Probe and test head having the same

Abstract

The application discloses a probe and a test head with the probe. The probe comprises at least two metal wires, each of which has a non-bonding part, a first bonding part and a second bonding part, and the non-bonding part is located between the first bonding part and the second bonding part. Each first bonding part forms a first contact part via a first fixed bundle set to directly or indirectly contact a counterpart element, and each second bonding part forms a second contact part via a second fixed bundle set to directly or indirectly contact a measured element. When the counterpart element downwardly guides the measured element through the first contact part and the second contact part, the two non-bonding parts are independently arranged and are both radially bent and deformed. The manufacturing process is simplified, the contact stress of the probe is reduced, and the manufacturing cost is reduced.

Description

[Technical Field]

[0001] The present invention relates to a probe and a test head having the probe, and more particularly to a stress-reducing and easy-to-manufacture probe and a test head having the probe. [Background Technology]

[0002] Test heads are used to perform electrical tests on integrated circuits before chip packaging. Test heads typically include at least two guide plates separated by partitions and multiple probes passing through the guide plates. During testing, the probes transmit signals by contacting the contact pads of the chip under test through their lower ends. The probes are usually integrated probes, and one probe (with sufficient positive force) can achieve electrical connection.

[0003] However, existing integrated probes (such as probes manufactured using EMES processes and laser cutting methods) have the following problems:

[0004] 1. Excessive contact stress: Due to the high structural rigidity of integrated probes, chip contact pads are prone to cracking, damaging the chip.

[0005] 2. High manufacturing costs: Traditional methods of stress reduction (such as laser cutting out the hole in the middle of the probe body) rely on high-end equipment, and the cost is difficult to control.

[0006] 3. Short lifespan: The probe needs to be shortened after wear, which increases stiffness and exacerbates stress concentration. Furthermore, repeated use of the metal can lead to fatigue, increasing the risk of probe damage (breakage).

[0007] Therefore, it is necessary to design a new probe and a test head with the probe to overcome the above problems. [Summary of the Invention]

[0008] To address the problems of the prior art, the present invention aims to provide a new probe and a test head having the probe, which simplifies the manufacturing process, reduces the contact stress of the probe, and lowers manufacturing costs.

[0009] To achieve the above objectives, the present invention provides a probe for abutting an upwardly connected mating element and a downwardly connected tested element. The probe comprises at least two metal wires, each metal wire having a non-connecting portion, a first connecting portion, and a second connecting portion, wherein the non-connecting portion is located between the first connecting portion and the second connecting portion; wherein each first connecting portion forms a first contact portion via a first fixed sleeve assembly to directly or indirectly contact the mating element, and each second connecting portion forms a second contact portion via a second fixed sleeve assembly to directly or indirectly contact the tested element; when the mating element is guided downwardly to the tested element through the first contact portion and the second contact portion, the two non-connecting portions are independently provided and both are radially bent and deformed.

[0010] Furthermore, the first fixing sleeve is made of conductive material and has an upper mating portion at its upper end for abutting upward against the mating element. The first contact portion indirectly contacts the mating element through the upper mating portion, and the first fixing sleeve is combined with the top of each of the metal wires. The second fixing sleeve is made of conductive material and has a lower mating portion at its lower end for abutting downward against the tested element. The second contact portion indirectly contacts the tested element through the lower mating portion, and the second fixing sleeve is combined with the bottom of each of the metal wires. The hardness of both the first fixing sleeve and the second fixing sleeve is greater than the hardness of the metal wires.

[0011] Furthermore, the first fixing sleeve has a receiving cavity and an abutting surface located within the receiving cavity. The upper abutting portion is located above the abutting surface and is spaced apart from the abutting surface. The receiving cavity is formed by an upward recess from the bottom of the first fixing sleeve and its cross-sectional area gradually increases from top to bottom. The top of each metal wire is received in the receiving cavity and contacts the abutting surface, and the cross-sectional area of ​​the upper abutting portion is smaller than the area of ​​the abutting surface.

[0012] Furthermore, the shortest distance between the upper connecting part and the metal wire in the vertical direction is defined as the first distance, and the shortest distance between the lower connecting part and the metal wire in the vertical direction is defined as the second distance. The first distance is greater than or equal to one-third of the maximum size of the first fixing sleeve in the vertical direction, and the second distance is greater than or equal to one-third of the maximum size of the second fixing sleeve in the vertical direction.

[0013] Furthermore, the metal wires are provided in multiple forms, each of which is cylindrical, and the multiple metal wires are arranged in a circular or rectangular arrangement.

[0014] Furthermore, when the multiple metal wires are arranged in a circular pattern, the cross-sections of the first fixing sleeve and the second fixing sleeve are both circular; when the multiple metal wires are arranged in a rectangular pattern, the cross-sections of the first fixing sleeve and the second fixing sleeve are both rectangular.

[0015] Furthermore, the first fixing sleeve has a first through hole extending vertically, and the second fixing sleeve has a second through hole extending vertically. Each of the metal wires passes through the first through hole upwards, so that the first contact portion is exposed in the first through hole to directly contact the docking element. Each of the metal wires passes through the second through hole downwards to directly contact the tested element.

[0016] Furthermore, the metal wire is joined to the first fixing sleeve and / or the second fixing sleeve by one of the following methods: welding, fusion, gluing, riveting, or high-pressure compression.

[0017] The present invention also provides a test head, comprising: an upper guide plate; a lower guide plate; a receiving space located between the upper guide plate and the lower guide plate; a probe for abutting an upwardly connected mating element and a downwardly connected tested element, wherein each of the non-connecting portions is located within the receiving space; a first fixing sleeve is received in the upper guide plate; a second fixing sleeve is received in the lower guide plate; the probe comprises: at least two metal wires, each metal wire having a non-connecting portion, a first connecting portion, and a second connecting portion, wherein the non-connecting portion is located between the first connecting portion and the second connecting portion; wherein each of the first connecting portions forms a first contact portion via a first fixing sleeve bundle to directly or indirectly contact the mating element, and each of the second connecting portions forms a second contact portion via a second fixing sleeve bundle to directly or indirectly contact the tested element; when the mating element is guided downward through the first contact portion and the second contact portion to connect with the tested element, the two non-connecting portions are independently arranged and both are radially bent and deformed.

[0018] Further: The first fixing sleeve is made of conductive material and has an upper mating portion at its upper end for abutting upward against the mating element. The first contact portion indirectly contacts the mating element through the upper mating portion. The first fixing sleeve is combined with the top of each of the metal wires. The second fixing sleeve is made of conductive material and has a lower mating portion at its lower end for abutting downward against the tested element. The second fixing sleeve is combined with the bottom of each of the metal wires. The second contact portion indirectly contacts the tested element through the lower mating portion. The hardness of both the first fixing sleeve and the second fixing sleeve is greater than the hardness of the metal wires.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] By providing at least two metal wires, each of the first bonding portions is bundled together with the first fixing sleeve to form the first contact portion, and each of the second bonding portions is bundled together with the second fixing sleeve to form the second contact portion, thus forming a bundled structure of split probe. Because the metal wires are relatively soft, a single metal wire in this invention cannot provide sufficient positive force. Therefore, the method of bundling at least two metal wires to form a probe not only ensures that the probe has sufficient positive force to achieve electrical connection, but also simplifies the manufacturing process and flow of the probe and reduces costs. At the same time, the elastic deformation of the non-bonding area disperses stress (the contact stress is shared by multiple metal wires), avoiding chip damage. The elastic deformation of the non-bonding area can also reduce metal fatigue and avoid the breakage problem caused by stress concentration in traditional probes, thereby extending the service life of the probe. [Attached Image Description]

[0021] Figure 1 This is a partial cross-sectional view of the probe of the test head in the first embodiment of the present invention after it has penetrated the guide plate;

[0022] Figure 2 for Figure 1 A partial cross-sectional view of the test head after assembly, in conjunction with the docking components and the component under test;

[0023] Figure 3 for Figure 1 The image shows only one of the probes in a 3D exploded view;

[0024] Figure 4 for Figure 3 A three-dimensional diagram of the probe assembly;

[0025] Figure 5 for Figure 4 Side view;

[0026] Figure 6 for Figure 5 A sectional view cut along the AA direction;

[0027] Figure 7 for Figure 5 A sectional view cut along the BB direction;

[0028] Figure 8 This is a partial cross-sectional view of the test head probe of the second embodiment of the present invention after it has penetrated the guide plate;

[0029] Figure 9 for Figure 8 A partial cross-sectional view of the test head after assembly, in conjunction with the docking components and the component under test;

[0030] Figure 10 for Figure 8 The image shows only one of the probes in a 3D exploded view;

[0031] Figure 11 for Figure 10 A three-dimensional diagram of the probe assembly;

[0032] Figure 12 for Figure 11 Side view;

[0033] Figure 13 for Figure 12 A sectional view cut along the CC direction;

[0034] Figure 14 for Figure 12 A sectional view taken along the DD direction.

[0035] Test head 100 Upper guide plate 1 Upper receiving hole 11 Lower guide plate 2 Lower receiving hole 21 partition 3 Containment space 31 probe T Metal wire 4 First joint 41 Second joint 42 Non-binding zone 43 Contact area 431 First fixing sleeve 5 Upper Reception Chamber 51 Upper docking section 52 First through hole 53 First contact surface 54 Second fixing sleeve 6 Lower Reception Chamber 61 Lower docking section 62 Second through hole 63 Second contact surface 64 Gap G First contact part T1 Second contact part T2 Component 200 Component under test 300 First distance L1 Second distance L2 Left and right directions X Forward and backward direction Y Up and down direction Z

Detailed Implementation Methods

[0036] To facilitate a better understanding of the purpose, structure, and features of this invention, the invention defines a vertical direction (Z), a horizontal direction (X), and a front-back direction (Y). These three directions are mutually perpendicular. The invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0037] like Figures 1 to 7 As shown, this is a first embodiment of the test head 100 of the present invention. Figures 8 to 14 The image shows a second embodiment of the test head 100 of the present invention.

[0038] like Figure 2 and Figure 9 As shown, in either of the two embodiments described above, the test head 100 is used to abut against an upward-facing docking element 200 and a downward-facing test element 300. The docking element 200 is a circuit board, and the test element 300 is a chip. The test head 100 includes an upper guide plate 1, a lower guide plate 2, a partition plate 3 located between the upper guide plate 1 and the lower guide plate 2 in a vertical direction, and a plurality of probes T housed in the partition plate 3. For the sake of simplicity and clarity, the accompanying drawings of this invention only show three of the probes T as an illustration; in reality, the test head 100 contains more than three probes T.

[0039] like Figure 1 and Figure 2 As shown, in either of the two embodiments described above, the upper guide plate 1 is located above the partition plate 3. The upper guide plate 1 has a plurality of upper receiving holes 11, each of the upper receiving holes 11 passing through the upper guide plate 1 vertically. The plurality of probes T pass through the plurality of upper receiving holes 11 in a one-to-one correspondence. In other embodiments, the number of upper guide plates 1 may be greater than or equal to two.

[0040] like Figure 1 and Figure 8 As shown, in either of the two embodiments described above, the lower guide plate 2 is located below the partition plate 3. The lower guide plate 2 has a plurality of lower receiving holes 21, each of the lower receiving holes 21 penetrating the lower guide plate 2 vertically. The plurality of probes T pass through the plurality of lower receiving holes 21 in a one-to-one correspondence. In other embodiments, the number of lower guide plates 2 may be greater than or equal to two.

[0041] like Figure 1 and Figure 8As shown, in either of the two embodiments described above, the partition 3 has a receiving space 31 that extends vertically through the partition 3. The receiving space 31 allows multiple probes T to pass through. Each probe T consists of multiple metal wires 4, a first fixing sleeve 5, and a second fixing sleeve 6. The metal wires 4 are flexible, and the mechanical properties of a single metal wire 4 are insufficient to provide the positive force required to contact the tested element 300 and achieve a stable electrical connection with it. Therefore, the number of metal wires 4 in the probe T of this invention must be greater than or equal to two to meet the positive force requirement and ensure stable contact with the docking element 200 and the tested element 300. That is, in other embodiments, the number of metal wires 4 may be only two. The number of metal wires 4 is not limited here, as long as it is greater than or equal to two. The dimensional proportions of the metal wires 4, the first fixing sleeve 5, and the second fixing sleeve 6 of the probe T shown in the accompanying drawings are not actual proportions of the probe T, but are illustrations to better illustrate the inventive points of this invention.

[0042] like Figure 3 and Figure 11 As shown, in either of the two embodiments described above, the metal wire 4 is cylindrical, and each metal wire 4 extends longitudinally in the vertical direction. The materials, lengths, and sizes of the multiple metal wires 4 are all the same, which facilitates standardized production and ensures that the performance of each probe T is consistent. The multiple metal wires 4 are gathered in the horizontal direction to form a bundle structure. In other embodiments, the cross-section of the metal wire 4 can also be other structures, such as rectangles, squares, or other shapes. The specific shape of the metal wire 4 is not limited here, and the lengths and sizes of the multiple metal wires 4 can also be different.

[0043] like Figure 3 and Figure 4 , Figure 10 and Figure 11As shown, in either of the two embodiments described above, each metal wire 4 includes a first bonding portion 41, a second bonding portion 42, and a non-bonding area 43 located between the first bonding portion 41 and the second bonding portion 42 in the vertical direction. The first bonding portion 41 is located above the second bonding portion 42. A plurality of first bonding portions 41 of each probe T are bundled together via a corresponding first fixing sleeve 5 to form a first contact portion T1. A plurality of second bonding portions 42 of each probe T are bundled together via a corresponding second fixing sleeve 6 to form a second contact portion T2. ​​That is, in this invention, only the portion of the metal wire 4 bundled by the first fixing sleeve 5 or the second fixing sleeve 6 is the first bonding portion 41 or the second bonding portion 42. The first contact portion T1 is used to directly or indirectly contact the docking element 200 upwards, and the second contact portion T2 is used to directly or indirectly contact the tested element 300 downwards.

[0044] like Figure 1 and Figure 2 , Figure 8 and Figure 9 As shown, in either of the two embodiments described above, the plurality of non-bonding regions 43 of each probe T are located within the receiving space 31. When the probe T tests the tested element 300, each of the non-bonding regions 43 of the plurality of metal wires 4 is independently and separately arranged and subjected to radial bending deformation under force. That is, all the non-bonding regions 43 of the probe T undergo relative displacement and elastic deformation in the horizontal direction. In this invention, it is sufficient that at least two of the two non-bonding regions 43 of the metal wires 4 are independently arranged. The purpose of doing so is to ensure that at least two of the non-bonding regions 43 of the metal wires 4 can deform separately under force, thereby reducing probe stress.

[0045] like Figure 3 and Figure 4 , Figure 10 and Figure 11 As shown, the first fixing sleeve 5 and the second fixing sleeve 6 are made of metal, preferably copper. Of course, in other embodiments, the first fixing sleeve 5 and the second fixing sleeve 6 can also be made of non-conductive adhesive. The specific structure and material of the first fixing sleeve 5 and the second fixing sleeve 6 are not limited, as long as they can bundle together multiple metal wires 4. The split design of the probe T allows the metal wires 4 to deform freely and elastically in the non-bonding area 43, reducing metal fatigue and extending the service life of the probe T (i.e., the probe T composed of multiple metal wires 4 is more flexible and less prone to breakage than the traditional one-piece probe). It can also reduce stress concentration on the probe T, reducing the risk of damage to the tested element 300. It eliminates the need for the complex process of laser cutting the middle gap, reducing production costs.

[0046] like Figure 7 and Figure 14 As shown, in either of the two embodiments described above, for any two adjacent non-bonding areas 43, the two adjacent non-bonding areas 43 in their natural state have both a part that is in contact with each other and a part that is spaced apart (in other embodiments, the two adjacent non-bonding areas 43 can be completely in contact without gaps or completely spaced apart to form gaps). Specifically, the two non-bonding areas 43 in their natural state are at least partially in contact with each other, and the part that is in contact is defined as the contact area 431. Within the tolerance range, each metal wire 4 is as parallel and non-intersecting as possible in its vertical extension direction. When the tested element 300 is tested, all the metal wires 4 of each probe T will produce corresponding deformation, and the non-bonding areas 43 of all the metal wires will undergo relative displacement. That is, the multiple non-bonding areas 43 change from having no gaps before the test to having gaps during the test (the multiple contact areas 431 can form gaps by being subjected to force in a direction perpendicular to the vertical direction). Alternatively, the multiple non-bonding areas 43 may change from having no contact with gaps at the beginning to having gaps during the test by being subjected to force, thereby increasing the gap.

[0047] like Figure 3 and Figure 6 , Figure 11 and Figure 14 As shown, in either of the two embodiments described above, the first fixing sleeve 5 gradually narrows from bottom to top, and the second fixing sleeve 6 gradually narrows from top to bottom. The hardness of both the first fixing sleeve 5 and the second fixing sleeve 6 is greater than the hardness of the metal wire 4. The higher hardness of the first fixing sleeve 5 and the second fixing sleeve 6 protects the multiple metal wires 4. In other embodiments, the hardness of the first fixing sleeve 5 and the second fixing sleeve 6 may not be greater than that of the metal wire 4. The first fixing sleeve 5 is located above the second fixing sleeve 6, and both the first fixing sleeve 5 and the second fixing sleeve 6 are fixedly connected to the multiple metal wires 4 by high-pressure compression. In other embodiments, the metal wire 4 can be joined to the first fixing sleeve 5 by welding, fusion, gluing, or riveting; the joining method of the metal wire 4 to the first fixing sleeve 5 and the second fixing sleeve 6 is not limited here.

[0048] The forming method of the probe T in the above two embodiments is as follows:

[0049] 1. Provide multiple cylindrical metal wires 4 extending longitudinally in the vertical direction, and gather the multiple metal wires 4 horizontally to form a metal wire bundle;

[0050] 2. A first fixing sleeve 5 is provided, and the first fixing sleeve 5 is high-pressure compressed and fixed to the plurality of metal wires 4;

[0051] 3. A second fixing sleeve 6 is provided, and the second fixing sleeve 6 is high-pressure compressed and fixed to the plurality of metal wires 4.

[0052] The order of steps 2 and 3 can be interchanged. In other embodiments, the first fixing sleeve 5 and the second fixing sleeve 6 can be fixed to the multiple metal wires 4 by one of the above-mentioned welding, fusion, gluing or riveting.

[0053] like Figures 1 to 7 The image shows a first embodiment of the test head 100 of the present invention.

[0054] like Figure 3 and Figure 7 As shown, in this embodiment, the overall structure of the probe T is cylindrical, and multiple metal wires 4 are arranged in a circular pattern. Under the combined effect of the geometric symmetry of the cylindrical structure of the metal wires 4 and the circular arrangement, each metal wire 4 deforms when the probe T is compressed. The multiple metal wires 4 disperse the stress through coordinated deformation, making the overall stress distribution of the probe T more uniform, thereby reducing the contact stress of the probe T (a uniform stress distribution can avoid local stress concentration and reduce the risk of chip contact pad breakage).

[0055] like Figure 2 As shown, in this embodiment, when the tested element 300 is tested, the multiple non-bonded areas 43 are radially expanded under force. After expansion, the maximum distance between the multiple non-bonded areas 43 in the left and right directions is not greater than three times the maximum size of the probe T in the left and right directions before expansion, so as to avoid short circuits caused by contact with the probe T on the left and right sides after being compressed.

[0056] like Figure 3 and Figure 6 As shown, in this embodiment, both the first fixing sleeve 5 and the second fixing sleeve 6 have circular cross-sections to accommodate the multiple circumferentially arranged metal wires 4, making the overall structure of the probe T symmetrical. The first fixing sleeve 5 includes an upper receiving cavity 51, a first abutting surface 54, and an upper mating portion 52. The upper receiving cavity 51 is a blind groove used to receive multiple first mating portions 41 of the probe T. Each probe T's multiple first mating portions 41 are fixed to the first fixing sleeve 5 by high-pressure compression. The upper receiving cavity 51 is formed by an upward recess from the bottom of the first fixing sleeve 5, and the cross-sectional area of ​​the upper receiving cavity 51 gradually increases from top to bottom, so that the mating area between the metal wire 4 and the first fixing sleeve 5 gradually expands from top to bottom. This gradual cross-section makes the mating area between the metal wire 4 and the first fixing sleeve 5 transition smoothly, avoiding local stress concentration in the mating area and making the stress distribution more uniform.

[0057] like Figure 3 and Figure 6 As shown, in this embodiment, the first abutting surface 54 is a circular plane, located at the top of the upper receiving cavity 51. The upper docking portion 52 is located above the first abutting surface 54 and spaced apart from it. A plurality of first connecting portions 41 are bundled together via the first fixing sleeve 5 and abut against the first abutting surface 54 upwards. A plurality of first connecting portions 41 of the probe T abut against the first abutting surface 54 upwards. The upper docking portion 52 is used to abut against the docking element 200 upwards. That is, the first contact portion T1 indirectly contacts the docking element 200 through the upper docking portion 52.

[0058] like Figure 3 and Figure 6 As shown, in this embodiment, the cross-sectional area of ​​the upper mating portion 52 is smaller than the area of ​​the first abutting surface 54, causing stress concentration when the upper mating portion 52 abuts against the mating element 200 upwards. The first fixing sleeve 5 has a certain thickness above the upper receiving cavity 51, that is, the upper mating portion 52 and the upper receiving cavity 51 are spaced a certain distance apart in the vertical direction, enhancing the structural strength of the first metal sleeve 5. Specifically, the shortest distance between the upper mating part 52 and the metal wire 4 in the vertical direction is defined as the first distance L1, that is, the shortest distance between the upper mating part 52 and the first abutting surface 54 is the first distance L1. The first distance L1 is greater than or equal to one-third of the maximum dimension of the first fixing sleeve 5 in the vertical direction and less than or equal to one-half of the maximum dimension H1 of the first fixing sleeve 5 in the vertical direction. This ensures that the upper receiving cavity 51 has a certain depth for the metal wire 4 to extend into, thereby ensuring the bonding strength between the first joint part 41 and the first metal sleeve 5. It also prevents the upper end of the metal wire 4 from being exposed after the probe T is ground short, thus protecting the first joint part 41 and avoiding poor contact, oxidation corrosion and stress concentration caused by the exposure of the metal wire 4.

[0059] like Figure 3 and Figure 6 As shown, in this embodiment, the second fixing sleeve 6 includes a lower receiving cavity 61, a second abutting surface 64, and a lower mating portion 62. The lower receiving cavity 61 is a blind groove used to receive a plurality of second mating portions 42 of the probe T. The plurality of second mating portions 42 of each probe T are fixed to the second fixing sleeve 6 by high-pressure compression. The lower receiving cavity 61 is located at the top of the second fixing sleeve 6, and the cross-sectional area of ​​the lower receiving cavity 61 gradually increases from bottom to top, so that the mating area between the metal wire 4 and the second fixing sleeve 6 gradually expands from bottom to top, which is beneficial to a more uniform stress distribution. A uniform stress distribution can reduce the fatigue risk of the metal wire 4 at the mating point and extend the service life of the probe T.

[0060] like Figure 3 and Figure 6 As shown, in this embodiment, the second abutment surface 64 is a circular plane, located at the top of the lower receiving cavity 61. The plurality of second coupling portions 42 of the probe T abut downward against the second abutment surface 64, that is, the plurality of second coupling portions 42 are bundled together via the second fixing sleeve 6 and abut downward against the second abutment surface 64. The lower docking portion 62 is located below the second abutment surface 64 and is spaced apart from the second abutment surface 64. The lower docking portion 62 is used to directly abut downward against the tested element 200.

[0061] like Figure 3 and Figure 6 As shown, in this embodiment, the cross-sectional area of ​​the lower mating portion 62 is smaller than the area of ​​the second abutting surface 64, causing stress concentration when the lower mating portion 62 abuts downward against the tested element 300. The lower mating portion 62 and the lower receiving cavity 61 are spaced a certain distance in the vertical direction to enhance the structural strength of the second metal sleeve 6. Specifically, the shortest distance between the lower mating portion 62 and the metal wire 4 in the vertical direction is the second distance L2, that is, the shortest distance between the lower mating portion 62 and the second abutting surface 64 is the second distance L2. The second distance L2 is greater than or equal to one-third of the maximum dimension of the second fixed sleeve 6 in the vertical direction and less than or equal to one-half of the maximum dimension H2 of the second fixed sleeve 6 in the vertical direction, so that the lower receiving cavity 61 has a certain depth for the metal wire 4 to extend into, ensuring the bonding strength between the second joint portion 42 and the second metal sleeve 6, and preventing the lower end of the metal wire 4 from being exposed after the probe T is ground short, thus protecting the lower joint portion 42 and avoiding poor contact, oxidation corrosion and stress concentration caused by the exposure of the metal wire 4.

[0062] like Figures 8 to 14 The image shows a second embodiment of the test head described in this invention.

[0063] like Figure 10 and Figure 14 As shown, in this embodiment, the probe T has a generally rectangular structure, with multiple metal wires 4 arranged in a roughly matrix-like configuration. Specifically, the metal wires 4 are arranged in three rows along the left-right direction (X), and the multiple metal wires 4 in each row are closely aligned along the front-back direction (Y). For adjacent rows of metal wires 4, the two adjacent metal wires 4 are staggered but in contact with each other. The multiple metal wires 4 are arranged and overlapped in a rectangular manner, so that the deformation, spacing, and stress state of each metal wire 4 of the probe T are almost identical after being subjected to force.

[0064] like Figure 10 and Figure 12As shown, in this embodiment, both the first fixing sleeve 5 and the second fixing sleeve 6 have rectangular cross-sections to accommodate the multiple rectangularly arranged metal wires 4, making the overall structure of the probe T symmetrical. The first fixing sleeve 5 has a first through hole 53, the shape of which matches the shape of the first fixing sleeve 5, i.e., the first through hole 53 gradually narrows from bottom to top, forming an inverted cone shape. The first through hole 53 penetrates the top and bottom of the first fixing sleeve 5 in the vertical direction, and the multiple first joint portions 41 of the multiple metal wires 4 of the probe T are accommodated in the first through hole 53. The second fixing sleeve 6 has a second through hole 63, the shape of which matches the shape of the second fixing sleeve 6, i.e., the second through hole 63 gradually narrows from top to bottom, forming a conical structure. The second through hole 63 penetrates the second fixing sleeve 6 in the vertical direction.

[0065] like Figure 9 and Figure 10 As shown, in this embodiment, the multiple first joint portions 41 of the multiple metal wires 4 of the probe T are bundled together by the first fixing sleeve 5 to form the first contact portion T1, which directly contacts the docking element 200. The first contact portion T1 passes through the first through hole 53. The multiple second joint portions 42 of the multiple metal wires 4 of the probe T are bundled together by the second fixing sleeve 6 to form the second contact portion T2, which directly contacts the tested element 300. The second contact portion T2 passes downward through the second through hole 63.

[0066] In summary, the probe and test head having the probe of the present invention have the following beneficial effects:

[0067] 1. By gathering multiple metal wires 4 in a horizontal direction, the first fixing sleeve 5 is combined with the multiple metal wires 4, and the second fixing sleeve 6 is combined with the multiple metal wires 4, forming a bundle-shaped split probe T. This simplifies the manufacturing process and flow of the probe T, reduces costs, and utilizes the elastic deformation of the non-bonding area 43 to disperse stress (the contact stress is shared by multiple metal wires 4), thus preventing chip damage. Furthermore, the radial expansion of the non-bonding area 43 can reduce metal fatigue and avoid the breakage problem caused by stress concentration in traditional probe T, thereby extending the service life of the probe T.

[0068] 2. The cross-sectional area of ​​the upper receiving cavity 51 gradually increases from top to bottom, so that the joint area between the metal wire 4 and the first fixing sleeve 5 gradually expands from top to bottom. The gradient cross-section design makes the joint area between the metal wire 4 and the first fixing sleeve 5 transition smoothly, which can avoid local stress concentration in the joint area, make the stress distribution more uniform, reduce the fatigue risk of the metal wire 4 at the joint, and extend the service life of the probe T. In addition, since the cross-sectional area of ​​the upper receiving cavity 51 gradually increases, the contact area between the metal wire 4 and the first fixing sleeve 5 is increased, and the stress at the joint is dispersed.

[0069] 3. The geometric symmetry of the cylindrical metal wire 4 and its circumferential arrangement work together to ensure that the probe T deforms symmetrically in all directions and has a uniform stress distribution when under pressure. This characteristic has significant advantages in terms of test stability (uniform stress distribution can avoid local stress concentration and reduce the risk of chip scratching), probe T life (symmetrical deformation reduces metal fatigue and extends the life of probe T), and manufacturing consistency (cylindrical metal wire 4 and circumferential arrangement facilitate standardized production and ensure that the performance of each probe T is consistent).

[0070] 4. The various ways in which the metal wire 4 is combined with the first fixing sleeve 5 and the second fixing sleeve 6 can be adapted to different materials and scenario requirements (such as welding for high-temperature environments and high-pressure compression for low-cost scenarios), improving the flexibility of the process. The most economical combination process can also be selected according to production conditions (such as gluing for small-batch production and high-pressure compression for large-scale production).

[0071] 5. The metal wire 4 has a cylindrical structure, which is beneficial for manufacturing. When multiple metal wires 4 are arranged in a circular pattern, the cross-sections of the first fixing sleeve 5 and the second fixing sleeve 6 are both circular. When multiple metal wires 4 are arranged in a rectangular pattern, the cross-sections of the first fixing sleeve 5 and the second fixing sleeve 6 are both rectangular. That is, the fixing sleeves with different structures can be adapted according to the different arrangement of multiple metal wires 4, which is beneficial to the overall symmetry of the probe T.

[0072] 6. The first distance L1 is greater than or equal to one-third of the maximum dimension of the first fixing sleeve 5 in the vertical direction, and the second distance L2 is greater than or equal to one-third of the maximum dimension of the second fixing sleeve 6 in the vertical direction. This prevents the upper and lower ends of the metal wire 4 from being exposed after the probe T is ground short, and protects the first joint 41 and the second joint 42, avoiding poor contact, oxidation corrosion and stress concentration caused by exposure.

[0073] The above detailed description is only an illustration of a preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the content of this invention's specification and illustrations are included within the patent scope of this invention.

Claims

1. A probe for abutting upward against a mating element and downward against a measured element, characterized in that, include: At least two metal wires, each of the metal wires having a non-bonding region, a first bonding portion and a second bonding portion, wherein the non-bonding region is located between the first bonding portion and the second bonding portion; Each of the first joint portions forms a first contact portion via a first fixed sleeve assembly to directly or indirectly contact the docking element, and each of the second joint portions forms a second contact portion via a second fixed sleeve assembly to directly or indirectly contact the tested element. When the docking element is guided downward through the first contact portion and the second contact portion to the tested element, the non-bonding areas of the at least two metal wires are independently set and all are radially bent and deformed.

2. The probe according to claim 1, characterized in that: The first fixing sleeve is made of conductive material and has an upper mating portion at its upper end for abutting upward against the mating element. The first contact portion indirectly contacts the mating element through the upper mating portion. The first fixing sleeve is combined with the top of each of the metal wires. The second fixing sleeve is made of conductive material and has a lower mating portion at its lower end for abutting downward against the tested element. The second contact portion indirectly contacts the tested element through the lower mating portion. The second fixing sleeve is combined with the bottom of each of the metal wires. The hardness of both the first fixing sleeve and the second fixing sleeve is greater than the hardness of the metal wires.

3. The probe according to claim 2, characterized in that: The first fixing sleeve has a receiving cavity and an abutting surface located in the receiving cavity. The upper abutting portion is located above the abutting surface and is spaced apart from the abutting surface. The receiving cavity is formed by an upward indentation from the bottom of the first fixing sleeve and its cross-sectional area gradually increases from top to bottom. The top of each metal wire is received in the receiving cavity and contacts the abutting surface, and the cross-sectional area of ​​the upper abutting portion is smaller than the area of ​​the abutting surface.

4. The probe according to claim 2, characterized in that: The shortest distance between the upper connecting part and the metal wire in the vertical direction is defined as the first distance, and the shortest distance between the lower connecting part and the metal wire in the vertical direction is defined as the second distance. The first distance is greater than or equal to one-third of the maximum size of the first fixing sleeve in the vertical direction, and the second distance is greater than or equal to one-third of the maximum size of the second fixing sleeve in the vertical direction.

5. The probe according to claim 1, characterized in that: The metal wires are provided in multiple forms, each of which is cylindrical, and the multiple metal wires are arranged in a circular or rectangular arrangement.

6. The probe according to claim 5, characterized in that: When the multiple metal wires are arranged in a circular pattern, the cross-sections of the first fixing sleeve and the second fixing sleeve are both circular; when the multiple metal wires are arranged in a rectangular pattern, the cross-sections of the first fixing sleeve and the second fixing sleeve are both rectangular.

7. The probe according to claim 1, characterized in that: The first fixing sleeve has a first through hole extending vertically, and the second fixing sleeve has a second through hole extending vertically. Each of the metal wires passes through the first through hole upwards so that the first contact portion is exposed in the first through hole to directly contact the docking element. Each of the metal wires passes through the second through hole downwards to directly contact the tested element.

8. The probe according to claim 1, characterized in that: The metal wire is joined to the first fixing sleeve and / or the second fixing sleeve by one of the following methods: welding, fusion, gluing, riveting, or high-pressure compression.

9. A test head, characterized in that, include: First, the guide plate; One guide plate; A receiving space is located between the upper guide plate and the lower guide plate; The probe as claimed in claim 1, wherein each of the non-binding regions is located within the receiving space, the first fixing sleeve is received in the upper guide plate, and the second fixing sleeve is received in the lower guide plate.

10. The test head according to claim 9, characterized in that: The first fixing sleeve is made of conductive material and has an upper mating portion at its upper end for abutting upward against the mating element. The first contact portion indirectly contacts the mating element through the upper mating portion. The first fixing sleeve is combined with the top of each of the metal wires. The second fixing sleeve is made of conductive material and has a lower mating portion at its lower end for abutting downward against the tested element. The second fixing sleeve is combined with the bottom of each of the metal wires. The second contact portion indirectly contacts the tested element through the lower mating portion. The hardness of both the first fixing sleeve and the second fixing sleeve is greater than the hardness of the metal wires.

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