Tester device handling system capable of checking loading status

Abstract

Disclosed is a test device conveying system capable of verifying a loading state, including: a disk on which a test device is loaded in a horizontal attitude; a picker configured to load the test device on the disk; and a loading state verifier configured to verify the loading state of the test device based on attitude differences between a normal state in which the test device is loaded on the disk in the horizontal attitude and an abnormal state in which the test device is loaded in an attitude different from the horizontal attitude.

Description

Technical Field

[0001] This disclosure relates to a test device transport system capable of verifying the loading status. More specifically, this disclosure relates to a transport system disposed between a processor and a tester, the processor being configured to receive a test device to be tested and release a test device that has been tested, and the tester being configured to perform installation tests on the test device and transport the test device between the processor and the tester. Background Technology

[0002] In recently developed memory modules, some have the following configuration: multiple dynamic random access memories (DRAMs) are mounted on a board. A known example of a memory module with multiple DRAMs mounted on a board, as described above, is the Miniaturized Compact Attached Memory Module (SOCAMM). To achieve high energy efficiency and bandwidth, various components, including the DRAMs, are mounted on the surface of such memory modules. Furthermore, there has been a recent trend to form memory modules with the smallest possible size by minimizing redundant areas where unmounted components are present, thus minimizing the space occupied by the memory module in its mounted state.

[0003] However, while the trend toward miniaturization and integration of memory modules has maximized efficiency in use, it has presented another challenge in performing installation tests on memory modules.

[0004] Specifically, before being supplied to the real market, memory modules are mounted on test devices with motherboards to evaluate their performance. This testing is known as mounting testing because the memory modules are tested in an actual mounted state. In this context, to maximize the efficiency of mounting testing, a system that automates the mounting test while transporting the memory modules is necessary. However, the aforementioned trend towards miniaturization and integration of memory modules means a reduction in the area of ​​the memory module that can directly contact automated devices. Therefore, a new testing apparatus and method are needed that can process large quantities of recently developed memory modules. Summary of the Invention

[0005] One aspect of this disclosure is to provide a novel transport system capable of reliably transporting test devices, enabling automated installation and testing even for recently developed test devices with reduced contact areas.

[0006] Another aspect of this disclosure is to provide a transport system for transporting test devices in a horizontal orientation to stably support the test devices.

[0007] Another aspect of this disclosure is to provide a transport system capable of verifying the loading status of a test device loaded in a horizontal orientation.

[0008] This disclosure is not limited to the aspects mentioned above, and other purposes not mentioned will be readily apparent to those skilled in the art from the following description.

[0009] According to embodiments of this disclosure, a test device transport system capable of verifying loading status includes: a disk on which test devices are loaded in a horizontal orientation; a pickup configured to load test devices onto the disk; and a loading status verifyer configured to verify the loading status of test devices based on an orientation difference between a normal state and an abnormal state, wherein in the normal state the test devices are loaded in a horizontal orientation on the disk, and in the abnormal state the test devices are loaded in an orientation different from the horizontal orientation.

[0010] The loading status inspector may include a camera configured to photograph the test device loaded on the disk from above.

[0011] The loading status inspector may also include an image processor configured to inspect the loading status of the test device based on inspection images captured by a camera.

[0012] The disk may include a pair of fixing members located on both sides of the test device mounted on the disk in order to hold the test device.

[0013] The image processor can be configured to inspect the loading state of a test device by using shape differences of a fixed component shown in an inspection image, wherein the shape differences of the fixed component shown in the inspection image are based on the attitude differences of the test device between normal and abnormal states.

[0014] When the ends of a pair of fixed components are captured and overlapped with the test device in the inspection image, the image processor can verify that the test device is in a normal state.

[0015] The image processor can inspect the loading status of the test device based on the shape of the outline of the test device shown in the inspection image.

[0016] Multiple test devices can be loaded onto a disk, and the loading status checker can include multiple cameras. The multiple cameras can be mounted above the disk along its transport path. The positions of the multiple cameras can be configured to selectively photograph the multiple test devices loaded onto the disk as it is transported along the transport path.

[0017] The load condition checker may include a distance measurement sensor connected to a pickup and configured to measure the distance to the surface of a test device located below the pickup.

[0018] The loading status checker may also include a distance information processor configured to check the loading status of the test device using distance information measured by a distance measurement sensor.

[0019] The distance measurement sensor may include: a first distance measurement sensor and a second distance measurement sensor, the first distance measurement sensor being configured to measure the distance to a first point on the test device; and the second distance measurement sensor being configured to measure the distance to a second point on the test device that is different from the first point.

[0020] When the difference between the distance measured by the first distance measurement sensor and the distance measured by the second distance measurement sensor exceeds a preset range, the distance information processor can detect that the test device is in an abnormal state.

[0021] The first distance measurement sensor and the second distance measurement sensor can be located at positions symmetrical about the pickup.

[0022] The distance measurement sensor can be set to measure the distance to the surface of the test device after the test device is placed on the disk and the pickup moves upward to a predetermined height.

[0023] Other details of this disclosure are included in the detailed description and the accompanying drawings. Attached Figure Description

[0024] Figure 1 This is a conceptual illustration of a test system including a transport system according to an embodiment of the present disclosure.

[0025] Figure 2 This is a conceptual view illustrating a test device to be transported in a transport system according to an embodiment of this disclosure.

[0026] Figure 3 This is a conceptual view showing one side of a test device on which a contact portion is formed.

[0027] Figure 4 It is a conceptual view showing a test device placed in a horizontal orientation, viewed from the side.

[0028] Figure 5 This is a view showing a test disk according to an embodiment of the present disclosure.

[0029] Figure 6 This is a view showing the insert according to an embodiment of the present disclosure.

[0030] Figure 7 This is a block diagram of a loading status checker according to a first embodiment of the present disclosure.

[0031] Figure 8This is a diagram showing the state of a test device mounted on a test tray, as captured by a loading status inspector according to a first embodiment of the present disclosure.

[0032] Figure 9 This is a view showing the insert as seen from the position of a camera set according to an embodiment of this disclosure.

[0033] Figure 10 This is a simplified view illustrating the state of the test device, according to an embodiment of the present disclosure, fixed to a fixing member in a normal condition.

[0034] Figure 11 It is shown in Figure 10 The view shown is of the fixed component on the left, viewed from above, in the state shown.

[0035] Figure 12 This is a simplified view illustrating the state of the test device, according to an embodiment of the present disclosure, fixed to a fixed member under abnormal conditions.

[0036] Figure 13 It is shown in Figure 12 The view shown is of the fixed component on the left, viewed from above, in the state shown.

[0037] Figure 14 This is a block diagram of a loading status inspector according to a second embodiment of the present disclosure.

[0038] Figure 15 This is a view showing a pickup and a distance measurement sensor mounted on the pickup according to an embodiment of the present disclosure.

[0039] Figure 16 This is a schematic view illustrating the state in which the pickup, according to an embodiment of the present disclosure, loads the test device onto the disk.

[0040] Figure 17 yes Figure 16 A magnified view of region AA.

[0041] Figure 18 This is a view showing the state in which the pickup is aligned above the insert to load the test device, according to an embodiment of the present disclosure.

[0042] Figure 19 It is shown Figure 18 The view shows the state of the pickup moving down to load the test device into the insert.

[0043] Figure 20 It is shown Figure 19 A view of the pickup moving upwards to a predetermined height after the test device has been placed. Detailed Implementation

[0044] The advantages and features of this disclosure, as well as the methods for implementing them, will become apparent from the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided merely to complete this disclosure and to fully inform those skilled in the art of the scope of this disclosure, and this disclosure is limited only by the scope of the claims.

[0045] Furthermore, the embodiments described in this specification will be described with reference to cross-sectional views and / or schematic diagrams, which serve as idealized illustrations of this disclosure. Therefore, the form of the illustrations can be modified by manufacturing techniques and / or tolerances. Additionally, in each figure shown in this disclosure, each component may be slightly enlarged or reduced for ease of description. Throughout the specification, the same reference numerals denote the same components.

[0046] The descriptions relating to directions such as up, down, front, back, left, or right mentioned below are provided solely based on the states shown in the accompanying drawings to facilitate a clear understanding of this disclosure. Therefore, this disclosure is not limited to the directions mentioned below. That is, in actual use or installation, this disclosure may be used or installed in directions different from those mentioned below, and this disclosure should be construed as including such modified embodiments.

[0047] Additionally, the “test device” mentioned below can be a semiconductor product in the form of a module or card in a second-level package.

[0048] Additionally, the term "disk" used below refers to both "test disk" and "user disk." A test disk is designed to be mounted on a tester on which test devices are loaded. With the test disk mounted on the tester, the test devices loaded on the test disk are electrically connected to the tester's interface. On the other hand, a user disk is configured to store test devices in a manner convenient for the user. Test devices under test are supplied to the test system while being loaded onto the user disk. Similarly, test devices that have completed testing are loaded back onto the user disk and then released from the test system.

[0049] In the following description, the present disclosure will be used to explain a test device transport system capable of verifying the loading status according to embodiments of the present disclosure.

[0050] Figure 1 This is a conceptual illustration of a test system including a transport system according to an embodiment of the present disclosure.

[0051] like Figure 1 As shown, the test system 1 including the transport system according to an embodiment of the present disclosure includes: a plurality of stackers 11, 12, 13, a plurality of transferers 20, 30, a plurality of intermediate feeders 40, and a plurality of chambers 51, 52, 53.

[0052] In this context, the transport system can be defined as a set of components that transports disks within the test system 1 along the user disk transport path PT1 and the test disk transport path PT2 (described later), or between the user disk transport path PT1 and the test disk transport path PT2.

[0053] The multiple stackers 11, 12, 13, multiple transferors 20, 30, and pickers installed in the corresponding areas can be components used to implement conventional known processors. In this case, a picker refers to a device configured to pick up and place test devices.

[0054] First, the multiple stackers 11, 12, and 13 can be classified as loading stacker 11, unloading stacker 12, and scrap stacker 13 according to their installation purpose. The specific number of each stacker 11, 12, and 13 can vary depending on the specifications of the test system 1. Typically, the multiple stackers 11, 12, and 13 are configured to stack multiple user disks. Furthermore, each of the multiple stackers 11, 12, and 13 is configured to exchange user disks with the user disk transferor 20. In this case, since the disk exchange structure between the stacker and the transferor is well known in the related art, its detailed description will be omitted.

[0055] User trays loaded with test devices to be tested are stored in loading stacker 11. User trays can be stored in loading stacker 11 by manual operation of a robot, automated guided vehicle (AGV), and / or operator. User trays loaded with test devices that have already been tested are stored in unloading stacker 12. Similarly, user trays stored in unloading stacker 12 can be released from unloading stacker 12 by manual operation of a robot, AGV, and / or operator. Scrap stacker 13 stores user trays loaded with defective test devices. Test devices stored in scrap stacker 13 are then released and discarded.

[0056] User disk transfer unit 20 can be designed to exchange user disks with loading stacker 11 and unloading stacker 12 in units of one lot. In this case, a lot refers to a unit of user disk supply designed with an optimized working environment in mind. That is, a lot refers to a unit used to count the number of user disks transported at one time. In this case, a batch of user disks can be transported between user disk transfer unit 20 and loading / unloading stackers 11, 12 in a stacked state.

[0057] On the other hand, the user disk transferor 20 can be configured to release user disks containing defective products to the scrap stacker 13 as needed. This is because the number of test devices evaluated as defective products is substantially small compared to the number of good products.

[0058] Therefore, as Figure 1 As shown, the user disk transport path PT1 is mainly formed between each of the stackers 11, 12, and 13 and the user disk transferor 20.

[0059] On the other hand, the user disk transferor 20 may have a clamp and a positioning plate. The clamp is configured to place the user disk transferred from the loading stacker 11 onto the positioning plate, or to retrieve the user disk placed on the positioning plate and transport it to another positioning plate or a position within the user disk transferor 20 to release the user disk to the unloading stacker 12 or the scrap stacker 13.

[0060] On the other hand, positioning plates can be provided one after another in front of each of the stackers 11, 12, and 13. Furthermore, the positioning plates can be configured to move vertically. When the positioning plate is moved to its maximum height, an exchange of test devices is performed between the user disk placed on the positioning plate and the test disk located on the test disk transferor 30. In this case, the exchange of test devices is performed by the pickup.

[0061] Specifically, the user trays transferred from the loading stacker 11 are placed on a positioning plate located in front of the loading stacker 11. When the picker transfers all the test devices loaded on the user trays to the test trays, the gripper transfers the empty user trays to the positioning plate located in front of the scrap stacker 13 or the unloading stacker 12.

[0062] User trays, placed on a positioning plate in front of scrap stacker 13 or unloading stacker 12, receive test devices from test trays that have completed testing. This operation is also performed by a pickup. When the user tray is fully loaded, the positioning plate moves downward to a height at which the gripper can pick up the user tray. When the downward movement of the positioning plate is complete, the gripper retrieves the user tray from the positioning plate to transfer the user tray to the corresponding stacker.

[0063] Similar to the user disk transferor 20, the test disk transferor 30 may include a clamp and multiple positioning plates. Also in the test disk transferor 30, the positioning plates are configured to move up and down, and the clamp is configured to transport the test disk between different positioning plates.

[0064] The positioning plates installed in the test tray transferor 30 can correspond one-to-one with the positioning plates installed in the user tray transferor 20. More specifically, the positioning plates installed in the test tray transferor 30 can be installed one after another in front of the positioning plates installed in the user tray transferor 20. The positioning plates installed in the test tray transferor 30 and the positioning plates installed in the user tray transferor 20 can be at the same or similar height at their maximum height. The exchange of test devices between the test tray and the user tray is performed when the positioning plates installed in the test tray transferor 30 and the user tray transferor 20 are moved upward to their maximum height. That is, after the test tray and the user tray are placed on the positioning plates and moved upward along the positioning plates, the pick-up device releases or loads the test devices.

[0065] Specifically, in front of the loading stacker 11, test devices loaded on user trays are transported to test trays. Conversely, in front of the scrap stacker 13 and the unloading stacker 12, test devices loaded on test trays are transported to user trays. After all test devices have been collected in front of the scrap stacker 13 and the unloading stacker 12, empty test trays are picked up by grippers and transferred to the positioning plate located in front of the loading stacker 11.

[0066] Intermediate feeder 40 is configured to move the test disc along a linear path. For example, intermediate feeder 40 may be configured to use various conventionally known drive mechanisms such as conveyors or robotic arms to move the test disc along a linear path. Specifically, one intermediate feeder 40 may be installed between the soaking chamber 51 and the test disc transferor 30, and another intermediate feeder 40 may be installed between the desoaking chamber 53 and the test disc transferor 30.

[0067] An intermediate feeder 40, installed between the soaking chamber 51 and the test tray transferor 30, retrieves the test tray prepared at the positioning plate and transfers it to the soaking chamber 51. Hereinafter, the area between the soaking chamber 51 and the test tray transferor 30 is referred to as the chamber loading area.

[0068] On the other hand, the intermediate feeder 40, installed between the desoaking chamber 53 and the test plate transferor 30, retrieves the test plate that has been cooled in the desoaking chamber and transfers it to the test plate transferor 30. Hereinafter, the area between the desoaking chamber 53 and the test plate transferor 30 is referred to as the chamber unloading area.

[0069] Immersion chamber 51 is a chamber used to slowly preheat the test tray to prepare the environment for test chamber 52. In contrast, de-immersion chamber 53 is a chamber where the test tray is slowly cooled to match the external temperature before being released to the outside. Test chamber 52, on the other hand, has an internal temperature set to the temperature required for installation testing and includes a tester on which the test tray is mounted. The tester has multiple interfaces electrically connected to each test device in close contact with the test tray. The tester evaluates the functionality of the test device by exchanging electrical signals with the test device via the interfaces.

[0070] The movement of the test disc between the soaking chamber 51, the test chamber 52, and the desoaking chamber 53 can be achieved using various conventionally known configurations. As an example, in the respective regions, the test disc can be moved by being pulled by a retainer that moves along the actuator. Here, the retainer can refer to a component configured to hold the test disc.

[0071] Summarizing the above description from the perspective of the test tray transport path PT2, the test tray initially awaits the positioning plate located in front of the loading stacker 11 in an empty state. Subsequently, when a user tray is loaded, the picker operates to collect new test devices from the user tray and transport them to the empty test tray. When the test tray is fully loaded, the intermediate feeder 40 operates to transfer the test tray to the soaking chamber 51. Subsequently, the test tray moves sequentially through the soaking chamber 51, the test chamber 52, and the desoaking chamber 53, undergoing preheating, testing, and heat removal processes in sequence. When cooling is completed in the desoaking chamber 53, the test tray is transferred back to the test tray transferor 30 by the intermediate feeder 40. When the test tray is loaded onto the positioning plate located in front of the unloading stacker 12, the picker retrieves the test devices from the test tray and transports them to the user tray. When the picker has retrieved all the test devices from the test tray, the empty test tray is moved back to the positioning plate located in front of the loading stacker. This process can be repeated until all test devices to be tested have been transferred to the tester.

[0072] In the following text, reference will be made to Figures 2 to 4 This describes a test device to be transported by a transport system according to an embodiment of the present disclosure.

[0073] Figure 2 This is a conceptual view illustrating a test device to be transported by a transport system according to an embodiment of this disclosure. In this respect, Figure 3 This is a conceptual view showing one side of a test device on which a contact portion is formed. Furthermore, Figure 4 It is a conceptual view showing a test device placed in a horizontal orientation, viewed from the side.

[0074] Reference Figure 2 , Figure 3 and Figure 4According to this disclosure, the test device D can be formed with a plate B as a basic frame, the plate B having a shape substantially similar to a thin plate. Components mounted in the test device D can be located on one side of the plate B, and terminals D3 can be formed on the opposite side of the plate B. In this case, the components mounted on the side of the test device D include a semiconductor chip D1 and an element D2. Furthermore, in this case, terminal D3 can be the end of a signal path electrically connected to the semiconductor chip D1 and / or the element D2.

[0075] As an example, the test device D can be an SO-CAMM or similar memory module, and the semiconductor chip D1 can be a memory chip. More specifically, the semiconductor chip D1 can be DRAM or another similar RAM. Furthermore, for example, element D2 can be various components required for the memory module, including active components such as various transistors and diodes and / or passive components such as inductors, resistors, and capacitors. Terminal D3 can be formed as a type of device known in the art for electrical contact, such as a TSV or BGA. During installation testing, terminal D3 serves as a contact for the interface electrically connected to the tester.

[0076] In test device D, the portions where semiconductor chips D1 to components D2 are mounted correspond to portions that are difficult for automated equipment to access and handle. This is because semiconductor chips D1 to components D2 may be damaged when the automated equipment moves or supports test device D by touching such portions. For ease of description, in the following text, the portions of board B where semiconductor chips D1 to components D2 are mounted and therefore difficult for the equipment to access are referred to as inaccessible portions, and the portions where semiconductor chips D1 to components D2 are not present and therefore easily accessible are referred to as accessible portions.

[0077] like Figure 2 and Figure 3 As shown, when a hole is formed through plate B, since semiconductor chip D1 or element D2 does not exist within it, the through portion PP surrounding the hole typically corresponds to the accessible portion. Additionally, refer to... Figure 2 and Figure 4 Since semiconductor chip D1 or component D2 is not present, both ends of board B typically correspond to accessible portions. In this case, due to the dense mounting of semiconductor chip D1 and component D2, the allowable space P2 at both ends of the side of board B where terminal D3 is mounted is wider than the allowable space P1 at both ends of the side where semiconductor chip D1 and component D2 are mounted.

[0078] Considering the structural characteristics of the test device D as described above, when transporting the test device D in an upright position, a method of securing the test device D by maintaining small accessible portions at both ends of the test device D can be considered. However, as the allowable spaces P1 and P2 (especially portion P1) at both ends of the test device D become increasingly narrow, it becomes increasingly difficult to properly secure the test device D in this way. In particular, due to manufacturing tolerances, there are test devices with allowable spaces P1 and P2 that are narrower than designed, and in such cases, there is a higher probability that the test device D cannot be properly secured to the device.

[0079] In this context, this disclosure proposes a transport system that focuses on the characteristic that the allowable space P2 of the portion in which the terminal D3 is mounted is wider than the allowable space P1 on the opposite side, enabling the horizontal loading and transport of the test device D.

[0080] Based on the foregoing description, a test pallet used as one type of pallet in a transport system according to embodiments of this disclosure will be described below. Figure 5 This is a view showing a test disk according to an embodiment of the present disclosure.

[0081] like Figure 5 As shown, the test disk 100 according to an embodiment of the present disclosure is configured such that a plurality of inserts 120 are mounted on the disk body 110.

[0082] The disc body 110 is shaped to be placed on a tester. For example, the disc body 110 may be configured such that a plurality of recesses (hereinafter referred to as mounting recesses) are formed through the bottom surface of a box-shaped member having a substantially open top surface. In this case, each mounting recess is formed to correspond to the position of each interface formed on the upper surface of the tester. Here, a mounting recess refers to a recess into which the insert 120 is inserted. The mounting recess may be formed with a cross-section slightly larger than that of the insert 120. When mounted on the disc body 110, the insert 120 is able to move due to the gap with the mounting recess.

[0083] Each insert 120 is configured to load a test device. In this case, the insert 120 is configured to load the test device in a horizontal orientation. Here, horizontal orientation means that the test device is placed in an orientation that minimizes its height. Meanwhile, although... Figure 5 The example shows insert 120 mounted on disk body 110 in a 2-row, 8-column configuration, but the test disk 100 according to this disclosure is not necessarily limited to this configuration. Figure 5 The embodiment shown illustrates this. In other words, the number of inserts 120 mounted on the disk body 110 can be changed as needed based on the number of interfaces on the tester.

[0084] On the other hand, although not shown, the user disk is also configured to load the test device in a horizontal orientation, similar to test disk 100. However, since the user disk is not configured for mounting on the tester, it would be sufficient if the user disk were simply configured to load the test device in a horizontal orientation, omitting insert 120 and mounting recess.

[0085] In the following text, reference will be made to Figure 6 The insert 120 according to an embodiment of the present disclosure is described below. Figure 6 This is a view illustrating an insert according to an embodiment of the present disclosure. Figure 6 As shown, the insert 120 according to an embodiment of the present disclosure includes an insert body 121 and a fixing member 123.

[0086] The insert body 121 is shaped to be inserted into and mounted into the mounting recess of the test tray. Furthermore, a loading space is formed in the central portion of the insert body 121, in which a horizontally positioned test device is loaded. In this configuration, the loading space is open at the bottom. This is to ensure that the interface and the test device come into contact with each other when the test tray is placed on the tester.

[0087] A pair of fixing members 123 are arranged facing each other, and the loading space of the insert body 121 is located at the center. Furthermore, each fixing member 123 is connected to the insert body 121 to enable reciprocating motion. An elastic member may be provided between each fixing member 123 and the insert body 121, such that the fixing member 123 protrudes as far as possible toward the loading space without external force. As an example, the elastic member may be provided as a conventionally widely known spring, such as a coil spring. When the test device is placed in the loading space, the pair of fixing members 123 push the test device from both sides to secure it within the loading space.

[0088] In this configuration, to switch a pair of retaining members 123 to an open state during the process of placing the test device within the loading space, the pickup may include an opener for opening the retaining members. For example, the opener may be configured to open the pair of retaining members 123 by including a pair of inclined surfaces that push the pair of retaining members away from each other in a direction as the pickup moves downward.

[0089] In the following text, reference will be made to Figures 7 to 13 The loading status inspector 201 according to the first embodiment is described below, which may be included in the transport system according to embodiments of the present disclosure. First, Figure 7 This is a block diagram of a loading status checker according to a first embodiment of the present disclosure.

[0090] The loading status checker 201 checks the loading status of the test device based on the attitude difference between the normal and abnormal states of the test device. In this case, the normal state is when the test device is loaded in the insert with a horizontal attitude, and the abnormal state is when the test device is loaded in the insert with an attitude other than horizontal.

[0091] refer to Figure 7 The loading status checker 201 may include multiple cameras 210 and image processors 220. In this case, although Figure 7 An example is shown in which the loading status inspector 201 includes two cameras 210, but the number of cameras 210 can be varied in various ways to take into account the shape of the test disk and the processing performance of the image processor 220.

[0092] Each camera 210 can be mounted to photograph a corresponding insert in the insert. For example, camera 210 can be mounted on intermediate feeder 40 located in the chamber loading area (see...). Figure 1 Above, to capture images transferred from the intermediate feeder 40 to the soaking chamber 51 (see above) Figure 1 The test disc is a device that moves as the test disc moves. Therefore, as the test disc moves, each camera 210 captures an image from above of the corresponding insert and the test device mounted therein. In the following text, the image captured by the camera 210 is referred to as the test image.

[0093] Image processor 220 is configured to inspect the loading status of a test device using an inspection image. For example, image processor 220 may be provided as an algorithm configured to perform such a task, a program including such an algorithm, a recording medium for non-transitory recording of such an algorithm or program, or an information processing device configured to execute such an algorithm or program. A detailed method for image processor 220 to inspect the loading status of a test device using an inspection image will be described later.

[0094] In the following text, reference will be made to Figure 8 To describe the installation configuration of the loading status inspector 201. Figure 8 This is a diagram showing the state of a test device mounted on a test tray, as captured by a loading status inspector according to a first embodiment of the present disclosure.

[0095] refer to Figure 8 The loading status inspector 201 includes a mounting frame 212 supporting multiple cameras 210 along the movement path of the test disc 100. The mounting frame 212 can be provided as a substantially linear plate-shaped member fixed to the space above the intermediate feeder.

[0096] The number of cameras 210 is set to correspond to the number of columns of inserts 120 mounted on the test disk 100. For example, in Figure 8In this configuration, the inserts 120 of the test disk 100 are arranged in two columns, and correspondingly, two cameras 210 are provided. In this case, the test disk 100 moves along a direction parallel to the columns of the inserts 120. For ease of description, the path along which the test disk is transported is referred to hereinafter as the transport path.

[0097] Each camera 210 is mounted above a column of inserts 120 that moves along the transport path. Thus, as a column of inserts 120 moves along the transport path, it passes through the space beneath the camera 210 responsible for its respective column. As the test tray 100 traverses the transport path, each camera 210 sequentially photographs the inserts 120 of its assigned column. That is, the cameras 210 selectively photograph the test devices mounted on the test tray 100 for each column.

[0098] Specifically, camera 210 may include a first camera 211 and a second camera 213. The first camera 211 and the second camera 213 are mounted to capture images of different areas of a single insert 120 and are configured to transmit the captured inspection images to an image processor via wired or wireless means. Additionally, the first camera 211 and the second camera 213 may each be fixed to a mounting frame 212 so as to face the insert 120 passing beneath it.

[0099] The positions of the first camera 211 and the second camera 213 can be configured to photograph different fixing members in the insert located below each camera. That is, the first camera 211 and the second camera 213 can selectively photograph a pair of fixing members of a single insert. For this purpose, the first camera 211 is mounted directly above the fixing member on one side of the insert 120 as it moves along the transport path. In contrast, the second camera 213 is mounted directly above the fixing member on the other side. Each of the first camera 211 and the second camera 213 can focus on the fixing member passing below.

[0100] On the other hand, the first camera 211 and the second camera 213 can be configured to capture inspection images at each preset shooting time point according to the movement time of the test disc 100. In this case, the interval between shooting time points can be set to the time required for the next insert 120 to reach the lower part of the first camera 211 and the lower part of the second camera 213 after the inspection image of the previous insert 120 has been captured.

[0101] Alternatively, the first camera 211 and the second camera 213 can be configured to capture images of the insert 120 based on control signals from the controller. As an example, the controller can be set to transmit control signals to the first camera 211 and the second camera 213 whenever a sensor installed to identify the insert detects it. As another example, the controller can transmit control signals to the first camera 211 and the second camera 213 based on user input.

[0102] In the foregoing examples, the description is based on an example including a first camera 211 and a second camera 213, but this disclosure is not necessarily limited to such embodiments. For example, camera 210 may be configured to use a single camera to capture the test device and insert 120 as a whole. However, for ease of description, the following will be described based on an embodiment including a first camera 211 and a second camera 213.

[0103] Continue to refer to Figure 9 The description, Figure 9 This is a view showing the insert as viewed from the position of a camera set according to an embodiment of this disclosure. (e.g.) Figure 9 As shown, the test device D, passing beneath the camera, is positioned between a pair of fixed members 123. In this state, the test device D is aligned with the center portion of the insert body 121.

[0104] If the test device D is secured by the fixing member 123 in its normal state, the contact portion and interface of the test device D will align and contact each other when the insert body 121 is subsequently placed on the tester. Conversely, if the test device D is in an abnormal state, the contact portion of the test device D may be misaligned with the interface or tilted in one direction when the insert body 121 is placed on the tester, making it difficult to perform tests on the test device D. Therefore, to ensure the reliability of the test, it is necessary to identify test devices D in an abnormal state before transferring them to the tester.

[0105] In the following text, reference will be made to Figures 10 to 13 The description focuses on the shape differences appearing in the inspection images due to the attitude differences of the test device between normal and abnormal states. In this case, to clearly show the fixed member 123 and the test device D, [the following text is missing]. Figure 10 and Figure 12 Only the portion of the insert body 121 directly connected to the fixing member 123 is shown in the diagram, and the rest of the portion is omitted.

[0106] First, refer to Figure 10 and Figure 11 To describe the normal state. Figure 10 This is a simplified view illustrating the state in which the test device according to an embodiment of the present disclosure is fixed to the fixing member in a normal condition. In this respect, Figure 11 It is shown in Figure 10 The view shown is of the fixed component on the left, viewed from above, in the state shown.

[0107] Reference Figure 10 and Figure 11 The test device D, fixed in a normal orientation, is parallel to a straight line L1 that extends through the ends 1231 of a pair of facing fixing members 123. Specifically, the long side of the test device D is parallel to the straight line L1. Furthermore, in the normal state, the lower portions of the ends 1231 of the pair of fixing members 123 are in close contact with the side surfaces of the test device D. The pair of ends 1231 press the test device D against each other from opposite sides to fix its position.

[0108] In this configuration, the upper portion of the end portion 1231 protrudes from above the lower portion, which is in close contact with the side surface, toward the opposing fixing member. Due to this shape, the upper portion of the end portion 1231 overlaps with the upper surface of the test device D, which is fixed in its normal state. Therefore, in the inspection image captured by photographing the test device D loaded in its normal state, the shape of the end portion 1231 covering the upper surface of the test device D is inspected.

[0109] Therefore, when the end portion 1231 of the fixture 123 is captured and overlaps with the test device D in the captured inspection image, the image processor verifies that the test device D is in a normal state. The method of verifying whether the end portion 1231 overlaps with the upper surface of the test device D can be achieved by utilizing various conventionally known image analysis techniques.

[0110] For example, the image processor can be configured to use an algorithm trained to detect objects on an inspection image to distinguish between the fixed member 123 and the test device D, and to determine whether the fixed member 123 is located above the test device D.

[0111] As another example, the image processor can be configured to distinguish between the fixed member 123 and the test device D based on preset RGB pixel values, and extract the contours of the fixed member 123 and the test device D to determine whether the fixed member 123 is above the test device D. For example, when the short side of the test device D in the identified contour bends along the contour of the end portion 1231, the image processor can determine that the fixed member 123 is above the test device D.

[0112] The following will refer to Figure 12 and Figure 13 To describe abnormal states. Figure 12 This is a simplified view illustrating the state of the test device according to an embodiment of the present disclosure, fixed to a fixing member under abnormal conditions. In this respect, Figure 13 It is shown in Figure 12The view shown is of the fixed component on the left, viewed from above, in the state shown.

[0113] Reference Figure 12 and Figure 13 The test device D, fixed in an abnormal posture, can have an orientation that intersects with a straight line L1 extending across the end portions 1231 of a pair of facing fixed members 123. Specifically, the test device D in an abnormal state can be tilted such that its long side intersects the straight line L1.

[0114] In an abnormal state, due to the tilt of the test device D, only one side (hereinafter referred to as the normal contact side) of the fixing member 123 is in close contact with the side surface of the test device D, while the fixing member 123 on the other side (hereinafter referred to as the abnormal contact side) may not be in close contact with the side surface of the test device D. Due to this tilt, the test device D is positioned above the end portion 1231 of the fixing member 123 on the abnormal contact side. Therefore, in the inspection image captured by photographing the test device D in an abnormal state, the end portion 1231 of the fixing member 123 on the abnormal contact side is hidden by the test device D and is not visible.

[0115] Therefore, if the test device D detected in the inspection image is identified as being located above the fixed member 123, the image processor determines that the test device D is in an abnormal state. For example, as described above, the image processor can identify the arrangement state of the test device D and the fixed member 123 by detecting objects in the inspection image, or it can check whether the test device D is located above the fixed member 123 based on the contour shape of the short side of the test device D. In the case of checking the arrangement state using the contour shape of the short side, if the contour of the short side of the test device D is identified as a straight line, the image processor determines that the test device D is in an abnormal state.

[0116] If test device D is detected as being in an abnormal state, the image processor outputs an alarm signal and transmits it to the intermediate feeder or the controller that controls the intermediate feeder. Upon receiving the alarm signal, the intermediate feeder can stop its operation and wait without transferring the test tray to the immersion chamber. The system can then be restarted after the test tray is retrieved by the user or a separate automated device, or after the abnormal test device D is corrected to the appropriate orientation.

[0117] In the above description, the example in which the image processor examines normal and abnormal states by recognizing the vertical arrangement of the test device D and the end portion 1231 is used as a basis, but this disclosure is not necessarily limited to this embodiment. For example, the image processor may examine the loading state of the test device based on the shape of the overall outline of the test device shown in the inspection image.

[0118] Specifically, as described above, the main difference between the normal and abnormal states of test device D lies in the tilt of test device D. Therefore, when viewed from above, test device D in its normal state has a roughly rectangular outline, while test device D in its abnormal state has a roughly trapezoidal outline. Using this, the image processor can identify the outline of the long side of test device D from the inspection image and then distinguish between the normal and abnormal states based on the extracted shape of the long side outline. Specifically, if the outline of the long side of test device D is parallel to the straight line L1 or the central axis of the insert extending along the width direction, the image processor can verify that test device D is in its normal state; otherwise, it is verified as an abnormal state.

[0119] Based on the above description, the following text will refer to Figures 14 to 20 The loading status inspector 202 according to a second embodiment of the present disclosure will be described. In this case, the loading status inspector according to the first embodiment and the loading status inspector according to the second embodiment are not in an exclusive relationship requiring only one of them to be selected and installed in a single transport system. That is, a single transport system may include both the loading status inspector according to the first embodiment and the loading status inspector according to the second embodiment.

[0120] Continue to refer to Figure 14 The description, Figure 14 This is a block diagram of a loading status checker according to a second embodiment of the present disclosure. Figure 14 As shown, the loading status inspector 202 according to the second embodiment may include a distance measurement sensor 230 and a distance information processor 240.

[0121] The distance information processor 240 is configured to check the loading status of the test device using distance information measured by the distance measurement sensor 230. For example, the distance information processor 240 may be an algorithm configured to perform such a task, a program including such an algorithm, a recording medium in which such an algorithm or program is non-transitoryly recorded, or an information processing device configured to execute such an algorithm or program. A detailed method for the distance information processor 240 to check the loading status of the test device using distance information will be described later.

[0122] Distance measurement sensor 230 is connected to a pickup of the test device and is configured to measure the distance to the surface of the test device located below the pickup. For example, distance measurement sensor 230 can be configured using various conventionally known distance measurement sensors capable of measuring distance in a non-contact manner. For example, infrared distance measurement sensors, laser distance measurement sensors, ultrasonic distance measurement sensors, etc., can be used to configure distance measurement sensor 230. Upon receiving a control signal from the controller, distance measurement sensor 230 measures the distance to the surface of the test device and is configured to transmit the measured distance information to distance information processor 240 using wired or wireless communication.

[0123] On the other hand, the distance measurement sensor 230 may include a first distance measurement sensor 231 and a second distance measurement sensor 232. The first distance measurement sensor 231 is configured to measure the distance to a first point on the test device, and the second distance measurement sensor 232 is configured to measure the distance to a second point on the test device that is different from the first point. For example, the first distance measurement sensor 231 and the second distance measurement sensor 232 may be installed in different locations to measure the distance to different points.

[0124] In the following text, reference will be made to Figure 15 Here is a description of an installation example for the distance measurement sensor 230. Figure 15 This is a view showing a pickup and a distance measurement sensor mounted on the pickup according to an embodiment of the present disclosure.

[0125] refer to Figure 15 The pickup 300 may include a pickup body 320 forming an integral frame, and a plurality of suction modules 310 mounted on the lower end of the pickup body 320. Each suction module 310 is configured to use negative pressure to pick up objects. The plurality of suction modules 310 may be arranged at predetermined intervals on the bottom surface of the pickup body 320 along the width direction of the pickup body 320.

[0126] As an example, the suction module 310 may include a substantially cylindrical body and a suction pad formed of an elastic material and attached to the lower end of the body. In this case, a suction flow path for transmitting negative pressure generated from an external negative pressure source may be formed along a central axis through the body. In contrast, the suction pad may have an annular shape attached to the bottom surface of the body around the suction flow path. Additionally, the suction pad may extend downwards in the radial direction, such that its overall shape resembles an inverted cup.

[0127] When negative pressure is applied to the suction flow path and the suction module 310 is in close contact with the test device, the suction pad deforms due to the pressure difference between the inside and outside of the body, thus adhering to the test device. Subsequently, as the pickup body 320 moves, the test device moves together with the suction module 310, and is simultaneously transferred through the negative pressure of the body to maintain close contact between them.

[0128] On the other hand, the first distance measurement sensor 231 and the second distance measurement sensor 232 can be connected to different sides of the pickup body 320, with the pickup body 320 inserted therebetween. That is, the first distance measurement sensor 231 and the second distance measurement sensor 232 can be mounted on opposite sides of the pickup body 320 along its width direction. Furthermore, the first distance measurement sensor 231 and the second distance measurement sensor 232 can be configured to measure the distance to objects located below them.

[0129] In this configuration, the width of the pickup body 320 can be smaller than the width of the test device. Therefore, when picking up the test device, the test device can be exposed on both sides of the pickup body 320. The first distance measurement sensor 231 and the second distance measurement sensor 232 can measure the distance to the portions of the test device exposed on both sides of the pickup body 320. This positioning of the first distance measurement sensor 231 and the second distance measurement sensor 232 is intended to maximize the difference between the distances measured by the first distance measurement sensor 231 and the second distance measurement sensor 232 when the test device is tilted.

[0130] In the following text, reference will be made to Figure 16 and Figure 17 Here is a usage example of the loading status checker according to the second embodiment. Figure 16 This is a schematic view illustrating the state in which the pickup, according to an embodiment of the present disclosure, loads a test device onto a disk. In this respect, Figure 17 yes Figure 16 A magnified view of region AA.

[0131] Figure 16 The disk 101 shown can be a user disk or a test disk. Additionally, depending on the type of disk 101, the transferor 102 can be referred to as a test disk transferor or a user disk transferor.

[0132] refer to Figure 16 and Figure 17 The pickup 300 can place the test device at each loading position PL on the disk 101. In this case, although Figure 16 A cover (without reference numerals) is shown attached to disk 101 to cover the test device located at loading position PL, but the cover may be omitted.

[0133] For example, if disk 101 is a test disk, the loading position PL can correspond to the internal space of the insert. In this case, pick-up 300 can pick up the test device to be tested from the user disk and load it into the loading position PL of disk 101 (i.e., the test disk).

[0134] As another example, if disk 101 is a user disk, the loading position PL can be the internal space of a recess formed in the user disk to receive the test device. In this case, pick-up 300 can pick up the completed test device from the test disk and load it into the loading position PL of disk 101 (i.e., the user disk).

[0135] On the other hand, the first distance measuring sensor 231 and the second distance measuring sensor 232 can be configured to measure the distance to the test device when the pickup 300 moves upward a predetermined height after placing the test device at the loading position PL. For example, this predetermined height can be set by the user through prior experimentation. The upward movement of the pickup 300 can be implemented by setting the time it takes for the pickup 300 to move upward after the negative pressure of the suction module 310 is removed. When the negative pressure of the suction module 310 is removed, the pickup body 320 moves upward vertically relative to the loading position PL. During this process, the suction module 310, whose negative pressure has been removed, separates from the test device.

[0136] In the following text, reference will be made to Figure 18 and Figure 20 This describes a method for inspecting the loading status of a test device using a distance measurement sensor 230. Figure 18 This is a view showing the state in which the pickup is aligned above the insert to load the test device, according to an embodiment of the present disclosure. Figure 19 It is shown Figure 18 The view shows the state of the pickup moving downwards to load the test device into the insert. Finally, Figure 20 It is shown Figure 19 A view of the pickup moving upwards to a predetermined height after the test device has been placed.

[0137] in this case, Figure 18 and Figure 20 The process of loading the test device D into the insert 120 of the test disk is shown, but the placement of the test device D can be performed similarly for the user disk. Additionally, in Figure 18 and Figure 20 In, such as in Figure 10 and Figure 12 In the diagram, only the portion of the insert body 121 directly connected to the fixing member 123 is shown, and the remaining portions are omitted to clearly show the fixing member 123 and the test device D.

[0138] Reference Figure 18 First, after picking up the test device D, the pickup 300 is aligned with the central axis of the pickup body 320 and the central axis of the insert body 121. In this state, the test device D is vertically aligned with the space formed between a pair of fixed members 123.

[0139] After that, as Figure 19 As shown, when the pickup body 320 moves downward, a pair of retaining members 123 move apart in opposite directions, and the test device D enters between the retaining members 123. Specifically, the test device D contacts the end portion 1231 during the downward movement (see Figure 1231). Figure 10 and Figure 12 In this situation, due to the inclined shape of the upper end of the end portion 1231, the pushing force applied by the test device D acts on the fixing member 123 in the direction toward the insert body 121. As a result, the pair of fixing members 123 overcome the elastic force of the elastic member and move toward the insert body 121. In this state, the pair of fixing members 123 push the test device D from both sides by the restoring force of the elastic member.

[0140] refer to Figure 20 After the test device D is placed, the pickup 300 moves upward again to a predetermined height. In this state, the first distance measuring sensor 231 and the second distance measuring sensor 232 measure the distance to the test device D, respectively. Specifically, the first distance measuring sensor 231 measures the distance H1 to the test device D located directly below it, and the second distance measuring sensor 232 measures the distance H2 to the test device D located directly below it.

[0141] Subsequently, the distance information processor compares the distance H1 measured by the first distance measurement sensor 231 with the distance H2 measured by the second distance measurement sensor 232. If the difference between the measured distances H1 and H2 exceeds a preset range, the distance information processor checks that the test device D is in an abnormal state. In this case, the preset range is pre-set, taking into account the design tolerances of the test device D.

[0142] Specifically, refer to Figure 10 and Figure 12 Under normal conditions, since the test device D is substantially parallel to the straight line L1, the difference between the distance H1 measured by the first distance measuring sensor 231 and the distance H2 measured by the second distance measuring sensor 232 is expected to be within the same or similar range as the design tolerance range of the test device D. Therefore, if the difference between the distance H1 measured by the first distance measuring sensor 231 and the distance H2 measured by the second distance measuring sensor 232 exceeds a preset range, it can be determined that the test device D is faulty. Figure 12The tilt is shown. Since the first distance measuring sensor 231 and the second distance measuring sensor 232 measure the distance to both ends of the test device D, even a slight tilt can be identified by maximizing the difference between the measured distances H1 and H2.

[0143] In the above description, the explanation is based on an embodiment in which, after the test device D is placed, the distance measuring sensor 230 measures the distance after the pickup 300 moves upward to a predetermined height; however, this disclosure is not necessarily limited to such an embodiment.

[0144] For example, the distance measurement sensor 230 can be configured to measure distance while the suction module 310 removes the negative pressure. Alternatively, the distance measurement sensor 230 can be configured to measure distance while the pickup 300 has already... Figure 19 The distance is measured while the object is moving downwards, even though the negative pressure has not yet been removed.

[0145] On the other hand, despite Figures 18 to 20 An example is shown in which both the first distance measuring sensor 231 and the second distance measuring sensor 232 measure the distance to the memory chip, but this disclosure is not limited to this example. For example, at least one of the first distance measuring sensor 231 and the second distance measuring sensor 232 can be installed to measure the distance to the board portion.

[0146] According to embodiments of this disclosure, at least the following effects are achieved.

[0147] Even test devices with small contact areas can be transported stably, thereby improving the automation efficiency of installation and testing.

[0148] It can quickly identify abnormally loaded test devices, thereby reducing system downtime caused by improper loading.

[0149] The effects of this disclosure are not limited to those illustrated above, and various other effects are also included in this specification.

[0150] Those skilled in the art to which this disclosure pertains will understand that this disclosure may be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, it should be understood that the above embodiments are illustrative in all respects and not restrictive. The scope of this disclosure should be defined by the appended claims rather than the foregoing description, and all changes or modifications derived from the meaning, scope, and equivalents of the appended claims should be construed as being included within the scope of this disclosure.

[0151] [Figure Labels]

[0152] 1: Test System 11: Loader Stacker

[0153] 12: Unloading stacker 13: Scrap stacker

[0154] 20: User Disk Transfer Tool; 30: Test Disk Transfer Tool

[0155] 40: Intermediate feeder; 51: Immersion chamber

[0156] 52: Test chamber; 53: Immersion chamber

[0157] 100: Test disk 101: Disk

[0158] 102: Transfer unit; 110: Disk body

[0159] 120: Insert 121: Insert Body

[0160] 123: Fixed components

[0161] 201, 202: Loading status inspector

[0162] 210: Camera 211: First Camera

[0163] 212: Mounting frame 213: Second camera

[0164] 220: Image Processor

[0165] 230: Distance Measurement Sensor

[0166] 231: First distance measurement sensor

[0167] 232: Second distance measurement sensor

[0168] 240: Distance Information Processor

[0169] 300: Pickup device; 310: Pickup module

[0170] 320: Pickup unit body

Claims

1. A test device transport system, the test device transport system being capable of inspecting the loading status, the test device transport system comprising: The test device is mounted on the disk in a horizontal orientation. A pickup is configured to load the test device onto the disk; as well as A loading status checker is configured to check the loading status of the test device based on the attitude difference between a normal state and an abnormal state, wherein in the normal state the test device is loaded on the disk in the horizontal attitude, and in the abnormal state the test device is loaded in an attitude different from the horizontal attitude.

2. The test device delivery system according to claim 1, wherein, The loading status inspector includes a camera configured to photograph the test device loaded on the disk from above.

3. The test device delivery system according to claim 1, wherein, The loading status inspector also includes an image processor configured to inspect the loading status of the test device based on inspection images captured by a camera.

4. The test device delivery system according to claim 3, wherein, The disk includes a pair of fixing members located on either side of the test device mounted on the disk to hold the test device in place. The image processor is configured to inspect the loading state of the test device using shape differences of the fixed member shown in the inspection image, wherein the shape differences of the fixed member shown in the inspection image are based on the posture differences of the test device between the normal state and the abnormal state.

5. The test device delivery system according to claim 4, wherein, When the ends of the pair of fixed components are captured and overlap with the test device in the inspection image, the image processor verifies that the test device is in the normal state.

6. The test device delivery system according to claim 3, wherein, The image processor checks the loading state of the test device based on the shape of the outline of the test device shown in the inspection image.

7. The test device delivery system according to claim 1, wherein, Multiple test devices are mounted on the disk. The loading status inspector includes multiple cameras. The plurality of cameras are mounted above the disk along its transport path, and The positions of the plurality of cameras are configured to selectively photograph the plurality of test devices mounted on the disk while the disk is being transported along the transport path.

8. The test device delivery system according to claim 1, wherein, The loading status inspector includes a distance measurement sensor connected to the pickup and configured to measure the distance to the surface of the test device located below the pickup.

9. The test device delivery system according to claim 8, wherein, The loading status checker also includes a distance information processor configured to check the loading status of the test device using distance information measured by the distance measurement sensor.

10. The test device delivery system according to claim 9, wherein, The distance measurement sensor includes: A first distance measurement sensor is configured to measure the distance to a first point on the test device; and A second distance measurement sensor is configured to measure the distance to a second point on the test device that is different from the first point.

11. The test device delivery system according to claim 10, wherein, When the difference between the distance measured by the first distance measurement sensor and the distance measured by the second distance measurement sensor exceeds a preset range, the distance information processor checks that the test device is in the abnormal state.

12. The test device delivery system according to claim 10, wherein, The first distance measurement sensor and the second distance measurement sensor are located at positions symmetrical about the pickup.

13. The test device delivery system according to claim 8, wherein, The distance measurement sensor is configured to measure the distance to the surface of the test device after the test device is placed on the disk and the pickup moves upward to a predetermined height.

Images