A double cold head opposed heat exchanger

Abstract

The application discloses a double-cold-head clamping type heat exchange device for heat exchange with a thermoelectric element, which comprises oppositely arranged first and second heat exchange units, and the thermoelectric element is clamped between the first and second heat exchange units; the first and second heat exchange units are internally provided with flow channels for the flow of cooling liquid; and a plurality of first fasteners are used for pressing the first and second heat exchange units towards each other. The symmetrical double-cold-head clamping structure can simultaneously realize high-efficiency liquid cooling heat exchange of the cold end and the hot end of the thermoelectric element, and the problem of large temperature difference of unilateral heat exchange is overcome. Meanwhile, the uniform pressing of the plurality of fasteners ensures good contact between the heat exchange units and the thermoelectric element, reduces the contact thermal resistance, and significantly improves the heat exchange efficiency and system stability.

Description

Technical Field

[0001] This application relates to the field of semiconductor refrigeration technology, and more specifically, to a dual-cold-head clamp-on heat exchange device. Background Technology

[0002] TEC (Thermoelectric Cooler) utilizes the Peltier effect to achieve cooling, offering advantages such as vibration-free, noise-free, refrigerant-free operation, and fast response. It is widely used in medical equipment, optoelectronic device temperature control, and portable cooling devices. During operation, the cold and hot ends of a TEC absorb and release heat, respectively. Heat exchangers are required on both sides to maintain the temperature difference between the cold and hot ends and ensure cooling efficiency.

[0003] In related technologies, existing heat exchange devices struggle to ensure uniform contact between the bottom surface of the water-cooling head and the surface of the TEC (Transformer Electrode Regulator). The TEC is a brittle device composed of multiple pairs of semiconductor grains connected in series, requiring high uniformity of surface stress. Excessive local pressure can cause TEC grains to crack, while insufficient local pressure can create tiny gaps between the water-cooling head and the TEC surface, significantly increasing contact thermal resistance and reducing heat exchange efficiency. Consequently, the actual cooling efficiency of the TEC is far lower than its nominal performance.

[0004] Therefore, how to improve the heat exchange efficiency between the heat exchange device and the semiconductor cooler has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to disclose a dual-cold-head clamp-on heat exchange device to improve the heat exchange efficiency between the heat exchange device and the semiconductor cooler.

[0006] A dual-cold-head clamp-on heat exchanger is used for heat exchange with a thermoelectric element, the dual-cold-head clamp-on heat exchanger comprising:

[0007] A first heat exchange unit and a second heat exchange unit are arranged opposite to each other, and the thermoelectric element is located between the first heat exchange unit and the second heat exchange unit; the first heat exchange unit and the second heat exchange unit are provided with flow channels for the flow of coolant.

[0008] Multiple first fasteners are used to press the first heat exchange unit and the second heat exchange unit toward each other.

[0009] In one possible implementation, both the first heat exchange unit and the second heat exchange unit include:

[0010] A base, the first surface of which is used to contact the thermoelectric element;

[0011] The top cover is disposed on the second surface of the base, the second surface being opposite to the first surface, and the top cover and the base together enclose the flow channel.

[0012] In one possible implementation, the flow channel includes:

[0013] Multiple micro-channels are provided on the second surface of the base;

[0014] An inner cavity is formed on the surface of the upper cover facing the base, and the microchannels communicate with the inner cavity.

[0015] In one possible implementation, the bottom of the microchannel is arc-shaped; along the extension direction of the microchannel, the depth of the middle region of the microchannel is greater than the depth of the two end regions of the microchannel, and the depth of the microchannel is the distance from the bottom of the channel to the second surface of the base.

[0016] In one possible implementation, multiple microchannels are arranged in parallel and spaced apart, with fins formed between adjacent microchannels; in the extension direction perpendicular to the microchannels, the thickness of the fins is equal to the width of the microchannel groove, and the width of the microchannel groove is 0.4 mm to 0.7 mm.

[0017] In one possible implementation, the surface of the top cover facing the base has an annular groove, and a sealing ring is embedded in the annular groove.

[0018] In one possible implementation, the base is made of copper; the top cover is made of polyphenylene sulfide.

[0019] In one possible implementation, the surface roughness Ra of the first surface of the base is no greater than 0.4 μm.

[0020] In one possible implementation, both the first heat exchange unit and the second heat exchange unit are provided with an inlet and an outlet, and the inlet and the outlet are located on the same side of the corresponding first heat exchange unit or second heat exchange unit.

[0021] The inner cavity is divided into a guiding zone and a confluence zone. The guiding zone connects the inlet to the microchannel, and the confluence zone connects the microchannel to the outlet. The guiding zone and the confluence zone are connected through the microchannel.

[0022] In one possible implementation, the first heat exchange unit is provided with a first mounting hole, and the second heat exchange unit is provided with a corresponding second mounting hole, with the first fastener passing through the first mounting hole and the second mounting hole.

[0023] In one possible implementation, the base is provided with a third mounting hole, and the upper cover is provided with a corresponding fourth mounting hole. The dual cold head clamp-type heat exchange device also includes a plurality of second fasteners, which pass through the third mounting hole and the fourth mounting hole and fix the upper cover to the base.

[0024] Compared to related technologies, the dual-cold-head clamp-type heat exchange device disclosed in this application, by setting up opposing first and second heat exchange units and clamping the thermoelectric element between them, and using multiple first fasteners to evenly press the two heat exchange units toward each other, can effectively avoid the problem of poor local contact of the thermoelectric element. Simultaneously, by setting flow channels for coolant circulation inside the first and second heat exchange units, efficient heat exchange of the thermoelectric element is achieved. The structure is compact, with good assembly consistency, and can significantly improve the heat exchange efficiency and operational stability of the semiconductor refrigeration system. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the double-cold-head clamp-type heat exchanger disclosed in the embodiments of this application;

[0027] Figure 2 This is a perspective view of the double-cold-head clamp-type heat exchanger disclosed in the embodiments of this application;

[0028] Figure 3 This is a view of the first surface of the base disclosed in an embodiment of this application;

[0029] Figure 4 This is a view of the second surface of the base disclosed in an embodiment of this application;

[0030] Figure 5 This is a cross-sectional view of the base at point AA as disclosed in the embodiments of this application;

[0031] Figure 6 This is a cross-sectional view of the base at point BB as disclosed in the embodiments of this application;

[0032] Figure 7 This is a top view of the top cover disclosed in the embodiments of this application;

[0033] Figure 8 This is a cross-sectional view of the top cover at the CC position as disclosed in the embodiments of this application;

[0034] Figure 9 This is a front view of the top cover disclosed in the embodiments of this application.

[0035] The attached figures are labeled as follows:

[0036] 10. First heat exchange unit; 20. Second heat exchange unit; 30. Thermoelectric element;

[0037] 100. Base; 110. Fin; 120. Third mounting hole;

[0038] 200. Top cover; 210. Annular groove; 220. Fourth mounting hole;

[0039] 300. Flow channel; 310. Microchannel; 320. Inner cavity; 321. Guide zone; 322. Convergence zone;

[0040] 400. Water inlet;

[0041] 500, water outlet;

[0042] 600, First mounting hole;

[0043] 700, Second mounting hole. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] The inventors discovered that in related technologies, the cold and hot ends of a thermoelectric cooler are typically cooled by two separate water-cooling heads in close contact. However, when the two water-cooling heads clamp the thermoelectric cooler from both sides, poor local contact can easily occur, leading to low heat exchange efficiency. Moreover, the assembly effect is highly dependent on the operator's experience and skill, making it difficult to guarantee the consistency of batch products, thus affecting the cooling effect and system stability.

[0046] Based on this, this application discloses a dual-cold-head clamp-on heat exchange device for heat exchange with thermoelectric element 30. This dual-cold-head clamp-on heat exchange device has a compact structure and good assembly consistency, which can significantly improve the heat exchange efficiency and operational stability of the semiconductor refrigeration system.

[0047] See Figure 1 and Figure 2The dual-cold-head clamp-type heat exchanger disclosed in this application is used for heat exchange with a thermoelectric element 30. The dual-cold-head clamp-type heat exchanger includes a first heat exchange unit 10, a second heat exchange unit 20, and a plurality of first fasteners.

[0048] The first heat exchange unit 10 and the second heat exchange unit 20 are disposed opposite to each other, and the thermoelectric element 30 is located between the first heat exchange unit 10 and the second heat exchange unit 20. Exemplarily, the thermoelectric element 30 can be a semiconductor cooler, having opposing cold and hot ends. When the thermoelectric element 30 is energized, the cold end absorbs heat to achieve cooling, and the hot end releases heat outward. The first heat exchange unit 10 and the second heat exchange unit 20 are respectively attached to the cold and hot ends of the thermoelectric element 30 to exchange heat between them. Both the first heat exchange unit 10 and the second heat exchange unit 20 have internal flow channels 300 for coolant circulation. Multiple first fasteners are used to press the first heat exchange unit 10 and the second heat exchange unit 20 together, thereby uniformly clamping the thermoelectric element 30 between the first heat exchange unit 10 and the second heat exchange unit 20. The first fastener can be any suitable fastening element such as a bolt, stud, screw, rivet, or clip, as long as it can press the first heat exchange unit 10 and the second heat exchange unit 20 together.

[0049] The external dimensions of the first heat exchange unit 10 and the second heat exchange unit 20 can be the same or different. For example, both heat exchange units can have external dimensions of 64mm × 64mm. This size matches the mounting dimensions of the heat pump, facilitating modular installation within the chassis. In other applications, the external dimensions can be other values, depending on the available space within the chassis and the cooling requirements.

[0050] The first heat exchange unit 10 and the second heat exchange unit 20 are respectively attached to the opposite ends of the thermoelectric element 30 from both sides, such as the cold end and the hot end. Coolant flows through the flow channels 300 inside the first heat exchange unit 10 and the second heat exchange unit 20, exchanging heat with the thermoelectric element 30, thereby achieving heat dissipation at the hot end or continuous cooling through the cold end. Because the two heat exchange units are uniformly pressed together by the first fastener, the forces on both sides of the thermoelectric element 30 are balanced, avoiding a decrease in heat exchange efficiency due to poor local contact. In this way, the dual-cold-head clamp-on heat exchange device achieves synchronous and efficient heat exchange between the cold and hot ends of the thermoelectric element 30 within a limited space, making it particularly suitable for semiconductor refrigeration equipment with high requirements for both space and efficiency.

[0051] like Figure 2 , Figure 3 and Figure 4As shown, both the first heat exchange unit 10 and the second heat exchange unit 20 include a base 100 and a top cover 200. The base 100 has a first surface and a second surface disposed opposite to each other, wherein the first surface is used to contact the thermoelectric element 30. The top cover 200 is disposed on the second surface of the base 100, and the top cover 200 and the base 100 together form a flow channel 300.

[0052] By configuring the heat exchange unit as a separate structure of base 100 and top cover 200, it is convenient to machine the various structures of flow channel 300 on the second surface of base 100 and / or the surface of top cover 200. After base 100 and top cover 200 are fixedly connected, a sealed flow channel 300 is formed between them, in which coolant can flow for heat exchange. When cleaning or maintenance of flow channel 300 is required, top cover 200 can be removed from base 100, which is convenient.

[0053] like Figures 4 to 8 As shown, the flow channel 300 includes multiple microchannels 310 and an inner cavity 320. The multiple microchannels 310 are disposed on the second surface of the base 100. The inner cavity 320 is formed on the surface of the upper cover 200 facing the base 100, and the microchannels 310 are connected to the inner cavity 320. When the upper cover 200 is closed on the second surface of the base 100, the microchannels 310 on the base 100 and the inner cavity 320 of the upper cover 200 together form a flow path for the coolant to flow.

[0054] Multiple microchannels 310 can be arranged in parallel and at intervals on the second surface of the base 100. Alternatively, the microchannels 310 can also be flow channel structures in the form of serpentine flow channels, spiral flow channels, or columnar fin arrays arranged on the second surface of the base 100, which can also realize heat exchange between the coolant and the base 100.

[0055] For example, the microchannels 310 can be directly formed on the second surface of the base 100 by milling, etching, laser processing, or other methods. By providing multiple microchannels 310 on the second surface of the base 100, the contact area between the coolant and the base 100 is greatly increased, thereby improving the heat exchange efficiency. When the coolant flows in the microchannels 310, it can quickly carry away the heat conducted from the thermoelectric element 30 to the base 100.

[0056] The size of the distribution area of ​​the microchannels 310 can be smaller than the external dimensions of the base 100. For example, when the external dimensions are 64mm × 64mm and the thermoelectric element 30 is 40mm × 40mm, the size of the microchannel 310 area can be 48mm × 48mm. For example, when the thickness of the base 100 is greater than 2mm, heat diffuses from the thermoelectric element 30 area outwards, with an effective diffusion distance of approximately 4mm to 6mm at the edges. Therefore, setting the microchannel area to 48mm × 48mm precisely covers the effective heat diffusion range within the copper base 100. If the microchannel area is too small, the heat generated at the edges of the thermoelectric element 30 cannot be effectively exchanged. If the microchannel 310 area is too large, the area beyond the heat diffusion range will have difficulty performing heat exchange, resulting in wasted space.

[0057] Please see Figure 5 The bottom of the microchannel 310 is arc-shaped. Along the extension direction of the microchannel 310, the depth of the middle region of the microchannel 310 is greater than the depth of the two end regions of the microchannel 310. Here, the depth of the microchannel 310 is defined as the distance from the bottom of the channel to the second surface of the base 100.

[0058] The bottom of the microchannel 310 is designed to be arc-shaped, with a deeper center and shallower ends, which facilitates fluid flow and reduces dead zones and resistance. Because the central region of the microchannel 310 is deeper, the cross-sectional area for coolant flow in this region is increased, allowing for a larger flow rate and thus enhancing the heat exchange capacity of the central region. Since the heat from the thermoelectric element 30 mainly diffuses outwards through the central region of the base 100, the heat flux density in the central region is relatively high. Therefore, making the central region of the microchannel 310 deeper allows more coolant to flow through this high heat flux density region, thus more effectively removing heat. For example, the depth of the central region of the microchannel 310 is as follows: Figure 5 As indicated by the dimension h, h ranges from 1.5mm to 2.0mm. Within this depth range, sufficient cross-sectional area is ensured to dissipate heat while maintaining the structural strength of the base 100, preventing deformation or insufficient strength of the base 100 due to excessively deep grooves.

[0059] Please see Figure 4 and Figure 6 Multiple microchannels 310 are arranged in parallel and spaced apart, with fins 110 formed between adjacent microchannels 310. In the direction perpendicular to the extension of the microchannels 310, the thickness of the fins 110 is approximately equal to the width of the grooves in the microchannels 310. For example, the width of the grooves in the microchannels 310 is as follows: Figure 6 As indicated by the dimension designation d1, d1 ranges from 0.4 mm to 0.7 mm, for example, 0.5 mm. Correspondingly, the thickness of fin 110 is as follows: Figure 6The standard d2 is shown in the medium dimension, which can be from 0.4mm to 0.7mm, for example, 0.5mm.

[0060] The fins 110 not only serve to separate adjacent microchannels 310, but also act as heat conduction paths for heat transfer from the first surface of the base 100 to the coolant. The thickness of the fins 110 is equal to the groove width of the microchannels 310, meaning that on the second surface of the base 100, the microchannels 310 and fins 110 form a periodic structure with equal spacing. This equal-spacing design simplifies manufacturing while ensuring uniform fluid distribution and balanced structural strength. Controlling the groove width within the range of 0.4mm to 0.7mm ensures sufficient heat exchange area while considering manufacturing feasibility and fluid resistance.

[0061] like Figure 6 and Figure 7 As shown, an annular groove 210 is formed on the surface of the upper cover 200 facing the base 100. This annular groove 210 surrounds the inner cavity 320 and contains a sealing ring. When the upper cover 200 and the base 100 are fixedly connected, the sealing ring is pressed between the upper cover 200 and the base 100, achieving a seal between them. The cross-sectional shape of the annular groove 210 can be rectangular, U-shaped, or semi-circular to accommodate sealing rings with different cross-sectional shapes. By creating an annular groove 210 on the upper cover 200 to install the sealing ring, compared to directly placing the sealing ring between planes, this design can more accurately position the sealing ring, preventing displacement or twisting during assembly, thereby ensuring the reliability of the seal.

[0062] For example, the sealing ring can be an O-ring. The sealing ring material can be EPDM (Ethylene Propylene Diene Monomer) or fluororubber. These materials have good chemical resistance to propylene glycol-based coolants and will not undergo significant swelling or performance degradation under long-term immersion, thus ensuring long-term sealing reliability. The sealing ring material can also be silicone rubber, nitrile rubber, etc., as long as it can withstand the chemical corrosion of the coolant used and maintain good elasticity within the operating temperature range.

[0063] In one specific embodiment, the base 100 is made of copper. Copper has an extremely high thermal conductivity, which can rapidly conduct the heat generated by the thermoelectric element 30 to the microchannel 310 region, thereby reducing contact thermal resistance and improving heat exchange efficiency. The first surface of the base 100, that is, the surface in contact with the thermoelectric element 30, is preferably a mirror-finished flat surface with a surface roughness Ra of no more than 0.4 μm, to ensure a tight fit between the base 100 and the thermoelectric element 30 and reduce interfacial thermal resistance. The first surface of the base 100 can be processed into a mirror-finished flat surface through processes such as grinding and polishing.

[0064] The top cover 200 is made of PPS (Polyphenylene Sulfide). PPS is a high-performance thermoplastic engineering plastic with excellent chemical resistance, dimensional stability, and heat resistance. PPS has good resistance to propylene glycol-based coolants and will not swell or crack under long-term immersion. Compared to POM (Polyoxymethylene), PPS has better dimensional stability in propylene glycol-based coolants. Compared to 316L stainless steel, PPS significantly reduces costs while meeting usage requirements. Therefore, the combination of a copper base 100 and a PPS top cover 200 balances the needs for high thermal conductivity, long-term chemical compatibility, and cost control.

[0065] like Figure 7 and Figure 9 As shown, both the first heat exchange unit 10 and the second heat exchange unit 20 are provided with an inlet 400 and an outlet 500. The inlet 400 and the outlet 500 are located on the same side of the corresponding first heat exchange unit 10 or second heat exchange unit 20. The internal cavity 320 of the first heat exchange unit 10 and the second heat exchange unit 20 is divided to form a guiding area 321 and a confluence area 322. The guiding area 321 connects the inlet 400 with the microchannel 310, and the confluence area 322 connects the microchannel 310 with the outlet 500. The guiding area 321 and the confluence area 322 are connected through the microchannel 310.

[0066] By dividing the inner cavity 320 into a guiding zone 321 and a confluence zone 322, the coolant has a predetermined flow path when entering and exiting the heat exchange unit. After entering the heat exchange unit from the inlet 400, the coolant first enters the guiding zone 321. Along the extension direction perpendicular to the microchannels 310, the width of the guiding zone 321 and the confluence zone 322 is greater than the width of all microchannels 310. Before entering the microchannels 310, the coolant can be evenly distributed along its width. After the flow equalization effect of the guiding zone 321, the coolant enters multiple parallel and spaced microchannels 310, where it undergoes sufficient heat exchange with the base 100. After completing the heat exchange, the coolant flows out from the other end of the microchannels 310, enters the confluence zone 322, and is discharged from the outlet 500 after converging in the confluence zone 322.

[0067] Since the flow guiding area 321 and the flow confluence area 322 are separated by the inner cavity 320 and connected by the micro water channel 310, the coolant must flow through all the micro water channels 310 after entering from the inlet 400 before reaching the flow confluence area 322. This avoids the phenomenon that the coolant flows directly from the inlet 400 to the outlet 500 without heat exchange, thus ensuring full utilization of the heat exchange area.

[0068] Because the inlet 400 and outlet 500 are located on the same side of the heat exchange unit, the layout of external piping is more flexible, making it particularly suitable for applications with limited internal space and restricted piping routing. Combined with the design of the flow guiding area 321 and the confluence area 322, even with the inlet and outlet on the same side, the coolant can evenly cover the entire microchannel 310 area, avoiding dead zones and ensuring temperature uniformity and heat exchange efficiency throughout the entire heat exchange unit.

[0069] For example, both the inlet 400 and the outlet 500 are threaded interfaces equipped with pagoda heads. The distance between the center of the inlet 400 and the center of the outlet 500 can be 35mm. This center distance setting provides sufficient operating clearance between the two pagoda heads installed side by side, avoiding interference during pipe installation.

[0070] In one specific embodiment, the first heat exchange unit 10 is provided with a first mounting hole 600, and the second heat exchange unit 20 is correspondingly provided with a second mounting hole 700. A first fastener passes through the first mounting hole 600 and the second mounting hole 700 to press the first heat exchange unit 10 and the second heat exchange unit 20 together. For example, there are four first mounting holes 600 and four second mounting holes 700, respectively located at the four corners of the corresponding heat exchange unit. The first fasteners are correspondingly four bolts. The four bolts pass through the four corner first mounting holes 600 and the four corner second mounting holes 700, and are locked with nuts, evenly pressing the two heat exchange units onto both sides of the thermoelectric element 30. This four-corner arrangement ensures that the clamping force is evenly distributed across the entire surface of the heat exchange unit, avoiding poor contact caused by excessive or insufficient local pressure.

[0071] During the tightening process, the four bolts are first slightly screwed in, and then tightened gradually in a diagonal sequence, with each tightening turn or torque being approximately equal, until the predetermined tightening torque is reached. This tightening method ensures that the first heat exchange unit 10 and the second heat exchange unit 20 remain parallel during the pressing process, avoiding tilting of the heat exchange units due to excessive tightening on one side, thereby ensuring the uniformity of force on both sides of the thermoelectric element 30.

[0072] like Figure 3 , Figure 4 and Figure 7As shown, the base 100 is provided with a third mounting hole 120, and the upper cover 200 is correspondingly provided with a fourth mounting hole 220. This dual-cold-head clamp-type heat exchanger also includes multiple second fasteners, which pass through the third mounting hole 120 and the fourth mounting hole 220, and fix the upper cover 200 to the base 100. For example, the second fasteners can be screws. By fixing the upper cover 200 to the base 100 with the second fasteners, a sealing ring is pressed between them, achieving a seal in the flow channel 300. When it is necessary to clean or repair the inside of the flow channel 300, the second fasteners can be removed, and the upper cover 200 can be taken off the base 100, making the operation convenient.

[0073] The following describes the working process of the double-cold-head clamp-type heat exchanger provided in this application.

[0074] A thermoelectric element 30 is placed between the first heat exchange unit 10 and the second heat exchange unit 20, with both sides of the thermoelectric element 30 facing the first surface of the base 100 of the first heat exchange unit 10 and the first surface of the base 100 of the second heat exchange unit 20, respectively. The first heat exchange unit 10 and the second heat exchange unit 20 are aligned, with the first mounting hole 600 and the second mounting hole 700 aligned one by one. Four bolts are passed through the corresponding first mounting holes 600 and second mounting holes 700, and nuts are screwed onto the protruding ends of the bolts. The four bolts are gradually tightened to the predetermined torque in a diagonal sequence and in multiple stages. During this process, the first heat exchange unit 10 and the second heat exchange unit 20 are evenly pressed against the thermoelectric element 30 from both sides, so that both sides of the thermoelectric element 30 are in close contact with the mirror-like flat surfaces of the two bases 100.

[0075] After assembly, the external coolant lines are connected to the inlet 400 and outlet 500 of the first heat exchange unit 10 and the second heat exchange unit 20, respectively. The coolant circulation system is started, and the coolant enters the heat exchange unit from the inlet 400. The coolant first enters the guide zone 321, and then enters multiple parallel and spaced microchannels 310, flowing along the extension direction of the microchannels 310. During the flow, the coolant undergoes sufficient heat exchange with the bottom of the microchannels 310 and the surface of the fins 110, carrying away the heat conducted from the thermoelectric element 30 to the base 100. Because the bottom of the microchannel 310 is arc-shaped and the depth in the middle region is greater than that at both ends, the flow rate of the coolant in the middle region of the microchannel 310 increases, effectively carrying away a large amount of heat accumulated in the middle region of the thermoelectric element 30. After heat exchange through the microchannel 310, the coolant flows out from the other end of the microchannel 310 and enters the confluence area 322. After converging in the confluence area 322, it is discharged from the outlet 500 on the same side.

[0076] During the heat exchange process described above, since the thermoelectric element 30 is symmetrically sandwiched between the two heat exchange units, both its cold and hot ends receive effective heat exchange, thereby ensuring that the thermoelectric element 30 can operate efficiently and stably within its optimal operating temperature range.

[0077] The terms "first" and "second," etc., used in this application are used to distinguish different objects, not to describe a specific order, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units may include steps or units not listed, but rather steps or units not listed.

[0078] In the description of this application, it should be understood that the terms "height," "thickness," "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "a plurality of" means two or more, and "at least one" can mean one, two, or more, unless otherwise expressly specified.

[0079] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment unless explicitly excluded by another embodiment. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A double-cold-head clamp-type heat exchanger, characterized in that, The dual-cold-head clamp-type heat exchanger, used for heat exchange with thermoelectric element (30), comprises: A first heat exchange unit (10) and a second heat exchange unit (20) are arranged opposite to each other, and the thermoelectric element (30) is located between the first heat exchange unit (10) and the second heat exchange unit (20); the first heat exchange unit (10) and the second heat exchange unit (20) are provided with flow channels (300) for the flow of coolant; Multiple first fasteners are used to press the first heat exchange unit (10) and the second heat exchange unit (20) toward each other.

2. The dual-cold-head clamp-type heat exchanger as described in claim 1, characterized in that, Both the first heat exchange unit (10) and the second heat exchange unit (20) include: A base (100), the first surface of which is used to contact the thermoelectric element (30); The top cover (200) is disposed on the second surface of the base (100), the second surface being opposite to the first surface, and the top cover (200) and the base (100) together enclose the flow channel (300).

3. The double-cold-head clamp-type heat exchanger as described in claim 2, characterized in that, The flow channel (300) includes: Multiple microchannels (310) are disposed on the second surface of the base (100); The inner cavity (320) is formed on the surface of the upper cover (200) facing the base (100), and the microchannels (310) are connected to the inner cavity (320).

4. The double-cold-head clamp-type heat exchanger as described in claim 3, characterized in that, The bottom of the microchannel (310) is arc-shaped; along the extension direction of the microchannel (310), the depth of the middle region of the microchannel (310) is greater than the depth of the two end regions of the microchannel (310), and the depth of the microchannel (310) is the distance from the bottom of the channel to the second surface of the base (100).

5. The double-cold-head clamp-type heat exchanger as described in claim 3, characterized in that, Multiple microchannels (310) are arranged in parallel and spaced apart, and fins (110) are formed between adjacent microchannels (310); in the extension direction perpendicular to the microchannels (310), the thickness of the fins (110) is equal to the groove width of the microchannels (310), and the groove width of the microchannels (310) is 0.4 mm to 0.7 mm.

6. The double-cold-head clamp-type heat exchanger as described in claim 2, characterized in that, The upper cover (200) has an annular groove (210) on its surface facing the base (100), and a sealing ring is embedded in the annular groove (210).

7. The double-cold-head clamp-type heat exchanger as described in claim 2, characterized in that, The base (100) is made of copper; the top cover (200) is made of polyphenylene sulfide.

8. The double-cold-head clamp-type heat exchanger as described in claim 2, characterized in that, The surface roughness Ra of the first surface of the base (100) is no greater than 0.4 μm.

9. The double-cold-head clamp-type heat exchanger as described in claim 3, characterized in that, The first heat exchange unit (10) and the second heat exchange unit (20) are each provided with an inlet (400) and an outlet (500), and the inlet (400) and the outlet (500) are located on the same side of the corresponding first heat exchange unit (10) or second heat exchange unit (20); The inner cavity (320) is divided into a flow guiding area (321) and a flow converging area (322). The flow guiding area (321) connects the inlet (400) and the micro channel (310). The flow converging area (322) connects the micro channel (310) and the outlet (500). The flow guiding area (321) and the flow converging area (322) are connected through the micro channel (310).

10. The double-cold-head clamp-type heat exchanger as described in claim 1, characterized in that, The first heat exchange unit (10) is provided with a first mounting hole (600), and the second heat exchange unit (20) is provided with a corresponding second mounting hole (700). The first fastener passes through the first mounting hole (600) and the second mounting hole (700).

11. The double-cold-head clamp-type heat exchanger as described in claim 2, characterized in that, The base (100) is provided with a third mounting hole (120), and the upper cover (200) is provided with a corresponding fourth mounting hole (220). The dual cold head clamp-type heat exchange device also includes a plurality of second fasteners, which pass through the third mounting hole (120) and the fourth mounting hole (220) and fix the upper cover (200) to the base (100).

Images