A cooling forming device for processing a silica gel gasket

Abstract

The present application relates to the technical fields of silica gel gasket processing, and discloses a cooling forming device for silica gel gasket processing, which comprises a cooling table, the top side of which is provided with two groups of fans, and the inside of the cooling table is uniformly provided with cooling pipes away from the fans; further comprising a water inlet pipe, which is arranged on one side of the inside of the cooling table, and the inside of the water inlet pipe is sequentially provided with a contraction section and a diffusion section, and a negative pressure area is formed above the contraction section and the diffusion section; the top end of the negative pressure area is connected with a negative pressure pipe, and the negative pressure pipe is uniformly provided with air nozzles, which are used for negative pressure adsorption of the middle part of the silica gel gasket when the cooling water flows; and the inside of the frame is provided with a central air deflector and side air deflectors. The cooling water kinetic energy is used for realizing jet negative pressure adsorption, eliminating the virtual contact of the middle part of the silica gel gasket to improve heat conduction, realizing differential air distribution in different zones, and realizing rapid cooling of the table body through the table bottom spray cooling fins, so as to improve the cooling efficiency and forming quality.

Description

Technical Field

[0001] This invention relates to the field of silicone pad processing technology, specifically a cooling and molding apparatus for silicone pad processing. Background Technology

[0002] In the field of intelligent sealing, silicone gaskets are mostly made using a one-piece molding process. After molding, the silicone gasket is in a high-temperature and high-elasticity state. It needs to be cooled and shaped using a cooling molding device to ensure the flatness, dimensional accuracy and elastic stability of the sealing surface. This avoids warping, bulging and internal stress defects caused by uneven cooling, which would affect the sealing reliability and service life of subsequent intelligent sealing components.

[0003] In the prior art, such as the cooling and molding device for processing elastic silicone gaskets disclosed in patent number CN212636315U, the coolant is mainly driven by a water pump to circulate in the cooling pipe, return pipe, and heat dissipation pipe, while a fan driven by a motor blows air onto the heat dissipation pipe to cool the coolant and indirectly cool the silicone gasket. Although this device can achieve basic cooling function, it still has shortcomings: First, molded silicone gaskets are mostly thin, flat parts with low overall rigidity. After demolding, under their own elastic internal stress, they are prone to arching in the middle, forming a false contact and air insulation layer with the cooling platform. This significantly reduces the contact heat conduction efficiency, slows down cooling in the middle, and easily leads to uneven local shrinkage and bulging residue. This directly results in the flatness of the intelligent sealing surface not meeting the standards and a decrease in sealing performance. Second, existing cooling devices of this type use a fixed fan to blow air, with a single and fixed airflow direction and range, which cannot achieve uniform airflow across the entire area. Third, during continuous cooling, the cooling platform continuously accumulates heat, and the platform temperature continues to rise. The temperature difference between the silicone gasket and the platform decreases, and the heat conduction efficiency continues to decline, making it difficult to meet the production requirements for stable and efficient cooling.

[0004] To address the aforementioned issues, there is an urgent need for innovative design based on the existing cooling and molding equipment used for silicone pad processing. Summary of the Invention

[0005] The purpose of this invention is to provide a cooling molding apparatus for processing silicone pads, so as to solve the problems mentioned in the background art of existing cooling molding apparatuses, such as low thermal conductivity, fixed air cooling range which cannot provide uniform heat dissipation across the entire area, and heat accumulation on the cooling platform which leads to a decrease in heat exchange efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a cooling and molding apparatus for processing silicone pads, comprising: The cooling platform has two sets of fans on one side of its top, and cooling pipes are evenly distributed inside the cooling platform on the side away from the fans. It also includes: a water inlet pipe, the main body of which is located inside one side of the cooling platform, and the inside of the water inlet pipe is provided with a contraction section and a diffusion section in sequence, forming a negative pressure zone above them. The top of the negative pressure zone is connected to a negative pressure pipe, and air nozzles are evenly distributed on the negative pressure pipe for negative pressure adsorption of the middle part of the silicone pad when the cooling water flows. The frame is located at the top center of the cooling platform. The frame has a central air guide plate and side air guide plates in the center and on both sides. The bottom of the frame has a small gear and a large gear, which improve the air output effect through differentiated swing. A turntable is provided on the cooling platform on one side of the frame through a drive box. A rack is provided on the turntable through a moving part. A water wheel is provided at one end of the water inlet pipe, and the top of the water wheel is connected to the turntable through a drive shaft.

[0007] Preferably, the cooling table surface has uniformly formed adsorption holes on one side center, and the adsorption holes are connected to air nozzles.

[0008] Preferably, the cooling platform at the outlet end of the water inlet pipe is provided with a distribution cavity, and the top of the distribution cavity is connected to the cooling pipe through a connecting pipe. A water inlet is fixed on one side of the cooling platform and is connected to the inlet end of the water inlet pipe.

[0009] Preferably, the bottom of the cooling platform is evenly distributed with heat dissipation fins, and five sets of spray pipes are arranged between the heat dissipation fins. The inlet end of the spray pipe is connected to the outlet of the cooling pipe, and the outlet end of the spray pipe is connected to a return water pipe and connected to a water pump to form a cooling water circulation. A water collection tank is provided at the bottom of the cooling platform below the heat dissipation fins.

[0010] Preferably, the bottom of the spray pipe is provided with water outlet holes evenly, and the water outlet holes are all inclined, with the inclination direction of the water outlet holes on adjacent spray pipes being opposite.

[0011] Preferably, the drive box has an elongated opening on the side near the rack, and the end of the movable part near the rack passes through the elongated opening and connects to the rack.

[0012] Preferably, a vertical groove is provided in the center of the movable component, an eccentric shaft is provided at one end of the top of the turntable, and the eccentric shaft is slidably engaged with the vertical groove. Horizontal grooves are provided on both sides of the movable component, and fixing pins are respectively provided in the drive boxes on both sides of the turntable, and the fixing pins are slidably engaged with the horizontal grooves respectively.

[0013] Preferably, the central air guide plate and the side air guide plates are respectively connected to a small gear and a large gear via a rotating shaft, and both the small gear and the large gear mesh with a rack.

[0014] Preferably, the pinion and the gear have the same tooth size, and the pinion has a smaller diameter than the gear.

[0015] Preferably, a guide groove is provided on the cooling platform below the rack, and the bottom of the rack is slidably connected to the guide groove.

[0016] Compared with the prior art, the beneficial effects of the present invention are: the cooling and molding device for processing silicone pads utilizes the kinetic energy of cooling water to simultaneously achieve jet negative pressure adsorption, eliminates the false contact in the middle of the silicone pad to improve heat conduction, and achieves zoned differentiated air swing, and achieves rapid cooling of the platform and water resource circulation through the bottom spray heat dissipation fins, thereby improving cooling efficiency and molding quality.

[0017] Its specific content is as follows: 1. By setting up a cooling platform, water inlet pipe, and negative pressure pipe, and by setting a jet structure including a contraction section, a diffusion section, and a negative pressure zone at the water inlet end of the water inlet pipe, the negative pressure generated during the flow of cooling water, together with the suction hole in the center of the negative pressure pipe and the platform, adsorbs the easily loose area in the middle of the silicone gasket, making the bulging middle area tightly fit the cooling platform surface, eliminating the air insulation layer between the gasket and the platform surface, improving contact heat conduction efficiency, accelerating heat conduction in the middle of the silicone gasket, improving cooling efficiency, and avoiding defects such as warping and bulging caused by delayed cooling and uneven contraction in the middle, thus improving the sealing reliability of subsequent seals and extending their service life. 2. By installing a water wheel inside the cooling pipe, the water wheel is driven to rotate by the kinetic energy of the flowing cooling water. The water wheel drives the turntable to rotate through the drive shaft. An eccentric shaft is installed on the turntable. When the turntable rotates, the moving parts drive the rack to move back and forth, which in turn drives the large gear and small gear to rotate back and forth. This causes the central air guide plate and the side air guide plates on the frame to swing back and forth synchronously from left to right. This changes the limitation of the traditional fixed air blowing of the fan. The cold air blown by the fan sweeps horizontally across the entire surface of the silicone pad along the cooling table surface, expanding the air cooling coverage area, enhancing the convective heat dissipation effect on the upper surface of the silicone pad, and further improving the cooling and molding efficiency. At the same time, there is no need to set up an additional motor to drive the air guide plate to swing. The power supply is fully utilized by the kinetic energy of the cooling water itself, simplifying the overall structure and reducing the energy consumption of the equipment. Furthermore, the tops of the large gear and the small gear are connected to the side air guide plate and the central air guide plate respectively via rotating shafts. The large gear and the small gear have the same tooth module and size, and both mesh with the rack. The diameter of the large gear is larger than that of the small gear. When the rack reciprocates and translates for the same distance, the rotation angle of the large gear is smaller, which makes the swing amplitude of the side air guide plate smaller, avoiding excessive airflow at the edge and warping deformation caused by excessive cooling. The rotation angle of the small gear is larger, which makes the swing amplitude of the central air guide plate larger, which can enhance the air cooling heat dissipation in the middle area of ​​the silicone pad and accelerate the heat dissipation in the middle. This matches the characteristic of the silicone pad bulging in the middle and requiring enhanced cooling. By differentiating the swing amplitude between the center and the side, uniform heat dissipation is achieved throughout the entire area, effectively solving the problem of uneven cooling. 3. By installing heat dissipation fins at the bottom of the cooling platform, the heat accumulated during continuous cooling can be quickly dissipated, avoiding the problem of reduced heat exchange temperature difference between the silicone pad and the platform surface and decreased heat conduction efficiency caused by the continuous rise in platform temperature. At the same time, the water after heat exchange is led out through pipelines and connected to the spray pipes at the fins. The water outlets on the spray pipes spray the heat dissipation fins evenly to cool them down, further improving the heat dissipation efficiency of the fins and accelerating the cooling of the cooling platform. The cooled water after spraying can be collected in the water collection tank for recycling, which not only improves the overall cooling efficiency but also achieves the efficient use of water resources, thus achieving the goal of energy saving and consumption reduction. Furthermore, the water outlets on the spray pipes are set at an angle, and the angles of the water outlets of adjacent spray pipes are opposite. The cooling water after heat exchange is sprayed obliquely onto the surface of the heat dissipation fins through the water outlets. On the one hand, the angled water outlets allow the water to flow obliquely along the gaps between the fins, increasing the contact area between the cooling water and the heat dissipation fins, avoiding spray dead zones caused by vertical dripping of water, and improving the overall heat dissipation efficiency. On the other hand, the opposite spraying directions of adjacent water outlets allow the two spray water streams to form a cross-impact disturbance in the heat dissipation fin area, so that the cooling water evenly covers the entire fin area, preventing uneven spraying in certain areas, ensuring uniform and stable cooling of the heat dissipation fins at the bottom of the cooling platform, and thus ensuring the cooling efficiency and molding quality during the continuous production process of the silicone pads. Attached Figure Description

[0018] Figure 1 This is a top view of the structure of the present invention; Figure 2 This is a top view cross-sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the water inlet pipe of the present invention; Figure 4 This is a side view of the structure of the present invention; Figure 5 This is a schematic diagram of the internal structure of the drive box of the present invention; Figure 6 This is a schematic diagram of the frame structure of the present invention; Figure 7 This is a schematic diagram of the structure of the present invention from a bottom view; Figure 8 This is a bottom view of the spray pipe structure of the present invention; Figure 9 This is a schematic diagram of a partial cross-sectional structure of the spray pipe of the present invention.

[0019] In the diagram: 1. Cooling platform; 2. Water inlet; 3. Fan; 4. Frame; 401. Central air guide plate; 402. Side air guide plate; 403. Rotating shaft; 404. Rack; 405. Guide groove; 406. Large gear; 407. Small gear; 5. Drive box; 501. Moving parts; 502. Turntable; 503. Vertical groove; 504. Horizontal groove; 505. Eccentric shaft; 506. Fixing pin; 507. Long slot; 6. Heat dissipation fins; 7. Adsorption hole; 8. Water collection tank; 9. Water inlet pipe; 901. Negative pressure pipe; 902. Air nozzle; 903. Contraction section; 904. Diffusion section; 905. Negative pressure zone; 906. Water wheel; 10. Distribution chamber; 11. Cooling pipe; 12. Spray pipe; 1201. Water outlet. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-9 This invention provides a technical solution: a cooling and molding device for processing silicone pads, comprising: a cooling table 1, the table surface of which is a flat and smooth metal heat-conducting surface; two sets of fans 3 are arranged on one side of the top of the cooling table 1; cooling pipes 11 are evenly distributed inside the cooling table 1 on the side away from the fans 3; cooling water flows through the cooling pipes 11; in conjunction with the operation of the fans 3, water cooling and air cooling are combined; adsorption holes 7 are evenly distributed in the center of the table surface, the adsorption holes 7 penetrate the table surface of the cooling table 1; a distribution cavity 10 is opened inside the cooling table 1; one end of the distribution cavity 10 is connected to a water inlet pipe 9, and the other end is connected to... Several cooling pipes 11 are connected and are evenly arranged inside the cooling platform 1 to uniformly transport and circulate cooling water, so that the surface temperature of the cooling platform 1 is uniform. The inside of the water inlet pipe 9 includes a contraction section 903, a negative pressure zone 905 and a diffusion section 904 connected in sequence. The inner diameter of the contraction section 903 gradually decreases from the water inlet end to the negative pressure zone 905, and the inner diameter of the diffusion section 904 gradually increases from the negative pressure zone 905 to the water outlet end. A negative pressure pipe 901 is fixedly connected to the top of the negative pressure zone 905. An air nozzle 902 is provided on the negative pressure pipe, and the air nozzles 902 are all connected to the adsorption holes 7. In the above technical solutions, such as Figure 1-3As shown, the water inlet end of the water inlet pipe 9 is connected to the external water supply equipment through the water inlet 2. Cooling water enters the water inlet pipe 9 through the water inlet 2. When it flows through the contraction section 903, the water flow velocity increases significantly due to the contraction of the pipe diameter. According to Bernoulli's principle, when the water flow velocity increases, the pressure in the negative pressure zone 905 will decrease accordingly, forming a stable negative pressure environment. This negative pressure is transmitted to the adsorption hole 7 on the surface of the cooling table 1 through the negative pressure pipe 901 and the air nozzle 902. A sealing ring is provided between the air nozzle 902 and the adsorption hole 7 to improve the sealing performance. When the high-temperature silicone pad after molding is placed on the cooling table 1, the negative pressure generated by the adsorption hole 7 will exert a downward adsorption force on the middle area of ​​the silicone pad, tightly adsorbing the silicone pad, which was originally arched in the middle due to its own elastic internal stress, onto the cooling table 1. This eliminates the air insulation layer between the silicone pad and the table, making the entire lower surface of the silicone pad fit tightly against the cooling table 1, improving the heat transfer efficiency, and allowing the heat of the silicone pad to be fully exchanged with the cooling water flowing in the cooling pipe 11. Example 2: Based on Example 1, this technical solution further discloses a specific implementation of the air-cooled structure. It utilizes the kinetic energy of the cooling water flow to achieve the oscillation of the air guide plate, expanding the air-cooling coverage area and realizing differentiated heat dissipation. Specifically, as follows... Figure 1 , Figures 4-6 As shown: The frame 4 is located at the top center of the cooling platform 1. A central air guide plate 401 and side air guide plates 402 are respectively located in the center and on both sides of the frame 4. A small gear 407 and a large gear 406 are respectively installed at their bottom ends. A turntable 502 is installed on the cooling platform 1 on one side of the frame 4 via a drive box 5. A rack 404 is installed on the turntable 502 via a movable part 501. A water wheel 906 is installed at one end inside the water inlet pipe 9, and the top of the water wheel 906 is connected to the turntable 502 via a drive shaft. The water wheel 906 is located downstream of the diffuser section 904. When cooling water flows through the water wheel 906, the impact force of the water flow drives the water wheel 906 to rotate. The water wheel 906... The output end is connected to the drive shaft, which passes through the side wall of the drive box 5 and is fixedly connected to the turntable 502. An eccentric shaft 505 is eccentrically provided on the surface of the turntable 502. A vertical groove 503 and a horizontal groove 504 are provided on the movable part 501. The eccentric shaft 505 is slidably embedded in the vertical groove 503. Fixing pins 506 are respectively provided in the drive box 5 on both sides of the turntable 502, and the fixing pins 506 are slidably engaged with the horizontal groove 504. A long slot 507 is provided on the side of the drive box 5 near the rack 404. The end of the movable part 501 near the rack 404 passes through the long slot 507 and is connected to the rack 404. The rack 404 is slidably embedded in the guide groove 405 of the frame 4. The lower ends of the central air guide plate 401 and the side air guide plate 402 are both fixedly connected to the rotating shaft 403. The rotating shaft 403 is fixedly connected to the small gear 407 and the large gear 406 respectively. The large gear 406 and the small gear 407 both mesh with the rack 404. The tooth module and size of the large gear 406 and the small gear 407 are the same. The diameter of the large gear 406 is larger than the diameter of the small gear 407. In the above technical solution, when the cooling water flows in the inlet pipe 9, it drives the water wheel 906 to rotate continuously. The water wheel 906 drives the turntable 502 to rotate synchronously through the drive shaft. The eccentric shaft 505 on the turntable 502 slides in the vertical groove 503, and at the same time drives the moving part 501 to reciprocate. The moving part 501 drives the rack 404 to move back and forth in the guide groove 405. When the rack 404 moves, it drives the large gear 406 and the small gear 407 meshing with it to rotate back and forth. Since the diameter of the large gear 406 is larger than that of the small gear 407, when the rack 404 moves back and forth the same distance, the rotation angle of the large gear 406 is smaller than that of the small gear 407, which in turn causes the swing amplitude of the side air guide plate 402 to be smaller than that of the central air guide plate 401. During the application of the above scheme, the fan 3 operates and blows air onto the silicone pads on the cooling platform 1 through the guidance of the central air guide plate 401 and the side air guide plates 402. The back-and-forth swing of the central air guide plate 401 and the side air guide plates 402 expands the air outlet range and improves the cooling efficiency. At the same time, since the central air guide plate 401 has a large swing amplitude, it can expand the air cooling coverage of the central area of ​​the silicone pads and enhance the convective heat dissipation in the central area, matching the characteristics of the silicone pads that are prone to heat accumulation in the central area and require enhanced cooling. The side air guide plates 402 have a smaller swing amplitude, which avoids the edge area of ​​the silicone pads from warping and deformation due to excessive air volume and rapid cooling, thus achieving uniform heat dissipation over the entire area of ​​the silicone pads. At the same time, this structure uses the kinetic energy of the cooling water itself to provide power, which simplifies the overall structure of the device and reduces the energy consumption of the equipment. Example 3: This embodiment is an example Figure 4 , Figures 7-9 As shown, based on Embodiment 1 and Embodiment 2, a cooling platform heat dissipation and water resource circulation structure is further disclosed to solve the problem of heat accumulation leading to heat exchange efficiency decay during continuous operation of the cooling platform, thereby achieving energy saving and consumption reduction. The bottom of the cooling platform 1 is evenly distributed with heat dissipation fins 6. The heat dissipation fins 6 are made of copper material. Copper material has a high thermal conductivity and can quickly dissipate the heat accumulated by the cooling platform 1 during continuous cooling. The heat dissipation fins 6 are distributed in an array, and gaps are reserved between adjacent heat dissipation fins 6 to facilitate the flow of spray water and heat dissipation. A water collection tank 8 is set below the cooling platform 1. The water collection tank 8 has a concave structure and is used to collect the cooling water after spraying. Five sets of spray pipes 12 are arranged between the heat dissipation fins 6. The inlet end of the spray pipe 12 is connected to the outlet of the cooling pipe 11, and the outlet end of the spray pipe 12 is connected to a return water pipeline and connected to a water pump to form a cooling water circulation. The warm water after heat exchange in the cooling pipe 11 is transported to the spray pipe 12 through the pipeline. Several water outlet holes 1201 are evenly opened on the surface of the spray pipe 12. The water outlet holes 1201 are inclined, and the water outlet holes 1201 on adjacent spray pipes 12 are inclined in opposite directions to form a cross-slanted spray structure. In the above technical solution, during the continuous cooling of the silicone pad, the heat absorbed by the cooling platform 1 will gradually be transferred to the interior and bottom. The heat dissipation fins 6 at the bottom of the cooling platform 1 can quickly conduct this heat, avoiding the accumulation of heat inside the cooling platform 1 and causing the platform temperature to rise. At the same time, the warm water in the cooling pipe 11 after heat exchange with the cooling platform 1 is transported to the spray pipe 12 through the pipeline. The warm water is sprayed onto the heat dissipation fins 6 through the water outlet 1201 on the spray pipe 12 to cool down the heat dissipation fins 6, further improving the heat dissipation efficiency of the heat dissipation fins 6, accelerating the cooling of the cooling platform 1, ensuring the stability of the surface temperature of the cooling platform 1, avoiding the reduction of the heat exchange temperature difference between the silicone pad and the platform, and ensuring stable heat conduction efficiency. Because the water outlet 1201 is inclined and the water outlets 1201 of adjacent spray pipes 12 are inclined in opposite directions, when warm water is sprayed obliquely from the water outlet 1201 onto the surface of the heat dissipation fins 6, on the one hand, the inclined water outlet allows the water flow to obliquely wash and wet along the gaps of the heat dissipation fins 6, increasing the contact area between the cooling water and the heat dissipation fins 6, avoiding spray dead corners caused by vertical dripping of water, so that each heat dissipation fin 6 can be covered by cooling water, improving the overall heat dissipation efficiency. On the other hand, the spraying directions of adjacent water outlets 1201 are opposite, and the two spray water flows form a cross-impact disturbance in the area of ​​the heat dissipation fins 6, so that the cooling water is evenly distributed on the surface of the heat dissipation fins 6, preventing heat dissipation dead corners caused by uneven local spraying, ensuring that the overall cooling of the heat dissipation fins 6 at the bottom of the cooling platform 1 is uniform and stable, thereby ensuring the cooling efficiency and molding quality during the continuous production process of the silicone pad. The sprayed cooling water will drip along the surface of the heat dissipation fins 6 into the water collection tank 8 below, which is convenient for subsequent recycling and processing.

[0022] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cooling and molding apparatus for processing silicone pads, comprising: The cooling platform (1) has two sets of fans (3) on one side of its top, and cooling pipes (11) are evenly distributed on the side of the cooling platform (1) away from the fans (3). Its characteristic is that it further includes: The water inlet pipe (9) is located inside the cooling platform (1) on one side. The water inlet pipe (9) has a contraction section (903) and a diffusion section (904) arranged in sequence inside. A negative pressure zone (905) is formed above the water inlet pipe (905). A negative pressure pipe (901) is connected to the top of the negative pressure zone (905). Air nozzles (902) are evenly distributed on the negative pressure pipe (901) for negative pressure adsorption of the middle part of the silicone pad when the cooling water flows. The frame (4) is located at the top center of the cooling platform (1). The frame (4) has a central air guide plate (401) and a side air guide plate (402) in the center and on both sides. The bottom of the frame (4) is provided with a small gear (407) and a large gear (406). The air outlet effect is improved by differential swinging. A turntable (502) is provided on the cooling platform (1) on one side of the frame (4) through a drive box (5). A rack (404) is provided on the turntable (502) through a movable part (501). A water wheel (906) is provided at one end of the water inlet pipe (9). The top of the water wheel (906) is connected to the turntable (502) through a drive shaft.

2. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The cooling platform (1) has uniformly opened adsorption holes (7) on one side of the platform, and the adsorption holes (7) are connected to the air nozzles (902).

3. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The cooling platform (1) at the outlet end of the water inlet pipe (9) is provided with a distribution cavity (10), and the top of the distribution cavity (10) is connected to the cooling pipe (11) through a connecting pipe. A water inlet (2) is fixed on one side of the cooling platform (1), and the water inlet (2) is connected to the inlet end of the water inlet pipe (9).

4. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The cooling platform (1) has heat dissipation fins (6) evenly distributed at the bottom end, and five sets of spray pipes (12) are arranged between the heat dissipation fins (6). The inlet end of the spray pipe (12) is connected to the outlet of the cooling pipe (11), and the outlet end of the spray pipe (12) is connected to a return water pipe and connected to a water pump to form a cooling water circulation. A water collection tank (8) is provided at the bottom of the cooling platform (1) below the heat dissipation fins (6).

5. The cooling and molding apparatus for processing silicone pads according to claim 4, characterized in that: The bottom of the spray pipe (12) is evenly provided with water outlet holes (1201), and the water outlet holes (1201) are all inclined. The inclination direction of the water outlet holes (1201) on adjacent spray pipes (12) is opposite.

6. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The drive box (5) has an elongated opening (507) on the side near the rack (404), and the movable part (501) is connected to the rack (404) through the elongated opening (507) at one end.

7. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The movable part (501) has a vertical groove (503) in the center. The top end of the turntable (502) is provided with an eccentric shaft (505), and the eccentric shaft (505) is slidably engaged with the vertical groove (503). The movable part (501) has horizontal grooves (504) on both sides. The drive boxes (5) on both sides of the turntable (502) are respectively provided with fixing pins (506), and the fixing pins (506) are slidably engaged with the horizontal grooves (504).

8. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The central air guide plate (401) and the side air guide plate (402) are respectively connected to the small gear (407) and the large gear (406) through the rotating shaft (403), and the small gear (407) and the large gear (406) are both meshed with the rack (404).

9. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: The pinion (407) and the gear (406) have the same tooth size, and the diameter of the pinion (407) is smaller than that of the gear (406).

10. The cooling and molding apparatus for processing silicone pads according to claim 1, characterized in that: A guide groove (405) is provided on the cooling platform (1) below the rack (404), and the bottom of the rack (404) is slidably connected to the guide groove (405).

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