Current-carrying capacity determination method and electronic device

Abstract

Embodiments of the present application provide a current-carrying capacity determination method and an electronic device. The method comprises: controlling a current source to output a first current to a circuit board; obtaining, by a first temperature detection device, a target temperature rise region of the circuit board under the first current; obtaining, by a second temperature detection device, an ambient temperature of the target temperature rise region; obtaining an allowable temperature rise value of the circuit board under the ambient temperature, and controlling the output current of the current source according to the allowable temperature rise value; obtaining a second current output by the current source when the second temperature detection device detects that the temperature of the target temperature rise region reaches the allowable temperature rise value; and determining the current-carrying capacity of the circuit board according to the ambient temperature, the allowable temperature rise value and the second current. The present application can improve the accuracy of current-carrying capacity analysis.

Description

Technical Field

[0001] This application belongs to the field of circuit board technology, and in particular relates to a method for determining current carrying capacity and an electronic device. Background Technology

[0002] In the design and manufacturing of circuit boards, especially high-current, high-density printed circuit boards (PCBs), accurately predicting the current-carrying capacity of conductors (such as copper foil) is crucial to ensuring the long-term reliability and safety of products.

[0003] In related technologies, common design standards such as IPC-2221A are typically relied upon to estimate the current-carrying capacity of conductors. However, in pursuit of broad applicability, these standards are based on simplified theoretical assumptions and early experimental data, resulting in inherent limitations in their calculation accuracy. Summary of the Invention

[0004] This application provides a method and electronic device for determining current carrying capacity, in order to solve the problem of poor accuracy in estimating the current carrying capacity of wires in a circuit board using common design standards.

[0005] In a first aspect, embodiments of this application provide a method for determining current-carrying capacity. The method includes: controlling a current source to output a first current to a circuit board; obtaining a target temperature rise area of ​​the circuit board under the first current using a first temperature detection device; obtaining the ambient temperature of the target temperature rise area using a second temperature detection device; obtaining an allowable temperature rise value of the circuit board at the ambient temperature; controlling the output current of the current source according to the allowable temperature rise value; obtaining a second current output by the current source when the second temperature detection device detects that the temperature of the target temperature rise area has reached the allowable temperature rise value; and determining the current-carrying capacity of the circuit board based on the ambient temperature, the allowable temperature rise value, and the second current.

[0006] The current-carrying capacity determination method provided in this application embodiment obtains the target temperature rise area of ​​the circuit board through a first temperature detection device, and then obtains the temperature of the target temperature rise area through a second temperature detection device. Data acquisition is triggered when the temperature of the target temperature rise area reaches the allowable temperature rise value, which improves the accuracy of data acquisition and thus the accuracy of current-carrying capacity analysis. Furthermore, this application determines the current-carrying capacity of the circuit board based on ambient temperature, allowable temperature rise value, and second current, avoiding the use of general design standards to estimate current-carrying capacity, thereby improving the accuracy of current-carrying capacity analysis.

[0007] Secondly, embodiments of this application provide a current-carrying capacity determination device, comprising: a current control module for controlling a current source to output a first current to a circuit board; a temperature rise acquisition module for acquiring a target temperature rise area of ​​the circuit board under the first current through a first temperature detection device; an ambient temperature acquisition module for acquiring the ambient temperature of the target temperature rise area through a second temperature detection device; the current control module is further configured to acquire an allowable temperature rise value of the circuit board under the ambient temperature, and control the output current of the current source according to the allowable temperature rise value; the current acquisition module is configured to acquire a second current output by the current source when the second temperature detection device detects that the temperature of the target temperature rise area has reached the allowable temperature rise value; and a current-carrying capacity determination module for determining the current-carrying capacity of the circuit board based on the ambient temperature, the allowable temperature rise value, and the second current.

[0008] Thirdly, embodiments of this application provide an electronic device, which includes a processor and a memory. The processor is used to execute a computer program stored in the memory to implement the current carrying capacity determination method described above.

[0009] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the above-described current carrying capacity determination method. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is an application scenario diagram of the current carrying capacity determination method provided in one embodiment of this application.

[0012] Figure 2 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application.

[0013] Figure 3 This is a flowchart illustrating a current-carrying capacity determination method provided in one embodiment of this application.

[0014] Figure 4 This is a flowchart illustrating a first current determination method provided in one embodiment of this application.

[0015] Figure 5 This is a flowchart illustrating a method for determining a target temperature rise region according to an embodiment of this application.

[0016] Figure 6This is a flowchart illustrating an embodiment of the method for determining ambient temperature provided in this application.

[0017] Figure 7 This is a flowchart illustrating a second current acquisition method provided in one embodiment of this application.

[0018] Figure 8 This is a flowchart illustrating a target operation method determination method provided in one embodiment of this application.

[0019] Figure 9 This is a scatter plot showing the relationship between the outer layer current carrying capacity and cross-sectional area under different allowable temperature rise values ​​provided in one embodiment of this application.

[0020] Figure 10 This is a scatter plot showing the relationship between the inner layer current carrying capacity and cross-sectional area under different allowable temperature rise values ​​provided in one embodiment of this application.

[0021] Figure 11 This is a flowchart illustrating a method for determining the current carrying capacity of a circuit board under test according to an embodiment of this application.

[0022] Figure 12 This is a schematic diagram of the current carrying capacity determination device provided in one embodiment of this application. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0024] Numerous specific details are set forth in the following description in order to provide a full understanding of this application. The described embodiments are only some, not all, of the embodiments of this application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0026] In the design and manufacturing of circuit boards, especially high-current, high-density printed circuit boards (PCBs), accurately predicting the current-carrying capacity of conductors (such as copper foil) is crucial to ensuring the long-term reliability and safety of products.

[0027] In related technologies, common design standards such as IPC-2221A are typically relied upon to estimate the current-carrying capacity of conductors. However, these methods suffer from poor accuracy in estimating current-carrying capacity. On one hand, these design standards, in pursuit of broad applicability, are based on simplified theoretical assumptions and early experimental data, leading to inherent limitations in their calculation accuracy. For example, the calculation data regarding the current-carrying capacity of internal circuit board traces in common design standards are not derived from direct empirical research but are obtained by downderating experimental data from external traces, lacking sufficient verification of accuracy and reliability. On the other hand, these common design standards contain nearly a hundred sets of charts and graphs; their complex chart system presents a high barrier to entry for general engineers, making it difficult to apply quickly and accurately. Furthermore, the parameters set in these design standards are relatively conservative, preventing them from providing effective guidance for the refined design of high-power, high-current circuit boards.

[0028] In view of the above problems, this application provides a method for determining current carrying capacity. This method is used to confirm the current carrying capacity of a circuit board, avoiding the use of general design standards to estimate the current carrying capacity, and improving the accuracy of current carrying capacity analysis.

[0029] Figure 1 This is an application scenario diagram of the current carrying capacity determination method provided in one embodiment of this application. For example... Figure 1 As shown, the current-carrying capacity determination method is applied to electronic device 10, which is connected to current source 20, first temperature detection device 30, and second temperature detection device 40, respectively. Current source 20 is connected to circuit board 50. It is understood that the connection in this disclosure refers to connection in a broad sense, including mechanical connection, electrical connection, and communication connection.

[0030] The functional information of the electronic device 10, current source 20, first temperature detection device 30, second temperature detection device 40 and circuit board 50 of this application is described below.

[0031] The electronic device 10 has both control and data processing capabilities. It can output current commands to the current source 20, causing the current source 20 to output current to the circuit board 50 according to the commands. The electronic device 10 can also acquire the current information output by the current source 20, as well as the temperature information detected by the first temperature detection device 20 and the second temperature detection device 30. By analyzing the current and temperature information, it can determine the current-carrying capacity of the circuit board 50.

[0032] The current source 20 can be an active electronic device or circuit capable of outputting a relevant current value, and its output current can be unaffected by changes in load impedance or output voltage under specific operating conditions. The current source 20 is connected to the circuit board 50 to output currents of different magnitudes to the circuit board 50.

[0033] The first temperature detection device 30 can be a device capable of acquiring temperature information of the circuit board 50. The first temperature detection device 30 can acquire temperature information of the circuit board 50 through contact or non-contact methods. In the case where the first temperature detection device 30 acquires temperature information of the circuit board 50 through contact, in some examples, the first temperature detection device 30 may include a temperature sensor array, with multiple temperature sensors regularly arranged on the surface of the circuit board 50. The temperature distribution information of the entire surface of the circuit board 50 is acquired through these multiple temperature sensors, generating a visualized thermal field image. In other examples, the surface of the circuit board 50 can be coated with a temperature-sensitive material. The coating color reversibly changes with the temperature of the circuit board 50. By calibrating the correspondence between color and temperature and combining it with image processing technology, the temperature distribution information of the entire surface of the circuit board 50 can be acquired. In the case where the first temperature detection device 30 acquires temperature information of the circuit board 50 through non-contact methods, the first temperature detection device 30 may include an infrared thermal imager. This application embodiment uses an infrared thermal imager as an example to illustrate that the first temperature detection device 30 can acquire temperature distribution information of the entire surface of the circuit board 50 in real time and generate a visualized thermal field image. Infrared thermal imagers can quickly and intuitively locate the hottest point on the surface of circuit board 50.

[0034] The second temperature detection device 40 can be another device capable of acquiring temperature information of the circuit board 50. The second temperature detection device 40 can acquire the temperature information of the circuit board 50 through a contact method. The second temperature detection device 40 may include a thermocouple device, which senses the temperature information of the circuit board 50 through a temperature-sensing junction composed of two dissimilar conductive wires. The thermocouple device can quickly and accurately determine the temperature of the corresponding temperature-sensing junction on the circuit board 50. The temperature-sensing junction can represent the location where the two conductive wires of different materials in the thermocouple device are interconnected and in thermal contact with the circuit board 50. The method of making thermal contact between the thermocouple device and the circuit board 50 can be found in relevant technologies and will not be elaborated here.

[0035] The circuit board 40 includes an insulating substrate and conductors formed thereon, which may have the same and / or different widths and thicknesses. The conductors are positioned at specific locations on the circuit board 40, including but not limited to: power layers for power distribution, ground layers for providing a common reference ground, and signal routing layers for connecting various electronic components. To avoid corner current accumulation effects, the conductors may be routed in a straight line.

[0036] In some embodiments, when it is necessary to determine the current-carrying capacity of the circuit board 50, the electronic device 10 sends a current command to the current source 20. The current source 20, based on the current command, can output different values ​​of current to the circuit board 50 (hereinafter referred to as the "first current" for ease of description). The first temperature detection device 30 acquires the target temperature rise area of ​​the circuit board 50 under the first current. The target temperature rise area may represent a region containing hot spots selected from the conductors of the circuit board 50, where a hot spot represents the location with the highest temperature in the conductor. The second temperature detection device 40 acquires the ambient temperature of the target temperature rise area and sends the ambient temperature to the electronic device 10; the ambient temperature may represent the temperature of the medium surrounding the circuit board 50. The electronic device 10 acquires the allowable temperature rise value of the circuit board 50 under different ambient temperatures and sends a current command to the current source 20 based on the allowable temperature rise value. The current source 20 adjusts the current output to the circuit board 50 according to the current command, for example, by increasing the output current. The second temperature detection device 40 continues to detect the temperature of the target temperature rise area and outputs a temperature alert to the electronic device 10 when the temperature of the target temperature rise area reaches the allowable temperature rise value. Based on temperature readings, electronic device 10 acquires the current currently output by current source 20 (referred to as "second current" for ease of description). Electronic device 10 then determines the current-carrying capacity of circuit board 50 under the current wiring design based on environmental information, allowable temperature rise, and the second current.

[0037] This application uses a first temperature detection device 30 to obtain the target temperature rise area of ​​the circuit board 50, and then uses a second temperature detection device 40 to obtain the temperature of the target temperature rise area. Data acquisition is triggered when the temperature of the target temperature rise area reaches the allowable temperature rise value, which improves the accuracy of data acquisition and thus the accuracy of current carrying capacity analysis. Furthermore, this application determines the current carrying capacity of the circuit board 50 based on the ambient temperature, the allowable temperature rise value, and the second current, avoiding the use of general design standards to estimate the current carrying capacity, thereby improving the accuracy of current carrying capacity analysis. In the embodiments of this application, the first temperature detection device 30 and the second temperature detection device 40 respectively implement different detection functions and have different detection accuracies. In this application, the detection accuracy of the first temperature detection device 30 is higher than the precision measurement accuracy of the second temperature detection device 40. The first temperature detection device 30 quickly locates the target temperature rise area, and the second temperature detection device 40 accurately detects the temperature of the target temperature rise area to accurately determine the current carrying capacity of the circuit board 50.

[0038] In one embodiment provided in this application, the second temperature detection device 40 includes a plurality of thermocouples. These thermocouples can be pre-positioned at different locations on the circuit board to be tested, enabling temperature detection at different locations on the circuit board. After the first temperature detection device 30 determines the target temperature rise area, temperature detection of target points within that area can be achieved using thermocouples positioned within that target temperature rise area. Specifically, the electronic device 10 can directly read the data detected by different thermocouples to obtain accurate temperature information at different locations.

[0039] Figure 2 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application. Figure 2 As shown, the electronic device 10 includes a memory 11, one or more processors 12, at least one communication bus 13, and a battery pack 14. The one or more processors 12 implement a current carrying capacity determination method when executing a computer program stored in the memory 11.

[0040] Figure 2 The illustrated structure of the electronic device does not constitute a limitation on the embodiments of this application. The electronic device 10 may also include more or fewer other hardware or software, or different component arrangements than those shown. For example, the electronic device 10 may also include multiple interfaces. For example, a first interface is used to connect a load to supply power to the load, and a second interface is used to connect an independent battery pack to increase the capacity of the electronic device.

[0041] In some embodiments, the electronic device 10 may also connect to a client device, which includes, but is not limited to, any electronic product that can interact with the user via a keyboard, mouse, remote control, touchpad, or voice control device, such as a personal computer, tablet computer, smartphone, digital camera, etc.

[0042] It should be noted that electronic device 10 is only an example. Other existing or future electronic products that are suitable for this application should also be included within the scope of protection of this application and are incorporated herein by reference.

[0043] In some embodiments, at least one communication bus 13 is configured to enable communication between the memory 11 and at least one processor 12, etc.

[0044] In some embodiments, the electronic device 10 may further include a battery pack 14 that powers various components. The battery pack 14 may be logically connected to at least one processor 12 via a power management device (not shown), thereby enabling functions such as charging, discharging, and power consumption management through the power management device. The electronic device 10 may also include one or more DC or AC power supplies, recharging devices, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The electronic device 10 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0045] Figure 3 This is a flowchart illustrating a current-carrying capacity determination method provided in one embodiment of this application. The current-carrying capacity determination method is applied to electronic devices (such as...). Figure 1 Electronic devices 10). Figure 3 As shown, the method for determining current carrying capacity includes the following steps: S11 controls the current source to output the first current to the circuit board.

[0046] In some embodiments, the current source 20 may be an active electronic device or circuit capable of outputting different current values, the output current of which is substantially unaffected by changes in load impedance or output voltage under specific operating conditions. The current source 20 is connected to the circuit board 50 to output different current values ​​to the circuit board 50.

[0047] In some embodiments, when it is necessary to determine the current-carrying capacity of the circuit board 50, the electronic device 10 controls the current source 20 to output a first current to the circuit board 50. The first current may represent a small current output by the current source 20 to the circuit board 50 at the beginning of the current-carrying capacity analysis test of the circuit board 50. As time goes on, the current output by the current source 20 to the circuit board 50 gradually increases.

[0048] In some embodiments, the first current is related to the cross-sectional area of ​​the conductor; different cross-sectional areas of the conductor correspond to different first currents. As mentioned above, the circuit board 40 includes an insulating substrate and conductors formed thereon, which may have the same and / or different cross-sectional areas. Taking conductors on the same circuit board 50 having different cross-sectional areas as an example, the electronic device 10 controls the current source 20 to output a first current to the circuit board 50, which may include: the electronic device 10 controls the current source 20 to output corresponding first currents to conductors with different cross-sectional areas in the circuit board 50, and the first currents corresponding to conductors with different cross-sectional areas are different. By controlling the current source 20 to output corresponding first currents to conductors with different cross-sectional areas in the specific layout design of the circuit board 50, the embodiments of this application can realize the measurement of the current carrying capacity of conductors with different cross-sectional areas in the circuit board, thereby improving the efficiency of current carrying capacity analysis.

[0049] S12, the target temperature rise area of ​​the circuit board under the first current is obtained through the first temperature detection device.

[0050] In some embodiments, the first temperature detection device 30 may be a device capable of sensing temperature information of the circuit board 50. The first temperature detection device 30 can acquire the temperature information of the circuit board 50 in a non-contact manner; for example, the first temperature detection device 30 may include an infrared thermal imager. The infrared thermal imager can acquire the temperature distribution information of the entire surface of the circuit board 50 in real time, generating a visualized thermal field image.

[0051] In some embodiments, if the circuit board 50 includes multiple conductors, the temperature distribution information may include spatial temperature variation information for each conductor in the circuit board 50. Based on the temperature distribution information, the location with the highest temperature and the location with the lowest temperature can be determined from each conductor. The location with the highest temperature in the conductor is called a hot spot, and the area containing the hot spot is selected from each conductor as the target temperature rise area.

[0052] S13, the ambient temperature of the target temperature rise area is obtained through the second temperature detection device.

[0053] In some embodiments, the second temperature detection device 40 may be another device capable of sensing temperature information of the circuit board 50. The second temperature detection device 40 can acquire the temperature information of the circuit board 50 by contact. The second temperature detection device 40 may include a thermocouple device that can quickly and accurately determine the temperature of the corresponding temperature sensing point on the circuit board 50.

[0054] In some embodiments, after the first temperature detection device 30 acquires the target temperature rise area of ​​the conductors in the circuit board 50, it makes thermal contact with a designated location on the circuit board 50 (hereinafter referred to as the "circuit board location" for ease of description) based on the target temperature rise area. The second temperature detection device 40 can determine the ambient temperature by detecting the temperature of the circuit board location. To avoid the influence of conductor temperature on the accuracy of ambient temperature acquisition, the circuit board location should be as far away from the target temperature rise area as possible. The ambient temperature can represent the temperature of the medium surrounding the circuit board 50.

[0055] S14: Obtain the allowable temperature rise value of the circuit board under ambient temperature, and control the output current of the current source according to the allowable temperature rise value.

[0056] In some embodiments, after the first temperature detection device 30 obtains the target temperature rise area of ​​the wires in the circuit board 50, the second temperature detection device 40 makes thermal contact with the target temperature rise area and detects the temperature of the target temperature rise area through the second temperature detection device 40.

[0057] In some embodiments, according to Joule's law, the greater the current flowing through a conductor, the faster the conductor's temperature rises. After obtaining the allowable temperature rise value of the circuit board 50 at ambient temperature, if the second temperature detection device 40 detects that the temperature of the target temperature rise area has not reached the allowable temperature rise value, it can control the current source 20 to increase the output current, so that the temperature of the target temperature rise area continues to rise.

[0058] The allowable temperature rise value can represent the maximum safe limit that the temperature of the wires in the circuit board 50 is allowed to rise relative to the ambient temperature, which can be preset. The allowable temperature rise value can include, but is not limited to, 10 degrees Celsius, 20 degrees Celsius and 30 degrees Celsius.

[0059] S15, when the second temperature detection device detects that the temperature of the target temperature rise area has reached the allowable temperature rise value, the second current output by the current source is acquired.

[0060] In some embodiments, the second temperature detection device 40 can detect the temperature of the target temperature rise area in real time. When the second temperature detection device 40 detects that the temperature of the target temperature rise area has reached the allowable temperature rise value, the electronic device 10 acquires the current value output by the current source 20 at the moment when the temperature of the target temperature rise area reaches the allowable temperature rise value as the second current. The target temperature rise area reaching the allowable temperature rise value can mean that the temperature difference between the temperature of the target temperature rise area and the ambient temperature has reached the allowable temperature rise value. For example, if the current ambient temperature is 20°C and the allowable temperature rise value is 10°C, then when the second temperature detection device 40 detects that the temperature of the target temperature rise area has reached 30°C, it is determined that the temperature of the target temperature rise area has reached the allowable temperature rise value. If, during the detection process, the current ambient temperature changes from 20°C to 23°C, then when the second temperature detection device 40 detects that the temperature of the target temperature rise area has reached 33°C, it is determined that the temperature of the target temperature rise area has reached the allowable temperature rise value.

[0061] S16, determine the current carrying capacity of the circuit board based on the ambient temperature, allowable temperature rise, and second current.

[0062] In some embodiments, current-carrying capacity can represent the maximum current that a conductor can carry at a specific ambient temperature, not exceeding the allowable temperature rise value. Since the second current is collected when the temperature in the target temperature rise region reaches the allowable temperature rise value, it is essentially the maximum current that the conductor can carry at ambient temperature, not exceeding the allowable temperature rise value. Therefore, the second current value can be used as the current-carrying capacity of the circuit board 50 at ambient temperature, corresponding to the allowable temperature rise value.

[0063] The current-carrying capacity determination method provided in this application combines a current source 20, a first temperature detection device 30, and a second temperature detection device 40 to determine the current-carrying capacity of the PCB board. Specifically, the first temperature detection device 30 quickly obtains the target temperature rise area of ​​the circuit board 50 under a first current, and then the second temperature detection device 40 accurately obtains the temperature of the target temperature rise area. Data acquisition is triggered when the temperature of the target temperature rise area reaches the allowable temperature rise value, which improves the accuracy of data acquisition and thus the accuracy of current-carrying capacity analysis. Furthermore, this application determines the current-carrying capacity of the circuit board 50 based on ambient temperature, allowable temperature rise value, and second current, avoiding the use of general design standards to estimate current-carrying capacity, thereby improving the accuracy of current-carrying capacity analysis.

[0064] In some embodiments, the first current can be determined based on the cross-sectional area of ​​the conductors in the circuit board 50. For example, the larger the cross-sectional area of ​​the conductor, the larger the first current; the smaller the cross-sectional area of ​​the conductor, the smaller the first current. The cross-sectional area of ​​the conductor can be determined based on the conductor's thickness and width information. Please refer to [link to relevant documentation]. Figure 4 , Figure 4 This is a flowchart illustrating a first current determination method provided in one embodiment of this application. Figure 4 As shown, it includes the following steps: S21, Obtain the thickness and width information of the conductors in the circuit board.

[0065] In some embodiments, the thickness information of the conductor may represent the dimension of the conductor in the direction perpendicular to the surface of the insulating substrate of the circuit board 50, and the width information may represent the lateral dimension of the conductor in the direction parallel to the surface of the insulating substrate.

[0066] S22, Determine the cross-sectional area of ​​the conductor based on the thickness and width information.

[0067] In some embodiments, the cross-sectional area of ​​the conductor can be determined based on the product of thickness information and width information.

[0068] S23, based on the cross-sectional area, controls the current source to output the first current to the circuit board.

[0069] In some embodiments, a correspondence between the cross-sectional area of ​​a conductor and a first current is preset, and the first current corresponding to the cross-sectional area can be determined by querying this correspondence.

[0070] In other embodiments, a preset model is pre-trained. The input data of the preset model is the cross-sectional area of ​​the wire, and the output data is the first current. The preset model may include, but is not limited to, convolutional neural network models such as LeNet-5, AlexNet, VGGNet, ResNet, and Inception, or supervised learning models such as support vector machines. This application does not impose any restrictions on this.

[0071] This embodiment determines the required current information for the conductor in the initial stage of the current-carrying capacity analysis test based on the conductor's cross-sectional area, thereby controlling the current source 20 to output the first current to the circuit board 50. This embodiment enables the circuit board 50 to be effectively activated from its initial state and gradually enter a stable working state, thereby improving the accuracy and continuity of subsequent data measurements and enhancing the accuracy of the current-carrying capacity analysis.

[0072] In some embodiments, the first temperature detection device 30 can acquire temperature distribution information across the entire surface of the circuit board 50 in a non-contact manner, generating a visualized thermal field image. See also... Figure 5 , Figure 5 This is a flowchart illustrating a method for determining a target temperature rise region according to an embodiment of this application. Figure 5 As shown, it includes the following steps: S31, the temperature distribution information of the wires in the circuit board is monitored by the first temperature detection device.

[0073] In some embodiments, the temperature distribution information can represent a quantifiable map of the surface thermal state of the circuit board 50. If the circuit board 50 includes multiple conductors, the temperature distribution information can include spatial variations in the temperature of each conductor in the circuit board 50.

[0074] S32. Based on the temperature distribution information, select the area containing hot spots from the conductor as the target temperature rise area. Hot spots represent the locations with the highest temperatures in the conductor.

[0075] In some embodiments, based on temperature distribution information, the location with the highest temperature and the location with the lowest temperature can be determined from each conductor. The location with the highest temperature in the conductor is called a hot spot, and the area containing the hot spot is selected from each conductor as the target temperature rise area. Thus, when there are multiple conductors on the circuit board 50, there are also multiple target temperature rise areas.

[0076] This embodiment of the application monitors the temperature distribution information of the conductors in the circuit board 50 using a first temperature detection device 30, determines the target temperature rise area of ​​the conductors, and can locate the extreme position of the temperature rise caused by the Joule heating effect, thereby accurately identifying potential failure risk points and guiding the optimization of conductor layout, heat dissipation enhancement, and reliability design under harsh conditions. This embodiment of the application, by monitoring the temperature distribution information of the conductors in the circuit board 50 using the first temperature detection device 30, can quickly and intuitively locate the point with the highest conductor temperature on the surface of the circuit board 50.

[0077] In some embodiments, ambient temperature may represent the temperature of the surrounding medium in which the circuit board 50 is located. See also Figure 6 , Figure 6This is a schematic flowchart of an embodiment of the method for determining ambient temperature provided in this application. Figure 6 As shown, it includes the following steps: S41, Obtain the circuit board position in the circuit board. The circuit board position represents the position where the distance from the target temperature rise area is greater than or equal to the spacing threshold.

[0078] In some embodiments, the circuit board location represents the location where ambient temperature data is collected. The target temperature rise area refers to the area containing hot spots selected from the conductor. The closer to the target temperature rise area, the greater the influence of the conductor temperature on the ambient temperature; the farther away from the target temperature rise area, the less the influence of the conductor temperature on the ambient temperature. Based on this, to improve the accuracy of ambient temperature monitoring, the circuit board needs to be positioned at a distance greater than or equal to a spacing threshold from the target temperature rise area. The spacing threshold can be determined according to the size of the circuit board; for example, the spacing threshold can be 10 cm, 8 cm, etc., and is not limited here.

[0079] S42, the ambient temperature is obtained by acquiring the temperature corresponding to the location of the circuit board through the second temperature detection device.

[0080] In some embodiments, after determining the position of the circuit board in the circuit board 50, the second temperature detection device 40 is brought into thermal contact with the circuit board 50, and the temperature at the position of the circuit board is monitored by the second temperature detection device 40 as the ambient temperature.

[0081] In this embodiment, the target temperature rise area of ​​the circuit board 50 is obtained by the first temperature detection device 30, and a location at a distance greater than or equal to a spacing threshold is selected as the monitoring location for the ambient temperature. This reduces the influence of wire temperature on the ambient temperature detection and improves the accuracy of the ambient temperature detection. In other embodiments of this application, the ambient temperature is obtained by the second temperature detection device 40 through thermal contact with the circuit board 50, which further improves the accuracy of the ambient temperature determination.

[0082] In some embodiments, it is considered that the greater the current flowing through the wires in the circuit board 50, the higher the temperature rise of the wires. Based on this, after obtaining the allowable temperature rise value of the circuit board 50 at ambient temperature, controlling the output current of the current source 20 according to the allowable temperature rise value may include: controlling the current source 20 to increase the output current by a preset step size.

[0083] The preset step size can be set according to actual needs and is not limited here. The preset step size can be a fixed value or dynamically set according to the conductor's temperature rise rate. The temperature rise rate represents the change in conductor temperature per unit time, calculated as the ratio of the change in conductor temperature to the set continuous time interval. A larger temperature rise rate indicates a faster temperature rise in the conductor; a smaller temperature rise rate indicates a slower temperature rise in the conductor.

[0084] For example, when the temperature rise rate of the conductor is less than a rate threshold, a preset step size is set to a first value. When the temperature rise rate of the conductor is greater than or equal to the rate threshold, a preset step size is set to a second value, which is less than the first value. The rate threshold can be set according to actual needs and is not limited here.

[0085] This application embodiment sets the preset step size to a dynamic value, dynamically adjusting the preset step size based on the temperature rise rate of the conductor. When the temperature rise rate is low, a larger preset step size is used to increase the output current, allowing the conductor temperature to reach the allowable temperature rise value more quickly. When the temperature rise rate is high, a smaller preset step size is used to increase the output current until the conductor temperature reaches the allowable temperature rise value, improving the precision of current control and thus enhancing the accuracy of current acquisition.

[0086] In some embodiments, when the second temperature detection device 40 detects that the temperature of the target temperature rise region has reached the allowable temperature rise value, the electronic device 10 acquires the current value output by the current source 20 at the moment when the temperature of the target temperature rise region reaches the allowable temperature rise value as the second current. Please refer to [link to relevant documentation]. Figure 7 , Figure 7 This is a schematic flowchart of a second current acquisition method provided in one embodiment of this application. Figure 7 As shown, it includes the following steps: S51, the temperature of the target temperature rise area is obtained through the second temperature detection device.

[0087] In some embodiments, the second temperature detection device 40 can detect the temperature of the target temperature rise area in real time.

[0088] S52, when the temperature difference between the target temperature rise area and the ambient temperature reaches the allowable temperature rise value, acquire the second current output by the current source.

[0089] In some embodiments, when the second temperature detection device 40 detects that the temperature difference between the target temperature rise area and the ambient temperature reaches an allowable temperature rise value, it outputs a temperature alert to the electronic device 10. This temperature alert indicates that the temperature of the target temperature rise area has reached the allowable temperature rise value, and may include a target timestamp indicating that the temperature of the target temperature rise area has reached the allowable temperature rise value. Upon receiving the temperature alert, the electronic device 10 acquires the current output by the current source 20 at the target timestamp (hereinafter referred to as the "second current" for ease of description).

[0090] In this embodiment of the application, when the second temperature detection device 40 detects that the temperature of the target temperature rise area has reached the allowable temperature rise value, it promptly acquires the second current output by the current source 20. By analyzing the second current, the current carrying capacity of the conductor can be accurately evaluated.

[0091] In some embodiments, the temperature of the target temperature rise region includes the outer conductor temperature, which can represent the temperature of the conductor's surface exposed to ambient air. The method for determining the outer conductor temperature includes: monitoring the surface temperature of the conductor in the target temperature rise region of the circuit board 50 using a second temperature detection device 40 to obtain the outer conductor temperature.

[0092] By bringing the second temperature detection device 40 into thermal contact with the outer surface of the conductor, and by monitoring the surface temperature of the conductor in the target temperature rise area through the second temperature detection device 40, the temperature of the outer conductor can be obtained.

[0093] In this embodiment, the temperature of the outer conductor of the conductor is detected by the second temperature detection device 40. By analyzing the temperature of the outer conductor, the surface safety compliance of the conductor in the actual application environment can be verified, so that the conductor can meet the safety standards and temperature requirements.

[0094] In some embodiments, the temperature of the target temperature rise region also includes the inner layer conductor temperature, which can represent the temperature of the conductor being encased in an insulating medium and located inside the circuit board 50. The target temperature rise region of the conductor in the circuit board 50 is provided with vias, and the method for determining the inner layer conductor temperature includes: monitoring the temperature of the vias using a second temperature detection device 40 to obtain the inner layer conductor temperature.

[0095] A via is set in the target temperature rise area of ​​the conductor, and the second temperature detection device 40 is brought into thermal contact with the via. By monitoring the temperature of the via through the second temperature detection device 40, the temperature of the inner conductor can be obtained.

[0096] This application uses a second temperature detection device 40 to detect the temperature of the inner conductor of the conductor. By analyzing the temperature of the inner conductor, the internal heat accumulation effect caused by the insulation wrapping of the conductor can be determined, and the true operating temperature of the conductor itself can be obtained, thus providing a key basis for evaluating the current carrying capacity of the conductor.

[0097] In some embodiments, determining the current-carrying capacity of the circuit board based on the ambient temperature, the allowable temperature rise value, and the second current includes: determining the current-carrying capacity of the circuit board 50 at the ambient temperature corresponding to the allowable temperature rise value based on the second current. For example, the second current value can be used as the current-carrying capacity of the circuit board 50 at the ambient temperature corresponding to the allowable temperature rise value.

[0098] As mentioned above, the temperature of the target temperature rise region includes the temperature of the outer layer conductors and the temperature of the inner layer conductors. Therefore, the current-carrying capacity of the conductors in circuit board 50 can include the current-carrying capacity of the outer layer conductors (hereinafter referred to as "outer layer current-carrying capacity" for ease of description) and the current-carrying capacity of the inner layer conductors (hereinafter referred to as "inner layer current-carrying capacity" for ease of description), and the current-carrying capacity of the outer layer conductors is different from that of the inner layer conductors. This application, by performing a current-carrying capacity determination method, is able to measure the current-carrying capacity of the outer layer conductors and the current-carrying capacity of the inner layer conductors corresponding to each conductor.

[0099] As shown in Tables 1 and 2, Table 1 presents outer layer current-carrying data for conductors with different cross-sectional areas under ambient temperature and corresponding to different allowable temperature rise values, collected in one embodiment of this application. Table 2 presents inner layer current-carrying data for conductors with different cross-sectional areas under ambient temperature and corresponding to different allowable temperature rise values, collected in one embodiment of this application. It is assumed that the conductors selected in this application have the same thickness but different widths. Tables 1 and 2 use five conductors with different cross-sectional areas as an example; in actual analysis, the number of conductors can be more, for example, 30, 40, or 50, and is not limited here.

[0100] Table 1: Outer current carrying capacity data of conductors with different cross-sectional areas at ambient temperature, corresponding to different allowable temperature rise values. According to Table 1, when the conductor width is 1 mm, its outer layer current carrying capacity is 2.86 A with an allowable temperature rise of 10 degrees Celsius at an ambient temperature of 25.69 degrees Celsius, and 4.03 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 2 mm, its outer layer current carrying capacity is 4.25 A with an allowable temperature rise of 10 degrees Celsius at an ambient temperature of 26.1 degrees Celsius, and 5.95 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 3 mm, its outer layer current carrying capacity is 5.22 A with an allowable temperature rise of 10 degrees Celsius at an ambient temperature of 26.29 degrees Celsius, and 7.45 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 4 mm, at an ambient temperature of 26.92 degrees Celsius, its outer layer current carrying capacity is 6.25 A with an allowable temperature rise of 10 degrees Celsius, and 8.59 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 5 mm, at an ambient temperature of 26.82 degrees Celsius, its outer layer current carrying capacity is 6.9 A with an allowable temperature rise of 10 degrees Celsius, and 9.75 A with an allowable temperature rise of 20 degrees Celsius.

[0101] According to Table 2, when the conductor width is 1 mm, at an ambient temperature of 26.34 degrees Celsius, its inner layer current carrying capacity is 2.32 A with an allowable temperature rise of 10 degrees Celsius, and 3.23 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 2 mm, at an ambient temperature of 25.79 degrees Celsius, its inner layer current carrying capacity is 3.25 A with an allowable temperature rise of 10 degrees Celsius, and 4.59 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 3 mm, at an ambient temperature of 25.66 degrees Celsius, its inner layer current carrying capacity is 4.09 A with an allowable temperature rise of 10 degrees Celsius, and 5.84 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 4 mm, at an ambient temperature of 25.32 degrees Celsius, its inner layer current carrying capacity is 5.06 A with an allowable temperature rise of 10 degrees Celsius, and 7.21 A with an allowable temperature rise of 20 degrees Celsius. When the conductor width is 5 mm, at an ambient temperature of 25.8 degrees Celsius, its inner layer current carrying capacity is 5.86 A with an allowable temperature rise of 10 degrees Celsius, and 8.27 A with an allowable temperature rise of 20 degrees Celsius.

[0102] In this embodiment, when the temperature of the target temperature rise area of ​​the circuit board 50 reaches the allowable temperature rise value, the second current output by the current source 20 to the circuit board 50 is determined. This can determine the current carrying capacity of the circuit board 50 at the ambient temperature corresponding to the allowable temperature rise value, avoid using general design standards to estimate the current carrying capacity, and improve the accuracy of the current carrying capacity analysis.

[0103] In some embodiments, by analyzing the cross-sectional area, allowable temperature rise, and second current of the conductor, a preset calculation method can be adjusted to obtain a target calculation method, thereby determining the current-carrying capacity of the conductor under test at the corresponding ambient temperature using the target calculation method. Please refer to [link to relevant documentation]. Figure 8 , Figure 8 This is a flowchart illustrating a method for determining a target computation method according to an embodiment of this application. Figure 8 As shown, it includes the following steps: S61, obtain the cross-sectional area of ​​the wires in the circuit board.

[0104] S62 determines the target calculation method for the corresponding ambient temperature of the circuit board based on the cross-sectional area, allowable temperature rise value and second current using a preset calculation method.

[0105] In some embodiments, the preset calculation formula may be as shown in Formula 1: Formula 1: .

[0106] Where I represents the second current, The value represents the allowable temperature rise, W represents the wire width, H represents the wire thickness, C is a preset value (e.g., C is 0.75), and K represents the correction factor to be measured.

[0107] According to Formula 1, all data except K are known. The correction coefficient K can be determined through nonlinear regression based on the conductor's cross-sectional area, allowable temperature rise, and second current. For example, using the allowable temperature rise and cross-sectional area of ​​conductors with different cross-sectional areas in Table 1 as input data and the second current as output data, Formula 1 can be used to determine the value of the correction coefficient K. A preset calculation method with known correction coefficient K values ​​is used as the target calculation method to determine the outer current-carrying capacity of the conductor under test. For another example, using the allowable temperature rise and cross-sectional area of ​​conductors with different cross-sectional areas in Table 2 as input data and the second current as output data, Formula 1 can be used to determine the value of the correction coefficient K. A preset calculation method with known correction coefficient K values ​​is used as the target calculation method to determine the inner current-carrying capacity of the conductor under test. The correction coefficient K is different for the target calculation method used to determine the outer current-carrying capacity and the target calculation method used to determine the inner current-carrying capacity.

[0108] Please refer to the following: Figure 9 and Figure 10 , Figure 9 This is a scatter plot showing the relationship between the outer layer current-carrying capacity and cross-sectional area under different allowable temperature rise values, according to one embodiment of this application. Figure 10 This is a scatter plot showing the relationship between the inner layer's current-carrying capacity and cross-sectional area under different allowable temperature rise values, according to one embodiment of this application. Figure 9 and 10 As shown, the allowable temperature rise values ​​include 10 degrees Celsius, 20 degrees Celsius, and 30 degrees Celsius. The horizontal axis represents the cross-sectional area of ​​the conductor, and the vertical axis represents the current-carrying capacity of the conductor. Under the same allowable temperature rise, the larger the cross-sectional area of ​​the conductor, the stronger its current-carrying capacity.

[0109] S63 uses a target calculation method to determine the current carrying capacity of the circuit board under test at the corresponding ambient temperature.

[0110] In some embodiments, for a circuit board with unknown current carrying capacity (hereinafter referred to as "the circuit board under test" for ease of description), the cross-sectional area of ​​the conductors in the circuit board (hereinafter referred to as "target cross-sectional area"), the allowable temperature rise value (hereinafter referred to as "target allowable temperature rise value") and the ambient temperature can be obtained, and Formula 1 can be used to determine the current carrying capacity of the conductors in the circuit board.

[0111] This application embodiment determines the correction coefficient in the preset calculation formula by using nonlinear regression based on the cross-sectional area of ​​the conductor, the allowable temperature rise value, and the second current. The preset calculation formula with known correction coefficients is used as the target calculation method, so that the current carrying capacity of the circuit board under test can be determined by the target calculation method, thereby improving the convenience and accuracy of current carrying capacity determination.

[0112] Please see Figure 11 , Figure 11 This is a flowchart illustrating a method for determining the current carrying capacity of a circuit board under test according to an embodiment of this application, as shown below. Figure 11 As shown, it includes the following steps: S71, obtain the target allowable temperature rise value of the circuit board under test at ambient temperature.

[0113] In some embodiments, the circuit board under test (PCB) may refer to a circuit board whose current-carrying capacity needs to be measured. The target allowable temperature rise of the PCB varies with different ambient temperatures; the higher the ambient temperature, the smaller the target allowable temperature rise, and the lower the ambient temperature, the larger the target allowable temperature rise.

[0114] S72, based on the target cross-sectional area and target allowable temperature rise of the circuit board under test, uses the target calculation method to determine the current carrying capacity of the circuit board under test at the corresponding ambient temperature.

[0115] In some embodiments, the target cross-sectional area and target allowable temperature rise of the conductors in the circuit board under test are used as input data for the target calculation method. The calculated current result is used as the current carrying capacity of the conductors in the circuit board under test at the corresponding ambient temperature through the target calculation method.

[0116] This application embodiment obtains the target cross-sectional area, target allowable temperature rise value and ambient temperature of the circuit board under test. The current carrying capacity of the circuit board under test can be determined by the target calculation method, which improves the convenience and accuracy of current carrying capacity determination.

[0117] Please see Figure 12 , Figure 12 This is a schematic diagram of a current carrying capacity determination device provided in one embodiment of this application. In some embodiments, the current carrying capacity determination device 100 may include multiple functional modules composed of computer program segments. The computer programs of each program segment in the current carrying capacity determination device 100 may be stored in the memory of an electronic device and executed by at least one processor to perform (see details). Figure 3 (Description) Function for determining current carrying capacity.

[0118] In some embodiments, the current carrying capacity determination device 100 can be divided into multiple functional modules according to the functions it performs. The functional modules may include: a current control module 101, a temperature rise acquisition module 102, an ambient temperature acquisition module 103, a current acquisition module 104, and a current carrying capacity determination module 105. As used in this application, a module refers to a series of computer program segments that can be executed by at least one processor and perform a fixed function, and which are stored in memory. In this embodiment, the functions of each module will be described in detail in subsequent embodiments.

[0119] The current control module 101 can be used to control the current source to output the first current to the circuit board.

[0120] The temperature rise acquisition module 102 can be used to acquire the target temperature rise area of ​​the circuit board under the first current through the first temperature detection device.

[0121] The ambient temperature acquisition module 103 can be used to acquire the ambient temperature of the target temperature rise area through a second temperature detection device.

[0122] The current control module 101 can also be used to obtain the allowable temperature rise value of the circuit board at ambient temperature, and control the output current of the current source according to the allowable temperature rise value.

[0123] The current acquisition module 104 can be used to acquire the second current output by the current source when the second temperature detection device detects that the temperature of the target temperature rise area has reached the allowable temperature rise value.

[0124] The current carrying capacity determination module 105 can be used to determine the current carrying capacity of a circuit board based on ambient temperature, allowable temperature rise, and second current.

[0125] It is understood that the current carrying capacity determination device 100 and the current carrying capacity determination method of the above embodiments belong to the same inventive concept. The specific implementation of each module of the current carrying capacity determination device 100 corresponds to each step of the current carrying capacity determination method in the above embodiments, and will not be repeated here.

[0126] The module division described above is a logical functional division, and other division methods may be used in actual implementation. Furthermore, the functional modules in the various embodiments of this application can be integrated into the same processing unit, or each module can exist physically separately, or two or more modules can be integrated into the same unit. The integrated modules described above can be implemented in hardware or in a combination of hardware and software functional modules.

[0127] then Figure 1In some embodiments, electronic device 10 is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits, programmable gate arrays, digital processors, and embedded devices.

[0128] Although not shown, the power source connected to the electronic device 10 may include one or more DC or AC power sources, recharging devices, power failure detection circuits, power converters or inverters, power status indicators, and other components. The electronic device 10 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0129] In some embodiments, the memory 11 stores a computer program that, when executed by at least one processor 12, implements all or part of the steps in the current carrying capacity determination method. The memory 11 includes read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically-erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0130] In some embodiments, this application provides a computer-readable storage medium storing a computer program that, when executed by processor 12, implements the aforementioned current carrying capacity determination method. The computer-readable storage medium may primarily include a program storage area and a data storage area. The program storage area may store an operating system, at least one application program required for a function, etc.; the data storage area may store data created based on the use of electronic device 10, etc.

[0131] In some embodiments, at least one processor 12 is the control unit of the electronic device 10, connecting various components of the electronic device 10 via various interfaces and lines. It executes programs or modules stored in the memory 11 and calls data stored in the memory 11 to perform various functions and process data. For example, when at least one processor 12 executes a computer program stored in the memory, it implements all or part of the steps of the current carrying capacity determination method in the embodiments of this application; or it implements all or part of the functions of the current carrying capacity determination device. At least one processor 12 may be composed of integrated circuits, such as a single-packaged integrated circuit or multiple integrated circuits with the same or different functions, including combinations of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips.

[0132] The integrated unit implemented as a software functional module described above can be stored in a computer-readable storage medium. This software functional module, stored in a storage medium, includes several instructions to cause an electronic device (which may be a personal computer, electronic device, or network device, etc.) or processor to execute portions of the methods of the various embodiments of this application.

[0133] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and other division methods may be used in actual implementation.

[0134] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0135] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0136] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other elements or, and the singular does not exclude the plural. Multiple elements or devices recited in the specification may also be implemented by a single element or device through software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A method for determining current-carrying capacity, characterized in that, The method includes: Control the current source to output the first current to the circuit board; The target temperature rise area of ​​the circuit board under the first current is obtained by the first temperature detection device. The ambient temperature of the target temperature rise area is obtained by a second temperature detection device. Obtain the allowable temperature rise value of the circuit board at the ambient temperature, and control the output current of the current source according to the allowable temperature rise value; When the second temperature detection device detects that the temperature of the target temperature rise area has reached the allowable temperature rise value, the second current output by the current source is acquired; The current-carrying capacity of the circuit board is determined based on the ambient temperature, the allowable temperature rise value, and the second current.

2. The method for determining current carrying capacity as described in claim 1, characterized in that, The control current source outputs a first current to the circuit board, including: Obtain the thickness and width information of the conductors in the circuit board; Based on the thickness information and the width information, the cross-sectional area of ​​the conductor is determined; Based on the cross-sectional area, the current source is controlled to output the first current to the circuit board.

3. The method for determining current carrying capacity as described in claim 1, characterized in that, The step of obtaining the target temperature rise area of ​​the circuit board under the first current through the first temperature detection device includes: The temperature distribution information of the wires in the circuit board is monitored by the first temperature detection device; Based on the temperature distribution information, a region containing hot spots is selected from the conductor as the target temperature rise region, where the hot spot represents the location point with the highest temperature in the conductor.

4. The method for determining current carrying capacity as described in claim 1, characterized in that, The step of obtaining the ambient temperature of the target temperature rise area through the second temperature detection device includes: The circuit board position in the circuit board is obtained, and the circuit board position represents the position where the distance from the target temperature rise area is greater than or equal to a spacing threshold. The ambient temperature is obtained by using the second temperature detection device to acquire the temperature corresponding to the location of the circuit board.

5. The method for determining current carrying capacity as described in claim 1, characterized in that, When the second temperature detection device detects that the temperature of the target temperature rise region has reached the allowable temperature rise value, acquiring the second current output by the current source includes: The temperature of the target temperature rise region is obtained through the second temperature detection device; When the temperature difference between the temperature corresponding to the target temperature rise region and the ambient temperature reaches the allowable temperature rise value, the second current output by the current source is obtained.

6. The method for determining current carrying capacity as described in claim 1, characterized in that, The temperature of the target temperature rise region includes the temperature of the outer conductor, and the method for determining the temperature of the outer conductor includes: The surface temperature of the conductors in the circuit board in the target temperature rise area is monitored by the second temperature detection device to obtain the temperature of the outer conductor.

7. The method for determining current carrying capacity as described in claim 1, characterized in that, The temperature of the target temperature rise region also includes the temperature of the inner layer conductors. The target temperature rise region of the conductors in the circuit board is provided with vias. The method for determining the temperature of the inner layer conductors includes: The temperature of the via is monitored by the second temperature detection device to obtain the temperature of the inner layer conductor.

8. The method for determining current carrying capacity as described in claim 1, characterized in that, The method further includes: Obtain the cross-sectional area of ​​the conductors in the circuit board; Based on the cross-sectional area, the allowable temperature rise value, and the second current, a target calculation method corresponding to the ambient temperature is determined using a preset calculation method. Using the target calculation method, the current carrying capacity of the circuit board under test corresponding to the ambient temperature is determined.

9. The method for determining current carrying capacity as described in claim 8, characterized in that, The step of determining the current-carrying capacity of the circuit board under test at the ambient temperature using the target calculation method includes: Obtain the target allowable temperature rise value of the circuit board under test at the ambient temperature; Based on the target cross-sectional area of ​​the circuit board under test and the target allowable temperature rise value, the current carrying capacity of the circuit board under test corresponding to the ambient temperature is determined using the target calculation method.

10. An electronic device, characterized in that, The electronic device includes a processor and a memory, wherein the processor is used to execute a computer program stored in the memory to implement the current carrying capacity determination method as described in any one of claims 1 to 9.

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