) works to drive the moving plate (201b) to move, which in turn drives the moving rod (201c) to rise, so that the bearing (201d) rises to support the wafer. After the wafer is supported, the power component I (201a) works to drive the moving plate (201b) to fall, which in turn drives the moving rod (201c), the bearing (201d), and the wafer to fall.

8. The wafer vacuum reflow soldering fixture equipment according to claim 7, characterized in that, The drive unit (200) further includes a heating plate drive unit (202), which is composed of a power assembly II (202b), a support plate (202c), and a movable rod (202d). The output end of the power assembly II (202b) is connected to the support plate (202c), and the movable rod (202d) is connected to the support plate (202c). The top end of the movable rod (202d) extends into the fixed chamber (401) and is slidably sealed to the fixed chamber (401). The top end of the movable rod (202d) is connected to the support ring (402a). When the wafer is heated, the power assembly II (202b) drives the support plate (202c) to move, thereby... The movable rod (202d) is raised, which drives the support ring (402a) and the heating plate (402) and the wafer on its surface to rise, so that the heating plate (402) moves away from the cooling plate (403). When the wafer is cooled, the power component II (202b) works to drive the carrier plate (202c) to move, which in turn drives the movable rod (202d) to fall. The movable rod (202d) falls, which drives the support ring (402a) and the heating plate (402) and the wafer on its surface to fall, so that the heating plate (402) is attached to the surface of the cooling plate (403) and the cooling plate (403) cools the heating plate (402) and the wafer on its surface.

9. The wafer vacuum reflow soldering fixture equipment according to claim 8, characterized in that, The supporting ring (402a) and heating plate (402) are provided with clearance grooves (402b) on the surface directly below the support member (201d). In the initial state, the support member (201d) is located in the clearance groove (402b). When it is necessary to support the wafer, the power component I (201a) drives the moving plate (201b) to move, which in turn drives the moving rod (201c) to rise, causing the support member (201d) to rise and extend out of the clearance groove (402b), so that the support member (201d) moves away from the heating plate (402) to facilitate wafer support. The circle is placed on the support (201d) to support the wafer. Then the power component I (201a) works to drive the moving plate (201b) to move, which in turn drives the moving rod (201c) to descend, so that the support (201d) drives the wafer to descend synchronously until the support (201d) enters the relief groove (402b) so that the wafer is supported on the surface of the heating plate (402). At this time, there is still a distance between the support (201d) and the bottom of the relief groove (402b) for the support ring (402a) and the heating plate (402) to rise.

10. The wafer vacuum reflow soldering fixture equipment according to claim 8, characterized in that, The wafer driving unit (201) and the heating plate driving unit (202) further include a telescopic sealing sleeve (203). The telescopic sealing sleeve (203) is fitted onto the moving rod (201c) in the wafer driving unit (201). One end of the telescopic sealing sleeve (203) is connected to the lower surface of the support platform (102), and the other end is connected to the surface of the moving plate (201b). When the moving plate (201b) rises and drives the moving rod (201c) to rise, the telescopic sealing sleeve (203) retracts. In addition, the telescopic sealing sleeve (203) is also fitted onto the movable rod (202d) in the heating plate driving unit (202). One end of the telescopic sealing sleeve (203) is connected to the lower surface of the support platform (102), and the other end is connected to the surface of the support plate (202c). When the support plate (202c) rises, the telescopic sealing sleeve (203) retracts.

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