A fully enclosed anti-pollution chip substrate material box automatic sorting and caching intelligent warehouse

Abstract

The application provides a full-closed anti-pollution chip substrate material box automatic sorting and caching intelligent warehouse, which comprises a rack, a plurality of transfer mechanisms, a plurality of storage mechanisms, a driving mechanism and a clamping mechanism. The rack comprises a frame body, a cover body, a conveying channel and a storage space, the cover body is installed on the frame body and encloses the frame body to form the conveying channel and the storage space. The plurality of transfer mechanisms are arranged in the conveying channel; the transfer mechanism comprises a transfer trolley and a material box, the material box is installed on the transfer trolley and moves in a first direction under the driving of the transfer trolley. The plurality of storage mechanisms are arranged in the storage space; the storage mechanism comprises a storage trolley. The driving mechanism is installed on the frame body. The clamping mechanism is installed on the driving mechanism. The full-closed anti-pollution chip substrate material box automatic sorting and caching intelligent warehouse provided by the application integrates a warehousing mode and a warehouse-out mode, compared with the prior art, the use of the feeding equipment and the discharging equipment does not need to be switched, the operation is simple, and the working space is greatly saved.

Description

Technical Field

[0001] This application relates to the field of conveying equipment technology, and in particular to a fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrate boxes. Background Technology

[0002] Chip substrates serve as the intermediate bridge between bare chips and the motherboard PCB, and are a core material in chip primary packaging. After production, chip substrates are placed in transport vehicles according to their categories. For ease of management, the chip substrates in the transport vehicles need to be stored in a warehouse. During storage, loading equipment is used to load the chip substrates from the storage vehicle into different bins according to their categories. During retrieval, unloading equipment is used to remove the chip substrates from the bins. Therefore, two different sets of transport equipment are typically required for storage and retrieval, which is cumbersome, space-consuming, and inefficient. Summary of the Invention

[0003] The purpose of this application is to provide a fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrate boxes, in order to solve the technical problems of cumbersome operation, large space occupation, and low transportation efficiency in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is: to provide a fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrate boxes, comprising: A rack, comprising a frame, a cover, a conveying channel, and a storage space, wherein the cover is installed on the frame and encloses the frame to form the conveying channel and the storage space; Multiple transfer mechanisms are all located in the conveying channel; each transfer mechanism includes a transfer vehicle and a material box, the material box is installed on the transfer vehicle and moves along a first direction under the drive of the transfer vehicle; Multiple storage units are all located in the storage space; each storage unit includes a storage vehicle that can move into the storage space. A drive mechanism, which is mounted on the frame; A clamping mechanism is mounted on the driving mechanism and moves along a first direction, a second direction, or a third direction under the drive of the driving mechanism.

[0005] Optionally, the drive mechanism includes two first drivers, a second driver, and a third driver. The two first drivers are mounted on the frame and spaced apart along a first direction. The second driver is mounted on the two first drivers and moves along a second direction under the drive of the two first drivers. The third driver is mounted on the second drivers and moves along a third direction under the drive of the second drivers.

[0006] Optionally, the clamping mechanism includes a mounting frame, a fourth actuator, and a vacuum suction unit. The mounting frame is mounted on the driving mechanism, the fourth actuator is mounted on the mounting frame, and the vacuum suction unit is disposed on the fourth actuator and moves along a third direction under the drive of the fourth actuator.

[0007] Optionally, the clamping mechanism further includes a ranging sensor and a barcode scanner, both of which are mounted on the mounting bracket.

[0008] Optionally, the clamping mechanism further includes an elastic connection assembly installed between the fourth actuator and the vacuum suction unit.

[0009] Optionally, the elastic connection assembly includes a first rotating member, a second rotating member, and an elastic connector. The first rotating member is mounted on the fourth driver, the second rotating member is mounted on the first rotating member and configured to rotate relative to the fourth driver via the first rotating member, and the elastic connector is mounted between the second rotating member and the vacuum suction unit and configured to rotate relative to the first rotating member via the second rotating member. The rotation direction of the first rotating component is different from that of the second rotating component.

[0010] Optionally, the first rotating member includes a first mounting plate, a first rotating plate, and two first elastic structures. The first mounting plate is mounted on the fourth driver, the first rotating plate is hinged to the first mounting plate, and the two first elastic structures are both mounted between the first mounting plate and the first rotating plate, and abut against the first mounting plate and the second rotating plate, and are symmetrically arranged along the rotation axis of the first rotating plate.

[0011] Optionally, the second rotating member includes a second mounting plate, a second rotating plate, and two second elastic structures. The second mounting plate is mounted on the first rotating member, the second rotating plate is hinged to the second mounting plate, and the two second elastic structures are both mounted between the second mounting plate and the second rotating plate and abut against the second mounting plate and the second rotating plate, and are symmetrically arranged along the rotation axis of the second rotating plate.

[0012] Optionally, the elastic connector includes a plurality of limiting rods, a third mounting plate, and a plurality of third elastic structures. The plurality of limiting rods are all inserted through the second rotating plate. The third mounting plate is installed on the plurality of limiting rods and is located at the end of the limiting rods away from the second rotating plate. The plurality of third elastic structures are respectively sleeved on the plurality of limiting rods and abut against the second rotating plate and the third mounting plate.

[0013] Optionally, the storage mechanism further includes an electromagnet mounted on the frame and located within the storage space.

[0014] The beneficial effects of the fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrate boxes provided in this application are as follows: This application provides a fully enclosed, anti-pollution, automated sorting and buffering intelligent warehouse for chip substrates, integrating inbound and outbound modes. Compared to existing technologies, it eliminates the need to switch between loading and unloading equipment, simplifying operation and significantly saving operating space. The conveyor channel and storage space effectively separate the transfer vehicle and storage vehicle, preventing interference and ensuring stable transport. Furthermore, both the conveyor channel and storage space are located within a enclosure, which encloses the rack to form a relatively closed space, thus effectively blocking dust from the external environment during inbound and outbound processes. Compared to existing technologies that directly transport chip substrates in an exposed environment, this relatively enclosed environment prevents dust adhering to the chip substrates from affecting subsequent processing. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A three-dimensional view of the overall structure of an automated sorting and buffering intelligent warehouse for fully enclosed, pollution-proof chip substrate boxes provided in Embodiment 1 of this application; Figure 2 A perspective view, excluding the enclosure, of a fully enclosed, pollution-proof, automated sorting and buffering intelligent bin for chip substrates provided in Embodiment 1 of this application; Figure 3 A perspective view of a fully enclosed, pollution-proof, automated sorting and buffering smart warehouse for chip substrate boxes provided in Embodiment 1 of this application, excluding the enclosure, transfer mechanism, and storage vehicle; Figure 4 A perspective view of a clamping mechanism for an automated sorting and buffering intelligent bin for a fully enclosed, pollution-proof chip substrate cassette, provided in Embodiment 1 of this application; Figure 5 This is a perspective view of a clamping mechanism for an automated sorting and buffering intelligent bin for a fully enclosed, pollution-proof chip substrate material box, provided in Embodiment 2 of this application.

[0017] The following are the labeling elements in the figure: 1. Frame; 11. Frame body; 12. Cover; 13. Conveyor channel; 14. Storage space; 15. Placement plate; 2. Transfer mechanism; 21. Transfer vehicle; 22. Material bin; 23. Lifter; 3. Storage mechanism; 31. Storage vehicle; 32. Electromagnet; 4. Drive mechanism; 41. First driver; 42. Second driver; 43. Third driver; 5. Clamping mechanism; 51. Mounting bracket; 52. Fourth driver; 53. Vacuum suction unit; 54. Distance sensor; 55. Barcode scanner; 56. Elastic connection assembly; 561. First rotating component; 5611. First mounting plate; 5612. First rotating plate; 5613. First elastic structure; 562. Second rotating component; 5621. Second mounting plate; 5622. Second rotating plate; 5623. Second elastic structure; 563. Elastic connection component; 5631. Limiting rod; 5632. Third mounting plate; 5633. Third elastic structure; 5634. Limiting block. Detailed Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0019] It should be noted that when a component is referred to as being "mounted to," "fixed to," or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] Example 1 like Figures 1 to 4 As shown, this application provides a fully enclosed, anti-contamination chip substrate cassette automated sorting and buffering intelligent warehouse, including a frame 1, multiple transfer mechanisms 2, multiple storage mechanisms 3, a drive mechanism 4, and a clamping mechanism 5. The frame 1 includes a frame body 11, a cover 12, a conveying channel 13, and a storage space 14. The cover 12 is installed on the frame body 11 and encloses the frame body 11 to form the conveying channel 13 and the storage space 14. Multiple transfer mechanisms 2 are all disposed in the conveying channel 13; each transfer mechanism 2 includes a transfer cart 21 and a cassette 22. The cassette 22 is installed on the transfer cart 21 and moves along a first direction under the drive of the transfer cart 21. Multiple storage mechanisms 3 are all disposed in the storage space 14; each storage mechanism 3 includes a storage cart 31, which can move into the storage space 14. The drive mechanism 4 is installed on the frame body 11. The clamping mechanism 5 is installed on the drive mechanism 4 and moves along a first direction, a second direction, or a third direction under the drive of the drive mechanism 4.

[0023] It should be noted that the first direction above and below refers to the bidirectional direction along its axis, specifically as follows: Figure 2 The X-axis is shown in the diagram. The second direction, above and below, refers to the bidirectional direction along its axis, specifically as shown in the diagram. Figure 2 The Y-axis is shown in the diagram. The third direction above and below refers to the bidirectional direction along its axis, specifically as shown in the diagram. Figure 2 The Z-axis is shown in the figure.

[0024] This application provides a fully enclosed, anti-pollution, automated sorting and buffering intelligent warehouse for chip substrate boxes, integrating inbound and outbound modes. Compared to existing technologies, it eliminates the need to switch between loading and unloading equipment, simplifying operation and significantly saving operating space. The conveyor channel 13 and storage space 14 effectively separate the transfer cart 21 and storage cart 31, preventing interference and ensuring stable transport. Furthermore, both the conveyor channel 13 and storage space 14 are located within a cover 12. The cover 12 encloses the frame 11, forming a relatively enclosed space that also contains the conveyor channel 13 and storage space 14. This effectively blocks dust from the external environment during inbound and outbound processes. Compared to existing technologies that directly transport chip substrates in an exposed environment, this relatively enclosed environment prevents dust adhering to the chip substrates from affecting subsequent processing.

[0025] Optionally, the transfer mechanism 2 also includes a lifter 23, which is installed between the transfer vehicle 21 and the material box 22 and is used to drive the material box 22 to move in a third direction.

[0026] With this configuration, the lifting device 23 can be used to lift the material box 22, thus preventing the vacuum suction device 53 from being unable to adsorb the chip substrate if the material box 22 is too low in the third-party upward position.

[0027] In one embodiment of this application, please refer to 1 to Figure 4 The drive mechanism 4 includes two first drivers 41, a second driver 42 and a third driver 43. The two first drivers 41 are mounted on the frame 11 and are spaced apart along the first direction. The second driver 42 is mounted on the two first drivers 41 and moves along the second direction under the drive of the two first drivers 41. The third driver 43 is mounted on the second driver 42 and moves along the third direction under the drive of the second driver 42.

[0028] With this configuration, the clamping mechanism 5 can be driven to move along the second direction under the action of the first driver 41; it can be driven to move along the first direction under the action of the second driver 42; and it can be driven to move along the third direction under the action of the third driver 43. Under the combined action of the first driver 41, the second driver 42, and the third driver 43, the clamping mechanism 5 can be driven to align with different positions, realizing fully automatic delivery of chip substrates. It has a high degree of automation, is easy to use, and has high delivery efficiency.

[0029] In one embodiment of this application, please refer to the following: Figures 1 to 4 The clamping mechanism 5 includes a mounting frame 51, a fourth driver 52, and a vacuum suction device 53. The mounting frame 51 is mounted on the driving mechanism 4, the fourth driver 52 is mounted on the mounting frame 51, and the vacuum suction device 53 is disposed on the fourth driver 52 and moves along a third direction under the drive of the fourth driver 52.

[0030] This configuration allows the vacuum suction unit 53 to move significantly along a third direction under the action of the third actuator 43, improving its moving efficiency in that direction. The fourth actuator 52 allows the vacuum suction unit 53 to move slightly along a third direction, preventing damage to the chip substrate caused by excessive movement during suction and placement, thus effectively protecting the chip substrate. The vacuum suction unit 53 is used to suction chip substrates.

[0031] In one embodiment of this application, see [reference] Figures 1 to 4 The clamping mechanism 5 also includes a ranging sensor 54 and a barcode scanner 55, both of which are mounted on the mounting bracket 51.

[0032] With this configuration, the distance sensor 54 can detect the distance between the clamping mechanism 5 and the target position, thereby enabling precise transport of the chip substrate and improving transport efficiency. The barcode scanner 55 can scan the chip substrate to record its information and complete the warehousing process.

[0033] Optionally, the rack 1 also includes a placement plate 15, which is mounted on the frame 11 and partially covers the conveying channel 13.

[0034] With this setup, the placement plate 15 can be used to temporarily store chip substrates that fail to scan, ensuring the stability of the transport process.

[0035] In one embodiment of this application, please refer to Figures 1 to 4 The storage mechanism 3 also includes an electromagnet 32, which is installed on the frame 11 and located in the storage space 14.

[0036] With this configuration, under the action of the electromagnet 32, the storage car 31 can be attracted after it moves into the storage space 14, so as to fix the storage car 31 in the storage space 14 and prevent the storage car 31 from shifting when entering and leaving the warehouse, thus ensuring the stability of the transportation.

[0037] The working principle of the fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates provided in this application is as follows: When switching to warehousing mode, the staff pushes the storage cart 31 containing the chip substrates into the storage space 14 and uses an electromagnet 32 ​​to attract and fix the storage cart 31 in the storage space 14. The drive mechanism 4 drives the clamping mechanism 5 to align with the storage cart 31, and uses a vacuum suction device 53 to attract the chip substrates. After the clamping mechanism 5 is aligned with the storage cart 31, the barcode scanner 55 scans the chip substrate and records the chip substrate information. If the scan fails, the drive mechanism 4 drives the clamping mechanism 5 to align with the placement plate 15 and places the chip substrate on the placement plate 15 for unified processing by the staff. If the scan is successful, the drive mechanism 4 drives the clamping mechanism 5 to align with the transfer cart 21 and places the chip substrate in the material bin 22. This process is repeated until the material bin 22 is full. It should be noted that multiple stacks of chip substrates are stacked in the storage cart 31, with chip substrates of the same type forming one stack, and the same material bin 22 is only used to load chip substrates of the same type. After the material bin 22 is fully loaded, the transfer vehicle 21 drives the material bin 22 to move out of the conveying channel 13 along the first direction, and another transfer vehicle 21 moves the material bin 22 into the conveying channel 13.

[0038] When switching to outbound mode, the transfer vehicle 21 moves the bin 22 containing the chip substrate into the conveying channel 13. The drive mechanism 4 drives the clamping mechanism 5 to align with the bin 22, and the chip substrate is adsorbed by the vacuum suction device 53. The drive mechanism 4 drives the clamping mechanism 5 to align with the storage vehicle 31, and the chip substrate is placed in the storage vehicle 31, completing the outbound process.

[0039] Example 2 This embodiment is basically the same as Embodiment 1, except that: in one embodiment of this application, please refer to the following. Figures 1 to 5 The clamping mechanism 5 also includes an elastic connection component 56, which is installed between the fourth driver 52 and the vacuum suction unit 53.

[0040] It should be noted that when adsorbing the chip substrate, a slight tilt is unavoidable. When the vacuum adsorber 53 adsorbs the chip substrate, a gap may easily appear between the vacuum adsorber 53 and the chip substrate, causing the chip substrate to be unable to be stably adsorbed onto the surface of the vacuum adsorber 53.

[0041] With this configuration, a flexible connection can be formed between the fourth driver 52 and the vacuum adsorber 53 under the action of the elastic connection component 56, ensuring that the vacuum adsorber 53 is stably attached to the surface of the chip substrate, avoiding the situation where there is a gap between the vacuum adsorber 53 and the chip substrate, which would prevent the chip substrate from being adsorbed onto the surface of the vacuum adsorber 53, thus ensuring the stability of the transport.

[0042] In one embodiment of this application, see [reference] Figure 1 As shown in Figure 5, the elastic connection assembly 56 includes a first rotating member 561, a second rotating member 562, and an elastic connector 563. The first rotating member 561 is mounted on the fourth actuator 52, and the second rotating member 562 is mounted on the first rotating member 561 and configured to rotate relative to the fourth actuator 52 via the first rotating member 561. The elastic connector 563 is mounted between the second rotating member 562 and the vacuum suction unit 53 and is configured to rotate relative to the first rotating member 561 via the second rotating member 562. The rotation directions of the first rotating member 561 and the second rotating member 562 are different.

[0043] With this configuration, under the action of the first rotating member 561 and the second rotating member 562, the vacuum adsorber 53 can rotate relative to the fourth driver 52 in two different directions. When adsorbing the chip substrate, the angle of the vacuum adsorber 53 can be adjusted according to the tilt angle of the chip substrate, so that the vacuum adsorber 53 can fit the chip substrate as closely as possible, ensuring the stability of adsorption and thus ensuring the stability of transport. Under the action of the elastic connector 563, a buffer can be formed between the second rotating member 562 and the vacuum adsorber 53, so that the vacuum adsorber 53 has an elastic buffer space. When adsorbing the chip substrate, it can effectively protect the chip substrate. Furthermore, the elastic connector 563 is disposed between the second rotating member 562 and the vacuum adsorber 53, and the elastic connector 563 can rotate with the vacuum adsorber 53, that is, the elastic connector 563 can directly face the chip substrate, resulting in a better buffering effect.

[0044] In one embodiment of this application, please refer to Figures 1 to 5 The first rotating component 561 includes a first mounting plate 5611, a first rotating plate 5612, and two first elastic structures 5613. The first mounting plate 5611 is mounted on the fourth driver 52. The first rotating plate 5612 is hinged to the first mounting plate 5611. The two first elastic structures 5613 are both mounted between the first mounting plate 5611 and the first rotating plate 5612, and abut against the first mounting plate 5611 and the second rotating plate 5622, and are symmetrically arranged along the rotation axis of the first rotating plate 5612.

[0045] With this configuration, the first mounting plate 5611 and the first rotating plate 5612 are hinged together, allowing the first rotating plate 5612 to rotate relative to the first mounting plate 5611, thus enabling the vacuum suction unit 53 to rotate relative to the first mounting plate 5611 in one direction. Under the action of the first elastic structure 5613, after adsorbing the chip substrate, the first rotating plate 5612 can automatically reset, facilitating the alignment of the chip substrate and thus making it easier to place.

[0046] In one embodiment of this application, please refer to the following: Figures 1 to 5 The second rotating member 562 includes a second mounting plate 5621, a second rotating plate 5622, and two second elastic structures 5623. The second mounting plate 5621 is mounted on the first rotating member 561, and the second rotating plate 5622 is hinged to the second mounting plate 5621. The two second elastic structures 5623 are both mounted between the second mounting plate 5621 and the second rotating plate 5622, and abut against the second mounting plate 5621 and the second rotating plate 5622, and are symmetrically arranged along the rotation axis of the second rotating plate 5622.

[0047] With this configuration, the second mounting plate 5621 and the second rotating plate 5622 are hinged together, allowing the second rotating plate 5622 to rotate relative to the second mounting plate 5621, thus enabling the vacuum suction unit 53 to rotate relative to the first mounting plate 5611 in another direction. Under the action of the second elastic structure 5623, after the chip substrate is suctioned, the second rotating plate 5622 can automatically reset, facilitating the alignment of the chip substrate and thus making it easier to place.

[0048] Optionally, both the first elastic structure 5613 and the second elastic structure 5623 are configured as spring sheets.

[0049] In one embodiment of this application, see [reference] Figures 1 to 5 The elastic connector 563 includes multiple limiting rods 5631, a third mounting plate 5632, and multiple third elastic structures 5633. The multiple limiting rods 5631 are all inserted through the second rotating plate 5622. The third mounting plates 5632 are all installed on the multiple limiting rods 5631 and are located at the end of the limiting rods 5631 away from the second rotating plate 5622. The multiple third elastic structures 5633 are respectively sleeved on the multiple limiting rods 5631 and abut against the second rotating plate 5622 and the third mounting plate 5632.

[0050] This configuration, under the action of the third elastic structure 5633, creates a buffer between the second rotating plate 5622 and the third mounting plate 5632, preventing the vacuum suction unit 53 from damaging the chip substrate. Under the action of the limiting rod 5631, the elastic force of the third elastic structure 5633 acts stably on the third mounting plate 5632 and the second rotating plate 5622. Furthermore, the limiting rod 5631 guides the third mounting plate 5632, helping to improve its movement stability and allowing the vacuum suction unit 53 to move stably relative to the second rotating plate 5622, ensuring stable buffering and replacement.

[0051] Optionally, the third elastic structure 5633 is configured as a spring or a sheet.

[0052] Optionally, the elastic connector 563 further includes a plurality of limiting blocks 5634, which are respectively installed on a plurality of limiting rods 5631 and are configured to correspond one-to-one with the plurality of limiting rods 5631, and are located at one end of the limiting rods 5631 near the second rotating plate 5622.

[0053] With this configuration, the limiting block 5634 can limit the limiting rod 5631, preventing it from coming off the second rotating plate 5622, which helps to improve the structural stability between the limiting rod 5631 and the second rotating plate 5622.

[0054] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrate boxes, characterized in that, include: A rack, comprising a frame, a cover, a conveying channel, and a storage space, wherein the cover is installed on the frame and encloses the frame to form the conveying channel and the storage space; Multiple transfer mechanisms are all located in the conveying channel; each transfer mechanism includes a transfer vehicle and a material box, the material box is installed on the transfer vehicle and moves along a first direction under the drive of the transfer vehicle; Multiple storage units are located within the storage space; The storage mechanism includes a storage vehicle that can be moved into the storage space; A drive mechanism, which is mounted on the frame; A clamping mechanism is mounted on the driving mechanism and moves along a first direction, a second direction, or a third direction under the drive of the driving mechanism.

2. The fully enclosed, anti-contamination chip substrate material box automated sorting and buffering intelligent warehouse as described in claim 1, characterized in that, The drive mechanism includes two first drivers, a second driver, and a third driver. The two first drivers are mounted on the frame and are spaced apart along a first direction. The second driver is mounted on the two first drivers and moves along a second direction under the drive of the two first drivers. The third driver is mounted on the second drivers and moves along a third direction under the drive of the second drivers.

3. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 1, characterized in that, The clamping mechanism includes a mounting frame, a fourth actuator, and a vacuum suction unit. The mounting frame is mounted on the driving mechanism, the fourth actuator is mounted on the mounting frame, and the vacuum suction unit is disposed on the fourth actuator and moves along a third direction under the drive of the fourth actuator.

4. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 3, characterized in that, The clamping mechanism also includes a distance sensor and a barcode scanner, both of which are mounted on the mounting frame.

5. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 3, characterized in that, The clamping mechanism further includes an elastic connection component, which is installed between the fourth driver and the vacuum suction unit.

6. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 5, characterized in that, The elastic connection assembly includes a first rotating member, a second rotating member, and an elastic connection member. The first rotating member is mounted on the fourth driver, the second rotating member is mounted on the first rotating member and configured to rotate relative to the fourth driver via the first rotating member, and the elastic connection member is mounted between the second rotating member and the vacuum suction unit and configured to rotate relative to the first rotating member via the second rotating member. The rotation direction of the first rotating component is different from that of the second rotating component.

7. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 6, characterized in that, The first rotating component includes a first mounting plate, a first rotating plate, and two first elastic structures. The first mounting plate is mounted on the fourth driver, the first rotating plate is hinged to the first mounting plate, and the two first elastic structures are mounted between the first mounting plate and the first rotating plate, and abut against the first mounting plate and the second rotating plate, and are symmetrically arranged along the rotation axis of the first rotating plate.

8. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 6, characterized in that, The second rotating member includes a second mounting plate, a second rotating plate, and two second elastic structures. The second mounting plate is mounted on the first rotating member, and the second rotating plate is hinged to the second mounting plate. The two second elastic structures are both mounted between the second mounting plate and the second rotating plate and abut against the second mounting plate and the second rotating plate, and are symmetrically arranged along the rotation axis of the second rotating plate.

9. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 8, characterized in that, The elastic connector includes multiple limiting rods, a third mounting plate, and multiple third elastic structures. The multiple limiting rods are all inserted through the second rotating plate. The third mounting plates are all installed on the multiple limiting rods and are located at the ends of the limiting rods away from the second rotating plate. The multiple third elastic structures are respectively sleeved on the multiple limiting rods and abut against the second rotating plate and the third mounting plate.

10. The fully enclosed, pollution-proof, automated sorting and buffering intelligent warehouse for chip substrates as described in claim 1, characterized in that, The storage mechanism also includes an electromagnet, which is mounted on the frame and located within the storage space.

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