Hollow round wafer processing apparatus and method

Abstract

The application relates to the technical field of semiconductor manufacturing, and discloses a hollow circular wafer processing device and method, wherein the hollow circular wafer processing device comprises a mounting seat, a camera mounted on the mounting seat, the camera being used for detecting the center position of a hollow circular wafer, a main shaft moving assembly, a rotating piece capable of moving along a first direction and a second direction being mounted on the main shaft moving assembly, the rotating piece being rotated about an axis extending along a third direction, and the camera being located on the third direction of the rotating piece; an inner circle trimming moving assembly, a first trimming piece capable of moving along the first direction, the second direction and the third direction being mounted on the inner circle trimming moving assembly, and the first trimming piece being used for trimming an inner edge by extending into a center hole of the hollow circular wafer; and an outer circle trimming moving assembly, a second trimming piece capable of moving along the first direction and the third direction being mounted on the outer circle trimming moving assembly, and the second trimming piece being used for trimming an outer edge of the hollow circular wafer. The application provides a hollow circular wafer processing device and method, which can reduce the error of hollow circular wafer processing and improve the consistency of products in the same batch.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a hollow wafer processing apparatus and method. Background Technology

[0002] In the semiconductor chip manufacturing process, after cutting hollow wafers, the surface of the wafers needs to be thinned and ground to reduce saw marks and damage. After grinding, the inner and outer edges of the hollow wafers also need to be rounded to effectively prevent breakage during circuit fabrication.

[0003] Currently, hollow wafers are typically moved to different workstations for grinding the outer edges and the inner edges of the center hole, respectively. However, when transferring hollow wafers to different workstations, they need to be repositioned and clamped, which can easily lead to errors in the processing of hollow wafers and affect the consistency of products in the same batch. Summary of the Invention

[0004] The purpose of this invention is to provide a hollow wafer processing apparatus and method that can reduce errors in hollow wafer processing and improve the consistency of products in the same batch.

[0005] To achieve the above objectives, the present invention provides a hollow wafer processing apparatus having a first direction, a second direction, and a third direction that intersect each other perpendicularly, and includes a worktable, wherein the worktable is equipped with a mounting base, a spindle moving assembly, an inner circle trimming moving assembly, an outer circle trimming moving assembly, and a control system. The mounting base is equipped with a camera for detecting the center position of the hollow circular wafer. The main shaft moving assembly is equipped with a rotating member that can move along the first direction and the second direction. The rotating member rotates about an axis extending along the third direction. The camera is located on the third direction of the rotating member. The side of the rotating member facing the camera along the third direction is used to fix the hollow circular wafer. The inner circle trimming moving assembly is equipped with a first grinding member that can move along the first direction, the second direction and the third direction. The first grinding member is used to extend into the central hole of the hollow circular wafer to grind the inner edge. The outer circle trimming moving assembly is equipped with a second grinding member that can move along the first direction and the third direction. The second grinding member is located in the first direction of the rotating member and is used to grind the outer edge of the hollow circular wafer. The control system is electrically connected to the spindle moving assembly, the inner circle trimming moving assembly, the outer circle trimming moving assembly, the camera, and the rotating component.

[0006] Optionally, the worktable is further equipped with a thinning moving assembly, which is equipped with a thinning component capable of moving along the second direction and a third direction. The thinning component is located in the third direction of the rotating component and is used to grind the side of the hollow wafer facing the thinning component. The control system is electrically connected to the thinning moving assembly.

[0007] Optionally, the thinning moving component is mounted on the mounting base.

[0008] Optionally, the thinning moving assembly includes a thinning Y-axis moving axis and a thinning Z-axis moving axis. The thinning Y-axis moving axis is mounted on the mounting base, the thinning Z-axis moving axis is mounted on the thinning Y-axis moving axis and is movable along the second direction, and the thinning element is mounted on the thinning Z-axis moving axis and is movable along the third direction.

[0009] Optionally, the rotating component includes: A rotating shaft, which is mounted on the main shaft moving assembly and is rotatable about an axis extending in the third direction; A suction cup, coaxially mounted on the side of the rotation axis facing the camera along a third direction, the side of the suction cup facing the camera along the third direction being used to adsorb the hollow cylindrical wafer; and A vacuum tube is inserted through the rotating shaft along the third direction. One end of the vacuum tube is connected to the suction cup, and the other end of the vacuum tube is used to connect to a vacuum machine.

[0010] Optionally, the spindle moving assembly includes a fourth X-axis moving axis and a second Y-axis moving axis. The fourth X-axis moving axis is mounted on the worktable, the second Y-axis moving axis is mounted on the fourth X-axis moving axis and is movable along the first direction, and the rotating component is mounted on the second Y-axis moving axis and is movable along the second direction.

[0011] Optionally, the inner circle trimming moving assembly includes a first X-axis moving axis, a first Y-axis moving axis, and a first Z-axis moving axis. The first X-axis moving axis is mounted on the worktable, the first Y-axis moving axis is mounted on the first X-axis moving axis and can move along the first direction, the first Z-axis moving axis is mounted on the first Y-axis moving axis and can move along the second direction, and the first grinding part is mounted on the first Z-axis moving axis and can move along the third direction.

[0012] Optionally, the outer circle trimming moving assembly includes a second X-axis moving axis and a second Z-axis moving axis. The second X-axis moving axis is mounted on the worktable, and the second Z-axis moving axis is mounted on the second X-axis moving axis and can move along the first direction. The second grinding part is mounted on the second Z-axis moving axis and can move along the third direction.

[0013] Optionally, the outer circle trimming moving assembly further includes a third X-axis moving axis, which is mounted on the second Z-axis moving axis and can move along the third direction, and the second grinding member is mounted on the third X-axis moving axis and can move along the first direction.

[0014] This invention provides a method for processing hollow wafers, comprising the following steps: 10. A processing method based on the hollow wafer processing apparatus according to any one of claims 1-9, characterized in that it includes the following steps: S1. Fix the hollow circular wafer to the rotating component, control the rotation of the rotating component, and start the camera to detect the center position of the hollow circular wafer. S2. Control the main shaft moving component to drive the rotating part to move, and determine whether the center position of the hollow circular wafer and the visual center position of the camera coincide. If yes, execute step S3; if no, execute step S2 again. S3. Control the inner circle trimming moving component and the outer circle trimming moving component respectively to drive the first grinding component and the second grinding component to move, so that the first grinding component extends into the center hole of the hollow circular wafer to grind the inner edge, and the second grinding component grinds the outer edge of the hollow circular wafer.

[0015] Compared with the prior art, the hollow wafer processing apparatus of this invention has the following advantages: The hollow wafer is fixed to a rotating component and rotated by the component. A camera detects the center position of the hollow wafer and controls the spindle moving component to move the rotating component so that the camera's visual center position coincides with the center position of the hollow wafer. Then, the inner and outer edge trimming moving components are controlled to move the first and second trimming components. The first trimming component extends into the center hole of the hollow wafer to trim the inner edge, and the second trimming component trims the outer edge of the hollow wafer. Therefore, the first and second trimming components trim the inner and outer edges of the hollow wafer based on the same center, eliminating the need to transfer the workstation for repositioning and clamping, reducing processing errors and improving the consistency of products in the same batch. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the hollow wafer processing apparatus according to an embodiment of the present invention; Figure 2 yes Figure 1 A magnified view of a portion of point A in the middle; Figure 3 This is a flowchart of the hollow wafer processing method described in the embodiments of the present invention; In the diagram, 1 is the worktable; 2 is the mounting base; 3 is the spindle moving assembly; 31 is the fourth X-axis moving axis; 32 is the second Y-axis moving axis; 4 is the inner circle trimming moving assembly; 41 is the first X-axis moving axis; 42 is the first Y-axis moving axis; 43 is the first Z-axis moving axis; 5 is the outer circle trimming moving assembly; 51 is the second X-axis moving axis; 52 is the second Z-axis moving axis; 53 is the third X-axis moving axis; 6 is the camera; 7 is the rotating component; 71 is the rotating axis; 72 is the suction cup; 8 is the hollow wafer; 9 is the first grinding component; 10 is the second grinding component; 11 is the thinning moving assembly; 111 is the thinning Y-axis moving axis; 112 is the thinning Z-axis moving axis; and 12 is the thinning component. Detailed Implementation

[0017] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0018] In the description of this invention, it should be understood that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this invention based on the specific circumstances.

[0019] In the description of this invention, it should be understood that the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," "longitudinal," "X-axis direction," "Y-axis direction," and "Z-axis direction," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. Moreover, some of the above terms, in addition to indicating orientations or positional relationships, may also be used to indicate other meanings; for example, the term "upper" may in some cases be used to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0020] The following is an explanation of the English abbreviations used in this application: HMI: Human Machine Interface.

[0021] like Figure 1-2 As shown, this embodiment of the invention provides a hollow wafer processing apparatus having a first direction X, a second direction Y and a third direction Z that intersect each other perpendicularly, including a worktable 1, a mounting base 2, a spindle moving assembly 3, an inner circle trimming moving assembly 4, an outer circle trimming moving assembly 5 and a control system mounted on the worktable 1; Mounting base 2 is equipped with camera 6, which is used to detect the center position of hollow circular wafer 8. The main shaft moving assembly 3 is equipped with a rotating member 7 that can move along the first direction X and the second direction Y. The rotating member 7 rotates about an axis extending along a third direction Z. The camera 6 is located on the third direction Z of the rotating member 7. The side of the rotating member 7 facing the camera 6 along the third direction Z is used to fix the hollow circular wafer 8. The inner circle trimming moving assembly 4 is equipped with a first trimming member 9 that can move along the first direction X, the second direction Y and the third direction Z. The first trimming member 9 is used to extend into the center hole of the hollow wafer 8 to trim the inner edge. The outer circle trimming moving assembly 5 is equipped with a second grinding component 10 that can move along the first direction X and the third direction Z. The second grinding component 10 is located on the first direction X of the rotating component 7 and is used to grind the outer edge of the hollow circular wafer 8. The control system is electrically connected to the spindle moving assembly 3, the inner circle trimming moving assembly 4, the outer circle trimming moving assembly 5, the camera 6, and the rotating component 7.

[0022] In this embodiment, the hollow wafer 8 is fixed to the rotating component 7 and rotated by the rotating component 7. The camera 6 detects the center position of the hollow wafer 8, and controls the spindle moving component 3 to drive the rotating component 7 to move so that the visual center position of the camera 6 coincides with the center position of the hollow wafer 8. Then, the inner circle trimming moving component 4 and the outer circle trimming moving component 5 are respectively controlled to drive the first grinding component 9 and the second grinding component 10 to move. The first grinding component 9 extends into the center hole of the hollow wafer 8 to grind the inner edge, and the second grinding component 10 grinds the outer edge of the hollow wafer 8. Therefore, the grinding of the inner and outer edges of the hollow wafer 8 by the first grinding component 9 and the second grinding component 10 is based on the same center as the reference, without the need to transfer the work station for repositioning and clamping, reducing processing errors and improving the consistency of products in the same batch.

[0023] The control system can control the start and stop of the rotating part 7 and its rotation speed. The control system can also control the start and stop of the camera 6 and obtain the visual center position data of the camera 6 and the center position data of the hollow circular wafer 8 to determine whether they overlap.

[0024] Both the first grinding wheel 9 and the second grinding wheel 10 are grinding wheels that rotate about an axis extending in the third direction Z.

[0025] The first grinding component 9 and the second grinding component 10 can operate continuously, but in order to save power and reduce rotation speed, the control system is electrically connected to the drive motors of the first grinding component 9 and the second grinding component 10 to control the start-up, stop and rotation speed of the first grinding component 9 and the second grinding component 10.

[0026] Furthermore, it also includes an HMI system, which is electrically connected to the control system. The HMI system can provide a wealth of parameter setting menus and process formula parameters for various functions, assisting the equipment to operate smoothly and monitoring the operating status of each component in real time and providing feedback on the results.

[0027] In this embodiment, the worktable 1 is further equipped with a thinning moving assembly 11, which is equipped with a thinning component 12 that can move along the second direction Y and the third direction Z. The thinning component 12 is located on the third direction Z of the rotating component 7 and is used to grind the side of the hollow wafer 8 facing the thinning component 12. The control system is electrically connected to the thinning moving assembly 11.

[0028] In this embodiment, a thinning moving component 11 is set to drive the thinning component 12 to move, so as to grind the side of the hollow wafer 8 facing the thinning component 12. The thinning grinding and the inner and outer edge grinding can be based on the same center as the reference, and the three different processes can be combined into one station. This effectively avoids the processing error of the hollow wafer 8 caused by the transfer of each process to the station, and can also shorten the processing time.

[0029] The thinning component 12 is a grinding wheel that rotates on an axis extending in the third direction Z. The control system is electrically connected to the drive motor of the thinning component 12 to control the start, stop and rotation speed of the thinning component 12.

[0030] In this embodiment, the thinning moving component 11 is further mounted on the mounting base 2.

[0031] In this embodiment, the camera 6 is mounted on the mounting base 2 and located on the third direction Z of the rotating member 7. Therefore, the thinning moving component 11 is mounted on the mounting base 2, and the thinning component 12 can also be better mounted on the third direction Z of the rotating member 7, thereby reducing the area occupied by the worktable 1 and setting the positions of each component more compactly.

[0032] In this embodiment, the thinning moving component 11 further includes a thinning Y-axis moving shaft 111 and a thinning Z-axis moving shaft 112. The thinning Y-axis moving shaft 111 is mounted on the mounting base 2, the thinning Z-axis moving shaft 112 is mounted on the thinning Y-axis moving shaft 111 and can move along the second direction Y, and the thinning component 12 is mounted on the thinning Z-axis moving shaft 112 and can move along the third direction Z.

[0033] In this embodiment, by sliding the thinning Z-axis moving shaft 112 along the second direction Y to the thinning X-axis moving shaft 111, the position of the thinning member 12 in the second direction Y can be adjusted, and the thinning member 12 can be moved along the third direction Z to be mounted on the thinning Z-axis moving shaft 112.

[0034] Therefore, the thinning member 12 is first driven to move along the third direction Z until it is higher than the hollow wafer 8 along the third direction Z. Then, the thinning member 12 is driven to move along the second direction Y towards the hollow wafer 8. Finally, the thinning member 12 is driven to move along the third direction Z towards the hollow wafer 8 to adjust the thinning depth of the hollow wafer 8, so as to adapt to the processing of hollow wafers 8 of different thicknesses.

[0035] In this embodiment, the rotating component 7 further includes a rotating shaft 71, a suction cup 72, and a vacuum tube; The rotating shaft 71 is mounted on the spindle moving assembly 3 and is capable of rotating about an axis extending in the third direction Z. The suction cup 72 is coaxially mounted on the side of the rotating shaft 71 facing the camera 6 along the third direction Z. The side of the suction cup 72 facing the camera 6 along the third direction Z is used to adsorb the hollow wafer 8. The vacuum tube passes through the rotating shaft 71 along the third direction Z. One end of the vacuum tube is connected to the suction cup 72, and the other end of the vacuum tube is used to connect to the vacuum machine.

[0036] In this embodiment, the hollow wafer 8 is placed on the side of the suction cup 72 facing the camera 6 along the third direction Z. The vacuum machine is started, and the air in the suction cup 72 is drawn into the vacuum machine through the vacuum tube. The suction cup 72 forms a negative pressure to adsorb and fix the hollow wafer 8.

[0037] The vacuum tube is inserted through the rotating shaft 71, so the rotation of the rotating shaft 71 can synchronously drive the vacuum tube to rotate, which in turn drives the suction cup 72 connected to the vacuum tube to rotate, and drives the hollow wafer 8 adsorbed on the suction cup 72 to rotate.

[0038] Furthermore, a valve is installed between the other end of the vacuum tube and the vacuum machine, and the control system is electrically connected to the valve. In this way, the control system can control the opening and closing of the valve to realize the vacuum machine's suction of the suction cup 72 and stop suction.

[0039] In this embodiment, the spindle moving assembly 3 further includes a fourth X-axis moving axis 31 and a second Y-axis moving axis 32. The fourth X-axis moving axis 31 is mounted on the worktable 1, the second Y-axis moving axis 32 is mounted on the fourth X-axis moving axis 31 and can move along the first direction X, and the rotating member 7 is mounted on the second Y-axis moving axis 32 and can move along the second direction Y.

[0040] In this embodiment, the second Y-axis moving axis 32 is slidably mounted on the fourth X-axis moving axis 31 along the first direction X, which can adjust the position of the rotating member 7 in the first direction X. The rotating member 7 can also be moved along the second direction Y and mounted on the second Y-axis moving axis 32. Therefore, the rotating member 7 can be driven to move along the first direction X and the second direction Y until the center position of the hollow circular wafer 8 fixed on the rotating member 7 is aligned with the visual center position of the camera 6 and then the movement stops.

[0041] In this embodiment, the inner circle trimming moving assembly 4 further includes a first X-axis moving axis 41, a first Y-axis moving axis 42, and a first Z-axis moving axis 43. The first X-axis moving axis 41 is mounted on the worktable 1, the first Y-axis moving axis 42 is mounted on the first X-axis moving axis 41 and can move along the first direction X, the first Z-axis moving axis 43 is mounted on the first Y-axis moving axis 42 and can move along the second direction Y, and the first grinding part 9 is mounted on the first Z-axis moving axis 43 and can move along the third direction Z.

[0042] In this embodiment, the first grinding member 9 can be adjusted in the first X direction by sliding the first Y-axis moving shaft 42 along the first X direction and mounting it on the first X-axis moving shaft 41. The first grinding member 9 can be adjusted in the second Y direction by sliding the first Z-axis moving shaft 43 along the second Y direction and mounting it on the first Y-axis moving shaft 42, and the rotating member 7 can be moved and mounted on the first Z-axis moving shaft 43 along the third Z direction.

[0043] like Figure 1 As shown, the inner circle trimming moving component 4 is located in the second direction Y of the rotating component 7. Therefore, the first trimming component 9 can be driven to move along the first direction X until the first trimming component 9 and the hollow circular wafer 8 are aligned in the second direction Y. Then, the first trimming component 9 is driven to move along the third direction Z to ensure that the first trimming component 9 is higher than the hollow circular wafer 8 in the third direction Z, thus avoiding direct impact on the hollow circular wafer 8 when the first trimming component 9 moves close to the hollow circular wafer 8. Next, the first trimming component 9 is driven to move close to the hollow circular wafer 8 in the second direction Y until the center position of the first trimming component 9 coincides with the visual center position of the camera 6, at which point it stops moving along the second direction Y. Finally, the first trimming component 9 is driven to move close to the hollow circular wafer 8 in the third direction Z until it extends into the central hole of the hollow circular wafer 8 to trim the inner edge.

[0044] In this embodiment, the outer circle trimming moving assembly 5 further includes a second X-axis moving axis 51 and a second Z-axis moving axis 52. The second X-axis moving axis 51 is mounted on the worktable 1, the second Z-axis moving axis 52 is mounted on the second X-axis moving axis 51 and can move along the first direction X, and the second grinding part 10 is mounted on the second Z-axis moving axis 52 and can move along the third direction Z.

[0045] In this embodiment, the second grinding component 10 is slidably mounted on the second X-axis moving axis 51 along the first direction X via the second Z-axis moving axis 52. The position of the second grinding component 10 in the first direction X can be adjusted. The second grinding component 10 can also be moved along the third direction Z and mounted on the second Z-axis moving axis 52. Therefore, the second grinding component 10 can be driven to move along the third direction Z to adjust the grinding position of the hollow circular wafer 8, which can adapt to the processing of hollow circular wafers 8 of different thicknesses. Then, the thinning component 12 can be driven to move along the first direction X to gradually approach the hollow circular wafer 8 to adjust the grinding depth of the hollow circular wafer 8, which can adapt to the processing of hollow circular wafers 8 of different diameters.

[0046] In this embodiment, the outer circle trimming moving component 5 further includes a third X-axis moving axis 53, which is mounted on the second Z-axis moving axis 52 and can move along the third direction Z. The second grinding component 10 is mounted on the third X-axis moving axis 53 and can move along the first direction X.

[0047] In this embodiment, based on the fact that the second grinding component 10 can slide along the first direction X to make coarse adjustments following the second Z-axis moving axis 52, the second grinding component 10 can be slidably mounted on the third X-axis moving axis 53 along the first direction X to achieve fine adjustments, and can be customized for materials with different shapes and edges.

[0048] like Figure 1-3 As shown, this embodiment provides a processing method based on the above-described hollow wafer processing apparatus, including the following steps: S1. Fix the hollow wafer 8 to the rotating component 7, control the rotating component 7 to rotate, and start the camera 6 to detect the center position of the hollow wafer 8. S2. Control the main spindle moving component 3 to drive the rotating component 7 to move, and determine whether the center position of the hollow circular wafer 8 and the visual center position of the camera 6 coincide. If yes, execute step S3; if no, execute step S2 again. S3. Control the inner circle trimming moving component 4 and the outer circle trimming moving component 5 respectively to drive the first trimming component 9 and the second trimming component 10 to move, so that the first trimming component 9 extends into the center hole of the hollow circular wafer 8 to trim the inner edge, and the second trimming component 10 trims the outer edge of the hollow circular wafer 8.

[0049] In this embodiment, a robotic arm is used to grasp the hollow wafer 8 and transport it to the rotating component 7. The rotating component 7 then fixes the hollow wafer 8. Specifically, the hollow wafer 8 is placed on the side of the suction cup 72 facing the camera 6 along the third direction Z. The vacuum machine is started, and the air in the suction cup 72 is drawn into the vacuum machine through the vacuum tube. The suction cup 72 forms a negative pressure to adsorb and fix the hollow wafer 8.

[0050] The control system is electrically connected to the vacuum machine to control its start / stop and suction speed.

[0051] The control system can automatically call the corresponding processing type algorithm according to the material and size of the hollow wafer 8. The control system is electrically connected to the drive motor of each grinding wheel, and can control the start, stop and rotation speed of the grinding wheel. The control system is also electrically connected to each moving component, and can control the distance between each grinding wheel and the hollow wafer 8, and adjust the grinding depth of the hollow wafer 8.

[0052] Furthermore, the following steps are included after step S3: S4. Control the thinning moving component 11 to drive the thinning part 12 to move, so that the thinning part 12 grinds the hollow circular wafer 8 along the third direction Z towards the side of the thinning part 12.

[0053] Furthermore, step S2 specifically involves: controlling the spindle moving assembly 3 to drive the rotating component 7 to move from the standby position, determining whether the center position of the hollow circular wafer 8 coincides with the visual center position of the camera 6; if so, then proceed to step S3; if not, then re-execute step S2. Step S3 specifically involves controlling the inner circle trimming moving component 4 and the outer circle trimming moving component 5 to drive the first trimming component 9 and the second trimming component 10 to move from the standby position, so that the first trimming component 9 extends into the center hole of the hollow circular wafer 8 to trim the inner edge, and the second trimming component 10 trims the outer edge of the hollow circular wafer 8. Step S4 specifically involves controlling the thinning moving component 11 to drive the thinning component 12 to move from the standby position, so that the thinning component 12 grinds the hollow circular wafer 8 along the third direction Z toward the side of the thinning component 12.

[0054] The following steps are included after step S4: S5. Determine whether the inner and outer edges of the hollow circular wafer 8 meet the grinding requirements. If yes, proceed to step S6; otherwise, continue grinding and repeat step S5 after a preset time. S6. Control the rotating component 7 to stop rotating, remove the hollow cylindrical wafer 8 from the rotating component 7, control the spindle moving component 3 to drive the rotating component 7 to the standby position, control the inner circle trimming moving component 4 to drive the first grinding component 9 to the standby position, control the outer circle trimming moving component 5 to drive the second grinding component 10 to the standby position, and control the thinning moving component 11 to drive the thinning component 12 to the standby position.

[0055] In this embodiment, the vacuum machine is turned off, the suction cup 72 is stopped, and the hollow wafer 8 is picked up from the rotating part 7 and transported to the next process by the robotic arm.

[0056] In summary, the embodiments of the present invention provide a hollow wafer processing apparatus and method that can reduce errors in hollow wafer processing and improve the consistency of products in the same batch.

[0057] The above description is only an optional embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A hollow wafer processing apparatus, comprising a first direction, a second direction, and a third direction that intersect each other perpendicularly, characterized in that, The system includes a worktable, which is equipped with a mounting base, a spindle moving assembly, an inner circle trimming moving assembly, an outer circle trimming moving assembly, and a control system. The mounting base is equipped with a camera for detecting the center position of the hollow circular wafer. The main shaft moving assembly is equipped with a rotating member that can move along the first direction and the second direction. The rotating member rotates about an axis extending along the third direction. The camera is located on the third direction of the rotating member. The side of the rotating member facing the camera along the third direction is used to fix the hollow circular wafer. The inner circle trimming moving assembly is equipped with a first grinding member that can move along the first direction, the second direction and the third direction. The first grinding member is used to extend into the central hole of the hollow circular wafer to grind the inner edge. The outer circle trimming moving assembly is equipped with a second grinding member that can move along the first direction and the third direction. The second grinding member is located in the first direction of the rotating member and is used to grind the outer edge of the hollow circular wafer. The control system is electrically connected to the spindle moving assembly, the inner circle trimming moving assembly, the outer circle trimming moving assembly, the camera, and the rotating component.

2. The hollow wafer processing apparatus according to claim 1, characterized in that, The worktable is also equipped with a thinning moving assembly, which is equipped with a thinning component that can move along the second direction and the third direction. The thinning component is located in the third direction of the rotating component and is used to grind the side of the hollow wafer facing the thinning component. The control system is electrically connected to the thinning moving assembly.

3. The hollow wafer processing apparatus according to claim 2, characterized in that, The thinning moving component is mounted on the mounting base.

4. The hollow wafer processing apparatus according to claim 3, characterized in that, The thinning moving assembly includes a thinning Y-axis moving axis and a thinning Z-axis moving axis. The thinning Y-axis moving axis is mounted on the mounting base. The thinning Z-axis moving axis is mounted on the thinning Y-axis moving axis and is movable along the second direction. The thinning element is mounted on the thinning Z-axis moving axis and is movable along the third direction.

5. The hollow wafer processing apparatus according to claim 1, characterized in that, The rotating component includes: A rotating shaft, which is mounted on the main shaft moving assembly and is rotatable about an axis extending in the third direction; A suction cup, coaxially mounted on the side of the rotation axis facing the camera along a third direction, the suction cup being used to adsorb the hollow cylindrical wafer; and A vacuum tube is inserted through the rotating shaft along the third direction. One end of the vacuum tube is connected to the suction cup, and the other end of the vacuum tube is used to connect to a vacuum machine.

6. The hollow wafer processing apparatus according to claim 1, characterized in that, The spindle moving assembly includes a fourth X-axis moving axis and a second Y-axis moving axis. The fourth X-axis moving axis is mounted on the worktable, and the second Y-axis moving axis is mounted on the fourth X-axis moving axis and can move along the first direction. The rotating component is mounted on the second Y-axis moving axis and can move along the second direction.

7. The hollow wafer processing apparatus according to claim 1, characterized in that, The inner circle trimming moving assembly includes a first X-axis moving axis, a first Y-axis moving axis, and a first Z-axis moving axis. The first X-axis moving axis is mounted on the worktable. The first Y-axis moving axis is mounted on the first X-axis moving axis and can move along the first direction. The first Z-axis moving axis is mounted on the first Y-axis moving axis and can move along the second direction. The first grinding part is mounted on the first Z-axis moving axis and can move along the third direction.

8. The hollow wafer processing apparatus according to claim 1, characterized in that, The outer circle trimming moving assembly includes a second X-axis moving axis and a second Z-axis moving axis. The second X-axis moving axis is mounted on the worktable, and the second Z-axis moving axis is mounted on the second X-axis moving axis and can move along the first direction. The second grinding part is mounted on the second Z-axis moving axis and can move along the third direction.

9. The hollow wafer processing apparatus according to claim 8, characterized in that, The outer circle trimming moving assembly also includes a third X-axis moving axis, which is mounted on the second Z-axis moving axis and can move along the third direction. The second grinding part is mounted on the third X-axis moving axis and can move along the first direction.

10. A processing method based on the hollow wafer processing apparatus according to any one of claims 1-9, characterized in that, Includes the following steps: S1. Fix the hollow circular wafer to the rotating component, control the rotation of the rotating component, and start the camera to detect the center position of the hollow circular wafer. S2. Control the main shaft moving component to drive the rotating part to move, and determine whether the center position of the hollow circular wafer and the visual center position of the camera coincide. If yes, execute step S3; if no, execute step S2 again. S3. Control the inner circle trimming moving component and the outer circle trimming moving component respectively to drive the first grinding component and the second grinding component to move, so that the first grinding component extends into the center hole of the hollow circular wafer to grind the inner edge, and the second grinding component grinds the outer edge of the hollow circular wafer.

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