Heating die assembly configured to form complex geometries

Abstract

An injection molding system comprising: a cavity plate configured to cooperate with a core plate to form a part therebetween by injection molding; a forming surface of the cavity plate, the forming surface configured as a negative mold of an exterior side of the part to form an exterior shape and exterior features of the part; a cooling line within the cavity plate; and a heater within the cavity plate between the forming surface and the cooling line.

Description

Technical Field

[0001] The information provided in this section is for the purpose of giving a general overview of the background of this disclosure. The work of the currently named inventors, to the extent described in this section, and in all aspects of that description which at the time of filing may not be regarded as prior art, is neither expressly nor implicitly considered prior art to this disclosure.

[0002] This disclosure relates to a heated mold assembly configured to form a component having a complex geometry. Background Technology

[0003] Injection molding is a manufacturing process used to produce parts by injecting molten material (usually plastic) into a mold. The process involves feeding plastic pellets into a heated barrel, where the pellets are molten into a liquid state. The molten plastic is then injected under high pressure through a nozzle into a mold cavity. The mold is configured to form a part with the desired shape and features. After filling the mold cavity, the plastic cools and solidifies. Cooling channels within the mold help manage temperature to ensure proper material solidification and reduce cycle time. After the plastic has solidified, the mold opens and ejector pins push the newly formed part out of the mold. The process is then repeated for the next part. Injection molding is used to produce parts in a wide variety of industries, such as the automotive industry and countless non-automotive industries. Summary of the Invention

[0004] Among various features, this disclosure provides an injection molding system comprising: a cavity plate configured to cooperate with a core plate to form a part therebetween by injection molding; a molding surface of the cavity plate configured as a female mold on the outer side of the part to form the external shape and external features of the part; cooling lines within the cavity plate; and a heater within the cavity plate between the molding surface and the cooling lines.

[0005] In a further feature, the temperature sensor is located adjacent to the heater.

[0006] Among the further features, the temperature sensor is a thermocouple.

[0007] In a further feature, the heater is an electric heater.

[0008] In a further feature, the heater is a cylindrical heater.

[0009] In a further feature, the cavity plate defines a gate, which is configured for injecting molten plastic through the gate onto the molding surface.

[0010] In a further feature, the forming surface includes surface features configured to form the geometry of the component.

[0011] In a further feature, the surface features include a plurality of protrusions; and the shaped surface further includes a smooth region configured to form a smooth outer surface of the component.

[0012] In a further feature, the plurality of protrusions are configured to form a grille pattern for the speaker cover, and the geometry defines a first hole extending through the component and a second hole having a bottom surface.

[0013] In a further feature, the heater is confined to a first region of the cavity plate opposite the plurality of protrusions, such that a second region of the cavity plate opposite the smooth region is free of heaters.

[0014] In a further feature, the heater is configured to heat to 180°F to 200°F.

[0015] Among various features, this disclosure also provides an injection molding system comprising: a cavity plate configured to cooperate with a core plate to form a part therebetween by injection molding; and a molding surface of the cavity plate configured as a female mold on the outer side of the part, the molding surface including: protrusions configured to form holes in the part; and smooth regions spaced apart from the protrusions, the smooth regions configured to form a smooth outer surface of the part spaced apart from the holes. Cooling lines are located within the cavity plate. A heater is located within the cavity plate below the protrusions and between the protrusions and the cooling lines, the heater being configured to heat molten plastic injected onto the molding surface during molding.

[0016] In a further feature, the heater is configured to heat to a temperature range of 180°F to 200°F.

[0017] In a further feature, the temperature sensor is located adjacent to the heater.

[0018] Among the further features, the temperature sensor includes a thermocouple.

[0019] In a further feature, the heater includes a cylindrical heater.

[0020] Among various features, this disclosure also provides a method for forming a part by injection molding, the method comprising: heating a molding surface of a cavity plate of a mold assembly with a heater, the heater being located within the cavity plate between the molding surface and cooling lines within the cavity plate; closing the cavity plate and core plate of the mold assembly together; injecting molten plastic into the region between the cavity plate and core plate through a gate defined by the cavity plate, such that the molten plastic flows onto the molding surface and around a protrusion of the molding surface to form a hole in the part; cooling the molten plastic with a coolant flowing through cooling lines within the cavity plate, the heater being located within the cavity plate between the molding surface and the cooling lines; separating the cavity plate and core plate; and removing the part from the mold assembly.

[0021] In a further feature, the method includes heating the forming surface to 180°F to 200°F using a heater.

[0022] In a further feature, the method includes forming the component as a speaker cover.

[0023] In a further feature, the method includes injecting molten plastic through a gate onto an unheated, smooth area of ​​the molding surface to form a smooth outer surface of the part spaced apart from holes in the part.

[0024] The present invention has the following solutions: Option 1. An injection molding system, comprising: A cavity plate, configured to cooperate with a core plate to form a component therebetween by injection molding; The forming surface of the cavity plate is configured as a female mold on the outer side of the component to form the outer shape and external features of the component; The cooling pipes within the cavity plate; and The heater is located within the cavity plate, between the shaped surface and the cooling lines.

[0025] Option 2. The injection molding system according to Option 1 further includes a temperature sensor adjacent to the heater.

[0026] Option 3. The injection molding system according to Option 2, wherein the temperature sensor is a thermocouple.

[0027] Option 4. The injection molding system according to Option 1, wherein the heater is an electric heater.

[0028] Option 5. The injection molding system according to Option 4, wherein the heater is a cylindrical heater.

[0029] Option 6. The injection molding system according to Option 1, wherein the cavity plate defines a gate, the gate being configured for injecting molten plastic through the gate onto the molding surface.

[0030] Option 7. The injection molding system according to Option 1, wherein the molding surface includes surface features configured to form the geometry of the component.

[0031] Option 8. The injection molding system according to Option 7, wherein: The surface features include multiple protrusions; and The shaped surface further includes a smooth region configured to form a smooth outer surface of the component.

[0032] Option 9. The injection molding system according to Option 8, wherein the plurality of protrusions are configured to form a grid pattern of a speaker cover, and the geometry defines a first hole extending through the component and a second hole having a bottom surface.

[0033] Option 10. The injection molding system according to Option 8, wherein the heater is confined to a first region of the cavity plate opposite to the plurality of protrusions, such that a second region of the cavity plate opposite to the smooth region is free of the heater.

[0034] Option 11. The injection molding system according to Option 1, wherein the heater is configured to heat to 180°F to 200°F.

[0035] Option 12. An injection molding system comprising: A cavity plate, configured to cooperate with a core plate to form a component therebetween by injection molding; The forming surface of the cavity plate, which is configured as the female mold on the outer side of the component, includes: Protrusions, the protrusions being configured to form holes in the component; and A smooth region spaced apart from the protrusion, the smooth region being configured to form a smooth outer surface of the component spaced apart from the hole; The cooling pipes within the cavity plate; and A heater, located within the cavity plate below the protrusion and between the protrusion and the cooling line, is configured to heat molten plastic injected onto the molding surface during molding.

[0036] Option 13. The injection molding system according to Option 12, wherein the heater is configured to heat to a temperature range of 180°F to 200°F.

[0037] Option 14. The injection molding system according to Option 12 further includes a temperature sensor adjacent to the heater.

[0038] Option 15. The injection molding system according to Option 14, wherein the temperature sensor includes a thermocouple.

[0039] Option 16. The injection molding system according to Option 15, wherein the heater comprises a cylindrical heater.

[0040] Option 17. A method for forming a part by injection molding, the method comprising: A heater is used to heat the forming surface of the cavity plate of the mold assembly, the heater being located within the cavity plate between the forming surface and cooling lines within the cavity plate; The cavity plate and core plate of the mold assembly are closed together; Molten plastic is injected into the region between the cavity plate and the core plate through a gate defined by the cavity plate, such that the molten plastic flows onto the molding surface and around the protrusions of the molding surface to form a hole in the component; The molten plastic is cooled by a coolant flowing through cooling pipes within the cavity plate, wherein the heater within the cavity plate is located between the forming surface and the cooling pipes; Separate the cavity plate and the core plate; and Remove the component from the mold assembly.

[0041] Option 18. The method according to Option 17 further includes heating the formed surface to 180°F to 200°F using the heater.

[0042] Option 19. The method according to Option 17 further includes forming the component as a speaker cover.

[0043] Option 20. The method of Option 17 further includes injecting the molten plastic through the gate onto an unheated, smooth area of ​​the forming surface to form a smooth outer surface of the component spaced apart from the holes in the component.

[0044] Further applications of this disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0045] This disclosure will be more fully understood from the specific embodiments and the accompanying drawings, in which: Figure 1 This is a perspective view of the cavity plate of the injection molding system disclosed herein; Figure 2 yes Figure 1 A perspective view of the cavity plate, in which the outermost portion of the shaped surface is removed to show the heating element of the cavity plate; Figure 3 yes Figure 2 A plan view; Figure 4 This is a cross-sectional view of the cavity plate disclosed herein; Figures 5A to 5D The illustrations depict a method and injection molding system for forming parts comprising complex geometries according to the present disclosure; and Figure 6 This is a plan view of an exemplary component formed using injection molding components and methods according to this disclosure.

[0046] In the accompanying drawings, reference numerals may be used repeatedly to identify similar and / or identical elements. Detailed Implementation

[0047] This disclosure relates to injection molding systems and methods configured to form "molded-in-color" parts, which are formed in any color required by an original equipment manufacturer (OEM) supplier, customer, etc. Forming "molded-in-color" parts eliminates the need for painting the part after its formation. Because the parts are not painted, they must be molded precisely without any irregularities, which would be unacceptable on visible surfaces (e.g., Class A surfaces) after the part is mounted.

[0048] For example, a speaker cap includes a Class A outer surface defining a plurality of holes. Some of these holes extend fully through the component and are closely spaced together. When the speaker is mounted, the closely spaced holes are positioned directly above the speaker. The speaker cap may further include holes that do not extend fully through the speaker cap and are located outside the through-holes covering the actual speaker. When these outer holes are formed, weld lines may be visible between the holes because the molten plastic cannot flow uniformly around the protrusions of the mold defining the holes. Such weld lines are generally unacceptable on surfaces visible after the speaker cap is mounted, such as Class A surfaces.

[0049] This disclosure generally provides an injection molding system with a heater located close to the molding surface of a cavity plate configured to form holes in a speaker plate. The heater is closer to the molding surface than the cooling lines of the cavity plate. During the molding process, the heater is configured to heat the molding surface and the molten plastic thereon to 180°F to 200°F or higher. Heating the molten plastic to this high temperature promotes the flow of the molten plastic around the protrusions of the cavity plate configured to form holes in the speaker plate. Therefore, the heater of this disclosure is configured to eliminate or significantly reduce the presence of weld lines on molded parts with complex geometries, such as speaker covers configured to be mounted above speakers on automotive doors. The injection molding system and method of this disclosure are configured to form any other automotive or non-automotive parts with complex geometries that are “colored molded” and to reduce or eliminate the presence of weld lines thereon.

[0050] Figure 1 An injection molding system 10 according to the present disclosure is illustrated. The injection molding system 10 can be configured to form any suitable part using any suitable injection molding process. Figure 6An example of a component 210 that can be formed using injection molding system 10 is illustrated. As further described herein, component 210 is a speaker cover for covering an audio speaker. Component 210 is specifically configured to be mounted to a vehicle door above a speaker mounted inside the door. Component 210 is merely one example of a component that can be formed using injection molding system 10. Injection molding system 10 can be configured to form any other suitable component configured for mounting in a vehicle. Injection molding system 10 can also be configured for non-automotive applications.

[0051] Injection molding system 10 includes cavity plate 20, which is configured to interact with core plate 80 (see...). Figures 5A to 5C The cavity plate 20 collaborates to form part 210 (or any other suitable part) by plastic injection molding. The cavity plate 20 includes a molding surface 30. The molding surface 30 is configured as a female mold on the outer side of the part to form the external shape and external features of the part. For example, and regarding... Figure 6 The component 210, the molding surface 30 is the female mold of the outer side 220 of the component 210 configured as a speaker cover.

[0052] The forming surface 30 includes various surface features configured to form the geometry of the component 210. For example, the forming surface 30 includes a first protrusion 32A and a second protrusion 32B. In the illustrated example, the first protrusion 32A is arranged closer together than the second protrusion 32B, the second protrusion 32B is outside the first protrusion 32A, and the first protrusion 32A is longer than the second protrusion 32B. The first protrusion 32A is configured to form a hole that extends completely through the component 210. The second protrusion 32B is configured to form a second hole in the component, the second hole having a bottom surface and not extending completely through the component.

[0053] For example, and regarding component 210, the first protrusion 32A is configured to form a plurality of first holes 232 extending completely through component 210. The first holes 232 are arranged to cover portions of the speaker. The first holes 232 are clustered together in a generally circular arrangement to cover a generally circular speaker. The first protrusion 32A may also be arranged in any other suitable configuration.

[0054] The second protrusion 32B is configured to form a plurality of second holes 234. The second holes 234 have a bottom surface and therefore do not extend completely through the component 210. The second holes 234 are recesses formed within the outer side 220 of the component 210. The second holes 234 are arranged to be spaced further apart and are generally outside the first holes 232. In some applications, the second holes 234 surround or partially surround a set of first holes 232. The second holes 234 are arranged such that the spacing between the second holes 234 increases approximately as the second holes 234 extend outward from the first holes 232 or approximately “fan out”. The arrangement of the first protrusions 32A and the second protrusions 32B on the forming surface 30 corresponds to the orientation of the first holes 232 and the second holes 234 of the component 210 and is its female mold.

[0055] The forming surface 30 of the cavity plate 20 further includes a smooth region 40. The smooth region 40 is located outside the second protrusion 32B. The smooth region 40 has no surface features that would form a hole within the component 210. The smooth region 40 is the female mold of the smooth outer surface 236 of the outer side 220 of the component 210.

[0056] For further reference Figures 2 to 4 The cavity plate 20 further includes a heater 50. The heater 50 is disposed in a channel 52 defined by the cavity plate 20. The channel 52 and the heater 50 disposed therein are slightly below the forming surface 30. The heater 50 is included below the first protrusion 32A and the second protrusion 32B. The heater 50 is not below the smooth region 40. Therefore, the smooth region 40, which does not have the first protrusion 32A and the second protrusion 32B, is not heated by the heater 50. The portion of the cavity plate 20 below the smooth region 40 does not have the heater 50.

[0057] The heaters 50 are spaced approximately evenly between any suitable distance, such as 10.0 mm to 15.0 mm. The temperature sensor 60 is spaced apart from the heaters 50 by any suitable distance, such as 4.5 mm to 6.0 mm. The heaters 50 are recessed below the forming surface 30 by any suitable distance, such as 6.4 mm to 12.0 mm.

[0058] Heater 50 is any suitable electric heater. For example, heater 50 can be configured as a cylinder heater. Heater 50 is configured to operate at any suitable temperature, such as in a temperature range of 180°F to 200°F or higher. Adjacent to heater 50 is temperature sensor 60, which can be configured to measure the temperature of heater 50 by any suitable temperature sensor. For example, temperature sensor 60 can be a thermocouple. Figure 4 As shown in the figure, temperature sensor 60 can be arranged between heaters 50.

[0059] The cavity plate 20 includes a cooling line 70 configured to circulate any suitable coolant through the cavity plate 20. For example, the cooling line 70 may be configured as a water pipe. The cooling line 70 is located below the heater 50 and the temperature sensor 60. The heater 50 is located between the forming surface 30 and the cooling line 70. Therefore, the heater 50 is closer to the forming surface 30 than the cooling line 70.

[0060] Continue to refer to Figures 1 to 4 and Figure 6 And refer to other sources. Figures 5A to 5D An exemplary method for forming a part (such as part 210) using the injection molding system 10 will now be described. First, refer to... Figure 5A Heater 50 is activated to heat the portion of the forming surface 30 including the first protrusion 32A and the second protrusion 32B to any suitable temperature, such as 180°F to 200°F or higher. The smooth region 40 is not heated. As explained above, heater 50 is arranged only opposite to the portion of the forming surface 30 including the first protrusion 32A and the second protrusion 32B. Heater 50 opposite to the smooth region 40 is excluded. Therefore, and referring to… Figure 2 and Figure 3 There exists a region 54 of the cavity plate 20 opposite the smooth region 40, where the heater 50 is not present. Therefore, the smooth region 40 of the cavity plate 20 is not heated.

[0061] After the forming surface 30 has been heated by the heater 50, the mold is closed to bring the cavity plate 20 and the core plate 80 together, as shown. Figure 5B The image shown is for reference only. Figure 5C Molten plastic is injected into the mold through gate 22. During the injection process, the temperature of cavity plate 20 is regulated by allowing any suitable coolant to pass through the cooling lines 70 of the cavity plate. Core plate 80 also includes cooling lines 82 for cooling core plate 80.

[0062] Molten plastic flows through gate 22 to forming surface 30. The molten plastic flows around first protrusion 32A to form first hole 232 of part 210, and around second protrusion 32B to form second hole 234 of part 210. The molten plastic also flows to smooth region 40 to form smooth outer surface 236 of part 210. The molten plastic is then cooled by coolant flowing through cooling lines 70 of cavity plate 20 and cooling lines 82 defined by core plate 80. (Reference) Figure 5D After part 210 is formed, the mold is opened and part 210 is ejected from the mold.

[0063] Heating the portion of the formed surface 30 including the first protrusion 32A and the second protrusion 32B eliminates or at least minimizes the formation of weld lines around the first hole 232 and / or the second hole 234 of the component 210. If the area of ​​the formed surface 30 including the first protrusion 32A and the second protrusion 32B is not heated by the heater 50, undesirable weld lines may be visible around the first hole 232 or the second hole 234. Without heating, weld lines may be particularly visible around the second hole 234 because they are spaced further apart than the first hole 232.

[0064] Eliminating or at least reducing the presence of weld lines eliminates the need to cover them with a spray agent. Therefore, component 210 can advantageously be “colored molded” in any color desired by the original equipment manufacturer (OEM), supplier, customer, etc. The molding surface 30, including the first protrusion 32A and the second protrusion 32B, is heated to a temperature suitable for promoting the flow of molten plastic around the first protrusion 32A and the second protrusion 32B, thereby eliminating or at least minimizing the formation of weld lines. Heating the molding surface 30 to high temperatures in the range of 180°F to 200°F or higher is generally sufficient to eliminate or at least reduce the formation of weld lines. Heating the molding surface 30 to lower temperatures (such as 160°F) will generally not eliminate or reduce the presence of weld lines.

[0065] The foregoing description is illustrative in nature and is in no way intended to limit this disclosure, its application, or use. The broad teachings of this disclosure can be implemented in various forms. Therefore, while this disclosure includes specific examples, its true scope should not be so limited, as other modifications will become apparent upon examination of the drawings, specification, and appended claims. It should be understood that one or more steps within the method may be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, while each of the embodiments described above is described as having certain features, any one or more of those features described with reference to any embodiment of this disclosure may be implemented in and / or combined with features of any other embodiment, even if such combinations are not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitutions of one or more embodiments for each other remain within the scope of this disclosure.

[0066] Various terms are used to describe spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.), including “connected,” “joined,” “linked,” “adjacent,” “next to,” “on top,” “above,” “below,” and “set.” Unless explicitly described as “direct,” when describing the relationship between first and second elements in the above disclosure, the relationship can be a direct relationship in which no other intermediate elements exist between the first and second elements, or an indirect relationship in which one or more intermediate elements exist between the first and second elements (spatially or functionally). As used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning logic using the non-exclusive logic “OR” (A or B or C) and should not be interpreted as meaning “at least one of A, at least one of B, and at least one of C.”

[0067] In a diagram, the direction of the arrows typically indicates the flow of information (e.g., data or instructions) of interest. For example, when components A and B exchange various types of information, but the information transmitted from component A to component B is relevant to the diagram, the arrow may point from component A to component B. This unidirectional arrow does not imply that no other information is transmitted from component B to component A. Furthermore, for information sent from component A to component B, component B may send a request for the information or an acknowledgment of receipt to component A.

Claims

1. An injection molding system, comprising: A cavity plate, configured to cooperate with a core plate to form a component therebetween by injection molding; The forming surface of the cavity plate is configured as a female mold on the outer side of the component to form the outer shape and external features of the component; The cooling pipes inside the cavity plate; as well as The heater is located within the cavity plate, between the shaped surface and the cooling lines.

2. The injection molding system of claim 1, further comprising a temperature sensor adjacent to the heater.

3. The injection molding system according to claim 2, wherein, The temperature sensor is a thermocouple.

4. The injection molding system according to claim 1, wherein, The heater is an electric heater.

5. The injection molding system according to claim 4, wherein, The heater is a cylindrical heater.

6. The injection molding system according to claim 1, wherein, The cavity plate defines a gate, which is configured to inject molten plastic through the gate onto the molding surface.

7. The injection molding system according to claim 1, wherein, The shaped surface includes surface features configured to form the geometry of the component.

8. The injection molding system according to claim 7, wherein: The surface features include multiple protrusions; and The shaped surface further includes a smooth region configured to form a smooth outer surface of the component.

9. The injection molding system according to claim 8, wherein, The plurality of protrusions are configured to form a grille pattern for the speaker cover, and the geometry defines a first hole extending through the component and a second hole having a bottom surface.

10. The injection molding system according to claim 8, wherein, The heater is confined to a first region of the cavity plate opposite the plurality of protrusions, such that the heater is not present in a second region of the cavity plate opposite the smooth region.

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