A method for manufacturing a ceramic-copper integrated heat sink plate using a bionic leaf vein cooling channel

Abstract

The application discloses a kind of manufacturing methods of ceramic-copper integrated heat dissipation plate with bionic leaf vein cooling channel, belong to electronic device heat dissipation and advanced manufacturing technology field, including the following steps: S1: generating print model;S2: generating print file, prepare ceramic bar stock and copper powder bar stock, ceramic bar stock and copper powder bar stock are added to multi-material direct writing additive manufacturing equipment;S3: setting the print parameter of multi-material direct writing additive manufacturing equipment, and the integrated heat dissipation plate green body is formed according to the print file of multi-material direct writing additive manufacturing equipment, S4: the integrated heat dissipation plate green body is carried out debinding treatment and sintering treatment to form final integrated heat dissipation plate, by using multi-material direct writing additive manufacturing technology to the integrated heat dissipation plate is manufactured, to enhance the reliability of integrated structure after manufacturing, and then through structural characteristics and manufacturing method solve the problem that the existing technology heat dissipation effect is poor, structure bonding strength is low.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation and advanced manufacturing technology for electronic devices, and specifically to a method for manufacturing an integrated ceramic-copper heat sink employing a biomimetic leaf vein cooling channel. Background Technology

[0002] As high-power electronic devices develop towards higher power density, higher integration, and miniaturization, the heat generated during their operation increases significantly, placing higher demands on the thermal management capabilities of heat dissipation structures. Ceramic materials, due to their excellent electrical insulation and thermal stability, are widely used in the substrate and packaging structures of high-power electronic devices; copper materials, due to their excellent electrical and thermal conductivity, are often used as conductive or thermally conductive layers.

[0003] Existing heat dissipation structures for high-power electronic devices typically employ a split design, where the ceramic substrate, copper conductive layer, and liquid cooling heat sink are manufactured separately through sintering, brazing, or bonding before being assembled. This type of structure has the following drawbacks in practical applications: First, the numerous heterogeneous material interfaces result in high interfacial thermal resistance, limiting further improvements in heat dissipation efficiency; second, the manufacturing process is complex, and assembly accuracy and consistency are significantly affected by human factors; third, traditional processing methods struggle to fabricate complex three-dimensional microchannel cooling structures within the ceramic structure, hindering the optimization of heat dissipation performance; and fourth, the finished product dimensions are limited, resulting in poor manufacturing flexibility.

[0004] Therefore, there is an urgent need to design a manufacturing method for a ceramic-copper integrated heat sink that uses biomimetic leaf vein cooling channels in order to solve the above problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to enhance the reliability of the integrated structure after manufacturing by using multi-material direct-write additive manufacturing technology to additively manufacture an integrated heat sink, thereby solving the problems of poor heat dissipation and low structural bonding strength of the prior art through structural characteristics and manufacturing methods.

[0006] The technical solution adopted by this invention to solve the technical problem is: a method for manufacturing an integrated ceramic-copper heat sink using a biomimetic leaf vein cooling channel, comprising the following steps:

[0007] S1: Generate a printing model based on the structural model determined by the integrated heat sink. The printing model includes a ceramic liquid cooling heat sink, a copper conductive layer, and a ceramic base located between the ceramic liquid cooling heat sink and the copper conductive layer. The ceramic liquid cooling heat sink has a biomimetic leaf vein-shaped cooling channel inside. The distribution of copper heat dissipation elements in the copper conductive layer corresponds to the biomimetic leaf vein-shaped area on the cooling channel.

[0008] S2: Slice the printed model to generate a printed file, prepare ceramic rods containing wax-based binders and copper powder rods containing wax-based binders, and add the ceramic rods and copper powder rods to the multi-material direct-write additive manufacturing equipment used for the molding and manufacturing of the integrated heat sink.

[0009] S3: Set the printing parameters of the multi-material direct-write additive manufacturing equipment. The multi-material direct-write additive manufacturing equipment prints the ceramic liquid cooling heat dissipation part, the ceramic base bottom and the copper conductive layer part in sequence from bottom to top according to the printing file to form a heat dissipation plate blank. The printing parameters are as follows: the printing nozzle temperature for the ceramic rod and the copper powder rod is 150-200℃.

[0010] S4: The heat sink blank is degreased and sintered to form the final integrated heat sink.

[0011] As a preferred embodiment of the present invention, the ceramic rod is a barium titanate ceramic rod.

[0012] As a preferred embodiment of the present invention, the barium titanate ceramic rod contains 70%-90% ceramic solids, with the remainder being a wax-based binder.

[0013] As a preferred embodiment of the present invention, the copper solid content in the copper powder rod is 70%-90%, and the remainder is a wax-based binder.

[0014] As a preferred technical solution of the present invention, the channel cross-section of the cooling channel is obtained through topology optimization with the dual objective of maximizing thermal conductivity and minimizing the flow resistance of the cooling medium. In the dual objective of the topology optimization, the weight ratio of maximizing thermal conductivity is 60%-70%, and the weight ratio of minimizing the flow resistance of the cooling medium is 30%-40%.

[0015] As a preferred embodiment of the present invention, the flow channel volume fraction of the cooling channel is in the range of 0.5-0.8.

[0016] As a preferred embodiment of the present invention, step S4 specifically includes the following steps:

[0017] S4.1: The integrated structural body is placed in a degreasing sintering furnace for degreasing and sintering treatment. The degreasing sintering furnace is heated to 280-320°C at a heating rate of 4-6°C / min, and then held at that temperature for 1.5-2.5h for degreasing treatment.

[0018] S4.2: The degreasing sintering furnace is heated to 1000-1100℃ at a heating rate of 2-4℃ / min, and then held at that temperature for 4.5-5.5h for sintering treatment. During the sintering treatment stage, inert gas is introduced into the degreasing sintering furnace for gas protection.

[0019] S4.3: After the sintering process is completed, a cooling process is performed to form the final integrated heat sink.

[0020] As a preferred embodiment of the present invention, the cooling process is carried out at a cooling rate of 1.5-2.5℃ / min until the temperature is reduced to room temperature.

[0021] As a preferred embodiment of the present invention, the ceramic liquid cooling heat dissipation part, the ceramic base and the copper conductive layer are all plate-shaped structures.

[0022] In a preferred embodiment of the present invention, the inert gas is argon.

[0023] The beneficial effects of this invention are reflected in:

[0024] 1. By employing a multi-material direct-write additive manufacturing method, the complex manufacturing requirements of biomimetic leaf vein-shaped cooling channels can be met. Compared to traditional split heat sinks, the interface bonding strength is higher. By using rods containing wax-based binders for initial additive manufacturing to form green blanks, followed by debinding and sintering of the green blanks, this method not only improves the overall interface bonding strength compared to traditional ceramic additive manufacturing followed by copper conductive layer addition, but also allows for targeted size and specification design according to actual needs, increasing the flexibility of the final product specifications. Furthermore, the integrated heat sink with biomimetic leaf vein cooling channels, based on the structural characteristics of biomimetic leaf veins, results in a more significant overall heat dissipation effect.

[0025] 2. Through the specific dual-objective function design of topology optimization, the channel parameters adapted to the heat dissipation characteristics of the ceramic-copper integrated heat sink were determined, making this channel structure the best choice for heat dissipation performance in the ceramic-copper integrated heat sink, rather than a simple material replacement or structural combination.

[0026] 3. The design achieves a coordinated arrangement between the cooling channels and the distribution of copper heat dissipation elements in the copper conductive layer. The distribution of copper heat dissipation elements in the copper conductive layer is designed to fit the shape of biomimetic leaf veins. Their orientation and distribution are highly matched with the biomimetic leaf vein cooling channels, so that the heat generation area and the heat exchange core area are precisely aligned, avoiding local heat accumulation and significantly improving heat conduction and heat exchange efficiency. This solves the problem of poor matching between the distribution of copper heat dissipation elements in the copper layer and the channel structure in the existing technology.

[0027] 4. A stepped bonding interface adapted to the copper conductive layer and cooling channels was designed, and a rod-material alternating penetration deposition strategy was adopted in the additive manufacturing process to specifically improve the bonding area and bonding strength of heterogeneous materials, reduce the interface thermal resistance and electrical resistance. Moreover, this bonding interface design can only be achieved through multi-material direct-write additive manufacturing, and is highly coupled with the manufacturing process, rather than a simple interface structure improvement.

[0028] 5. For the complex structure of the biomimetic leaf vein cooling channel, customized improvements were made to the additive manufacturing and sintering processes. Different printing parameters were used for different areas in the additive manufacturing stage, and atmospheric temperature control and local constant temperature strategies were adopted in the sintering stage. This ensured the forming accuracy, structural integrity and dense bonding of heterogeneous materials of the complex channel, and solved the problems of deformation and uneven sintering that are prone to occur in the additive manufacturing of complex structures.

[0029] 6. By comparing the multi-dimensional performance data with existing split heat dissipation structures and existing additive manufacturing ceramic copper heat dissipation structures, the significant advantages of this invention in terms of heat dissipation efficiency, interface bonding force, surface forming quality, and structural reliability are intuitively demonstrated, proving the synergistic optimization effect of the structural design and manufacturing method of this invention, rather than the improvement of a single process or structure.

[0030] 7. The manufacturing process is simplified, eliminating the need for subsequent assembly processes, thus improving manufacturing consistency and structural reliability; the structural design has a high degree of freedom, making it suitable for manufacturing complex shapes and customized electronic heat dissipation structures. The distribution of the copper conductive layer and the microchannel cooling channel structure can be flexibly adjusted according to the heat dissipation characteristics of different high-power electronic devices, making it highly practical. Attached Figure Description

[0031] Figure 1 A schematic diagram of the topology-optimized heat dissipation circuit board structure designed for an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the ceramic-copper integrated heat sink structure designed for an embodiment of the present invention;

[0033] Figure 3 The topology-optimized heat dissipation biomimetic blade flow channel structure designed for an embodiment of the present invention;

[0034] Figure 4 Simulation results of the topology-optimized heat sink designed for an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the ceramic-copper composite dual direct-write forming equipment and scanning strategy used in an embodiment of the present invention;

[0036] Figure 6 A ceramic-copper integrated manufacturing prototype (left: before sintering, right: after sintering) for an embodiment of the present invention.

[0037] Figure 7 The interfacial bonding performance curve of the ceramic-copper composite integrated heat sink prepared for an embodiment of the present invention;

[0038] Figure 8 The surface roughness of the ceramic-copper composite integrated heat sink prepared for an embodiment of the present invention;

[0039] Figure 9 The interfacial bonding performance curve of the ceramic-copper composite integrated heat sink prepared for an embodiment of the present invention.

[0040] In the diagram: 1. Ceramic liquid cooling heat dissipation section; 2. Copper conductive layer section; 3. Ceramic base bottom; 4. Cooling channel. Detailed Implementation

[0041] The invention will now be described in further detail with reference to the accompanying drawings.

[0042] Combined with appendix Figure 1-9 As shown, a method for manufacturing a ceramic-copper integrated heat sink employing biomimetic leaf vein cooling channels includes the following steps:

[0043] S1: Generate a printing model based on the structural model determined by the integrated heat sink. The printing model includes a ceramic liquid cooling heat sink 1, a copper conductive layer 2, and a ceramic base 3 located between the ceramic liquid cooling heat sink 1 and the copper conductive layer 2. The ceramic liquid cooling heat sink 1 is provided with biomimetic leaf vein-shaped cooling channels 4. The number of cooling channels 4 is at least one set, which is used to guide the flow of cooling medium for heat exchange. The distribution of copper heat dissipation elements in the copper conductive layer 2 corresponds to the biomimetic leaf vein-shaped areas on the cooling channels 4, so that the heat generation area on the copper conductive layer 2 corresponds one-to-one with the heat exchange core area of ​​the cooling channels 4, thereby realizing rapid heat conduction and efficient heat exchange.

[0044] The cross-section of the cooling channel 4 is obtained through topology optimization with the dual objective of maximizing thermal conductivity and minimizing the flow resistance of the cooling medium. In the dual objective of topology optimization, the weight ratio of maximizing thermal conductivity is 60%-70%, and the weight ratio of minimizing the flow resistance of the cooling medium is 30%-40%. The cooling channel 4 is designed as a biomimetic leaf vein shape. With the use of topology optimization and weight selection, the optimal cross-sectional shape is obtained. The flow channel volume fraction of the cooling channel 4 is in the range of 0.5-0.8. At this volume fraction, the heat exchange area of ​​the cooling medium flowing in the final integrated heat sink is optimally balanced with the structural strength of the ceramic liquid cooling heat sink 1 part of the integrated heat sink. It is also highly compatible with the thermal conductivity characteristics of the ceramic-copper composite structure. It is the flow channel volume parameter with the best heat dissipation effect in the ceramic-copper composite structure. The biomimetic leaf vein-shaped cooling channel 4 includes a biomimetic main leaf vein cooling channel and a biomimetic branch leaf vein cooling channel.

[0045] The ceramic liquid cooling heat dissipation part 1, the ceramic base 3, and the copper conductive layer 2 are all plate-shaped structures. The thickness of the ceramic liquid cooling heat dissipation part 1 accounts for 80%-90% of the thickness of the integrated heat dissipation plate printing model, the thickness of the ceramic base 3 accounts for 5%-10% of the thickness of the integrated heat dissipation plate printing model, and the thickness of the copper conductive layer 2 accounts for 5%-10% of the thickness of the integrated heat dissipation plate printing model.

[0046] Preferably, the thickness of the integrated heat sink is 2mm-8mm;

[0047] The copper heat dissipation element in the copper conductive layer 2 corresponding to the biomimetic main vein cooling channel is used to dissipate heat in the core area of ​​the electronic device corresponding to the integrated heat sink. The distance between the copper heat dissipation element in the biomimetic branch vein cooling channel and the corresponding biomimetic branch vein cooling channel is no more than 0.5mm, so that the heat generated by the corresponding part of the copper conductive layer 2 in the final integrated heat sink can be directly and quickly conducted to the corresponding part of the adjacent cooling channel 4, avoiding local heat accumulation. The thickness of the copper conductive layer 2 is 0.1-0.3mm, so that the final integrated heat sink can achieve a balance between heat conduction efficiency and lightweight structure while ensuring conductivity.

[0048] The interface between the ceramic substrate 3, the copper conductive layer 2, and the ceramic liquid cooling heat dissipation plate is chemically bonded, meaning that the heterogeneous interfaces are bonded using the same wax-based adhesive. This allows different material rods to interpenetrate at the interface during the deposition process of multi-material direct-write additive manufacturing, further improving the interface bonding strength and thermal conductivity, and reducing interface thermal resistance and interface resistance. At the interface between the ceramic substrate 3 and the copper conductive layer 2, the height of the interface at the connection between the main vein and the branch vein of the copper conductive layer 2 ranges from 0.05mm to 0.2mm, and the height of the interface between the ceramic liquid cooling heat dissipation plate and the ceramic substrate 3 ranges from 0.1mm to 0.2mm.

[0049] S2: Slice the printed model to generate a printed file, prepare ceramic rods containing wax-based binders and copper powder rods containing wax-based binders, and add the ceramic rods and copper powder rods to the multi-material direct-write additive manufacturing equipment used for the molding and manufacturing of the integrated heat sink.

[0050] The multi-material direct-write additive manufacturing equipment is specifically a fused deposition modeling (FDM) equipment. The ceramic rod is a barium titanate ceramic rod. The thermal expansion coefficient of barium titanate ceramic matches well with that of copper material. During sintering and actual operation, it can reduce interface cracking caused by thermal expansion differences. It is suitable for the complex structure of the biomimetic leaf vein-shaped cooling channel 4 and ensures structural stability. The ceramic solid content in the barium titanate ceramic rod is 70%-90%, and the remainder is a wax-based binder. The copper powder rod has a copper solid content of 70%-90%, and the remainder is a wax-based binder. By selecting rods containing wax-based binders, the formability of the rods and the bonding after deposition are ensured.

[0051] S3: Set the printing parameters of the multi-material direct-write additive manufacturing equipment. The multi-material direct-write additive manufacturing equipment prints the ceramic liquid cooling heat dissipation part 1, the ceramic base 3 and the copper conductive layer part 2 in sequence from bottom to top according to the printing file to form a heat dissipation plate blank. The printing parameters are as follows: the printing nozzle temperature for the ceramic rod and the copper powder rod is 150-200℃.

[0052] For an integrated heat sink with a thickness of 5mm, the printing parameters also include printing speed, line spacing, and layer height.

[0053] The printing speed for ceramic is 20-30 mm / s, and the printing speed for copper is 20-40 mm / s. Furthermore, the printing speed at the corner of the biomimetic leaf vein cooling channel is 20-25 mm / s, and the printing speed for the rest is 25-30 mm / s. The printing speed for the copper heat dissipation element corresponding to the biomimetic main leaf vein cooling channel is 30-40 mm / s, and the printing speed for the rest is 20-30 mm / s.

[0054] The line spacing for ceramic printing is 0.5-0.7mm, and the line spacing for copper printing is 0.5-0.7mm.

[0055] The printing layer height for both ceramic and copper is 0.2 mm;

[0056] By setting the above parameters, at the corners of the bionic main leaf vein cooling channel and the bionic branch leaf vein cooling channel, the printing speed is reduced and the line spacing is decreased to ensure the forming accuracy of the channel structure. The corresponding parts of the ceramic base 3, the copper conductive layer 2 and the ceramic liquid cooling heat dissipation part 1 are formed in the same manufacturing process, and the internal bionic leaf vein cooling channel 4 is constructed at the same time. In addition, while suppressing warping deformation and shedding, it is beneficial to improve the forming accuracy and density. At the same time, in order to further improve the surface roughness, when the program is set, after printing the last layer of the top surface, a step of non-extrusion material running and ironing is added.

[0057] S4: The heat sink blank is degreased and sintered to form the final integrated heat sink.

[0058] Specifically:

[0059] S4.1: The integrated structural body is placed in a degreasing sintering furnace for degreasing and sintering treatment. The degreasing sintering furnace is heated to 280-320°C at a heating rate of 4-6°C / min, and then held at that temperature for 1.5-2.5h for degreasing treatment.

[0060] S4.2: The degreasing sintering furnace is heated to 1000-1100℃ at a heating rate of 2-4℃ / min, and then held at that temperature for 4.5-5.5h for sintering treatment;

[0061] In the sintering process, an inert gas, namely argon, is introduced into the degreasing sintering furnace for gas protection.

[0062] S4.3: After the sintering process is completed, a cooling process is performed to form the final integrated heat sink.

[0063] The cooling process is carried out at a cooling rate of 1.5-2.5℃ / min until the temperature is reduced to room temperature.

[0064] Argon gas is introduced to create a protective atmosphere, and an auxiliary heating device is used to achieve localized constant temperature in the internal area of ​​the corresponding part of the biomimetic leaf vein cooling channel 4. This avoids uneven local sintering temperature caused by the complex channel structure, ensuring the dimensional accuracy and structural integrity of the channel, while achieving a dense bond between ceramic and copper at the interface. After sintering, the material is cooled to room temperature at a cooling rate of 1.5-2.5℃ / min to reduce thermal stress.

[0065] Taking the preparation of a 5mm thick integrated heat sink using barium titanate ceramic rods with 75% ceramic solid content and copper powder rods with 75% copper solid content as raw materials as an example:

[0066] S1: Generate a printing model based on the structural model determined by the integrated heat sink;

[0067] The cross-section of the cooling channel 4 is obtained through topology optimization with the dual objective of maximizing thermal conductivity and minimizing the flow resistance of the cooling medium. In the dual objective of the topology optimization, the weight of maximizing thermal conductivity is 65%, the weight of minimizing the flow resistance of the cooling medium is 35%, and the flow volume fraction of the cooling channel 4 is 0.5.

[0068] The distance from the copper heat dissipation element to the corresponding biomimetic leaf vein cooling channel is 0.4 mm, and the thickness of the copper conductive layer 2 is 0.2 mm.

[0069] The height of the interface between the main vein and the branch vein of the copper conductive layer 2 is 0.08 mm, and the height of the interface between the ceramic liquid cooling heat dissipation plate and the ceramic base 3 is 0.15 mm.

[0070] S2: Slice the printed model to generate a printed file, prepare ceramic rods containing wax-based binders and copper powder rods containing wax-based binders, and add the ceramic rods and copper powder rods to the multi-material direct-write additive manufacturing equipment used for the molding and manufacturing of the integrated heat sink.

[0071] S3: Set the printing parameters of the multi-material direct-write additive manufacturing equipment. The equipment prints the ceramic liquid cooling heat dissipation section 1, the ceramic substrate 3, and the copper conductive layer 2 sequentially from bottom to top according to the printing file to form a heat dissipation plate green body. The printing parameters specify a printing nozzle temperature of 150°C for the ceramic rod and a printing nozzle temperature of 155°C for the copper powder rod.

[0072] The printing speed of the corner of the biomimetic leaf vein cooling channel is 25 mm / s, and the printing speed of the rest is 30 mm / s. The printing speed of the copper part corresponding to the biomimetic main leaf vein cooling channel is 35 mm / s, and the printing speed of the rest is 25 mm / s.

[0073] The spacing between the ceramic printing lines is 0.7mm, and the spacing between the copper printing lines is 0.6mm.

[0074] The printing layer height for both ceramic and copper is 0.2 mm;

[0075] S4: The heat sink blank is degreased and sintered to form the final integrated heat sink.

[0076] Specifically:

[0077] S4.1: The integrated structural body is placed in a degreasing sintering furnace for degreasing and sintering. The degreasing sintering furnace is heated to 300°C at a heating rate of 5°C / min, and then held at that temperature for 2 hours for degreasing.

[0078] S4.2: The degreasing sintering furnace is heated to 1050°C at a heating rate of 3°C / min, and then held at that temperature for 5 hours for sintering treatment, wherein an argon protective atmosphere is introduced at 800-1050°C.

[0079] S4.3: After the sintering process is completed, a cooling process is performed to form the final integrated heat sink.

[0080] The cooling process is carried out at a cooling rate of 2℃ / min until the temperature drops to room temperature.

[0081] After sintering, the surface roughness is tested using laser confocal microscopy. Figure 8 As shown, the forming quality is good, the roughness is low, Sa=15.90 μm, as indicated. Figure 9 As shown, the interfacial bonding performance of the integrated heat sink prepared in the test embodiment of the present invention is as follows: the interfacial bonding force reaches 998 N;

[0082] After sintering, the integrated heat sink was subjected to performance testing and compared with existing split ceramic-copper heat sinks (straight cylindrical flow channels, full-surface copper conductive layer) and existing additively manufactured ceramic-copper heat sinks (simple branched flow channels, strip-shaped copper conductive layer):

[0083] 1. Heat dissipation efficiency: The integrated heat sink of this invention has a thermal resistance of 0.08-0.12 K / W, while the thermal resistance of existing split ceramic-copper heat sinks is 0.35-0.45 K / W. This invention improves heat dissipation efficiency by approximately 70% or more. The thermal resistance of existing additively manufactured ceramic-copper heat sinks (simple branch channels) is 0.20-0.25 K / W. This invention improves heat dissipation efficiency by approximately 40% or more.

[0084] 2. Surface roughness: Through laser confocal microscopy testing, the surface roughness Sa of the structure of this invention is 15.90 μm, indicating good forming quality;

[0085] 3. Interface bonding strength: The ceramic-copper interface bonding strength of the structure of this invention reaches 998 N, while the existing additive manufacturing ceramic-copper heat dissipation structure has a bonding strength of 680 N. This invention increases the bonding strength by 46%.

[0086] 4. Thermal resistance: The thermal resistance of the structure of this invention is 0.10 K / W, while that of the existing additive manufacturing ceramic copper heat dissipation structure is 0.22, representing a 54.5% improvement over the existing additive manufacturing structure;

[0087] 5. High and low temperature cycle test: After 1000 cycles at -40℃ to 125℃, the structure of the present invention showed no interface cracking or flow channel deformation, and the heat dissipation efficiency decay rate was 3.2%, with a heat dissipation efficiency decay rate ≤5%.

[0088] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing an integrated ceramic-copper heat sink employing biomimetic leaf vein cooling channels, characterized in that: Includes the following steps: S1: Generate a printing model based on the structural model determined by the integrated heat sink. The printing model includes a ceramic liquid cooling heat sink (1), a copper conductive layer (2), and a ceramic base (3) located between the ceramic liquid cooling heat sink (1) and the copper conductive layer (2). The ceramic liquid cooling heat sink (1) is provided with a biomimetic leaf vein-shaped cooling channel (4). The distribution of copper heat dissipation elements in the copper conductive layer (2) corresponds to the biomimetic leaf vein-shaped area on the cooling channel (4). S2: Slice the printed model to generate a printed file, prepare ceramic rods containing wax-based binders and copper powder rods containing wax-based binders, and add the ceramic rods and copper powder rods to the multi-material direct-write additive manufacturing equipment used for the molding and manufacturing of the integrated heat sink. S3: Set the printing parameters of the multi-material direct-write additive manufacturing equipment. The multi-material direct-write additive manufacturing equipment prints the ceramic liquid cooling heat dissipation part (1), the ceramic base (3) and the copper conductive layer part (2) in sequence from bottom to top according to the printing file to form a heat dissipation plate blank. The printing parameters are as follows: the printing nozzle temperature for the ceramic rod and the copper powder rod is 150-200℃. S4: The heat sink blank is degreased and sintered to form the final integrated heat sink.

2. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 1, characterized in that: The ceramic rod is a barium titanate ceramic rod.

3. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 2, characterized in that: The barium titanate ceramic rod contains 70%-90% ceramic solids, with the remainder being a wax-based binder.

4. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 3, characterized in that: The copper powder rod contains 70%-90% copper solids, with the remainder being a wax-based binder.

5. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 1, characterized in that: The cross section of the cooling channel (4) is obtained through topology optimization with the dual objective of maximizing thermal conductivity and minimizing the flow resistance of the cooling medium. In the dual objective of the topology optimization, the weight ratio of maximizing thermal conductivity is 60%-70%, and the weight ratio of minimizing the flow resistance of the cooling medium is 30%-40%.

6. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 5, characterized in that: The flow channel volume fraction of the cooling channel (4) is in the range of 0.5-0.

8.

7. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 1, characterized in that: S4 specifically includes the following steps: S4.1: The integrated structural body is placed in a degreasing sintering furnace for degreasing and sintering treatment. The degreasing sintering furnace is heated to 280-320°C at a heating rate of 4-6°C / min, and then held at that temperature for 1.5-2.5h for degreasing treatment. S4.2: The degreasing sintering furnace is heated to 1000-1100℃ at a heating rate of 2-4℃ / min, and then held at that temperature for 4.5-5.5h for sintering treatment. During the sintering treatment stage, inert gas is introduced into the degreasing sintering furnace for gas protection. S4.3: After the sintering process is completed, a cooling process is performed to form the final integrated heat sink.

8. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 7, characterized in that: The cooling process is carried out at a cooling rate of 1.5-2.5℃ / min until the temperature drops to room temperature.

9. The manufacturing method of a ceramic-copper integrated heat sink employing a biomimetic leaf vein cooling channel according to claim 1, characterized in that: The ceramic liquid cooling heat dissipation part (1), the ceramic base (3) and the copper conductive layer (2) are all plate-shaped structures.

10. A method for manufacturing an integrated ceramic-copper heat sink with a biomimetic leaf vein cooling channel according to claim 7, characterized in that: The inert gas is argon.

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