Wafer buffer system for polishing machine

Abstract

The application discloses a wafer buffer system for a polishing machine, which comprises a rack arranged near one side of a loading table of the polishing machine, and a wafer feeding station is arranged above the loading table; a buffer mechanism, which comprises a buffer groove and a groove lifting assembly connected with the buffer groove, and the buffer groove is adapted to move up and down under the driving of the groove lifting assembly; and a transmission mechanism arranged above the buffer mechanism, which comprises a horizontal movement module, a rotating module, a vertical movement module, a swing module and a clamping module connected with each other. The horizontal movement module and the rotating module are cooperatively adapted to make the movement track of the wafer between the wafer feeding station and above the buffer groove be a straight line perpendicular to the horizontal movement module. The wafer buffer system for the polishing machine disclosed by the embodiment of the application can realize the functions of wafer automatic picking, wafer automatic placing, wafer automatic feeding and wafer storage.

Description

Technical Field

[0001] This invention relates to the field of wafer polishing technology, and in particular to a wafer buffer system for a polishing machine. Background Technology

[0002] Chemical mechanical polishing (CMP) is a core process in semiconductor manufacturing that achieves atomic-level planarization of wafer surfaces. After polishing, a large number of impurities adhere to the wafer surface. Therefore, in the complete wafer processing workflow, CMP equipment is equipped with a cleaning system to clean the wafers and ensure cleanliness. However, in some small-batch or flexible production scenarios, polished wafers cannot immediately enter the cleaning system. This necessitates buffering the polished wafers. Currently, mainstream CMP equipment lacks a corresponding buffering system, resulting in a lack of flexibility and compatibility in wafer processing. Summary of the Invention

[0003] To address at least one technical problem in the prior art, embodiments of the present invention provide a wafer cache system for a polishing machine. The technical solution is as follows: A wafer cache system for a polishing machine includes: The frame is located on one side of the loading table near the polishing machine table, and the loading table has a feeding station above it; A buffer mechanism, comprising: a buffer slot and a slot lifting assembly, wherein the slot lifting assembly is connected to the buffer slot, and the buffer slot is adapted to move up and down under the drive of the slot lifting assembly; A transmission mechanism is disposed above the buffer mechanism, and the transmission mechanism includes interconnected components: a horizontal movement module, a rotation module, a vertical movement module, a swing module, and a clamping module; The transverse module is fixed to the frame, and the transverse module and the rotary module cooperate to ensure that the movement trajectory of the wafer from above the buffer slot to the wafer delivery station is a straight line perpendicular to the transverse module. The rotation angle of the rotary module is... The distance the wafer moves vertically relative to the transverse module and the distance from the wafer to the rotation center of the rotating module ,satisfy: .

[0004] Furthermore, the lateral movement module includes: A crossbeam is fixed on the frame. A transverse guide rail and a transverse transmission assembly are provided on the crossbeam. A transverse guide rail connecting block is slidably connected to the transverse guide rail. The transverse transmission assembly has a transverse drive motor, which is located at one end of the crossbeam. A transverse drag chain is provided along the transverse drag chain fixing plate. The transverse drag chain is connected to the transverse guide rail connecting block. The transverse drag chain fixing plate is fixedly provided on the frame. The transverse drag chain fixing plate and the crossbeam are respectively provided opposite to each other on the frame along the first direction to achieve the overall center of gravity balance of the transmission mechanism along the first direction.

[0005] Furthermore, the longitudinal translation module includes: A longitudinal beam, on which a longitudinal guide rail is fixedly mounted, the longitudinal beam is connected to a ball screw via a ball screw fixing seat, and the longitudinal guide rail is slidably connected to a longitudinal guide rail connecting block; A longitudinal drag chain is arranged along the longitudinal beam and connected to the longitudinal guide rail connecting block. A gas pipeline is arranged along the longitudinal beam and connected to the clamping module. The gas pipeline and the longitudinal drag chain are arranged on opposite sides of the longitudinal beam along the first direction to achieve the center of gravity balance of the longitudinal beam along the first direction. The transverse drag chain, the longitudinal drag chain, and the gas pipeline are all arranged at the end of the transverse beam away from the transverse drive motor to achieve the center of gravity balance of the entire transmission mechanism along the second direction, which is perpendicular to the first direction.

[0006] Furthermore, on the crossbeam, transverse limiting members are provided near both ends of the transverse guide rail, a transverse limiting sensor is provided between the two transverse limiting members, and a transverse limiting brush is provided on the transverse guide rail connecting block. The transverse limiting sensor is adapted to sense the movement of the transverse guide rail connecting block through the transverse limiting brush. The transverse limiting members and the transverse limiting brush constitute a dual limiting structure of the transverse module.

[0007] Furthermore, the transverse transmission assembly also includes: a driving wheel and a driven wheel; the transverse drive motor is connected to the driving wheel; the driving wheel and the driven wheel are connected by a synchronous belt; the transverse guide rail connecting block is connected to the synchronous belt by a pressure plate; a driven wheel adjusting component and a driven wheel fixing component are provided on the crossbeam; the driven wheel is connected to the crossbeam through the driven wheel adjusting component; and the driven wheel fixing component abuts against the side of the driven wheel adjusting component by a screw.

[0008] Further, the rotating module includes: A rotary table is connected to the lower part of the transverse guide rail connecting block, and a rotation limit sensor is provided on the rotary table; A connecting seat is provided on the upper side of the longitudinal beam (331) and on the lower side of the rotating seat; A rotating gear is disposed on the connecting seat, and a rotating limiting disk is disposed on the rotating gear. The rotating limiting disk is disposed along the circumferential portion of the rotating gear, and the rotating limiting sensor is adapted to sense the rotation angle of the rotating gear through the rotating limiting disk. A rotating worm gear is disposed within the rotating seat and meshes with a rotating gear, the rotating gear being adapted to rotate under the drive of the rotating worm gear.

[0009] Furthermore, a longitudinal movement limiting component and a longitudinal movement limiting sensor are provided on the longitudinal movement guide rail, and a longitudinal movement limiting brush is provided on the longitudinal movement guide rail connecting block. The longitudinal movement guide rail connecting block is sleeved on the ball screw and meshes with the ball screw. The longitudinal movement guide rail connecting block moves along the longitudinal movement guide rail under the drive of the ball screw. The longitudinal movement limiting component and the longitudinal movement limiting brush constitute a dual limiting structure of the longitudinal movement module.

[0010] Furthermore, the swing module includes: Guide sleeve, which is connected to the longitudinal guide rail connecting block; A swing worm gear, wherein the swing worm gear passes through the guide sleeve; A swaying gear is disposed on the lower side of the swaying worm and meshes with the swaying worm. The swaying gear is adapted to rotate under the drive of the swaying worm. A gear fixing seat is provided on the lower side of the guide sleeve. The gear fixing seat has a receiving space. The swing gear is disposed in the receiving space of the gear fixing seat. A swing limit sensor is disposed in the receiving space of the gear fixing seat. A swing limit brush is disposed on the swing gear.

[0011] Furthermore, fixed bearings are provided on both sides of the swing gear, and the fixed bearings are partially embedded in the gear fixing seat. A gear fixing plate is provided on the fixed bearings near the clamping module, and the clamping module is connected to the gear fixing plate.

[0012] Furthermore, a guide block is provided in the receiving space of the gear fixing seat, the guide block has a snap-fit ​​groove, and the swing worm is connected to the snap-fit ​​groove in the receiving space of the gear fixing seat.

[0013] Furthermore, the clamping module includes: A clamping connecting block is disposed on one side of the swing gear and connected to the swing gear via a rotating shaft; A suction cup, which is connected to the clamping connecting block; A first air passage connector is disposed on the clamping connecting block and is connected to the suction cup. The second air connector is located on the longitudinal beam and is connected to the first air connector via the gas pipeline. The gas pipeline and the longitudinal drag chain are located on opposite sides of the longitudinal beam. An airflow sensor is mounted on the longitudinal beam and is connected to the second air passage connector.

[0014] Furthermore, a basket support is provided within the buffer slot, and the basket support is fixed to the frame. The buffer slot is adapted to move up and down relative to the basket support under the drive of the slot lifting assembly. The horizontal movement module, the vertical movement module, and the swing module cooperate to perform wafer clamping or placement actions after the buffer slot descends to its position. The swing angle of the swing module... The moving distance of the longitudinal translation module The moving distance of the lateral module ,satisfy: .

[0015] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: The wafer caching system for polishing equipment disclosed in this invention is configured in conjunction with the polishing equipment and includes a transmission mechanism and a caching mechanism. It can realize the functions of automatic wafer picking, placing, unloading and storage, and is compatible with wafers of different sizes. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the assembly structure of the wafer cache system and the polishing machine provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a wafer cache system for a polishing machine provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the wafer movement path provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of the cache module structure provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the transverse movement module structure provided in an embodiment of the present invention; Figure 6This is a schematic diagram of the structure of the rotation module, longitudinal translation module, and swing module provided in the embodiments of the present invention; Figure 7 This is a top view of the rotating module provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the transverse moving module, the longitudinal moving module, and the clamping module provided in the embodiments of the present invention; Figure 9 This is a schematic diagram of the clamping module provided in an embodiment of the present invention.

[0018] In the picture: Polishing machine 10: loading stage 11, wafer basket 13; 100 racks; Cache mechanism 200: cache slot 210, slot lifting assembly 220, basket bracket 230; Transmission mechanism 300: Horizontal movement module 310: crossbeam 311, horizontal movement guide rail 312, horizontal movement transmission assembly 313, horizontal movement guide rail connecting block 314, horizontal movement cable chain 315, fine adjustment plate 316, horizontal movement limit component 317, horizontal movement limit sensor 318, horizontal movement limit brush 319, horizontal movement drive motor 3131, drive wheel 3132, driven wheel 3133, synchronous belt 3134, pressure plate 3135, driven wheel adjusting component 3136, driven wheel fixing component 3137, horizontal movement cable chain fixing plate 3151, horizontal movement cable chain connecting plate 3152; Rotary module 320: Rotary base 321, connecting base 322, rotary gear 323, rotary worm gear 324, rotary limit sensor 325, rotary limit disk 326, rotary drive motor 327, rotary drive motor positioning pin 3271, first coupling 3272; Longitudinal Module 330: Longitudinal beam 331, longitudinal guide rail 332, ball screw 333, longitudinal guide rail connecting block 334, longitudinal drag chain 335, ball screw fixing seat 336, longitudinal limit component 337, longitudinal limit sensor 338, longitudinal limit brush 339, longitudinal drive motor 3310, longitudinal drive motor positioning pin 3311, second coupling 3312, longitudinal drag chain connecting plate 3351; Swing module 340: guide sleeve 341, swing worm gear 342, swing gear 343, gear fixing seat 344, swing limit sensor 345, swing limit brush 346, guide block 347, gear fixing plate 348, swing drive motor 349, guide sleeve positioning pin 3411, snap ring 3421, gear fixing seat pressure plate 3441, third coupling 3491; Clamping module 350: clamping connecting block 351, suction cup 352, first air path connector 353, second air path connector 354, gas pipeline 355, airflow sensor 356. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0020] It should be noted that the terms "first" and "second" used in the embodiments of the present invention are used to distinguish between two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of the invention. Subsequent embodiments will not explain this in detail.

[0021] like Figure 1 and Figure 2 As shown, a wafer caching system for a polishing machine 10 includes a rack 100, a caching mechanism 200, and a transfer mechanism 300. The rack 100 is disposed on the side near the loading stage 11 of the polishing machine 10. Both the transfer mechanism 300 and the caching mechanism 200 are connected to the rack 100, and the transfer mechanism 300 is disposed above the caching mechanism 200.

[0022] The buffer mechanism 200 includes a buffer slot 210 and a slot lifting assembly 220. The slot lifting assembly 220 is disposed below the buffer slot 210 and connected to the buffer slot 210. The buffer slot 210 is adapted to move up and down under the drive of the slot lifting assembly 220.

[0023] As described above, the buffer mechanism 200 is used to store wafers. A buffer solution is circulated in the buffer tank 210, and the wafers are immersed in the buffer solution. Since the polishing machine 10 is installed together with the downstream cleaning equipment in the mass production process, the wafers directly enter the cleaning equipment after polishing to remove impurities caused during the polishing process. Therefore, the polishing machine 10 typically does not have a matching wafer buffer mechanism 200. This embodiment of the invention provides a matching wafer buffer mechanism 200 on the polishing machine 10, which allows for flexible wafer handling by immersing the wafers in the buffer solution, preventing them from being exposed to air and contaminated. This is especially beneficial for small-batch wafer processing such as testing and pilot production, where the wafers can be temporarily stored using the buffer mechanism 200.

[0024] The transmission mechanism 300 includes: a transverse module 310, a rotary module 320, a longitudinal module 330, a swing module 340, and a clamping module 350. The transverse module 310 is connected to the frame 100, the rotary module 320 is connected to the transverse module 310, the longitudinal module 330 is connected to the rotary module 320, the swing module 340 is connected to the longitudinal module 330, and the clamping module 350 is connected to the swing module 340.

[0025] Among them, such as Figure 3 As shown, the transverse module 310 and the rotary module 320 cooperate to ensure that the movement trajectory of the wafer from above the cache slot 210 to the wafer delivery station is a straight line perpendicular to the transverse module 310, and the rotation angle of the rotary module 320 is... The distance the wafer moves vertically relative to the transverse translation module 310 and the distance from the wafer to the rotation center of the rotating module 320 ,satisfy: .

[0026] As described above, the clamping module 350 is used to clamp the wafer, the oscillating module 340 is used to drive the clamping module 350 to oscillate around the oscillation center of the oscillating module 340, the longitudinal movement module 330 is used to drive the oscillating module 340 to move up and down in the longitudinal movement plane, the rotation module 320 is used to drive the longitudinal movement module 330 to rotate around the rotation center of the rotation module 320, and the transverse movement module 310 is used to drive the rotation module 320 to move linearly in the transverse movement plane. The oscillation plane of the oscillating module 340 is perpendicular to the rotation plane of the rotation module 320, and the transverse movement plane is perpendicular to the longitudinal movement plane. The movement trajectory of the wafer is perpendicular to the movement trajectory of the rotation module driven by the transverse movement module in the transverse movement plane.

[0027] As described above, through the cooperation between the transverse module 310 and the rotary module 320, the wafers on the transfer robot are transported to the main unit carrier stage via a specific linear motion trajectory, which greatly reduces the opening size of the wafer inlet at the main unit stage and further reduces the contamination received inside the main unit stage during loading and unloading.

[0028] In one embodiment, such as Figure 4 As shown, the cache mechanism 200 also includes a basket support 230, which is disposed within the cache slot 210 and fixed to the frame 100. The cache slot 210 is adapted to move up and down relative to the basket support 230 under the drive of the slot lifting assembly 220. The transverse module 310, the longitudinal module 330, and the swing module 340 cooperate to perform wafer clamping or placement actions after the cache slot 210 descends to its position. The swing angle of the swing module 340... The moving distance of the longitudinal translation module 330 The moving distance of the lateral module 310 ,satisfy: .

[0029] As described above, through the coordinated operation of the horizontal moving module 310, the vertical moving module 330, and the swinging module 340, the clamping module can extend into the basket support 230, and the swinging angle is determined according to the moving distance of the vertical moving module 330 and the horizontal moving module 310, so that the clamping module can be closely attached to the wafer.

[0030] As a case, such as Figure 4 As shown, the wafers are placed in the wafer basket 13, and the entire basket 13 is placed on the basket support 230. The basket support 230 is fixed relative to the frame 100. The buffer tank 210 is raised under the drive of the tank lifting assembly 220, and the basket support 230 is placed into the buffer solution in the buffer tank 210, thereby immersing the wafers in the wafer basket 13 into the buffer solution. When polishing is required, the transfer mechanism 300 removes the wafers from the wafer basket 13 and transfers them to the polishing machine 10 for polishing. After polishing, the transfer mechanism 300 transfers the polished wafers back to the wafer basket 13. When the entire basket of wafers has been polished, the buffer tank 210 is lowered under the drive of the tank lifting assembly 220, and the basket support 230 is exposed from the buffer tank 210. The wafers are then removed from the buffer tank 210 by the operator.

[0031] In one embodiment, such as Figure 5 As shown, the transverse module 310 includes: a crossbeam 311, a transverse guide rail 312, a transverse transmission assembly 313, a transverse guide rail connecting block 314, and a transverse cable chain 315. The crossbeam 311 is connected to the frame 100. The transverse guide rail 312 and the transverse transmission assembly 313 are both mounted on the crossbeam 311. The transverse guide rail connecting block 314 is slidably connected to the transverse guide rail 312 and is also connected to the transverse transmission assembly 313. The transverse cable chain 315 is disposed along the crossbeam 311 and is connected to the transverse guide rail connecting block 314. The transverse guide rail connecting block 314 is a moving component of the transverse module 310, and the transverse transmission assembly 313 drives the transverse guide rail connecting block 314 to slide along the transverse guide rail 312. The crossbeam 311 is used to fix the transverse guide rail 312 and the transverse transmission assembly 313, so that the transverse guide rail connecting block 314 can move stably.

[0032] For example, such as Figure 8As shown, multiple fine-tuning plates 316 are provided on the connection surface between the crossbeam 311 and the frame 100. By adjusting the screws on the top of the fine-tuning plates 316, the screws are slightly moved relative to the fine-tuning plates 316, and the screw heads apply a force perpendicular to the top surface of the crossbeam 311. This allows the fine-tuning plates 316 at the bottom of the crossbeam 311 to adjust the horizontal level of the overall robot, and the fine-tuning plates 316 on the side of the crossbeam 311 to adjust the side tilt, thereby improving the compatibility and accuracy of the robot's precise positioning.

[0033] Furthermore, a transverse drag chain fixing plate 3151 is fixedly installed on the rack 100, and a transverse drag chain 315 is installed along the transverse drag chain fixing plate 3151. The transverse drag chain 315 is connected to the transverse guide rail connecting block 314. The upper part of the rack 100 has two parallel and oppositely arranged support beams. The transverse drag chain fixing plate 3151 and the crossbeam 311 are respectively installed on the two support beams. That is, the transverse drag chain fixing plate 3151 and the crossbeam 311 are oppositely arranged along the first direction (X direction in the figure), so that the wafer cache system used for polishing machine is balanced along the center of gravity of the whole along the first direction.

[0034] As described above, the transverse drag chain fixing plate 3151 and the crossbeam 311 are arranged opposite to each other on the two support beams of the rack 100 along the first direction, which can maintain the overall structural center of gravity balance of the rack 100 and the transmission mechanism 300 and prevent the entire wafer cache system from overturning.

[0035] For example, such as Figure 8 As shown, a transverse drag chain fixing plate 3151 is fixed on the frame 100, a transverse drag chain connecting plate 3152 is provided on the transverse guide rail connecting block 314, and the transverse drag chain 315 is connected to the transverse drag chain fixing plate 3151 and the transverse drag chain connecting plate 3152, and plays a guiding role in the air and electrical circuits for transverse movement between the two.

[0036] In one embodiment, the lateral transmission assembly 313 includes: a lateral drive motor 3131, a drive pulley 3132, a driven pulley 3133, and a timing belt 3134. The lateral drive motor 3131 is connected to the drive pulley 3132, and the timing belt 3134 is connected to both the drive pulley 3132 and the driven pulley 3133. The drive pulley 3132 is connected to the lateral drive motor 3131, which drives the drive pulley 3132 to rotate. The drive pulley 3132 drives the driven pulley 3133 to rotate via the timing belt 3134. The drive pulley 3132 and the driven pulley 3133 ensure the timing belt 3134 is tensioned. The timing belt 3134 is connected to a lateral guide rail connecting block 314, which moves as the timing belt 3134 moves. In one scenario, a pressure plate 3135 is provided on the transverse guide rail connecting block 314, and the pressure plate 3135 engages with the timing belt 3134, thereby fixing the transverse guide rail connecting block 314 onto the timing belt 3134.

[0037] In one embodiment, such as Figure 8 As shown, a driven wheel adjusting member 3136 and a driven wheel fixing member 3137 are provided on the crossbeam 311. The driven wheel 3133 is connected to the crossbeam 311 through the driven wheel adjusting member 3136, and the driven wheel fixing member 3137 abuts against the side of the driven wheel adjusting member 3136 through a screw.

[0038] As described above, by adjusting the screw on the driven wheel fixing component 3137 to press against the driven wheel 3133 adjusting block, the center distance between the driving wheel 3132 and the driven wheel 3133 can be relatively increased or decreased. This allows the synchronous belt 3134 on the driving and driven wheels 3133 to be relatively straightened and tightened / loosened, thereby achieving tension adjustment of the synchronous belt 3134 of the entire transverse transmission assembly 313. This reduces the risk of inaccurate transmission caused by tooth skipping due to excessive looseness of the synchronous belt 3134 during installation, and the risk of deformation or even breakage of the fixed shaft of the synchronous belt 3134 pulley due to excessive tightness and extra eccentric load. This improves the transmission accuracy, overall service life, and operational stability.

[0039] In one embodiment, lateral movement limiting members 317 are provided at both ends of the lateral movement guide rail 312, and a lateral movement limiting sensor 318 is provided between the lateral movement limiting members 317. A lateral movement limiting brush 319 is provided on the lateral movement guide rail connecting block 314. The lateral movement limiting sensor 318 is adapted to limit the movement of the lateral movement guide rail connecting block 314 by sensing the lateral movement limiting brush 319. As described above, in this embodiment of the invention, the transverse module 310 has a transverse limiting component, which includes a transverse limiting member 317 disposed on the transverse guide rail 312 and a transverse limiting brush 319 disposed on the transverse guide rail connecting block 314. The transverse limiting member 317 achieves hard limiting of the transverse guide rail connecting block 314, and the transverse limiting sensor 318 and the transverse limiting brush 319 cooperate to achieve soft limiting of the transverse guide rail connecting block 314, thereby ensuring that the clamping module 350 can perform arbitrary transverse movement within the specified stroke without the risk of exceeding the stroke.

[0040] In one embodiment, such as Figure 6 and Figure 7 As shown, the rotating module 320 includes: a rotating base 321, a connecting base 322, a rotating gear 323, and a rotating worm gear 324. The rotating base 321 is located below the transverse guide rail connecting block 314. The connecting base 322 is connected to the rotating base 321. The rotating gear 323 is mounted on the connecting base 322, and the rotating worm gear 324 is located inside the rotating base 321, and the rotating worm gear 324 meshes with the rotating gear 323, so that the rotating gear 323 is adapted to rotate under the drive of the rotating worm gear 324.

[0041] As described above, the rotating worm gear 324 is connected to a motor, which drives the rotating worm gear 324 to rotate. The rotating worm gear 324 drives the rotating gear 323 to rotate, which in turn drives the longitudinal movement module 330 connected to the rotating module 320. The rotary base 321 is connected to the transverse guide rail connecting block 314, so that the entire rotating module 320 slides along the transverse guide rail 312 with the transverse guide rail connecting block 314.

[0042] Furthermore, a rotation limit sensor 325 is provided on the rotary base 321, and a rotation limit disk 326 is provided on the rotating gear 323. The rotation limit disk 326 is arranged along the circumferential portion of the rotating gear 323 and rotates with the rotating gear 323. When the rotation limit disk 326 passes the rotation limit sensor 325, the rotation limit sensor 325 can sense the movement of the rotating gear 323 through the rotation limit disk 326. The rotation limit sensor 325 is adapted to sense the rotation angle of the rotating gear 323 through the rotation limit disk 326.

[0043] As described above, in this embodiment of the invention, the rotating module 320 has a rotation limiting component, which includes a rotation limiting sensor 325 disposed on the rotary base 321 and a rotation limiting disk 326 disposed on the rotating gear 323. The rotation limiting sensor 325 and the rotation limiting disk 326 cooperate to achieve soft limiting of the rotating gear 323. The rotation limiting disk 326 can be an arc-shaped structure. When the rotating gear 323 drives the rotation limiting disk 326 past the rotation limiting sensor 325, the rotation limiting sensor 325 can control the rotation range of the rotating gear 323 by sensing the rotation limiting disk 326.

[0044] Exemplarily, a rotary base 321 is installed below the transverse guide rail connecting block 314, a rotating gear 323 is mounted above the connecting base 322, and a bearing is sandwiched between the two. A rotating limit disk 326 is mounted on the rotating gear 323 and rotates together. A bearing fixing seat is installed below the rotary base 321, and a bearing is sandwiched between the two. A rotary drive motor 327 is mounted on the side of the rotary base 321, and a rotary drive motor positioning pin 3271 is installed between the two. A rotating worm gear 324 is installed inside the rotary base 321, and a bearing is mounted on each side. The bearing washer on the right side is fixed to the bearing with bolts to ensure the relative position stability of the rotating worm gear 324. A bushing is mounted on the left side, and a first coupling 3272 is mounted on it. The rotational movement of the clamping module 350 is achieved through the cooperative movement between the rotating worm gear 324 and the rotating gear 323, and the limit stroke constraint of the clamping module 350 for the rotational movement is achieved through the relative movement between the sensor and the rotating limit disk 326.

[0045] In one embodiment, such as Figure 6 and Figure 8As shown, the longitudinal movement module 330 includes: a longitudinal beam 331, a longitudinal movement guide rail 332, a ball screw 333, a longitudinal movement guide rail connecting block 334, and a longitudinal movement cable chain 335. The longitudinal beam 331 is connected to the connecting seat 322 of the rotating module 320. The connecting seat 322 rotates with the rotating gear 323, thereby driving the longitudinal beam 331 to rotate. The longitudinal movement guide rail 332 is mounted on the longitudinal beam 331, and a ball screw fixing seat 336 is mounted on the longitudinal beam 331, with the ball screw fixing seat sleeved on the ball screw 333. The longitudinal movement guide rail connecting block 334 is slidably connected to the longitudinal movement guide rail 332, and is sleeved on and meshes with the ball screw 333. The ball screw 333 is connected to the longitudinal drive motor 3310, which drives the ball screw 333 to rotate. The ball screw 333 then drives the longitudinal guide rail connecting block 334 to slide along the longitudinal guide rail 332. The longitudinal drag chain 335 is set along the longitudinal beam 331 and is connected to the longitudinal guide rail connecting block 334.

[0046] A longitudinal drag chain 335 is arranged along the longitudinal beam 331 and is connected to the longitudinal guide rail connecting block 334. A gas pipeline 355 is arranged along the longitudinal beam 331 and is connected to the clamping module 350. The gas pipeline 355 and the longitudinal drag chain 335 are arranged on opposite sides of the longitudinal beam 331 along the first direction (X direction in the figure) to achieve the center of gravity balance of the longitudinal beam 331 along the first direction. A transverse drag chain 315, a longitudinal drag chain 335, and a gas pipeline 355 are all arranged on the transverse beam 311 at one end away from the transverse drive motor 3131 to achieve the center of gravity balance of the entire transmission mechanism 300 along the second direction (Y direction in the figure). The second direction is perpendicular to the first direction.

[0047] Furthermore, longitudinal movement limiting members 337 are provided on the longitudinal movement guide rail 332 along the vertical direction, longitudinal movement limiting sensors 338 are provided between the longitudinal movement limiting members 337, and longitudinal movement limiting brushes 339 are provided on the longitudinal movement guide rail connecting block 334. As described above, in this embodiment of the invention, the longitudinal movement module 330 has a longitudinal movement limiting assembly, which includes longitudinal movement limiting members 337 provided on the longitudinal movement guide rail 332, longitudinal movement limiting sensors 338 provided on the longitudinal movement guide rail 332, and longitudinal movement limiting brushes 339 provided on the longitudinal movement guide rail connecting block 334. The longitudinal movement limiting members 337 achieve hard limiting of the longitudinal movement guide rail connecting block 334, and the cooperation of the longitudinal movement limiting sensors 338 and the longitudinal movement limiting brushes 339 achieves soft limiting of the longitudinal movement guide rail connecting block 334.

[0048] For example, the longitudinal guide rail 332 is mounted on the longitudinal beam 331, and longitudinal limiters 337 and longitudinal limit sensors 338 are fixed on its upper and lower sides. The longitudinal guide rail connecting block 334 is fixed on the longitudinal guide rail 332. The longitudinal guide rail connecting block 334 is equipped with a longitudinal limit brush 339. The ball screw 333 passes through the longitudinal guide rail connecting block 334. The ball screw fixing seat 336 passes through the ball screw 333 and is mounted on the longitudinal beam 331. The longitudinal drive motor is mounted on the connecting seat 322, and a longitudinal drive motor positioning pin 3311 is installed between the two. After the fixing seat and the connecting seat 322 are connected and fixed, the ball screw 333 and the longitudinal drive motor 3310 are locked by the second coupling 3312 to ensure the transmission action and consistency, thereby realizing the lifting movement of the clamping module 350.

[0049] In one embodiment, such as Figure 6 As shown, the swing module 340 includes: a guide sleeve 341, a swing worm 342, a swing gear 343, and a gear fixing seat 344. The guide sleeve 341 is connected to the longitudinal guide rail connecting block 334, which drives the swing module 340 to move up and down along the longitudinal guide rail 332. The swing worm 342 is disposed in the guide sleeve 341, and the swing gear 343 meshes with the swing worm 342. The swing gear 343 is disposed on the lower side of the swing worm 342 and is adapted to rotate under the drive of the swing worm 342. The gear fixing seat 344 is disposed on the lower side of the guide sleeve 341 and has a receiving space. The swing gear 343 is disposed in the receiving space of the gear fixing seat 344.

[0050] As described above, the oscillating worm gear 342 is connected to the motor, which drives the oscillating worm gear 342 to rotate. The oscillating worm gear 342 drives the oscillating gear 343 to rotate. The oscillating gear 343 is connected to the clamping module 350. The oscillating module 340 drives the clamping assembly to rotate around the center of the oscillating gear 343 through the oscillating gear 343.

[0051] Furthermore, a swing limit sensor 345 is provided in the gear fixing seat 344, and a swing limit brush 346 is provided on the swing gear 343. The swing limit brush 346 rotates together with the swing gear 343, and the swing limit sensor 345 senses the movement of the swing gear 343 through the swing limit brush 346.

[0052] In one embodiment, a guide block 347 is provided in the receiving space of the gear fixing seat 344, and the oscillating worm 342 is connected to the guide block 347 at the end of the receiving space. The guide block 347 has a snap-fit ​​groove, and the oscillating worm 342 is disposed in the snap-fit ​​groove at the end of the receiving space. As described above, the connection between the guide block 347 and the oscillating worm 342 helps to maintain the stability of the movement of the oscillating worm 342.

[0053] For example, a worm gear sleeve is fitted in the middle of the oscillating worm 342, and one or two bearings are installed on each side of the oscillating worm 342 along the vertical direction. The bearings are pressed onto the oscillating worm 342 by bearing nuts. A third coupling 3491 is locked at the head of the oscillating worm 342, and a guide sleeve 341 clamps the bearings and locks them onto the guide rail connecting block. A guide sleeve positioning pin 3411 is installed between the two. The output shaft of the oscillating drive motor 349 passes through the third coupling 3491 and is fixed on the longitudinal guide rail connecting block 334. The motor and the oscillating worm 342 are locked by the third coupling 3491 to ensure the operation and consistency of the transmission. An oscillating limit sensor 345 is installed inside the gear fixing seat 344. A bearing is installed on each side of the oscillating gear 343 and passes into the gear fixing seat 344 for axial fixation. A gear fixing plate 348 presses on the bearings and is fixed on the gear fixing seat 344. A sealing ring is installed between the gear fixing plate 348 and the gear fixing seat 344. The oscillating worm gear 342 is inserted into the gear fixing seat 344 and fixed at the connection point using the gear fixing seat pressure plate 3441. A bearing is placed at the tail end and fixed using a snap ring 3421. Finally, the guide block 347 passes through the bearing and is fixed to the gear fixing seat 344, with a sealing ring between them. The oscillating motion of the clamping module 350 is achieved through the coordinated movement between the oscillating worm gear 342 and the oscillating gear 343. The limit stroke constraint of the clamping module 350 for the oscillating motion is achieved through the relative movement between the soft limit sensor and the welded brush inside the oscillating gear 343.

[0054] In one embodiment, such as Figure 8As shown, the clamping module 350 includes: a clamping connecting block 351, a suction cup 352, a first air connector 353, a second air connector 354, and an airflow sensor 356. The clamping connecting block 351 is mounted on one side of and connected to the swing gear 343 via a rotating shaft. The axis of the clamping module 350 is not collinear with the axis of the swing module 340, preventing the swing module 340 from contacting the wafer during wafer clamping. The swing gear 343 drives the clamping connecting block 351 to rotate, thereby rotating the clamping module 350. The suction cup 352 is connected to the clamping connecting block 351 and is used for vacuum adsorption of the wafer. The first air connector 353 is mounted on the clamping connecting block 351 and communicates with the suction cup 352. The second air connector 354 is mounted on the longitudinal beam 331. The second air connector 354 is connected to the first air connector 353 via a gas pipe 355. Gas passes through the second air connector 354 into the first air connector 353, and then through the first air connector 353 into the suction cup 352. An airflow sensor 356 is mounted on the longitudinal beam 331 and is connected to the second air connector 354. This sensor is used to sense the pressure of the gas entering the suction cup 352. In this embodiment of the invention, the second air connector 354 and the airflow sensor 356 are mounted on the longitudinal beam 331, allowing the gas pipe 355 to rotate with the longitudinal beam 331. This facilitates maintaining unobstructed and controllable airflow during the operation of the transmission mechanism 300.

[0055] For example, the clamping connecting block 351 is mounted on the gear fixing plate 348, the sealing ring is clamped between the two and pressed on the gear fixing seat 344, and the suction cup 352 is fixed on the clamping connecting block 351.

[0056] Furthermore, the gas pipeline 355 and the longitudinal drag chain 335 are arranged on opposite sides of the longitudinal beam 331, thereby balancing the longitudinal beams 331 on both sides and preventing structural tilting.

[0057] For example, a longitudinal drag chain connecting plate 3351 is provided on the longitudinal beam 331, and the longitudinal drag chain 335 serves as a pneumatic and electrical guide for the lifting and lowering action between the longitudinal beam 331 and the longitudinal drag chain connecting plate 3351.

[0058] As an example, the wafer cache system for the polishing station 10 also includes: routing aid components.

[0059] The wiring auxiliary components include: a wiring tube near the gear mounting base 344. Through the wiring tube, the transverse drag chain 315, and the longitudinal drag chain 335, the air circuit and electrical circuit can be ensured to work normally when the clamping module 350 performs transverse, lifting, rotating, and swinging movements.

[0060] As an example, the operation of the wafer cache system for polishing machine 10 disclosed in this embodiment of the invention is as follows: When there are no wafers on the main unit, the clamping module 350 is in the initial position. The swing module 340 swings from the horizontal position to the vertical position, and the clamping module 350 tilts at a certain angle, so that the suction cup 352 can better adhere to the wafer through contact when clamping the wafer, further increasing the contact area with the wafer, thereby making the vacuum suction cup 352 perform adsorption more quickly and speeding up the clamping efficiency. The longitudinal movement module 330 drives the clamping module 350 down to the wafer pick-up position of the buffer slot 210, while the transverse movement module 310 moves to the wafer pick-up waiting position of the basket. The transverse movement module 310 moves to the position where the suction cup 352 adheres to the wafer, the vacuum adsorption is activated, the airflow sensor 356 detects the adsorbed wafer, and the transverse movement module 310 and the lifting module cooperate to remove the wafer from the cassette at a certain angle and raise it above the buffer slot 210. At the same time, the swing module 340 swings to the horizontal position, while the transverse movement module 310 and the lifting module move to the position of the wafer inlet of the main unit. Through the cooperation between the rotating module 320 and the traversing module 310, the wafer on the clamping module 350 moves to the main unit's support stage in a specific arc. The coordinated movement of the rotating module 320 and the traversing module 310 significantly reduces the opening size of the wafer inlet at the main unit, further minimizing contamination inside the main unit during loading and unloading. After the clamping module 350 completes wafer placement and the main unit completes wafer removal, the clamping module 350 again exits the main unit in the same arc to the wafer inlet position. Finally, the clamping module 350 returns to its initial position.

[0061] When there is a wafer on the main unit, the clamping module 350 is in the initial position. The main unit sends a wafer pick-up signal, and the traversing module 310 and the lifting module move to the wafer inlet position of the main unit of the polishing machine. Through the cooperation between the rotating module 320 and the traversing module 310, the clamping module 350 moves in a specific arc to the bearing platform of the main unit of the polishing machine. At this time, the bearing platform is raised to the position below the suction cup 352 of the transfer clamping module 350 to deliver the wafer, and the vacuum adsorption of the suction cup 352 is activated. When the airflow sensor 356 detects the adsorbed wafer, the bearing platform descends. At this time, it is assumed that the main unit has completed wafer pick-up, and the clamping module 350 exits the main unit again in the same arc to the wafer inlet position of the main unit. The transfer mechanism 300 begins the wafer storage operation. The horizontal movement module 310 moves to above the cache tray, the swing module 340 swings from the horizontal position to the vertical position and tilts the clamping module 350 at a certain angle, and the lifting module descends to the vicinity of the cache tray. The horizontal movement module 310 and the lifting module cooperate to send the wafer into the cache basket at a certain angle. The vacuum adsorption is turned off, the sensor detects no negative pressure, the horizontal movement module 310 exits the cache basket, and the lifting module rises above the cache slot 210. The clamping module 350 performs the wafer retrieval operation. The traverse module 310 moves above the processing tray, while the lifting module descends to the wafer pick-up position in the buffer slot 210. Simultaneously, the traverse module 310 moves to the wafer pick-up waiting position in the basket. Further, the traverse module 310 moves to the suction cup 352 to adhere to the wafer, vacuum adsorption is activated, and the airflow sensor 356 detects the adsorbed wafer. The traverse module 310 and the lifting module work together to remove the wafer from the tray at a certain angle and raise it above the buffer slot 210. Simultaneously, the swing module 340 swings to a horizontal position, and the traverse module 310 and the lifting module move to the wafer inlet position on the main unit. Through the cooperation between the rotation module 320 and the traverse module 310, the wafer on the clamping module 350 moves in a specific arc to the main unit's support platform. The coordinated movement of the rotation module 320 and the traverse module 310 significantly reduces the opening size of the wafer inlet on the main unit, further reducing contamination inside the main unit during loading and unloading. After the clamping module 350 completes the wafer placement and the main unit completes the wafer removal, the clamping module 350 retracts from the main unit along the same arc to the wafer inlet position. Finally, the clamping module 350 returns to its initial position.

[0062] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0063] All the above-mentioned optional technical solutions can be combined in any way to form optional embodiments of the present invention, and will not be described in detail here.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer cache system for a polishing machine, characterized in that, include: The frame (100) is provided on one side of the loading table (11) near the polishing machine (10), and the loading table (11) has a feeding station above it; A buffer mechanism (200) includes a buffer slot (210) and a slot lifting assembly (220). The slot lifting assembly (220) is connected to the buffer slot (210), and the buffer slot (210) is adapted to move up and down under the drive of the slot lifting assembly (220). A transmission mechanism (300) is disposed above the buffer mechanism (200). The transmission mechanism (300) includes interconnected components: a horizontal movement module (310), a rotation module (320), a vertical movement module (330), a swing module (340), and a clamping module (350). The transverse module (310) is fixed to the frame (100). The transverse module (310) and the rotation module (320) cooperate to ensure that the movement trajectory of the wafer from above the cache slot (210) to the wafer delivery station is a straight line perpendicular to the transverse module (310). The rotation angle of the rotation module (320) is... The distance the wafer moves vertically relative to the transverse module (310) and the distance from the wafer to the rotation center of the rotating module (320) ,satisfy: 。 2. A wafer cache system for a polishing machine as described in claim 1, characterized in that, The lateral movement module includes: A crossbeam (311) is fixed on the frame (100). A transverse guide rail (312) and a transverse transmission assembly (313) are provided on the crossbeam (311). A transverse guide rail connecting block (314) is slidably connected on the transverse guide rail. The transverse transmission assembly (313) has a transverse drive motor (3131), which is located at one end of the crossbeam. A transverse drag chain (315) is arranged along the transverse drag chain fixing plate (3151). The transverse drag chain (315) is connected to the transverse guide rail connecting block (314). The transverse drag chain fixing plate (3151) is fixedly arranged on the frame (100). The transverse drag chain fixing plate (3151) and the crossbeam (311) are respectively arranged opposite to each other on the frame (100) along the first direction to achieve the overall center of gravity balance of the wafer cache system for the polishing machine along the first direction.

3. A wafer cache system for a polishing machine as described in claim 2, characterized in that, The longitudinal movement module (330) includes: A longitudinal beam (331) is fixedly provided with a longitudinal guide rail (332). The longitudinal beam (331) is connected to a ball screw (333) through a ball screw fixing seat (336). The longitudinal guide rail (332) is slidably connected to a longitudinal guide rail connecting block (334). A longitudinal drag chain (335) is arranged along the longitudinal beam (331). The longitudinal drag chain (335) is connected to the longitudinal guide rail connecting block (334). A gas pipeline (355) is arranged along the longitudinal beam (331). The gas pipeline (355) is connected to the clamping module (350). The gas pipeline (355) and the longitudinal drag chain (335) are arranged on opposite sides of the longitudinal beam (331) along the first direction to achieve the center of gravity balance of the longitudinal beam (331) along the first direction. The transverse drag chain (315), the longitudinal drag chain (335) and the gas pipeline (355) are all arranged on the transverse beam (311) at one end away from the transverse drive motor (3131) to achieve the center of gravity balance of the entire transmission mechanism (300) along the second direction. The second direction is perpendicular to the first direction.

4. A wafer cache system for a polishing machine as described in claim 2, characterized in that, On the crossbeam (311), transverse limiting members (317) are provided near both ends of the transverse guide rail (312). A transverse limiting sensor (318) is provided between the two transverse limiting members (317). A transverse limiting brush (319) is provided on the transverse guide rail connecting block (314). The transverse limiting sensor (318) is adapted to sense the movement of the transverse guide rail connecting block (314) through the transverse limiting brush (319). The transverse limiting members (317) and the transverse limiting brush (319) constitute the dual limiting structure of the transverse module (310).

5. A wafer cache system for a polishing machine as described in claim 2, characterized in that, The transverse transmission assembly (313) further includes: a drive wheel (3132) and a driven wheel (3133). The transverse drive motor (3131) is connected to the drive wheel (3132). The drive wheel (3132) and the driven wheel (3133) are connected by a synchronous belt (3134). The transverse guide rail connecting block (314) is connected to the synchronous belt (3134) by a pressure plate (3135). A driven wheel adjusting member (3136) and a driven wheel fixing member (3137) are provided on the crossbeam (311). The driven wheel (3133) is connected to the crossbeam (311) through the driven wheel adjusting member (3136). The driven wheel fixing member (3137) abuts against the side of the driven wheel adjusting member (3136) by a screw.

6. A wafer cache system for a polishing machine as described in claim 3, characterized in that, The rotating module (320) includes: A rotating base (321) is connected to the lower part of the transverse guide rail connecting block (314), and a rotation limit sensor (325) is provided on the rotating base (321). Connecting seat (322), the connecting seat (322) is disposed on the upper side of the longitudinal beam (331) and on the lower side of the rotating seat (321); A rotating gear (323) is disposed on the connecting seat (322), and a rotating limiting disk (326) is disposed on the rotating gear (323). The rotating limiting disk (326) is disposed along the circumferential portion of the rotating gear (323), and the rotating limiting sensor (325) is adapted to sense the rotation angle of the rotating gear (323) through the rotating limiting disk (326). A rotating worm (324) is disposed in the rotating seat (321). The rotating worm (324) meshes with the rotating gear (323), and the rotating gear (323) is adapted to rotate under the drive of the rotating worm (324).

7. A wafer cache system for a polishing machine as described in claim 3, characterized in that, The longitudinal guide rail (332) is provided with a longitudinal movement limiting component (337) and a longitudinal movement limiting sensor (338). The longitudinal guide rail connecting block (334) is provided with a longitudinal movement limiting brush (339). The longitudinal guide rail connecting block (334) is sleeved on the ball screw (333) and meshes with the ball screw (333). The longitudinal guide rail connecting block (334) moves along the longitudinal guide rail (332) under the drive of the ball screw (333). The longitudinal movement limiting component (337) and the longitudinal movement limiting brush (339) constitute the dual limiting structure of the longitudinal movement module.

8. A wafer cache system for a polishing machine as described in claim 3, characterized in that, The swing module (340) includes: Guide sleeve (341), the guide sleeve (341) is connected to the longitudinal guide rail connecting block (334); A swing worm (342) is inserted into the guide sleeve (341); A swing gear (343) is disposed on the lower side of the swing worm (342) and meshes with the swing worm (342). The swing gear (343) is adapted to rotate under the drive of the swing worm (342). A gear fixing seat (344) is disposed on the lower side of the guide sleeve (341). The gear fixing seat (344) has a receiving space. The swing gear (343) is disposed in the receiving space of the gear fixing seat (344). A swing limit sensor (345) is disposed in the receiving space of the gear fixing seat (344). A swing limit brush (346) is disposed on the swing gear (343).

9. A wafer cache system for a polishing machine as described in claim 8, characterized in that, Fixed bearings are provided on both sides of the swing gear (343), and the fixed bearings are partially embedded in the gear fixing seat (344). A gear fixing plate (348) is provided on the fixed bearings near the clamping module (350), and the clamping module (350) is connected to the gear fixing plate (348).

10. A wafer cache system for a polishing machine as described in claim 8, characterized in that, A guide block (347) is provided in the accommodating space of the gear fixing seat (344), the guide block (347) has a snap-fit ​​groove, and the swing worm (342) is connected to the snap-fit ​​groove in the accommodating space of the gear fixing seat (344).

11. A wafer cache system for a polishing machine as described in claim 8, characterized in that, The clamping module (350) includes: A clamping connecting block (351) is disposed on one side of the swing gear (343) via a rotating shaft and connected to the swing gear (343); A suction cup (352) is connected to the clamping connecting block (351); The first air connector (353) is disposed on the clamping connecting block (351) and is connected to the suction cup (352); The second gas connector (354) is disposed on the longitudinal beam (331) and is connected to the first gas connector (353) through the gas pipeline (355). An airflow sensor (356) is mounted on the longitudinal beam (331) and is connected to the second air passage connector (354).

12. A wafer cache system for a polishing machine as described in claim 1, characterized in that, A basket support (230) is provided inside the buffer slot (210), and the basket support (230) is fixed on the frame (100). The buffer slot (210) is adapted to move up and down relative to the basket support (230) under the drive of the slot lifting assembly (220). The horizontal moving module (310), the vertical moving module (330), and the swing module (340) cooperate to perform wafer clamping or placement actions after the buffer slot (210) is lowered into place. The swing angle of the swing module (340) is... The moving distance of the longitudinal translation module (330) The moving distance of the lateral module (310) ,satisfy: 。

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