Colored glass inner hole forming method and system

Abstract

The application discloses a colored glass inner hole forming method and system, and belongs to the colored glass processing field. The colored glass inner hole forming method comprises the following steps: positioning a laser beam to a local position of a colored glass to be drilled, so that the laser beam inputs energy according to preset working parameters, and a locally expanded colored glass is obtained; waste is separated, and a colored glass with a completed inner hole is obtained; wherein the colored glass is a colored silicate glass, the preset working parameters comprise setting the wavelength of the laser beam to 800 nm to 10600 nm, the energy density to 0.01 J / cm 2 to 10 J / cm 2 . The colored glass inner hole forming method has high inner hole size precision and small hole wall damage.

Description

Technical Field

[0001] This application relates to the field of colored glass processing, and in particular to a method and system for forming internal holes in colored glass. Background Technology

[0002] Colored silicate glass, due to its inherent optical and decorative properties (such as gray, green, and bronze glass), is widely used in automotive, construction, furniture, and electronic device exterior components. Laser processing methods have attracted attention for their non-contact nature when machining internal holes in this type of glass. However, existing laser processing techniques suffer from uneven energy absorption, leading to poor hole wall quality. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this application provides a method for forming inner holes in colored glass, aiming to solve the problem of poor hole wall quality caused by uneven energy absorption in current laser glass processing technology.

[0004] To achieve the above objectives, this application proposes a method for forming an inner hole in colored glass, comprising the following steps: positioning a laser beam at a local location of the area to be drilled in the colored glass, such that the laser beam is input with energy according to preset working parameters to obtain locally expanded colored glass; separating waste material to obtain colored glass with the inner hole processed; wherein the colored glass is colored silicate glass, and the preset working parameters include setting the wavelength of the laser beam to 800nm ​​to 10600nm and the energy density to 0.01 J / cm². 2 Up to 10 J / cm 2 .

[0005] In some embodiments, the thickness of the colored glass is 0.1 mm to 8 mm.

[0006] In some embodiments, the diameter of the inner hole is less than or equal to 600 mm.

[0007] In some embodiments, the preset working parameters include setting the total processing time for a single operation to 0.2s to 8s and the single-point dwell time of the laser beam to 1ms to 100ms.

[0008] In some embodiments, the preset operating parameters include setting the pulse frequency of the laser beam to 5 kHz to 100 kHz.

[0009] In some embodiments, the preset operating parameters include setting the operating duration of the input energy to 1ms to 25s.

[0010] In some embodiments, the separation of waste is carried out using mechanical external force, wherein the mechanical external force is 0.1 MPa to 0.8 MPa.

[0011] In some embodiments, the laser beam is a ring-focused infrared laser beam.

[0012] In some embodiments, the colorant of the colored silicate glass includes at least one of iron oxide, cobalt oxide, nickel oxide, and selenium oxide.

[0013] To achieve the above objectives, this application also proposes a colored glass inner hole forming system. The system is used to perform the above-described colored glass inner hole forming method. The system includes: a laser emitting module for emitting a laser beam; a beam shaping module for shaping the laser beam; a control module electrically connected to the laser emitting module and the beam shaping module to control the laser parameters to achieve processing; and a separation execution module that applies mechanical force to the waste block located in the inner hole region, causing the waste block to separate from the glass along the stress interface formed by the laser beam.

[0014] This application controls the laser's operating parameters to input specific energy into a localized area of ​​the glass, inducing a controllable volume expansion effect in that area without directly ablating or vaporizing the glass. This creates a difference in the intermolecular spacing between the irradiated and unirradiated areas, forming a directional expansion stress gradient around the inner hole contour. Under the action of this stress gradient, a mechanically weak separation interface naturally forms between the waste block to be removed and the glass body. This allows subsequent waste separation steps to be easily completed without chemical etching, resulting in smooth, chipped inner hole edges and significantly improved processing efficiency. Detailed Implementation

[0015] To make the technical solutions and advantages of this application clearer, the application and its beneficial effects will be described in further detail below in conjunction with specific embodiments. The following description is provided to enable those skilled in the art to fully understand this application and is not intended to limit the subject matter recorded in the claims.

[0016] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a particular range. Ranges defined in this way can include or exclude endpoints and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for a specific parameter, it is expected that ranges of 60-110 and 80-120 are also included. Furthermore, if minimum range values ​​of 1 and 2 are listed, and if maximum range values ​​of 3, 4, and 5 are listed, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5. In this application, unless otherwise stated, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed in this article; "0-5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is stated as an integer ≥2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0017] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions.

[0018] Unless otherwise specified, all technical features and optional technical features of this application may be combined to form new technical solutions.

[0019] Unless otherwise specified, all steps in this application may be performed sequentially or randomly, preferably sequentially. For example, the method includes steps (a) and (b), indicating that the method may include steps (a) and (b) performed sequentially, or it may include steps (b) and (a) performed sequentially. For example, the mention that the method may also include step (c) indicates that step (c) may be added to the method in any order. For example, the method may include steps (a), (b), and (c), or it may include steps (a), (c), and (b), or it may include steps (c), (a), and (b), etc.

[0020] Colored silicate glass, due to its inherent optical and decorative properties (such as gray, green, and bronze glass), is widely used in automotive, construction, furniture, and electronic device exterior components. Laser processing methods have attracted attention for their non-contact nature when machining internal holes in this type of glass. However, existing laser processing techniques suffer from uneven energy absorption, leading to poor hole wall quality.

[0021] In view of this, this application proposes a method for forming the inner hole of colored glass, comprising the following steps: S1: Position the laser beam at a local location of the hole to be opened in the colored glass, so that the laser beam is input with energy according to the preset working parameters to obtain locally expanded colored glass; S2: Separate the waste material to obtain colored glass with the inner hole processed; wherein, the colored glass is colored silicate glass, and the preset operating parameters include setting the wavelength of the laser beam to 800nm ​​to 10600nm and the energy density to 0.01J / cm². 2 Up to 10 J / cm 2 .

[0022] Existing laser cutting or drilling processes mostly utilize high-energy-density pulsed lasers to directly ablate and vaporize materials, forming holes or kerfs. Essentially, this is a thermal removal process, inevitably resulting in a molten layer, heat-affected zone, and microcracks. In this solution, by precisely controlling the laser's operating parameters, specific energy is input into a localized area of ​​the glass. Instead of directly ablating or vaporizing the glass, this induces a controllable volume expansion effect in that area. This process creates a difference in the intermolecular distance between the irradiated and unirradiated areas, forming a directional expansion stress gradient around the inner hole contour. Under the influence of this stress gradient, a mechanically weak separation interface naturally forms between the waste material to be removed and the glass body. This allows subsequent waste separation steps to be easily completed without chemical etching, resulting in smooth, chip-free inner hole edges and significantly improved processing efficiency.

[0023] This application limits the laser wavelength to 800nm ​​to 10600nm, covering a wide range from near-infrared to mid-far-infrared, allowing for matching to the absorption characteristics of different coloring ions (such as iron, cobalt, nickel, selenium, etc.). The energy density is controlled at 0.01 J / cm². 2 Up to 10 J / cm 2 The relatively low temperature range ensures that only thermal expansion of the glass is induced, rather than melting or vaporization, thus fundamentally avoiding problems such as excessively large heat-affected zone, rough hole walls, and slag splashing caused by traditional laser ablation processing.

[0024] The "separation of waste material" in step S2 can be achieved through purely physical methods such as gentle mechanical tapping, flexible pushing, or suction cup lifting. Since a stress-concentrated separation interface has already been prepared in step S1, only an external force much smaller than the intrinsic strength of the glass is needed to completely separate the waste material along the interface. The entire process requires no soaking or assistance with any chemical etching solution, making it short, green, and environmentally friendly.

[0025] In some embodiments, when the laser beam wavelength is in the near-infrared range of 800–1100 nm, the processing uses an energy density of 0.01 J / cm². 2 ~6J / cm 2When the laser beam wavelength is in the mid-to-far infrared range of 9–10.6 μm, the processing uses an energy density of 0.01 J / cm². 2 ~10J / cm 2 .

[0026] For example, the wavelength of the laser beam is 808nm, 946nm, 980nm, 1047nm, 1064nm, 1310nm, 1480nm, 1530nm, 1600nm, 2097nm, 2300nm, 2940nm, 9300nm, 10600nm, or within any two of the above values.

[0027] For example, the energy density of the laser beam is 0.01 J / cm², 0.1 J / cm², 1 J / cm², 5 J / cm², 10 J / cm², or within the range of any two of the above values.

[0028] In some embodiments, the thickness of the colored glass is 0.1 mm to 8 mm.

[0029] The forming method provided in this application is highly adaptable to the thickness of colored glass. In some embodiments, the thickness of the colored glass can be as thin as 0.1 mm, such as ultra-thin colored glass for electronic device exterior parts; or as thick as 8 mm, such as thick plate colored glass for buildings or large installations. By adjusting preset operating parameters such as laser energy density, pulse frequency, and irradiation time, this method can achieve precise volume expansion stress induction and high-quality internal hole forming throughout the entire thickness range from 0.1 mm to 8 mm.

[0030] In some embodiments, the diameter of the inner hole is less than or equal to 600 mm.

[0031] The core of this method is to form a closed-loop expansion stress gradient along the inner hole contour, thereby generating a separation interface that penetrates the glass thickness. When the inner hole diameter is too large, the contour circumference is too long, making it difficult to guarantee the synchronization and consistency of laser energy input along the contour. This may lead to discontinuous stress gradients or localized stress concentrations, resulting in incomplete separation of the waste block or accidental breakage. Therefore, this solution is more suitable for processing requirements with inner hole diameters of 600 mm or less.

[0032] In some embodiments, the preset working parameters include setting the total processing time for a single operation to 0.2s to 8s and the single-point dwell time of the laser beam to 1ms to 100ms.

[0033] The total processing time for a single operation is controlled within 0.2s to 8s, ensuring sufficient energy input to create adequate volume expansion and stress gradient while avoiding excessive heat accumulation that could damage the glass substrate due to prolonged irradiation. The single-point dwell time of the laser beam is set to 1ms to 100ms, which is more conducive to precise and controllable energy deposition at each point, a crucial condition for achieving micro-area expansion without melting.

[0034] For example, the total processing time for a single operation is 0.2s, 1s, 2s, 3s, 4s, 5s, 6s, 7s, or 8s, or falls within the range of any two of the above values.

[0035] For example, the single-point dwell time of the laser beam is 1ms, 10ms, 20ms, 30ms, 40ms, 50ms, 60ms, 70ms, 80ms, 90ms, 100ms, or within any two of the above values.

[0036] In some embodiments, preset operating parameters include setting the operating duration of the input energy to 1ms to 25s.

[0037] The working time refers to the total time for the laser beam to continuously input energy into the area to be processed. For thin colored glass with small apertures, the working time can be set near the lower limit, such as from a few milliseconds to several hundred milliseconds, to achieve rapid and precise expansion stress induction. For thicker glass with larger apertures, the working time can be appropriately extended to several seconds or even 25 seconds to ensure that heat is fully conducted throughout the entire thickness of the glass, forming a through-hole separation interface. This working time, in conjunction with the aforementioned total processing time, single-point dwell time, and pulse frequency, ensures precise and controllable energy input.

[0038] For example, the working duration of the input energy is 1ms, 10ms, 100ms, 500ms, 1s, 2s, 3s, 4s, 5s, 6s, 7s, 8s, 9s, 10s, 11s, 12s, 13s, 14s, 15s, 16s, 17s, 18s, 19s, 20s, 21s, 22s, 23s, 24s, 25s, or within the range of any two of the above values.

[0039] In some embodiments, preset operating parameters include setting the pulse frequency of the laser beam to 5 kHz to 100 kHz.

[0040] The pulse frequency range can be matched with the thickness of colored glass, the concentration of coloring ions, and the desired rate of expansion stress formation. When a lower pulse frequency of 5kHz to 10kHz is selected, the single pulse energy is higher, which is beneficial for deep energy input to thicker glass of 6-8mm, allowing volume expansion to penetrate the entire glass cross section. When a higher pulse frequency of 50kHz to 100kHz is selected, the pulse energy is lower but the repetition frequency is higher, which is suitable for rapid scanning and uniform energy accumulation of thin glass of 0.1-2mm, avoiding local overheating caused by excessive single pulse energy.

[0041] For example, the pulse frequency of the laser beam is 5kHz, 10kHz, 15kHz, 20kHz, 25kHz, 30kHz, 35kHz, 40kHz, 45kHz, 50kHz, 55kHz, 60kHz, 65kHz, 70kHz, 75kHz, 80kHz, 85kHz, 90kHz, 95kHz, 100kHz, or within any two of the above values.

[0042] In some embodiments, the waste is separated by mechanical force, which is 0.1 MPa to 0.8 MPa.

[0043] Mechanical force is used to overcome the weak remaining bonding forces at the separation interface after laser-induced volume expansion. A lower limit of 0.1 MPa is sufficient to effectively eject the waste block, while an upper limit of 0.8 MPa is far below the force that would cause chipping, breakage, or scratches to the glass body during separation. In practical applications, this force can be applied using flexible push rods, vacuum suction cups, or pulsed pneumatics.

[0044] For example, the mechanical external force is 0.1MPa, 0.2MPa, 0.3MPa, 0.4MPa, 0.5MPa, 0.6MPa, 0.7MPa, or 0.8MPa, or falls within the range of any two of the above values.

[0045] In some embodiments, the laser beam is a ring-focused infrared laser beam.

[0046] In this scheme, the laser emitted by the infrared laser source (such as a fiber laser with a wavelength of 1064nm or a CO2 laser with a wavelength of 10.6μm) is shaped by diffractive optical elements such as a conical lens group, a spatial light modulator, and a galvanometer scanning ring trajectory to form a ring-shaped focused spot on the surface of the glass to be processed, which is completely superimposed on the inner hole contour.

[0047] The use of a ring-focused infrared laser beam has at least the following advantages: energy is deposited only on the circumference to be separated, and the induced volume expansion and stress gradient are precise and symmetrical; the infrared band is highly matched with the absorption characteristics of coloring ions in colored silicate glass, which can achieve effective expansion through the thickness with a low energy density, avoiding energy waste and thermal damage; the entire circumference is heated and expanded synchronously, the processing time is short and the production efficiency is high, which is especially suitable for application scenarios that require high-efficiency mass production.

[0048] In some embodiments, the colorant for the colored silicate glass includes at least one of iron oxide, cobalt oxide, nickel oxide, and selenium oxide.

[0049] These coloring metal oxides are introduced into the glass network structure during the preparation of bulk-colored silicate glass, giving the glass a specific color and determining its ability to absorb laser energy in specific wavelength bands.

[0050] Specifically, green or bronze-colored glass containing iron oxide has an extremely high absorption coefficient in the 1064nm near-infrared band; blue glass containing cobalt oxide has multiple characteristic absorption peaks in the near-infrared region; gray-toned glass containing nickel oxide couples well with 10.6μm mid-far-infrared lasers; and glass containing selenium oxide exhibits moderate absorption characteristics across a wide infrared spectrum.

[0051] The method described in this application utilizes the efficient and selective absorption of infrared laser by the aforementioned colorant to precisely convert laser energy into localized heat, thereby inducing the glass to produce the desired volume expansion effect with relatively low energy density. Therefore, clearly defining the type of colorant used in colored silicate glass helps to accurately match laser operating parameters according to the actual composition of the glass, ensuring the reliable formation of the expansion stress gradient and the high-quality forming of the inner hole.

[0052] To address the aforementioned problems, this application also proposes a colored glass internal hole forming system, which is used to perform the aforementioned colored glass internal hole forming method. The system includes: Laser emitting module, used to emit laser beams; A beam shaping module is used to shape the laser beam; The control module is electrically connected to the laser emission module and the beam shaping module, and controls the laser parameters to achieve processing. The separation execution module applies mechanical force to the waste block located in the inner hole area, causing the waste block to separate from the glass along the stress interface formed by the laser beam.

[0053] The laser emitting module emits a laser beam. As an energy source, it provides adjustable infrared laser output with parameters such as wavelength, power, and pulse frequency to meet the absorption characteristics of colored silicate glasses with different compositions and the energy input requirements of glasses with different thicknesses. The beam shaping module shapes the laser beam. This module receives the raw laser beam from the laser emitting module and shapes it into a ring-shaped focused beam matching the contour of the hole to be opened, precisely projecting this ring-shaped spot onto the colored glass surface. The control module, electrically connected to the laser emitting module and the beam shaping module, controls the laser parameters to achieve the processing. This module is the system's control center, responsible for precisely controlling key variables such as laser wavelength, energy density, pulse frequency, single-point dwell time, and total processing time according to preset operating parameters, ensuring that the energy input only induces directional volume expansion of the glass, rather than melting or vaporization. The separation execution module applies mechanical force to the waste block located within the inner hole region, causing the waste block to separate from the glass along the stress interface formed by the laser beam. This module is activated after laser processing is completed. It applies a controllable low-pressure mechanical force to the waste block and uses the already formed expansion stress gradient to weaken the interface, thereby achieving non-destructive separation of the waste block.

[0054] The technical solution of this application will be further described in detail below with reference to specific embodiments.

[0055] Example 1 We need to provide gray-colored silicate glass containing iron oxide, 1.0 mm thick, with a 10 mm diameter inner hole to be machined. A near-infrared fiber laser with a wavelength of 1064 nm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 10 mm inner hole using a beam shaping module. The preset operating parameters are: energy density 2 J / cm². 2 The pulse frequency is 80kHz, the single-point dwell time is 10ms, the laser input energy working time is 0.3s, and the total processing time for a single operation is controlled within 0.5s. After cooling for 1 second, the separation execution module applies a pushing force to the waste block with a flexible rubber chuck of 0.2MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0056] Example 2 We need to provide bronze-colored silicate glass containing iron oxide and selenium oxide, 4mm thick, with a 50mm diameter inner hole to be machined. A mid-to-far infrared CO2 laser with a wavelength of 10.6μm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 50mm inner hole using a beam shaping module. The preset operating parameters are: energy density 6 J / cm². 2 The pulse frequency is 30kHz, the single-point dwell time is 50ms, the laser input energy working time is 3.0s, and the total processing time for a single operation is controlled within 4.0s. After cooling for 2 seconds, the separation execution module applies pressure to the waste block with a flexible push rod of 0.5MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0057] Example 3 We need to provide green-colored silicate glass containing iron oxide, 8mm thick, with a 300mm diameter inner hole to be machined. A near-infrared laser with a wavelength of 1064nm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 300mm inner hole using a beam shaping module. The preset operating parameters are: energy density 5 J / cm². 2 The pulse frequency is 8kHz, the single-point dwell time is 80ms, the laser input energy working time is 6.5s, and the total processing time for a single operation is controlled within 7.0s. After cooling for 3 seconds, the separation execution module applies pressure to the waste block with a flexible push rod of 0.6MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0058] Example 4 We need to provide blue-colored silicate glass containing cobalt oxide, 0.2 mm thick, with a 5 mm diameter inner hole to be machined. A near-infrared laser with a wavelength of 1064 nm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 5 mm inner hole using a beam shaping module. The preset operating parameters are: energy density 0.1 J / cm³. 2 The pulse frequency is 90kHz, the single-point dwell time is 2ms, the laser input energy working time is 0.1s, and the total processing time for a single operation is controlled within 0.2s. After cooling for 1 second, the separation execution module applies a lifting force to the waste block with a vacuum suction cup of 0.1MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0059] Example 5 We need to provide dark gray colored silicate glass containing iron oxide, nickel oxide, and selenium oxide, 6 mm thick, with a 100 mm diameter inner hole to be machined. A mid-to-far infrared CO2 laser with a wavelength of 10.6 μm is selected, and the laser beam is shaped into a ring-shaped focused beam corresponding to the contour of the 100 mm inner hole using a beam shaping module. The preset operating parameters are: energy density 9 J / cm³. 2 The pulse frequency is 10kHz, the single-point dwell time is 100ms, the laser input energy working time is 7.0s, and the total processing time for a single operation is controlled within 7.5s. After cooling for 3 seconds, the separation execution module applies pressure to the waste block with a flexible push rod of 0.7MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0060] Example 6 We need to provide dark gray colored silicate glass containing iron oxide and nickel oxide, 8 mm thick, with a 500 mm diameter inner hole to be machined. A near-infrared fiber laser with a wavelength of 1064 nm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 500 mm inner hole using a beam shaping module. The preset operating parameters are: energy density 8 J / cm². 2The pulse frequency is 6kHz, the single-point dwell time is 90ms, the laser input energy working time is 20s, and the total processing time for a single operation is controlled within 7.8s. After cooling for 2 seconds, the separation execution module applies pressure to the waste block with a flexible push rod of 0.75MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0061] Example 7 We need to provide blue-colored silicate glass containing cobalt oxide, 0.1 mm thick, with a 3 mm diameter inner hole to be machined. A 9.4 μm CO2 laser is selected, and the laser beam is shaped into a ring-shaped focused beam corresponding to the 3 mm inner hole contour using a beam shaping module. The preset operating parameters are: energy density 0.01 J / cm³. 2 The pulse frequency is 100kHz, the single-point dwell time is 1ms, the laser input energy working time is 5ms, and the total processing time for a single operation is controlled within 0.2s. After cooling for 1 second, the separation execution module applies a lifting force to the waste block with a vacuum chuck of 0.1MPa, and the waste block is completely separated along the stress interface to obtain the finished inner hole.

[0062] Example 8 We need to provide green-colored silicate glass containing iron oxide, 4mm thick, with an 80mm diameter inner hole to be machined. A near-infrared laser with a wavelength of 1064nm will be selected, and the laser beam will be shaped into a ring-shaped focused beam corresponding to the contour of the 80mm inner hole using a beam shaping module. The preset operating parameters are: energy density 4 J / cm². 2 The pulse frequency is 40kHz, the single-point dwell time is 30ms, the laser input energy working time is 3s, and the total processing time for a single operation is controlled within 2.5s. After cooling for 2 seconds, the separation execution module applies pressure to the waste block with a flexible push rod of 0.4MPa. The waste block is completely separated along the stress interface to obtain the finished inner hole.

[0063] Comparative Example 1 We need to provide gray-colored silicate glass containing iron oxide, 4mm thick, with an internal hole of 50mm diameter. Mechanical drilling will be performed using a diamond-tipped drill bit at 3000rpm and a feed rate of 5mm / min, with water cooling.

[0064] Comparative Example 2 We need bronze-colored silicate glass containing iron oxide and selenium oxide, 4mm thick, with a 50mm diameter internal hole to be machined. A 1064nm near-infrared laser will be used, employing a focused laser beam for point-by-point scanning ablation, with an energy density of 25 J / cm². 2 The pulse frequency is 50kHz, and the glass material is vaporized and removed layer by layer by a focused spot. After processing, the glass needs to be immersed in a chemical etching solution for 30 minutes to remove slag and smooth the hole walls. The waste liquid is disposed of separately.

[0065] Performance testing 1. Method for testing the accuracy of internal hole dimensions: Test equipment: Bridge coordinate measuring machine (CMM, model: Zeiss PRISMO, accuracy class 0.5μm) or high-precision image measuring instrument (such as OGP SmartScope) is used.

[0066] Test Procedure: The inner hole of the finished automotive tinted glass is used as the test object. The bottom surface (mounting surface) of the glass is taken as reference A, and the theoretical axis of the inner hole is taken as reference B. Eight evenly distributed measurement points (a total of 24 points) are extracted at 0.5mm from the upper surface, the middle of the thickness, and 0.5mm from the lower surface of the glass. The actual radius value from each measurement point to the reference axis is calculated, and the difference between the maximum and minimum radii (i.e., roundness error) is recorded. The deviation (ΔD) between the measured diameter and the theoretical design diameter is calculated. 100 pieces of glass are continuously processed for SPC (Statistical Process Control) analysis.

[0067] 2. Edge chipping test method: Test equipment: Ultra-depth-of-field 3D microscope (such as Keyence VHX-7000).

[0068] Test standard: According to the automotive glass industry standard QC / T 1175-2022, observe the micromorphology of the hole wall edge at 50x to 200x magnification.

[0069] Judgment criteria: If the chord length (chipping width) of the largest notch at the edge of the hole is <0.02mm (i.e. 20μm), and there are no jagged cracks extending to the glass body under the naked eye and microscope, it is judged as "no chipping".

[0070] 3. Color difference damage test method: Test equipment: Spectrophotometer (such as X-Rite Ci7800) with a standard D65 light source and a 10° observation angle.

[0071] Test method: Measure the chromaticity coordinates (L, a, b) in the processed area (within 3mm of the inner hole edge) and the unprocessed area (original glass surface).

[0072] Calculation formula: Color difference ΔE = √[(ΔL)] 2 + (Δa) 2 + (Δb) 2 ].

[0073] Judgment criteria: If the ΔE value is <1.5 (the human visual recognition threshold is usually ΔE≈2~3), and the colored layer shows no cracks or oxidation discoloration under a high-power microscope, it is judged as "no color difference damage".

[0074] The variable statistics of the examples and comparative examples, as well as the above performance test results, are shown in Table 1 below.

[0075] Table 1. Performance Comparison of Examples and Comparative Examples Compared with Comparative Example 1, the inner hole accuracy of the embodiment was improved from ±0.15mm to within ±0.02mm, the edge chipping amount was reduced from more than 200μm to less than 20μm, the color difference ΔE was reduced from 3.5 to 5.0 to less than 1.5, and the problem of color difference area cracking caused by mechanical stress was eliminated.

[0076] Compared with Comparative Example 2, the embodiment uses a ring-shaped focused beam with low energy density, which avoids the melting and vaporization of glass, and no melt-resolidified layer is generated. The edge chipping amount is reduced from 80-150μm to below 20μm, the color difference ΔE is reduced from 2.8-4.2 to below 1.5, and the chemical etching step is eliminated, realizing green and efficient internal hole forming of colored glass.

[0077] Based on the performance results of the eight embodiments, the colored glass inner hole forming method provided in this application consistently achieves excellent performance in three core indicators across a wide range of thicknesses from 0.1 mm to 8 mm and hole diameters from 3 mm to 500 mm. The inner hole dimensional accuracy is consistently controlled within ±0.02 mm, with extremely low roundness error and good consistency in continuous processing. These performance results demonstrate that this solution, by controlling the laser operating parameters and inputting specific energy into a localized area of ​​the glass, induces a controllable volume expansion effect in that area without directly ablating or vaporizing the glass. This creates a difference in the intermolecular spacing between the irradiated and unirradiated areas, forming a directional expansion stress gradient around the inner hole contour. Under the action of this stress gradient, a mechanically weak separation interface naturally forms between the waste block to be removed and the glass body, allowing subsequent waste separation steps to be easily completed without chemical etching. The resulting inner hole has smooth edges without chipping, and the processing efficiency is significantly improved.

[0078] Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples.

[0079] The above description is only a part or preferred embodiment of this application and should not be construed as limiting the scope of protection of this application. All equivalent structural transformations made using the content of this application specification under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A method for forming the inner hole of colored glass, characterized in that, Includes the following steps: The laser beam is positioned at a local location in the colored glass where an opening is to be made, so that the laser beam is input with energy according to preset working parameters to obtain locally expanded colored glass; The waste material is separated to obtain colored glass with the inner hole machined. The colored glass is colored silicate glass, and the preset operating parameters include setting the wavelength of the laser beam to 800 nm to 10600 nm and the energy density to 0.01 J / cm². 2 Up to 10 J / cm 2 .

2. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The thickness of the colored glass is 0.1 mm to 8 mm.

3. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The diameter of the inner hole is less than or equal to 600 mm.

4. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The preset working parameters include setting the total processing time for a single operation to 0.2s to 8s and the single-point dwell time of the laser beam to 1ms to 100ms.

5. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The preset operating parameters include setting the operating time of the input energy from 1ms to 25s.

6. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The preset operating parameters include setting the pulse frequency of the laser beam from 5 kHz to 100 kHz.

7. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The separation of waste materials is carried out using mechanical external force, which is 0.1 MPa to 0.8 MPa.

8. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The laser beam is a ring-focused infrared laser beam.

9. The method for forming the inner hole of colored glass according to claim 1, characterized in that, The colorant of the colored silicate glass includes at least one of iron oxide, cobalt oxide, nickel oxide, and selenium oxide.

10. A colored glass internal hole forming system, characterized in that, The system is used to perform the method for forming the inner hole of colored glass as described in any one of claims 1 to 9, the system comprising: Laser emitting module, used to emit laser beams; A beam shaping module is used to shape the laser beam; The control module is electrically connected to the laser emission module and the beam shaping module, and controls the laser parameters to achieve processing. The separation execution module applies mechanical force to the waste block located in the inner hole area, causing the waste block to separate from the glass along the stress interface formed by the laser beam.

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