Laser scribing method, apparatus, storage medium, and device

Abstract

The application discloses a laser scribing method and device, a storage medium and equipment, and belongs to the technical field of lasers. An initial repetition frequency and a target dotting interval are obtained; an interference-free dotting interval is determined according to the initial repetition frequency, the interference-free dotting interval is a dotting interval in a state where adjacent dots do not interfere with each other by improving the initial repetition frequency and a laser processing speed, and the interference-free dotting interval is greater than the target dotting interval; the number of sub-lines that need to be split for target scribing and the sub-line dotting interval of each sub-line are determined according to the numerical relationship between the interference-free dotting interval and the target dotting interval; and the laser head is controlled to process each sub-line in turn according to the number of sub-lines and the sub-line dotting interval, so that the dots between the sub-lines are staggered, and the dotting interval between different sub-lines after final splicing satisfies the target dotting interval. The application can keep the dotting form of each laser pulse circular, and avoid phenomena such as uneven scribing width, broken lines or rough edges.

Description

Technical Field

[0001] This application relates to the field of laser technology, and in particular to a laser scribing method, apparatus, storage medium and device. Background Technology

[0002] In existing laser processing technologies, especially when laser scribing certain materials, there is often a trade-off between processing efficiency and processing quality. When increasing the laser repetition frequency to improve processing efficiency, once the repetition frequency exceeds a certain threshold, heat accumulation or plasma interference can occur between adjacent laser pulses, affecting each other. This interference causes the shape of the scribing point in each laser pulse to be influenced by the previous laser pulse, resulting in phenomena such as non-circular dots and energy loss. In practice, often only the shape of the first scribing point of each line is normal, while the shape of subsequent dots is unstable, directly leading to uneven scribing width, broken lines, or rough edges.

[0003] To avoid this phenomenon, traditional laser processing techniques typically only reduce processing speed and laser repetition frequency, which directly leads to a significant decrease in overall processing efficiency. Therefore, there is an urgent need for a method that can eliminate interference between adjacent marking points, ensure marking quality, and maintain or even improve processing efficiency. Summary of the Invention

[0004] This application provides a laser marking method, apparatus, storage medium, and device to solve the problem of interference easily generated by high-repetition-rate laser marking. The technical solution is as follows: According to a first aspect of this application, a laser scribing method is provided, the method comprising: The initial repetition frequency and the target dot spacing are obtained. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots. The target dot spacing is the target spacing between each dot in a single target line. The interference-free dot spacing is determined based on the initial repetition frequency. The interference-free dot spacing is the dot spacing achieved by increasing the initial repetition frequency and laser processing speed so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing. Based on the numerical relationship between the non-interference dot spacing and the target dot spacing, determine the number of sub-lines that the target line needs to be divided into and the dot spacing of each sub-line. The laser head is controlled to process each sub-line sequentially according to the number of sub-lines and the spacing between the dots, so that the dots of each sub-line are arranged alternately, and the final dot spacing between different sub-lines meets the target dot spacing.

[0005] In one possible implementation, determining the number of sub-lines to be divided into for the target line and the sub-line spacing of each sub-line based on the numerical relationship between the non-interference dot spacing and the target dot spacing includes: Compare the values ​​of the non-interference dot spacing and the target dot spacing; If the spacing between the interference-free dots is greater than N times the spacing between the target dots, but not greater than N+1 times the spacing between the target dots, then the number of sub-lines that the target line needs to be divided into is determined to be N+1, where N is a positive integer; The sub-line dot spacing is determined based on the number of sub-lines and the target dot spacing.

[0006] In one possible implementation, determining the sub-line dot spacing of each sub-line based on the number of sub-lines and the target dot spacing includes: Multiply the number of sub-lines by the target dot spacing to obtain the sub-line dot spacing for each sub-line.

[0007] In one possible implementation, determining the interference-free dot spacing based on the initial repetition frequency includes: The initial repetition frequency is increased by a predetermined factor to obtain the target repetition frequency; The interference-free dot spacing is determined based on the target repetition frequency. The interference-free dot spacing is the dot spacing achieved by gradually increasing the laser processing speed during laser dotting at the target repetition frequency so that adjacent dots do not interfere with each other.

[0008] In one possible implementation, the difference between the predetermined multiple and 1 is greater than the quotient of the offset distance between each sub-line and the total length of the target line.

[0009] In one possible implementation, the controlled laser head processes each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing, including: Control the laser head to process the nth sub-line according to the sub-line dot spacing; After processing the nth sub-line, the laser head is controlled to jump to the start or end position of the (n+1)th sub-line based on the offset distance, and the (n+1)th sub-line is processed according to the sub-line dot spacing, wherein the offset distance is less than the total length of the target line.

[0010] In one possible implementation, controlling the laser head to jump to the start or end position of the (n+1)th sub-line based on the offset distance includes: When the processing direction of each sub-line is the same, control the laser head to jump to the starting position of the (n+1)th sub-line based on the offset distance; When the processing directions of each sub-line are opposite, the laser head is controlled to jump to the end position of the (n+1)th sub-line based on the offset distance.

[0011] According to a second aspect of this application, a laser scribing apparatus is provided, the apparatus comprising: The parameter acquisition module is used to acquire the initial repetition frequency and the target dot spacing. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots, and the target dot spacing is the target spacing between each dot in a single target line. The spacing determination module is used to determine the interference-free dot spacing based on the initial repetition frequency. The interference-free dot spacing is the dot spacing when the initial repetition frequency and laser processing speed are increased so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing. The sub-line determination module is used to determine the number of sub-lines that the target line needs to be divided into and the sub-line dot spacing of each sub-line based on the numerical relationship between the non-interference dot spacing and the target dot spacing. The sub-line processing module is used to control the laser head to process each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing, so that the dots of each sub-line are arranged alternately, and the dot spacing between different sub-lines after splicing meets the target dot spacing.

[0012] According to a third aspect of this application, a computer-readable storage medium is provided, wherein at least one instruction is stored therein, the at least one instruction being loaded and executed by a processor to implement the laser scribing method as described above.

[0013] According to a fourth aspect of this application, a laser processing apparatus is provided, the laser processing apparatus including the laser scribing device described above.

[0014] The beneficial effects of the technical solution provided in this application include at least the following: By increasing the laser repetition frequency from the initial frequency to the target frequency and gradually increasing the laser processing speed, the spacing between adjacent dots is increased to a non-interference dot spacing. With the dot spacing increased, the heat-affected zone and plasma cloud generated after the previous laser pulse are spatially separated from the area affected by subsequent laser pulses. This eliminates dot distortion caused by heat accumulation or plasma interference at high repetition frequencies, ensuring that the dot shape of each laser pulse remains circular, avoiding uneven line width, broken lines, or rough edges.

[0015] In multi-line staggered splicing, the spacing between the dots on each sub-line is an integer multiple of the target dot spacing. In this way, after the dots on multiple sub-lines are arranged in an alternating manner, the final splicing effect is equivalent to a complete line continuously distributed with the target dot spacing. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a laser scribing method provided in one embodiment of this application; Figure 2 This is a flowchart of a laser scribing method provided in one embodiment of this application; Figure 3 This is a structural block diagram of a laser scribing device provided in one embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0019] This application relates to a laser scribing method based on multi-line splicing. Addressing the problem of decreased scribing quality due to interference between adjacent dots during high-repetition-frequency laser scribing, which forces a reduction in processing speed, this application proposes a strategy to break down a single scribing line into multiple sub-lines for reciprocal splicing by increasing the laser repetition frequency and processing speed. The core idea is to eliminate interference through spatial isolation. Specifically, by increasing the scribing speed, the physical distance between each dot is forcibly increased, ensuring that the next dot is spatially unaffected by the previous dot, thus restoring the normal dot pattern. Since a single high-speed scan cannot cover all the required dot density, this application breaks down the original scribing line into two or more sub-lines with sufficiently large dot intervals. These sub-lines are then processed sequentially and spliced ​​together to ultimately form a complete, continuous scribing line with consistent width.

[0020] The laser scribing method specifically includes: determining the initial repetition frequency and target dot spacing under interference-free conditions; increasing the initial repetition frequency and laser processing speed until interference is eliminated when there is interference between adjacent dots, and recording the new interference-free dot spacing; based on the numerical relationship between the interference-free dot spacing and the target dot spacing, decomposing the original scribing into multiple sub-lines for sequential processing, with the dots of these sub-lines arranged alternately so that the dot spacing between different sub-lines after final splicing meets the target dot spacing. This application can significantly improve the processing efficiency of laser scribing while ensuring the consistency and continuity of scribing width, and is applicable to pulsed lasers of various wavelengths and pulse widths, as well as different optical configuration scenarios.

[0021] like Figure 1 The diagram illustrates a flowchart of a laser scribing method according to an embodiment of this application. This laser scribing method can be applied to laser processing equipment. The laser scribing method may include: Step 101: Obtain the initial repetition frequency and the target dot spacing. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots. The target dot spacing is the target spacing between each dot in a single target line.

[0022] In laser scribing, the laser head emits pulsed laser light at a certain repetition frequency. Each laser pulse forms a dot on the material surface, and the center distance between adjacent dots is called the dot spacing. The dot spacing is determined by both the laser repetition frequency and the laser processing speed. When the dot spacing is large enough, the heat-affected zone and plasma between adjacent pulses will not overlap, and there is no mutual interference between the dots. Each dot has a regular shape and good roundness. In this embodiment, the laser repetition frequency that meets the above conditions is called the initial repetition frequency f0.

[0023] When obtaining the initial repetition frequency, a dot test can be performed on the target material to detect the actual geometric shape of the dots at a certain repetition frequency. If the roundness of the dots meets a preset roundness threshold and the diameter of the dots meets a preset consistency threshold, it is determined that there is no mutual interference between adjacent dots at the current repetition frequency, and this repetition frequency is determined as the initial repetition frequency f0. If the dot shape deviates from the above thresholds, such as the dots being non-round, having excessive diameter deviation, or edge splashing, it is determined that there is mutual interference between adjacent dots at the current repetition frequency, and the repetition frequency needs to be adjusted and the test repeated.

[0024] The target dot spacing d0 is a process requirement parameter for scribing, representing the center distance between adjacent dots in a single target scribing line. Specifically, the exact value of the target dot spacing d0 can be determined through experiments or experience based on specific processing requirements and material properties.

[0025] Step 102: Determine the interference-free dot spacing based on the initial repetition frequency. The interference-free dot spacing is the dot spacing achieved by increasing the initial repetition frequency and laser processing speed so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing.

[0026] To improve processing efficiency, it is necessary to increase the laser repetition frequency f0 and the laser processing speed. However, increasing the laser repetition frequency f0 shortens the time interval between adjacent points. If the laser processing speed is not increased accordingly, subsequent laser pulses will arrive at adjacent positions before the heat and plasma of the previous pulse have dissipated, causing interference between adjacent points. Gradually increasing the laser processing speed causes the laser spot to move a longer distance per unit time, thus increasing the actual distance between adjacent points. As the distance increases, the heat-affected zone and plasma cloud generated by the previous pulse gradually separate spatially from the area affected by subsequent laser pulses. When the laser processing speed is increased to a certain value, the interference between adjacent points is completely eliminated. The center distance between adjacent points at this point is denoted as the interference-free point spacing d. f .

[0027] In this embodiment, the spacing d of the interference-free dotting is... f It is the minimum spacing that can guarantee the quality of the dots after increasing the repetition frequency, and its value is greater than the target dot spacing d0.

[0028] Step 103: Based on the numerical relationship between the non-interference dot spacing and the target dot spacing, determine the number of sub-lines that need to be divided into for the target line and the dot spacing of each sub-line.

[0029] Due to the interference-free dot spacing d f If the target dot spacing d0 is greater than the target dot spacing, directly use the interference-free dot spacing d f During processing, the spacing between adjacent dots is too large, resulting in sparse lines. Therefore, in this embodiment, a single target line is split into multiple sub-lines for processing, and equivalent compensation is achieved by arranging the dots of each sub-line in an alternating manner.

[0030] The number of splits is determined by the spacing d of the non-interference dots. f The multiple relationship between the target dot spacing d0 and the sub-line dot spacing is determined. The sub-line dot spacing of each sub-line is determined based on the number of sub-lines and the target dot spacing d0. There are multiple ways to determine this, which are not limited here. It is only necessary to ensure that there is no mutual interference between adjacent dots when each sub-line is processed individually, and that the sub-line dot spacing between different sub-lines after splicing meets the target dot spacing d0.

[0031] Taking two sub-lines as an example, when the two sub-lines are spliced ​​together, the dots of the first sub-line cover part of the position, and the dots of the second sub-line fill the gaps between the dots of the first sub-line. After the dots of the two sub-lines are intersected, the whole is equivalent to the target line continuously distributed with the target dot spacing d0.

[0032] Step 104: Control the laser head to process each sub-line sequentially according to the number of sub-lines and the spacing between the dots, so that the dots of each sub-line are arranged alternately, and the final dot spacing between different sub-lines meets the target dot spacing.

[0033] The laser head scans and processes each sub-line sequentially according to the determined number of sub-lines and the spacing between the dots on each sub-line. For example, when processing the first sub-line, the laser head scans along the scribing direction at the corresponding dot spacing. After the first sub-line is processed, the laser head shifts a certain distance to begin processing the second sub-line, and so on. After all sub-lines are processed, the dots on each sub-line are staggered along the length of the target scribing line, with the dots on adjacent sub-lines filling the gaps. After splicing, a complete scribing line is formed, and the spacing between adjacent dots on this scribing line is equal to the target dot spacing d0, thus meeting the scribing quality requirements.

[0034] During laser processing, each laser pulse completes the marking of adjacent marking points without mutual interference, resulting in regular marking shapes that meet quality requirements. At the same time, due to the significant increase in laser repetition frequency and laser processing speed, the scanning time of a single sub-line is much shorter than that of traditional solutions, and the total processing time of multiple sub-lines is still less than that of traditional solutions, thus improving processing efficiency.

[0035] In summary, the laser scribing method provided in this application increases the laser repetition frequency from the initial repetition frequency to the target repetition frequency and gradually increases the laser processing speed, thereby increasing the spacing between adjacent scribing points to an interference-free scribing spacing. After the scribing spacing is increased, the heat-affected zone and plasma cloud generated after the previous laser pulse scribing point are spatially separated from the area affected by subsequent laser pulses. This eliminates scribing distortion caused by heat accumulation or plasma interference at high repetition frequencies, ensuring that the scribing shape of each laser pulse remains circular, avoiding phenomena such as uneven scribing width, broken lines, or rough edges.

[0036] In multi-line staggered splicing, the spacing between the dots on each sub-line is an integer multiple of the target dot spacing. In this way, after the dots on multiple sub-lines are arranged in an alternating manner, the final splicing effect is equivalent to a complete line continuously distributed with the target dot spacing.

[0037] like Figure 2The diagram illustrates a flowchart of a laser scribing method according to an embodiment of this application, which can be applied to laser processing equipment. The laser scribing method may include: Step 201: Obtain the initial repetition frequency and the target dot spacing. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots. The target dot spacing is the target spacing between each dot in a single target line.

[0038] The implementation process of step 201 is the same as that of step 101, and will not be described again here.

[0039] Step 202: Increase the initial repetition frequency by a predetermined factor to obtain the target repetition frequency.

[0040] To improve processing efficiency, the laser repetition frequency needs to be increased from the initial repetition frequency f0 to a higher target repetition frequency f. Specifically, a predetermined multiple of x (x > 1) can be set, then the target repetition frequency f is: f = x × f0.

[0041] Since the processing speed gain from the frequency increase must be greater than the time loss required for switching between each sub-line, the conditions to be met by the predetermined multiple x can be set according to the above conditions. Specifically, the difference between the predetermined multiple and 1 is greater than the quotient of the offset distance between each sub-line and the total length of the target scribing line, and the corresponding formula is: x-1>s / L, where s represents the offset distance of each sub-line and L is the total length of the target scribing line.

[0042] Since the offset distance s between sub-lines is usually on the order of micrometers, while the total length L of the target scribe line is usually on the order of centimeters or even meters, s is much smaller than L, and s / L is much smaller than 1. Therefore, only a slight increase in frequency is needed to ensure that the efficiency gain is greater than the switching loss.

[0043] Step 203: Determine the interference-free dot spacing based on the target repetition frequency. The interference-free dot spacing is the dot spacing when laser dotting is performed at the target repetition frequency, and the laser processing speed is gradually increased so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing.

[0044] At the target repetition frequency f, the laser pulse interval shortens. If the laser processing speed remains constant, the spacing between adjacent dots decreases, easily leading to heat accumulation and plasma interference. To eliminate interference, the laser processing speed needs to be gradually increased at the target repetition frequency.

[0045] Increasing the laser processing speed gradually increases the distance the laser spot moves per unit time, thus increasing the actual distance between adjacent laser points. As the distance increases, the heat-affected zone and plasma cloud generated by the previous pulse gradually separate spatially from the area affected by subsequent laser pulses. When the laser processing speed reaches a certain value, the interference between adjacent laser points is completely eliminated. The center distance between adjacent laser points at this point is denoted as the interference-free laser point spacing d. f Among them, the spacing d of the interference-free dots f It can be obtained through experiments, calculations, or by looking up tables; no specific method is required here.

[0046] In this embodiment, the spacing d of the interference-free dotting is... f It is the minimum spacing that can guarantee the quality of the dots after increasing the repetition frequency, and its value is greater than the target dot spacing d0.

[0047] Step 204: Compare the values ​​of the spacing between the interference-free dots and the spacing between the target dots.

[0048] Specifically, the spacing d of the interference-free dot pattern can be calculated. f The ratio of the target dot spacing d0 to the number of sub-lines to be split subsequently determines the number of sub-lines.

[0049] Step 205: If the spacing between the non-interference dots is greater than N times the target spacing but not greater than N+1 times the target spacing, then the number of sub-lines that need to be divided into the target line is determined to be N+1, where N is a positive integer.

[0050] Because of d f >d0, directly using the interference-free dot spacing d f During processing, if the distance between adjacent dots is too large, the continuity requirement of the scribing cannot be met, resulting in breaks or insufficient width in the scribing. To solve this problem, a single target scribing line can be broken down into multiple sub-lines and processed separately. Equivalent compensation can be achieved by arranging the dots of each sub-line in an alternating manner.

[0051] The number of splits is determined by the spacing d of the non-interference dots. f The multiple relationship with the target dot spacing d0 is determined by the following rules: If d0 < d f If ≤2d0, then N=1, the number of splits is 2, that is, a single target line is split into two sub-lines, the spacing between dots on the sub-lines is 2d0, and the two sub-lines are processed back and forth with a spacing of d0. If 2d0 < d f If ≤3d0, then N=2, the number of splits is 3, that is, a single target line is split into three sub-lines, the spacing between dots on the sub-lines is 3d0, and the three sub-lines are processed sequentially with a spacing of d0 between them; If 3d0 < d fIf ≤4d0, then N=3, the number of splits is 4, that is, a single target line is split into four sub-lines, the spacing between dots on the sub-lines is 4d0, and the four sub-lines are processed sequentially with a spacing of d0 between them; and so on.

[0052] In summary, if Nd0 < d f If ≤ (N+1)d0, then the number of splits is N+1, that is, a single target line is split into N+1 sub-lines, where N is a positive integer.

[0053] In practical implementation, the spacing d of the interference-free dots is compared. f The value of the distance d0 between the target and the target marking points. If there is no interference, the marking point distance d... f If the dot spacing is greater than the target spacing d0 but not more than twice the target spacing d0, then only two sub-lines are needed to complete the compensation. The dot spacing between each pair of sub-lines is set to twice the target spacing d0, and the two sub-lines are staggered by a distance equal to the target spacing d0, alternating in the drawing direction. The dots of the first sub-line cover a portion of the area, and the dots of the second sub-line fill the gaps between the dots of the first sub-line. After the dots of the two sub-lines intersect, the overall effect is equivalent to a complete line continuously distributed at the target spacing d0.

[0054] If there is no interference, the dot spacing d f If the distance between the dots exceeds twice the target dot spacing d0 but does not exceed three times the target dot spacing d0, then three sub-lines are needed to complete the compensation. Similarly, when there is no interference, the dot spacing d... f If the distance exceeds N times the target dot spacing d0 but does not exceed N+1 times the target dot spacing d0, then N+1 sub-lines are needed to complete the compensation. After multiple sub-lines are arranged in an alternating pattern according to the above rules, the whole is equivalent to a complete line continuously distributed with the target dot spacing d0.

[0055] Because the spacing between the dots on each sub-line is greater than the spacing d of the dots without interference. f Therefore, there is no mutual interference between adjacent dots when each sub-line is processed individually.

[0056] Step 206: Multiply the number of sub-lines by the target dot spacing to obtain the dot spacing of each sub-line.

[0057] The spacing between dots on each sub-line should be consistent to ensure that the lines are uniform after splicing.

[0058] If it is split into N+1 sub-lines, then the spacing d between the dots on each sub-line is... s = (N+1)d0.

[0059] Taking the splitting into two sub-lines (N=1) as an example, the spacing d between the dots on each sub-line is... s=2d0. Taking the division into three sub-lines (N=2) as an example, the dot spacing d for each sub-line is... s =3d0.

[0060] Step 207: Control the laser head to process each sub-line sequentially according to the number of sub-lines and the spacing between the dots, so that the dots of each sub-line are arranged alternately, and the final dot spacing between different sub-lines meets the target dot spacing.

[0061] Specifically, controlling the laser head to process each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing can include: controlling the laser head to process the nth sub-line according to the sub-line dot spacing; after processing the nth sub-line, controlling the laser head to jump to the start or end position of the (n+1)th sub-line based on the offset distance, and processing the (n+1)th sub-line according to the sub-line dot spacing, wherein the offset distance is less than the total length of the target line.

[0062] Specifically, controlling the laser head to jump to the start or end position of the (n+1)th sub-line based on the offset distance can include: when the processing directions of each sub-line are the same, controlling the laser head to jump to the start position of the (n+1)th sub-line based on the offset distance; when the processing directions of each sub-line are opposite, controlling the laser head to jump to the end position of the (n+1)th sub-line based on the offset distance.

[0063] In this embodiment, the laser head is controlled to make dots according to the sub-line spacing d. s Process the nth sub-line. The laser head moves along the scribing direction at a speed of d. s The laser scans the dot spacing of the sub-lines to form the dot sequence of the nth sub-line. After processing the nth sub-line, the laser head is controlled to jump to the start or end position of the (n+1)th sub-line based on the offset distance s, and the (n+1)th sub-line is processed according to the dot spacing. The offset distance s is equal to the target dot spacing d0. The sub-lines are staggered sequentially by the target dot spacing d0, so that the dots on each sub-line are alternately arranged in the scribing direction.

[0064] When the processing direction of each sub-line is the same, for example, all scanning from left to right, after the laser head completes the nth sub-line, it jumps to the starting position (i.e., the left end) of the n+1th sub-line based on the offset distance s, and then starts scanning the n+1th sub-line.

[0065] When the processing directions of each sub-line are opposite, such as when using a reciprocating scanning method, the laser head, after completing the nth sub-line, does not need to return to the starting point. Instead, it jumps directly to the end position (i.e., the right end) of the (n+1)th sub-line based on the offset distance s, and then scans the (n+1)th sub-line from right to left. In this case, the jump distance is the shortest, the jump time is minimized, and the processing efficiency is higher.

[0066] After all sub-lines are processed, the dots on each sub-line are staggered along the length of the target scribing line, with the dots on adjacent sub-lines filling the gaps. In the spliced ​​entire scribing line, the dot spacing between different sub-lines is equal to the target dot spacing d0, which meets the scribing quality requirements.

[0067] The processing efficiency of the traditional laser scribing method and the laser scribing method of this embodiment is analyzed below: In the traditional interference-free state, the laser processing time t0 = L / (f0×d0).

[0068] In this interference-free scenario, assuming the target line is divided into N+1 sub-lines, the target repetition frequency f = x × f0, and the single scan time is approximately L / [(N+1) × f × d0]. Considering the N+1 scans and the small intermediate jump time t... N (The offset distance s is much smaller than L), laser processing time t f ≈(L+s) / (x×f0×d0)-t N .

[0069] The comparison shows that as long as x > 1 and x - 1 > s / L, then t can be guaranteed. f <t0。

[0070] As can be seen, the larger x is, the higher the laser processing efficiency. For example, when the frequency is doubled (x=2), the laser processing efficiency can be increased by nearly 50%.

[0071] The laser scribing method provided in this application is not dependent on a specific type of laser and is applicable to pulsed lasers of various wavelengths and pulse widths. Furthermore, this method is not dependent on a specific optical configuration and can be implemented on various laser processing equipment.

[0072] In summary, the laser scribing method provided in this application increases the laser repetition frequency from the initial repetition frequency to the target repetition frequency and gradually increases the laser processing speed, thereby increasing the spacing between adjacent scribing points to an interference-free scribing spacing. After the scribing spacing is increased, the heat-affected zone and plasma cloud generated after the previous laser pulse scribing point are spatially separated from the area affected by subsequent laser pulses. This eliminates scribing distortion caused by heat accumulation or plasma interference at high repetition frequencies, ensuring that the scribing shape of each laser pulse remains circular, avoiding phenomena such as uneven scribing width, broken lines, or rough edges.

[0073] In multi-line staggered splicing, the spacing between the dots on each sub-line is an integer multiple of the target dot spacing. In this way, after the dots on multiple sub-lines are arranged in an alternating manner, the final splicing effect is equivalent to a complete line continuously distributed with the target dot spacing.

[0074] The laser scribing method is illustrated below with two specific examples.

[0075] Example 1 For a certain material, the optimal dot spacing d0 = 10 μm is achieved at a laser repetition frequency f0 = 100 kHz, at which point there is no interference. If the laser repetition frequency is increased to f = 200 kHz (x = 2), severe interference occurs when processing at the original laser processing speed. Further increasing the laser processing speed until the dot spacing reaches d0 is also possible. f The interference disappeared when the value was 18μm.

[0076] Comparison revealed that: 10μm < 18μm ≤ 20μm (i.e., d0) <d f (≤2d0), formulate the following processing strategy: split the original line into 2 sub-lines.

[0077] Sub-line 1: The dot spacing is set to 20μm.

[0078] Sub-line 2: The dot spacing is set to 20μm, and the starting position is offset by 10μm relative to sub-line 1.

[0079] Processing procedure: The laser head first rapidly scans sub-line 1, then fine-tunes its position (the offset distance s is very small), and then rapidly scans sub-line 2. After the two lines are superimposed, it is equivalent to continuous scribing with a spacing of 10μm, and each point is formed under interference-free high-frequency and high-speed conditions.

[0080] Results: The processing efficiency was improved by about 45%-50% compared with the original 100kHz mode, and the scribing quality was excellent.

[0081] Example 2 If the laser repetition frequency is increased to f=300kHz (x=3), the interference-free spacing d is measured. f =28μm.

[0082] Comparison revealed that: 20μm < 28μm ≤ 30μm (i.e., 2d0) <d f (≤3d0), formulate the following processing strategy: split the original line into 3 sub-lines.

[0083] Sub-line 1: The dot spacing is set to 30μm.

[0084] Sub-line 2: The dot spacing is set to 30μm, and the starting position is offset by 10μm relative to sub-line 1.

[0085] Sub-line 3: The dot spacing is set to 30μm, and the starting position is offset by 20μm relative to sub-line 1.

[0086] Processing procedure: The laser head first rapidly scans sub-line 1, then fine-tunes its position (the offset distance s is very small), then rapidly scans sub-line 2, then fine-tunes its position (the offset distance s is very small), and then rapidly scans sub-line 3. After the three lines are superimposed, it is equivalent to continuous scribing with a spacing of 10μm, and each point is formed under interference-free high-frequency and high-speed conditions.

[0087] Result: The theoretical efficiency improvement is more significant.

[0088] like Figure 3 The diagram illustrates a structural block diagram of a laser scribing apparatus according to an embodiment of this application. This laser scribing apparatus can be applied in laser processing equipment. The apparatus includes: The parameter acquisition module 310 is used to acquire the initial repetition frequency and the target dot spacing. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots, and the target dot spacing is the target spacing between each dot in a single target line. The spacing determination module 320 is used to determine the interference-free dot spacing based on the initial repetition frequency. The interference-free dot spacing is the dot spacing when the initial repetition frequency and laser processing speed are increased so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing. The sub-line determination module 330 is used to determine the number of sub-lines that need to be divided into for the target line drawing and the sub-line dot spacing of each sub-line based on the numerical relationship between the non-interference dot spacing and the target dot spacing. The sub-line processing module 340 is used to control the laser head to process each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing, so that the dots of each sub-line are arranged alternately, and the dot spacing between different sub-lines after splicing meets the target dot spacing.

[0089] In an optional embodiment, the sub-line determination module 330 is further configured to: Compare the values ​​of the spacing between interference-free dots and the spacing between target dots; If the spacing between the non-interference dots is greater than N times the spacing between the target dots and not greater than N+1 times the spacing between the target dots, then the number of sub-lines that need to be divided into for the target line is determined to be N+1, where N is a positive integer. The spacing between sub-line dots is determined based on the number of sub-lines and the target dot spacing.

[0090] In an optional embodiment, the sub-line determination module 330 is further configured to: Multiply the number of sub-lines by the target dot spacing to obtain the sub-line dot spacing for each sub-line.

[0091] In an optional embodiment, the spacing determination module 320 is further configured to: The initial repetition frequency is increased by a predetermined factor to obtain the target repetition frequency; The interference-free dot spacing is determined based on the target repetition frequency. The interference-free dot spacing is the dot spacing achieved by gradually increasing the laser processing speed during laser dotting at the target repetition frequency so that adjacent dots do not interfere with each other.

[0092] In an optional embodiment, the difference between the predetermined multiple and 1 is greater than the quotient of the offset distance between each sub-line and the total length of the target line.

[0093] In an optional embodiment, the sub-wire processing module 340 is further configured to: Control the laser head to process the nth sub-line according to the sub-line dot spacing; After processing the nth sub-line, the laser head is controlled to jump to the start or end position of the (n+1)th sub-line based on the offset distance, and the (n+1)th sub-line is processed according to the sub-line dot spacing, wherein the offset distance is less than the total length of the target line.

[0094] In an optional embodiment, the sub-wire processing module 340 is further configured to: When the processing direction of each sub-line is the same, the control laser head jumps to the starting position of the (n+1)th sub-line based on the offset distance; When the processing directions of each sub-line are opposite, the control laser head jumps to the end position of the (n+1)th sub-line based on the offset distance.

[0095] In summary, the laser scribing device provided in this application increases the laser repetition frequency from the initial repetition frequency to the target repetition frequency and gradually increases the laser processing speed, thereby increasing the spacing between adjacent scribing points to an interference-free scribing spacing. After the scribing spacing is increased, the heat-affected zone and plasma cloud generated after the previous laser pulse scribing point are spatially separated from the area affected by subsequent laser pulses. This eliminates scribing distortion caused by heat accumulation or plasma interference at high repetition frequencies, ensuring that the scribing shape of each laser pulse remains circular, avoiding phenomena such as uneven scribing width, broken lines, or rough edges.

[0096] In multi-line staggered splicing, the spacing between the dots on each sub-line is an integer multiple of the target dot spacing. In this way, after the dots on multiple sub-lines are arranged in an alternating manner, the final splicing effect is equivalent to a complete line continuously distributed with the target dot spacing.

[0097] One embodiment of this application provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to implement the laser scribing method described above.

[0098] One embodiment of this application provides a laser processing apparatus, which includes the laser scribing device described above.

[0099] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0100] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A laser scribing method, characterized in that, The method includes: The initial repetition frequency and the target dot spacing are obtained. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots. The target dot spacing is the target spacing between each dot in a single target line. The interference-free dot spacing is determined based on the initial repetition frequency. The interference-free dot spacing is the dot spacing achieved by increasing the initial repetition frequency and laser processing speed so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing. Based on the numerical relationship between the non-interference dot spacing and the target dot spacing, determine the number of sub-lines that the target line needs to be divided into and the dot spacing of each sub-line. The laser head is controlled to process each sub-line sequentially according to the number of sub-lines and the spacing between the dots, so that the dots of each sub-line are arranged alternately, and the final dot spacing between different sub-lines meets the target dot spacing.

2. The laser scribing method according to claim 1, characterized in that, The step of determining the number of sub-lines to be divided into for the target line and the sub-line dot spacing based on the numerical relationship between the non-interference dot spacing and the target dot spacing includes: Compare the values ​​of the non-interference dot spacing and the target dot spacing; If the spacing between the interference-free dots is greater than N times the spacing between the target dots, but not greater than N+1 times the spacing between the target dots, then the number of sub-lines that the target line needs to be divided into is determined to be N+1, where N is a positive integer; The sub-line dot spacing is determined based on the number of sub-lines and the target dot spacing.

3. The laser scribing method according to claim 2, characterized in that, The step of determining the sub-line dot spacing for each sub-line based on the number of sub-lines and the target dot spacing includes: Multiply the number of sub-lines by the target dot spacing to obtain the sub-line dot spacing for each sub-line.

4. The laser scribing method according to claim 1, characterized in that, The step of determining the interference-free dot spacing based on the initial repetition frequency includes: The initial repetition frequency is increased by a predetermined factor to obtain the target repetition frequency; The interference-free dot spacing is determined based on the target repetition frequency. The interference-free dot spacing is the dot spacing achieved by gradually increasing the laser processing speed during laser dotting at the target repetition frequency so that adjacent dots do not interfere with each other.

5. The laser scribing method according to claim 4, characterized in that, The difference between the predetermined multiple and 1 is greater than the quotient of the offset distance between each sub-line and the total length of the target line.

6. The laser scribing method according to claim 5, characterized in that, The controlled laser head processes each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing, including: Control the laser head to process the nth sub-line according to the sub-line dot spacing; After processing the nth sub-line, the laser head is controlled to jump to the start or end position of the (n+1)th sub-line based on the offset distance, and the (n+1)th sub-line is processed according to the sub-line dot spacing, wherein the offset distance is less than the total length of the target line.

7. The laser scribing method according to claim 6, characterized in that, The control of the laser head to jump to the start or end position of the (n+1)th sub-line based on the offset distance includes: When the processing direction of each sub-line is the same, control the laser head to jump to the starting position of the (n+1)th sub-line based on the offset distance; When the processing directions of each sub-line are opposite, the laser head is controlled to jump to the end position of the (n+1)th sub-line based on the offset distance.

8. A laser marking device, characterized in that, The device includes: The parameter acquisition module is used to acquire the initial repetition frequency and the target dot spacing. The initial repetition frequency is the laser repetition frequency under the condition that there is no mutual interference between adjacent dots, and the target dot spacing is the target spacing between each dot in a single target line. The spacing determination module is used to determine the interference-free dot spacing based on the initial repetition frequency. The interference-free dot spacing is the dot spacing when the initial repetition frequency and laser processing speed are increased so that adjacent dots do not interfere with each other. The interference-free dot spacing is greater than the target dot spacing. The sub-line determination module is used to determine the number of sub-lines that the target line needs to be divided into and the sub-line dot spacing of each sub-line based on the numerical relationship between the non-interference dot spacing and the target dot spacing. The sub-line processing module is used to control the laser head to process each sub-line sequentially according to the number of sub-lines and the sub-line dot spacing, so that the dots of each sub-line are arranged alternately, and the dot spacing between different sub-lines after splicing meets the target dot spacing.

9. A computer-readable storage medium, characterized in that, The storage medium stores at least one instruction, which is loaded and executed by a processor to implement the laser scribing method as described in any one of claims 1 to 7.

10. A laser processing device, characterized in that, The laser processing equipment includes: the laser scribing device as described in claim 8.

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