Surface topography measurement system and method

Abstract

The present application provides a surface topography measurement system and method, the surface topography measurement method comprising: setting, by a control module, a synchronous scanning area and a skip scanning area of an object surface according to a scanning script; in the synchronous scanning area, performing synchronous scanning by an interferometer at a first displacement speed, and generating a plurality of interference images by a camera, the plurality of interference images being associated with reference light provided by the interferometer and a plurality of object reflection lights reflected from the object surface; and in the skip scanning area, first moving the interferometer at a second displacement speed while the camera does not generate interference images, and then performing synchronous scanning by the interferometer at the first displacement speed and generating the interference images by the camera; wherein the second displacement speed is greater than the first displacement speed.

Description

Technical Field

[0001] This application relates to a surface topography measurement system and method, and more particularly to a surface topography measurement system and method that can accelerate the scanning speed of high-step edges. Background Technology

[0002] In existing surface topography measurement techniques, interferometry is widely used to measure the height distribution and structural characteristics of an object's surface. Generally, traditional surface topography measurement systems perform continuous scanning at a fixed speed, recording an interferometric image at each depth location to generate complete surface topography data. Traditional systems generate a large number of interferometric images, placing extremely high demands on memory and data processing capabilities, easily creating a bottleneck in devices with limited memory. However, while this layer-by-layer scanning method offers high accuracy when measuring shallow structures, its scanning efficiency significantly decreases when encountering deep structures such as vias and redistribution layers (RDLs).

[0003] The reason is that traditional surface topography measurement systems must scan all depth points, meaning the scanning process includes areas inside vias or redistribution layers. As those skilled in the art will understand, scanning areas inside vias or redistribution layers does not produce effective interferometric images and instead wastes time and resources. To address these issues, the industry needs a surface topography measurement system and method that can improve measurement efficiency, reduce memory requirements, and adapt to different structural characteristics. Summary of the Invention

[0004] The technical problem this application aims to solve is to provide a surface topography measurement system that, based on a known scanning script, can not only accurately measure the surface of an object under normal circumstances, but also selectively accelerate the scanning speed when encountering specific structures. For objects with high-depth or protruding structures on their surfaces, this surface topography measurement system can optimize the scanning process, shorten measurement time, and reduce memory usage.

[0005] This application proposes a surface topography measurement system, including a light source, an interferometer, a photographic device, and a control module. The light source provides test light. The interferometer divides the test light into a first sub-ray and a second sub-ray. The first sub-ray is incident on a reference mirror and reflects a reference light, while the second sub-ray is incident on the object surface and reflects multiple object-reflected rays. These multiple object-reflected rays correspond to different measurement heights of the interferometer along a first axis. The photographic device receives the reference light and the multiple object-reflected rays to selectively generate multiple interferometric images. The control module is electrically connected to the interferometer and the photographic device, and sets the interferometer and the photographic device to operate in a first scanning mode or a second scanning mode according to a scanning script. In the first scanning mode, the measurement height of the interferometer changes with a first displacement velocity, and the photographic device records the multiple interferometric images. In the second scanning mode, the measurement height of the interferometer changes with a second displacement velocity, and the photographic device does not record interferometric images; the second displacement velocity is greater than the first displacement velocity.

[0006] In some embodiments, the scan script can be associated with the current structure of the object surface. When the scan script indicates that the current structure is a through-hole edge, the control module can configure the interferometer and the imaging device to operate sequentially in a second scan mode and a first scan mode. When the scan script indicates that the current structure is not a through-hole edge, the control module can configure the interferometer and the imaging device to operate in the first scan mode. The jump time of the second scan mode can be associated with the current structure indicated by the scan script.

[0007] In some embodiments, the control module can further configure the interferometer and the imaging device to operate in a third scanning mode to generate a scanning script. In the third scanning mode, the interferometer moves along the first axis at a third displacement velocity, and the imaging device records the plurality of interferometric images. The third displacement velocity can be greater than the first displacement velocity. Each interferometric image is associated with a reference light and the corresponding interference fringe pattern of the light reflected from the plurality of objects. The control module can determine the current structure based on the interferometric images generated by the third scanning mode. The measured height of the interferometer is associated with the position of the interferometer along the first axis, and the first displacement velocity or the second displacement velocity of the measured height of the interferometer can be the moving speed of the interferometer along the first axis.

[0008] This application provides a surface topography measurement method. By introducing a dual-modal design of synchronous scanning and skip scanning, combined with a known scanning script, efficient and accurate surface topography measurement can be achieved. For objects with high-depth or protruding structures on their surfaces, this surface topography measurement method can optimize the scanning process, shorten measurement time, and reduce memory usage.

[0009] This application proposes a surface topography measurement method for a surface topography measurement system. The system includes an interferometer, a photographic device, and a control module. The method comprises: the control module setting a synchronous scanning area and a skip scanning area on the object surface according to a scanning script; in the synchronous scanning area, the interferometer performs synchronous scanning at a first displacement speed, and the photographic device generates multiple interferometric images, which are associated with a reference light provided by the interferometer and multiple object-reflected lights reflected from the object surface; and in the skip scanning area, the interferometer first moves at a second displacement speed while the photographic device does not generate interferometric images, and then the interferometer performs synchronous scanning at the first displacement speed while the photographic device generates the interferometric images; wherein the second displacement speed is greater than the first displacement speed.

[0010] In some embodiments, the interferometer performs synchronous scanning at a first displacement velocity so that when the interferometer provides the reference light and the reflected light from each object, the imaging device can simultaneously generate one of the corresponding interferometric images. The scan script is associated with the current structure of the object surface; when the scan script indicates that the current structure is a through-hole edge, the control module can set the through-hole edge as a skip scan area. When the scan script indicates that the current structure is a through-hole edge, the skip time of the interferometer performing skip scans at a second displacement velocity can be associated with the through-hole depth.

[0011] In summary, the surface topography measurement system and method provided in this application are applicable to semiconductor manufacturing, optical component processing, or other applications requiring precise measurement of the surface structure of objects. When the object surface has high-depth structures such as through holes or protruding structures such as redistribution layers, the surface topography measurement system and method of this application can accelerate the scanning speed of through hole edges or protruding structure edges, thereby improving overall measurement efficiency.

[0012] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of a surface topography measurement system according to an embodiment of this application.

[0015] Figure 2 This is a schematic diagram of the object surface being the edge of a through hole.

[0016] Figure 3 This is a schematic diagram of the object's surface having raised edges.

[0017] Figure 4 This is a flowchart of a surface morphology measurement method according to an embodiment of this application.

[0018] Symbol Explanation

[0019] 1: Surface morphology measurement system; 10: Light source; 12: Interferometer; 120: Objective lens; 121: Beam splitter; 122: Reference mirror; 13: Photographic installation; 14: Control module; 15: Beam splitter; DUT, DUT': Object surface; P1: Surface; P2: Surface; S20~S22: Steps and procedures. Detailed Implementation

[0020] In the embodiments described below, the positional relationships include: up, down, left, and right. Unless otherwise specified, they are all based on the direction shown by the components in the diagram.

[0021] Please see Figure 1 , Figure 1 This is a schematic diagram of a surface topography measurement system according to an embodiment of this application. Figure 1 As shown, the surface topography measurement system 1 of this application includes a light source 10, an interferometer 12, an imaging device 13, and a control module 14. The light source 10 provides test light to the interferometer 12, which scans the object surface DUT. The imaging device 13 receives reference light returned from the interferometer 12 and multiple object lights to generate multiple interference images. The control module 14 analyzes these multiple interference images to determine the surface topography of the object surface DUT. In practice, a beam splitter 15 can be provided between the light source 10 and the interferometer 12. The beam splitter 15 guides the light from the light source 10 towards the interferometer 12, as well as the light returning from the interferometer 12 and directed towards the imaging device 13. The components of the surface topography measurement system 1 will be described below.

[0022] Light source 10 is used to provide test light, which can be a parallel light. In one example, light source 10 can be a broadband white LED or a monochromatic laser light source, and the specific type is determined according to the reflection characteristics and accuracy requirements of the DUT surface; this embodiment is not limited to this. Furthermore, an interferometer 12 is provided along the optical path of the test light. Interferometer 12 can be an optical interferometer, such as the common Mirau interferometer, Linnik interferometer, or Michelson interferometer. For ease of explanation, this embodiment uses a Mirau interferometer as an example, but those skilled in the art will understand that interferometer 12 is not limited to a Mirau interferometer. Interferometer 12 includes an objective lens 120, a beam splitter 121, and a reference mirror 122. In this design, objective lens 120 can be a microscope objective used to focus the test light beam, and beam splitter 121 is used to reflect a portion of the test light beam toward reference mirror 121, while also allowing another portion of the test light beam to pass through. Here, the portion of the test light beam reflected toward reference mirror 121 can be called the first sub-ray, and the portion of the test light beam passing through beam splitter 121 can be called the second sub-ray. In practice, the light beam after reflection from the first sub-ray beam through reference mirror 121 is referred to as the reference light in this embodiment. The second sub-ray beam is incident on the object surface DUT and, after reflection from the object surface DUT, can be called the object reflected light. These object reflected lights correspond to different depth positions of the interferometer along the first axis (i.e., the Z-axis).

[0023] The control module 14 can control the measurement height of the interferometer 12. The interferometer 12 can scan at multiple measurement heights, each corresponding to a different object's reflected light. The imaging device 13 can capture the light rays returned from the interferometer 12, such as reference light and multiple object reflected light. Since there may be optical path differences between the reference light and each object's reflected light when they reach the imaging device 13, obvious (or indistinct) interference fringe patterns may be visible in the images captured by the imaging device 13. In this embodiment, the multiple images captured by the imaging device 13 corresponding to multiple object reflected light are all referred to as interference images. Those skilled in the art should understand that the control module 14 can determine the height and undulation of the object surface DUT based on the interference fringe patterns in the multiple interference images, thereby obtaining the surface morphology of the object surface DUT. For example, the control module 14 can determine which interference image has the best clarity based on grayscale values ​​or contrast, and then calculate the surface morphology of the object surface DUT from the measurement height corresponding to the interferometer 12.

[0024] Unlike traditional surface topography measurement systems, the control module 14 of the surface topography measurement system 1 in this embodiment is optimized to more effectively measure specific structures of the object surface DUT, such as for measuring through holes. Please refer to [link / reference needed]. Figure 1 and Figure 2 , Figure 2 This is a schematic diagram showing the edge of a through hole on the object's surface. Figure 2 For example, a DUT (Distributed Under Test) of an object surface is illustrated with a through-hole. This through-hole has two surfaces with a height difference (depth H): an upper surface P1 corresponding to the opening of the through-hole and a lower surface P2 corresponding to the bottom of the through-hole. Taking a through-hole with a height difference of 175 micrometers as an example, some traditional surface topography measurement systems require nearly 100 seconds to complete the entire measurement because the scanning process includes the hollow area inside the through-hole. The surface topography measurement system 1 of this embodiment can efficiently and accurately measure the surface topography of the DUT, especially for design optimization of objects with high-depth structures such as through-holes. The through-hole referred to in this embodiment is an example of a recessed structure. In reality, recessed structures may also include trenches or through-holes and vias of various functions, such as through-interposer vias (TIV), through-silicon vias (TSV), through-glass vias (TGV), or other vertical vias. This embodiment does not impose any limitations.

[0025] In detail, the control module 14 is electrically connected to the interferometer 12 and the imaging device 13, respectively, and switches the operating modes of the interferometer 12 and the imaging device 13 according to the scanning script, including a first scanning mode and a second scanning mode. Assume the object surface DUT is a wafer surface, and the scanning script is pre-prepared (a known object surface DUT layout). In one example, the scanning script described in this embodiment can predefine one or more synchronous scanning regions and one or more skip scanning regions. In practice, the scanning script can pre-divide the object surface DUT into regions; for example, if the depth of a via is on the Z-axis, the region can be divided in the XY plane. A criterion for dividing the region could be that any object surface DUT that is not the edge of a via can be classified as a synchronous scanning region, while only the edges of vias are classified as skip scanning regions. This embodiment does not impose such limitations.

[0026] At this point, the control module 14 can first determine the structure to be scanned next (the current structure) from the scanning script. If the current structure corresponds to a planar surface or a structure with minimal elevation changes, falling within the synchronous scanning area of ​​the DUT's scanning script, the control module 14 can control the interferometer 12 and the imaging device 13 to use the first scanning mode throughout the process to ensure data continuity. In practice, the first scanning mode refers to the interferometer 12 changing its measurement height at a relatively low initial displacement speed, and the imaging device 13 recording the interference images of the reflected light and reference light returned from each measurement height to obtain detailed surface data of the DUT. Here, the simultaneous generation or recording of a corresponding interference image by the imaging device 13 when the interferometer 12 changes its measurement height can be called synchronous scanning. In other words, when the current structure does not have a large elevation difference (e.g., it is not a through-hole edge), the control module 14 can allow the interferometer 12 and the imaging device 13 to perform synchronous scanning throughout the process to ensure the accuracy of the scanned DUT.

[0027] Conversely, if the current structure corresponds to the edge of a through hole or a structure with significant undulations, belonging to the skip scanning area of ​​the DUT (Device Under Test) surface, the control module 14 can control the interferometer 12 and the imaging device 13 to sequentially use the second scanning mode and the first scanning mode. Figure 2 For example, the control module 14 knows from the scanning script that it is currently scanning the edge of a through hole, which may have a depth H. At this time, at the upper surface P1 (from the upper surface P1 to the depth h1) near the opening of the through hole, the control module 14 can first set the interferometer 12 and the imaging device 13 to perform synchronous scanning to ensure that the structure of the upper surface P1 is completely scanned.

[0028] Next, at the hollow region (depth h2) corresponding to the measured height of the through hole, the control module 14 can control the interferometer 12 and the imaging device 13 to use the second scanning mode. In practice, the second scanning mode refers to the interferometer 12 changing its measured height at a higher second displacement velocity, while the imaging device 13 does not record the interference image. For example, because the imaging device 13 does not record the interference image, in addition to saving data storage space, the interferometer 12 can move its measured height more quickly without waiting for the imaging device 13 to process it. Therefore, the second displacement velocity can be much greater than the first displacement velocity; in other words, comparing the change in the measured height of the interferometer 12 per unit time, the change in measured height in the second scanning mode will be much greater than the change in measured height in the first scanning mode. For a practical example, the second displacement velocity can be, for example, 1 mm / s, and the first displacement velocity can be, for example, 0.1 mm / s.

[0029] The jump distance of the second scanning mode is related to the hole depth H, especially to depth h2. Those skilled in the art will understand that the control module 14 can calculate the duration of the second scanning mode (i.e., the jump time) from the known second displacement velocity and the known depth h2. Since the imaging device 13 does not record interferometric images, the lack of data storage significantly reduces memory usage. Because the control module 14 knows the approximate hole depth H from the scanning script, when the measured height is close to the bottom of the hole, for example, at depth h3, the control module 14 can control the interferometer 12 and the imaging device 13 to switch back to the first scanning mode. In this embodiment, the first scanning mode is defined as described above, meaning that the interferometer 12 and the imaging device 13 can resume synchronous scanning at this measured height (depth h3), ensuring that the structure of the lower surface P2 can be completely scanned when it is adjacent to the lower surface P2. As described above, when the control module 14 determines that the current structure is the edge of a through hole, it will first skip the hollow region (depth h2) of the through hole without performing synchronous scanning (second scanning mode), and will only perform synchronous scanning (first scanning mode) when it approaches the bottom of the through hole. In one example, the interferometer 12 and the imaging device 13 first operate in the second scanning mode and then operate in the first scanning mode. This embodiment is called skip scanning.

[0030] As described earlier in this embodiment, when the surface topography measurement system 1 scans the edge of the through hole (jump scan area), it first performs a synchronous scan within the range of depth h1 corresponding to the measurement height, then performs a jump scan (depth h2) within the range of depth h2 corresponding to the measurement height, and then performs a synchronous scan (depth h3) again within the range of depth h3 corresponding to the measurement height. However, as long as the surface topography measurement system 1 performs at least one jump scan on the object surface DUT, that is, the interferometer 12 and the imaging device 13 switch from the second scanning mode to the first scanning mode at least once, the position of the jump scan should conform to the definition of the jump scan area in this embodiment. In other words, the surface topography measurement system 1 of this embodiment skips a certain depth distance and then resumes the normal synchronous scanning speed. Because the skipped depth is scanned at high speed and no data is stored, memory can be greatly saved, adapting to environments with limited memory capacity. Taking the measurement of a through hole 175 micrometers deep as an example, when using the surface topography measurement system 1 of this embodiment for measurement, the total time can be greatly reduced from nearly 100 seconds in the traditional method to within 13.5 seconds.

[0031] On the other hand, the surface topography measurement system 1 can change the measurement height of the interferometer 12 in several ways. For example, optical means can be used to change the optical path length of the object's reflected light along the first axis (Z-axis) without moving the overall position of the interferometer 12; or, the actual position of the interferometer 12 along the first axis (Z-axis) can be directly moved to change the optical path length of the object's reflected light along the first axis (Z-axis). This embodiment does not impose any limitations on this. It is worth mentioning that the surface topography measurement system 1 in this embodiment can significantly improve measurement efficiency because the control module 14 obtains a scan script and knows the location of the vias in advance. These locations can be provided by the manufacturer or the scan script can be compiled based on previous data and directly applied to the measurement of wafers in the same series. In addition, if the scan script is incorrect, for example, if the expected measurement value is not measured at the location that should be the edge of the via, the control module 14 can activate a fast scan mechanism to scan at larger intervals and higher speeds to quickly locate the anomaly.

[0032] In one example, the surface topography measurement system 1 of this application can generate scan scripts, for example, using a third scan mode as the initial inspection step. For instance, when measuring a new object surface or when an error occurs in the existing scan script, and no usable scan script is available, the control module 14 can select to activate the third scan mode. The interferometer 12 moves along the first axis at a third displacement speed (e.g., 0.5 mm / s, between the first and second displacement speeds), and the imaging device 13 can select to record interferometric images at longer time intervals. The control module 14 determines the structure by analyzing changes in the interference fringe pattern within the interferometric image. For example, an indistinct or absent interference fringe pattern indicates the presence of a through-hole, while a prominent interference fringe pattern indicates the presence of a surface (possibly the opening or bottom of the through-hole). Based on this, a new scan script is generated. In practice, the third scan mode is designed for rapid acquisition of a structural overview or anomaly detection because it requires less data than synchronous scanning and has relatively lower memory requirements, making it particularly suitable for pre-generated scan scripts. Furthermore, the generated scan script can be stored in the memory of the control module 14 and reused in subsequent measurements, making it suitable for batch wafer inspection.

[0033] Similarly, this application is not only applicable to through holes, but also to protruding structures. Please refer to the following: Figure 1 and Figure 3 , Figure 3 This is a schematic diagram showing the surface of an object with raised, textured edges. Figure 3For example, the object surface DUT' is drawn with a raised structure having two surfaces with a height difference (depth H), namely surface P1 corresponding to the bottom of the raised structure and surface P2 corresponding to the top of the raised structure. The scan script described in this embodiment can also predefine one or more synchronous scan regions and one or more skip scan regions. In practice, the scan script can pre-divide the object surface DUT' into regions; for example, if the height of the raised structure is on the Z-axis, the region can be divided in the XY plane. A criterion for dividing the region could be that any part of the object surface DUT' that is not the edge of the raised structure can be classified as a synchronous scan region, while only the edges of the raised structure will be classified as skip scan regions. This embodiment does not impose any restrictions.

[0034] by Figure 3 For example, the control module 14 knows from the scan script that it is currently scanning the edge of a protruding structure, which may have a height H. At this time, at surface P1 (from surface P1 to height h1) near the bottom of the protruding structure at the measured height, the control module 14 can first set the interferometer 12 and the imaging device 13 to perform synchronous scanning to ensure that the structure of surface P1 is completely scanned. Then, at the middle region (height h2) of the protruding structure corresponding to the measured height, the control module 14 can control the interferometer 12 and the imaging device 13 to use a second scanning mode. In practice, the second scanning mode refers to the interferometer 12 changing its measured height at a higher second displacement speed, while the imaging device 13 does not record interference images. Since the control module 14 can also know the approximate height H of the protruding structure from the scan script, when the measured height is close to the top of the protruding structure, for example, at height h3, the control module 14 can control the interferometer 12 and the imaging device 13 to switch back to the first scanning mode. As previously defined, the first scanning mode in this embodiment refers to the interferometer 12 and the imaging device 13 at the measured height (height h3) being able to resume synchronous scanning, ensuring that the structure of surface P2 can be completely scanned when it is near the surface P2. As described above, when the control module 14 determines that the current structure is a protruding structure, it will first skip the middle region (height h2) of the protruding structure without synchronous scanning (second scanning mode), and only perform synchronous scanning when it approaches the top of the protruding structure (first scanning mode). The protruding structure referred to in this embodiment can actually be a redistribution layer (RDL), a bump, or a pillar; this embodiment does not impose any limitations.

[0035] For clarity regarding the surface morphology measurement method described in this application, please refer to [the relevant documentation / reference]. Figures 1 to 4 , Figure 4This is a flowchart illustrating the steps of a surface topography measurement method according to an embodiment of this application. As shown, the surface topography measurement method is used in a surface topography measurement system. The surface topography measurement system includes an interferometer, a photographic device, and a control module. The surface topography measurement method includes: the control module setting a synchronous scanning area and a skip scanning area of ​​the object surface according to a scanning script; in the synchronous scanning area, the interferometer performs synchronous scanning at a first displacement speed, and the photographic device generates multiple interference images, the multiple interference images being associated with a reference light provided by the interferometer and multiple object-reflected light reflected from the object surface; and in the skip scanning area, the interferometer first moves at a second displacement speed while the photographic device does not generate interference images, and then the interferometer performs synchronous scanning at the first displacement speed while the photographic device generates the interference images; wherein the second displacement speed is greater than the first displacement speed.

[0036] In summary, the surface topography measurement system and method provided in this application are suitable for applications such as semiconductor manufacturing, optical component processing, or other applications requiring precise measurement of the surface structure of objects. When the object surface has high-depth structures such as through holes, the surface topography measurement system and method of this application can accelerate the scanning speed of the through hole edges, thereby improving the overall measurement efficiency.

[0037] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A surface morphology measurement system, characterized in that, The surface topography measurement system includes: A light source, used to provide a test beam; An interferometer is used to split the test beam into a first sub-beam and a second sub-beam. The first sub-beam is directed toward a reference mirror and reflects a reference beam. The second sub-beam is directed toward an object surface and reflects multiple object-reflected beams. These object-reflected beams correspond to different measurement heights of the interferometer along a first axis. A photographic apparatus for receiving the reference light and the light reflected from the objects to selectively generate multiple interferometric images; and A control module is electrically connected to the interferometer and the imaging device, and sets the interferometer and the imaging device to work in a first scanning mode or a second scanning mode according to a scanning script; In the first scanning mode, the measurement height of the interferometer changes with a first displacement velocity and the imaging device records the interferometric images; In the second scanning mode, the measurement height of the interferometer changes with a second displacement velocity and the imaging device does not record the interferometric images, wherein the second displacement velocity is greater than the first displacement velocity.

2. The surface morphology measurement system according to claim 1, characterized in that, The scan script is associated with a current structure on the surface of the object. When the scan script indicates that the current structure is a through hole edge or a raised structure edge, the control module sets the interferometer and the imaging device to work sequentially in the second scan mode and the first scan mode.

3. The surface morphology measurement system according to claim 2, characterized in that, When the scan script indicates that the current structure is not the edge of the through hole or the edge of the protruding structure, the control module sets the interferometer and the imaging device to operate in the first scan mode.

4. The surface morphology measurement system according to claim 2, characterized in that, The jump time of the second scan mode is associated with the current structure indicated by the scan script.

5. The surface morphology measurement system according to claim 1, characterized in that, The control module further sets the interferometer and the imaging device to operate in a third scanning mode to generate the scanning script. In the third scanning mode, the interferometer moves along the first axis at a third displacement speed and the imaging device records the interferometric images. The third displacement speed is greater than the first displacement speed.

6. The surface morphology measurement system according to claim 5, characterized in that, Each of the interference images is associated with an interference fringe pattern of the reference light and the corresponding object reflected light, and the control module determines the current structure based on the interference images generated by the third scanning mode.

7. The surface morphology measurement system according to claim 1, characterized in that, The measurement height of the interferometer is related to the position of the interferometer along a first axis, and the first displacement velocity or the second displacement velocity of the measurement height of the interferometer is the movement velocity of the interferometer along the first axis.

8. A surface topography measurement method for a surface topography measurement system, the surface topography measurement system comprising an interferometer, a photographic device, and a control module, characterized in that, The surface morphology measurement method includes: The control module sets a synchronous scanning area and a skip scanning area on the surface of an object according to a scanning script; Within the synchronous scanning area, the interferometer performs synchronous scanning at a first displacement velocity, and the photographic device generates multiple interferometric images. These interferometric images are correlated with a reference light provided by the interferometer and multiple object-reflected lights reflected from the surface of an object; and In the skip scan area, the interferometer first moves at a second displacement speed while the imaging device does not produce interference images, and then the interferometer performs synchronous scanning at the first displacement speed while the imaging device produces these interference images; The second displacement velocity is greater than the first displacement velocity.

9. The surface morphology measurement method according to claim 8, characterized in that, The interferometer performs synchronous scanning at the first displacement speed so that when the interferometer provides the reference light and the reflected light from each of the objects, the imaging device synchronously generates one of the corresponding interferometric images.

10. The surface morphology measurement method according to claim 8, characterized in that, The scan script is associated with a current structure on the object's surface. When the scan script indicates that the current structure is a through hole edge or a raised structure edge, the control module sets the through hole edge or the raised structure edge as the skip scan area.

11. The surface morphology measurement method according to claim 10, characterized in that, When the scan script indicates that the current structure is the edge of the through hole or the edge of the protrusion structure, the interferometer performs a jump scan at a second displacement speed, and the jump time is associated with a through hole depth or a protrusion height.

Images