Measurement device, film forming system, and method for manufacturing electronic device

Abstract

The present application relates to a measurement device, a film forming system, and a method for manufacturing an electronic device. The measurement precision is prevented from being reduced while standby time at the time of film thickness measurement is reduced. The measurement device includes a measurement member that optically measures a film thickness of a film formed on a substrate, a moving member that moves the measurement member from a standby position to a measurement position on the substrate, and a vibration suppression portion that comes into contact with the measurement member at the measurement position and suppresses vibration of the measurement member.

Description

Technical Field

[0001] This invention relates to a measuring device, a film forming system, and a method for manufacturing electronic devices. Background Technology

[0002] In the manufacture of organic EL display devices (organic EL displays), the quality of the film is improved by inspecting the film deposited on the substrate and incorporating the inspection results into subsequent manufacturing processes. As an example of such inspection, Patent Document 1 discloses the measurement of the film thickness of a film deposited on a substrate. In the apparatus of Patent Document 1, the film thickness is optically measured using a measuring head.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2023-79032 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] When starting a measurement by stopping the movement of the measuring head at the measurement position, the measuring head may sometimes vibrate due to the cessation of movement. If the film thickness is measured while the measuring head is vibrating, the measurement accuracy may sometimes decrease. If the measurement is started after the standby period until the vibration of the measuring head stops, the productivity will decrease due to the standby time.

[0008] This invention provides a technique for reducing standby time during film thickness measurement while preventing a decrease in measurement accuracy.

[0009] Solution for solving the problem

[0010] According to the present invention, a measuring device is provided, characterized in that the measuring device comprises:

[0011] A measuring component that optically measures the thickness of a film deposited on a substrate;

[0012] A moving component, the moving component causing the measuring component to move from a standby position to a measuring position on the substrate; and

[0013] The vibration suppression part abuts against the measuring component at the measuring position of the measuring component to suppress the vibration of the measuring component.

[0014] Furthermore, according to the present invention, a film-forming system is provided, the film-forming system comprising:

[0015] A first film-forming chamber, wherein a film is formed relative to the substrate;

[0016] A second film-forming chamber, wherein a film is formed relative to the substrate; and

[0017] A transfer chamber, used to transfer the substrate, after film formation in the first film formation chamber, to the second film formation chamber.

[0018] Its features are,

[0019] The handover room is equipped with a measuring device.

[0020] The measuring device includes:

[0021] A measuring component that optically measures the thickness of a film deposited on the substrate;

[0022] A moving component, the moving component causing the measuring component to move from a standby position to a measuring position on the substrate; and

[0023] A vibration suppression unit is provided, which abuts against the measuring component at the measuring position to suppress the vibration of the measuring component.

[0024] Furthermore, according to the present invention, a method for manufacturing an electronic device is provided, characterized in that it includes:

[0025] The process of forming a film on a substrate in the above-described film-forming system; and

[0026] The process of measuring the film thickness of a film formed on a substrate in the film forming system.

[0027] The effects of the invention

[0028] According to the present invention, a technique can be provided that reduces standby time during film thickness measurement while preventing a decrease in measurement accuracy. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a film-forming system according to one embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of a measuring device according to one embodiment.

[0031] Figure 3 This is an explanatory diagram for film thickness measurement.

[0032] Figure 4 This is a three-dimensional view of the substrate holding unit.

[0033] Figure 5 This is a diagram showing the adsorption surface of the substrate holding unit.

[0034] Figure 6 This is a three-dimensional view of the substrate support unit and the measurement unit.

[0035] Figure 7 This is a top view of the measuring unit.

[0036] Figure 8 yes Figure 7 Sectional view along line B-B.

[0037] Figure 9 This is a flowchart illustrating a processing example of the control device of the measuring apparatus.

[0038] Figure 10 This is a diagram illustrating the operation of the measuring device.

[0039] Figure 11 This is a diagram illustrating the operation of the measuring device.

[0040] Figure 12 This is a diagram illustrating the operation of the measuring device.

[0041] Figure 13 This is an explanatory diagram showing the positional relationship between the measurement unit and the substrate holding unit, etc.

[0042] Figure 14 This is an explanatory diagram of another structural example of a measuring unit.

[0043] Figure 15 This is an explanatory diagram of another structural example of a measuring unit.

[0044] Figure 16 This is a diagram showing the adsorption surface of another substrate holding unit.

[0045] Figure 17 (A) is an overall view of the organic EL display device, and (B) is a view showing the cross-sectional structure of 1 pixel. Detailed Implementation

[0046] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the invention as defined in the claims. Although multiple features are described in the embodiments, not all of these features are necessarily essential to the invention, and multiple features can be combined arbitrarily. In the accompanying drawings, the same or identical structures are labeled with the same reference numerals, and repeated descriptions are omitted.

[0047] <First Implementation>

[0048] <Film Forming System>

[0049] Figure 1 This is a schematic diagram illustrating the structure of a film-forming system A according to one embodiment. Film-forming system A is an apparatus for forming a film of vapor-deposited material relative to a substrate 100. Film-forming system A can be applied, for example, to the manufacture of display panels for organic EL display devices used in smartphones.

[0050] As indicated by the arrows, the substrate 100 is transported in the following sequence: buffer chamber 306A → swirl chamber 307A → junction chamber 308A → film-forming block 301A → buffer chamber 306B → swirl chamber 307B → junction chamber 308B → film-forming block 301B → buffer chamber 306C → swirl chamber 307C → junction chamber 308C. In the following description, buffer chambers 306A to 306C are referred to as buffer chamber 306 unless otherwise specified or used collectively. Similarly, swirl chambers 307A to 307C are referred to as swirl chamber 307, junction chambers 308A to 308C are referred to as junction chamber 308, and film-forming blocks 301A and 301B are referred to as film-forming block 301.

[0051] In the film deposition block 301, around the transport chamber 302, which has an octagonal shape when viewed from above, are arranged multiple film deposition chambers 303 for performing film deposition processing relative to the substrate 100 and a mask storage chamber 305 for storing masks before and after use. The film deposition apparatus arranged in the film deposition chambers 303 is, for example, an upward deposition type film deposition apparatus that deposits a vapor-deposited material onto the substrate 100 from below, forming a thin film of vapor-deposited material with a predetermined pattern on the substrate via a mask. The vapor-deposited material can be an organic material, an inorganic material (metal, metal oxide, etc.), or similar substances. The film deposition apparatus can be an apparatus for depositing a film on the substrate 100 by vacuum vapor deposition, or it can be an apparatus suitable for various film deposition methods such as sputtering and CVD.

[0052] In the transport chamber 302, a transport robot 302a is arranged to transport the substrate 100. The transport robot 302a includes a manipulator that holds the substrate 100 and a multi-joint arm that moves the manipulator in the horizontal direction. In other words, the film deposition block 301 is a cluster-type film deposition unit in which multiple film deposition chambers 303 are arranged around the transport robot 302a. In the film deposition block 301, the substrate 100 can be sequentially transported to multiple film deposition chambers 303 for film deposition. As another example, the substrate 100 can also be transported to only one of the multiple film deposition chambers 303 for film deposition.

[0053] In the transport direction of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a transfer chamber 308 are respectively arranged on the upstream and downstream sides of the film-forming block 301. During the manufacturing process, each chamber is maintained in a vacuum state. Furthermore, in... Figure 1 Only two film-forming blocks 301 are shown in the figure, but the film-forming system 1 may also have more than three film-forming blocks 301, or it may have only one film-forming block 301.

[0054] The film-forming system A of this embodiment constitutes a production line in which multiple film-forming blocks 301 are connected by a connecting device consisting of a buffer chamber 306, a swirl chamber 307, and a transfer chamber 308. However, the structure of the connecting device is not limited to this, and for example, it may consist of only the buffer chamber 306 or the transfer chamber 308.

[0055] The conveying robot 302a performs the following: feeding the substrate 100 from the upstream transfer chamber 308 to the conveying chamber 302; conveying the substrate 100 between the film forming chambers 303; conveying the mask between the mask storage chamber 305 and the film forming chamber 303; and feeding the substrate 100 from the conveying chamber 302 to the downstream buffer chamber 306.

[0056] The buffer chamber 306 is a chamber for temporarily storing substrates 100 according to operating conditions. The buffer chamber 306 is equipped with a substrate storage rack, also referred to as a housing, and a lifting mechanism. The substrate storage rack has a multi-layer structure capable of storing multiple substrates 100 in a horizontal state with the processed surface (film-forming surface) of the substrate 100 facing downwards in the direction of gravity. The lifting mechanism moves the substrate storage rack up and down to align the layers of substrates 100 being fed in or out with the transport position. Thus, multiple substrates 100 can be temporarily stored and held in the buffer chamber 306.

[0057] The swirl chamber 307 is equipped with a device for changing the orientation of the substrate 100. In this embodiment, the orientation of the substrate 100 is rotated 180 degrees by a transport robot provided in the swirl chamber 307. The transport robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and transfers it to the transfer chamber 308, thereby exchanging the front and rear ends of the substrate in the buffer chamber 306 and the transfer chamber 308. As a result, the orientation of the substrate 100 when it is fed into the film deposition chamber 303 becomes the same in each film deposition block 301, thus enabling the scanning direction of the evaporation source relative to the substrate 100 and the orientation of the mask to be consistent in each film deposition block 301. By adopting such a structure, the orientation of the mask placed in the mask storage chamber 305 in each film deposition block 301 can be consistent, simplifying mask management and improving usability.

[0058] The control system of film deposition system A includes a host computer 300 that controls the entire production line and control devices 310-313 that control each structure. These devices can communicate via wired or wireless communication lines 300a. Control device 310 controls the substrate processing unit in the rotary chamber 307. Control device 311 controls the substrate processing unit in the transfer chamber 308. Control device 312 controls the substrate processing unit in the transport chamber 302. Control device 313 controls the substrate processing unit in the film deposition chamber 303. Control devices 313 are provided for each film deposition chamber 303. The host computer 300 sends information related to the substrate 100, transport timing, and other instructions to each control device 310-313. In addition, each control device 310-313 controls each structure based on the received instructions.

[0059] <Measuring Apparatus>

[0060] Figure 2 This is a schematic diagram of a measuring device 201 according to an embodiment of the present invention. In the figure, arrows X and Y represent intersecting horizontal directions, and arrow Z represents the vertical direction. The Y direction is orthogonal to the X direction.

[0061] The measuring device 201 is, for example, an apparatus disposed in the transfer chamber 308B or the transfer chamber 308C to measure the film thickness of a film formed on the substrate 100 in the film forming block 301A or the film forming block 301B. The measuring device 201 includes a chamber 210, a substrate holding unit 211, a moving unit 212, an adsorption auxiliary unit 213, a moving unit 214, a substrate support unit 215, and a measuring unit 216.

[0062] Chamber 210 has a box-shaped form, forming a junction chamber 308. Chamber 210 is maintained in a vacuum environment or an inactive gas environment such as nitrogen. In this embodiment, chamber 210 is connected to a vacuum pump (not shown).

[0063] In this embodiment, the substrate 100, which is to be measured, is fed into the chamber 210 via a transport robot in the swivel chamber 307 through a feed inlet (not shown) formed in the chamber 210. Additionally, the substrate 100, whose film thickness has been measured, is fed out of the chamber 210 via a transport robot (not shown) downstream of the transfer chamber 308 through a feed outlet (not shown) formed in the chamber 210.

[0064] The measurement unit 216 is equipped with a measurement head 216 to measure the film thickness of the film deposited on the substrate 100. The measurement results are used to control the film deposition apparatus in the film deposition chamber 303, thereby improving the quality of the film deposition. Figure 3This is an explanatory diagram for film thickness measurement. In the illustrated example, an organic EL film 100a is formed on the lower surface (film-forming surface) of the substrate 100, and the film 100a is formed in the film-forming region, which is the manufacturing region of the electronic device. An inspection film 100c for film thickness measurement is formed in an inspection region 100b adjacent to the film-forming region of the film 100a. The inspection region 100b is set at a predetermined position (in this embodiment, the end of the substrate 100). In this embodiment, the inspection region 100b is separated from the film-forming region (manufacturing region), but the inspection region 100b may also be part of the film-forming region.

[0065] In film thickness measurement, firstly, the measuring head 2161 is moved from a standby position P1 outside the substrate 100 to a measuring position P2 on the substrate 100 via the moving unit 214 along the lower surface of the substrate 100. The measuring position P2 is the position where the measuring head 2161 faces the inspection film 100c. Film thickness is measured by reading the inspection film 100c using the measuring head 2161 at the measuring position P2.

[0066] In this embodiment, the measuring head 2161 optically measures the thickness of the inspection film 100c. The measuring head 2161 outputs light to the inspection film 100c and receives reflected light from the inspection film 100c. The received light is split and the light intensity is calculated according to each wavelength. The measured light intensity of each wavelength is fitted with an analysis model, thereby enabling the calculation of the film thickness.

[0067] Reference Figure 4 The substrate holding unit 211 will be described. Figure 4 This is a perspective view of the substrate holding unit 211. In this embodiment, the substrate holding unit 211 is an electrostatic chuck that uses electrostatic force to attract the substrate 100.

[0068] The substrate holding unit 211 includes a frame 2111 and a base 2112. The frame 2111 is a rectangular member that forms the outline of the substrate holding unit 211 and supports the base 2112. For example, the frame 2111 is formed to be at least the same size as the substrate 100, which is the object to be held by the substrate holding unit 211. Components of the moving unit 212 (described later) are provided on the side of the frame 2111. The base 2112 holds the substrate 100 by electrostatic force.

[0069] The substrate 2112 is, for example, a plate-shaped component made of a ceramic substrate, which has a structure in which circuits such as metal electrodes are embedded. Figure 5 This is a diagram showing the adsorption surface of the substrate holding unit 211, and a bottom view of the substrate 2112.

[0070] Multiple electrodes 151a to 151l (collectively referred to as electrodes 151) that generate electrostatic forces are disposed on the lower surface 2112a of the substrate 2112, and each of them constitutes an adsorption portion. The lower surface 2112a forms a horizontal adsorption surface of the adsorption substrate 100. When a positive (+) voltage and a negative (-) voltage are applied to the electrodes 151, polarization charges are induced in the substrate 100 through the ceramic substrate, and the substrate 100 is adsorbed and held on the adsorption plate 112 by the electrostatic attraction (electrostatic force) between the substrate 100 and the adsorption plate 112. In this embodiment, the multiple electrodes 151a to 151l are arranged in a matrix, and the application of voltage can be controlled individually.

[0071] A vibration suppression section 114 is formed at the periphery of the lower surface 2112a. The vibration suppression section 114 abuts against the measuring unit 216 at the measuring position P2, suppressing the vibration of the measuring unit 216. Details will be described later.

[0072] The substrate 2112 is also provided with a plurality of sensors 113 for detecting the adsorption and release of the substrate 100 relative to the lower surface 112a. The sensors 113 are, for example, contact sensors for detecting contact with the substrate 100.

[0073] Reference Figure 2 and Figure 4 The moving unit 212 is a mechanism for moving the substrate holding unit 211. In this embodiment, the moving unit 212 is a lifting unit that moves the substrate holding unit 211 up and down in the vertical direction. The moving unit 212 includes a movable part 2121, a fixed part 2122, and a driving part 2123.

[0074] The movable part 2121 supports the substrate holding unit 211 and is configured to move together with the substrate holding unit 211. The movable part 2121 includes a lifting member 21211, a plurality of connecting members 21212, and a plurality of lifting shafts 21214. The lifting shafts 21214 are shaft members that extend in the Z direction and are suspended from the lifting member 21211. Figure 4 Only its lower end is shown in the figure. The connecting member 21212 is a component connected to the base plate holding unit 211. The lifting shaft 21214 and the connecting member 21212 are connected via a joint 21213 equipped with a spherical bearing, and the connecting member 21212 can swing relative to the lifting shaft 21214.

[0075] The fixing part 2122 is fixed to the upper wall part 210a of the chamber 210. The driving part 2123 includes a drive source that generates a driving force for moving the movable part 2121 and a mechanism that converts the driving force of the drive source into translational motion. For example, the rotational driving force of an electric motor is converted into translational motion by a ball screw mechanism and transmitted to the movable part 2121, thereby causing the movable part 2121 to rise and fall. As a result, the substrate holding unit 211 rises and falls.

[0076] When the substrate holding unit 211 adsorbs the substrate 100, the adsorption assist unit 213 reduces the bending of the substrate 100 and corrects the substrate 100 to adsorb in a flatter posture. The substrate 100 is supported by the substrate support unit 215 at its periphery. Therefore, the central portion bends downward. The adsorption assist unit 213 presses the periphery of the substrate 100 downward to correct this bending.

[0077] The adsorption auxiliary unit 213 of this embodiment includes a shaft-shaped pressing part 2131 pressing the substrate 100 and a lifting part 2132 for raising and lowering the pressing part 2131. The lifting part 2132 can be appropriately equipped with known technologies such as electric motors and ball screw mechanisms.

[0078] In this embodiment, the adsorption assist unit 213 presses the substrate 100, which is supported on the substrate support unit 215, to partially move away from the substrate holding unit 211. Specifically, the pressing part 2131 presses the substrate 100 from above via a through hole 21112 formed in the frame 2111 of the substrate holding unit 211. In addition, in this embodiment, the adsorption assist unit 2213 corrects the substrate 100 to a more horizontal position by pressing the four corners of the substrate 100 from above with the four pressing parts 22131.

[0079] Figure 6 This is a perspective view of the substrate support unit 215, the measuring unit 216, and the moving unit 214. The substrate support unit 215 is a unit that supports the substrate 100. The substrate 100, which is to be inspected, is fed into the measuring device 201 and supported by the substrate support unit 215. In addition, the substrate 100 after inspection is sent out from the substrate support unit 215.

[0080] The substrate support unit 215 supports the substrate 100 from below. The substrate support unit 215 is located in the chamber 210 between the substrate holding unit 211 and the measuring unit 216 in the vertical direction. In this embodiment, the substrate support unit 215 includes a frame 2151 and a plurality of support members 2152.

[0081] The frame 2151 forms the outline of the substrate support unit 215 and is supported by the base member 2164 via the support member. The base member 2164 is fixed within the chamber 210. The frame 2151 has a rectangular frame shape, and the substrate 100 is supported inside the frame formed by the frame 2151. In this embodiment, the frame 2151 includes a plurality of members 21511 to 21514. Members 21511 and 21513 are arranged facing each other, and members 21512 and 21514 are arranged facing each other.

[0082] The support member 2152 is the portion of the substrate support unit 215 that directly supports the substrate 100, and is formed, for example, by a leaf spring. In this embodiment, a plurality of support members 2152 are supported on the frame 2151 such that they extend to the inside of the frame formed by the frame 2151, and the periphery of the substrate 100 is placed on the plurality of support members 2152. By making the support members 2152 elastic, the load acting on the substrate 100 when the substrate 100 supported on the plurality of support members 2152 comes into contact with the substrate holding unit 211 can be released by the elastic deformation of the support members 2152.

[0083] Apart from Figure 6 In addition, refer to Figure 7 and Figure 8 . Figure 7 This is a top view of the measuring unit 216 and the moving unit 214. Figure 8 yes Figure 7 Sectional view along line B-B.

[0084] The measuring unit 216 includes a measuring head 2161, a support member 2162 supporting the measuring head 2161, and an abutment portion 2163 disposed on the support member 2162. The moving unit 214 is a mechanism for moving the measuring unit 216 along the film-forming surface of the substrate 100, and includes a driving unit 2140 and a pair of guide rails 2143. Figure 6 The measurement unit 216 is shown in standby position P1 (see reference). Figure 3 ) state.

[0085] The guide rail 2143 extends along the short side of the base plate 100 on the base member 2164. The support member 2162 is a plate-shaped slider that can reciprocate in the Y direction by being guided by the guide rail 2143. In this embodiment, the drive unit 2140 is a ball screw mechanism, including a motor 2141 as a drive source, a ball screw shaft 2142, and a ball nut 2144. The ball screw shaft 2142 extends in the Y direction and rotates about an axis in the Y direction by the motor 2141. The ball nut 2144 is provided on the support member 2162 and engages with the ball screw shaft 2142. The measuring unit 216 moves in the Y direction by the rotation of the ball screw shaft 2142.

[0086] The measuring head 2161 is configured to protrude upward from the support member 2162. The abutment portion 2163 is provided on the support member 2162 in a manner separate from the measuring head 2161 in the X direction, and in this embodiment, is fixed to the side of the support member 2162. The abutment portion 2163 is, for example, made of an elastic member, and is configured to protrude upward from the support member 2162. The height Z2 of the upper end of the abutment portion 2163 relative to the base member 2164 is higher than the height Z1 of the upper end of the measuring head 2161.

[0087] When the measuring unit 216 is moved from the standby position P1 to the measuring position P2 and then stops via the moving unit 214, the measuring unit 216 generates a micro-vibration. At the measuring position P2, the vibration suppression part 114 of the substrate holding unit 211 comes into contact with the abutment part 2163, thereby suppressing the vibration of the measuring unit 216 as early as possible. The abutment part 2163 is made of an elastic member, thereby buffering the impact when the abutment part 2163 comes into contact with the vibration suppression part 114, and preventing the measuring unit 216 from shifting position.

[0088] Reference Figure 2 The control device 311 controls the measuring device 201. The control device 311 includes a processing unit 311a, a storage unit 311b, an input / output interface (I / O) 311c, and a communication unit 311d. The processing unit 311a is a processor, such as a CPU, that executes programs stored in the storage unit 311b to control the measuring device 201. The storage unit 311b is a storage device such as ROM, RAM, or HDD, which stores various control information in addition to the programs executed by the processing unit 311a. The I / O 311c is an interface for sending and receiving signals between the processing unit 311a and external devices. External devices include actuators and sensors included in the measuring device 201. The communication unit 311d is a communication device that communicates with a host device 300 or other control devices 310, 312, 313, etc., via a communication line.

[0089] <Control Example>

[0090] A control example of the measuring device 201 based on the control device 311 will be described. Figure 9 This is a flowchart illustrating a processing example performed by the processing unit 311a, and in particular, a processing example related to the film thickness measurement of the substrate 100 is shown. Figures 10-12 This is a diagram illustrating the operation of the measuring device 201.

[0091] In step S1, the substrate 100 is fed into the measuring device 201 (feeding process). Figure 10 The operation of the measuring device 201 is shown when the substrate 100 is fed in. State ST1 shows the state before the substrate 100 is fed in. The substrate holding unit 211 is in the retracted position. The retracted position is the position to avoid contact between the substrate 100 during transport and the substrate holding unit 211 and the substrate support unit 215. The measuring unit 216 is in the standby position P1 with the measuring head 2161 retracted to the outside of the substrate 100.

[0092] State ST2 is the state where the transport robot 307a in the rotary chamber 307 delivers the substrate 100 into the chamber 210. State ST3 is the state after the transport robot 307a places the substrate 100 on the substrate support unit 215 and then retracts. In this state, the central portion of the substrate 100 flexes due to its own weight. Through these steps, the delivery of the substrate 100 is completed.

[0093] exist Figure 9 In step S2, the substrate 100 is adsorbed by the substrate holding unit 211 (adsorption process). Figure 11 State ST11 indicates the state in which the substrate 100 is adsorbed onto the substrate holding unit 211. In the adsorption process, firstly, the deflection of the substrate 100 is corrected by the adsorption auxiliary unit 213. The substrate 100 is corrected to a more horizontal position by pressing the four corners of the substrate 100 from above using the pressing part 2131. The pressing part 2131 of the adsorption auxiliary unit 213 presses the corners of the substrate 100, thereby suppressing deformation of the substrate 100 such that the outer side of the substrate 100 faces upwards. Then, the substrate holding unit 211 is lowered from the retracted position to the adsorption position, and a voltage is applied to the electrode portion of the substrate holding unit 211. As a result, the substrate 100 is adsorbed onto the substrate holding unit 211.

[0094] exist Figure 9 In step S3, the film thickness of substrate 100 is measured (measurement process). Here, the inspection film 100c of inspection area 100b is measured. Figure 3 The film thickness is as follows. Figure 11 As shown in state ST12, the measuring unit 216 is moved from the standby position P1 to the measuring position P2 by the moving unit 214. Figure 13 State ST12 shows the Z-direction positional relationship of the substrate 100, the vibration suppression section 114 of the base 2112, the measuring head 2161, and the contact section 2163 when the measuring unit 216 moves. The measuring head 2161 moves on the substrate 100 in a state separated from the substrate 100. The contact section 2163 also moves in a state separated from the vibration suppression section 114.

[0095] When the measuring unit 216 moves to the measuring position P2 and stops, as Figure 12 As shown in state ST21, the substrate holding unit 211 is lowered from the adsorption position to the measurement position.

[0096] Figure 13State ST21 illustrates the Z-direction positional relationship of the substrate 100, the vibration suppression section 114 of the substrate 2112, the measuring head 2161, and the contact section 2163 when the substrate holding unit 211 is lowered from the adsorption position to the measurement position. The measuring head 2161 is positioned facing the inspection film 100c while separating from it. The contact section 2163 abuts against the vibration suppression section 114. By abutting against the vibration suppression section 114, the vibration of the measuring unit 216 is suppressed. Subsequently, the film thickness of the inspection film 100c is measured using the measuring head 2161. Because the vibration of the measuring unit 216 is suppressed by the contact section 2163 and the vibration suppression section 114, higher accuracy measurements can be performed even if the standby time until the vibration stops is shortened or eliminated. Furthermore, by abutting the contact portion 2163 and the vibration suppression portion 114, the distance between the measuring head 2161 and the inspection membrane 100c remains constant, enabling measurements with higher precision.

[0097] Through the above steps, the film thickness measurement is completed. Upon completion of the film thickness measurement, the substrate holding unit 211 is raised from the measurement position to the adsorption position. The Z-direction positional relationship between the vibration suppression unit 114, the measurement head 2161, and the contact part 2163 is restored. Figure 13 The state of ST12. Then, the measuring unit 216 is moved from the measuring position P2 to the standby position P1 by the moving unit 214.

[0098] exist Figure 9 In step S4, a peeling process is performed. The pressing portion 2131 of the adsorption auxiliary unit 213 is raised to release the pressure on the four corners of the substrate 100. By stopping the application of voltage to the electrode portion of the substrate holding unit 211, the adsorption of the substrate holding unit 211 is released, and the substrate 100 is peeled off from the substrate holding unit 211. Figure 12 State ST22 shows the state in which the substrate 100 is peeled from the substrate holding unit 211 and placed on the substrate support unit 215.

[0099] exist Figure 9 In step S5, a delivery instruction for the substrate 100 is sent to the host device 300, etc. Correspondingly, the substrate 100 after film thickness measurement is delivered from the measuring device 201 by a transport robot 302a disposed downstream of the measuring device 201.

[0100] <Second Implementation>

[0101] In the first embodiment, the vibration suppression part 114 is lowered to make it come into contact with the abutment part 2163, but conversely, the vibration suppression part 114 can be raised to make it come into contact with the abutment part 2163.

[0102] Figure 14 This is an operational illustration of the measurement unit 216A in this embodiment. First, regarding the structure of the measurement unit 216A, the differences from the measurement unit 216 in the first embodiment will be explained.

[0103] The measuring unit 216A is configured such that the support member 2162 of the measuring unit 216 in the first embodiment is a two-component structure, including an upper support member 2162A and a lower support member 2162B. The support member 2162B is a plate-shaped slider that can reciprocate in the Y direction by being guided by the guide rail 2143. In addition, a ball nut 2144 is provided on the support member 2162B.

[0104] The support member 2162A is provided with a measuring head 2161 and an abutment part 2163. The support member 2162A is supported on the support member 2162B via multiple guide shafts 2165.

[0105] A lifting unit 2164 is provided on the lower support member 2162B. The lifting unit 2164 raises and lowers the support member 2162A to multiple positions. In this embodiment, the support member 2162A rises and falls between two positions: a raised position and a lowered position. As a result, the abutment portion 2163 provided on the support member 2162A rises and falls.

[0106] The lifting unit 2164 includes a motor 2166 as a drive source and a cam plate 2167 mounted on the output shaft of the motor 2166. The cam plate 2167 is rotated by the motor 2166. The cam plate 2167 is a circular component with an eccentric cam on which the output shaft of the motor 2166 is mounted at a position offset from its center. By rotating the cam plate 2167, the support member 2162A can be raised or lowered relative to the support member 2162B.

[0107] The operation of the measuring unit 216A will be explained. Figure 14 State ST141 is equivalent to Figure 13 State ST12 shows the Z-direction positional relationship of the substrate 100, the vibration suppression section 114 of the base 2112, the measuring head 2161, and the contact section 2163 when the measuring unit 216A moves. The support member 2162A is in the lowered position. The measuring head 2161 moves on the substrate 100 in a state separated from the substrate 100. The contact section 2163 also moves in a state separated from the vibration suppression section 114.

[0108] When the measuring unit 216 moves to the measuring position P2 and stops, the lifting unit 2164 is driven to raise the support member 2162A to the raised position. Figure 14State ST142 shows the Z-direction positional relationship of the substrate 100, the vibration suppression section 114 of the base 2112, the measuring head 2161, and the contact section 2163 when the support member 2162A is raised to the raised position. The measuring head 2161 is positioned facing the inspection film 100c while separating from it. The contact section 2163 abuts against the vibration suppression section 114. By abutting against the vibration suppression section 114, the vibration of the measuring unit 216 is suppressed. Then, the film thickness of the inspection film 100c is measured by the measuring head 2161. By abutting against the vibration suppression section 114, the vibration of the measuring unit 216 is suppressed, therefore, even if the standby time until the vibration stops is shortened or eliminated, higher accuracy measurements can be performed. Furthermore, by abutting the contact portion 2163 and the vibration suppression portion 114, the distance between the measuring head 2161 and the inspection membrane 100c remains constant, enabling measurements with higher precision.

[0109] After the above steps, the film thickness measurement is completed. Upon completion of the film thickness measurement, the lifting unit 2164 is driven to lower the support member 2162A to the lowered position. The force pushing the support member 2162A upwards by the rotation of the cam plate 2167 no longer applies, and the support member 2162A descends to the lowered position due to its own weight (including the weight of the measuring head 2161 and the contact part 2163). The Z-direction positional relationship of the vibration suppression unit 114, the measuring head 2161, and the contact part 2163 is restored. Figure 14 The state of ST141. Then, the measuring unit 216A is moved from the measuring position P2 to the standby position P1 by the moving unit 214.

[0110] <Third Implementation Method>

[0111] In the second embodiment, the vibration suppression part 114 comes into contact with the contact part 2163 by independently moving the Y-direction of the measuring unit 216A and the Z-direction of the contact part 2163. However, it can also be configured such that the contact part 2163 moves in the Z-direction by moving the Y-direction of the measuring unit 216A.

[0112] Figure 15 This is an explanatory diagram of the operation of the measuring unit 216 and the moving unit 214 in this embodiment. First, regarding the structure of this embodiment, the differences from the first embodiment will be explained.

[0113] The structure of the measuring unit 216 and the moving unit 214 in this embodiment is basically the same as that in the first embodiment, but the measuring unit 216 and the moving unit 214 are mounted on the base member 2164A, which replaces the base member 2164 in the first embodiment.

[0114] The upper surface of the base member 2164A is an inclined surface 2164a. The inclined surface 2164a is inclined upward from the standby position P1 toward the standby position P2. The moving unit 214 is mounted on the inclined surface 2164a, and as a result, the guide rail 2143 and the ball screw shaft 2142 extend obliquely parallel to the inclined surface 2164a. The support member 2162 of the measuring unit 216 is also in a position parallel to the inclined surface 2164a, but the measuring head 2161 and the abutment portion 2163 are in a vertical position and are fixed in a position slightly inclined relative to the support member 2162. In addition, the width of the abutment portion 2163 in the Y direction is narrower than the width of the support member 2162 in the Y direction.

[0115] Figure 15 State ST151 is equivalent to Figure 11 The state ST11 indicates that the measuring unit 216 is in the standby position P1. The measuring head 2161 is located at a position lower than the substrate 100, and the contact portion 2163 is located at a position lower than the vibration suppression portion 114.

[0116] Figure 15 State ST152 indicates the intermediate state during which the measuring unit 216 is moved from the standby position P1 to the measuring position P2 by the moving unit 214. Along the inclination of the inclined surface 2164a, the measuring unit 216 moves upward while moving in the Y direction and approaches the substrate 100 and the base 2112 in the Z direction. However, the measuring unit 216 moves while the measuring head 2161 is separated from the substrate 100 and the contact portion 2163 is also separated from the vibration suppression portion 114.

[0117] Figure 15 State ST153 indicates that the measuring unit 216 has reached the measuring position P2. The contact part 2163 abuts against the vibration suppression part 114, and the moving unit 214 stops the movement of the measuring unit 216. The measuring head 2161 is located at a position facing the inspection membrane 100c while separating from it.

[0118] The vibration of the measuring unit 216 is suppressed by the contact between the contact portion 2163 and the vibration suppression portion 114. The thickness of the inspection film 100c is measured by the measuring head 2161. Because the vibration of the measuring unit 216 is suppressed by the contact between the contact portion 2163 and the vibration suppression portion 114, higher accuracy measurements can be performed even if the standby time until the vibration stops is shortened or eliminated. Furthermore, the distance between the measuring head 2161 and the inspection film 100c remains constant due to the contact between the contact portion 2163 and the vibration suppression portion 114, enabling even higher accuracy measurements.

[0119] The film thickness measurement is completed through the above steps. Upon completion of the film thickness measurement, the measuring unit 216 is moved from the measuring position P2 to the standby position P1 via the moving unit 214. Along the inclination of the inclined surface 2164a, the measuring unit 216 moves downwards while moving in the Y direction, and moves away from the substrate 100 and the base material 2112 in the Z direction, returning to the state ST151. In this embodiment, the measuring unit 216 can be moved in the Z direction with a relatively simple structure.

[0120] <Fourth Implementation>

[0121] In the first embodiment, an electrostatic chuck is exemplified as the substrate holding unit 211, but it may also be a unit that holds the substrate 100 by mechanically clamping the periphery of the substrate 100, or a unit that uses a force other than electrostatic force to adsorb the substrate 100.

[0122] Figure 16 This diagram shows a structural example of an adhesive substrate holding unit, and a structural example of a substrate 2112A that replaces the substrate 2112 in the first embodiment.

[0123] The substrate 2112A is, for example, composed of a plate-shaped component, and multiple adhesive attachments 152 are supported on the substrate 2112A. The substrate 100 can be held in place by the adhesive force of the multiple adhesive attachments 152. A vibration suppression section 114A, corresponding to the vibration suppression section 114 in the first embodiment, is formed at the periphery of the substrate 2112A. The vibration suppression section 114A abuts against the contact portion 2163 of the measuring unit 216 at the measuring position P2, suppressing the vibration of the measuring unit 216.

[0124] <Fifth Implementation>

[0125] Below, an example of a method for manufacturing an electronic device will be described. The structure and manufacturing method of an organic EL display device will be illustrated below as an example of an electronic device. In this example, Figure 1 The film-forming block 301 is exemplified by having three locations on the production line.

[0126] First, the organic EL display device to be manufactured will be explained. Figure 17 (A) is an overall view of the organic EL display device 50. Figure 17 (B) is a diagram representing the cross-sectional structure of 1 pixel.

[0127] like Figure 17 As shown in (A), in the display area 51 of the organic EL display device 50, a plurality of pixels 52, each having a plurality of light-emitting elements, are arranged in a matrix. Each light-emitting element has a structure having an organic layer held between a pair of electrodes, which will be described in detail later.

[0128] Furthermore, the term "pixel" as used herein refers to the smallest unit capable of displaying the desired color in the display area 51. In the case of a color organic EL display device, pixel 52 is constituted by a combination of multiple sub-pixels, namely a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, which emit different colors. Pixel 52 is typically composed of a combination of three types of sub-pixels: red (R) light-emitting elements, green (G) light-emitting elements, and blue (B) light-emitting elements, but is not limited thereto. Pixel 52 may contain at least one type of sub-pixel, preferably two or more, and more preferably three or more. For example, the sub-pixels constituting pixel 52 may also be a combination of four types of sub-pixels: red (R) light-emitting elements, green (G) light-emitting elements, blue (B) light-emitting elements, and yellow (Y) light-emitting elements.

[0129] Figure 17 (B) is Figure 17 A partial cross-sectional view along line A-B of (A). Pixel 52 has multiple sub-pixels composed of an organic EL element having a first electrode (anode) 54, a hole transport layer 55, a red layer 56R, a green layer 56G, a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. The hole transport layer 55, red layer 56R, green layer 56G, blue layer 56B, and electron transport layer 57 are equivalent to organic layers. The red layer 56R, green layer 56G, and blue layer 56B are respectively formed into patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue light, respectively.

[0130] Furthermore, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 can be formed commonly across multiple light-emitting elements 52R, 52G, and 52B, or they can be formed separately for each light-emitting element. That is, as shown... Figure 17 As shown in (B), after the hole transport layer 55 is formed as a common layer covering multiple sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B are formed separately for each sub-pixel region, and then the electron transport layer 57 and the second electrode 58 are formed as a common layer covering multiple sub-pixel regions on top of this.

[0131] Furthermore, to prevent short circuits between the adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Also, since the organic EL layer can deteriorate due to moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from the effects of moisture or oxygen.

[0132] exist Figure 17In (B), the hole transport layer 55 and the electron transport layer 57 are represented as a single layer, but depending on the structure of the organic EL display element, they can also be formed from multiple layers having a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure can be formed between the first electrode 54 and the hole transport layer 55 to allow holes to be smoothly injected from the first electrode 54 into the hole transport layer 55. Similarly, an electron injection layer can also be formed between the second electrode 58 and the electron transport layer 57.

[0133] The red layer 56R, green layer 56G, and blue layer 56B can each be formed from a single light-emitting layer, or they can be formed by stacking multiple layers. For example, the red layer 56R can be composed of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer can be a red light-emitting layer, and the upper layer can be an electron transport layer or a hole blocking layer. By setting layers on the lower or upper sides of the light-emitting layers in this way, the light-emitting position in the light-emitting layers can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

[0134] Furthermore, an example of red layer 56R is shown here, but green layer 56G and blue layer 56B can also adopt the same structure. Additionally, the number of layers can be two or more. Moreover, layers of different materials, such as the light-emitting layer and the electron-blocking layer, can be stacked, or layers of the same material, such as stacking two or more light-emitting layers, can be stacked.

[0135] The following is a detailed explanation of an example of a manufacturing method for an organic EL display device. Here, we assume that the red layer 56R consists of two layers: a lower layer 56R1 and an upper layer 56R2, while the green layer 56G and the blue layer 56B consist of a single light-emitting layer.

[0136] First, a substrate 53 is prepared, which has a circuit (not shown) for driving an organic EL display device and a first electrode 54. Furthermore, the material of the substrate 53 is not particularly limited and can be made of glass, plastic, metal, etc. In this embodiment, a substrate with a polyimide film laminated on a glass substrate is used as the substrate 53.

[0137] An acrylic or polyimide resin layer is coated onto a substrate 53 on which the first electrode 54 is formed by rod coating or spin coating. An insulating layer 59 is formed by patterning the resin layer in a way that creates an opening in the portion where the first electrode 54 is formed using photolithography. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0138] A substrate 53 with an insulating layer 59 patterned is fed into a first film-forming chamber 303, whereby a hole transport layer 55 is formed as a common layer on the first electrode 54 of the display area. The hole transport layer 55 is formed using a mask with openings in the display area 51 of the panel portion of the final organic EL display device.

[0139] Next, the substrate 53 to which the hole transport layer 55 is formed is fed into the second film deposition chamber 303. Alignment is performed between the substrate 53 and the mask, and the substrate is placed on the mask. A red layer 56R is deposited on the portion of the substrate 53 above the hole transport layer 55 where red elements are emitted (the region forming the red subpixels). Here, the mask used in the second film deposition chamber is a high-precision mask with openings formed only in the regions of the substrate 53 that become red subpixels, among the multiple regions that become subpixels in the organic EL display device. Thus, the red layer 56R, containing the red light-emitting layer, is deposited only in the regions of the multiple subpixels on the substrate 53 that become red subpixels. In other words, the red layer 56R is not deposited in the regions of the multiple subpixels on the substrate 53 that become blue subpixels or green subpixels, but selectively deposited in the regions that become red subpixels.

[0140] Similar to the deposition of the red layer 56R, the green layer 56G is deposited in the third deposition chamber 303, and then the blue layer 56B is deposited in the fourth deposition chamber 303. After the deposition of the red layer 56R, green layer 56G, and blue layer 56B is completed, the electron transport layer 57 is deposited over the entire display area 51 in the fifth deposition chamber 303. The electron transport layer 57 is formed as a common layer on the three-color layers 56R, 56G, and 56B.

[0141] The substrate to which the electron transport layer 57 is formed is moved to the sixth film deposition chamber 303, where the second electrode 58 is deposited. In this embodiment, each layer is deposited by vacuum evaporation in the first to sixth film deposition chambers 303. However, the present invention is not limited to this; for example, the second electrode 58 in the sixth film deposition chamber 303 can also be deposited by sputtering. Afterward, the substrate to which the second electrode 58 is formed is moved to a sealing device, and the protective layer 60 is deposited by plasma CVD (sealing process), completing the organic EL display device 50. Furthermore, here the protective layer 60 is formed by CVD, but it is not limited to this; it can also be formed by ALD or inkjet methods.

[0142] Here, the film deposition in the first to sixth film deposition chambers 303 is performed using a mask with openings corresponding to the patterns of each layer to be formed. During film deposition, after the relative positions (alignment) of the substrate 53 and the mask are adjusted, the substrate 53 is placed on top of the mask to perform film deposition.

[0143] <Other Implementation Methods>

[0144] The present invention can also be implemented by supplying a program that implements one or more functions of the above-described embodiments to a system or device via a network or storage medium, wherein one or more processors in the computer of the system or device read and execute the program. Alternatively, it can be implemented by a circuit (e.g., an ASIC) that implements one or more functions.

[0145] The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are appended to disclose the scope of the invention.

[0146] Explanation of reference numerals in the attached figures

[0147] 1 Film forming apparatus, 114 Vibration suppression unit, 201 Measuring device, 214 Moving unit, 216 Measuring unit.

Claims

1. A measuring device, characterized in that, The measuring device includes: A measuring component that optically measures the thickness of a film deposited on a substrate; A moving component that moves the measuring component from a standby position to a measuring position on the substrate; as well as A vibration suppression unit is provided, which abuts against the measuring component at the measuring position to suppress the vibration of the measuring component.

2. The measuring device according to claim 1, characterized in that, The measuring component includes: A measuring head that optically measures the film thickness; and The abutting part abuts against the vibration suppression part.

3. The measuring device according to claim 2, characterized in that, The abutment portion is formed by an elastic member.

4. The measuring device according to claim 1, characterized in that, The measuring device includes a substrate holding member for holding the substrate. The vibration suppression part is disposed on the substrate holding member.

5. The measuring device according to claim 4, characterized in that, The measuring device includes a lifting component that raises and lowers the substrate holding component to multiple positions. The plurality of locations include: The vibration suppression part abuts against the measuring component at a first position; and The vibration suppression part is separated from the measuring component at a second position.

6. The measuring device according to claim 5, characterized in that, The second position is the position where the vibration suppression part is positioned above the measuring component. When the measuring component moves to the measuring position, the lifting component causes the substrate holding component to descend from the second position to the first position.

7. The measuring device according to claim 2, characterized in that, The measuring component includes a lifting component that raises and lowers the abutment portion to multiple positions. The plurality of locations include: The first position where the abutting part abuts against the vibration damping part; and The second position where the contact portion is separated from the vibration suppression portion.

8. The measuring device according to claim 7, characterized in that, The second position is the position where the contact portion is located below the vibration suppression portion. When the measuring component moves to the measuring position, the lifting component causes the abutting portion to rise from the second position to the first position.

9. The measuring device according to claim 4, characterized in that, The substrate holding component includes: Electrode portion, the electrode portion forming an electrostatic chuck; and The substrate supports the electrode portion. The vibration damping section is part of the substrate.

10. The measuring device according to claim 1, characterized in that, The measuring device is located in the transfer chamber for transferring the substrate to the film-forming chamber for forming a film on the substrate.

11. A film-forming system, the film-forming system comprising: A first film-forming chamber, wherein a film is formed relative to the substrate; A second film-forming chamber, wherein a film is formed relative to the substrate; and The transfer chamber is used to transfer the substrate, after film formation in the first film formation chamber, to the second film formation chamber. Its features are, The handover room is equipped with a measuring device. The measuring device includes: A measuring component that optically measures the thickness of a film deposited on the substrate; A moving component that moves the measuring component from a standby position to a measuring position on the substrate; as well as A vibration suppression unit is provided, which abuts against the measuring component at the measuring position to suppress the vibration of the measuring component.

12. A method for manufacturing an electronic device, characterized in that, The method for manufacturing the electronic device includes: The process of forming a film on a substrate in the film-forming system of claim 11; and The process of measuring the film thickness of a film formed on a substrate in the film forming system.

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