A compression pump mechanism, radiator and vehicle

Abstract

The application relates to the technical field of heat exchange cooling, and particularly provides a pressure pump mechanism, a radiator and a vehicle. The pressure pump mechanism comprises a pump shell, the pump shell is provided with a liquid inlet and a liquid outlet; a pump swimming assembly comprises a deformable assembly and an inductor assembly, the movable end of the inductor assembly is connected with the deformable assembly, a pump cavity is formed between the deformable assembly and the pump shell, and the pump cavity is communicated with the liquid inlet and the liquid outlet; the deformable assembly is deformed through displacement of the movable end of the inductor assembly, so that the volume of the pump cavity is changed. The pressure pump mechanism can convert the displacement amount of the movable end of the inductor assembly into elastic deformation of the deformable assembly, can increase the volume change of the pump cavity, and can further increase the pumping speed and power of the cooling liquid and improve the pumping efficiency.

Description

Technical Field

[0001] This application relates to the field of heat exchange and cooling technology, specifically to a pump mechanism, a radiator, and a vehicle. Background Technology

[0002] The pump mechanism utilizes the piezoelectric effect of piezoelectric ceramics to displace the movable end of the piezoelectric ceramic, and then the displacement of the movable end of the piezoelectric ceramic generates a change in the volume of the pump chamber to achieve fluid output. However, the displacement of the movable end of the piezoelectric ceramic is small, resulting in low pumping efficiency of the pump mechanism. Summary of the Invention

[0003] The purpose of this application is to provide a pump mechanism, radiator, and vehicle to improve pumping efficiency.

[0004] To solve the above-mentioned technical problems, this application provides a pump mechanism, comprising:

[0005] A pump housing having an inlet and an outlet;

[0006] A pumping assembly includes a deformable component and an inductor component. The movable end of the inductor component is connected to the deformable component. A pump cavity is formed between the deformable component and the pump housing. The pump cavity is connected to the inlet and the outlet. The volume of the pump cavity is changed by the displacement of the movable end of the inductor component causing the deformable component to deform.

[0007] In the pump mechanism of this application, a deformable component is added to the pumping assembly. The deformable component and the pump housing form a pump chamber. The small displacement of the moving end of the inductor component can be converted into a large deformation of the deformable component, thereby increasing the volume change of the pump chamber, increasing the pumping speed and force of the coolant, and improving the pumping efficiency.

[0008] Optionally, the deformable component includes an elastic element and a linkage assembly, wherein:

[0009] The elastic element is connected to the pump housing, and the pump cavity is formed between the elastic element and the pump housing;

[0010] The linkage assembly connects the movable end of the inductor assembly and the elastic element. The linkage assembly can convert the displacement of the movable end of the inductor assembly into the elastic deformation of the elastic element, thereby changing the volume of the pump chamber.

[0011] Optionally, the deformable component further includes an elastic diaphragm located on the outer periphery of the elastic element and connecting the elastic element and the pump housing.

[0012] Optionally, the elastic element is deformable between a first position and a second position. In the first position, the elastic element bends toward the interior of the pump cavity and has maximum curvature. In the second position, the elastic element is planar.

[0013] Optionally, the linkage assembly includes a first linkage and a second linkage, one end of the first linkage is hinged to the movable end of the inductor assembly, the other end of the first linkage is slidably mounted on the second linkage, one end of the second linkage is hinged to the elastic member, and the other end of the second linkage has a hinge portion.

[0014] Optionally, the number of pumping assemblies is two, and the two pumping assemblies are arranged opposite each other in the lateral direction of the pump housing.

[0015] Optionally, the pump mechanism further includes a one-way inlet valve and a one-way outlet valve. The one-way inlet valve is installed on the pump housing and communicates with the pump chamber. The one-way inlet valve has the inlet port. The one-way outlet valve is installed on the pump housing and communicates with the pump chamber. The one-way inlet valve has the outlet port.

[0016] This application also provides a heat sink, comprising:

[0017] Heat-absorbing base plate;

[0018] Heat dissipation fins are connected to the heat absorption base plate. The heat dissipation fins are distributed in a serpentine pattern. The interior of the heat dissipation fins has cooling channels. The heat absorption base plate has an inlet and an outlet that communicate with the cooling channels.

[0019] The aforementioned pump mechanism is connected to the heat-absorbing base plate, the inlet is connected to the outlet of the pump mechanism, and the outlet is connected to the inlet of the pump mechanism.

[0020] The radiator of this application includes the aforementioned pump mechanism, and therefore has the same technical effect as the aforementioned pump mechanism, which will not be repeated here.

[0021] Optionally, there are multiple pump mechanisms, which are connected sequentially. The inlet of the foremost pump mechanism is connected to the outlet, and the outlet of the last pump mechanism is connected to the inlet.

[0022] In this section, along the flow direction of the coolant, the end closer to the upstream is the front end, and the end closer to the downstream is the rear end.

[0023] Optionally, there are multiple pump mechanisms, with the inlet of each pump mechanism connected to the outlet and the outlet of each pump mechanism connected to the inlet.

[0024] Optionally, the heat dissipation fins and the heat absorption base plate are integrally formed; or the heat dissipation fins and the heat absorption base plate are welded and fixed; or the heat dissipation fins and the heat absorption base plate are bonded and fixed.

[0025] Optionally, the heat-absorbing base plate is provided with a heat-absorbing boss on the side facing away from the heat dissipation fins.

[0026] Optionally, the heat-absorbing boss has an inner cavity, and the cooling channel communicates with the inner cavity.

[0027] Optionally, the heat-absorbing boss and the heat-absorbing base plate are integrally formed; or the heat-absorbing boss and the heat-absorbing base plate are welded and fixed; or the heat-absorbing boss and the heat-absorbing base plate are bonded and fixed.

[0028] This application also provides a vehicle including the aforementioned radiator.

[0029] The vehicle in this application includes the aforementioned radiator, and therefore has the same technical effect as the aforementioned radiator, which will not be repeated here. Attached Figure Description

[0030] Figure 1 A cross-sectional view of a specific embodiment of the pump mechanism provided in this application;

[0031] Figure 2 for Figure 1 A diagram showing the state of the elastic element in the pump mechanism at the first and second positions.

[0032] Figure 3 for Figure 1 Schematic diagram of the inductor assembly in the pump mechanism;

[0033] Figure 4 This is a schematic diagram of the structure of a first specific embodiment of the radiator provided in this application;

[0034] Figure 5 for Figure 4 A cross-sectional view of the radiator;

[0035] Figure 6 for Figure 4 A schematic diagram of the heat dissipation fins in a radiator;

[0036] Figure 7 A schematic diagram of the structure of a second specific embodiment of the heat sink provided in this application;

[0037] Figure 8 This is a schematic diagram of the structure of a third specific embodiment of the heat sink provided in this application;

[0038] Figure 9 This is a schematic diagram of the structure of the fourth specific embodiment of the heat sink provided in this application;

[0039] in, Figures 1-9 The accompanying figure labels are as follows:

[0040] 1-Pump mechanism; 11-Pump housing; 111-Inlet; 112-Outlet; 113-Pump chamber; 12-Pump assembly; 121-Elastic element; 122-Inductor assembly; 1221-Moving end; 123-Linkage assembly; 1231-First link; 1232-Second link; 124-Elastic diaphragm; 13-One-way inlet valve; 14-One-way outlet valve;

[0041] 2-Heat-absorbing base plate; 21-Inlet; 22-Outlet;

[0042] 3-Heat dissipation fins; 31-Cooling flow channels;

[0043] 4-Heat-absorbing boss;

[0044] 5-Connecting pipes. Detailed Implementation

[0045] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] In this article, "multiple" usually refers to two or more.

[0047] In this paper, the extension direction of the pump housing 11 is defined as longitudinal, that is, the flow direction of the coolant in the pump housing 11 is longitudinal, and the direction perpendicular to the extension direction of the pump housing 11 is transverse.

[0048] Please refer to Figures 1-3 , Figure 1 A cross-sectional view of a specific embodiment of the pump mechanism provided in this application; Figure 2 for Figure 1 A diagram showing the state of the elastic element in the pump mechanism at the first and second positions. Figure 3 for Figure 1 A schematic diagram of the inductor assembly in the pump mechanism.

[0049] This application provides a pump mechanism 1, including:

[0050] Pump housing 11, which has a liquid inlet 111 and a liquid outlet 112;

[0051] The pumping assembly 12 includes a deformable component and an inductor component 122. The movable end 1221 of the inductor component 122 is connected to the deformable component. A pump chamber 113 is formed between the deformable component and the pump housing 11. The pump chamber 113 is connected to the inlet 111 and the outlet 112. The displacement of the movable end 1221 of the inductor component 122 causes the deformable component to deform, thereby changing the volume of the pump chamber 113.

[0052] In the pump mechanism 1 of this application, a deformable component is added to the pumping assembly 12. The deformable component and the pump housing 11 form a pump chamber 113. The small displacement of the movable end 1221 of the inductor component 122 can be converted into a large deformation of the deformable component, thereby increasing the volume change of the pump chamber 113, increasing the pumping speed and force of the coolant, and improving the pumping efficiency.

[0053] Among them, such as Figure 1 As shown, the inductor 122 is located on the lateral side of the pump housing 11. The end of the inductor 122 away from the pump housing 11 is the fixed end, and the end of the inductor 122 close to the pump housing 11 is the movable end 1221. Based on the piezoelectric effect, the inductor 122 can deform, causing the movable end 1221 of the inductor 122 to move in the direction of approaching or moving away from the pump housing 11.

[0054] like Figure 3 As shown in some embodiments of this application, the inductor assembly 122 can specifically be a piezoelectric ceramic assembly. The inductor assembly 122 includes multiple piezoelectric ceramic sheets, which are stacked to significantly increase the displacement of the movable end 1221 of the inductor assembly 122. Along the stacking direction, one end of the inductor assembly 122 is the movable end 1221, and the other end is the fixed end. During operation, the fixed end is fixed on a rigid structure, and under the action of the excitation voltage, the movable end 1221 can move along the stacking direction to achieve power output.

[0055] Furthermore, in some embodiments of this application, the deformable component includes an elastic element 121 and a linkage assembly 123, wherein:

[0056] The elastic element 121 is connected to the pump housing 11, and a pump chamber 113 is formed between the elastic element 121 and the pump housing 11.

[0057] The linkage assembly 123 is connected between the movable end 1221 of the inductor assembly 122 and the elastic member 121. The linkage assembly 123 can convert the displacement of the movable end 1221 of the inductor assembly 122 into the elastic deformation of the elastic member 121, so as to change the volume of the pump chamber 113.

[0058] As configured above, the linkage assembly 123 connects the movable end 1221 of the inductor assembly 122 and the elastic element 121, acting as a displacement amplifier. It converts the small lateral displacement of the movable end 1221 into a large elastic deformation of the elastic element 121. For example, when the movable end 1221 moves closer to the inside of the pump housing 11, under the transmission action of the linkage assembly 123, the elastic element 121 gradually bends closer to the inside of the pump cavity 113. During this process, the volume of the pump cavity 113 gradually decreases, and the pressure inside the pump cavity 113 gradually... As the volume of the pump chamber gradually increases, the coolant inside the pump chamber 113 can only be discharged from the outlet 112. When the movable end 1221 moves away from the inside of the pump housing 11, under the transmission action of the connecting rod assembly 123, the elastic element 121 gradually returns to the planar state. During this process, the volume of the pump chamber 113 gradually increases and the pressure inside the pump chamber 113 gradually decreases. Therefore, external coolant can only be replenished into the inside of the pump chamber 113 through the inlet 111. This cycle is repeated to provide power for the coolant and realize the circulation of the coolant.

[0059] Therefore, in this embodiment, the pump mechanism 1 converts the small displacement of the movable end 1221 of the inductor assembly 122 into a large elastic deformation of the elastic member 121 through the connecting rod assembly 123, thereby increasing the volume change of the pump chamber 113, and thus increasing the pumping speed and force of the coolant, and improving the pumping efficiency.

[0060] Please continue to refer to this. Figure 1 and Figure 2 In this embodiment, the deformable component further includes an elastic diaphragm 124, which is located on the outer periphery of the elastic member 121 and connects the elastic member 121 and the pump housing 11.

[0061] As described above, the elastic diaphragm 124 is made of a flexible material such as rubber or polyurethane, and it stably connects the elastic element 121 and the pump housing 11 during the deformation of the elastic element 121, ensuring that the pump chamber 113 remains sealed at all times; at the same time, by Figure 2 It can be seen that the elastic diaphragm 124 is equivalent to a linkage mechanism connecting the elastic element 121 and the pump housing 11. The setting of the elastic diaphragm 124 is beneficial to increasing the curvature change range of the elastic element 121, increasing the volume change of the pump chamber 113, increasing the pumping speed and force of the coolant, and improving the pumping efficiency.

[0062] Depend on Figure 2 As can be seen, in this embodiment, the elastic member 121 can deform between the first position and the second position. In the first position, the elastic member 121 bends into the pump cavity 113 and has the maximum curvature; in the second position, the elastic member 121 is in a planar state.

[0063] As configured above, in the first position, the elastic element 121 bends inward toward the pump chamber 113, with the elastic element 121 having the maximum curvature and the pump chamber 113 having the minimum volume; in the second position, the elastic element 121 is in a planar state, with the elastic element 121 having the minimum curvature and the pump chamber 113 having the maximum volume. By deforming the elastic element 121 between the first and second positions, the volume of the pump chamber 113 can be changed, so that the coolant can obtain power under pressure and realize the output of coolant.

[0064] Please continue to refer to this. Figure 1 and Figure 2 In this embodiment, the linkage assembly 123 includes a first linkage 1231 and a second linkage 1232. One end of the first linkage 1231 is hinged to the movable end 1221, and the other end of the first linkage 1231 is slidably mounted on the second linkage 1232. One end of the second linkage 1232 is hinged to the elastic member 121, and the other end of the second linkage 1232 has a hinge portion for hinged to a rigid structure.

[0065] As configured above, when the movable end 1221 of the inductor assembly 122 moves towards the inside of the pump housing 11, the first connecting rod 1231 rotates counterclockwise, causing the second connecting rod 1232 to rotate counterclockwise, causing the elastic element 121 to gradually bend towards the inside of the pump chamber 113. During this process, the volume of the pump chamber 113 gradually decreases, and the pressure inside the pump chamber 113 gradually increases, so that the coolant inside the pump chamber 113 can only be discharged from the outlet 112. When the movable end 1221 of the inductor assembly 122 moves away from the inside of the pump housing 11, the first connecting rod 1231 rotates clockwise, causing the second connecting rod 1232 to rotate clockwise, causing the elastic element 121 to gradually return to a flat state. During this process, the volume of the pump chamber 113 gradually increases, and the pressure inside the pump chamber 113 gradually decreases. Therefore, external coolant can only be replenished into the inside of the pump chamber 113 through the inlet 111.

[0066] Therefore, this embodiment, through the arrangement of the first link 1231 and the second link 1232 as described above, converts the lateral displacement of the inductor component 122 into the elastic deformation motion of the elastic member 121, thereby amplifying the displacement of the inductor component 122, increasing the volume change of the pump chamber 113, and thus increasing the pumping speed and force of the coolant, and improving the pumping efficiency.

[0067] The second connecting rod 1232 has a groove along its extension direction, and the other end of the first connecting rod 1231 is slidably mounted in the groove. In this way, the groove can guide the first connecting rod 1231 and ensure the movement accuracy of the connecting rod assembly 123.

[0068] Please continue to refer to this. Figure 1 and Figure 2In this embodiment, there are two pumping components 12, which are arranged opposite each other along the lateral side of the pump housing 11.

[0069] As configured above, when the movable ends 1221 of the two inductor components 122 move simultaneously toward the inside of the pump housing 11, the two elastic elements 121 bend simultaneously toward each other. During this process, the volume of the pump chamber 113 gradually decreases, and the pressure inside the pump chamber 113 gradually increases, causing the coolant inside the pump chamber 113 to be discharged from the outlet 112. When the two movable ends 1221 move simultaneously away from the inside of the pump housing 11, the two elastic elements 121 gradually recover until the two elastic elements 121 are in a planar state. During this process, the volume of the pump chamber 113 gradually increases, and the pressure inside the pump chamber 113 gradually decreases, allowing external coolant to be replenished into the pump chamber 113 through the inlet 111.

[0070] It is understood that when there is only one pumping assembly 12, the volume change of the pump chamber 113 can also be achieved through the elastic deformation movement of one elastic element 121. Therefore, in some embodiments of this application, the number of pumping assemblies 12 can be at least one. Of course, as mentioned above, when there are two pumping assemblies 12, the simultaneous elastic deformation movement of the two elastic elements 121 can result in a larger volume change of the pump chamber 113, further increasing the pumping output and pumping speed of the coolant, and further improving the pumping efficiency of the pumping mechanism 1, which is a more preferred technical solution.

[0071] Please continue to refer to this. Figure 1 and Figure 2 In this embodiment, the pump mechanism 1 further includes a one-way inlet valve 13 and a one-way outlet valve 14. The one-way inlet valve 13 is installed on the pump housing 11 and communicates with the pump chamber 113. The one-way inlet valve 13 has an inlet port 111. The one-way outlet valve 14 is installed on the pump housing 11 and communicates with the pump chamber 113. The one-way inlet valve 13 has an outlet port 112.

[0072] With the one-way inlet valve 13 and one-way outlet valve 14 configured as described above, when the pressure inside the pump chamber 113 increases, the coolant inside the pump chamber 113 can only be discharged from the outlet 112 in one direction; while when the pressure inside the pump chamber 113 decreases, the external coolant can only enter the pump chamber 113 from the inlet 111 in one direction. Thus, the pump mechanism 1 can provide power for the coolant and realize the circulation of the coolant.

[0073] Please refer to Figures 4-6 , Figure 4 This is a schematic diagram of the structure of a first specific embodiment of the radiator provided in this application; Figure 5 for Figure 4 A cross-sectional view of the radiator; Figure 6 for Figure 4A schematic diagram of the heat dissipation fins in a radiator.

[0074] This embodiment also provides a heat sink, including:

[0075] Heat-absorbing base plate 2;

[0076] Heat dissipation fins 3 are connected to heat absorption base plate 2. The heat dissipation fins 3 are distributed in a serpentine shape. The interior of the heat dissipation fins 3 has a cooling channel 31. The heat absorption base plate 2 has an inlet 21 and an outlet 22 that communicate with the cooling channel 31.

[0077] The aforementioned pump mechanism 1 is connected to the heat absorption base plate 2. The inlet 21 is connected to the outlet 112 of the pump mechanism 1, and the outlet 22 is connected to the inlet 111 of the pump mechanism 1.

[0078] The radiator in this embodiment includes the aforementioned pump mechanism 1, and therefore has the same technical effect as the aforementioned pump mechanism 1, which will not be repeated here.

[0079] Furthermore, most intelligent driving controllers in related technologies use water cooling, but this requires an external water system connected to the vehicle. As the level of intelligence continues to improve, the size of intelligent driving controllers continues to increase. The placement of intelligent driving controllers in the vehicle is greatly limited by the location of water pipes, which greatly affects the assembly of intelligent driving controllers and also restricts the placement of other vehicle components.

[0080] The heat sink in this embodiment includes a pump mechanism 1, a heat-absorbing base plate 2, and heat dissipation fins 3. The heat-absorbing base plate 2 is used to contact the electronic device and absorb the heat from the electronic device. The heat dissipation fins 3 have cooling channels 31 inside, through which coolant flows. The heat dissipation fins 3 are distributed in a serpentine pattern, which significantly increases the contact area with the air. Heat dissipation is achieved through heat radiation and heat convection with the air, thereby improving heat dissipation efficiency. The pump mechanism 1 is used to provide power for the coolant, so that the coolant circulates inside the pump mechanism 1, the heat-absorbing base plate 2, and the heat dissipation fins 3, continuously realizing heat exchange between the coolant and the electronic device, reducing the operating temperature of the electronic device, and extending the service life of the electronic device.

[0081] Therefore, it can be seen that the radiator in this embodiment can achieve self-circulation of coolant, eliminating the need for external vehicle water circuits, reducing the length of on-vehicle piping, lowering costs, reducing external interfaces of the radiator, making the radiator smaller in size, and allowing for more flexible placement on the vehicle, minimizing the impact on the assembly of the intelligent driving controller, and minimizing the impact on the placement of other vehicle components.

[0082] In the pump mechanism 1, the fixed end of the inductor assembly 122 can be fixed to the heat-absorbing base plate 2, and the hinge part of the second connecting rod 1232 can be hinged to the heat-absorbing base plate 2.

[0083] Depend on Figure 4 As can be seen, the radiator in this embodiment is equipped with a pressure pump mechanism 1, which reduces the cost of the radiator while meeting the heat dissipation requirements.

[0084] In addition, such as Figure 4 and Figure 5 As shown, the radiator in this embodiment also includes connecting pipes 5 connected to both ends of the pump mechanism 1. The liquid inlet 111 of the pump mechanism 1 and the outlet 22 of the heat absorption base plate 2 are connected through one of the connecting pipes 5, and the liquid outlet 112 of the pump mechanism 1 and the inlet 21 of the heat absorption base plate 2 are connected through the other connecting pipe 5, thereby realizing the connection between the pump mechanism 1 and the heat absorption base plate 2.

[0085] Please refer to Figure 7 , Figure 7 This is a schematic diagram of the structure of a second specific embodiment of the heat sink provided in this application.

[0086] In some other embodiments of this application, there are multiple pump mechanisms 1, and the multiple pump mechanisms 1 are connected in sequence. The inlet 111 of the foremost pump mechanism 1 is connected to the outlet 22, and the outlet 112 of the last pump mechanism 1 is connected to the inlet 21.

[0087] In this section, along the flow direction of the coolant, the end closer to the upstream is the front end, and the end closer to the downstream is the rear end.

[0088] As set up above, the heat sink in this embodiment adopts a series drive form of multiple pump mechanisms 1. The output of adjacent front pump mechanism 1 serves as the input of adjacent rear pump mechanism 1. Under the action of multiple pump mechanisms 1, the flow rate of coolant is further increased, thereby removing the heat generated by electronic devices more quickly and maintaining the electronic devices in the optimal operating temperature range. At the same time, multiple pump mechanisms 1 can also form a redundant design. When some pump mechanisms 1 are damaged, the remaining pump mechanisms 1 can still work normally, ensuring the normal operation of the heat sink.

[0089] Depend on Figure 7 As can be seen, in this embodiment, there are two pump mechanisms 1. In practice, the number of pump mechanisms 1 can be adjusted according to the heat dissipation requirements; for example, the number of pump mechanisms 1 can be three or more.

[0090] Please refer to Figure 8 , Figure 8 This is a schematic diagram of the structure of a third specific embodiment of the heat sink provided in this application.

[0091] In some other embodiments of this application, there are multiple pump mechanisms 1, with the inlet 111 of each pump mechanism 1 connected to the outlet 22 and the outlet 112 of each pump mechanism 1 connected to the inlet 21.

[0092] As set above, the heat sink in this embodiment adopts a parallel drive form of multiple pump mechanisms 1. Multiple pump mechanisms 1 work together to provide power to the coolant, further increasing the flow rate of the coolant, thereby removing the heat generated by the electronic devices more quickly and maintaining the electronic devices in the optimal operating temperature range. At the same time, multiple pump mechanisms 1 can also form a redundant design. When some pump mechanisms 1 are damaged, the remaining pump mechanisms 1 can still work normally, ensuring the normal operation of the heat sink.

[0093] Depend on Figure 8 As can be seen, in this embodiment, there are three pump mechanisms 1. In practice, the number of pump mechanisms 1 can be adjusted according to the heat dissipation requirements; for example, there can be two or more pump mechanisms 1.

[0094] Furthermore, in this embodiment, the heat dissipation fins 3 and the heat absorption base plate 2 can be integrally formed, such as by integral die casting. On the one hand, this simplifies the processing technology of the heat dissipation fins 3 and the heat absorption base plate 2 and reduces processing costs. On the other hand, the integral forming design of the heat dissipation fins 3 and the heat absorption base plate 2 can improve the overall integrity of the heat sink, further enhance the heat conduction efficiency, improve the heat dissipation performance of the heat sink, effectively reduce the heat of electronic devices, and maintain the normal operating temperature of electronic devices.

[0095] In other embodiments of this application, the heat dissipation fins 3 and the heat absorption base plate 2 are welded and fixed. For example, welding processes such as ultrasonic welding, resistance welding, and friction welding can be used to fix the heat dissipation fins 3 and the heat absorption base plate 2, ensuring reliable connection between the heat dissipation fins 3 and the heat absorption base plate 2, and facilitating heat transfer between the heat dissipation fins 3 and the heat absorption base plate 2.

[0096] In other embodiments of this application, the heat dissipation fins 3 and the heat absorption base plate 2 are bonded and fixed together, such as by bonding the heat dissipation fins 3 and the heat absorption base plate 2 with thermally conductive adhesive. The heat conduction interface between the heat dissipation fins 3 and the heat absorption base plate 2 is relatively tight, which effectively improves the heat conduction efficiency.

[0097] Please refer to Figure 9 , Figure 9 This is a schematic diagram of the fourth specific embodiment of the heat sink provided in this application.

[0098] In this embodiment, a heat-absorbing boss 4 is provided on the side of the heat-absorbing base plate 2 facing away from the heat dissipation fins 3.

[0099] The position and size of the heat-absorbing boss 4 can be determined according to the heat dissipation requirements of the electronic device. During operation, the heat-absorbing boss 4 is in contact with the electronic device. The heat-absorbing boss 4 can effectively conduct the heat generated by the electronic device to the heat-absorbing base plate 2, so that the coolant and the electronic device can exchange heat efficiently and reduce the operating temperature of the electronic device.

[0100] In some embodiments of this application, the heat-absorbing boss 4 and the heat-absorbing base plate 2 are integrally formed. For example, the heat-absorbing boss 4 and the heat-absorbing base plate 2 are integrally die-cast. On the one hand, this simplifies the processing technology of the heat-absorbing boss 4 and reduces processing costs. On the other hand, the integral forming design of the heat-absorbing boss 4 and the heat-absorbing base plate 2 can further improve the heat conduction efficiency, improve the heat dissipation performance of the heat sink, effectively reduce the heat of electronic devices, and maintain the normal operating temperature of electronic devices.

[0101] In other embodiments of this application, the heat-absorbing boss 4 and the heat-absorbing base plate 2 are welded and fixed. For example, welding processes such as ultrasonic welding, resistance welding, and friction welding can be used to fix the heat-absorbing boss 4 and the heat-absorbing base plate 2, ensuring that the connection between the heat-absorbing boss 4 and the heat-absorbing base plate 2 is reliable and facilitating heat transfer between the heat-absorbing boss 4 and the heat-absorbing base plate 2.

[0102] In other embodiments of this application, the heat-absorbing boss 4 and the heat-absorbing base plate 2 are bonded together, such as by using thermally conductive adhesive. The thermal conduction interface between the heat-absorbing boss 4 and the heat-absorbing base plate 2 is relatively tight, which improves the heat conduction efficiency.

[0103] Furthermore, in some embodiments of this application, the heat-absorbing boss 4 has an inner cavity, and the cooling channel 31 communicates with the inner cavity.

[0104] In this way, the coolant can flow directly into the interior of the heat-absorbing boss 4 to exchange heat with the electronic components, shortening the heat transfer path and enabling the heat from the electronic components to be quickly transferred to the coolant, thereby improving heat dissipation efficiency.

[0105] To ensure that the heat-absorbing boss 4 has good thermal conductivity, the heat-absorbing boss 4 can be made of a high thermal conductivity material such as copper.

[0106] This embodiment also provides a vehicle including the aforementioned radiator.

[0107] The vehicle in this embodiment includes the aforementioned radiator, and therefore has the same technical effects as the aforementioned radiator, which will not be repeated here.

[0108] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A pump mechanism, characterized in that, include: A pump housing having an inlet and an outlet; A pumping assembly includes a deformable component and an inductor component. The movable end of the inductor component is connected to the deformable component. A pump cavity is formed between the deformable component and the pump housing. The pump cavity is connected to the inlet and the outlet. The volume of the pump cavity is changed by the displacement of the movable end of the inductor component causing the deformable component to deform.

2. The pump mechanism according to claim 1, characterized in that, The deformable component includes an elastic element and a linkage assembly, wherein: The elastic element is connected to the pump housing, and the pump cavity is formed between the elastic element and the pump housing; The linkage assembly connects the movable end of the inductor assembly and the elastic element. The linkage assembly can convert the displacement of the movable end of the inductor assembly into the elastic deformation of the elastic element, thereby changing the volume of the pump chamber.

3. The pump mechanism according to claim 2, characterized in that, The deformable component further includes an elastic diaphragm located on the outer periphery of the elastic element and connecting the elastic element and the pump housing.

4. The pump mechanism according to claim 2 or 3, characterized in that, The elastic element is deformable between a first position and a second position. In the first position, the elastic element bends toward the interior of the pump cavity and has maximum curvature. In the second position, the elastic element is in a planar state.

5. The pump mechanism according to any one of claims 2-4, characterized in that, The linkage assembly includes a first linkage and a second linkage. One end of the first linkage is hinged to the movable end of the inductor assembly, and the other end of the first linkage is slidably mounted on the second linkage. One end of the second linkage is hinged to the elastic member, and the other end of the second linkage has a hinge portion.

6. The pump mechanism according to any one of claims 1-5, characterized in that, The number of pumping components is two, and the two pumping components are arranged opposite each other in the lateral direction along the pump casing.

7. The pump mechanism according to any one of claims 1-6, characterized in that, The pump mechanism further includes a one-way inlet valve and a one-way outlet valve. The one-way inlet valve is installed on the pump housing and communicates with the pump chamber. The one-way inlet valve has the inlet port. The one-way outlet valve is installed on the pump housing and communicates with the pump chamber. The one-way inlet valve has the outlet port.

8. A radiator, characterized in that, include: Heat-absorbing base plate; Heat dissipation fins are connected to the heat absorption base plate. The heat dissipation fins are distributed in a serpentine pattern. The interior of the heat dissipation fins has cooling channels. The heat absorption base plate has an inlet and an outlet that communicate with the cooling channels. The pump mechanism according to any one of claims 1-7, wherein the pump mechanism is connected to the heat-absorbing base plate, the inlet is connected to the liquid outlet of the pump mechanism, and the outlet is connected to the liquid inlet of the pump mechanism.

9. The radiator according to claim 8, characterized in that, The number of pump mechanisms is multiple, and the multiple pump mechanisms are connected in sequence. The inlet of the foremost pump mechanism is connected to the outlet, and the outlet of the last pump mechanism is connected to the inlet. In this section, along the flow direction of the coolant, the end closer to the upstream is the front end, and the end closer to the downstream is the rear end.

10. The radiator according to claim 8, characterized in that, The number of pump mechanisms is multiple, and the inlet of each pump mechanism is connected to the outlet, and the outlet of each pump mechanism is connected to the inlet.

11. The radiator according to any one of claims 8-10, characterized in that, The heat dissipation fins and the heat absorption base plate are integrally formed; or the heat dissipation fins and the heat absorption base plate are welded and fixed; or the heat dissipation fins and the heat absorption base plate are bonded and fixed.

12. The radiator according to any one of claims 8-11, characterized in that, The heat-absorbing base plate has a heat-absorbing protrusion on the side facing away from the heat dissipation fins.

13. The radiator according to claim 12, characterized in that, The heat-absorbing boss has an inner cavity, and the cooling channel communicates with the inner cavity.

14. The radiator according to claim 12 or 13, characterized in that, The heat-absorbing boss and the heat-absorbing base plate are integrally formed; or the heat-absorbing boss and the heat-absorbing base plate are welded and fixed; or the heat-absorbing boss and the heat-absorbing base plate are bonded and fixed.

15. A vehicle, characterized in that, Includes the heat sink as described in any one of claims 8-14.

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