Method for removing copper electroplated on surface of glass core board and preparation method of glass core board

Abstract

The application discloses a glass core plate surface electroplated copper removal method and a glass chip preparation method, relates to the chip field, and removes the method which comprises the following steps: S1, placing the first surface of the glass core plate after electroplating copper on a substrate; S2, heating, melting and removing copper; S3, placing the second surface of the glass core plate after electroplating copper on a substrate; S4, heating, melting and removing copper; and S5, obtaining the glass core plate after removing surface copper after solidification; the copper on both sides of the glass substrate is etched and removed in the mode of heating and melting copper, the problems of CMP broken pieces and stress cracking caused by large thickness difference of double-sided copper in traditional process double-sided grinding are avoided, product yield and production capacity are improved, the electroplated copper can be ensured to have no cavity problem after the copper is heated and melted, and the thickness of the whole glass chip is only the thickness of the glass core plate after the copper on both sides of the glass core plate is removed by the method, and can be less than 5 um, while the traditional double-sided grinding process can only be less than 15 um.

Description

Technical Field

[0001] This invention relates to the field of chips, and more particularly to a method for removing electroplated copper from the surface of a glass core board and a method for preparing glass chips. Background Technology

[0002] Glass core boards, with their low dielectric loss, high dimensional stability, excellent flatness, and insulation properties, are widely used in high-end chip packaging, precision electronic substrates, and high-frequency communication devices, serving as a core material for next-generation high-density packaging substrates. Compared to traditional organic core boards, glass core boards offer significant advantages such as a low coefficient of thermal expansion, minimal warpage, superior temperature resistance, and high integration, effectively meeting the fabrication needs of high-frequency, high-speed, and highly integrated electronic devices, thus demonstrating extremely broad application prospects in the industry.

[0003] Currently, the manufacturing process of glass core boards in the industry suffers from core technical defects due to the fact that glass is a typical brittle inorganic material with high rigidity, poor toughness, and weak impact and stress cracking resistance. Existing glass core board manufacturing methods have core technical defects such as high risk of glass cracking, poor product yield, and low production efficiency, making it difficult to adapt to the current production needs of high-precision, high-quality, and mass production of high-end glass core boards. Summary of the Invention

[0004] The purpose of this invention is to design a method for removing electroplated copper from the surface of a glass core board and a method for preparing glass chips in order to solve the above problems.

[0005] The present invention achieves the above objectives through the following technical solutions: A method for removing electroplated copper from the surface of a glass core board, characterized by comprising: S1. Place the first side of the copper-plated glass core board on the substrate; S2. Heat and melt the copper on the second surface of the electroplated glass core board, and remove the molten copper on the second surface of the glass substrate. S3. After the copper plating on the glass core board is cured, place the second side of the copper-plated glass core board on the substrate. S4. Heat and melt the copper on the first surface of the electroplated glass core board, and remove the molten copper on the first surface of the glass substrate. S5. After the copper in the glass core board is cured, a glass core board with the surface copper removed is obtained.

[0006] Methods for preparing glass core boards include: A1. Create glass through holes in the glass core board; A2. Deposit a seed layer onto the glass through-hole; A3. Use double-sided electroplating process to electroplat copper into the glass through holes to achieve solid hole filling, form copper circuits, and obtain the glass core board after copper plating. A4. Using the method for removing copper plating from the surface of a glass core board as described in any one of claims 1-4, copper is removed from the first and second surfaces of the glass core board after copper plating, to obtain a glass core board with the surface copper removed. A5. The glass core board with the surface copper removed is subjected to PVD, photoresist PR coating, exposure, development, electroplating, film removal and etching to complete the circuit on both sides. A6. The glass substrate with completed circuitry on both sides is subjected to multiple dielectric and metal layer fabrications to obtain a glass core board.

[0007] The beneficial effects of this invention are as follows: by heating and melting copper to remove copper from both sides of the electroplated copper glass core board, the problem of CMP breakage and stress cracking caused by the large difference in copper thickness on both sides during the traditional double-sided grinding process is avoided; product yield and production capacity are improved; at the same time, the electroplated copper is guaranteed to be free of voids after the copper is heated and melted; after removing the copper from both sides of the glass core board by this method, the thickness of the entire glass chip can be reduced to less than 5 μm, while the traditional double-sided grinding process can only achieve less than 15 μm. Attached Figure Description

[0008] Figure 1 This is a flowchart of the method for removing electroplated copper from the surface of the glass core board according to the present invention; Figure 2 This is a flowchart of the preparation method of the glass core plate of the present invention. Detailed Implementation

[0009] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0010] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0011] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0012] In the description of this invention, it should be understood that the terms "upper," "lower," "inner," "outer," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0013] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0014] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0015] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0016] like Figure 1 As shown, the method for removing electroplated copper from the surface of a glass core board includes: S1. Place the first side of the copper-plated glass core board on the substrate; S2. Heat and melt the copper on the second surface of the electroplated glass core board, and remove the molten copper on the second surface of the glass substrate. S3. After the copper plating on the glass core board is cured, place the second side of the copper-plated glass core board on the substrate. S4. Heat and melt the copper on the first surface of the electroplated glass core board, and remove the molten copper on the first surface of the glass substrate; wherein the melting point of the glass core board and the substrate is higher than the melting point of copper; S5. After the copper in the glass core board is cured, a glass core board with the surface copper removed is obtained.

[0017] In S2 and S4, after the copper is heated and melted, the substrate is tilted to a preset angle to remove the molten copper above the second or first surface of the glass core plate. The preset angle is 0-90°. In this embodiment, the 0-90° preset angle is set as the optimal choice, but it is not limited to this range. Other angles are acceptable as long as the tilt angle of the glass core plate allows the copper on the surface of the glass core plate to flow and leave the glass core plate. In S2 and S4, after the copper is heated and melted, since the copper on the second surface of the glass core plate has already melted and is in a liquid state, when the substrate is tilted, the liquid copper will flow out along the second surface of the glass core plate, removing the molten copper on the second surface of the glass core plate, thus achieving the removal of copper from both the second and first surfaces of the glass core plate.

[0018] like Figure 2 As shown, the method for preparing a glass core board includes: A1. Create glass through holes in the glass core board; A2. Deposit a seed layer onto the glass through-hole; A3. Use double-sided electroplating process to electroplat copper into the glass through holes to achieve solid hole filling, form copper circuits, and obtain the glass core board after copper plating. A4. Using the copper removal method described above for the surface of the glass core board, the copper on the first and second surfaces of the electroplated glass core board is removed to obtain a glass core board with the surface copper removed. A5. The glass core board with the surface copper removed is subjected to PVD, photoresist PR / pressure-sensitive dry film coating, exposure, development, electroplating, film removal and etching to complete the circuit on both sides. A6. The glass substrate with completed circuitry on both sides is subjected to multiple dielectric and metal layer fabrications to obtain a glass core board. The dielectric layer is fabricated by PI coating, exposure, development, and baking or ABF lamination, baking, and drilling. The metal layer is fabricated sequentially by PVD, photoresist coating (PR / pressure-sensitive dry film), exposure, development, electroplating, film removal, and etching.

[0019] This invention removes copper from both sides of the electroplated copper-coated glass core by heating and melting the copper, avoiding the CMP breakage problem and stress cracking caused by the large difference in copper thickness on both sides during traditional double-sided grinding. This improves product yield and production capacity, and ensures that the electroplated copper is free of voids after melting. After removing the copper from both sides of the glass core using this method, the thickness of the entire glass chip, leaving only the glass core itself, can be less than 5µm, while traditional double-sided grinding processes can only achieve less than 15µm. The technical solution of this invention is not limited to the specific embodiments described above; all technical modifications made according to the technical solution of this invention fall within the protection scope of this invention.

Claims

1. A method for removing electroplated copper from the surface of a glass core board, characterized in that, include: S1. Place the first side of the copper-plated glass core board on the substrate; S2. Heat and melt the copper on the second surface of the electroplated glass core board, and remove the molten copper on the second surface of the glass substrate. S3. After the copper plating on the glass core board is cured, place the second side of the copper-plated glass core board on the substrate. S4. Heat and melt the copper on the first surface of the electroplated glass core board, and remove the molten copper on the first surface of the glass substrate. S5. After the copper in the glass core board is cured, a glass core board with the surface copper removed is obtained.

2. The method for removing electroplated copper from the surface of a glass core board according to claim 1, characterized in that, The melting point of glass core and substrate is higher than that of copper.

3. The method for removing electroplated copper from the surface of a glass core board according to claim 1, characterized in that, In S2 and S4, after the copper is heated and melted, the substrate is tilted to a preset angle to remove the molten copper that is above the second side or the first side of the glass core plate.

4. The method for removing electroplated copper from the surface of a glass core board according to claim 3, characterized in that, The preset angle is 0-90°.

5. A method for preparing a glass core board, characterized in that, include: A1. Create glass through holes in the glass core board; A2. Deposit a seed layer onto the glass through-hole; A3. Use double-sided electroplating process to electroplat copper into the glass through holes to achieve solid hole filling, form copper circuits, and obtain the glass core board after copper plating. A4. Using the method for removing copper plating from the surface of a glass core board as described in any one of claims 1-4, copper is removed from the first and second surfaces of the glass core board after copper plating, to obtain a glass core board with the surface copper removed. A5. The glass core board with the surface copper removed is subjected to PVD, photoresist PR coating, exposure, development, electroplating, film removal and etching to complete the circuit on both sides. A6. The glass substrate with completed circuitry on both sides is subjected to multiple dielectric and metal layer fabrications to obtain a glass core board.

6. The method for preparing a glass core board according to claim 5, characterized in that, In A6, the dielectric layer is fabricated by PI coating, exposure, development, and baking, or by ABF lamination, baking, and drilling.

7. The method for preparing a glass core board according to claim 5, characterized in that, In A6, the metal layer is fabricated sequentially through PVD, photoresist (PR) coating, exposure, development, electroplating, stripping, and etching.

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