A secondary system composite base for semiconductor devices
Patent Information
- Application Number
- CN202611147872.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-30
- Publication Date
- 2026-10-23
AI Technical Summary
1)基座分为混凝土结构和钢结构基座,需要在基座顶部预留孔洞便于半导体设备与各系统管线衔接安装;而基座和二次配管配线一般分别由不同厂商设计制作,安装过程中常会衔接不通畅,导致二次设计或设计更变,以及返工等情况,且安全隐患较多,质量控制风险偏高;
[0015] The advantages of this invention are: its reasonable structural design allows for modular integration of the secondary distribution systems required by semiconductor equipment, such as gas, cooling water, vacuum, exhaust, and electrical systems, with the equipment base; it can be prefabricated in the factory and assembled as a whole; compared with the existing technology of separate construction, it can reduce docking errors, shorten the construction cycle, reduce the occupation of clean space, and simplify the modification and disassembly; it has good structural rigidity and leveling accuracy, and the interface standard is universal, which can effectively reduce the engineering construction cost, adapt to the upgrading and transformation of multiple generations of semiconductor equipment, and has good applicability and practicality.
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Figure CN122960818A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a composite base for a semiconductor secondary distribution system, specifically to a composite base for a semiconductor manufacturing equipment secondary distribution system. Background Technology
[0002] With the rapid development of the electronics and semiconductor industry, advanced chip manufacturing processes have progressed from the mainstream mature 28nm to 2nm mass production, entering a period of rapid technological iteration. Upgrading and transformation using high-end precision production equipment has become a trend. How to address the long construction cycle of semiconductor factories and put them into production as quickly as possible has become one of their main pain points. The construction cycle of semiconductor factories is a key factor in their success, determining whether a product can succeed in the market.
[0003] In existing technologies, semiconductor factories involve numerous production equipment, complex connections for various water, electricity, gas, and drainage systems, limited on-site space, and extremely stringent construction requirements. Conventional construction practices in the semiconductor industry typically include: first, designing and fabricating the base body according to seismic requirements, including a base platform plate with several openings, supported by top beams, longitudinal beams, and diagonal beams beneath the platform plate, and supported by square steel support legs with fixing components or adjustable feet beneath the beams; then, positioning and installing the base on-site on a concrete floor slab with functional waffle holes; and finally, positioning and installing secondary piping and wiring on-site.
[0004] The existing construction methods described above have the following problems: 1) The base is divided into concrete structure and steel structure base. Holes need to be reserved on the top of the base to facilitate the connection and installation of semiconductor equipment and various system pipelines. However, the base and secondary piping and wiring are generally designed and manufactured by different manufacturers. During the installation process, the connection is often not smooth, which leads to secondary design or design changes, as well as rework and other situations. In addition, there are many safety hazards and the quality control risks are relatively high. 2) In the conventional secondary piping construction sequence of process equipment, the length of the base installation period restricts the length of the secondary piping and wiring construction period, thus affecting the entire secondary piping construction cycle; 3) In the secondary distribution of process equipment, operating valve panels are generally required for bulk gas, process cooling water (PCW) and process vacuum (PV), which occupy the space of the raised floor near the process equipment, thus occupying a large amount of cleanroom space. 4) When the process equipment needs to be upgraded or modified, the dismantling of the base and pipelines is time-consuming and labor-intensive, and there are many safety hazards in the dismantling process. Summary of the Invention
[0005] This invention proposes a composite base for a secondary distribution system of semiconductor equipment. Its purpose is to overcome the above-mentioned shortcomings of the existing technology, and to modularly and systematically integrate the semiconductor equipment base with each system pipeline to form an integral composite base. While ensuring the micro-vibration resistance function, it simplifies the connection and installation of each system pipeline, shortens the construction period, reduces the space occupied, and reduces the installation cost.
[0006] The technical solution of this invention is a composite base for a secondary distribution system of semiconductor equipment. Its structure includes a base body fixed to the top surface of a porous concrete waffle slab with uniformly distributed functional waffle holes. The base body has several openings, each at which a unit interface module plate / box is installed. Each unit interface module plate / box has a semiconductor production equipment connection interface, and each unit interface module plate / box is connected to a pipeline. The pipeline extends through the functional waffle holes to the bottom of the porous concrete waffle slab. The interface plates (boxes) are installed on the composite base, integrating the design, prefabrication, and installation of the composite base and pipelines. Pipelines are connected via accessory interfaces on the interface plates (boxes), making installation quick and convenient, shortening the construction period, and saving space for production equipment installation. All water, electricity, gas, and drainage system accessories can be connected using semiconductor industry-standard methods, ensuring strong versatility and facilitating maintenance and repair.
[0007] Preferably, the base body includes a platform plate, a top beam, longitudinal beams, inclined beams, square steel support legs, and adjustable feet. The bottom surface of the platform plate, which has several openings, is supported by horizontally distributed top beams, longitudinal beams, and inclined beams. Adjustable feet are supported at the bottom edges of the top beams and longitudinal beams. Square steel support legs are supported between adjacent adjustable feet. L / T-shaped fasteners are connected to the bottom side of the square steel support legs.
[0008] Preferably, the pipeline extends to the underside of the porous concrete waffle slab via a cable bridge or cable conduit.
[0009] Preferably, when the base body is not fixed to the top surface of the porous concrete waffle slab, its bottom is supported on a mobile platform. The mobile platform includes support legs with swivel casters mounted on their bottom ends. Several support legs are correspondingly installed at the bottom of the steel support legs on each side of the base body. Horizontally arranged reinforcing steel is connected between adjacent support legs, and diagonal bracing steel is connected between the lower middle part of each support leg and the adjacent reinforcing steel. The mobile platform is used to assist in the fabrication of the base body, the support legs support the production and processing of the base body, and the swivel casters at the bottom of the support legs facilitate the handling and auxiliary positioning and installation of the base body.
[0010] Preferably, the unit interface module board / box is an HPN2, UN2, or PV interface board. The valve disc fixing panel includes a horizontal part and several vertical parts integrally formed with the edge of the horizontal part. The vertical parts are connected to the platform plate by bolts. Each independent ordinary nitrogen passage, ultra-high purity nitrogen passage, and process vacuum passage are fixed on the horizontal part of the valve disc fixing panel. Each passage is fixed to the horizontal part of the valve disc fixing panel by several pipe fixing clips. The pipe fixing clips are fixed to the horizontal part of the valve disc fixing panel by mounting bolts.
[0011] Preferably, along one end of the ordinary nitrogen passage, a UN2 gas inlet ferrule interface, a ball valve, a pressure regulating valve, a pressure gauge, and a UN2 gas outlet sealing interface are sequentially provided; along one end of the ultra-high purity nitrogen passage, an HPN2 gas outlet sealing interface, a diaphragm valve, and an HPN2 gas inlet sealing interface are sequentially provided, wherein the HPN2 gas inlet sealing interface extends vertically to below the horizontal part of the valve disc fixing panel, and a pressure regulating valve, a pressure gauge, and a check valve are also provided between the diaphragm valve and the HPN2 gas inlet sealing interface; along one end of the process vacuum passage, a PV outlet ferrule interface and a PV inlet ferrule interface are sequentially provided, the PV inlet ferrule interface extends vertically to below the horizontal part of the valve disc fixing panel, and a ball valve is also provided between the PV outlet ferrule interface and the PV inlet ferrule interface.
[0012] Alternatively, preferably, the unit interface module board / box is an HPN2, UN2, NH3, or DCS interface box, the structure of which includes a valve disc box with a valve disc box cover, and the valve disc box is provided with its own independent negative pressure exhaust passage, ordinary driving nitrogen passage, ultra-high purity nitrogen passage, ammonia passage, dichlorosilane passage and special gas passage.
[0013] Preferably, the outer side of the valve disc box is provided with a UN2 driving gas inlet interface, an EXGF exhaust interface, and an NH3 & DCS pipeline inlet trim. The EXGF exhaust interface and the NH3 & DCS pipeline inlet trim are arranged adjacent to each other on the front of the valve disc box. The valve disc box inside the NH3 & DCS pipeline inlet trim is provided with a special gas inlet face sealing interface, an NH3 inlet face sealing interface, and a DCS inlet face sealing interface. The two UN2 driving gas inlet interfaces are respectively arranged on both sides of the valve disc box. The valve disc box inside the UN2 driving gas inlet interfaces on both sides is provided with an NH3 outlet face sealing interface, a special gas outlet face sealing interface, and a DCS outlet face sealing interface respectively. The valve disc box inside the UN2 driving gas inlet interface on one side is also provided with an HPN2 gas inlet face sealing interface. The EXGF exhaust interface communicates with the inner cavity of the valve disc box to form an integrally closed negative pressure exhaust passage. The UN2 driving gas inlet interface is connected to the pneumatic interface of the pneumatic valve on each gas passage in the valve disc box cavity through a normal driving nitrogen passage.
[0014] Preferably, the special gas inlet sealing interface is located at one end of the special gas passage, which is divided into two branches with their ends connected to the special gas outlet sealing interfaces on both sides respectively. A diaphragm valve and a pneumatic valve are also provided on the two branches. The NH3 inlet sealing interface is located at one end of the ammonia passage, which is divided into two branches with their ends connected to the NH3 outlet sealing interfaces on both sides respectively. A diaphragm valve and a pneumatic valve are also provided on the two branches. The DCS inlet sealing interface is located at one end of the dichlorosilane passage, which is divided into two branches with their ends connected to the DCS outlet sealing interfaces on both sides respectively. The inlet sealing interface is equipped with diaphragm valves and pneumatic valves on both branches; the HPN2 gas inlet sealing interface is located at one end of the ultra-high purity nitrogen passage. The ultra-high purity nitrogen passage is divided into six branches, with the ends of each branch connected to the ammonia passage branch near the NH3 outlet sealing interface, the special gas passage branch near the special gas outlet sealing interface, and the dichlorosilane passage branch near the DCS outlet sealing interface. Pneumatic valves are also installed on the six branches. The main ultra-high purity nitrogen passage is also equipped with an HPN2 check valve, an HPN2 pressure gauge, an HPN2 pressure regulating valve, and a diaphragm valve.
[0015] The advantages of this invention are: its reasonable structural design allows for modular integration of the secondary distribution systems required by semiconductor equipment, such as gas, cooling water, vacuum, exhaust, and electrical systems, with the equipment base; it can be prefabricated in the factory and assembled as a whole; compared with the existing technology of separate construction, it can reduce docking errors, shorten the construction cycle, reduce the occupation of clean space, and simplify the modification and disassembly; it has good structural rigidity and leveling accuracy, and the interface standard is universal, which can effectively reduce the engineering construction cost, adapt to the upgrading and transformation of multiple generations of semiconductor equipment, and has good applicability and practicality. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the installation state structure of the composite base of the secondary distribution system of the semiconductor device of the present invention.
[0017] Figure 2 This is a schematic diagram of the structure of the secondary distribution system composite base of the semiconductor device of the present invention when it is supported on a mobile platform.
[0018] Figure 3 yes Figure 1 , 2 A schematic diagram of the structure of HPN2 (ultra-high purity nitrogen), UN2 (ordinary nitrogen), and PV interface plate.
[0019] Figure 4 yes Figure 3 Top view.
[0020] Figure 5 yes Figure 3 The main view.
[0021] Figure 6 yes Figure 1 ,2 A schematic diagram of the structure of the interface boxes for HPN2, UN2, NH3, and DCS.
[0022] Figure 7 yes Figure 6 A schematic diagram of the structure with valve disc cover.
[0023] Figure 8 yes Figure 6 Top view.
[0024] Figure 9 yes Figure 1 , 2 A schematic diagram of the PCW interface board.
[0025] Figure 10 yes Figure 1 , 2 A schematic diagram of the structure of the HPN2 and HPAr interface panels.
[0026] Figure 11 yes Figure 1 , 2 A schematic diagram of the structure of the EV interface panel.
[0027] Figure 12 yes Figure 1 , 2 A schematic diagram of the structure of the EXGF interface box.
[0028] In the diagram, 1 is the base body, 11 is the platform plate, 111 is the opening, 12 is the top beam, 13 is the longitudinal beam, 14 is the diagonal beam, 15 is the square steel support leg, 151 is the L / T-shaped fastener, and 16 is the adjustable foot. 2 is a porous concrete waffle slab; 21 is a functional waffle hole; 3 is a unit interface module panel / box; 31 is an HPN2, UN2, or PV interface panel; 311 is a valve disc fixing panel; 312 is a pipe fixing clamp; 313 is a bolt; 314 is a UN2 gas inlet compression fitting interface; 315 is a ball valve; 316 is a pressure regulating valve; 317 is a pressure gauge; 318 is a UN2 gas outlet sealing interface; 319 is an HPN2 gas inlet sealing interface; 3110 is a diaphragm valve; 3111 is an HPN2 gas outlet sealing interface; 3112 is a PV inlet compression fitting interface; 3113 is a PV outlet compression fitting interface; 32 is HPN2 or UN2. NH3, DCS interface box, 321 is valve disc box, 322 is valve disc box cover, 323 is UN2 drive gas inlet interface, 324 is EXGF exhaust (general exhaust) interface, 325 is NH3 & DCS pipeline inlet trim, 326 is special gas inlet face sealing interface, 327 is NH3 inlet face sealing interface, 328 is DCS inlet face sealing interface, 329 is HPN2 gas inlet face sealing interface, 3210 is NH3 outlet face sealing interface, 3211 is special gas outlet face sealing interface, 3212 is DCS outlet face sealing interface, 3213 is HPN2 check valve, 3214 is HPN2 pressure gauge, 3215 is HPN 2. Pressure regulating valve; 3216 is a diaphragm valve; 3217 is a pneumatic valve; 33 is a PCW interface plate; 331 is a C-shaped steel fixing bracket; 332 is a connecting bolt; 333 is an L-shaped connector; 334 is a pipe P-type clamp; 335 is a PCW inlet interface; 336 is a PCW outlet interface; 34 is an HPN2 / HPAr interface plate; 341 is a fixing panel; 342 is a mounting bolt; 343 is a sealing interface for the HPN2 gas inlet face; 344 is an A-type diaphragm valve; 345 is a sealing interface for the HPN2 gas outlet face; 346 is a sealing interface for the HPAr gas inlet face; 347 is a B-type diaphragm valve; 348 is a sealing interface for the HPAr gas outlet face. Interface, 35 is EV interface panel, 351 is L-shaped fixing panel, 352 is fixing bolt, 353 is EV vacuum ISO flange interface, 354 is ISO pipe clamp, 355 is reducing pipe, 356 is bellows, 357 is KF pipe clamp, 36 is EXGF interface box, 361 is fixing plate, 362 is fixing installation bolt, 363 is exhaust manifold body, 364 is exhaust outlet KF interface, 365 is exhaust inlet KF interface, 4 is pipeline, 41 is cable tray, 42 is cable conduit, 5 is system pipeline C-shaped steel support, 6 is mobile platform, 61 is support leg, 62 is swivel caster, 63 is reinforcing steel, 64 is diagonal bracing steel. Detailed Implementation
[0029] The present invention will be further described in detail below with reference to embodiments and specific implementation methods.
[0030] like Figure 1As shown, a secondary distribution system composite base for semiconductor equipment includes a base body 1 fixed on the top surface of a porous concrete waffle slab 2 with uniformly distributed functional waffle holes 21. The base body 1 has several openings 111, and a unit interface module board / box 3 is installed at each opening 111. Each unit interface module board / box 3 is equipped with a semiconductor production equipment connection interface, and each unit interface module board / box 3 is connected to a pipeline 4. The pipeline 4 passes through the functional waffle holes 21 and extends to the bottom of the porous concrete waffle slab 2.
[0031] In the specific design, the base body 1 includes a platform plate 11, a top beam 12, a longitudinal beam 13, an inclined beam 14, square steel support legs 15, and adjustable feet 16. The bottom surface of the platform plate 11, which has several openings 111, is supported by the horizontally distributed top beam 12, longitudinal beam 13, and inclined beam 14. The bottom edge of the top beam 12 and longitudinal beam 13 is supported by adjustable feet 16. Square steel support legs 15 are supported between adjacent adjustable feet 16. The bottom side of the square steel support legs 15 is connected to L / T-shaped fasteners 151. The above structure constitutes a micro-seismic base.
[0032] The pipeline 4 is preferably extended to the underside of the concrete porous waffle slab 2 via a cable bridge 41 or a cable conduit 42, and is also preferably supported by a system pipeline C-shaped steel support 5.
[0033] Based on the above structure, various water, electricity, gas and drainage system pipelines are modularly integrated in design, prefabrication and installation. Various water, electricity, gas and drainage system accessories and interface panels (boxes) involved in the production equipment are concentrated on the composite base (base body 1) to make an integral composite base.
[0034] The interface panel (box) is installed on the composite base, integrating the design, prefabrication and installation of the composite base and pipeline installation. During pipeline installation, the connection is made through the accessory interface on the interface panel (box), which is quick and convenient, shortens the construction period and saves the installation space of production equipment. All accessories of water, electricity, gas and drainage systems can be connected in the way commonly used in the semiconductor industry, which is highly versatile and easy to maintain and repair.
[0035] The base support legs are made of aluminum profile legs and square steel tube legs bolted together, and adjusting bolts are installed at the bottom of the aluminum profile legs to form adjustable feet 16, which can adjust the height of the legs to ensure the levelness of the base and its resistance to micro-vibrations.
[0036] like Figure 2As shown, when the base body 1 is not fixed to the top surface of the porous concrete waffle slab 2, the bottom is supported on the mobile platform 6. The mobile platform 6 includes support legs 61 with universal casters 62 installed at the bottom. Several support legs 61 are installed at the bottom of the steel support legs 15 on each side of the base body 1. Horizontally arranged reinforcing steel 63 is connected between adjacent support legs 61. Diagonal bracing steel 64 is connected between the lower part of each support leg 61 and the adjacent reinforcing steel 63.
[0037] The mobile platform 6 is used to assist in the fabrication of the base body 1. The support leg 61 is bolted to the square steel support leg 15 using square steel pipes to support the production and processing of the base body 1. The bottom of the support leg 61 is equipped with universal casters 62 to facilitate the handling and auxiliary positioning and installation of the base body 1. The support leg 61 is preferably reinforced by C-shaped steel diagonal bracing 64 around its perimeter, and the rigidity of the support leg 61 is strengthened by bolting or welding.
[0038] In a specific processing embodiment, it includes: 1. Prefabricated legs (support leg 61, serving as main columns) The upper end is rigidly connected to the main support leg (square steel support leg 15) of the upper base body 1 by bolts, so as to transfer all the loads of the upper base body 1 and the system pipeline (pipeline 4) down.
[0039] The lower end is fixed to the bottom swivel casters 62 with high-strength bolts, forming a vertical support column that is the core vertical load-bearing component of the entire mobile platform 6.
[0040] The material is square steel tubing, arranged vertically and evenly distributed around and in the center of the mobile platform 6.
[0041] Functions and roles Vertical load-bearing: It bears the self-weight of the upper base (base body 1), pipeline (pipeline 4), platform (mobile platform 6) and construction load, and is the "skeleton" of the entire structure, ensuring vertical rigidity.
[0042] Positioning support: serves as the positioning reference for all upper components (pipes, platform plates, interface plates, interface boxes, brackets) to ensure overall dimensional accuracy.
[0043] Installation reference: Provides installation positions for the bottom pulleys (swivel casters 62) and reinforcing steel 63, and is the basic unit of the entire mobile platform 6.
[0044] II. 62 swivel casters Installed at the bottom of support leg 61, it is fixed to the connecting plate at the bottom of support leg 61 with high-strength bolts via a mounting base with a flange, and then forms an integral load-bearing structure with the bottom horizontal steel base (reinforcing steel 63). The swivel casters 62 are equipped with brakes and leveling functions for easy positioning.
[0045] Functions and roles Achieve overall mobility: The entire mobile platform 6 can move horizontally on the ground, facilitating transfer and positioning in prefabrication workshops and construction sites.
[0046] Leveling and positioning: The casters with brakes and adjustable height can be locked in place and the platform level can be finely adjusted at the same time.
[0047] Distribute load: Distribute the load transmitted by the support leg 61 to the ground to reduce local stress concentration.
[0048] III. Precast Leg Reinforcing Steel (Reinforcing Steel 63) The supports are horizontally arranged between the support legs 61 and connected to the sides of the support legs 61 by welding or bolts to form a closed horizontal load-bearing frame. The dispersed support legs 61 are connected into an integral structural frame.
[0049] Functions and roles Horizontal stability: Prevents the support leg 61 from shifting, swaying or tilting in the horizontal direction (left and right / front and back), and improves the lateral stiffness of the overall structure.
[0050] Load transfer and distribution: Distribute local loads evenly to all support legs 61 to avoid excessive stress on a single support leg 61.
[0051] Control the spacing between support legs 61: Ensure the accuracy of the installation spacing between each support leg 61 and prevent the support legs 61 from shifting during installation.
[0052] IV. Precast Leg Diagonal Steel Section (Diagonal Steel Section 64, Diagonal Support / Scissor Bracing) One end is connected to the lower middle node of the support leg 61, and the other end is connected to the bottom reinforcing steel 63, forming a triangular force-bearing system. The diagonal tie steels 64 are arranged in a cross / single diagonal manner, connecting the support leg 61 and the reinforcing steel 63 into a stable space truss structure.
[0053] Functions and roles Improve overall lateral stability: Through the triangular truss effect, the structure’s resistance to overturning and swaying is greatly improved, especially during movement, to prevent the moving platform 6 from becoming unstable due to the shift of the center of gravity.
[0054] Enhance overall rigidity: Limit the lateral deformation of the support leg 61, reduce the deflection of the structure under load, and ensure the levelness of the mobile platform 6 and the installation accuracy of the base and system pipelines.
[0055] Resisting dynamic loads during construction / transportation: Absorbing impacts and vibrations during movement and hoisting, protecting the upper base, precision components, and system piping.
[0056] These four components together form a stable support system for the mobile prefabricated platform: All loads from the upper base and system piping are transferred to the support leg 61 via the top platform frame. The support leg 61 transfers the vertical load to the bottom → it is connected as a whole by the reinforcing steel 63, and then transferred to the swivel caster 62; The horizontal stability is ensured by a truss system composed of reinforcing steel 63 and diagonal bracing steel 64, preventing the platform from swaying or tipping over.
[0057] The specific installation process includes: When the composite base (base body 1) is positioned and installed, it is first transported to the cleanroom process machine position using a mobile prefabricated platform (mobile platform 6). The mobile prefabricated platform, together with the composite base, is then transferred to the installation area using swivel casters. Subsequently, the swivel casters are locked, and the platform is initially leveled using the adjustment device on the prefabricated processing leg (support leg 61) to ensure the accuracy range of the platform top surface level deviation.
[0058] After leveling, the composite base is temporarily fixed to the upper support structure of the mobile prefabricated platform, and the bolts are pre-tightened to prevent displacement of the base during subsequent installation. Then, the connecting bolts between the prefabricated legs and the composite base legs are removed, and the mobile prefabricated platform is slowly moved out from the bottom of the composite base, so that the composite base is completely placed in the pre-set installation position of the machine in the clean room.
[0059] During the removal process, a dedicated person must be assigned to monitor the entire process to prevent the platform casters from scratching the cleanroom floor. After the platform is removed, the final levelness of the composite base is re-measured, and precise adjustments are made using the adjusting bolts at the bottom of the base legs (adjustable feet 16) to ensure that the overall levelness, elevation, and planar position of the base meet the installation requirements of the process equipment, thus ensuring the accuracy and anti-vibration performance of subsequent equipment installation.
[0060] The mobile prefabrication platform is reusable. After the installation of a set of composite bases is completed, it can be transported back to the prefabrication processing area to carry out the production and transportation of the next batch of bases. This effectively improves the construction efficiency of process machine bases in cleanrooms, while reducing the pollution of the clean environment caused by on-site welding, cutting and other operations.
[0061] The following are several examples of unit interface module board / box 3: like Figure 3-5As shown, the unit interface module board / box 3 is an HPN2, UN2, and PV interface board 31. Its structure includes a valve disc fixing panel 311 and UN2 gas inlet clamping interface 314, ball valve 315, pressure regulating valve 316, pressure gauge 317, UN2 gas outlet sealing interface 318, HPN2 gas inlet sealing interface 319, diaphragm valve 3110, HPN2 gas outlet sealing interface 3111, PV inlet clamping interface 3112, and PV outlet clamping interface 3113 installed on the valve disc fixing panel 311. Each pipeline is fixed to the valve disc fixing panel 311 by pipe fixing clamps 312. The valve disc fixing panel 311 has a vertical part on its edge, which is fixed to the platform plate 11 by bolts 313.
[0062] In the specific design, the valve plate fixing panel 311 includes a horizontal part and several vertical parts integrally formed with the edge of the horizontal part. The vertical parts are connected to the platform plate 11 by bolts 313. Each independent ordinary nitrogen passage, ultra-high purity nitrogen passage and process vacuum passage are fixed on the horizontal part of the valve plate fixing panel 311. Each passage is fixed to the horizontal part of the valve plate fixing panel 311 by several pipe fixing clips 312. The pipe fixing clips 312 are fixed to the horizontal part of the valve plate fixing panel 311 by mounting bolts.
[0063] Along the ordinary nitrogen passage, from one end to the other, there are sequentially provided a UN2 gas inlet ferrule interface 314, a ball valve 315, a pressure regulating valve 316, a pressure gauge 317, and a UN2 gas outlet sealing interface 318.
[0064] Along the ultra-high purity nitrogen gas passage, from one end to the other, there are sequentially arranged HPN2 gas outlet sealing interface 3111, diaphragm valve 3110, and HPN2 gas inlet sealing interface 319, wherein the HPN2 gas inlet sealing interface 319 extends vertically to below the horizontal part of the valve disc fixing panel 311. Preferably, a pressure regulating valve, pressure gauge, check valve, etc. are also provided between the diaphragm valve 3110 and the HPN2 gas inlet sealing interface 319.
[0065] A PV outlet ferrule interface 3113 and a PV inlet ferrule interface 3112 are sequentially provided from one end of the process vacuum passage to the other end. The PV inlet ferrule interface 3112 extends vertically to below the horizontal part of the valve disc fixing panel 311. A ball valve is preferably provided between the PV outlet ferrule interface 3113 and the PV inlet ferrule interface 3112.
[0066] like Figure 6-8As shown, the unit interface module board / box 3 is an HPN2, UN2, NH3, and DCS interface box 32. Its structure includes a valve disc box 321 with a valve disc box cover 322. The side of the valve disc box 321 is provided with an UN2 drive gas inlet interface 323, an EXGF exhaust interface 324, and an NH3 & DCS pipeline inlet decorative plate 325. The valve disc box 321 contains a special gas inlet face sealing interface 326, an NH3 inlet face sealing interface 327, a DCS inlet face sealing interface 328, an HPN2 gas inlet face sealing interface 329, an NH3 outlet face sealing interface 3210, a special gas outlet face sealing interface 3211, a DCS outlet face sealing interface 3212, an HPN2 check valve 3213, an HPN2 pressure gauge 3214, an HPN2 pressure regulating valve 3215, an HPN2 diaphragm valve 3216, and a pneumatic valve 3217.
[0067] In the specific design, the valve disc box 321 is equipped with its own independent negative pressure exhaust passage, ordinary driving nitrogen passage, ultra-high purity nitrogen passage, ammonia passage, dichlorosilane passage and special gas passage.
[0068] The outer side of the valve disc housing 321 is provided with an UN2 driving gas inlet interface 323, an EXGF exhaust interface 324, and an NH3 & DCS pipeline inlet trim 325. The EXGF exhaust interface 324 and the NH3 & DCS pipeline inlet trim 325 are arranged adjacent to each other on the front of the valve disc housing 321. Inside the valve disc housing 321 on the inner side of the NH3 & DCS pipeline inlet trim 325, there are special gas inlet face sealing interfaces 326, NH3 inlet face sealing interfaces 327, and DCS inlet face sealing interfaces 328. Two UN2 driving gas inlet interfaces 323 are respectively located on both sides of the valve disc housing 321. The valve disc box 321 inside the inlet interface 323 is equipped with an NH3 outlet face sealing interface 3210, a special gas outlet face sealing interface 3211, and a DCS outlet face sealing interface 3212. The valve disc box 321 inside the UN2 driving gas inlet interface 323 on one side is also equipped with an HPN2 gas inlet face sealing interface 329. The EXGF exhaust interface 324 communicates with the inner cavity of the valve disc box 321 to form an integrally closed negative pressure exhaust passage. The UN2 driving gas inlet interface 323 is connected to the pneumatic interface of the pneumatic valve 3217 on each gas passage in the valve disc box 321 through a normal driving nitrogen passage.
[0069] The special gas inlet sealing interface 326 is located at one end of the special gas passage. The special gas passage is divided into two branches, and the ends are respectively connected to the special gas outlet sealing interfaces 3211 on both sides. The two branches are also equipped with diaphragm valves 3216 and pneumatic valves 3217.
[0070] The NH3 inlet sealing interface 327 is located at one end of the ammonia passage. The ammonia passage is divided into two branches, and the ends are respectively connected to the NH3 outlet sealing interfaces 3210 on both sides. The two branches are also equipped with diaphragm valves 3216 and pneumatic valves 3217.
[0071] The DCS inlet sealing interface 328 is located at one end of the dichlorosilane passage. The dichlorosilane passage is divided into two branches, and the ends are respectively connected to the DCS outlet sealing interfaces 3212 on both sides. A diaphragm valve 3216 and a pneumatic valve 3217 are also provided on the two branches.
[0072] The HPN2 gas inlet sealing interface 329 is located at one end of the ultra-high purity nitrogen gas passage. The ultra-high purity nitrogen gas passage is divided into six branches, and the ends of the branches are respectively connected to the ammonia gas passage branch near the NH3 outlet sealing interface 3210, the special gas passage branch near the special gas outlet sealing interface 3211, and the dichlorosilane passage branch near the DCS outlet sealing interface 3212. Pneumatic valves 3217 are also provided on the six branches. The main ultra-high purity nitrogen gas passage is also equipped with an HPN2 check valve 3213, an HPN2 pressure gauge 3214, an HPN2 pressure regulating valve 3215, and a diaphragm valve 3216.
[0073] like Figure 9 As shown, the unit interface module board / box 3 is a PCW interface board 33, the structure of which includes a C-shaped steel fixing bracket 331, an L-shaped connector 333 connected to the edge of the C-shaped steel fixing bracket 331, the L-shaped connector 333 being fixed to the platform plate 11 by connecting bolts 332, a PCW inlet interface 335 and a PCW outlet interface 336 being installed on the C-shaped steel fixing bracket 331, and each pipeline being fixed to the PCW interface board 33 by pipe P-type pipe clamps 334.
[0074] like Figure 10 As shown, the unit interface module board / box 3 is an HPN2 and HPAr interface board 34. Its structure includes a fixed panel 41. The edge of the fixed panel 41 is fixed to the platform plate 11 through 342. The fixed panel 41 is equipped with a sealing interface 343 for the HPN2 gas inlet surface, an A diaphragm valve 344, a sealing interface 345 for the HPN2 gas outlet surface, a sealing interface 346 for the HPAr gas inlet surface, a B diaphragm valve 347, and a sealing interface 348 for the HPAr gas outlet surface.
[0075] like Figure 11 As shown, the unit interface module board / box 3 is an EV interface board 35, whose structure includes an L-shaped fixing panel 351. The edge of the L-shaped fixing panel 351 is fixed to the platform plate 11 by fixing bolts 352. The horizontal part of the L-shaped fixing panel 351 has three mounting notches. Each mounting notch is used to install a reducing pipe mechanism. The reducing pipe mechanism includes a KF pipe clamp 357, a corrugated pipe 356, a reducing pipe 355, an ISO pipe clamp 354, and an EV vacuum ISO flange interface 353 connected from top to bottom.
[0076] like Figure 12 As shown, the unit interface module board / box 3 is an EXGF interface box 36, whose structure includes a fixing plate 361. The edge of the fixing plate 361 is fixed to the platform plate 11 by fixing bolts 362. An exhaust collection body 363 is installed on the fixing plate 361. The top and front of the exhaust collection body 363 are provided with exhaust inlet KF interface 365, and the bottom of the exhaust collection body 363 is provided with exhaust outlet KF interface 364.
[0077] Based on the above structure, the present invention has the following main structural features: Integrated composite base overall configuration: integrates equipment load-bearing, anti-micro-vibration frame, secondary pipeline support, and modular interface panel / box into one unit.
[0078] Modular integration of multi-media interface plates / boxes: valve plates / boxes for high-purity nitrogen, utility nitrogen, process vacuum, ammonia, dichlorosilane, process cooling water, exhaust, and waste gas are centrally integrated on the base.
[0079] Adjustable anti-micro-seismic support structure: Aluminum profiles and square steel bolted together with legs, equipped with adjustable support feet, which have the characteristics of leveling, shock absorption and high rigidity.
[0080] Prefabricated assembly auxiliary tooling structure: equipped with prefabricated legs, swivel casters, reinforcement and diagonal bracing steel, to realize off-site prefabrication and overall relocation and installation.
[0081] Integrated layout of base and secondary piping: Pipe supports, cable trays and conduits are prefabricated as a whole with the base, adapting to the standardized piping layout of waffle slabs.
[0082] Compared with existing technologies, it has the following specific differences: 1) Overall structure Existing technology: The equipment base, secondary piping, and valve panel are designed and constructed separately, belonging to different units, which easily leads to connection deviations and rework changes.
[0083] This invention adopts an integrated composite base design, with a unified structure, prefabricated in the factory and installed on site in one go, eliminating docking conflicts and reducing rework.
[0084] 2) Interface panel box layout Existing technology: Various gas, water, vacuum, and exhaust valves are scattered around the raised floor, occupying clean space and resulting in a cluttered layout.
[0085] This invention: All interface panels / boxes are modularly integrated and fixed to the base, with a neat layout and unified interfaces, saving cleanroom space and facilitating later operation and maintenance.
[0086] 3) Vibration reduction of base support Existing technology: The outriggers are mostly fixed welded structures with non-adjustable height. They require leveling with shims on site, resulting in poor resistance to micro-vibrations and low overall rigidity.
[0087] This invention employs a combination of bolted outriggers and adjustable feet, combined with beams, columns, and inclined beams to form a truss structure, which allows for precise leveling and significantly improves resistance to micro-vibrations and overall rigidity.
[0088] 4) Construction assembly mode Existing technology: The base can only be welded and fabricated in situ on the clean site, which takes a long time, occupies many clean windows, and poses significant safety hazards.
[0089] This invention features specialized prefabricated fixtures, enabling off-site prefabrication, pulley-assisted relocation, and rapid on-site positioning and installation, significantly shortening the construction cycle in clean areas.
[0090] 5) Pipeline layout Existing technology: After the base is completed, each component is measured and welded on-site, resulting in a scattered layout, long construction period, and difficulty in quality control.
[0091] This invention: Pipeline supports and cable trays are prefabricated as an integrated unit with the base, allowing for neat pipe routing that matches floor slab openings, eliminating the need for extensive on-site welding, and resulting in higher construction efficiency and standardization.
[0092] All of the components described above are existing technologies, and those skilled in the art can use any model and existing design that can achieve their corresponding functions.
[0093] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.
Claims
1. A composite base for a secondary distribution system of a semiconductor device, characterized in that, The base body (1) is fixed on the top surface of a concrete porous waffle floor slab (2) with uniformly spaced functional waffle holes (21). The base body (1) has several openings (111). Each opening (111) is equipped with a unit interface module plate / box (3). Each unit interface module plate / box (3) is equipped with a semiconductor production equipment connection interface. Each unit interface module plate / box (3) is connected to a pipeline (4). The pipeline (4) extends through the functional waffle holes (21) to the bottom of the concrete porous waffle floor slab (2).
2. The composite base for a secondary distribution system of a semiconductor device as described in claim 1, characterized in that, The base body (1) includes a platform plate (11), a top beam (12), a longitudinal beam (13), an inclined beam (14), a square steel support leg (15), and adjustable feet (16). The bottom surface of the platform plate (11), which has several openings (111), is supported by the horizontally distributed top beam (12), longitudinal beam (13), and inclined beam (14). The bottom edge of the top beam (12) and the longitudinal beam (13) is supported by adjustable feet (16). The square steel support leg (15) is supported between adjacent adjustable feet (16). The bottom side of the square steel support leg (15) is connected to an L / T-shaped fastener (151).
3. The composite base for a secondary distribution system of a semiconductor device as described in claim 2, characterized in that, The pipeline (4) extends to the underside of the concrete porous waffle slab (2) via a cable bridge (41) or a cable conduit (42).
4. A composite base for a secondary distribution system of a semiconductor device as described in any one of claims 1-3, characterized in that, When the base body (1) is not fixed on the top surface of the porous concrete waffle slab (2), the bottom is supported on the mobile platform (6). The mobile platform (6) includes support legs (61) with universal casters (62) installed at the bottom. Several support legs (61) are installed at the bottom of the steel support legs (15) on each side of the base body (1). Horizontally arranged reinforcing steel (63) is connected between adjacent support legs (61). Diagonal bracing steel (64) is connected between the lower part of each support leg (61) and the adjacent reinforcing steel (63).
5. A composite base for a secondary distribution system of a semiconductor device as described in any one of claims 1-3, characterized in that, The unit interface module board / box (3) is HPN2, UN2, PV interface board (31). The valve plate fixing panel (311) includes a horizontal part and several vertical parts integrally formed with the edge of the horizontal part. The vertical parts are connected to the platform plate (11) by bolts (313). The horizontal part of the valve plate fixing panel (311) has its own independent ordinary nitrogen passage, ultra-high purity nitrogen passage and process vacuum passage. Each passage is fixed to the horizontal part of the valve plate fixing panel (311) by several pipe fixing clips (312). The pipe fixing clips (312) are fixed to the horizontal part of the valve plate fixing panel (311) by mounting bolts.
6. The composite base for a secondary distribution system of a semiconductor device as described in claim 5, characterized in that, Along the ordinary nitrogen passage, from one end to the other, are sequentially provided an UN2 gas inlet ferrule interface (314), a ball valve (315), a pressure regulating valve (316), a pressure gauge (317), and an UN2 gas outlet sealing interface (318); along the ultra-high purity nitrogen passage, from one end to the other, are sequentially provided an HPN2 gas outlet sealing interface (3111), a diaphragm valve (3110), and an HPN2 gas inlet sealing interface (319), wherein the HPN2 gas inlet sealing interface (319) extends vertically to the valve disc for fixing. Below the horizontal part of the panel (311), a pressure regulating valve, a pressure gauge, and a check valve are provided between the diaphragm valve (3110) and the HPN2 gas inlet sealing interface (319); a PV outlet ferrule interface (3113) and a PV inlet ferrule interface (3112) are provided sequentially from one end of the process vacuum passage to the other end. The PV inlet ferrule interface (3112) extends vertically to below the horizontal part of the valve disc fixing panel (311), and a ball valve is provided between the PV outlet ferrule interface (3113) and the PV inlet ferrule interface (3112).
7. A composite base for a secondary distribution system of a semiconductor device as described in any one of claims 1-3, characterized in that, The unit interface module board / box (3) is HPN2, UN2, NH3, DCS interface box (32), and its structure includes a valve disc box (321) with a valve disc box cover (322). The valve disc box (321) is equipped with its own independent negative pressure exhaust passage, ordinary driving nitrogen passage, ultra-high purity nitrogen passage, ammonia passage, dichlorosilane passage and special gas passage.
8. The composite base for a secondary distribution system of a semiconductor device as described in claim 7, characterized in that, The valve disc housing (321) has an UN2 drive gas inlet interface (323), an EXGF exhaust interface (324), and an NH3 & DCS pipeline inlet trim panel (325) on its outer side. The EXGF exhaust interface (324) and the NH3 & DCS pipeline inlet trim panel (325) are arranged adjacent to each other on the front of the valve disc housing (321). Inside the valve disc housing (321) on the inner side of the NH3 & DCS pipeline inlet trim panel (325), there are special gas inlet face sealing interfaces (326), NH3 inlet face sealing interfaces (327), and DCS inlet face sealing interfaces (328). Two UN2 drive gas inlet interfaces (323) are respectively arranged on both sides of the valve disc housing (321). The valve disc box (321) inside the gas inlet port (323) is equipped with an NH3 outlet face sealing port (3210), a special gas outlet face sealing port (3211), and a DCS outlet face sealing port (3212). The valve disc box (321) inside the UN2 driving gas inlet port (323) on one side is also equipped with an HPN2 gas inlet face sealing port (329). The EXGF exhaust port (324) is connected to the inner cavity of the valve disc box (321) to form an integrally closed negative pressure exhaust passage. The UN2 driving gas inlet port (323) is connected to the pneumatic ports of the pneumatic valves (3217) on each gas passage in the valve disc box (321) through the ordinary driving nitrogen passage.
9. The composite base for a secondary distribution system of a semiconductor device as described in claim 8, characterized in that, The special gas inlet sealing interface (326) is located at one end of the special gas passage. The special gas passage is divided into two branches, and the ends of the branches are respectively connected to the special gas outlet sealing interfaces (3211) on both sides. A diaphragm valve (3216) and a pneumatic valve (3217) are also provided on the two branches. The NH3 inlet sealing interface (327) is located at one end of the ammonia passage. The ammonia passage is divided into two branches, and the ends of the branches are respectively connected to the NH3 outlet sealing interfaces (3210) on both sides. A diaphragm valve (3216) and a pneumatic valve (3217) are also provided on the two branches. The DCS inlet sealing interface (328) is located at one end of the dichlorosilane passage. The dichlorosilane passage is divided into two branches, and the ends of the branches are respectively connected to the DCS outlet sealing interfaces (3212) on both sides. Diaphragm valves (3216) and pneumatic valves (3217) are also provided on the two branches; the HPN2 gas inlet sealing interface (329) is set at one end of the ultra-high purity nitrogen passage. The ultra-high purity nitrogen passage is divided into six branches, and the ends are respectively connected to the ammonia passage branch near the NH3 outlet sealing interface (3210), the special gas passage branch near the special gas outlet sealing interface (3211), and the dichlorosilane passage branch near the DCS outlet sealing interface (3212). Pneumatic valves (3217) are also provided on the six branches. The main ultra-high purity nitrogen passage is also equipped with HPN2 check valve (3213), HPN2 pressure gauge (3214), HPN2 pressure regulating valve (3215), and diaphragm valve (3216).