A full-closed-loop semiconductor dehumidifying and drying device and method

Abstract

The application discloses a full-closed-loop semiconductor dehumidifying and drying device and method, and belongs to the dehumidifying and drying field.The full-closed-loop semiconductor dehumidifying and drying device comprises a drying box, a heating air duct and a dehumidifying air duct installed in the drying box, and further comprises a driving motor fixedly connected to the heating air duct, wind wheels rotatably connected to the inside of the heating air duct and the dehumidifying air duct, and the wind wheel in the heating air duct being connected to the driving motor; a supporting column rotatably connected to the inside of the drying box, a placing table fixedly connected to the top of the supporting column; a first extension frame and a second extension frame symmetrically connected to the outer wall of the dehumidifying air duct, and a filtering frame rotatably connected to the side of the dehumidifying air duct close to the first extension frame and the second extension frame.The application can overcome the problems of high energy consumption, low latent heat recovery rate, low energy efficiency ratio, limited equipment operation power and poor drying quality stability of the dehumidifying and drying device.

Description

Technical Field

[0001] This invention relates to the field of dehumidification and drying technology, and in particular to a fully closed-loop semiconductor dehumidification and drying device and method. Background Technology

[0002] The fully closed-loop semiconductor dehumidification and drying device is a high-efficiency environmental control equipment that integrates semiconductor condensation technology and closed-loop control logic. It is mainly used in precision scenarios with strict requirements for humidity and temperature. Through multi-stage thermopile collaboration, cross-flow heat recovery and phase change heat storage technology, it achieves efficient recovery of latent heat with zero moisture discharge and is widely used in semiconductor manufacturing, electronic component processing and other fields.

[0003] By separating the dehumidification and heating air ducts, the dehumidification capacity of the equipment is optimized. After being dehumidified, the return air can be circulated back into the drying chamber, while the air in the heating air duct goes directly to the condenser for heating, which can heat the air sent out by the heating air duct to achieve efficient dehumidification and drying, while maintaining the airtightness of the internal space to reduce the impact of external humidity and dust on the drying process.

[0004] Current dehumidification and drying equipment includes heat pump drying equipment, semiconductor dehumidification equipment, and rotary dehumidification equipment. Among them, heat pump drying equipment and rotary dehumidification equipment are bulky, energy-intensive, and have low latent heat recovery rates. Semiconductor dehumidification equipment has limited temperature difference and frosts under high humidity conditions, resulting in relatively low energy efficiency. In addition, during operation, these equipment typically only filter dust and other impurities from the air through fixed filters, requiring regular cleaning or replacement. This makes it difficult to maintain the system's ventilation efficiency, hindering efficient operation and affecting the equipment's lifespan and drying quality. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of high energy consumption, low latent heat recovery rate, low energy efficiency ratio, limited equipment operating power, and poor drying quality stability in existing dehumidification and drying devices, and to propose a fully closed-loop semiconductor dehumidification and drying device and method.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A fully closed-loop semiconductor dehumidification and drying device includes a drying chamber and a heating air duct and a dehumidification air duct installed inside the drying chamber. It further includes: a drive motor fixedly connected to the heating air duct; a fan wheel rotatably connected inside both the heating and dehumidification air ducts; the fan wheel in the heating air duct being connected to the drive motor; a support column rotatably connected inside the drying chamber; a platform fixedly connected to the top of the support column; a first extension frame and a second extension frame symmetrically connected to the outer wall of the dehumidification air duct; a filter frame rotatably connected to the side of the dehumidification air duct near the first and second extension frames; a speed reduction linkage mechanism provided on the dehumidification air duct; the speed reduction linkage mechanism being connected to the filter frame and the fan wheel in the dehumidification air duct, for driving the filter frame to rotate along the dehumidification air duct; a sealing dust removal mechanism disposed on the side of the first and second extension frames near the filter frame; the sealing dust removal mechanism being in contact with the filter frame; and a dehumidification heat recovery mechanism disposed between the dehumidification air duct and the heating air duct, for recovering moisture and heat from the humid air.

[0007] To reduce energy consumption during equipment operation and achieve greater energy efficiency and environmental friendliness, preferably, the deceleration linkage mechanism includes a single-tooth gear rotatably connected to the dehumidification duct, the single-tooth gear being connected to the shaft end of the impeller inside the dehumidification duct, a connecting gear rotatably connected to the dehumidification duct and meshing with the single-tooth gear, a linkage wheel assembly fixedly connected to the connecting gear, a second driven wheel rotatably connected to the shaft end of the filter frame on the dehumidification duct, and a third belt sleeved between the linkage wheel assembly and the second driven wheel assembly. A directional component is provided between the dehumidification duct and the connecting gear to control the rotation direction of the connecting gear.

[0008] To prevent the connecting gear from rotating to the initial angle when the single-tooth gear disengages from the connecting gear, the directional component further includes a limiting ring fixedly connected to the side of the dehumidification duct near the connecting gear. A groove is formed on the side of the connecting gear near the limiting ring. Multiple sets of ratchet teeth are fixedly connected to the inner wall of the limiting ring. Multiple sets of pawls are rotatably connected to the side of the groove near the ratchet teeth. An elastic element that fits against the side of the pawl away from the ratchet teeth is fixedly connected inside the groove. The end of the limiting ring extends into the inside of the groove, and the ratchet teeth mesh with the pawls.

[0009] To ensure the stability of gas delivery, preferably, the sealing dust removal mechanism includes multiple sets of connecting cylinders fixedly connected within the first extension frame. The end of each connecting cylinder is fixedly connected to a sealing plate that fits against the inner wall of the first extension frame. A first spring, sleeved on the connecting cylinder, is fixedly connected between the sealing plate and the first extension frame. The dehumidification duct has multiple sets of striking rods symmetrically hinged inside. An arc-shaped cylinder is fixedly connected between the striking rod and the dehumidification duct. The arc-shaped cylinder is connected to at least one set of connecting cylinders via a pipe.

[0010] To facilitate dust cleaning on the filter frame and ensure stable gas flow, a positioning frame is further included, fixedly connected within the second extension frame. A scraper is slidably connected inside the positioning frame, and a second spring is fixedly connected between the scraper and the positioning frame. A cleaning nozzle is fixedly connected to the bottom of the positioning frame. The second extension frame extends to the outside of the drying chamber. The end of the cleaning nozzle is inclined and connected to at least one set of connecting cylinders via a pipe. The end of the scraper is in contact with the filter frame. A collection box connected to the second extension frame is fixedly connected to the drying chamber.

[0011] To ensure uniform drying of the items, the drying chamber further includes a rotating shaft rotatably connected to the bottom of the drying chamber. A first driven wheel is fixedly connected to one end of the rotating shaft near the linkage wheel assembly. A second belt is sleeved between the first driven wheel and the linkage wheel assembly. A connecting shaft is rotatably connected to the bottom of the drying chamber near the rotating shaft. A bevel gear assembly meshing with the connecting shaft and the rotating shaft is provided. A driving bevel gear is fixedly connected to the end of the connecting shaft away from the bevel gear assembly. A driven bevel gear meshing with the driving bevel gear is fixedly connected to the support column.

[0012] To reduce energy consumption during drying and improve the stability of gas flow, preferably, a drive wheel is rotatably connected to the heating duct and the dehumidifying duct. The drive wheel is connected to the impeller, and a first belt is sleeved between the two sets of drive wheels. The surface of the impeller is spiral, and the spiral directions of the impellers in the heating duct and the dehumidifying duct are opposite, respectively used to blow out the dry hot air in the heating duct and to draw the humid air in the drying chamber into the dehumidifying duct.

[0013] To improve the latent heat recovery rate and energy efficiency ratio of the equipment, preferably, the dehumidification heat recovery mechanism includes a cross-flow heat exchange core and an evaporator disposed in the dehumidification duct. A condensate tank connected to the evaporator is fixedly connected to the dehumidification duct. A condenser is disposed inside the heating duct. Multiple sets of semiconductor thermoelectric stacks are fixedly connected inside the drying chamber. The cross-flow heat exchange core is connected to the evaporator outlet and the condenser inlet via copper pipes. The cold end of the semiconductor thermoelectric stack is connected to the evaporator via copper pipes. The hot end of the semiconductor thermoelectric stack is connected to the condenser via copper pipes. A phase change heat storage module is disposed in the condenser duct.

[0014] A fully closed-loop semiconductor dehumidification and drying method includes the following steps: Step 1: When drying items, absorb the hot and humid air and remove impurities from the hot and humid air; Step 2: Then pre-cool the hot, humid air to the dew point; Step 3: After the pre-cooled air is evaporated, liquid water is released, and the condensate is collected. Step 4: The dehumidified cold air exchanges heat with the humid hot air, and then passes through the TEC hot end to condense and heat to the set temperature; Step 5: The heated drying air is then blown onto the items to dry them.

[0015] In step four, the TECs are arranged in series with a temperature gradient of 25°C-60°C and a condensation phase change temperature of 48°C-52°C. In step five, the temperature fluctuation of the drying hot air outlet is -0.8°C to 0.8°C.

[0016] Compared with the prior art, the present invention provides a fully closed-loop semiconductor dehumidification and drying device and method, which has the following beneficial effects: 1. This fully closed-loop semiconductor dehumidification and drying device, through a speed reduction linkage mechanism, can drive the filter frame to rotate according to the rotation speed of the impeller, ensuring that the gas always flows through the clean filter frame, thereby improving the stability of the gas flow. At the same time, it can clean the dust and other impurities adhering to the filter frame, ensuring the efficient operation of the equipment and extending the service life of the filter frame. In addition, it can ensure the stability of the drying quality of the items, which is conducive to the stable and uniform drying of the items.

[0017] 2. This fully closed-loop semiconductor dehumidification and drying device can drive the table to rotate through a speed reduction linkage mechanism, so that hot air can flow evenly along different directions of the items, further improving the drying quality of the items and increasing the drying efficiency.

[0018] 3. This fully closed-loop semiconductor dehumidification and drying device can achieve zero moisture discharge from the equipment through a dehumidification heat recovery mechanism, and recover and utilize the heat in the humid gas to heat the gas in the heating duct, thereby improving the efficient recovery of latent heat and achieving efficient dehumidification and drying of items. In addition, it can also maintain the airtightness of the internal space, reducing the impact of humidity and dust in the outside air on the drying of items.

[0019] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This invention can overcome the problems of high energy consumption, low latent heat recovery rate, low energy efficiency ratio, limited equipment operating power, and poor drying quality stability of dehumidification and drying devices. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a fully closed-loop semiconductor dehumidification and drying device proposed in this invention; Figure 2 This is a schematic diagram of the internal structure of the drying chamber in a fully closed-loop semiconductor dehumidification and drying device proposed in this invention. Figure 1 ; Figure 3 This is a schematic diagram of the internal structure of the drying chamber in a fully closed-loop semiconductor dehumidification and drying device proposed in this invention. Figure 2 ; Figure 4 This is a schematic cross-sectional view of the drying chamber in a fully closed-loop semiconductor dehumidification and drying device proposed in this invention. Figure 5 This is a schematic diagram of the filter frame in a fully closed-loop semiconductor dehumidification and drying device proposed in this invention; Figure 6 This is a partial structural schematic diagram of a fully closed-loop semiconductor dehumidification and drying device proposed in this invention; Figure 7 This invention proposes a fully closed-loop semiconductor dehumidification and drying device. Figure 2 A schematic diagram of the structure of part A; Figure 8 This is a schematic cross-sectional view of the connecting gear in a fully closed-loop semiconductor dehumidification and drying device proposed in this invention. Figure 9 This invention proposes a fully closed-loop semiconductor dehumidification and drying device. Figure 4 A schematic diagram of the structure of part B.

[0021] In the diagram: 1. Drying oven; 2. Heating air duct; 3. Dehumidifying air duct; 4. Support column; 5. Display platform; 6. Drive motor; 7. Fan wheel; 8. Drive wheel; 9. First belt; 10. Single tooth gear; 11. Connecting gear; 12. Linkage wheel assembly; 13. Rotating shaft; 14. First driven wheel; 15. Second belt; 16. Connecting shaft; 17. Bevel gear set; 18. Drive bevel gear; 19. Driven bevel gear; 20. Groove; 21. Limiting ring; 22. Racket tooth; 23. Pawl; 24. Elastic element; 25. Filter frame; 26. First extension frame; 27. Second extension frame; 28. Connecting cylinder; 29. ​​Sealing plate; 30. First spring; 31. Positioning frame; 32. Scraper; 33. Second spring; 34. Cleaning nozzle; 35. Collection box; 36. Striking rod; 37. Arc cylinder; 38. Second driven wheel; 39. Third belt; 40. Crossflow heat exchange core; 41. Evaporator; 42. Condensate tank; 43. Semiconductor thermopile; 44. Condenser. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] Example 1: Reference Figures 1-9 A fully closed-loop semiconductor dehumidification and drying device includes a drying chamber 1 and a heating air duct 2 and a dehumidification air duct 3 installed inside the drying chamber 1. It further includes: a drive motor 6, fixedly connected to the heating air duct 2; a fan wheel 7 rotatably connected inside both the heating air duct 2 and the dehumidification air duct 3; the fan wheel 7 in the heating air duct 2 being connected to the drive motor 6; a support column 4, rotatably connected inside the drying chamber 1; a shelf 5 fixedly connected to the top of the support column 4; a first extension frame 26 and a second extension frame 27, symmetrically connected to the outer wall of the dehumidification air duct 3; a filter frame 25 rotatably connected to the side of the dehumidification air duct 3 near the first extension frame 26 and the second extension frame 27; a reduction linkage mechanism provided on the dehumidification air duct 3, connected to the filter frame 25 and the fan wheel 7 in the dehumidification air duct 3, for driving the filter frame 25 to rotate along the dehumidification air duct 3; and a sealing dust removal mechanism located near the first extension frame 26 and the second extension frame 27. On the side near the filter frame 25, the sealing dust removal mechanism is attached to the filter frame 25; the dehumidification and heat recovery mechanism is set between the dehumidification duct 3 and the heating duct 2, and is used to recover moisture and heat in the humid air. It also includes a drive wheel 8 that is rotatably connected to the heating duct 2 and the dehumidification duct 3. The drive wheel 8 is connected to the impeller 7. A first belt 9 is sleeved between the two sets of drive wheels 8. The surface of the impeller 7 is spiral, and the spiral direction of the impeller 7 in the heating duct 2 and the dehumidification duct 3 is opposite. It is used to blow out the dry hot air in the heating duct 2 and to draw the humid air in the drying box 1 into the dehumidification duct 3, respectively. The drying box 1 is made of aluminum alloy material with a wall thickness of 2mm and a diameter of 500mm*400mm*300mm. The heating duct 2 is a rectangular hole with a diameter of 120mm*80mm and a flange connecting to the drying chamber. The dehumidification duct 3 has a cross section of 80mm*60mm and is bent into a U-shape at the bottom, 30mm from the bottom plate.

[0025] In this embodiment, the drive motor 6 drives two sets of impellers 7 to rotate, realizing the circulation of gas in the drying chamber 1. Hot air is blown towards the items, forming humid and hot gas, which enters the dehumidification duct 3. During this process, the drive reduction linkage mechanism rotates, causing the filter frame 25 to rotate slowly in the dehumidification duct 3, intercepting dust and other impurities in the humid and hot gas, and ensuring that the gas can always flow through the clean filter frame 25. During the rotation of the filter frame 25, the sealing dust removal mechanism can ensure that dust and other impurities in the gas do not flow to the dehumidification heat recovery mechanism, and clean and collect the dust and other impurities adsorbed on the filter frame 25, so as to improve the stability of gas flow and facilitate the efficient operation of the equipment. Furthermore, when the humid and hot gas passes through the dehumidification heat recovery mechanism, the moisture is condensed and the condensate is collected. The heat can then be used to heat the gas in the heating duct 2 to realize latent heat recovery, reduce the energy consumption of the equipment, improve the energy efficiency ratio of the equipment, and at the same time reduce the impact of humidity and dust in the external environment on the drying of items.

[0026] Reference Figure 2 and Figure 7 The deceleration linkage mechanism includes a single-tooth gear 10 rotatably connected to the dehumidification duct 3, the single-tooth gear 10 being connected to the shaft end of the impeller 7 inside the dehumidification duct 3, a connecting gear 11 rotatably connected to the dehumidification duct 3 and meshing with the single-tooth gear 10, a linkage wheel set 12 fixedly connected to the connecting gear 11, a second driven wheel 38 rotatably connected to the shaft end of the filter frame 25, and a third belt 39 sleeved between the linkage wheel set 12 and the second driven wheel set 38. A directional component is provided between the dehumidification duct 3 and the connecting gear 11 to control the rotation direction of the connecting gear 11.

[0027] In this embodiment, when the impeller 7 rotates, it will drive the single-tooth gear 10 to rotate. When the single-tooth gear 10 meshes with the connecting gear 11, it will drive the connecting gear 11 to rotate at a certain angle. It should be explained that since the impeller 7 rotates at a relatively fast speed, this method can reduce the rotation speed of the connecting gear 11, so as to adjust the rotation speed of the filter frame 25.

[0028] Reference Figures 7-8 The directional component includes a limiting ring 21 fixedly connected to the dehumidification duct 3 near the connecting gear 11. A groove 20 is provided on the side of the connecting gear 11 near the limiting ring 21. Multiple sets of ratchet teeth 22 are fixedly connected to the inner wall of the limiting ring 21. Multiple sets of pawls 23 are rotatably connected to the side of the groove 20 near the ratchet teeth 22. An elastic element 24 is fixedly connected inside the groove 20 and fits against the side of the pawls 23 away from the ratchet teeth 22. The end of the limiting ring 21 extends into the inside of the groove 20, and the ratchet teeth 22 mesh with the pawls 23.

[0029] In this embodiment, when the connecting gear 11 rotates with the single-tooth gear 10, the pawl 23 will not affect the rotation of the connecting gear 11. When the single-tooth gear 10 disengages from the connecting gear 11, the pawl 23 will engage with the ratchet 22 to prevent the connecting gear 11 from rotating to the initial position, thereby ensuring the continuity of the rotation of the connecting gear 11.

[0030] Reference Figure 4 and Figure 9 The sealing dust removal mechanism includes multiple sets of connecting cylinders 28 fixedly connected within the first extension frame 26. The end of the connecting cylinder 28 is fixedly connected to a sealing plate 29 that fits against the inner wall of the first extension frame 26. A first spring 30 sleeved on the connecting cylinder 28 is fixedly connected between the sealing plate 29 and the first extension frame 26. The dehumidification duct 3 has multiple sets of striking rods 36 symmetrically hinged inside. An arc-shaped cylinder 37 is fixedly connected between the striking rod 36 and the dehumidification duct 3. The arc-shaped cylinder 37 is connected to at least one set of connecting cylinders 28 through a pipe.

[0031] In this embodiment, when the filter frame 25 rotates, it first moves the sealing plate 29 into the first extension frame 26, compresses the connecting cylinder 28, and delivers some of the gas in the connecting cylinder 28 into the arc-shaped cylinder 37, causing the striking rod 36 to rotate away from the filter frame 25. This avoids the striking rod 36 affecting the rotation of the filter frame 25. When the corner of the filter frame 25 passes the sealing plate 29, the edge of the filter frame 25 quickly fits against the sealing plate 29 under the action of the first spring 30. Under the action of the connecting cylinder 28, the striking rod 36 rotates back to its initial position to strike the filter frame 25, thereby reducing the adsorption force between dust and other impurities and the filter frame 25, so as to facilitate the subsequent cleaning of dust and other impurities on the filter frame 25.

[0032] Reference Figure 9 It also includes a positioning frame 31 fixedly connected within the second extension frame 27. A scraper 32 is slidably connected inside the positioning frame 31. A second spring 33 is fixedly connected between the scraper 32 and the positioning frame 31. A cleaning nozzle 34 is fixedly connected to the bottom of the positioning frame 31. The second extension frame 27 extends to the outside of the drying chamber 1. The end of the cleaning nozzle 34 is inclined. The cleaning nozzle 34 is connected to at least one set of connecting cylinders 28 through a pipe. The end of the scraper 32 is in contact with the filter frame 25. A collection box 35 connected to the second extension frame 27 is fixedly connected to the drying chamber 1.

[0033] In this embodiment, during the rotation of the filter frame 25, the scraper 32 remains in contact with the outer wall of the filter frame 25 under the action of the second spring 33, thereby cleaning the dust and other impurities on the filter frame 25. The gas compressed by the connected cylinder 28 passes through the cleaning nozzle 34, further accelerating the shedding of dust and other impurities on the filter frame 25, and finally collecting the dust and other impurities into the collection box 35. It should be noted that the positioning frame 31 and the scraper 32 can also seal the dehumidification duct 3, preventing dust and other impurities from flowing to the crossflow heat exchange core 40 with the gas flow.

[0034] Reference Figure 4 and Figure 6 It also includes a rotating shaft 13 rotatably connected to the bottom of the drying chamber 1. A first driven wheel 14 is fixedly connected to one end of the rotating shaft 13 near the linkage wheel assembly 12. A second belt 15 is sleeved between the first driven wheel 14 and the linkage wheel assembly 12. A connecting shaft 16 is rotatably connected to the bottom of the drying chamber 1 near the rotating shaft 13. A bevel gear assembly 17 meshes between the connecting shaft 16 and the rotating shaft 13. A drive bevel gear 18 is fixedly connected to one end of the connecting shaft 16 away from the bevel gear assembly 17. A driven bevel gear 19 meshing with the drive bevel gear 18 is fixedly connected to the support column 4.

[0035] In this embodiment, when the connecting gear 11 rotates, it drives the linkage wheel assembly 12 to rotate, which in turn drives the first driven wheel 14 to rotate via the second belt 15. This, in turn, drives the driven bevel gear 19 and the support column 4 to rotate via the bevel gear assembly 17 and the driving bevel gear 18. In other words, as the items on the shelf 5 are dried, the drying angle of the items can be continuously adjusted to improve the drying efficiency and quality of the items.

[0036] Reference Figures 2-4 The dehumidification heat recovery mechanism includes a cross-flow heat exchange core 40 and an evaporator 41 installed in the dehumidification duct 3. A condensate tank 42 connected to the evaporator 41 is fixedly connected to the dehumidification duct 3. A condenser 44 is installed inside the heating duct 2. Multiple sets of semiconductor thermopile 43 are fixedly connected inside the drying chamber 1. The cross-flow heat exchange core 40 is connected to the outlet of the evaporator 41 and the inlet of the condenser 44 through a copper pipe. The cold end of the semiconductor thermopile 43 is connected to the evaporator 41 through a copper pipe. The hot end of the semiconductor thermopile 43 is connected to the condenser 44 through a copper pipe. A phase change heat storage module is installed in the duct of the condenser 44.

[0037] In this embodiment, the cross-flow heat exchange core 40 and the evaporator 41 are connected to the dehumidification duct 3, which can reduce the humid and hot gas in the dehumidification duct 3 to a certain temperature. Then, the gas flows into the evaporator 41, where the moisture in the gas condenses into liquid water and is collected in the condensate tank 42. The dry and low-temperature gas flows back to the cross-flow heat exchange core 40 through the copper pipe for initial cooling of the humid and hot gas. After being heated, the low-temperature dry gas flows into the condenser 44 through the copper pipe to heat the gas in the heating duct 2, thereby achieving the purpose of recovering latent heat. It should be noted that the cross-flow heat exchange core 40 has dimensions of 200*150*100 mm, a 45° diagonal cross layout, and the end cap is sealed with a silicone gasket. The compression is 1.5 mm, and the pre-cooling efficiency is greater than 60%. Evaporator 41 is a microfin type with a fin height of 8cm and a spacing of 2mm, closely attached to the cold end of the TEC. Its surface is coated with a nano-hydrophobic layer (nano-zinc oxide) with a specified thickness of 20μm and a contact angle greater than 150°. It is also connected to a TEC polarity reversal circuit for unidirectional current defrosting. The condensate tank 42 is located below the cold end of the TEC. It is a V-shaped stainless steel tank with an inclination angle of 5°. It is led from the condensate tank 42 to the water storage bottle outside the equipment through a 10mm diameter polytetrafluoroethylene pipe. The condenser 44 is made of 8mm copper tube with finned tubes and a fin spacing of 3mm. It is connected to the copper tube flange. The copper tubes are arranged in an array. The semiconductor thermopile 43 uses a TEC chip, and each stage uses an independent PID temperature control. It is fixed in the equipment in the center by a mounting base. The copper tubes have a diameter of 6mm, are coiled in a serpentine three-bend shape, and are 600mm long. They are brazed to the TEC hot end to the condenser 44. The phase change thermal storage module is a paraffin-expanded graphite composite that covers the outer wall of the condenser 44. It has a hexagonal honeycomb aluminum shell and a graphene sheet with a thermal conductivity of 0.5 mm. The thermal storage density is greater than 200 KJ / kg. It is coupled to the TEC hot end through the graphene thermal conductive layer, storing heat during the peak dehumidification period and releasing heat during the low load period.

[0038] Example 2: Similar to Example 1, a fully closed-loop semiconductor dehumidification and drying method is proposed based on Example 1, including the following steps: Step 1: When drying items, absorb the hot and humid air and remove impurities from the hot and humid air; Step 2: Then pre-cool the hot, humid air to the dew point; Step 3: After the pre-cooled air is evaporated, liquid water is released, and the condensate is collected. Step 4: The dehumidified cold air exchanges heat with the humid hot air, and then passes through the TEC hot end to condense and heat to the set temperature; Step 5: The heated drying air is then blown onto the items to dry them.

[0039] In step four, the TECs are arranged in series with a temperature gradient of 25°C-60°C and a condensation phase change temperature of 48°C-52°C. In step five, the temperature fluctuation of the drying hot air outlet is -0.8°C to 0.8°C. In addition, the equipment adopts an intelligent control system, including a humidity sensor, a temperature sensor, a controller, a microprocessor, and a PWM power regulator. This is a conventional method in existing technology, so it will not be described in detail. The humidity sensor is placed at the inlet and outlet of the cross-flow heat exchange core 40, and the temperature sensor is placed on the surface of the TEC cold / hot end, the housing of the phase change heat storage module, and the air outlet. The controller is installed on the side wall of the drying chamber 1 through an electrical box. The PWM power regulator dynamically adjusts the duty cycle of the TEC current to dynamically adjust the TEC current and the speed of the drive motor 6. The speed control signal of the drive motor 6 is output as an analog quantity in the range of 0-10V. It also includes a frost warning module: based on the current surge and the temperature difference valve triggering the TEC polarity reversal defrosting, when the temperature difference between the TEC cold / hot end is greater than 60°C, polarity reversal defrosting is triggered for 10-15 seconds.

[0040] Example 3: Laboratory precision instrument drying module TEC configuration: Three-stage 4*4cm TEC plates with a center distance of 50mm, including a high-temperature stage with a maximum power of 80W and a medium / low-temperature stage with a maximum power of 60W; Operating parameters: Inlet air 40°C / RH80% - after dehumidification 25°C / RH30% - reheated to 45°C for output; Power consumption: 0.82 kW·h / kg water, latent heat recovery rate: 72.3%.

[0041] Example 4: Household item drying module Add ultraviolet germicidal lamps and negative ion generators; Remote start / stop via mobile app + customizable drying curve.

[0042] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A fully closed-loop semiconductor dehumidification and drying device, comprising a drying chamber (1) and a heating air duct (2) and a dehumidification air duct (3) installed within the drying chamber (1), characterized in that, Also includes: A drive motor (6) is fixedly connected to the heating air duct (2). Both the heating air duct (2) and the dehumidifying air duct (3) are rotatably connected to a fan wheel (7). The fan wheel (7) in the heating air duct (2) is connected to the drive motor (6). A support column (4) is rotatably connected inside the drying oven (1), and a shelf (5) is fixedly connected to the top of the support column (4). The first extension frame (26) and the second extension frame (27) are symmetrically connected to the outer wall of the dehumidification duct (3). A filter frame (25) is rotatably connected to the side of the dehumidification duct (3) near the first extension frame (26) and the second extension frame (27). The dehumidification duct (3) is provided with a deceleration linkage mechanism, which is connected to the filter frame (25) and the impeller (7) in the dehumidification duct (3) to drive the filter frame (25) to rotate along the dehumidification duct (3); A sealed dust removal mechanism is disposed on the side of the first extension frame (26) and the second extension frame (27) close to the filter frame (25), and the sealed dust removal mechanism is in contact with the filter frame (25); The dehumidification and heat recovery mechanism is located between the dehumidification duct (3) and the heating duct (2) and is used to recover moisture and heat from the humid air.

2. The fully closed-loop semiconductor dehumidification and drying device according to claim 1, characterized in that, The deceleration linkage mechanism includes a single-tooth gear (10) rotatably connected to the dehumidification duct (3), the single-tooth gear (10) being connected to the shaft end of the impeller (7) inside the dehumidification duct (3), a connecting gear (11) rotatably connected to the dehumidification duct (3) meshing with the single-tooth gear (10), a linkage wheel assembly (12) fixedly connected to the connecting gear (11), a second driven wheel (38) rotatably connected to the shaft end of the filter frame (25) on the dehumidification duct (3), and a third belt (39) sleeved between the linkage wheel assembly (12) and the second driven wheel assembly (38). A directional component is provided between the dehumidification duct (3) and the connecting gear (11) to control the rotation direction of the connecting gear (11).

3. The fully closed-loop semiconductor dehumidification and drying device according to claim 2, characterized in that, The directional component includes a limiting ring (21) fixedly connected to the dehumidification duct (3) near the connecting gear (11). The connecting gear (11) has a groove (20) on the side near the limiting ring (21). Multiple sets of ratchet teeth (22) are fixedly connected to the inner wall of the limiting ring (21). Multiple sets of pawls (23) are rotatably connected to the side of the groove (20) near the ratchet teeth (22). An elastic element (24) is fixedly connected inside the groove (20) and fits against the side of the pawls (23) away from the ratchet teeth (22). The end of the limiting ring (21) extends into the interior of the groove (20), and the ratchet (22) engages with the pawl (23).

4. The fully closed-loop semiconductor dehumidification and drying device according to claim 1, characterized in that, The sealing and dust removal mechanism includes multiple sets of connecting cylinders (28) fixedly connected in the first extension frame (26). The end of the connecting cylinder (28) is fixedly connected to a sealing plate (29) that fits against the inner wall of the first extension frame (26). A first spring (30) sleeved on the connecting cylinder (28) is fixedly connected between the sealing plate (29) and the first extension frame (26). The dehumidification duct (3) has multiple sets of striking rods (36) symmetrically hinged inside. An arc-shaped cylinder (37) is fixedly connected between the striking rod (36) and the dehumidification duct (3). The arc-shaped cylinder (37) is connected to at least one set of connecting cylinders (28) through a pipe.

5. The fully closed-loop semiconductor dehumidification and drying device according to claim 4, characterized in that, It also includes a positioning frame (31) fixedly connected inside the second extension frame (27), a scraper (32) is slidably connected inside the positioning frame (31), a second spring (33) is fixedly connected between the scraper (32) and the positioning frame (31), and a cleaning nozzle (34) is fixedly connected to the bottom of the positioning frame (31). The second extension frame (27) extends to the outside of the drying box (1), the end of the cleaning nozzle (34) is inclined, the cleaning nozzle (34) is connected to at least one set of connecting cylinders (28) through a pipe, the end of the scraper (32) is attached to the filter frame (25), and a collection box (35) connected to the second extension frame (27) is fixedly connected to the drying box (1).

6. The fully closed-loop semiconductor dehumidification and drying device according to claim 2, characterized in that, It also includes a rotating shaft (13) rotatably connected to the bottom of the drying chamber (1). A first driven wheel (14) is fixedly connected to one end of the rotating shaft (13) near the linkage wheel group (12). A second belt (15) is sleeved between the first driven wheel (14) and the linkage wheel group (12). A connecting shaft (16) is rotatably connected to the bottom of the drying chamber (1) near the rotating shaft (13). A bevel gear group (17) meshes between the connecting shaft (16) and the rotating shaft (13). A driving bevel gear (18) is fixedly connected to one end of the connecting shaft (16) away from the bevel gear group (17). A driven bevel gear (19) meshing with the driving bevel gear (18) is fixedly connected to the support column (4).

7. The fully closed-loop semiconductor dehumidification and drying device according to claim 1, characterized in that, It also includes a drive wheel (8) rotatably connected to the heating air duct (2) and the dehumidifying air duct (3), the drive wheel (8) being connected to the fan wheel (7), and a first belt (9) being sleeved between the two sets of drive wheels (8). The surface of the impeller (7) is spiral, and the spiral directions of the impeller (7) in the heating air duct (2) and the dehumidifying air duct (3) are opposite, respectively used to blow out the dry hot air in the heating air duct (2) and to draw the humid and hot air in the drying box (1) into the dehumidifying air duct (3).

8. The fully closed-loop semiconductor dehumidification and drying device according to claim 1, characterized in that, The dehumidification heat recovery mechanism includes a cross-flow heat exchange core (40) and an evaporator (41) installed in the dehumidification duct (3). A condensate tank (42) connected to the evaporator (41) is fixedly connected to the dehumidification duct (3). A condenser (44) is installed inside the heating duct (2). Multiple sets of semiconductor thermopile (43) are fixedly connected inside the drying box (1). The cross-flow heat exchange core (40) is connected to the outlet of the evaporator (41) and the inlet of the condenser (44) by a copper pipe. The cold end of the semiconductor thermopile (43) is connected to the evaporator (41) by a copper pipe. The hot end of the semiconductor thermopile (43) is connected to the condenser (44) by a copper pipe. A phase change heat storage module is installed in the air duct of the condenser (44).

9. A fully closed-loop semiconductor dehumidification and drying method, employing the fully closed-loop semiconductor dehumidification and drying apparatus according to any one of claims 1-8, characterized in that, Includes the following steps: Step 1: When drying items, absorb the hot and humid air and remove impurities from the hot and humid air; Step 2: Then pre-cool the hot, humid air to the dew point; Step 3: After the pre-cooled air is evaporated, liquid water is released, and the condensate is collected. Step 4: The dehumidified cold air exchanges heat with the humid hot air, and then passes through the TEC hot end to condense and heat to the set temperature; Step 5: The heated drying air is then blown onto the items to dry them.

10. The fully closed-loop semiconductor dehumidification and drying method according to claim 9, characterized in that, In step four, the TECs are arranged in series with a temperature gradient of 25°C-60°C and a condensation phase change temperature of 48°C-52°C. In step five, the temperature fluctuation of the drying hot air outlet is -0.8°C to 0.8°C.

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