A heat-reduced adhesive tape with anti-warping performance and a preparation method thereof

CN122958950APending Publication Date: 2026-10-23ANHUI MINGXUN NEW MATERIAL TECH
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Patent Information

Application Number
CN202411423768.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-12
Publication Date
2026-10-23

AI Technical Summary

Technical Problem

例如,一些胶带在高温下容易变软,导致粘性下降过快,无法有效固定电子元件;而一些胶带则因内部应力分布不均,容易在加工过程中产生翘曲

Benefits of technology

[0047]1.本发明的热减粘胶带具有优异的粘结性、耐高温性和抗翘曲性,且可移除性佳,适用于高精度电子元件定位加工的需求,具有较好的市场价值。

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of adhesive tapes, and provides a heat-reducing adhesive tape with anti-warping performance and a preparation method thereof.The heat-reducing adhesive tape comprises a PET substrate layer, a heat-reducing adhesive layer and a release layer from bottom to top, and the heat-reducing adhesive layer comprises the following raw materials in parts by weight: polyacrylate 45-60 parts, modified resin 5-15 parts, foaming microspheres 1.5-3 parts, isocyanate curing agent 1-2.5 parts, modified calcium carbonate crystal whisker 1-2 parts, silane coupling agent 0.5-1.5 parts, plasticizer 0.5-1.5 parts, antioxidant 0.5-1 part and solvent 50-70 parts.The heat-reducing adhesive tape has excellent adhesion, high-temperature resistance and anti-warping performance, is good in removability, is suitable for the positioning and processing requirements of high-precision electronic components, and has good market value.
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Description

Technical Field

[0001] This invention belongs to the field of adhesive tape technology, specifically relating to a heat-resistant adhesive tape with anti-warping properties and its preparation method. Background Technology

[0002] With the rapid development of the electronics industry, the demand for high-performance tapes is increasing, especially in the slitting and positioning of MLCCs and MLCIs. Heat-resistant tapes are widely used because they can quickly reduce tack at specific temperatures, enabling rapid mounting and protection of electronic components.

[0003] Warpage refers to the undesirable bending or deformation of adhesive tape during processing and use due to internal stress, temperature changes, or humidity. Warpage not only affects the processing efficiency of the tape but can also lead to inaccurate positioning of electronic components or even damage to them. Although various heat-resistant adhesive tapes are available on the market, most still need improvement in their anti-warpage performance. For example, some tapes soften easily at high temperatures, causing their tack to decrease too quickly and making it impossible to effectively fix electronic components; while other tapes are prone to warping during processing due to uneven internal stress distribution.

[0004] Chinese patent CN 113278385 A discloses a removable acrylic foam tape, including a substrate layer, pressure-sensitive adhesive layers on both sides of the substrate layer, and a release film layer on the side of the pressure-sensitive adhesive layer away from the substrate layer; the pressure-sensitive adhesive layer components include butyl acrylate, acrylic acid, curing agent, thermally conductive powder, foamed microspheres, glass microspheres, and solvent; the tape provided by this invention has good thermal conductivity and good removability, however, it does not involve research on anti-warping performance, which may not meet the needs of high-precision electronic component processing.

[0005] Therefore, there is an urgent need for a heat-resistant tape with anti-warping properties, which can have excellent adhesion, high temperature resistance, and anti-warping properties. Summary of the Invention

[0006] To address the existing technical problems, the present invention aims to provide a heat-resistant adhesive tape with anti-warping properties and its preparation method. The heat-resistant adhesive tape of the present invention exhibits excellent adhesion, high-temperature resistance, and anti-warping properties, and also has good removability, making it suitable for the needs of high-precision electronic component positioning processing and possessing significant market value.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] This invention provides a heat-resistant adhesive tape with anti-warping properties. The heat-resistant adhesive tape consists of a PET substrate layer, a heat-resistant adhesive layer, and a release layer from bottom to top. The heat-resistant adhesive layer comprises, by weight, the following raw materials: 45-60 parts polyacrylate, 5-15 parts modified resin, 1.5-3 parts foamed microspheres, 1-2.5 parts isocyanate curing agent, 0.5-1 part modified calcium carbonate whiskers, 0.5-1.5 parts silane coupling agent, 0.5-1.5 parts plasticizer, 0.5-1 part antioxidant, and 50-70 parts solvent.

[0009] The reaction mechanism and function of this invention are as follows:

[0010] 1. The use of soft monomers butyl acrylate and isooctyl acrylate in this invention can increase the flexibility and adhesion of the resin; the use of hard monomers methyl methacrylate and vinyl acetate can provide the rigidity and cohesiveness of the resin; the crosslinking monomer N-hydroxymethylacrylamide can play a crosslinking role during the polymerization process; the functional monomers hydroxyethyl acrylate and isobornyl methacrylate can further improve the adhesion, cohesiveness, chemical resistance and weather resistance, thereby improving its anti-warping performance.

[0011] 2. In this invention, rosin resin and terpene phenol resin are added to the heat-resistant adhesive tape as common modifying resins. On the one hand, rosin resin with a softening point of 70-90℃ is selected, which can provide good adhesion performance at lower temperatures, thereby providing better initial tack and bonding speed. On the other hand, terpene phenol resin with a softening point of 120-150℃ is selected, which can provide better tack and high temperature resistance. The combination of the two can balance the initial tack and tack of the tape, and make the heat-resistant adhesive tape maintain its adhesion in high temperature environment.

[0012] On the other hand, rosin resin and terpene phenol resin have good compatibility with a variety of substrates, which can improve the adhesion performance of heat-resistant adhesive layers to PET substrates; at the same time, the combined use of rosin resin and terpene phenol resin can improve the environmental adaptability of the tape in terms of water resistance, chemical resistance and other aspects.

[0013] 3. This invention utilizes foamed microspheres with a specific initial particle size and modified calcium carbonate whiskers with a specific average particle size to enhance the removability of the tape. When heated, the foamed microspheres expand, reducing the adhesive surface area of ​​the tape. However, the degree of thermal expansion is difficult to control uniformly, leading to easy breakage during tearing and removal, making rapid removal difficult. When some foamed microspheres expand excessively, the one-dimensional linear structure of the whiskers helps penetrate these microspheres, thus more effectively controlling the uniformity of expansion and making it less prone to tearing during removal, thereby enhancing removability.

[0014] 4. Calcium carbonate whiskers not only possess high strength and modulus, which can enhance the mechanical properties of tapes when added to them, but also help improve the thermal stability of the tapes. However, calcium carbonate whiskers may have poor dispersibility. The applicant has modified them to compensate for this deficiency in the system.

[0015] On one hand, this invention modifies calcium carbonate whiskers by mixing N,N-bis(2-hydroxyethyl)ethylenediamine. The amino groups form stable complexes with calcium ions on the surface of the calcium carbonate whiskers through coordination bonds. This complexation can change the surface properties of the whiskers and reduce agglomeration. Furthermore, the hydroxyl groups on N,N-bis(2-hydroxyethyl)ethylenediamine may crosslink with acrylates, increasing cohesion and thus improving its anti-warping properties.

[0016] On the other hand, the applicant introduced sodium N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline, which interacts with the surface of calcium carbonate whiskers modified with N,N-bis(2-hydroxyethyl)ethylenediamine, further enhancing the dispersibility and stability of calcium carbonate whiskers in the system; at the same time, the sodium N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline coated on the surface, and the benzene ring structure in its structure further improves the heat resistance.

[0017] 5. This invention preferably uses plasticizers in specific mass ratios of dibutyl phthalate, di(2-ethylhexyl) phthalate, and tricresyl phosphate, primarily to improve the flexibility and elongation of the tape, thereby improving its processing and performance. Dibutyl phthalate imparts good softness to the product, di(2-ethylhexyl) phthalate helps regulate the tape's flexibility and temperature resistance, and tricresyl phosphate has good heat resistance and migration resistance, which can improve the plasticizing effect of the polymer.

[0018] In addition, the use of plasticizers can effectively avoid the problem of reduced flexibility that may be caused by modified calcium carbonate whiskers, thus balancing the overall performance of the tape.

[0019] In some embodiments, the polyacrylate comprises, by weight, the following raw materials:

[0020] 25-35 parts butyl acrylate, 10-15 parts isooctyl acrylate, 5-10 parts methyl methacrylate, 5-10 parts vinyl acetate, 1-5 parts N-hydroxymethylacrylamide, 3-5 parts hydroxyethyl acrylate, 4-6 parts isobornyl methacrylate, 0.4-0.8 parts initiator, and 40-60 parts mixed solvent.

[0021] Preferably, the polyacrylate comprises the following raw materials in parts by weight:

[0022] 30 parts butyl acrylate, 12 parts isooctyl acrylate, 6 parts methyl methacrylate, 8 parts vinyl acetate, 3 parts N-hydroxymethylacrylamide, 4 parts hydroxyethyl acrylate, 5 parts isobornyl methacrylate, 0.6 parts initiator, 30 parts ethyl acetate, and 20 parts ethanol.

[0023] Furthermore, the method for preparing the polyacrylate includes the following steps:

[0024] Butyl acrylate, isooctyl acrylate, methyl methacrylate, vinyl acetate, N-hydroxymethylacrylamide, hydroxyethyl acrylate, isobornyl methacrylate, and a mixture of ethyl acetate and ethanol were added to a reaction vessel. An inert gas was introduced, and the mixture was heated to 65-80°C and reacted for 20-40 minutes. A portion of azobisisobutyronitrile was added, and the reaction was maintained for 1-2 hours. The remaining mixture of ethyl acetate and ethanol, along with azobisisobutyronitrile, was then added dropwise, and the reaction was maintained for 2-4 hours to obtain polyacrylate.

[0025] In some embodiments, the modified resin is rosin resin and terpene phenol resin in a mass ratio of (1-3):1.

[0026] In some embodiments, the softening point of the rosin resin is 70-90°C, and the softening point of the terpene phenol resin is 120-150°C.

[0027] In some embodiments, the plasticizer is any one or more of dibutyl phthalate, dioctyl phthalate, di(2-ethylhexyl) phthalate, dioctyl sebacate, and tricresyl phosphate.

[0028] Preferably, the plasticizer comprises dibutyl phthalate, di(2-ethylhexyl) phthalate and tricresyl phosphate, wherein the mass ratio of the two is (2-4):(1-2):1.

[0029] More preferably, the mass ratio of dibutyl phthalate, di(2-ethylhexyl) phthalate, and tricresyl phosphate is 2.5:1.5:1.

[0030] In some embodiments, the method for preparing the modified calcium carbonate whiskers includes the following steps:

[0031] (1) Add N,N-bis(2-hydroxyethyl)ethylenediamine and deionized water to the reaction vessel, mix, then add calcium carbonate whiskers, stir for 4-6 hours, and dry to obtain the intermediate product;

[0032] (2) Add N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline sodium salt and deionized water to the reaction vessel, mix, add the intermediate product obtained in step (1), stir for 1-3 hours, dry, pulverize, and obtain modified calcium carbonate whiskers.

[0033] In some embodiments, the mass ratio of the calcium carbonate whiskers to N,N-bis(2-hydroxyethyl)ethylenediamine is 1:(5-10).

[0034] Preferably, the mass ratio of the intermediate product to sodium N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline is 1:(1.5-3).

[0035] In some embodiments, the initial particle size of the foamed microspheres is 5-10 μm, and the average particle size of the modified calcium carbonate whiskers is 25-50 μm.

[0036] In some embodiments, the thickness of the PET substrate layer is 70-85 μm, the thickness of the heat-resistant adhesive layer is 80-120 μm, and the thickness of the release layer is 100-150 μm.

[0037] In some embodiments, the silane coupling agent is triacetoxyvinylsilane.

[0038] In some embodiments, the antioxidant is any one or more of antioxidant 1010, antioxidant 1076, and antioxidant 618.

[0039] In some embodiments, the solvent is any one or more of ethyl acetate, toluene, isopropanol, heptane, and ethanol.

[0040] In some embodiments, the release layer is a monosilicon release layer.

[0041] Another aspect of the present invention provides a method for preparing a heat-resistant adhesive tape with anti-warping properties, comprising the following steps:

[0042] 1. The foamed microspheres, modified calcium carbonate whiskers, silane coupling agent and part of the solvent are mixed and added to the reaction vessel to obtain a mixture;

[0043] 2. After mixing the mixture obtained in step 1, polyacrylate, modified resin, isocyanate curing agent, plasticizer, antioxidant and the remaining solvent, a heat-resistant adhesive is obtained.

[0044] 3. Use a coating machine to coat the heat-reducing adhesive obtained in step 2 onto the lower surface of the release layer, adjust the thickness, and dry to obtain the heat-reducing adhesive layer.

[0045] 4. The PET substrate layer is laminated onto the lower surface of the heat-resistant adhesive layer obtained in step 3, cured, and cut to obtain the heat-resistant adhesive tape.

[0046] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0047] 1. The heat-resistant adhesive tape of the present invention has excellent adhesion, high temperature resistance and anti-warping properties, and good removability. It is suitable for the needs of high-precision electronic component positioning processing and has good market value.

[0048] 2. The present invention uses specific types and proportions of monomers to prepare polyacrylate, which can improve the adhesive strength, cohesive strength, chemical resistance and weather resistance of the tape, thereby improving its anti-warping performance.

[0049] 3. The present invention adds rosin resin and terpene phenol resin as common modified resins to the heat-resistant adhesive tape, which can balance the initial tack and holding power of the tape, and improve the adhesion performance of the heat-resistant adhesive layer to the PET substrate.

[0050] 4. The present invention uses foamed microspheres with a specific initial particle size and modified calcium carbonate whiskers with a specific average particle size to enhance the removability of the tape.

[0051] 5. In this invention, N,N-bis(2-hydroxyethyl)ethylenediamine and N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline sodium salt are used to modify calcium carbonate whiskers, thereby enhancing their dispersibility and stability in the system. In addition, the introduced hydroxyl groups may crosslink with acrylates, increasing cohesion and thus improving their anti-warping properties.

[0052] 6. The plasticizer of the present invention preferably has a specific mass ratio that can improve the flexibility of the tape, effectively avoid the problem of decreased flexibility that may be caused by modified calcium carbonate whiskers, and balance the overall performance of the tape. Detailed Implementation

[0053] The present invention will be described below with reference to specific embodiments. It should be noted that the following embodiments are examples of the present invention and are used only to illustrate the invention, not to limit it. Other combinations and various modifications within the scope of the present invention can be made without departing from its spirit or scope.

[0054] Each heat-resistant adhesive tape was prepared according to the proportions and preparation methods of the raw materials specified in the following examples and comparative examples.

[0055] To facilitate implementation of this invention by those skilled in the art, the manufacturers of some raw materials for the embodiments and comparative examples are described below:

[0056] Foamed microspheres: purchased from Beijing Yijin Technology Co., Ltd., model PG07;

[0057] Rosin resin: purchased from Shangrao Sinan Resin Co., Ltd., model number 138, softening point 85-90℃;

[0058] Terpene phenol resin: purchased from Shenzhen Yoshida Chemical Co., Ltd., model DA-22, softening point 120-130℃;

[0059] Aragonite-type calcium carbonate whiskers: purchased from Hubei Langbowan Biomedical Co., Ltd.;

[0060] Unless otherwise specified, all other raw materials can be purchased from the market.

[0061] Preparation Example 1

[0062] The preparation method of modified calcium carbonate whiskers A includes the following steps:

[0063] (1) Add 20g of N,N-bis(2-hydroxyethyl)ethylenediamine and 200ml of deionized water to the reaction vessel, mix, then add 2.5g of aragonite-type calcium carbonate whiskers, stir for 5h, and dry at 85℃ for 3h to obtain the intermediate product;

[0064] (2) Add 33g of N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline sodium salt and 350ml of deionized water to the reaction vessel, mix, then add 15g of the intermediate product obtained in step (1), stir for 2h, dry at 85℃ for 4h, and pulverize to an average particle size of 40μm to obtain modified calcium carbonate whiskers A.

[0065] Preparation Example 2

[0066] The preparation method of modified calcium carbonate whiskers B is the same as that of Preparation Example 1, except that the amount of N,N-bis(2-hydroxyethyl)ethylenediamine added is 12g.

[0067] Preparation Example 3

[0068] The preparation method of modified calcium carbonate whiskers C is the same as that of preparation example 1, except that the average particle size after pulverization in step (2) is 10 μm.

[0069] Preparation Example 4

[0070] The preparation method of polyacrylate includes the following steps:

[0071] A mixture of 30g butyl acrylate, 12g isooctyl acrylate, 6g methyl methacrylate, 8g vinyl acetate, 3g N-hydroxymethylacrylamide, 4g hydroxyethyl acrylate, 5g isobornyl methacrylate, 20g ethyl acetate, and 14g ethanol was added to a reaction vessel. Nitrogen gas was introduced, and the mixture was heated to 75°C and reacted for 30 minutes. Then, 0.4g azobisisobutyronitrile was added, and the reaction was maintained for 1.5 hours. Finally, the remaining 10g ethyl acetate and 6g ethanol mixture, along with 0.2g azobisisobutyronitrile, were added dropwise, and the reaction was maintained for 3 hours to obtain polyacrylate.

[0072] Example 1

[0073] A heat-resistant adhesive tape with anti-warping properties, comprising, from bottom to top, a PET substrate layer, a heat-resistant adhesive layer, and a single silicone release layer. The heat-resistant adhesive layer, by weight, comprises the following raw materials: 52.5 parts polyacrylate, 7 parts rosin resin, 3 parts terpene phenolic resin modified resin, 2.25 parts foamed microspheres PG07, 1.75 parts isoflurane diisocyanate, 1.5 parts modified calcium carbonate whiskers A, 1 part triacetoxyvinylsilane, 0.5 parts dibutyl phthalate, 0.3 parts di(2-ethylhexyl) phthalate, 0.2 parts tricresyl phosphate, 0.8 parts antioxidant 1010, 40 parts ethyl acetate, and 20 parts ethanol.

[0074] The PET substrate layer has a thickness of 85 μm, the heat-resistant adhesive layer has a thickness of 90 μm, and the release layer has a thickness of 110 μm.

[0075] The method for preparing the heat-resistant adhesive tape in this embodiment includes the following steps:

[0076] 1. Add the foamed microspheres PG07, modified calcium carbonate whiskers A, triacetoxyvinylsilane, 70 wt% ethyl acetate and 70 wt% ethanol to a reaction vessel to obtain a mixture;

[0077] 2. The mixture obtained in step 1, polyacrylate, rosin resin, terpene phenol resin, isoflurone diisocyanate, dibutyl phthalate, di(2-ethylhexyl) phthalate, tricresyl phosphate, antioxidant 1010, the remaining ethyl acetate and ethanol are mixed to obtain a heat-resistant adhesive.

[0078] 3. Apply the heat-resistant adhesive obtained in step 2 to the lower surface of the single silicone release layer and bake at 70°C for 5 minutes to obtain the heat-resistant adhesive layer.

[0079] 4. The PET substrate layer is laminated to the lower surface of the heat-resistant adhesive layer obtained in step 3, cured at 45°C for 48 hours, and then cut to obtain the heat-resistant adhesive tape.

[0080] Example 2

[0081] A heat-resistant adhesive tape with anti-warping properties, comprising, from bottom to top, a PET substrate layer, a heat-resistant adhesive layer, and a single silicone release layer. The heat-resistant adhesive layer, by weight, comprises the following raw materials: 45 parts polyacrylate, 3 parts rosin resin, 2 parts terpene phenol resin, 1.5-3 parts expanded microspheres PG07, 1 part isoflurane diisocyanate, 1 part modified calcium carbonate whiskers A, 0.5 parts triacetoxyvinylsilane, 0.25 parts dibutyl phthalate, 0.15 parts di(2-ethylhexyl) phthalate, 0.1 parts tricresyl phosphate, 0.5 parts antioxidant 1076, 35 parts ethyl acetate, and 15 parts ethanol.

[0082] The PET substrate layer has a thickness of 70 μm, the heat-resistant adhesive layer has a thickness of 80 μm, and the release layer has a thickness of 100 μm.

[0083] The preparation method of the heat-resistant adhesive tape in this embodiment is the same as in Embodiment 1.

[0084] Example 3

[0085] A heat-resistant adhesive tape with anti-warping properties, comprising, from bottom to top, a PET substrate layer, a heat-resistant adhesive layer, and a single silicone release layer. The heat-resistant adhesive layer, by weight, comprises the following raw materials: 60 parts polyacrylate, 11.25 parts rosin resin, 3.75 parts terpene phenolic resin modified resin, 3 parts foamed microspheres PG07, 2.5 parts isoflurane diisocyanate, 2 parts modified calcium carbonate whiskers A, 1.5 parts triacetoxyvinylsilane, 0.75 parts dibutyl phthalate, 0.45 parts di(2-ethylhexyl) phthalate, 0.3 parts tricresyl phosphate, 10101 parts antioxidant, 52.5 parts ethyl acetate, and 17.5 parts ethanol.

[0086] The PET substrate layer has a thickness of 70 μm, the heat-resistant adhesive layer has a thickness of 120 μm, and the release layer has a thickness of 150 μm.

[0087] The preparation method of the heat-resistant adhesive tape in this embodiment is the same as in Embodiment 1.

[0088] Example 4

[0089] A heat-resistant adhesive tape with anti-warping properties and its preparation method are disclosed. The specific implementation method is the same as in Example 1, except that an equal amount of modified calcium carbonate whiskers B is used instead of modified calcium carbonate whiskers A.

[0090] Example 5

[0091] A heat-resistant adhesive tape with anti-warping properties and its preparation method are disclosed. The specific implementation method is the same as in Example 1, except that an equal amount of modified calcium carbonate whiskers C is used instead of modified calcium carbonate whiskers A.

[0092] Example 6

[0093] A heat-resistant adhesive tape with anti-warping properties and its preparation method are disclosed. The specific implementation method is the same as that in Example 1, except that 10 parts of rosin resin are used to replace 7 parts of rosin resin and 3 parts of terpene phenol resin modified resin.

[0094] Comparative Example 1

[0095] A heat-resistant adhesive tape with anti-warping properties and its preparation method are described. The specific implementation method is the same as in Example 1, except that aragonite-type calcium carbonate whiskers with an average particle size of 40 μm after being crushed are used instead of modified calcium carbonate whiskers A.

[0096] Effect evaluation:

[0097] The heat-resistant adhesive tapes prepared in Examples 1-6 and Comparative Example 1 were tested and analyzed. The specific results are shown in Table 1.

[0098] Performance testing:

[0099] (1) Peel force: The 180° peel force performance of SUS and PP sheets was tested in accordance with the ASTM D3330 standard for peel force testing of pressure-sensitive tape.

[0100] (2) Removability: The test board was SUS / PE (forming a sandwich structure with the tape); the tape size was 12mm×110mm; the pressing conditions were 0.25MPa, holding pressure for 10s; the wetting time was 24h; the test environment was 23±1℃, 50±5%RH; the tape was stretched and removed at a 30° angle and a removal rate of 300mm / min, and the tape was recorded as broken and whether there was any residual adhesive on the board during the removal process.

[0101] Table 1

[0102]

[0103] As shown in Table 1, the heat-resistant adhesive tapes prepared in Examples 1-3 have good peel strength, good removability, and good anti-warping properties, and have good market value.

[0104] Compared to Example 1, Example 4 changed the mass ratio of calcium carbonate whiskers to N,N-bis(2-hydroxyethyl)ethylenediamine during the preparation of modified calcium carbonate whiskers, which affected the dispersibility of the modified calcium carbonate whiskers and the degree of crosslinking with acrylic resin, thereby affecting the overall performance of the tape.

[0105] Compared to Example 1, Example 5 changed the particle size after pulverization during the preparation of modified calcium carbonate whiskers, which caused the calcium carbonate whiskers to penetrate too many foamed microspheres, thus failing to effectively reduce the sticky surface and affecting removability.

[0106] Compared to Example 1, Example 6 uses only one type of rosin resin as the modified resin, resulting in increased high-temperature adhesion and decreased peel strength.

[0107] Compared to Example 1, Comparative Example 1 used an equal amount of aragonite-type calcium carbonate whiskers with a particle size of 40 μm after pulverization to replace modified calcium carbonate whiskers A, which reduced its dispersibility, heat resistance, and crosslinking degree, thereby affecting the overall performance of the tape.

[0108] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present application in any way. Although the present application discloses the preferred embodiment as described above, it is not intended to limit the present application. Any changes or modifications made by those skilled in the art without departing from the scope of the technical solution of the present application using the disclosed technical content are equivalent to equivalent implementation cases. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the technical solution of the present invention are still within the scope of the technical solution.

Claims

1. A heat-resistant adhesive tape with anti-warping properties, characterized in that, The heat-resistant adhesive tape consists of a PET substrate layer, a heat-resistant adhesive layer, and a release layer from bottom to top. The heat-resistant adhesive layer comprises the following raw materials by weight: 45-60 parts polyacrylate, 5-15 parts modified resin, 1.5-3 parts foamed microspheres, 1-2.5 parts isocyanate curing agent, 0.5-1 part modified calcium carbonate whiskers, 0.5-1.5 parts silane coupling agent, 0.5-1.5 parts plasticizer, 0.5-1 part antioxidant, and 50-70 parts solvent.

2. The heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The polyacrylate comprises the following raw materials in parts by weight: 25-35 parts butyl acrylate, 10-15 parts isooctyl acrylate, 5-10 parts methyl methacrylate, 5-10 parts vinyl acetate, 1-5 parts N-hydroxymethylacrylamide, 3-5 parts hydroxyethyl acrylate, 4-6 parts isobornyl methacrylate, 0.4-0.8 parts initiator, and 40-60 parts mixed solvent.

3. The heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The modified resin is rosin resin and terpene phenol resin, with a mass ratio of (1-3):

1.

4. The heat-resistant adhesive tape with anti-warping properties according to claim 3, characterized in that, The softening point of the rosin resin is 70-90℃, and the softening point of the terpene phenol resin is 120-150℃.

5. The heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The plasticizer is any one or more of dibutyl phthalate, dioctyl phthalate, di(2-ethylhexyl) phthalate, dioctyl sebacate, and tricresyl phosphate.

6. The heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The method for preparing the modified calcium carbonate whiskers includes the following steps: (1) Add N,N-bis(2-hydroxyethyl)ethylenediamine and deionized water to the reaction vessel, mix, then add calcium carbonate whiskers, stir for 4-6 hours, and dry to obtain the intermediate product; (2) Add N-ethyl-N-(2-hydroxy-3-sulfopropyl)-3-methylaniline sodium salt and deionized water to the reaction vessel, mix, add the intermediate product obtained in step (1), stir for 1-3 hours, dry, pulverize, and obtain modified calcium carbonate whiskers.

7. The heat-resistant adhesive tape with anti-warping properties according to claim 6, characterized in that, The mass ratio of the calcium carbonate whiskers to N,N-bis(2-hydroxyethyl)ethylenediamine is 1:(5-10).

8. The heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The initial particle size of the foamed microspheres is 5-10 μm, and the average particle size of the modified calcium carbonate whiskers is 25-50 μm.

9. A heat-resistant adhesive tape with anti-warping properties according to claim 1, characterized in that, The thickness of the PET substrate layer is 70-85μm, the thickness of the heat-resistant adhesive layer is 80-120μm, and the thickness of the release layer is 100-150μm.

10. A method for preparing a heat-resistant adhesive tape with anti-warping properties according to any one of claims 1-9, characterized in that, It includes the following steps:

1. The foamed microspheres, modified calcium carbonate whiskers, silane coupling agent and part of the solvent are mixed and added to the reaction vessel to obtain a mixture; 2. After mixing the mixture obtained in step 1, polyacrylate, modified resin, isocyanate curing agent, plasticizer, antioxidant and the remaining solvent, a heat-resistant adhesive is obtained.

3. Use a coating machine to coat the heat-reducing adhesive obtained in step 2 onto the lower surface of the release layer, adjust the thickness, and dry to obtain the heat-reducing adhesive layer.

4. The PET substrate layer is laminated onto the lower surface of the heat-resistant adhesive layer obtained in step 3, cured, and cut to obtain the heat-resistant adhesive tape.

Citation Information

Patent Citations

  • Removable acrylic foam tape

    CN113278385A