Method, system and related devices for monitoring laser processing power

Abstract

The embodiment of the application discloses a kind of laser processing power monitoring method, system and related device, method is applied to laser processing power monitoring system power monitoring device, comprising: obtaining the processing formula of workpiece laser processing, processing formula contains the power parameter corresponding to laser processing operation;According to power parameter, the power reference characteristic quantity corresponding to laser processing operation is determined;According to the power monitoring characteristic quantity of the processing laser according to current laser processing operation, the detection result of current laser processing operation is output according to power monitoring characteristic quantity and the power reference characteristic quantity corresponding to current laser processing operation.The result is thus collected and the accurate association of specific laser processing operation using the laser processing power monitoring method provided in the application, according to power monitoring characteristic quantity and the power reference characteristic quantity, the detection result of current laser processing operation is output, which is beneficial to real-time acquisition of the processing quality of laser processing operation in the processing process.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method, system and related device for monitoring laser processing power. Background Technology

[0002] Laser processing is a precision machining process that uses a high-energy laser beam to act on the surface or interior of a workpiece to remove, modify, or separate materials. During laser processing, the stability of the laser power directly determines the consistency of the processing quality: insufficient power leads to insufficient processing depth and incomplete processing areas; excessive power causes the heat-affected zone to expand, excessive ablation, and even damage to functional areas of the workpiece, reducing product yield. Because lasers are susceptible to power drift due to factors such as temperature changes, device aging, and resonant cavity contamination during actual operation, causing deviations between the set value and the actual output power, monitoring the laser power is a crucial step in ensuring processing quality.

[0003] Currently, there are two main methods for detecting laser power in actual production: offline measurement and online monitoring. Offline measurement involves placing a power meter or similar device into the optical path before and after processing. However, offline measurement can only obtain the power status at the start and end of processing and cannot provide feedback on real-time power changes during the processing.

[0004] Online monitoring based on photoelectric sensors involves continuously acquiring laser power during the manufacturing process. However, existing online monitoring solutions typically only continuously acquire laser power data, resulting in a continuous time-series signal. This lacks a precise correlation with the actual power of the processing operation, making it impossible to determine which specific processing operation corresponds to a particular segment of the acquired signal. Take wafer laser scribing as an example. Wafer laser scribing is a precision machining process that uses a high-power laser to scribble grooves or modified layers on or inside a wafer surface, preparing it for subsequent dicing. Because semiconductor materials are extremely sensitive to heat and energy, even small fluctuations in laser power can directly affect the processing results and reduce product yield. In this scenario, the problem of online monitoring solutions failing to accurately correlate acquired data with specific scribing passes is particularly prominent. A single wafer typically contains dozens to hundreds of scribing passes, and the power status of each pass needs to be monitored independently. However, the continuously acquired time-series signal is difficult to segment and determine by pass. Summary of the Invention

[0005] In view of this, this application discloses a method, system and related device for monitoring laser processing power, which can realize accurate monitoring of each laser processing operation during the laser processing of workpieces, and realize the precise correlation between the collected results and the specific laser processing operation, which is beneficial to obtain the processing quality of a single laser processing operation in real time during the processing.

[0006] In a first aspect, embodiments of this application provide a method for monitoring laser processing power, applied to a laser processing power monitoring system, comprising: Obtain the processing formula for laser processing of the workpiece, which includes the power parameters corresponding to the laser processing operation; Based on the power parameters, determine the power reference characterization quantity corresponding to the laser processing operation. The power reference characterization quantity is used to characterize the target processing power of the laser processing operation. Collect power monitoring parameters of the laser used in the current laser processing operation. These power monitoring parameters are used to characterize the actual processing power of the laser processing operation. The detection results of the current laser processing operation are output based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0007] Therefore, in this embodiment, by acquiring a processing formula containing power parameters of the laser processing operation, the power reference characterization quantity corresponding to each pass is determined, and the power monitoring characterization quantity of the current laser processing operation is collected during the processing. Based on the comparison between the power monitoring characterization quantity and the power reference characterization quantity, a detection result reflecting the processing quality is output. Unlike the existing technology where offline measurement cannot acquire process data and online monitoring cannot accurately correlate the collected data with specific laser processing operations, this application achieves a precise correspondence between the collected data and specific laser processing operations by independently configuring a power reference characterization quantity for each laser processing operation. Thus, since the determination of each laser processing operation is based on its independent power reference characterization quantity, even if there is power drift of the laser between different passes, it can be identified and quantified pass by pass, effectively avoiding batch quality problems in subsequent laser processing caused by the accumulation of abnormal power, and improving the power monitoring accuracy and quality control level of the laser processing process.

[0008] In conjunction with the first aspect, in one possible embodiment, the laser processing operation includes multiple laser processing operations, which are executed in a preset processing order, and each laser processing operation corresponds one-to-one with multiple power reference characterization values; the laser processing operation includes multiple passes of scribing, and the current laser processing operation includes scribing the current pass.

[0009] In conjunction with the first aspect, in one possible embodiment, the step of obtaining the processing formula for laser processing of the workpiece is performed within a first time interval prior to receiving the laser start signal.

[0010] As can be seen, in this embodiment, by acquiring the processing recipe within the first time interval before receiving the laser start signal, it is ensured that the power monitoring device has completed the parsing and storage of all power reference values ​​for each pass before the scribing process begins, avoiding the problem that the reference values ​​are not yet ready when processing starts. Specifically, workpiece scribing has strict timing requirements. If the recipe acquisition and parsing are delayed until after laser start, the current scribing process may have started before the reference values ​​are ready, resulting in the inability to compare monitoring data. By reserving a first time interval before the laser start signal to complete the recipe acquisition, it is ensured that the power reference values ​​are stably present in the monitoring system before the actual acquisition begins, providing a reliable time window for accurate comparison of subsequent power monitoring values ​​and reference values, thereby avoiding monitoring failure or data loss due to timing misalignment and ensuring the integrity and timeliness of each scribing monitoring.

[0011] In conjunction with the first aspect, in one possible embodiment, the method further includes: upon receiving a laser start signal, entering a power acquisition state, the power acquisition state being a preparatory state characterizing the power monitoring quantity of the laser to be acquired for processing; in the power acquisition state, detecting laser emission, and performing the step of acquiring the power monitoring quantity of the processing laser according to the current laser processing operation.

[0012] As can be seen, in the embodiments of this application, by using the detection of laser emission as the trigger condition for collecting power monitoring characteristic quantities during the power acquisition state, the acquisition action is precisely synchronized with the actual laser processing process. The system records effective power data only during the time period when the laser actually acts on the workpiece. On the one hand, this significantly reduces the amount of invalid data and lowers the storage space occupation; on the other hand, it ensures a strict correspondence between the acquired data and the laser processing operation period, so that the power characteristic value of each laser processing operation can accurately reflect the real laser energy input state of that pass, thus improving the accuracy of the monitoring data.

[0013] In conjunction with the first aspect, in one possible embodiment, when the power deviation value is within a preset tolerance range, the detection result is the first detection result, which indicates that the processing quality of the current laser processing operation is qualified; the power deviation value is determined based on the power monitoring characteristic quantity and the power reference characteristic quantity corresponding to the current laser processing operation; when the power deviation value exceeds the preset tolerance range, the detection result is the second detection result, which indicates that the processing quality of the current laser processing operation is unqualified.

[0014] It can be seen that, in the embodiments of the present application, by comparing the power deviation value with the preset tolerance range, the detection results are clearly divided into a first detection result indicating qualified processing quality and a second detection result indicating unqualified processing quality. Specifically, the laser power inevitably has slight fluctuations during the processing. If a single absolute threshold is used for determination, normal process fluctuations are likely to be misjudged as abnormalities, or real power drifts may be missed due to an excessively loose threshold. By setting the preset tolerance range, on the one hand, a reasonable power fluctuation space for the laser under normal working conditions is allowed, avoiding false alarms caused by excessive sensitivity; on the other hand, when the power deviation exceeds the tolerance range, an unqualified determination is clearly output, and substantive power abnormalities caused by factors such as laser aging, temperature drift or optical path pollution are blocked in a timely manner. In this way, the evaluation standard for processing quality is more scientific and stable, which effectively reduces the probability of misjudgment while ensuring detection sensitivity, and improves the reliability of the determination result.

[0015] In combination with the first aspect, in a possible embodiment, the power monitoring apparatus method further comprises: when the detection result is the first detection result, receiving a laser start signal for the next laser processing operation sent by the controller, and when the laser emitting light is detected, collecting the power monitoring characterization value of the processing laser during the processing of the next laser processing operation; and outputting the detection result of the next laser processing operation of the current laser processing operation according to the power monitoring characterization value of the next laser processing operation and the power reference characterization value corresponding to the next laser processing operation, wherein the plurality of power reference characterization values include the power reference characterization value of the next laser processing operation of the current laser processing operation; when the detection result is the second detection result, an abnormal signal is generated.

[0016] It can be seen that, in the embodiments of the present application, after the detection result is output, different subsequent processes are executed respectively according to the first detection result and the second detection result: when the determination is qualified, the monitoring of the next laser processing operation is automatically connected; when the determination is unqualified, an abnormal signal is generated. When the power of the current laser processing operation is normal, the system seamlessly receives the laser start signal of the next pass and continues the collection, which ensures the continuity and high efficiency of the production line processing; when a power abnormality is detected, the alarm information is output in a timely manner, so that the host computer can suspend processing in time and perform manual intervention, avoiding the reduction of workpiece yield or even batch scrapping caused by the continuous execution of unqualified processing operations. In this way, the branching processing mechanism based on the determination result improves the automation level of the workpiece processing process and the reliability of processing quality.

[0017] In combination with the first aspect, in a possible embodiment, outputting the detection result of the current laser processing operation comprises: generating a power detection result within a second time interval starting from the moment when the laser stop signal of the controller is received.

[0018] As can be seen, in the embodiments of this application, by generating power detection results within a second time interval starting from the moment the laser stop signal is received, timely feedback of the detection results for a single laser processing operation is ensured. Specifically, laser processing typically involves dozens to hundreds of operations, and the production line has a tight pace. If there is a significant delay in uploading the detection results, it may occupy the preparation time window for the next action, or even prevent the host computer from obtaining the quality status of the previous operation in a timely manner, thus affecting subsequent processing decisions. By completing the result upload within a limited time interval after the laser stops, on the one hand, the real-time nature of monitoring feedback is ensured, allowing the host computer to know the quality judgment of the current processing operation before the next processing operation; on the other hand, the backlog of detection data is avoided, ensuring smooth data flow for the entire processing batch. In this way, while ensuring monitoring accuracy, production line processing efficiency is also taken into account, making the laser processing operation and real-time power monitoring accurately matched in timing.

[0019] In conjunction with the first aspect, in one possible embodiment, acquiring a power monitoring characteristic quantity of the processing laser according to the current laser processing operation includes: sampling the processing laser to obtain a sampled optical signal; converting the sampled optical signal into an electrical signal through a photoelectric sensor; extracting features from the electrical signal to obtain feature values; and determining the power monitoring characteristic quantity based on the mapping relationship between the feature values ​​and the power monitoring characteristic quantity.

[0020] As can be seen, in the embodiments of this application, the acquisition of power monitoring characteristics is achieved through four steps: sampling, photoelectric conversion, feature extraction, and mapping calculation. Characteristic optical signals are acquired without affecting the processing of the main optical path; the photoelectric sensor converts the optical signal into a continuous electrical signal, achieving a high-speed response to power changes; the feature extraction step converts the original electrical signal into characteristic voltage values, effectively suppressing noise during the sampling process; and through the pre-calibrated mapping relationship between feature values ​​and power monitoring characteristics, the feature values ​​are accurately converted into power values. This ensures both the timely response of the acquisition link to power changes and the accuracy and stability of the power values ​​through feature extraction and calibration mapping, providing reliable data support for subsequent channel-by-channel comparison and judgment.

[0021] Secondly, embodiments of this application provide a laser processing power monitoring device, comprising: an acquisition unit, a determination unit, a collection unit, and an output unit; wherein, the acquisition unit is used to acquire a processing formula for laser processing of a workpiece, the processing formula including power parameters corresponding to the laser processing operation; the determination unit is used to determine a power reference characterization quantity corresponding to the laser processing operation based on the power parameters, the power reference characterization quantity being used to characterize the target processing power of the laser processing operation; the collection unit is used to collect a power monitoring characterization quantity of the processing laser according to the current laser processing operation, the power monitoring characterization quantity being used to characterize the actual processing power of the laser processing operation; and the output unit is used to output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0022] Thirdly, embodiments of this application provide a power monitoring system, including: a power monitoring device, a controller, a power monitoring server, and a laser; wherein, the power monitoring server is used to store the processing recipe for laser processing of a workpiece, the processing recipe including power parameters corresponding to the laser processing operation; the controller is used to send a laser start signal and a laser stop signal to the power monitoring device, and to send a laser enable signal to the laser; the laser is used to execute laser emission and stop emission in response to the laser enable signal; the power monitoring device is used to acquire the processing recipe for laser processing of a workpiece, the processing recipe including power parameters corresponding to the laser processing operation; and, based on the power parameters, determine a power reference characterization quantity corresponding to the laser processing operation, the power reference characterization quantity being used to characterize the target processing power of the laser processing operation; and, collect the power monitoring characterization quantity of the processing laser according to the current laser processing operation, the power monitoring characterization quantity being used to characterize the actual processing power of the laser processing operation; and, output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0023] Fourthly, embodiments of this application provide an electronic device including a memory and a processor. The memory stores a computer program, which includes program instructions. The processor is configured to invoke the program instructions to execute the steps of the method designed in the first aspect described above.

[0024] Fifthly, embodiments of this application provide a computer-readable storage medium, wherein the computer-readable storage medium stores computer-readable instructions that, when executed on a computer, cause the computer to perform some or all of the steps described in the method of the first aspect of embodiments of this application.

[0025] Sixthly, embodiments of this application provide a computer program product, wherein the computer program product includes a computer program, which, when executed by a processor, implements some or all of the steps described in the method of the first aspect of embodiments of this application. The computer program product may be a software installation package.

[0026] The beneficial effects of the technical solutions in aspects two through six can be found in the technical effects of the technical solution in aspect one, and will not be repeated here. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of a power monitoring system provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a power monitoring device provided in an embodiment of this application; Figure 3 A schematic flowchart illustrating a laser processing power monitoring method provided in this application embodiment; Figure 4 A flowchart illustrating a real-time acquisition of laser power monitoring and characterization parameters is provided for an embodiment of this application. Figure 5 This application provides a schematic diagram of a process for performing branching based on detection results in an embodiment of the present application. Figure 6 This is a signal timing diagram provided in an embodiment of this application; Figure 7 A schematic flowchart illustrating another laser processing power monitoring method provided in this application embodiment; Figure 8 A functional unit block diagram of a laser processing power monitoring device provided in this application embodiment; Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Specific Implementation To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0030] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but in some embodiments includes steps or units not listed, or in some embodiments includes other steps or units inherent to these processes, methods, products, or apparatuses.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] In the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone; A and B exist simultaneously; B exists alone. Among them, A and B can be singular or plural.

[0033] In this embodiment, the symbol " / " can indicate that the preceding and following objects are in an "or" relationship. Alternatively, the symbol " / " can also represent a division sign, i.e., performing a division operation. For example, A / B can mean A divided by B.

[0034] In the embodiments of this application, "at least one item" or its similar expression refers to any combination of these items, including any combination of a single item or a plurality of items. "One or more" means one or more, while "multiple" means two or more. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0035] In the embodiments of this application, "equal to" can be used with "greater than" and is applicable to technical solutions used when "greater than" is used; it can also be used with "less than" and is applicable to technical solutions used when "less than" is used. When "equal to" is used with "greater than", it is not used with "less than"; when "equal to" is used with "less than", it is not used with "greater than".

[0036] First, it should be noted that the workpieces in the embodiments of this application refer to various material substrates that can be precision-processed by lasers, including but not limited to semiconductor wafers (such as silicon wafers, silicon carbide wafers, and sapphire wafers), ceramic substrates, metal sheets, and composite material substrates. The following will use wafers as a typical example of a workpiece for detailed explanation, but the technical solutions of this application are not limited thereto.

[0037] The laser processing power monitoring method provided in this application is universally applicable and can be widely used in various laser precision processing fields, including but not limited to wafer laser scribing, wafer laser cutting, wafer laser marking, and laser modification processing of various semiconductor devices. To facilitate understanding and implementation of the technical solution, the following will use a wafer laser scribing scenario as an example to elaborate on the laser processing power monitoring method provided in this application. It should be noted that although the following detailed explanation uses wafer laser scribing as an example, the technical solution of this application is equally applicable to other laser processing scenarios.

[0038] Specifically, in wafer laser scribing and wafer laser cutting scenarios, laser processing operations include multiple laser processing operations, which are executed in a preset processing sequence, and each laser processing operation corresponds one-to-one with multiple power reference values. Laser processing operations include multiple scribing passes, with the current laser processing operation including the scribing of the current pass. The processing recipe includes the power parameters of each of the multiple cutting trajectories. The laser monitoring instrument treats each trajectory as an independent laser processing operation according to the order of the cutting trajectories, determines the corresponding power reference value for each pass, and collects and compares the power monitoring values.

[0039] In wafer laser marking scenarios, the processing recipe includes power parameters for multiple marking patterns or marking areas. The laser monitor treats each pattern or area as an independent laser processing operation according to the marking sequence, determines the corresponding power reference characterization for each area, and collects the power monitoring characterization for comparison. In laser modification processing scenarios, the processing formula contains power parameters for multiple modification regions. The laser monitoring instrument treats each region as an independent laser processing operation according to the modification sequence, determines the corresponding power benchmark characterization quantity for each region, and collects the power monitoring characterization quantity for comparison.

[0040] In each of the above scenarios, the power monitoring system achieves a precise correlation between the power monitoring parameters and the specific processing operation by independently setting a power reference parameter for each laser processing operation. It should be noted that wafer laser scribing is only one preferred exemplary application scenario of the technical solution in this application, and does not limit the application of this solution to this scenario. For other laser processing fields employing the same or substantially the same technical concepts to achieve power monitoring, the relevant descriptions in the wafer laser scribing scenario can be used for understanding and implementation, and will not be elaborated upon here. Specific implementation details in other fields are those that can be reasonably derived and adaptively adjusted by those skilled in the art after reading the full text of this application and considering the specific process object, and all fall within the technical scope covered by this application.

[0041] Secondly, see Figure 1 , Figure 1 This is a schematic diagram of a power monitoring system provided in an embodiment of this application. A laser processing power monitoring method provided in this embodiment can be executed in this power monitoring system. Specifically, the power monitoring system 100 includes a power monitoring server 110, a PLC (Programmable Logic Controller) 120, a power monitoring device 130, and a laser 140.

[0042] In this embodiment, the PLC 120 acts as a controller, communicating with the power monitoring device 130. It sends laser start and stop signals to the power monitoring device 130, and simultaneously sends a laser enable signal to the laser 140 to control the laser's output and shutdown. The power monitoring server 110 communicates with the power monitoring device 130, storing and distributing processing recipe data, and receiving detection results from the power monitoring device 130.

[0043] Please refer to details. Figure 2 In this embodiment, the power monitoring device 130 is a laser power monitoring device with independent functions, such as... Figure 2As shown, the system includes a power sensor 231, an industrial control computer 232, corresponding cables 233, and a power module 234. The power sensor 231 is used to sample and convert the processing laser light into photoelectric signals. Exemplarily, in this embodiment, the sampling is beam splitting sampling, meaning the power sensor 231 obtains a portion of the light from the processing laser light path as a sampling light signal through a built-in or external beam splitter, and further converts this sampling light signal into an electrical signal. The industrial control computer 232 is used to perform the tasks of acquiring, processing, and determining the power signal. The cables 233 are used to establish communication connections between the power monitoring device 130 and the controller PLC 120, the power monitoring server 110, and the laser 140 and the power sensor 231. The power module 234 is used to supply power to the internal components of the power monitoring device 130. The power monitoring device 130 can independently complete the tasks of acquiring, processing, and determining the power signal, and feeds back the detection results to the power monitoring server 110 via the cables 233.

[0044] Understandable Figure 1 The configuration and quantity of the power monitoring server 110, controller PLC 120, power monitoring device 130, and laser 140 in the power monitoring system 100 shown are merely examples and do not constitute a limitation on the embodiments of this application. For example, the power monitoring server 110 may be integrated with the power monitoring device 130 in the same physical device, or it may be an independent cloud server or edge computing node. This application does not make any specific limitations in this regard.

[0045] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the foregoing content and the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0046] The following will combine Figure 1 , Figure 2 A method for monitoring laser processing power in an embodiment of this application will be described. Figure 3 This is a flowchart illustrating a laser processing power monitoring method provided in an embodiment of this application. This method can be applied to… Figure 1 The power monitoring system 100 shown is used for execution, specifically by the power monitoring device 130 therein. The method includes the following steps: S310. Obtain the processing formula for laser processing of the workpiece.

[0047] For example, laser processing is illustrated using laser scribing and a wafer as the workpiece. Wafer laser scribing is a key process before semiconductor wafer dicing. The wafer (e.g., silicon wafer, silicon carbide wafer, or sapphire wafer) is fixed on a vacuum adsorption platform, which moves to cooperate with the laser scanning unit for scribing. Depending on the wafer pattern design, a wafer typically contains dozens to hundreds of parallel or intersecting scribing lines. Each scribing line must ensure consistent processing quality to ensure that subsequent dicing processes can accurately separate along the scribing lines, avoiding defects such as chipping or incomplete cutting. Since different scribing passes may correspond to different material thicknesses, wafer areas, or laser power requirements, the process requires setting laser power parameters individually for each scribing pass to ensure that each pass can obtain consistent scribing depth and trench morphology under its specific processing environment.

[0048] The processing recipe includes multiple power parameters corresponding to various scribing passes, representing the preset laser power to be used for each scribing pass. The power monitoring device 130 acquires this processing recipe before processing and extracts the power setting value for each scribing pass, then determines it as the power reference value for the corresponding pass and stores it in the memory of the industrial control computer 232 for retrieval during subsequent processing. The power reference parameter is a reference parameter used to characterize the target processing power; it can be the power value itself or an equivalent reference value determined based on the voltage-power mapping relationship.

[0049] Specifically, in this embodiment, the recipe data between the power monitoring server 110 and the power monitoring device 130 can be transmitted in JSON format via the TCP protocol. For example, the JSON-formatted recipe information includes at least: workpiece ID, total number of scribing passes, and power parameters for each scribing pass arranged sequentially according to the processing order. It should be understood that this is merely an exemplary implementation and does not constitute a limitation of the present invention. In other embodiments, the power monitoring server 110 and the power monitoring device 130 can use any suitable communication method, such as UDP protocol, Modbus, EtherCAT protocol, etc., and data formats, such as XML, binary protocols, etc., to exchange recipe data, as long as the transmission of recipe data from the power monitoring server 110 to the power monitoring device 130 can be achieved.

[0050] In one possible embodiment, the power monitoring system further includes a controller communicatively connected to the power monitoring device; the step of obtaining the processing recipe for laser processing of the workpiece is performed within a first time interval before the moment the laser start signal from the controller is received.

[0051] Specifically, before receiving the laser start signal from the controller PLC, the power monitoring device needs to acquire and parse the processing recipe in advance to ensure that a usable reference characterization quantity is available when processing begins. Therefore, in this embodiment, the power monitoring server completes the transmission of the recipe data at least within a first time interval before the laser start signal is issued. This first time interval is set to ensure that the power monitoring device has sufficient time to complete the data reception, parsing, and storage.

[0052] For example, the first time interval can be set to 100ms, meaning the power monitoring server completes the transmission of recipe data at least 100ms before laser emission, ensuring the power monitoring device is ready upon receiving the laser start signal. It should be understood that 100ms is merely a preferred example and does not constitute a limitation of this application. In other embodiments, the specific value of the first time interval can be adaptively adjusted based on factors such as the amount of processing recipe data, the transmission rate of the communication link, and the parsing processing speed of the power monitoring device. For example, it can be set to 50ms, 150ms, or 300ms. The first time interval is sufficient to ensure that the power monitoring device completes the acquisition, parsing, and storage of the reference characterization quantities of the recipe data before the laser start signal arrives. The setting of the first time interval needs to consider two aspects: firstly, if the first time interval is too short, the power monitoring device may not be able to complete the parsing and storage of all pass reference characterization quantities before laser start, resulting in the current laser processing operation starting before the reference characterization quantities are ready; secondly, if the first time interval is too long, the recipe data transmission time is too early, which may conflict with other processing scheduling tasks of the host computer or occupy the storage resources of the power monitoring device. The value of the first time interval should be reasonably configured based on the actual production line's communication conditions and the processing capacity of the power monitoring device, so as to avoid resource occupation and scheduling conflicts while ensuring that the formula data is ready.

[0053] As can be seen, in this embodiment, by acquiring the processing recipe within a first time interval before receiving the laser start signal, it is ensured that the power monitoring device has completed the parsing and storage of all operational power reference values ​​before processing begins, avoiding the problem that the reference values ​​are not yet ready when processing starts. Specifically, laser processing has strict timing requirements. If the recipe acquisition and parsing are delayed until after laser start, the current processing operation may have started before the reference values ​​are ready, resulting in the inability to compare monitoring data. By reserving a first time interval before the laser start signal to complete the recipe acquisition, it is ensured that the power reference values ​​are stably present in the monitoring system before the actual acquisition begins, providing a reliable time window for accurate comparison of subsequent power monitoring values ​​and reference values, thereby avoiding monitoring failure or data loss due to timing misalignment, and ensuring the integrity and timeliness of monitoring for each processing operation.

[0054] S320. Based on multiple power parameters, determine multiple power reference quantities corresponding to the laser processing operation.

[0055] For example, the laser processing operation is explained using wafer laser scribing as an example. After acquiring the processing recipe, the power monitoring device parses the recipe data and extracts the power setting value for each scribing line. This extracted power setting value is used as the power reference characterization value for that scribing line and stored in the power monitoring device's memory in scribing order for real-time retrieval during subsequent processing. Specifically, the power monitoring device stores the parsed power reference characterization values ​​for each pass in memory in the form of a sequential index table, with each index item corresponding one-to-one with the scribing pass number. When the power monitoring device receives the laser start signal for the current pass during subsequent processing, it can directly access and read the corresponding power reference characterization value based on the current pass's sequential number, without needing to traverse and search or re-parse the recipe data, ensuring high-speed response for real-time retrieval of reference characterization values ​​during scribing. This sequential index storage method utilizes the fixed pass order and sequential execution in wafer scribing, avoiding complex search and matching processes and reducing the computational latency of the monitoring system.

[0056] For example, the processing formula contains power setting values ​​for 100 scribing lines in sequence. After the power monitoring device analyzes the data, it stores the power setting value of the first scribing line as the power reference value of the first scribing line in memory address 1, stores the power setting value of the third scribing line as the power reference value of the third scribing line in memory address 3, and so on, until the power reference values ​​of all scribing lines are stored.

[0057] Specifically, the processing recipe includes at least the wafer ID, the total number of scribe lines, and the power parameters for each scribe line arranged sequentially in the processing order. By analyzing this information, the power monitoring device can clearly identify the currently processed wafer, the total number of scribe lines to be monitored, and the reference power value corresponding to each scribe line. Through recipe analysis and a reference characterization pre-storage mechanism, each scribe line can quickly retrieve its unique corresponding power reference characterization value during processing, achieving a one-to-one correspondence between scribe lines and reference characterization values. This provides a data foundation for accurate comparison and judgment of subsequent scribe lines.

[0058] S330, Collect power monitoring parameters of the processing laser according to the current laser processing operation.

[0059] For example, the laser processing operation is explained using wafer laser scribing as an example. During processing, the power monitoring device collects real-time power monitoring parameters of the processing laser used for the current scribing pass. Specifically, before the laser emits light, the controller PLC sends a start signal to the power monitoring device, triggering the device to begin data acquisition; immediately afterward, the controller PLC sends a laser enable signal to the laser, the laser emits light, and the scanning unit performs scribing. After scribing is completed, the laser is turned off; subsequently, the controller PLC sends a stop signal to the power monitoring device, and the power monitoring device stops data acquisition. Specifically, the power monitoring parameters are used to characterize the actual processing power, including at least one of the following: voltage signal obtained through photoelectric conversion, current signal, or corresponding characteristic value.

[0060] In one possible embodiment, the method further includes: upon receiving a laser start signal, entering a power acquisition state, the power acquisition state being a preparatory state characterizing the power monitoring parameters of the laser to be acquired for processing; and in the power acquisition state, detecting laser emission and performing the step of acquiring the power monitoring parameters of the processing laser according to the current laser processing operation.

[0061] Specifically, in power monitoring, the power monitoring device, upon entering power acquisition mode, does not simply begin recording data based on the control signal from the PLC. Instead, it uses the detection of actual laser emission as the trigger condition for data acquisition. When the power monitoring device detects that the light signal intensity exceeds a preset threshold, it determines that the laser has actually emitted light, and at this point, it begins recording power data. If the control signal is directly used as the start time for acquisition, it is easy to acquire invalid initial signals or miss the initial part. By using actual light emission as the acquisition trigger, the synchronization error caused by response delay is effectively eliminated.

[0062] In this embodiment, the power monitoring device detects whether the laser is actually emitting light by means of a photoelectric sensor that monitors the sampled light signal in real time. When the voltage value obtained by converting the sampled light signal continuously exceeds a preset light emission threshold, the power monitoring device determines that the laser has actually emitted light. This light emission threshold can be set to a value slightly higher than the ambient light noise level, for example, it can be set to 1.5 to 3 times the voltage value corresponding to the dark current of the power sensor. By setting the light emission threshold, the actual light emission of the laser can be effectively distinguished from ambient light noise or sensor dark current, avoiding false triggering of acquisition during non-light emission periods.

[0063] As can be seen, in the embodiments of this application, by using the detection of laser emission as the trigger condition for performing power monitoring characteristic quantity acquisition under power acquisition state, the acquisition action is precisely synchronized with the actual laser processing process. The system only records valid power data during the time period when the laser actually acts on the workpiece. On the one hand, this significantly reduces the amount of invalid data and reduces storage space occupation; on the other hand, it ensures a strict correspondence between the acquired data and the laser processing period, so that the power characteristic value of each processing operation can accurately reflect the real laser energy input state of the operation, thereby improving the accuracy of the monitoring data.

[0064] In one possible embodiment, please refer to Figure 4 The process involves collecting power monitoring parameters of the laser used in the current laser processing operation, including the following steps: S41. Sample the processing laser to obtain the sampled optical signal.

[0065] For example, laser processing operations are explained using laser scribing as an example. The photoelectric sensor inside the power sensor converts the sampled optical signal into a corresponding voltage signal sequence. This voltage signal sequence uses a single scribing pass as the basic data unit, with the horizontal axis representing the sampling time and the vertical axis representing the voltage value, reflecting the original electrical signal characteristics of the laser power changing over time during that scribing pass.

[0066] S42. The photoelectric sensor of the power monitoring device converts the sampled optical signal into an electrical signal.

[0067] The power sensor internally uses a photoelectric sensor to convert the sampled optical signal into a corresponding voltage signal sequence. This voltage signal sequence uses a single scribing line as the basic data unit, with the horizontal axis representing the sampling time and the vertical axis representing the voltage value, reflecting the original electrical signal characteristics of the laser power changing over time during that scribing process.

[0068] S43. Extract features from the electrical signal and obtain feature values.

[0069] Specifically, the industrial control computer of the power monitoring device extracts features from the voltage signal sequence within the current channel to aggregate the high-frequency sampled raw voltage data into characteristic voltage values ​​that can represent the overall power level of a single channel. Specifically, feature extraction can be performed using one of the following methods: Method 1, Moving Average: A sliding window is set, and the voltage values ​​within the window are averaged to obtain the characteristic voltage value of the line. Boundary points at the beginning and end of the electrical signal sequence that cannot be covered by the complete window due to its incompleteness are discarded and not included in subsequent characteristic value calculations.

[0070] Specifically, the sliding window inevitably has blind spots at both ends of the electrical signal sequence. Forcibly averaging the boundary points of these blind spots introduces systematic bias due to insufficient samples, preventing the feature values ​​from accurately reflecting the overall power level of the laser processing operation. By eliminating these boundary points, mean distortion caused by incomplete windows is avoided, ensuring that each data point involved in the calculation is smoothed with the same window length. Furthermore, while effectively suppressing random fluctuations and measurement noise, the accuracy and reliability of the feature values ​​are further improved.

[0071] Method 2, Energy Density: Integrate the effective signal segment over time, and divide the integral by the effective signal duration to obtain the characteristic voltage value of that trace. The effective signal segment refers to the voltage data segment completely covered by the window after moving average filtering and boundary truncation. This method can reflect the overall laser energy input level during a single trace trace and has good cumulative characterization ability for power fluctuations.

[0072] In an optional embodiment, other feature extraction methods such as peak detection, median filtering, and root mean square calculation can also be used, and this application does not limit these methods. It should be understood that the two feature extraction methods described above are suitable for different processing scenarios. The moving average method is simple to calculate and has a fast response, making it suitable for processing scenarios where the power signal is relatively stable and instantaneous fluctuations are small, effectively smoothing random noise. The energy density method, by integrating the effective signal segment over time, reflects the overall input level of laser energy during a single scribing process, making it suitable for processing scenarios with large power fluctuations or sensitivity to cumulative heat input. In practical applications, the two feature extraction methods can be flexibly selected or combined based on factors such as material properties, scribing depth requirements, and processing stability, and this application does not impose specific limitations on these methods.

[0073] S44. Determine the power monitoring characterization quantity based on the mapping relationship between the characteristic value and the power monitoring characterization quantity.

[0074] In this embodiment, the power monitoring device pre-establishes a mapping relationship between characteristic voltage values ​​and power monitoring parameters, specifically embodied in a voltage-power calibration curve. Based on this calibration curve, the characteristic values ​​extracted in step S43 are mapped to the power monitoring parameters of the current laser processing operation.

[0075] Regarding the establishment of the voltage-power calibration curve, in this embodiment, laser processing operation is explained using laser scribing as an example; the power monitoring device performs a calibration process before executing the monitoring task, specifically including: First, select calibration power points. Choose five calibration power points such that their coverage includes the power monitoring characterization range p1 and p2 of the laser scribing. For example, if the power monitoring characterization range of the scribing is 10W to 50W, then the five calibration power points can be selected as 10W, 20W, 30W, 40W, and 50W respectively.

[0076] Then, calibration signals were acquired. Laser scribing was performed at five calibration powers, with three scribings repeated at each power point, resulting in a total of 15 sets of acquired data. Each set of acquired data includes the voltage signal sequence corresponding to that scribing line and its characteristic voltage value.

[0077] Next, a calibration curve is established. The characteristic voltage values ​​from the 15 sets of collected data are fitted to their corresponding calibration power values ​​to establish a power-voltage calibration curve. This fitting can be done using linear fitting, polynomial fitting, or spline interpolation, etc., and this application does not limit the method.

[0078] Finally, test the accuracy of the calibration curve. Switch to other power points for verification and processing, substitute the measured characteristic voltage values ​​into the calibration curve to calculate the predicted power, and compare it with the actual set power to test the accuracy of the calibration curve. If the deviation is within an acceptable range, the calibration is complete; otherwise, readjust the calibration power point or fitting method.

[0079] Through the above calibration process, the power monitoring device establishes a stable and accurate voltage-power mapping relationship, which not only ensures the timely response of the acquisition link to power changes, but also ensures the accuracy and stability of the power value through feature extraction and calibration mapping, providing reliable data support for subsequent channel-by-channel comparison and judgment.

[0080] S340. Output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0081] For example, laser processing operations are explained using laser scribing as an example. The detection results reflect the processing quality of the current scribing pass; multiple power reference parameters include preset power reference parameters corresponding to the current scribing pass.

[0082] Specifically, in actual processing, the difference between the power monitoring quantity and the power reference quantity can be characterized by various characteristic parameters. For example, this difference can be quantified directly using the power deviation value, or based on the electrical signal after photoelectric conversion using the voltage deviation value or current deviation value, or from the perspective of energy accumulation using the energy deviation value. In other words, any characteristic quantity that can reflect the degree of deviation between the actual processing state and the target state is applicable to the technical solution of this application, and this application does not specifically limit it. For ease of understanding, the power deviation value is used as an example below.

[0083] The following explanation uses power deviation as an example: In one possible embodiment, the power deviation value is determined based on the power monitoring characteristic quantity and the power reference characteristic quantity corresponding to the current laser processing operation. When the power deviation value is within a preset tolerance range, the detection result is the first detection result, which indicates that the processing quality of the current laser processing operation is qualified; when the power deviation value exceeds the preset tolerance range, the detection result is the second detection result, which indicates that the processing quality of the current laser processing operation is unqualified.

[0084] The power monitoring device first calculates the power deviation between the monitored power quantity and the power reference quantity. For example, the power deviation can be represented by a power deviation rate, calculated as follows: Power deviation rate = (P actual) Pbenchmark) / Pbenchmark × 100% Wherein, Pactual represents the power monitoring characteristic value acquired during the current laser processing and obtained through feature extraction and calibration curve mapping; Preference represents the power reference characteristic value corresponding to the current laser processing operation, which is obtained from the processing formula analysis and pre-stored in the memory of the power monitoring device. The power deviation rate characterizes the relative deviation of the power monitoring characteristic value from the reference power. The smaller the value, the closer the power monitoring characteristic value during processing is to the target value set by the process. Specifically, when the power deviation rate is positive, the corresponding power is too high: it means that too much energy is injected by the laser per unit time. This usually leads to excessive expansion of the heat-affected zone, excessive material ablation, spatter and debris, and even damage to the processed components. Excessive power will cause excessive ablation, and the heat-affected zone will be too large, exceeding the width of the cutting track, causing damage to the processed components; when the power deviation rate is negative, the corresponding power is too low: it means insufficient energy. This will result in insufficient laser processing depth, incomplete grooves, and easy chipping during subsequent dicing. Insufficient heat may also prevent the formation of effective cracks.

[0085] Subsequently, the power monitoring device compares the calculated power deviation rate with a preset tolerance threshold X. If the power deviation rate is less than or equal to the threshold X, i.e., within the preset tolerance range, a first detection result, such as an OK signal, is output, indicating that the current laser processing quality is qualified. If the power deviation rate is greater than the threshold X, i.e., outside the preset tolerance range, a second detection result, such as an NG signal, is output, indicating that the current laser processing quality is unqualified.

[0086] For example, for laser scribing of silicon wafers, the tolerance threshold X for power deviation rate can be set to ±5%; for materials with higher hardness and greater sensitivity to thermal damage, such as silicon carbide, the tolerance threshold X can be appropriately narrowed to ±3% due to its greater sensitivity to power fluctuations; while for sapphire materials, due to their higher thermal conductivity and relatively greater tolerance to power fluctuations, the tolerance threshold X can be appropriately relaxed to ±8%. It should be understood that the specific values ​​of the above tolerance thresholds are merely illustrative and do not constitute a limitation of this application. In actual production, the specific value of the tolerance threshold X should be determined comprehensively based on factors such as the specific wafer material, laser model, scribing depth requirements, and historical yield data.

[0087] In other possible embodiments, the power monitoring device may not perform the judgment of the detection result (OK signal / NG signal), but instead output the power monitoring characteristic value to the power monitoring server, which will then make subsequent judgments according to its built-in judgment rules. In this case, the power monitoring device only undertakes the function of power data acquisition and transmission, while the quality judgment is flexibly performed by the upper system according to the production line process requirements.

[0088] The directly output power monitoring values ​​can also be used to reflect the processing quality of the current laser processing operation, allowing maintenance personnel and the power monitoring server to trace, statistically control the process, and perform offline analysis. Thus, by directly outputting the power monitoring values ​​to the power monitoring server for subsequent judgment, the decoupling of monitoring data acquisition and quality judgment decisions is achieved. Specifically, the power monitoring device focuses on power data acquisition and transmission, while the power monitoring server flexibly configures judgment strategies according to the actual process requirements of the production line, ensuring the versatility and stability of the monitoring hardware.

[0089] As can be seen, in the embodiments of this application, by comparing the power deviation value with a preset tolerance range, the detection results are clearly distinguished into a first detection result indicating that the processing quality is qualified and a second detection result indicating that the processing quality is unqualified. Specifically, laser power inevitably fluctuates slightly during processing. If a single absolute threshold is used for judgment, normal process fluctuations are easily misjudged as abnormalities, or the threshold may be too lenient, causing true power drift to be missed. By setting a preset tolerance range, on the one hand, a reasonable power fluctuation space for the laser under normal operating conditions is allowed, avoiding false alarms caused by oversensitivity; on the other hand, when the power deviation exceeds the tolerance range, a clear unqualified judgment is output, promptly intercepting substantial power anomalies caused by factors such as laser aging, temperature drift, or optical path contamination. In this way, the evaluation standard for processing quality becomes more scientific and stable, effectively reducing the probability of false judgment while ensuring detection sensitivity, and improving the reliability of the judgment results.

[0090] Please see Figure 5 , Figure 5 This application provides a schematic diagram of a process for performing branching based on detection results, which can be applied to... Figure 1 The power monitoring device in the power monitoring system shown. For example... Figure 5 As shown, the method includes the following steps: S51. Output the detection results of the current laser processing operation.

[0091] For example, the laser processing operations in this embodiment are explained using laser scribing as an example.

[0092] Specifically, the power monitoring device calculates the power deviation value based on the power monitoring characteristic value of the current row marking and the corresponding power reference characteristic value, compares the power deviation value with the preset tolerance range, and outputs the detection result that reflects the processing quality of the current row marking.

[0093] S52. When the detection result is the first detection result, receive the laser start signal for the next laser processing operation sent by the controller.

[0094] Specifically, if the detection result of the current scribing pass is the first detection result, such as an OK signal, indicating that the processing quality of the current pass is qualified, the power monitoring device continues to wait for and receive the laser start signal for the next scribing pass sent by the controller PLC. More specifically, if the current scribing pass determination result is OK, the power monitoring device continues to wait for the controller PLC to send the start signal for the next scribing pass. After receiving the start signal, it repeats steps S330 and S340, that is, it collects the power monitoring characteristic quantity for the next pass and compares it with the corresponding reference characteristic quantity to output the detection result. This process continues until all scribing passes for the workpiece are completed.

[0095] S53. When it is detected that the laser emits light, the power monitoring characterization quantity of the next laser processing operation is collected.

[0096] Specifically, the power monitoring device enters a collection state after receiving the laser start signal for the next scribing pass, and starts to collect the power monitoring characterization quantity data during the next scribing processing when it is detected that the laser actually emits light.

[0097] S54. Output the detection result of the next laser processing operation of the current laser processing operation according to the power monitoring characterization quantity of the next laser processing operation and the corresponding power reference characterization quantity.

[0098] Specifically, the power monitoring device processes the collected power monitoring characterization quantity data of the next pass, calculates the deviation rate between it and the power reference characterization quantity corresponding to the next pass, and outputs the detection result of the next scribing pass according to whether the deviation rate is within the preset tolerance range, wherein the plurality of power reference characterization quantities include the power reference characterization quantity corresponding to the next scribing pass.

[0099] S55. When the detection result is the second detection result, an abnormal signal is generated.

[0100] Specifically, if the detection result of the current scribing pass is the second detection result, for example, an NG signal, which indicates that the processing quality of the current pass is unqualified, the power monitoring device immediately generates an abnormal signal, notifying the power monitoring server to suspend the operation of the entire production line for manual processing.

[0101] It can be seen that, in the embodiments of the present application, after the detection result is output, different subsequent processes are executed respectively according to the first detection result and the second detection result: when it is determined to be qualified, the monitoring of the next laser processing operation is automatically connected; when it is determined to be unqualified, an abnormal signal is generated. When the power of the current laser processing operation is normal, the system seamlessly receives the laser start signal of the next laser processing operation and continues the collection, which ensures the continuity and high efficiency of production line processing; when a power abnormality is detected, the abnormal signal is generated in time, so that the power monitoring server can suspend the processing in time and carry out manual intervention, avoiding the decrease of workpiece yield or even batch scrap caused by the continuous execution of unqualified processing operations. In this way, through the branch processing mechanism based on the judgment result, the automation level of the workpiece processing process and the reliability of processing quality are improved.

[0102] Specifically, please refer to Figure 6 , Figure 6 which is a signal timing diagram provided in the embodiment of the present application. In this embodiment, the signal interaction between the modules inside the power monitoring system 100 follows a strict timing logic to ensure the precise correspondence between the monitoring data and the laser processing operation. As shown in Figure 6 , the specific timing is as follows: At time T0 (recipe issuance time): the power monitoring server sends the processing recipe in JSON format to the power monitoring device via TCP protocol. The recipe data packet contains at least the workpiece ID, the total number of operations N, and a power parameter array P[1]~P[N] of length N.

[0103] Time T1 (Reference Characteristic Ready Time): The power monitoring device completes recipe analysis, maps the power parameter array to the power reference characteristic array B[1]~B[N] according to the channel number, and stores it in the memory of the industrial control computer. The time interval between T1 and T0 is the recipe analysis delay Δt1, which is usually less than 50ms.

[0104] At time T2 (start signal transmission time): The PLC controller sends a laser start signal to the power monitoring device and a laser enable signal to the laser. Based on the above, T2 is Δt2 time intervals (e.g., 50ms) earlier than T3 (laser emission time), causing the power monitoring device 130 to enter the power acquisition state.

[0105] At time T3 (laser emission moment): The laser begins to emit light in response to the laser enable signal. The power monitoring device detects that the light signal intensity exceeds a preset threshold, triggering the acquisition of power monitoring parameters. The effective processing time Δt_process for a single laser processing operation is from T3 to T4 (laser shutdown moment).

[0106] At time T4 (laser off time): the laser stops emitting light. According to engineering practice, the PLC controller sends a laser stop signal after a fourth time interval Δt4 (e.g., 10ms) following laser off, to ensure that the power monitoring device captures complete power attenuation tail data.

[0107] At time T5 (stop signal arrival time): The power monitoring device receives the laser stop signal, stops data acquisition, and starts the data processing and judgment process.

[0108] At time T6 (result upload time): the power monitoring device uploads the detection result (OK / NG) to the power monitoring server. The time interval between T6 and T5 is the processing delay Δt3, specifically Δt3 does not exceed the second time interval (e.g., 100ms).

[0109] At time T7 (next pass start time): If the current pass test result is OK, the PLC controller sends the laser start signal for the next pass at time T7, repeating the timing cycle from T2 to T6; if the test result is NG, the PLC controller pauses sending subsequent start signals and waits for manual intervention.

[0110] Please see Figure 7 , Figure 7This is a schematic flowchart of another laser processing power monitoring method provided in an embodiment of this application. This method can be applied to... Figure 1 The power monitoring device in the power monitoring system shown is exemplary. Figure 7 The laser processing operation in this example is explained using wafer laser scribing. Figure 7 As shown, the method includes the following steps: S710, power monitoring device self-test.

[0111] Specifically, before processing, the power monitoring device performs a self-test procedure to confirm that the power sensor, industrial computer, communication interface and power module and other functional modules are in normal condition, and that the communication link between the controller PLC and the power monitoring server is unobstructed, so as to ensure the reliability of the subsequent data acquisition and judgment process.

[0112] S711, the host computer sends the processing formula to the power monitoring device in JSON format.

[0113] Specifically, the power monitoring server sends the recipe data, which includes power parameters for multiple passes, to the power monitoring device via TCP protocol in JSON format according to the processing order. The power monitoring device receives and caches the recipe data, preparing to parse it.

[0114] S712, the power monitoring device analyzes the data and extracts the power reference characterization quantity for each line.

[0115] Specifically, the power monitoring device parses the received JSON format recipe data, extracts the power setpoint for each pass, determines it as the power reference characterization quantity for the corresponding pass, and stores it in memory in the order of the lines drawn for real-time retrieval during processing.

[0116] S713. The workpiece enters the processing station and is ready to begin laser scribing.

[0117] Specifically, for example, the workpiece is a wafer; the wafer enters the laser scribing processing station through the conveying device. After positioning and alignment are completed, the system enters the waiting state and waits for the controller PLC to send a start command.

[0118] S714, the PLC controller sends a start signal, and the power monitoring device begins to collect data.

[0119] Specifically, the PLC controller sends a start signal to the power monitoring device before the laser emits light, triggering the power monitoring device to enter the power acquisition state, so that the acquisition system can complete the initialization before the laser emits light.

[0120] S715, the controller PLC sends a laser enable signal to the laser, and the laser emits light.

[0121] Specifically, the PLC controller sends a laser enable signal to the laser, and the laser responds to the signal to perform a light emission operation. The scanning unit performs the current pass scribing process according to the planned path.

[0122] S716. After the line marking is completed, the PLC controller sends a stop signal, and the power monitoring device stops collecting data.

[0123] Specifically, after the current scribing process is completed, the laser is turned off, the PLC controller sends a stop signal to the power monitoring device, and the power monitoring device responds to the signal by stopping the acquisition of power data.

[0124] S717. The power monitoring device calculates the deviation rate between the power monitoring characteristic quantity and the power reference characteristic quantity.

[0125] Specifically, the power monitoring device extracts features from the current channel voltage signal sequence and determines the power monitoring characterization value based on the pre-calibrated voltage-power mapping relationship. Then, it calculates the deviation rate between the power monitoring characterization value and the corresponding power reference characterization value.

[0126] S718. Determine whether the power deviation rate is less than the preset threshold X%; if yes, proceed to step S719; if no, proceed to step S721.

[0127] Specifically, the power monitoring device compares the calculated power deviation rate with the preset tolerance threshold X%. If the deviation rate is less than X%, the current pass marking process is deemed to be of acceptable quality. If the deviation rate is greater than or equal to X%, it is deemed to be unacceptable.

[0128] S719: Output OK signal and continue monitoring the next line.

[0129] Specifically, when the power deviation rate is within the preset tolerance range, the power monitoring device outputs an OK signal to the power monitoring server, indicating that the current scribing quality is qualified, and the system automatically enters the monitoring process for the next scribing.

[0130] S720. Determine if there is a next line.

[0131] Specifically, the power monitoring device determines whether the current scribe is the last scribe based on the total number of scribe lines in the recipe data; if there is a next scribe line, it returns to step S714 to continue monitoring the next scribe line; if there is no next scribe line, it completes the scribe line detection for the wafer and jumps to step S723.

[0132] S721 outputs an NG signal to notify the host computer to suspend operation.

[0133] Specifically, when the power deviation rate exceeds the preset tolerance range, the power monitoring device outputs an NG signal to the power monitoring server, indicating that the current pass marking processing quality is unqualified, and at the same time outputs an alarm message to notify the host computer to suspend the operation of the entire line.

[0134] S722, Waiting for manual reset.

[0135] Specifically, the host computer responds to the NG signal by pausing the entire production line operation and waiting for manual investigation of the cause of the power abnormality and completion of the reset operation before resuming subsequent processing.

[0136] S723, Completed.

[0137] In one possible embodiment, outputting the detection result of the current track marking includes: generating a power detection result within a second time interval, starting from the moment the laser stop signal from the controller is received.

[0138] Specifically, after the scribing is completed, the PLC controller sends a laser stop signal to the power monitoring device. The power monitoring device stops acquiring data and completes the data processing and judgment for the current pass. Subsequently, it generates the power detection result within a second time interval. For example, this second time interval can be set to 100ms, meaning that after the single-pass scribing detection is completed, the power monitoring device feeds back the OK / NG result to the power monitoring server within 100ms, ensuring that the result is uploaded before the next scribing begins, without affecting the normal processing sequence of the next scribing pass.

[0139] It should also be noted that in this embodiment, the controller PLC sends a stop signal at least four time intervals after the laser beam emission ends to ensure that complete line drawing data can be collected. For example, the fourth time interval can be 10ms, meaning the controller PLC sends the stop signal 10ms after the laser beam is turned off, allowing the power monitoring device to capture power attenuation data during the laser shutdown process and ensuring the integrity of the single-track line drawing power data.

[0140] As can be seen, in the embodiments of this application, by generating power detection results within a second time interval starting from the moment the laser stop signal is received, timely feedback of single-pass scribing detection results is ensured. Specifically, workpiece scribing typically involves dozens to hundreds of scribing passes, and the production line has a tight schedule. If there is a significant delay in uploading the detection results, it may occupy the preparation time window for the next scribing pass, or even prevent the host computer from obtaining the quality status of the previous pass in time, thus affecting subsequent processing decisions. By completing the result upload within a limited time interval after the laser stops, on the one hand, the real-time nature of monitoring feedback is ensured, allowing the host computer to know the quality judgment of the current pass before the next processing pass; on the other hand, the backlog of detection data is avoided, ensuring smooth data flow for the entire processing batch. In this way, while ensuring monitoring accuracy, production line processing efficiency is also taken into account, making scribing processing and real-time power monitoring accurately matched in timing.

[0141] The foregoing mainly describes the solutions of the embodiments of this application from a methodological perspective. It is understood that, in order to achieve the above functions, the apparatus may include hardware structures and / or software circuits corresponding to the execution of each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in a hardware or computer software-driven hardware manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0142] This application embodiment can divide the device into functional units according to the above method example. For example, each function can be divided into different functional units, or two or more functions can be integrated into one processing unit. It should be noted that the unit division in this application embodiment is illustrative and is only a logical functional division, while other division methods may be used in actual implementation.

[0143] In this embodiment, refer to Figure 8 , Figure 8 This is a functional block diagram of a laser processing power monitoring device provided in an embodiment of this application. The laser processing power monitoring device 800 includes an acquisition unit 801, a determination unit 802, a data acquisition unit 803, and an output unit 804.

[0144] In this embodiment, the acquisition unit 801, the determination unit 802, the acquisition unit 803, and the output unit 804 can be any circuit unit used to receive and process signals, information, etc., or to determine a monitoring mechanism, and there are no specific limitations on this.

[0145] In this embodiment, the laser processing power monitoring device 800 may further include a storage unit for storing computer program code or instructions executed by the laser processing power monitoring device 800. The storage unit may be a memory.

[0146] In this embodiment, the laser processing power monitoring device 800 can be a chip or a chip module.

[0147] In this embodiment, the acquisition unit 801, the determination unit 802, the acquisition unit 803, and the output unit 804 can be integrated into the communication unit. The communication unit can be a communication interface, a transceiver, a transceiver circuit, etc.

[0148] In this embodiment, the acquisition unit 801, the determination unit 802, the acquisition unit 803, and the output unit 804 can be integrated into the processing unit.

[0149] It should be noted that the processing unit can be a processor or controller, such as a baseband processor, baseband chip, CPU, general-purpose processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. The processing unit can also be a combination that implements computational functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.

[0150] In this embodiment, the laser processing power monitoring device 800 is used to perform any of the steps performed by the chip / chip module, etc., as described in the above method embodiments.

[0151] In specific implementation, the acquisition unit 801, the determination unit 802, the acquisition unit 803, and the output unit 804 are used to execute any of the steps in the above method embodiments, and when performing actions such as sending, other units can be selectively called to complete the corresponding operation. A detailed explanation follows.

[0152] The acquisition unit 801 is used to acquire the processing formula for laser processing of the workpiece. The processing formula includes the power parameters corresponding to the laser processing operation. The determining unit 802 is used to determine the power reference characterization quantity corresponding to the laser processing operation based on the power parameters. The power reference characterization quantity is used to characterize the target processing power of the laser processing operation. The acquisition unit 803 is used to acquire the power monitoring and characterization quantity of the processing laser according to the current laser processing operation. The power monitoring and characterization quantity is used to characterize the actual processing power of the laser processing operation. Output unit 804 is used to output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0153] In this embodiment, the laser processing operation includes multiple laser processing operations, which are executed in a preset processing order, and each laser processing operation corresponds one-to-one with multiple power reference characterization values; the laser processing operation includes multiple passes of scribing, and the current laser processing operation includes scribing the current pass.

[0154] In this embodiment, the step of the laser processing power monitoring device 800 acquiring the processing formula for laser processing of the workpiece is performed within a first time interval before receiving the laser start signal.

[0155] In this embodiment, the acquisition unit 803 is further configured to, upon receiving a laser start signal, enter a power acquisition state, which is a preparatory state representing the power monitoring characteristic quantity of the laser to be acquired for processing; in the power acquisition state, upon detecting laser emission, execute the step of acquiring the power monitoring characteristic quantity of the processing laser according to the current laser processing operation.

[0156] In this embodiment, when the power deviation value is within the preset tolerance range, the detection result is the first detection result, which indicates that the processing quality of the current laser processing operation is qualified; the power deviation value is determined based on the power monitoring characteristic quantity and the power reference characteristic quantity corresponding to the current laser processing operation; when the power deviation value exceeds the preset tolerance range, the detection result is the second detection result, which indicates that the processing quality of the current laser processing operation is unqualified.

[0157] In this embodiment, the output unit 804 is further configured to: receive the laser start signal for the next laser processing operation sent by the controller when the detection result is the first detection result; and when the laser emits light, collect the power monitoring characteristic quantity of the laser during the next laser processing operation; and output the detection result of the next laser processing operation of the current laser processing operation based on the power monitoring characteristic quantity of the next laser processing operation and the power reference characteristic quantity corresponding to the next laser processing operation, wherein the multiple power reference characteristic quantities include the power reference characteristic quantity of the next laser processing operation of the current laser processing operation; and generate an abnormal signal when the detection result is the second detection result.

[0158] In this embodiment, in terms of outputting the detection result of the current laser processing operation, the output unit 804 is specifically used to generate a power detection result within a second time interval, starting from the moment the laser stop signal from the controller is received.

[0159] In this embodiment, in terms of acquiring the power monitoring characteristic quantity of the processing laser according to the current laser processing operation, the acquisition unit 803 is specifically used to: sample the processing laser to obtain the sampled optical signal; convert the sampled optical signal into an electrical signal through the photoelectric sensor of the power monitoring device; extract features from the electrical signal to obtain feature values; and determine the power monitoring characteristic quantity according to the mapping relationship between the feature values ​​and the power monitoring characteristic quantity.

[0160] It should be noted that, Figure 8 The specific implementation of each operation in the embodiments can be found in the description of the method embodiments shown above, and will not be repeated here.

[0161] In this embodiment, refer to Figure 9 , Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 9 As shown, the electronic device 900 includes a processor 901 and a memory 902. The processor 901 is coupled to the memory 902. The memory 902 is used to store computer programs or instructions and / or data. The processor 901 is used to execute the computer programs or instructions stored in the memory 902, or to read the data stored in the memory 902.

[0162] Optionally, there may be one or more processors 901.

[0163] Optionally, the memory 902 may be one or more.

[0164] Alternatively, the memory 902 can be integrated with the processor 901, or it can be set separately.

[0165] Optionally, the electronic device 900 may also include a transceiver for receiving and / or transmitting signals. For example, a processor 901 may be used to control the transceiver to receive and / or transmit signals.

[0166] In specific implementation, the processor 901 in the electronic device 900 is used to execute the computer program or instructions stored in the memory 902 to perform the following operations: Obtain the processing formula for laser processing of the workpiece, which includes the power parameters corresponding to the laser processing operation; Based on the power parameters, determine the power reference characterization quantity corresponding to the laser processing operation. The power reference characterization quantity is used to characterize the target processing power of the laser processing operation. Collect power monitoring parameters of the laser used in the current laser processing operation. These power monitoring parameters are used to characterize the actual processing power of the laser processing operation. The detection results of the current laser processing operation are output based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

[0167] It should be noted that, Figure 9 The specific implementation of each operation in the embodiments can be found in the description of the method embodiments shown above, and will not be repeated here.

[0168] Furthermore, embodiments of this application also provide a computer-readable storage medium storing computer instructions, which, when executed on a computer, cause the methods in the various method embodiments of this application to be performed.

[0169] Furthermore, this application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any of the methods described in the above method embodiments. The computer program product may be a software installation package, and the computer may include an electronic device.

[0170] Furthermore, embodiments of this application also provide a chip, which includes a processor. A memory for storing a computer program is provided independently of the chip, and the processor is used to execute the computer program stored in the memory, so that the methods in the various method embodiments of this application are executed.

[0171] Furthermore, the chip may also include a communication interface. The communication interface can be an input / output interface or an interface circuit, etc. Furthermore, the chip may also include memory.

[0172] It should be understood that the processor in the embodiments of this application can be an integrated circuit chip with the ability to process signals. In implementation, each step of the above method embodiments can be completed by integrated logic circuits in the processor's hardware or by instructions in software form. The processor can be a CPU, or other general-purpose processors, DSPs, ASICs, FPGAs, or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the embodiments of this application can be directly implemented by a hardware encoding processor, or by a combination of hardware and software modules in the encoding processor. The software modules can be located in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above method.

[0173] The memory in this application embodiment can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. Non-volatile memory can be ROM, Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), EEPROM, or flash memory. Volatile memory can be RAM, which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), and synchronous link dynamic random access memory (SLDRAM).

[0174] It should be noted that when the processor is a general-purpose processor, DSP, ASIC, FPGA, or other programmable logic device, discrete gate or transistor logic device, or discrete hardware component, the memory can be integrated into the processor.

[0175] It should be noted that the memory described in this article is intended to include, but is not limited to, these and any other suitable types of memory.

[0176] It should be noted that, for the sake of simplicity, the above embodiments are all described as a series of actions. Those skilled in the art should understand that this application is not limited to the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0177] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0178] The steps of the methods or algorithms described in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, portable hard disk, read-only optical disc (CD-ROM), or any other form of storage medium well known in the art. An exemplary storage medium is coupled to the processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0179] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, in the form of a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0180] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on the processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented through a software program that runs on the processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0181] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A method for monitoring laser processing power, characterized in that, Applications include laser processing power monitoring systems, including: Obtain a processing formula for laser processing of a workpiece, wherein the processing formula includes power parameters corresponding to the laser processing operation; Based on the power parameters, a power reference quantity corresponding to the laser processing operation is determined, and the power reference quantity is used to characterize the target processing power of the laser processing operation. Collect power monitoring parameters of the processing laser according to the current laser processing operation, and the power monitoring parameters are used to characterize the actual processing power of the laser processing operation; The detection result of the current laser processing operation is output based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

2. The method according to claim 1, characterized in that, The laser processing operation includes multiple laser processing operations, which are executed in a preset processing order, and each of the multiple laser processing operations corresponds one-to-one with multiple power reference characterization values. The laser processing operation includes multiple scribing passes, and the current laser processing operation includes the current scribing pass.

3. The method according to claim 2, characterized in that, The step of obtaining the processing formula for laser processing of the workpiece is performed within a first time interval before receiving the laser start signal.

4. The method according to claim 3, characterized in that, The method further includes: upon receiving the laser start signal, entering a power acquisition state, wherein the power acquisition state is a preparatory state characterizing the power monitoring characteristic quantity of the laser to be acquired; and in the power acquisition state, detecting laser emission and performing the step of acquiring the power monitoring characteristic quantity of the laser to be acquired according to the current laser processing operation.

5. The method according to any one of claims 1-4, characterized in that, When the power deviation value is within the preset tolerance range, the detection result is the first detection result, which indicates that the processing quality of the current laser processing operation is qualified; the power deviation value is determined based on the power monitoring characteristic quantity and the power reference characteristic quantity corresponding to the current laser processing operation. When the power deviation value exceeds the preset tolerance range, the detection result is the second detection result, which indicates that the processing quality of the current laser processing operation is unqualified.

6. The method according to claim 5, characterized in that, The method further includes: When the detection result is the first detection result, the laser start signal for the next laser processing operation sent by the controller is received, and when the laser emits light, the power monitoring characteristic quantity of the processing laser during the next laser processing operation is collected. Based on the power monitoring characteristic quantity of the next laser processing operation and the power reference characteristic quantity corresponding to the next laser processing operation, the detection result of the next laser processing operation of the current laser processing operation is output, and the multiple power reference characteristic quantities include the power reference characteristic quantity of the next laser processing operation of the current laser processing operation. When the detection result is the second detection result, an abnormal signal is generated.

7. The method according to claim 6, characterized in that, The output of the detection result of the current laser processing operation includes: Starting from the moment the laser stop signal is received from the controller, a power detection result is generated within a second time interval.

8. The method according to any one of claims 1-7, characterized in that, The power monitoring parameters acquired according to the current laser processing operation include: The processing laser is sampled to obtain the sampled optical signal; The sampled optical signal is converted into an electrical signal using a photoelectric sensor; Feature extraction is performed on the electrical signal to obtain feature values; The power monitoring characteristic quantity is determined based on the mapping relationship between the characteristic value and the power monitoring characteristic quantity.

9. A laser processing power monitoring device, characterized in that, include: The system comprises an acquisition unit, a determination unit, a data collection unit, and an output unit; among which, The acquisition unit is used to acquire the processing formula for laser processing of the workpiece, the processing formula including the power parameters corresponding to the laser processing operation; The determining unit is used to determine the power reference characterization quantity corresponding to the laser processing operation based on the power parameters, wherein the power reference characterization quantity is used to characterize the target processing power of the laser processing operation; The acquisition unit is used to acquire power monitoring parameters of the processing laser according to the current laser processing operation, and the power monitoring parameters are used to characterize the actual processing power of the laser processing operation. The output unit is used to output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

10. A laser processing power monitoring system, characterized in that, include: Power monitoring device, controller, power monitoring server, and laser; among which, The power monitoring server is used to store the processing recipe for laser processing of workpieces, and the processing recipe includes the power parameters corresponding to the laser processing operation; The controller is used to send a laser start signal and a laser stop signal to the power monitoring device, and to send a laser enable signal to the laser. The laser is used to perform laser emission and stop emission in response to the laser enable signal; The power monitoring device is used to acquire a processing formula for laser processing of a workpiece, the processing formula including power parameters corresponding to the laser processing operation; and, based on the power parameters, determine a power reference characterization quantity corresponding to the laser processing operation, the power reference characterization quantity being used to characterize the target processing power of the laser processing operation; and, acquire a power monitoring characterization quantity of the processing laser according to the current laser processing operation, the power monitoring characterization quantity being used to characterize the actual processing power of the laser processing operation; and, output the detection result of the current laser processing operation based on the power monitoring characterization quantity and the power reference characterization quantity corresponding to the current laser processing operation.

11. An electronic device, characterized in that, It includes a processor and a memory, the memory being used to store one or more programs and configured to be executed by the processor, the programs including instructions for performing the steps of the method as described in any one of claims 1-8.

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