Method for detecting glass substrate tgv hidden cracks

Abstract

The present disclosure provides a glass substrate TGV hidden crack detection method based on acoustic emission positioning and local mechanical review, which firstly collects acoustic emission waveform through hierarchical cyclic loading, screens acoustic emission suspected area through in-situ calibration of acoustic wave parameters of the substrate, matches the acoustic source coordinates with corresponding TGV holes and determines the structure projection area, selects the homologous control area to carry out micro-indentation detection, determines the local mechanical abnormality according to three mechanical parameters such as elastic modulus, and determines the TGV buried hidden crack in combination with the acoustic emission aggregation and mechanical abnormality conditions. The present disclosure has high positioning accuracy and detection efficiency, can distinguish multiple types of defects, is non-destructive and convenient for process tracing.

Description

Technical Field

[0001] This disclosure belongs to the field of non-destructive testing technology for glass substrates, specifically relating to a batch screening and detection method for TGV buried hidden cracks in glass substrates after metal filling and RDL manufacturing, based on acoustic emission positioning and local mechanical verification. Background Technology

[0002] Current conventional methods for detecting TGV cracks in glass substrates include visual inspection, optical microscopy, SEM observation, cross-sectional inspection, and point-by-point local mechanical testing. Visual inspection and ordinary optical inspection can only identify cracks extending to the substrate surface, resulting in large-area omissions of hidden cracks in the hole walls, surrounding glass, and metal-glass interfaces. Cross-sectional inspection requires cutting and destroying the sample, making it unsuitable for screening batch finished products. If local mechanical testing is performed on all TGV holes of the entire substrate, the number of inspection points is large, the inspection cycle is long, and the practicality for mass production scenarios is poor.

[0003] Existing general-purpose acoustic emission testing methods suffer from several drawbacks: First, they often rely on pure glass theoretical sound velocity positioning, failing to consider the interference of TGV metal filling, RDL, sensor coupling, and acquisition channel delay on sound wave propagation, resulting in large positioning errors. Second, they rely solely on single-channel amplitude and energy to identify anomalies, lacking multi-channel synchronization, positioning residual, and event clustering joint screening mechanisms, making it easy for fixture friction and equipment vibration noise to be misinterpreted as crack signals. Third, they only output the substrate plane coordinates and cannot automatically correspond to TGV hole numbers, hole perimeter angles, and layered structural regions, requiring manual secondary positioning. Furthermore, relying solely on acoustic emission signals cannot confirm the existence of actual hidden cracks, and separate mechanical testing lacks pre-screening of the affected area, leaving the overall problems of misjudgment and inefficiency unresolved.

[0004] Existing technologies lack a complete closed-loop scheme of "acoustic emission coarse screening and local mechanical comparison verification". They also lack the supporting logic for automatically mapping the sound source plane coordinates to the TGV layered structure, calibrating the sound wave propagation parameters in situ, and jointly quantifying and judging the acoustic emission and mechanical parameters. As a result, it is difficult to balance the efficiency of batch testing with the accuracy of hidden crack judgment.

[0005] Based on this, a method was developed that can achieve efficient and non-destructive screening and accurate quantitative judgment of hidden cracks buried in TGV glass substrates, while taking into account both batch testing efficiency and low false judgment rate. Summary of the Invention

[0006] This disclosure provides a method for detecting hidden cracks in TGV glass substrates based on acoustic emission localization and local mechanical verification. It achieves efficient and non-destructive screening and accurate quantitative determination of TGV buried hidden cracks by in-situ acoustic parameter calibration and noise reduction of the substrate under test, conversion of acoustic source coordinates to TGV structured position, micro-indentation comparison of the same structure and same source region, and joint judgment under dual conditions of acoustic emission and mechanical parameters. This reduces the number of detection points, lowers the misjudgment, and is suitable for batch production testing of substrates.

[0007] The specific technical solution disclosed herein is as follows:

[0008] A method for detecting TGV microcracks in glass substrates, based on acoustic emission localization and local mechanical verification, includes:

[0009] The glass substrate under test is subjected to graded cyclic loading to excite acoustic emission signals from hidden cracks, and the waveform is collected. The signal trigger threshold is set according to the background noise of each channel.

[0010] A reference excitation is applied to the glass substrate under test to calibrate the effective propagation speed of the sound wave and the time deviation of each acquisition channel. The sound source plane coordinates are solved based on the corrected first wave arrival time, and the suspected acoustic emission area is obtained by multi-channel synchronous response, positioning residual, and event clustering.

[0011] Match the plane coordinates of the sound source to the corresponding target TGV hole, and calculate the distance of the sound source from the center of the hole and the angle around the hole relative to the target hole to obtain the structural projection area corresponding to the sound source.

[0012] On the substrate under test, select a normal control area with no abnormalities that has the same TGV structure as the suspected acoustic emission area, the same distance from the hole center, and the same or symmetrical hole perimeter angle.

[0013] The same micro-indentation loading conditions were used to test the suspected area and the normal control area respectively. Three mechanical parameters were extracted: elastic modulus, unloading stiffness and residual indentation depth. When two or more mechanical parameters deviated from the normal range, it was determined that there was a local mechanical abnormality in the area.

[0014] Based on the acoustic emission event accumulation conditions and local mechanical anomaly conditions, multiple levels of graded judgment results were set to obtain the TGV hidden crack detection results of the glass substrate.

[0015] Before hierarchical cyclic loading, the following steps are included:

[0016] A plane coordinate system for the glass substrate is pre-constructed, the center coordinates of each TGV hole are calibrated, and the structural projection area is divided.

[0017] The structural projection area includes the orifice projection area, the orifice wall and metal-glass interface projection area, the glass area around the orifice, and the RDL edge area. All structural projection areas are uniformly converted to the glass substrate plane coordinate system for storage.

[0018] Before performing the hierarchical cyclic loading, the following steps are included:

[0019] Preliminary tests were conducted using crack-free glass substrates of the same specifications to determine the critical load that would not generate new cracks. The applied force during formal testing was always lower than this critical load.

[0020] The testing process simultaneously records the applied force, substrate displacement, and waveform data of all acoustic emission channels.

[0021] The reference excitation parameters are calibrated using the following formula: ;

[0022] in, For the first The arrival time of the first wave recorded by each sensor. For reference, the incentive start time, The distance from the reference position to the sensor, For effective transmission speed, For the first Time deviation of each channel.

[0023] The steps for matching the sound source plane coordinates to the target TGV aperture and converting the aperture circumferential parameters include:

[0024] For each valid sound source coordinate Calculate the distance between the effective sound source and the center of each TGV aperture:

[0025] ;

[0026] The TGV hole with the smallest distance and located within the influence range of the hole is identified as the target TGV hole;

[0027] The angle around the sound source relative to the center of the target hole is: ;

[0028] in, Effective sound source coordinates To the Line 1 The Euler distance between the centers of the TGV holes; For the first Line 1 The coordinates of the center plane of the TGV holes; It is the arctangent function in the four quadrants.

[0029] The micro-pressure detection points are uniformly arranged in three rows and three columns, and all detection points avoid the internal cavity of the TGV.

[0030] When the sound source corresponds to the hole wall or the metal-glass interface, the micro-indentation detection point is arranged at the projection position of the hole periphery surface corresponding to the sound source.

[0031] The multi-level classification results are set based on acoustic emission event aggregation conditions and local mechanical anomaly conditions, including:

[0032] When acoustic emission events are concentrated in the same structural projection area and two or more mechanical parameters are abnormal, it is determined to be a hidden crack abnormal area.

[0033] The area is identified as a region to be retested only if the acoustic emission event aggregation condition is met.

[0034] A region is considered to have localized performance abnormalities if there are only two or more abnormal mechanical parameters and no focused acoustic emission events.

[0035] The glass substrate under test has TGV holes, a metal-glass interface, and an RDL edge structure.

[0036] The hidden cracks to be detected are buried cracks located in the hole wall, the glass around the hole, or the metal-glass interface, and that do not extend to the substrate surface.

[0037] After obtaining the TGV hidden crack detection results for the glass substrate by setting multiple graded judgment results based on acoustic emission event aggregation conditions and local mechanical anomaly conditions, the process includes the following steps:

[0038] Output standardized test records;

[0039] The standardized test record shall include at least: substrate number, TGV aperture number, sound source coordinates, distance from aperture center, aperture circumferential angle, projected area of ​​the structure to which it belongs, number of effective acoustic emission events, positioning residual, number of mechanical anomalies, and final judgment result.

[0040] The beneficial effects of this disclosure include at least the following:

[0041] The method described in this disclosure, on the one hand, effectively filters out interference noise such as equipment vibration and fixture friction by calibrating the effective propagation velocity of sound waves and the time deviation of the acquisition channel in situ on the substrate under test, and combines multi-channel synchronous response, positioning residual, and multi-level screening of effective sound sources through event clustering, thereby improving the sound source positioning accuracy. On the other hand, it constructs an automatic mapping link from the sound source plane coordinates to the TGV hole number, distance from the hole center, hole perimeter angle, and projection area of ​​each layer structure. It adopts a graded detection mode of acoustic emission coarse screening to lock a small number of suspected areas and then conducting micro-indentation comparison verification at fixed points, saving the huge workload of precise hole-by-hole inspection of all TGV holes on the entire substrate, and is suitable for large-scale applications. This batch production line screening method simultaneously selects symmetrical normal areas of the same structure to establish a three-standard-deviation quantitative mechanical judgment benchmark. Combined with acoustic emission event aggregation and dual-condition joint judgment logic of two or more abnormal mechanical parameters, it can clearly distinguish between real buried hidden cracks, suspected noise points, and local performance anomalies caused by material inhomogeneity. This significantly reduces the problems of missed and false judgments caused by single detection methods. The overall detection process is mainly based on non-destructive acoustic emission pre-screening, only requiring micro-indentation without cutting and damaging the sample. Finally, it outputs standardized, fully traceable detection records, which facilitates subsequent process defect tracing and has outstanding detection accuracy, detection efficiency, and mass production practical value. Attached Figure Description

[0042] Figure 1This is a flowchart of the method for detecting hidden cracks in TGV glass substrates as described in this disclosure;

[0043] Figure 2 A schematic diagram showing the transformation of the sound source coordinates to the TGV aperture and structural projection area;

[0044] Figure 3 This is a schematic diagram of local mechanical verification and hidden crack determination in the suspected acoustic emission area. Detailed Implementation

[0045] The technical solutions of the embodiments of this disclosure will be clearly and thoroughly described below with reference to the accompanying drawings. The described embodiments are merely some embodiments of this disclosure.

[0046] Terminology Explanation:

[0047] TGV (Through-GlassVia): A glass through-hole that penetrates the glass substrate;

[0048] Acoustic emission: Acoustic emission is the phenomenon of releasing transient elastic waves inside a material due to crack opening and closing, interface slippage, or local damage changes.

[0049] Valid sound source event: A valid sound source event is an acoustic emission event in which no fewer than three acoustic emission sensors receive a response within a specified time window, and the signal propagation time, sound source coordinates, and positioning residual meet the set conditions.

[0050] Structural projection area: The structural projection area is the region formed by dividing the corresponding ranges of the TGV aperture, aperture wall, metal-glass interface, periapical glass, and RDL edge in the plane coordinate system of the glass substrate.

[0051] Local mechanical verification: Local mechanical verification refers to setting up the same micro-indentation test points in the suspected area and the normal control area of ​​the same structure based on the acoustic emission positioning results, and comparing the elastic modulus, unloading stiffness and residual indentation depth under the same load conditions. Specific Implementation Example 1:

[0053] This disclosure provides an embodiment:

[0054] This embodiment provides a method for detecting hidden cracks in TGV (Through-Temperature Vapor Deposition) glass substrates based on acoustic emission localization and local mechanical verification. It is applicable to glass substrates after metal-filled vias or RDL (Real-Time Layer) fabrication. This method addresses the following engineering problems: TGV vias are numerous, and hidden cracks are difficult to identify during routine visual inspection; performing precise inspection on all vias on the entire board individually would be labor-intensive; relying solely on acoustic emission signals is susceptible to noise, fixture friction, and equipment vibration. Therefore, this method first uses controlled loading to collect acoustic emission signals, locates suspected abnormal areas, then performs local mechanical verification on these areas against normal areas of the same structure, and finally provides a judgment result. Figure 1 The specific steps of the method described in this embodiment are as follows:

[0055] S1. Establish the coordinate relationship between the glass substrate and the TGV aperture:

[0056] A planar coordinate system for the substrate is established, using the reference corner point of the glass substrate as the origin and the two perpendicular substrate edges as the X and Y axes, respectively. Based on the TGV array design data and actual measurement results, the hole number, hole center coordinates, hole diameter, hole spacing, hole-filling metal area, and RDL pattern boundary of each TGV hole are recorded.

[0057] For the TGV hole in row m and column n, the center coordinates of the hole are: ;

[0058] A structural projection region is established around each TGV aperture, including the aperture opening projection region, the aperture wall and metal-glass interface projection region, the surrounding glass region, and the RDL edge region. These regions are uniformly transformed to the substrate coordinate system for subsequent mapping of the sound source coordinates to specific TGV structural locations.

[0059] S2. Apply load and collect acoustic emission signals:

[0060] The glass substrate to be tested was mounted on a four-point bending fixture. Multiple acoustic emission sensors were arranged along the edge of the substrate, and the position of each sensor in the substrate coordinate system was recorded. All channels were installed using the same type of coupling agent and fixing method. Before formal testing, a pre-test was conducted on a sample of the same specification without obvious cracks to determine the safe loading range that would not generate new cracks. During formal testing, graded cyclic loading below this critical load was used to cause existing hidden cracks to open, close, or partially slip, releasing acoustic emission signals while preventing the formation of new cracks in the intact area during the testing process. The loading force, displacement, and waveforms of each acoustic emission channel were recorded simultaneously during the testing process. Background noise for each channel was collected before loading, and trigger thresholds were set for each channel.

[0061] S3. Calibrate propagation parameters:

[0062] Because the TGV via array, via-filling metal, and RDL structure alter the propagation conditions of elastic waves within the substrate, the theoretical sound velocity of pure glass cannot be directly used for localization. Therefore, reference calibration is required on the substrate under test before formal testing.

[0063] Short-time reference excitations are applied at multiple known coordinate locations. For the p-th reference position and the i-th sensor, we have: ;

[0064] in, For the first The arrival time of the first wave recorded by each sensor. For reference, the incentive start time, The distance from the reference position to the sensor, For effective transmission speed, For the first The time deviation of each channel is calculated based on measured data from multiple reference locations, and the positioning residual between the calculated position and the actual position is recorded. In subsequent positioning, the arrival time of each channel is first corrected for the time deviation.

[0065] S4. Filter valid events and calculate sound source coordinates:

[0066] During loading, when any channel signal exceeds its trigger threshold, the synchronous response of other channels within a specified time window is extracted. When at least three sensors receive signals within the same time window, this group of signals is considered a candidate event, and parameters such as the first wave arrival time, peak value, energy, and duration are extracted. Candidate events with only one or two channel responses, or whose time difference exceeds the maximum propagation range of the substrate, or whose signal characteristics are consistent with known noise such as equipment vibration or fixture friction, are eliminated.

[0067] Let the coordinates of the sound source be... The sound source occurred at the time of , No. The coordinates of the sensors are Then we have:

[0068] ;

[0069] Using the first wave arrival time corrected by at least three sensors, the sound source coordinates and sound source occurrence time are determined, and the positioning residual is calculated. Events located outside the substrate area or with positioning residuals exceeding the calibrated allowable value are not considered valid sound source events. Cluster analysis is performed on the valid sound source coordinates of the same loading stage. When at least three valid events consecutively fall into the same local area, and the radius of that area is not greater than half the distance between adjacent TGV apertures, that area is identified as a suspected acoustic emission area.

[0070] S5. Convert the sound source coordinates to the TGV structure position:

[0071] For each valid sound source coordinate Calculate its distance from the center of each TGV hole:

[0072] ;

[0073] The TGV aperture with the smallest distance and located within the influence range of the target aperture is identified as the target TGV aperture. The aperture circumferential angle of the sound source relative to the center of the target aperture is: ;

[0074] Based on the distance between the sound source coordinates and the target hole center, the distance from the hole center is determined. This coordinate is then matched with pre-established projection areas for the hole opening, hole wall and interface, surrounding glass area, and RDL edge area to determine the corresponding structural projection area. A positioning record is ultimately generated, including: glass substrate number, TGV hole number, sound source coordinates, distance from the hole center, hole perimeter angle, structural projection area, number of valid events, and positioning residual. Events not falling within the influence range of any TGV hole are marked as non-TGV area events and are not included in subsequent hidden crack assessment.

[0075] like Figure 2 As shown, firstly, the distance between the sound source coordinates and the center of each TGV aperture is calculated to determine the target TGV aperture; then, the distance and angle of this point relative to the center of the target aperture are calculated; finally, this position is matched to the specific structural projection area. After this step, the ordinary planar sound source coordinates can be converted into TGV structural positions that can be directly used for subsequent local verification.

[0076] S6. Identify suspected detection areas and normal control areas:

[0077] The locations where effective acoustic emission events repeatedly cluster, the positioning residuals meet the requirements, and the corresponding TGV structure projection areas are identified as suspected detection areas. On the same glass substrate, normal control areas where no effective acoustic emission events cluster are selected. The normal control areas should meet the following consistency conditions with the suspected detection areas: identical TGV structure, identical material region, identical distance from the hole center, and identical or symmetrical hole perimeter angles. The suspected areas and normal control areas are used for comparison testing using the same detection point arrangement, the same loading direction, the same maximum detection load, and the same loading rate.

[0078] S7. Perform local mechanical verification:

[0079] A low-load instrumented micro-indentation device was used to set up identical three rows and three columns of detection points on the accessible perimeter surface of both the suspected and normal control areas. The same maximum load, loading rate, and loading direction were applied to both areas, and the detection points avoided the cavities inside the TGV borehole and locations where stable loading was not possible. For cases where the sound source corresponds to the borehole wall or buried interface, the detection points were set at the corresponding projected positions on the perimeter surface.

[0080] Record the load-indentation depth curves at each test point, and extract the elastic modulus, unloading stiffness, and residual indentation depth. Establish normal ranges using the average and standard deviation of each parameter in the normal control area. When the elastic modulus, unloading stiffness, or residual indentation depth of a suspected area is lower than the normal average minus three standard deviations, it is recorded as a mechanical anomaly. When at least two of the three parameters exceed the normal range, the location is defined as a local mechanical anomaly area. Determine the micro-indentation location using acoustic emission localization results, and only test suspected TGV holes and their corresponding periphery.

[0081] S8. Jointly determine and output the detection results:

[0082] The acoustic emission localization condition is deemed met when there are at least three valid acoustic emission events, the event localization residual is not greater than the calibrated allowable value, and the events are concentrated in the same TGV aperture and the same structural projection area. The local mechanical verification condition is deemed met when there are at least two abnormal local mechanical parameters at this location relative to the normal control area.

[0083] When the same location simultaneously meets both the acoustic emission localization condition and the local mechanical verification condition, it is identified as a hidden crack anomaly region; when only the acoustic emission localization condition is met, it is listed as a region to be retested; when only the local mechanical verification condition is met, it is listed as a local performance anomaly region. The final record includes the glass substrate number, TGV hole number, acoustic source coordinates, distance from the hole center, hole perimeter angle, structural projection area, number of valid events, localization residual, local mechanical anomaly items, and the judgment result.

[0084] like Figure 3 As shown, the suspected detection location is determined based on the acoustic emission localization results, and a normal area with the same structure and location is selected for micro-indentation control detection. Based on the acoustic emission event aggregation and local mechanical parameter anomalies, three types of results are formed: hidden crack anomaly area, area to be retested, or local performance anomaly area.

[0085] The method described in this embodiment enables the screening, location, and verification of hidden crack anomaly regions without performing precise inspection of all TGV holes individually. By calibrating the effective propagation velocity and acquisition channel time deviation on the actual substrate under test, the sound source coordinates are calculated using the first wave arrival times of multiple acoustic emission sensors. Valid sound sources are then screened based on positioning residuals and event aggregation. The sound source planar coordinates are then converted into TGV hole number, distance from the hole center, hole perimeter angle, and structural projection area. Based on these results, the local mechanical testing location is determined, and normal areas with the same structure and location are selected for comparative testing. Finally, based on the acoustic emission event aggregation results and the results of local mechanical parameter anomalies, the hidden crack anomaly region and the corresponding TGV structural location are output. Specific Implementation Example 2:

[0087] This disclosure also provides an embodiment:

[0088] An electronic device includes: a storage medium and a processing unit; wherein the storage medium is used to store a computer program, and the processing unit exchanges data with the storage medium for executing the computer program through the processing unit during TGV hidden crack detection of a glass substrate, performing the steps of the method as described in Specific Embodiment 1. Specific Implementation Example 3:

[0090] A computer-readable storage medium storing a computer program; when the computer program is run, it performs the steps of the method described in Specific Embodiment 1.

[0091] In this disclosure, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in connection with an instruction execution system, apparatus, or device. In this disclosure, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wireless, wireline, optical fiber, RF, etc., or any suitable combination thereof.

[0092] The above disclosures only cover a few specific implementation scenarios. However, this disclosure is not limited to these, and any variations that can be conceived by those skilled in the art should fall within the protection scope of this disclosure. The serial numbers in this disclosure are for descriptive purposes only and do not represent the superiority or inferiority of the implementation scenarios.

Claims

1. A method for detecting TGV microcracks in glass substrates, based on acoustic emission localization and local mechanical verification, characterized in that, include: The glass substrate under test is subjected to graded cyclic loading to excite acoustic emission signals from hidden cracks, and the waveform is collected. The signal trigger threshold is set according to the background noise of each channel. A reference excitation is applied to the glass substrate under test to calibrate the effective propagation speed of the sound wave and the time deviation of each acquisition channel. The sound source plane coordinates are solved based on the corrected first wave arrival time, and the suspected acoustic emission area is obtained by multi-channel synchronous response, positioning residual, and event clustering. Match the plane coordinates of the sound source to the corresponding target TGV hole, and calculate the distance of the sound source from the center of the hole and the angle around the hole relative to the target hole to obtain the structural projection area corresponding to the sound source. On the substrate under test, select a normal control area with no abnormalities that has the same TGV structure as the suspected acoustic emission area, the same distance from the hole center, and the same or symmetrical hole perimeter angle. The same micro-indentation loading conditions were used to test the suspected area and the normal control area respectively. Three mechanical parameters were extracted: elastic modulus, unloading stiffness and residual indentation depth. When two or more mechanical parameters deviated from the normal range, it was determined that there was a local mechanical abnormality in the area. Based on the acoustic emission event accumulation conditions and local mechanical anomaly conditions, multiple levels of graded judgment results were set to obtain the TGV hidden crack detection results of the glass substrate.

2. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that: Before hierarchical cyclic loading, the following steps are included: A plane coordinate system for the glass substrate is pre-constructed, the center coordinates of each TGV hole are calibrated, and the structural projection area is divided. The structural projection area includes the orifice projection area, the orifice wall and metal-glass interface projection area, the glass area around the orifice, and the RDL edge area. All structural projection areas are uniformly converted to the glass substrate plane coordinate system for storage.

3. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that, Before performing the hierarchical cyclic loading, the following steps are included: Preliminary tests were conducted using crack-free glass substrates of the same specifications to determine the critical load that would not generate new cracks. The applied force during formal testing was always lower than this critical load. The testing process simultaneously records the applied force, substrate displacement, and waveform data of all acoustic emission channels.

4. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that: The reference excitation parameters are calibrated using the following formula: ; in, For the first The arrival time of the first wave recorded by each sensor. For reference, the incentive start time, The distance from the reference position to the sensor, For effective transmission speed, For the first Time deviation of each channel.

5. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that, The steps for matching the sound source plane coordinates to the target TGV aperture and converting the aperture circumferential parameters include: For each valid sound source coordinate Calculate the distance between the effective sound source and the center of each TGV aperture: ； The TGV hole with the smallest distance and located within the influence range of the hole is identified as the target TGV hole; The angle around the sound source relative to the center of the target hole is: ; in, Effective sound source coordinates To the Line 1 The Euler distance between the centers of the TGV holes; For the first Line 1 The coordinates of the center plane of the TGV holes; It is the arctangent function in the four quadrants.

6. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that: The micro-pressure detection points are uniformly arranged in three rows and three columns, and all detection points avoid the internal cavity of the TGV.

7. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that: When the sound source corresponds to the hole wall or the metal-glass interface, the micro-indentation detection point is arranged at the projection position of the hole periphery surface corresponding to the sound source.

8. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that, The multi-level classification results are set based on acoustic emission event aggregation conditions and local mechanical anomaly conditions, including: When acoustic emission events are concentrated in the same structural projection area and two or more mechanical parameters are abnormal, it is determined to be a hidden crack abnormal area. The area is identified as a region to be retested only if the acoustic emission event aggregation condition is met. A region is considered to have localized performance abnormalities if there are only two or more abnormal mechanical parameters and no focused acoustic emission events.

9. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that: The glass substrate under test has TGV holes, a metal-glass interface, and an RDL edge structure. The hidden cracks to be detected are those located on the hole wall, around the hole glass, or at the metal-glass interface, and that do not extend to the substrate surface.

10. The method for detecting TGV hidden cracks in glass substrates according to claim 1, characterized in that, After obtaining the TGV hidden crack detection results for the glass substrate by setting multiple graded judgment results based on acoustic emission event aggregation conditions and local mechanical anomaly conditions, the process includes the following steps: Output standardized test records; The standardized test record shall include at least: substrate number, TGV aperture number, sound source coordinates, distance from aperture center, aperture circumferential angle, projected area of ​​the structure to which it belongs, number of effective acoustic emission events, positioning residual, number of mechanical anomalies, and final judgment result.

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