Data processing method, temperature control device, interface conversion circuit and temperature control system

Abstract

The application relates to a data processing method, a temperature control device, an interface conversion circuit and a temperature control system. The temperature data processing method comprises the following steps: acquiring initial data of a temperature control device; acquiring update data by a sliding filtering algorithm based on the initial data; acquiring at least one output value by a median algorithm based on the update data; mapping the output value to a standard data table to obtain at least one initial measurement value; and performing calibration compensation on the initial measurement value to obtain a final measurement value. The application has high accuracy of temperature and humidity data, can be compatible with various temperature and humidity measurement modes, has a wide temperature and humidity monitoring range, and has high applicability.

Description

Technical Field

[0001] This application relates to the technical field of sensing devices, and in particular to a data processing method, a temperature control device, an interface conversion circuit, and a temperature control system. Background Technology

[0002] Temperature and humidity are crucial in the production processes of various industries, thus requiring real-time monitoring. With the development of technology and production capacity, production workshops are becoming increasingly larger, and the number of production equipment is also increasing. Due to the sheer size of the production workshops or the sheer number of production equipment, traditional manual methods of monitoring temperature and humidity are no longer sufficient to meet the production needs of these workshops or equipment.

[0003] In related technologies, automatic monitoring devices can be used to automatically monitor the temperature and humidity of production workshops or equipment. However, in complex scenarios or when multiple points need to be monitored simultaneously, the accuracy of the data from these automatic monitoring devices needs improvement. Furthermore, sensors often exhibit noise, drift, and abnormal fluctuations in their measurements due to hardware characteristics or environmental interference. When the measurement range of standard instruments is wide, quantization errors and temperature drift further exacerbate data deviations. Summary of the Invention

[0004] In view of the above, it is necessary to provide a data processing method, a temperature control device, an interface conversion circuit, and a temperature control system that provides high accuracy in temperature and humidity data, is compatible with multiple temperature and humidity measurement methods, has a wide temperature and humidity monitoring range, and is highly applicable.

[0005] The first aspect of this application provides a data processing method, comprising: acquiring initial data of a temperature control device; acquiring updated data based on the initial data using a sliding filter algorithm; acquiring at least one output value based on the updated data using a median algorithm; mapping the output value to a standard data table to obtain at least one initial measurement value; and calibrating and compensating the initial measurement value to obtain a final measurement value.

[0006] In the data processing method of the first aspect of this application, firstly, the sliding filter algorithm continuously updates data based on a fixed window. Median filtering prioritizes eliminating interference from single-point outliers. Compared to traditional moving average filtering, this application utilizes the statistical robustness of the median to effectively suppress occasional impulse noise or instantaneous drift from the temperature sensor, reducing the risk of outliers being passed to subsequent modules and ensuring the steady-state characteristics of the updated data. Secondly, the operation of mapping the output value to a standard data table, using table lookup or piecewise linear interpolation, converts the original electrical signal (such as resistance or voltage) into a preliminary temperature value. This can initially compensate for the inherent nonlinear error of the sensor. Subsequent calibration compensation steps can further reduce systematic deviations caused by environmental drift or the characteristics of the device itself, forming a two-stage error correction link of "coarse calibration + fine calibration". In other words, this application's technical path of anti-interference through sliding median filtering combined with secondary calibration compensation to eliminate deviations can improve the effectiveness and accuracy of temperature and humidity data in complex noise environments.

[0007] In some embodiments, the initial data contains multiple electrical parameter values. The updated data is obtained based on the initial data using a sliding filter algorithm, including: constructing a sliding window size; removing the earliest acquired value from the initial data through the sliding window; and acquiring a value and inserting it into the initial data through the sliding window to obtain the updated data.

[0008] In some embodiments, obtaining at least one output value based on the updated data using a median algorithm includes: sorting the updated data by size to obtain permuted data; and taking the value located in the middle of the permuted data as the output value.

[0009] In some embodiments, mapping the output value to a standard data table to obtain at least one initial measurement value includes: obtaining the temperature value corresponding to the output value as the initial measurement value; or, obtaining two temperature values ​​corresponding to the interval where the output value is located as the initial measurement value.

[0010] In some embodiments, calibrating and compensating the initial measurement value to obtain the final measurement value includes: substituting the initial measurement value into the compensation formula: Tx=(Rx-R0) / (R1-R0)*(T1-T0)+T0 to obtain the final measurement value; where Tx is the final measurement value, T0 is the lower limit temperature value corresponding to the interval, T1 is the upper limit temperature value corresponding to the interval, Rx is the output value, R0 is the lower limit value corresponding to the interval, and R1 is the upper limit value corresponding to the interval.

[0011] A second aspect of this application provides a temperature control device, including a control module, a temperature and humidity sensing module, a thermocouple temperature measurement module, and a thermistor temperature measurement module; the temperature and humidity sensing module is communicatively connected to the control module, the thermocouple temperature measurement module is communicatively connected to the control module, and the thermistor temperature measurement module is connected to the control module via an analog-to-digital converter; the control module is configured to acquire a temperature value through a data processing method according to any embodiment of the first aspect of this application.

[0012] In the second aspect of this application, the temperature control device adopts a modular design, that is, the temperature control device includes a control module, a temperature and humidity sensing module, a thermocouple temperature measurement module, and a thermistor temperature measurement module, and each module is connected through a bus, thereby expanding multiple measurement methods and improving the compatibility, monitoring range and adaptability of the temperature control device.

[0013] In some embodiments, the temperature and humidity sensing module includes a first sensing unit, a second sensing unit, and a wireless communication unit. Both the first sensing unit and the second sensing unit are used to collect first initial data. The first sensing unit is communicatively connected to the control module, the second sensing unit is communicatively connected to the wireless communication unit, and the wireless communication unit is communicatively connected to the control module.

[0014] In some embodiments, the thermocouple temperature measurement module includes at least two switching units, at least two data acquisition units, and multiple thermocouples. The thermocouples are used to convert temperature signals into electromotive force signals. The data acquisition units are used to generate second initial data based on the electromotive force signals. The thermocouples are connected to the switching units, the switching units are connected to the data acquisition units, and the data acquisition units are connected to the control module.

[0015] In some embodiments, the thermal temperature measurement module includes an analog-to-digital converter, multiple voltage divider circuit units, and multiple thermistors. The thermistors are used to convert temperature signals into resistance signals, the analog-to-digital converter is used to generate third initial data based on the resistance signals, the thermistors are connected to the voltage divider circuit units, and the voltage divider circuit units are connected to the analog-to-digital converter.

[0016] The third aspect of this application provides an interface conversion circuit applied to a temperature control device as described in any embodiment of the second aspect of this application. The interface conversion circuit includes a conversion chip, an input terminal, an output terminal, and an overcurrent protection element. The input terminal is connected to the input pin of the conversion chip through the overcurrent protection element, and the output terminal is connected to the output pin of the conversion chip. The conversion chip is configured to detect an object connected to the input terminal and output a charging voltage or data signal from the output terminal based on the type of the object.

[0017] In the third aspect of this application, when the input terminal of the interface conversion circuit is connected to a power supply, the conversion chip can output a charging voltage to charge the temperature control device. When the input terminal is connected to an external device, the conversion chip can enable communication between the temperature control device and the external device. The input terminal and the conversion chip are connected through an overcurrent protection element, which can reduce the problem of excessive current input to the conversion chip when the input terminal is connected to a power supply, thereby improving the safety of power supply.

[0018] In some embodiments, the input terminal includes a first input terminal and a second input terminal. The first input terminal is used to connect to an external power supply, and the second input terminal is used to connect to an external device. The first input terminal is connected to the conversion chip through an overcurrent protection element, and the second input terminal is connected to the conversion chip and the second input terminal is connected to the first input terminal through an overcurrent protection element.

[0019] The fourth aspect of this application provides a temperature control system applied to a temperature control device as described in any embodiment of the second aspect of this application. The temperature control system includes an application terminal, a data acquisition terminal, and field devices. The application terminal and the data acquisition terminal are communicatively connected. The data acquisition terminal is configured to acquire monitoring data from the field devices using multiple temperature control devices. The application terminal is configured to control the field devices based on the monitoring data.

[0020] In the fourth aspect of this application, the application terminal and the data acquisition terminal are connected in communication. The data acquisition terminal is configured to acquire monitoring data of the field equipment using multiple temperature control devices. The application terminal is configured to control the field equipment based on the monitoring data, thereby enabling remote control of the field equipment and improving the intelligence level of the production process. Attached Figure Description

[0021] Figure 1 This is a flowchart of a data processing method according to an embodiment of this application.

[0022] Figure 2 This is a sub-flowchart of step S200 in an embodiment of this application.

[0023] Figure 3 This is a sub-flowchart of step S300 in an embodiment of this application.

[0024] Figure 4 This is a schematic diagram of the operation of the sliding median filtering algorithm according to an embodiment of this application.

[0025] Figure 5 This is a product diagram of the temperature control device according to an embodiment of this application.

[0026] Figure 6 This is a schematic diagram of the temperature control device according to an embodiment of this application.

[0027] Figure 7This is a schematic diagram of the interface conversion circuit according to an embodiment of this application.

[0028] Figure 8 This is a schematic diagram of the temperature control system according to an embodiment of this application.

[0029] Explanation of main component symbols 1. Temperature control device; 10. Circuit board; 11. Control module; 12. Temperature and humidity sensing module; 13. Thermocouple temperature measurement module; 14. Thermistor temperature measurement module; 121. First sensing unit; 122. Second sensing unit; 123. Wireless communication unit; 131. Data acquisition unit; 132. Switching unit; 133. Thermocouple; 141. Analog-to-digital converter; 142. Voltage divider circuit unit; 143. Thermistor; 15. Interface conversion module; 16. Power module; 161. Power supply interface; 17. Network module; 18. Storage module; 19. Display module; 20. Alarm module; 21. Voice module; 100. Conversion chip; 101. First input terminal; 102. Second input terminal; 103. Overcurrent protection element; 104. Output terminal; 30. Application terminal; 301. Wireless router; 302. Switch; 40. Data acquisition terminal; 50. Field equipment.

[0030] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0031] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It should be understood that, unless otherwise stated, " / " in this application means "or". For example, A / B can mean A or B. "And / or" in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. "At least one" refers to one or more. "More than one" refers to two or more. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, and a, b, and c (seven cases).

[0033] It should also be noted that the terms "first" and "second" in the specification, claims, and drawings of this application are used to distinguish similar objects, not to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the method. Without departing from the scope of the claims, the execution order of multiple steps can be interchanged, and some steps can also be deleted.

[0034] Temperature and humidity are crucial in the production processes of various industries, thus requiring real-time monitoring. With the development of technology and production capacity, production workshops are becoming increasingly larger; for example, the world's largest single-building factory covers hundreds of hectares. Simultaneously, the number of production equipment within these workshops is also increasing, including various storage refrigerators, ovens, processing equipment, and mainframes. Due to the sheer size of these workshops and the sheer number of production devices, traditional manual temperature and humidity monitoring methods are inefficient and prone to data anomalies, making them unsuitable for the production needs of such workshops and equipment.

[0035] In related technologies, automatic monitoring devices can be used to automatically monitor the temperature and humidity of production workshops or equipment. However, in complex scenarios or when multiple points need to be monitored simultaneously, the accuracy of the data from these automatic monitoring devices needs improvement. Furthermore, sensors often exhibit noise, drift, and abnormal fluctuations in their measurements due to hardware characteristics or environmental interference. When the measurement range of standard instruments is wide, quantization errors and temperature drift further exacerbate data deviations.

[0036] Among existing filtering algorithms, moving average filtering achieves smoothing by taking the average of a window, but it is sensitive to sudden outliers; a single extreme value can significantly deflect the output result. Weighted moving average, while assigning weights to new data to improve response speed, still struggles to address occasional noise contamination. Adaptive algorithms such as Kalman filtering rely on accurate system models and noise statistics assumptions, resulting in a complexity-benefit imbalance in scenarios with stable temperature changes. Furthermore, these filtering algorithms can only reduce noise, drift, and abnormal fluctuations in the aforementioned measurements, and still lack an address for errors caused by the wide measurement range of standard instruments.

[0037] Therefore, this application provides a data processing method, a temperature control device, an interface conversion circuit, and a temperature control system. These provide highly accurate temperature and humidity data, are compatible with various temperature and humidity measurement methods, have a wide monitoring range, and are highly applicable. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0038] Figure 1 This is a flowchart of a data processing method according to an embodiment of this application.

[0039] Please see Figure 1 The embodiments of this application first provide a data processing method, including: Step S100: Obtain the initial data of the temperature control device.

[0040] Step S200: Obtain updated data based on the initial data using a sliding filter algorithm.

[0041] Step S300: Obtain at least one output value based on the updated data using the median algorithm.

[0042] Step S400: Map the output values ​​to a standard data table to obtain at least one initial measurement value.

[0043] Step S500: Perform calibration compensation on the initial measurement value to obtain the final measurement value.

[0044] In the data processing method of this application embodiment, firstly, the sliding filter algorithm continuously updates data based on a fixed window. Median filtering prioritizes eliminating interference from single-point outliers. Compared to traditional moving average filtering, this application utilizes the statistical robustness of the median to effectively suppress occasional impulse noise or instantaneous drift from the temperature sensor, reducing the risk of outliers being transmitted to subsequent modules and ensuring the steady-state characteristics of the updated data. Secondly, the operation of mapping the output value to a standard data table converts the original electrical signal (such as resistance or voltage) into a preliminary temperature value through table lookup or piecewise linear interpolation. This can initially compensate for the inherent nonlinear error of the sensor. Subsequent calibration compensation steps can further reduce systematic deviations caused by environmental drift or the characteristics of the device itself, forming a two-stage error correction link of "coarse calibration + fine calibration". In other words, this application's technical path of anti-interference through sliding median filtering combined with secondary calibration compensation to eliminate deviations can improve the effectiveness and accuracy of temperature and humidity data in complex noise environments.

[0045] In some embodiments, the initial data may include multiple electrical parameter values. For example, the initial data may be electrical parameter values ​​such as voltage, resistance, or capacitance generated by measuring components such as temperature and humidity sensors, thermocouples, or thermistors when measuring temperature and humidity. The initial and final measured values ​​are temperature and humidity parameter values. As shown in the example below, the initial and final measured values ​​may be temperature values.

[0046] Figure 2 This is a sub-flowchart of step S200 in an embodiment of this application. Figure 3 This is a sub-flowchart of step S300 in an embodiment of this application. Figure 4 This is a schematic diagram of the operation of the sliding median filtering algorithm according to an embodiment of this application.

[0047] In some embodiments, please refer to Figure 2 Step S200 may include: Sub-step S201: Construct the sliding window size.

[0048] Sub-step S202: Remove the earliest collected values ​​from the initial data using a sliding window.

[0049] Sub-step S203: Collect a value and fill in the initial data through a sliding window to obtain updated data.

[0050] In some embodiments, please refer to Figure 3 Step S300 may include: Sub-step S301: Sort the updated data by size to obtain the permuted data.

[0051] Sub-step S302: Take the value located in the middle of the arranged data as the output value.

[0052] The sliding window size can be 8 to 12, meaning that the initial data of a sliding window can contain 8 to 12 electrical parameter values. Please refer to [link / reference]. Figure 4 Taking nine electrical parameter values ​​as an example, when the sliding window moves from time t0 to time t1, the first value "14" can be discarded, and a value "16" is collected to supplement the initial data to obtain updated data. This can reduce the interference problems that may occur when acquiring temperature and humidity data in real time and periodically. Then, continue to refer to... Figure 4 By sorting the updated data by size to generate permuted data and taking the middle value "15" as the output value, the problem of numerical anomalies caused by random factors can be reduced. In other words, this application can improve the accuracy of the data.

[0053] In some embodiments, step S400 may include: obtaining the temperature value corresponding to the output value as the initial measurement value; or, obtaining two temperature values ​​corresponding to the interval where the output value is located as the initial measurement values. Table 1 below is a standard data table of temperature-resistance for one type of measuring component according to an embodiment of this application.

[0054] Please refer to Table 1. If the output value exactly corresponds to the center value of the resistor "437139.000" in the standard data table, the initial measurement value is "-55". If the output value is between two resistance values, i.e. in a certain range, such as "412169.000" to "437139.000", then the temperature values ​​"-54" and "-55" corresponding to the endpoints of the range are taken as the initial measurement values. At this time, step S500 needs to be executed for secondary calibration compensation.

[0055] In some embodiments, the mapping of the output value to the resistors in the standard data table can be one of mapping the output value to the minimum, center, or maximum value of the resistors in Table 1.

[0056] In some embodiments, step S500 may include: substituting the initial measured value into the compensation formula: Tx=(Rx-R0) / (R1-R0)*(T1-T0)+T0 to obtain the final measured value; where Tx is the final measured value, T0 is the lower limit temperature value corresponding to the interval, T1 is the upper limit temperature value corresponding to the interval, Rx is the output value, R0 is the lower limit value corresponding to the interval, and R1 is the upper limit value corresponding to the interval. For example, assuming the output value "420000.000" is located in the interval [412169.000, 437139.000], substituting it into the compensation formula yields a final measured value of approximately "-54.3136", which can reduce the problem of quantization error and temperature drift caused by the wide measurement range of the standard instrument further aggravating the data deviation.

[0057] Figure 5 This is a product diagram of the temperature control device 1 according to an embodiment of this application. Figure 6 This is a schematic diagram of the structure of the temperature control device 1 according to an embodiment of this application.

[0058] Please see Figure 5 The embodiments of this application also provide a temperature control device 1.

[0059] Please see Figure 6 The temperature control device 1 may include a control module 11, a temperature and humidity sensing module 12, a thermocouple temperature measurement module 13, and a thermistor temperature measurement module 14. All three modules are connected to the control module 11. Specifically, the temperature and humidity sensing module 12 can be connected to the control module 11 via an I2C bus, the thermocouple temperature measurement module 13 via an SPI bus, and the thermistor temperature measurement module 14 via an analog-to-digital converter 141. In this configuration, a modular design is adopted, where the temperature control device 1 includes the control module 11, temperature and humidity sensing module 12, thermocouple temperature measurement module 13, and thermistor temperature measurement module 14, and all modules are connected via a bus. This allows for the expansion of various measurement methods, improving the compatibility, monitoring range, and adaptability of the temperature control device 1.

[0060] In other embodiments, the temperature and humidity sensing module 12, the thermocouple temperature measurement module 13, and the thermistor temperature measurement module 14 can all be connected to the control module 11 via wireless communication. For example, when the temperature and humidity sensing module 12, the thermocouple temperature measurement module 13, and the thermistor temperature measurement module 14 are all peripherals, they can be connected to the control module 11 via Bluetooth or NFC.

[0061] In the embodiments of this application, the control module 11 can acquire first initial data from the temperature and humidity sensing module 12, second initial data from the thermocouple temperature measurement module 13, and third initial data from the thermistor temperature measurement module 14, and employ at least one of a sliding filter algorithm and a median filter algorithm to filter the first initial data, the second initial data, and the third initial data. In this case, outliers in the monitoring data can be removed, thereby improving the accuracy of the monitoring data.

[0062] The controller can be configured to execute the data processing method of any of the above embodiments of this application to obtain accurate temperature and humidity values.

[0063] In this embodiment, because the temperature control device 1 adopts a modular design, the data acquisition and data conversion processes are performed in advance in a functional module (such as the temperature and humidity sensing module 12) outside the control module 11. This reduces the data processing burden on the control module 11, simplifying its algorithm or program and reducing its complexity. Therefore, in some embodiments, the control module 11 may include a microcontroller unit (MCU). In this embodiment, a lower-cost microcontroller can be used for data processing while being compatible with multiple measurement methods or supporting multiple measurement data, which reduces both the complexity of the algorithm or program and the cost.

[0064] In the embodiments of this application, the temperature and humidity sensing module 12 may include a first sensing unit 121, a second sensing unit 122, and a wireless communication unit 123. Both the first sensing unit 121 and the second sensing unit 122 are used to collect first initial data.

[0065] In some embodiments, the first sensing unit 121 may be disposed on the same circuit board 10 as the control module 11. The first sensing unit 121 may be connected to the control module 11 via an I2C bus. That is, the first sensing unit 121 may be mounted on the circuit board 10 on which the control module 11 is disposed and electrically connected to the control module 11. In some embodiments, the first sensing unit 121 may be mounted on the circuit board 10 on which the control module 11 is disposed via surface mount technology (SMT). In other embodiments, the first sensing unit 121 may be connected to the control module 11 wirelessly, for example, when the first sensing unit 121 is a peripheral device.

[0066] In the embodiments of this application, the wireless communication connection may include, but is not limited to, WiFi, Bluetooth, Zigbee, LoRa, 4G, NB-IoT, and NFC.

[0067] In some embodiments, the second sensing unit 122 may be an external temperature and humidity sensor, which may have a wireless communication unit 123, such as Bluetooth. The second sensing unit 122 is connected to the wireless communication unit 123 via an I2C bus, and the wireless communication unit 123 communicates with the control module 11 wirelessly. In this case, the second sensing unit 122 can be used in scenarios requiring remote or wireless measurement, such as temperature and humidity measurement in refrigerators or ovens. In other embodiments, the second sensing unit 122 may also be directly connected to the control module 11 via an I2C bus, for example, when the second sensing unit 122 is also located on the circuit board 10.

[0068] In the embodiments of this application, the thermocouple temperature measurement module 13 may include a switching unit 132, a data acquisition unit 131, and thermocouples 133. The number of switching units 132 is at least two, the number of data acquisition units 131 is also at least two, and the number of thermocouples 133 may be multiple, such as six thermocouples 133. Thermocouples 133 can be used to convert temperature signals into electromotive force signals. The data acquisition unit 131 can generate second initial data based on the electromotive force signals. Thermocouples 133 are connected to switching units 132, and switching units 132 are connected to data acquisition units 131. Data acquisition units 131 are connected to the control module 11 via an SPI bus. In this case, the switching unit 132 can quickly switch the detection signals (i.e., electromotive force signals) of multiple thermocouples 133 at the back end to the front-end data acquisition unit 131 for processing in a short time, thereby reducing the number of data acquisition units 131 and thus reducing costs.

[0069] In some other embodiments, the data acquisition unit 131 may also be connected to the control module 11 via wireless communication, for example, when the data acquisition unit 131 is a peripheral device.

[0070] In some embodiments, thermocouple 133 may include at least one thermocouple 133 selected from the types S, R, B, K, T, J, N, or E.

[0071] In the embodiments of this application, the thermistor temperature measurement module 14 may include an analog-to-digital converter 141, a voltage divider circuit unit 142, and a thermistor 143. The number of voltage divider circuit units 142 may be multiple, and each voltage divider circuit unit 142 can be used for voltage reduction. The number of thermistors 143 may be the same as the number of voltage divider circuit units 142; that is, the number of thermistors 143 may also be multiple and consistent with the number of voltage divider circuit units 142. The thermistors 143 can be used to convert temperature signals into resistance signals. The analog-to-digital converter 141 can generate third initial data based on the resistance signals. The thermistors 143 are connected to the voltage divider circuit unit 142, and the voltage divider circuit unit 142 is connected to the analog-to-digital converter 141.

[0072] In some embodiments, the thermistor 143 may be classified by material as at least one of semiconductor thermistor 143, metal thermistor 143, and alloy thermistor 143. Classified by resistance, the thermistor 143 may be classified by resistance as at least one of positive temperature coefficient thermistor 143 (PTC), negative temperature coefficient thermistor 143 (NTC), or critical temperature thermistor 143 (CTR).

[0073] In the embodiments of this application, please refer to Figure 6 The temperature control device 1 may further include a power module 16, which is used to supply power to the control module 11. The power module 16 may include a built-in power supply, a power management unit, a voltage control unit, and multiple power supply interfaces 161. The power supply interfaces 161 are used to connect to an external power supply. The built-in power supply and the power supply interfaces 161 are connected to the power management unit, which is connected to the voltage control unit. The voltage control unit is connected to the control module 11. The power management unit is configured to select either an external power supply or a built-in power supply to power the control module 11 based on the type of power supply.

[0074] In some embodiments, the power supply interface 161 may include, but is not limited to, a USB interface, a type-A interface, a type-B interface, and a type-C interface.

[0075] In some embodiments, please refer to Figure 6 The temperature control device 1 may also include an interface conversion module 15, which is connected to the control module 11 via a UART bus. The interface conversion module 15 is also connected to at least one of a plurality of power supply interfaces 161. The interface conversion unit is configured to transmit data through the power supply interface 161. For example, when the type-C interface is connected to an external device (such as a data reading device), the interface conversion unit can transmit data with the external device through the type-C interface.

[0076] In some embodiments, please refer to Figure 6The temperature control device 1 may further include a network module 17, which is connected to the control module 11 via at least one of a UART bus or an SPI bus. The control module 11 is also configured to communicate with an external terminal via the network module 17 in at least one of wired or wireless means. The network module 17 may include at least one of Ethernet or WIFI network standards. In the embodiments of this application, the first initial data, the second initial data, or the third initial data can be transmitted to the external terminal via Ethernet. When the Ethernet fails, the control module 11 can switch from Ethernet to WIFI and transmit the first initial data, the second initial data, or the third initial data to the external terminal via WIFI.

[0077] In some embodiments, the control module 11 is further configured to receive OTA instructions from an external terminal and perform upgrades and restarts based on the OTA instructions.

[0078] In some embodiments, the external terminal may be at least one of a computer host, a display screen, or a cloud device.

[0079] In some embodiments, please refer to Figure 6 The temperature control device 1 may further include a storage module 18, which is connected to the control module 11 via an SDIO bus. The storage module 18 is used to store at least one of first initial data, second initial data, or third initial data. The storage module 18 may include at least one of a local storage module 18 and a cloud storage module 18. The local storage module 18 may be mounted on the circuit board 10 together with the control module 11, and the cloud storage module 18 may be a storage medium in a cloud device.

[0080] In some embodiments, the temperature control device 1 may further include a display module 19, which is connected to the control module 11 via a UART bus. The display module 19 is used to display at least one of first initial data, second initial data, or third initial data, and includes at least one display method of displaying numerical values, displaying curves, or displaying graphs. The display module 19 may be a display disposed on the circuit board 10.

[0081] In some embodiments, the display module 19 can display real-time data, historical data, and alarm information.

[0082] In some embodiments, please refer to Figure 6 The temperature control device 1 may further include an alarm module 20, which is connected to the control module 11 via a UART bus. The alarm module 20 may include a buzzer. The control module 11 is also configured to control the alarm module 20 to sound an alarm when at least one of the first initial data, the second initial data, or the third initial data is greater than a preset threshold.

[0083] In some embodiments, please refer to Figure 6 The temperature control device 1 may also include a voice module 21, which is connected to the control module 11 via a UART bus. The control module 11 is also configured to control the voice module 21 to broadcast at least one of the first initial data, the second initial data, or the third initial data.

[0084] In the temperature control device 1 of this application embodiment, the temperature control device 1 adopts a modular design, that is, the temperature control device 1 includes a control module 11, a temperature and humidity sensing module 12, a thermocouple temperature measurement module 13, and a thermistor temperature measurement module 14, and each module is connected through a bus, thereby expanding multiple measurement methods and improving the compatibility, monitoring range, and adaptability of the temperature control device 1. In addition, after acquiring the monitoring data, that is, after acquiring the first initial data of the temperature and humidity sensing module 12, the second initial data of the thermocouple temperature measurement module 13, and the third initial data of the thermistor temperature measurement module 14, the control module 11 can process the monitoring data by at least one of the sliding filter algorithm and the median filter algorithm, thereby removing outliers in the monitoring data and improving the accuracy of the monitoring data.

[0085] The temperature control device 1 in this embodiment of the application is modularly designed and can be compatible with multiple temperature measurement methods. The temperature measurement range can be from -200℃ to 600℃, and the accuracy can reach ±0.5℃.

[0086] Figure 7 This is a schematic diagram of the interface conversion circuit according to an embodiment of this application.

[0087] Please see Figure 7 This application also provides an interface conversion circuit, applied in a temperature control device 1 as described in any of the above embodiments of this application. The interface conversion circuit includes a conversion chip 100, an input terminal, an output terminal 104, and an overcurrent protection element 103. The input terminal is connected to the input pin of the conversion chip 100 via the overcurrent protection element 103, and the output terminal 104 is connected to the output pin of the conversion chip 100. The conversion chip 100 is configured to detect objects connected to the input terminal and output a charging voltage or data signal from the output terminal 104 based on the type of the object.

[0088] In some embodiments, the overcurrent protection element 103 may include a fuse.

[0089] In some embodiments, the interface conversion circuit may be the interface conversion module 15 in the temperature control device 1.

[0090] In some embodiments, the input terminals may include a first input terminal 101 and a second input terminal 102. The first input terminal 101 can be used to connect to an external power supply, and the second input terminal 102 can be connected to an external device. The first input terminal 101 is connected to the conversion chip 100 through an overcurrent protection element 103, and the second input terminal 102 is connected to the conversion chip 100. The second input terminal 102 is also connected to the first input terminal 101 through the overcurrent protection element 103. In this case, overcurrent protection can be provided regardless of whether the first input terminal 101 or the second input terminal 102 is connected to an external power supply.

[0091] In the interface conversion circuit of this application embodiment, when the input terminal of the interface conversion circuit is connected to a power supply, the conversion chip 100 can output a charging voltage to charge the temperature control device 1. When the input terminal is connected to an external device, the conversion chip 100 can communicate between the temperature control device 1 and the external device. The input terminal and the conversion chip 100 are connected through an overcurrent protection element 103, which can reduce the problem of excessive current input to the conversion chip 100 when the input terminal is connected to a power supply, thereby improving the safety of power supply.

[0092] Figure 8 This is a schematic diagram of the temperature control system according to an embodiment of this application.

[0093] Please see Figure 8 Finally, this application provides a temperature control system applied to a temperature control device 1 as described in any of the above embodiments of this application. The temperature control system may include an application terminal 30, a data acquisition terminal 40, and field devices 50. The application terminal 30 is communicatively connected to the data acquisition terminal 40. The data acquisition terminal 40 is configured to acquire monitoring data from the field devices 50 using multiple temperature control devices 1. The application terminal 30 is configured to control the field devices 50 based on the monitoring data.

[0094] In some embodiments, there may be multiple field devices 50.

[0095] In some embodiments, the application terminal 30 and the data acquisition terminal 40 can communicate via a wireless router 301 or a switch 302.

[0096] In some embodiments, the application terminal 30 may include at least one of a computer host, a display screen, or a cloud device.

[0097] In some embodiments, field device 50 may include various storage refrigerators, ovens, processing equipment, and host devices, etc.

[0098] In the temperature control system of this application embodiment, the application terminal 30 is communicatively connected to the data acquisition terminal 40. The data acquisition terminal 40 is configured to acquire monitoring data of the field equipment 50 using multiple temperature control devices 1. The application terminal 30 is configured to control the field equipment 50 based on the monitoring data, thereby enabling remote control of the field equipment 50 and improving the intelligence level of the production process.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A data processing method, characterized in that, include: Obtain the initial data from the temperature control device; Updated data is obtained based on the initial data using a sliding filter algorithm; Based on the updated data, at least one output value is obtained using the median algorithm; The output values ​​are mapped to a standard data table to obtain at least one initial measurement value; The initial measurement value is calibrated and compensated to obtain the final measurement value.

2. The data processing method according to claim 1, characterized in that, The initial data contains multiple electrical parameter values, and the process of obtaining updated data based on the initial data using a sliding filter algorithm includes: Build the sliding window size; The earliest collected values ​​in the initial data are removed using the sliding window. A value is collected and added to the initial data through the sliding window to obtain updated data.

3. The data processing method according to claim 2, characterized in that, The step of obtaining at least one output value based on the updated data using the median algorithm includes: The updated data is sorted by size to obtain the sorted data; The value located in the middle of the arranged data is used as the output value.

4. The data processing method according to claim 1, characterized in that, The step of mapping the output value to a standard data table to obtain at least one initial measurement value includes: Obtain the temperature value corresponding to the output value as the initial measurement value; or, The two temperature values ​​corresponding to the interval where the output value is located are obtained as the initial measurement values.

5. The data processing method according to claim 4, characterized in that, The calibration and compensation of the initial measurement value to obtain the final measurement value includes: Substitute the initial measured value into the compensation formula: Tx=(Rx-R0) / (R1-R0)*(T1-T0)+T0 to obtain the final measured value; where Tx is the final measured value, T0 is the lower limit temperature value corresponding to the interval, T1 is the upper limit temperature value corresponding to the interval, Rx is the output value, R0 is the lower limit value corresponding to the interval, and R1 is the upper limit value corresponding to the interval.

6. A temperature control device, characterized in that, It includes a control module, a temperature and humidity sensing module, a thermocouple temperature measurement module, and a thermistor temperature measurement module; The temperature and humidity sensing module is communicatively connected to the control module, the thermocouple temperature measurement module is communicatively connected to the control module, and the thermistor temperature measurement module is connected to the control module through an analog-to-digital converter; The control module is configured to acquire temperature values ​​using the data processing method described in any one of claims 1 to 5.

7. The temperature control device according to claim 6, characterized in that, The temperature and humidity sensing module includes a first sensing unit, a second sensing unit, and a wireless communication unit. Both the first sensing unit and the second sensing unit are used to collect first initial data. The first sensing unit is communicatively connected to the control module, the second sensing unit is communicatively connected to the wireless communication unit, and the wireless communication unit is communicatively connected to the control module.

8. The temperature control device according to claim 6, characterized in that, The thermocouple temperature measurement module includes at least two switching units, at least two data acquisition units, and multiple thermocouples. The thermocouples are used to convert temperature signals into electromotive force signals. The data acquisition units are used to generate second initial data based on the electromotive force signals. The thermocouples are connected to the switching units, the switching units are connected to the data acquisition units, and the data acquisition units are connected to the control module.

9. The temperature control device according to claim 6, characterized in that, The thermistor temperature measurement module includes the analog-to-digital converter, multiple voltage divider circuit units, and multiple thermistors. The thermistors are used to convert temperature signals into resistance signals. The analog-to-digital converter is used to generate third initial data based on the resistance signals. The thermistors are connected to the voltage divider circuit units, and the voltage divider circuit units are connected to the analog-to-digital converter.

10. An interface conversion circuit, characterized in that, The interface conversion circuit, applied to the temperature control device as described in any one of claims 7 to 9, includes a conversion chip, an input terminal, an output terminal, and an overcurrent protection element. The input terminal is connected to the input pin of the conversion chip via the overcurrent protection element, and the output terminal is connected to the output pin of the conversion chip. The conversion chip is configured to detect an object connected to the input terminal and output a charging voltage or data signal from the output terminal based on the type of the object.

11. The interface conversion circuit according to claim 10, characterized in that, The input terminal includes a first input terminal and a second input terminal. The first input terminal is used to connect to an external power source, and the second input terminal is used to connect to an external device. The first input terminal is connected to the conversion chip through the overcurrent protection element, and the second input terminal is connected to the conversion chip. The second input terminal is also connected to the first input terminal through the overcurrent protection element.

12. A temperature control system, characterized in that, The temperature control system is applied to the temperature control device as described in any one of claims 7 to 9, wherein the temperature control system includes an application terminal, a data acquisition terminal, and field devices, the application terminal is communicatively connected to the data acquisition terminal, the data acquisition terminal is configured to acquire monitoring data of the field devices using multiple temperature control devices, and the application terminal is configured to control the field devices based on the monitoring data.

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