Temperature-controlled slide stage and semiconductor probe station

Abstract

The application discloses a heat preservation type temperature control wafer table and a semiconductor probe table, and relates to the technical field of semiconductor testing equipment. The heat preservation type temperature control wafer table comprises a wafer heating disc used for carrying and heating a semiconductor plate, a wafer base, a ring-shaped heat preservation part vertically arranged on the wafer base, and an airflow guide cap. The ring-shaped heat preservation part is used for arranging the wafer heating disc, and the wafer heating disc is arranged outside the ring-shaped heat preservation part. The airflow guide cap, the ring-shaped heat preservation part, the wafer base and the wafer heating disc cooperatively form a heat flow microcirculation space. The heat preservation type temperature control wafer table and the semiconductor probe table are beneficial to the balanced distribution of temperature and the improvement of detection quality and detection efficiency.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor testing equipment, and in particular to a heat-insulated temperature-controlled wafer stage and a semiconductor probe stage. Background Technology

[0002] To ensure product quality, in semiconductor manufacturing, semiconductor boards need to be placed on a wafer carrier stage. The wafer carrier stage then heats the semiconductor board to a set temperature, and then powers on the chips on the semiconductor board and performs tests.

[0003] The wafer stage is typically mounted on a heat-insulated base, which can be moved to test different chips.

[0004] However, the external environment absorbs heat from the stage, resulting in an uneven temperature distribution and significant differences in the stage temperature. Consequently, the semiconductor board cannot be heated uniformly, affecting the detection quality and efficiency of the semiconductor board. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a heat-insulated temperature-controlled slide stage, which is beneficial for uniform temperature distribution and improves detection quality and efficiency.

[0006] The present invention also proposes a semiconductor probe station having the above-mentioned heat-insulating temperature-controlled wafer stage.

[0007] According to a first aspect of the present invention, a heat-insulating temperature-controlled substrate stage includes: A wafer heating plate is used to support and heat semiconductor boards; The substrate carrier includes a carrier plate portion for carrying and supporting the substrate heating plate, and a ring-shaped heat preservation portion erected on the carrier plate portion. The internal space of the ring-shaped heat preservation portion is used to set the substrate heating plate, and an airflow guide cap is provided on the outside of the substrate heating plate. The airflow guide cap, the ring-shaped heat preservation part, the carrier plate part, and the carrier heating plate work together to form a heat flow micro-circulation space.

[0008] The heat-controlled wafer stage and semiconductor probe station according to embodiments of the present invention have at least the following beneficial effects: First, it significantly improves heating efficiency and heat preservation performance, achieving rapid heating and precise temperature control.

[0009] By setting the aforementioned ring-shaped heat insulation part, a physical heat insulation barrier is constructed around the heating plate, which can effectively block the direct convection loss of heat from the heating plate to the surrounding ambient air.

[0010] Meanwhile, the heat flow micro-circulation space formed by the airflow guide cap, the ring-shaped heat insulation part, the carrier plate part and the carrier heating plate together allows the hot air rising around the heating plate to be forcibly guided and flow back down along the inner wall of the ring-shaped heat insulation part after encountering the obstruction of the airflow guide cap, thereby forming a closed internal heat circulation airflow around the carrier heating plate.

[0011] This microcirculation mechanism effectively prevents hot air from directly overflowing and cold air from intruding, greatly reducing heat exchange loss. This allows the temperature of the heating plate surface to rise quickly to the set value and maintain a uniform and controllable temperature state for a longer period of time, significantly shortening the test waiting time and improving test efficiency.

[0012] Second, it significantly improves the temperature uniformity of the stage surface, ensuring the accuracy of test data.

[0013] In traditional structures, the movement of the stage in the X, Y, and Z directions causes airflow around the tray, resulting in a lower temperature on the outer ring of the tray compared to the inner ring. This invention, through the constraint of the micro-circulation space, allows the hot airflow around the heating plate to circulate orderly along a predetermined path, avoiding localized overheating or undercooling and effectively improving the uniformity of temperature distribution on the tray surface.

[0014] A uniform temperature field ensures that test cells at different locations on the wafer are tested under the same temperature conditions, thereby significantly improving the consistency and reliability of test results.

[0015] Third, it effectively isolates the thermal effects of external motion systems, ensuring the accuracy of equipment movement and its service life.

[0016] The ring-shaped insulation section not only provides thermal insulation but also acts as an external thermal barrier, confining the high-temperature heat radiation and convection generated by the substrate heating plate within the insulation space. This effectively prevents heat transfer to the X, Y, and Z motion platforms and rotating mechanism at the bottom of the substrate stage. This structural design ensures that the external motion mechanism remains in a stable temperature environment over a long period, preventing a decrease in mechanical precision or movement jamming due to thermal expansion, thereby guaranteeing the probe station's pin insertion accuracy and long-term operational reliability.

[0017] Fourth, the combined internal and external cooling mode significantly improves heat dissipation efficiency and shortens the testing cycle.

[0018] Based on the pre-reserved notch in the ring-shaped insulation section and the open structure of the heat flow micro-circulation space, this invention can introduce external cooling airflow into this space when cooling is required. This allows the cooling gas to flow rapidly along the outer ring of the heating plate, and combined with the existing cooling air channels inside the heating plate, achieves simultaneous internal and external cooling. This synergistic cooling method significantly increases the heat dissipation area and improves heat exchange efficiency, enabling the stage to rapidly cool from a high temperature to room temperature or the target temperature. This effectively shortens the total time of the heating and cooling cycles, thereby increasing test throughput.

[0019] Fifth, reduce heat energy consumption to achieve energy conservation and emission reduction.

[0020] Because the ring-shaped heat insulation section and the heat flow micro-circulation space effectively reduce heat loss, the carrier heating plate can maintain the set temperature without frequent or high-power heat replenishment during the heat preservation stage, which significantly reduces the power consumption of the temperature control system and conforms to the green and energy-saving design concept.

[0021] Sixth, it also has electromagnetic shielding function, which enhances the anti-interference capability of the testing system.

[0022] When the ring-shaped insulation part is made of stainless steel or other metal materials, its closed ring structure can form an electromagnetic shielding layer for the heating plate, effectively suppressing the interference of electromagnetic radiation generated by the heating system on the test signal circuit and surrounding precision instruments, which is beneficial to improving the signal-to-noise ratio and measurement accuracy of the test system.

[0023] The present invention also provides a semiconductor probe station, which has the above-mentioned beneficial effects.

[0024] According to a first aspect of the present invention, the heat-insulating temperature-controlled slide stage has an airflow guide cap that is a strip extending along the outer periphery of the slide heating plate. The strip has a waist hole, the length direction of which is along the length direction of the strip. The waist hole is provided with a positioning screw for connecting the slide heating plate, and the waist hole can be adjusted relative to the positioning screw along its own length direction.

[0025] Advantageously, by setting the airflow guide cap as a strip extending along the outer periphery of the substrate heating plate, and providing a waist hole and positioning screw on this strip, the installation position of the airflow guide cap can be flexibly adjusted along the length of the waist hole. This adjustable structure can adaptively adjust the relative position of the airflow guide cap and the heating plate according to different specifications of substrate heating plates or different temperature control requirements, thereby optimizing the size of the heat flow microcirculation space and the airflow guiding angle. On the other hand, the cooperation between the waist hole and the positioning screw enables a floating connection during the installation of the guide cap. When the substrate heating plate undergoes thermal expansion at high temperatures, the guide cap can generate a small displacement relative to the positioning screw through the waist hole, effectively releasing thermal stress, avoiding constraint deformation of the substrate plate, and ensuring the structural integrity and flatness accuracy of the heating plate and substrate plate under high-temperature conditions.

[0026] According to a first aspect of the present invention, the heat-insulating temperature-controlled substrate stage includes an airflow guide cap comprising a mounting portion that conforms to the outer periphery of the substrate heating plate and a cap brim portion that connects to the mounting portion, the cap brim portion being used to cooperate in forming the heat flow micro-circulation space.

[0027] Beneficially, by configuring the airflow guide cap as a mounting part that fits against the outer periphery of the substrate heating plate and a brim connecting the mounting part, the brim can physically block and directionally guide the rising hot air around the substrate heating plate. When the rising hot air encounters the brim, it is forced to change direction and moves outward and downward along the surface of the brim to the inner wall of the annular insulation part, thereby forming a stable micro-circulation of hot airflow inside the insulation groove. This effectively prevents hot air from directly overflowing and cold air from intruding, reduces heat loss caused by the exchange of hot and cold air, and further improves the temperature uniformity of the substrate stage surface.

[0028] According to a first aspect of the present invention, the heat-insulating temperature-controlled substrate stage includes a substrate base and a heat-insulating member disposed on the substrate base. The heat-insulating member includes an outer barrel and an inner barrel disposed within the outer barrel. The bottom of the inner barrel and the bottom of the outer barrel are used to form the tray portion, and the walls of the inner barrel and the outer barrel are used to form the ring-shaped heat-insulating portion.

[0029] Advantageously, by setting the carrier base as a combination of a base component and an insulation component, and specifying the insulation component as an outer barrel component and an inner barrel component disposed within the outer barrel component, the bottom of the inner barrel component and the bottom of the outer barrel component form a carrier plate portion, and the barrel wall of the inner barrel component and the barrel wall of the outer barrel component form a ring-shaped insulation portion. This double-layer nested structure provides a physical basis for vacuum insulation, allowing the carrier heating plate to be embedded inside the inner barrel component, achieving all-round thermal insulation of the sides and bottom; at the same time, the modular double-layer structure facilitates the independent processing, assembly, and maintenance of each component, reducing manufacturing costs and assembly difficulty.

[0030] According to a first aspect embodiment of the present invention, the space between the outer barrel and the inner barrel forms a vacuum insulation cavity, the vacuum insulation cavity including a side vacuum cavity and a bottom vacuum cavity, the side vacuum cavity being located between the inner wall surface of the outer barrel and the outer wall surface of the inner barrel, and the bottom vacuum cavity being located between the inner surface of the bottom of the outer barrel and the outer surface of the bottom of the inner barrel.

[0031] Advantageously, by forming a vacuum insulation cavity in the space between the outer and inner barrel components, and specifically configuring the vacuum insulation cavity as a side vacuum cavity and a bottom vacuum cavity, the vacuum insulation layer simultaneously covers the sides and bottom of the carrier heating plate. The vacuum cavity contains almost no air molecules, effectively blocking heat transfer outwards through heat conduction and convection, greatly reducing heat loss. Simultaneously, the continuous design of the side and bottom vacuum cavities ensures the uniformity and stability of vacuum extraction, significantly improving the overall insulation effect. This drastically reduces the frequency and power required for heat replenishment during the high-temperature holding phase of the carrier heating plate, achieving energy saving and consumption reduction.

[0032] According to a first aspect embodiment of the present invention, in a heat-insulating temperature-controlled substrate stage, at least one of the inner wall surface of the outer barrel and the outer wall surface of the inner barrel is provided with a plurality of support frames for abutting against the other, and the space around the support frames is used to form the side vacuum cavity.

[0033] Advantageously, by providing several support frames on at least one of the inner wall surfaces of the outer barrel and the outer wall surface of the inner barrel for abutting against the other, the inner and outer barrels can resist external atmospheric pressure during vacuuming without collapsing or deforming, ensuring that the effective space of the vacuum chamber is not destroyed. The support frames adopt a thin-plate structure design, which provides reliable support while reducing the contact area with the barrel wall, thus reducing heat leakage caused by solid contact conduction; the space around the support frames remains connected to form a complete side vacuum chamber, achieving a balance between structural strength and excellent thermal insulation performance.

[0034] According to a first aspect of the present invention, the heat-insulating temperature-controlled substrate stage has an outer protruding edge that overlaps the top of the outer barrel, the outer protruding edge being used to suspend the bottom of the inner barrel, so that a bottom vacuum cavity is formed between the inner surface of the bottom of the outer barrel and the outer surface of the bottom of the inner barrel.

[0035] Advantageously, by providing an outwardly projecting edge on the inner barrel that overlaps with the top of the outer barrel, the bottom of the inner barrel is suspended in the air, thus easily forming a bottom vacuum cavity between the bottom of the inner barrel and the inner surface of the bottom of the outer barrel. This overlapping structure achieves the positioning and suspension support of the inner barrel without additional welding or fasteners, simplifying the manufacturing process and assembly flow; at the same time, the sealing fit between the outwardly projecting edge and the top of the outer barrel effectively ensures the airtightness of the vacuum cavity, ensuring the long-term stability and reliability of the vacuum insulation effect.

[0036] According to a first aspect embodiment of the present invention, the inner surface of the inner barrel is provided with a heat-reflective coating.

[0037] According to a first aspect of the present invention, the heat-insulating temperature-controlled substrate stage has a channel connection portion for transmitting electrical energy, so that the substrate heating plate can heat up, cool down, adsorb and desorb; The ring-shaped insulation part is provided with a notch for connecting the channel connection part to the outside. The channel connection part also includes a ventilation pipe for connecting the heat flow micro-circulation space.

[0038] Advantageously, by providing a notch for connecting the ring-shaped insulation section to the outside, external connection lines and pipes such as the vacuum connector, cooling air passage, and heating wire of the wafer heating plate can be easily passed through the insulation groove for external connection, avoiding interference between the lines and the insulation structure. Simultaneously, the ventilation pipe connects to the heat flow micro-circulation space, allowing external cooling airflow to be introduced into the outer ring area of ​​the wafer heating plate through this pipe. This, combined with the internal cooling air passage, achieves synergistic cooling, significantly improving cooling efficiency and shortening the testing cycle. Furthermore, this ventilation pipe can also be used to introduce inert protective gas into the heat flow micro-circulation space to prevent wafer oxidation at high temperatures, expanding the applicability of the wafer stage.

[0039] According to a first aspect of the present invention, a heat-insulating temperature-controlled substrate stage includes a substrate heating plate comprising a stacked heat-insulating base, a heating plate body, an insulating conductive plate, and a substrate tray. A constraint system is provided between the heat-insulating base and the heating plate body, the constraint system comprising a translational constraint component, a vertical constraint component, and a rotational constraint component. The heating plate body, the insulating conductive plate, and the substrate tray are provided with a center positioning and adsorption fixing structure. A rotational constraint structure is provided between the heat-insulating base and the substrate tray.

[0040] Beneficially, by setting the wafer heating plate as a multi-layered stacked structure of a heat-insulating base, a heating plate body, an insulating conductive plate, and a wafer tray, and coordinating with translational constraint components, vertical constraint components, rotational constraint components, and a center-positioning adsorption and fixing structure and a rotational constraint structure, a precise division of labor and accurate positioning of each functional layer is achieved. The heat-insulating base blocks heat conduction downwards to protect the bottom moving mechanism, the heating plate body concentrates heat generation, the insulating conductive plate ensures electrical insulation and uniform heat conduction, and the wafer tray directly carries the wafer. The multi-dimensional constraint system of translation, vertical, and rotation ensures that each layer maintains precise concentricity and fit under thermal expansion or external force, greatly improving the stability of heat transfer and the flatness of the wafer tray surface. The center-positioning adsorption and fixing structure enables rapid concentric positioning and firm fixation of each layer, ensuring assembly accuracy and consistent heat conduction.

[0041] The semiconductor probe station according to a second aspect of the present invention includes any one of the heat-insulating temperature-controlled wafer stage described in any one of the embodiments.

[0042] Beneficially, this provides a semiconductor probe station that incorporates any of the aforementioned heat-insulated temperature-controlled wafer stages, giving the probe station excellent temperature uniformity and heat preservation performance. In high-temperature wafer testing, this probe station effectively shortens the temperature stabilization time and reduces testing errors introduced by temperature drift. Simultaneously, due to the heat insulation effect of the insulation bath, the XYZ motion and rotation mechanisms at the bottom of the probe station are unaffected by thermal radiation and convection, maintaining stable motion accuracy across all axes and preventing accuracy deviations due to thermal expansion and contraction. Furthermore, when the insulation bath is made of stainless steel, it also provides electromagnetic shielding, reducing electromagnetic interference from the heating system to test circuits or other precision instruments, thereby comprehensively improving the probe station's testing accuracy, reliability, and long-term operational stability.

[0043] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the structure of the heat-insulating temperature-controlled wafer stage of the semiconductor probe station according to an embodiment of the present invention; Figure 2 for Figure 1 A three-dimensional structural diagram of the heating plate for the middle carrier plate; Figure 3 for Figure 2 A schematic diagram of the structure of the slide heating plate from a frontal view. Figure 4 for Figure 2 A three-dimensional exploded view of the heating plate for the slide; Figure 5 for Figure 4 Further exploded structural diagram of the slide heating plate; Figure 6 for Figure 5 Exploded view of the slide heating plate from the front view; Figure 7 for Figure 5 Schematic diagram of the structure of the heating plate and the heat insulation base; Figure 8 for Figure 2 A schematic diagram of the structure of an alternative to the slide heating plate; Figure 9 for Figure 1 Schematic diagram of the thermal insulation structure of the insulated temperature-controlled slide stage; Figure 10 for Figure 9 Enlarged view of point A in the thermal insulation structure; Figure 11 for Figure 1 A schematic diagram of the heating plate and airflow guide cap of the heat-controlled substrate stage; Figure 12 for Figure 11 Enlarged view of section B of the slide heating plate and airflow guide cap; Figure 13 for Figure 1 A schematic diagram of the insulation component of an insulated temperature-controlled tray stage; Figure 14 for Figure 13 Schematic diagram of the assembly structure of the insulation component.

[0046] Explanation of reference numerals in the attached figures: Slide heating plate 1; Slide base 2; Insulated base 100; mounting surface 110; heating plate body 120; positioning hole 130; constraint system 140; translation constraint assembly 150; positioning element 160; fixing element 170; vertical constraint assembly 180; first elastic clamping element 190; positioning ring groove 191; rotation constraint assembly 200; first abutment part 210; second abutment part 220; rotation drive spring 230; heat insulation column 240; insulating conduction disk 250; carrier disk 260; second elastic clamping element 270; positioning protrusion 280; positioning groove 290; disk body 300; channel group 310; Carrier plate 400; Ring-shaped insulation 410; Airflow guide cap 420; Heat flow microcirculation space 430; Waist hole 440; Positioning screw 450; Mounting part 460; Cap brim 470; Insulation component 480; Outer barrel component 490; Inner barrel component 500; Side vacuum chamber 510; Bottom vacuum chamber 520; Support frame 530; Outer convex edge 540; Channel connection part 550; Notch position 560; Ventilation pipeline 570; Base component 580. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0049] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, this is only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0050] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0051] The following description, in conjunction with the accompanying drawings, describes an embodiment of the heat-insulating temperature-controlled wafer stage and a semiconductor probe stage according to the present invention.

[0052] Reference Figures 1 to 14 The present invention aims to provide an embodiment of a heat-insulating temperature-controlled wafer stage. Furthermore, since the heat-insulating temperature-controlled wafer stage can be a component of a semiconductor probe station, the present invention also aims to provide an embodiment of a semiconductor probe station.

[0053] For a heat-controlled substrate stage, the heat-controlled substrate stage includes a substrate heating plate 1 and a substrate base 2.

[0054] The specific structure of the carrier heating plate 1 can be found in [reference needed]. Figures 2 to 8 This facilitates understanding of the principles and knowledge related to semiconductor board testing. For the wafer carrier 2, please refer to... Figures 9 to 14 This makes it easier to understand the interaction between the slide heating plate 1 and the slide base 2.

[0055] For wafer heating plate 1, wafer heating plate 1 is used to support and heat semiconductor board, specifically, refer to... Figure 2 , Figure 2 This is a three-dimensional structural diagram of the wafer heating plate 1 of the semiconductor probe station according to an embodiment of the present invention.

[0056] The substrate heating plate 1 in this embodiment of the invention mainly includes a substrate plate 260, an insulating conduction plate 250, a heating plate body 120, a heat insulation base 100, and a constraint system 140.

[0057] Specifically, the wafer carrier 260 is located at the top and is used to hold the semiconductor chip under test. The surface of the wafer carrier 260 is usually gold-plated. When there is wear, it needs to be replaced according to the wear condition.

[0058] The insulating conductive disk 250 is located between the carrier disk 260 and the heating disk 120, and plays the role of insulation and heat conduction. The insulating conductive disk 250 is made of heat-conducting ceramic, which satisfies both the insulation effect and the heat conduction function.

[0059] As is easily understood, the insulating conductive plate 250 is positioned between the substrate tray 260 and the heating plate body 120, achieving both electrical insulation between the heating plate body 120 and the substrate tray 260, and ensuring effective heat conduction from the heating plate body 120 to the substrate tray 260. The insulating conductive plate 250 and the heating plate body 120 are fixed together by adsorption, as are the substrate tray 260 and the insulating conductive plate 250, avoiding the constraint stress generated by hard connections such as screws at high temperatures. The substrate tray 260, the insulating conductive plate 250, and the heating plate body 120 are positioned using pin holes, ensuring the relative positional accuracy between them, maintaining a consistent heat transfer path, and facilitating the quick replacement of the substrate tray 260.

[0060] The heating plate 120 is mounted on the mounting surface 110 of the heat insulation base 100. The heating plate 120 is used to generate heat and heat the substrate 260 and the semiconductor chip under test above it.

[0061] The heat-insulating base 100 is located at the bottom and is used to prevent the heat from the heating plate 120 from being transferred downwards. It is made of heat-insulating ceramic.

[0062] from Figure 2 The structure of the constraint system 140 can also be seen. The constraint system 140 is used to fix the heating plate 120 to the mounting surface 110. The constraint system 140 includes a translation constraint component 150, a vertical constraint component 180 and a rotation constraint component 200.

[0063] The vertical constraint assembly 180 includes a plurality of first elastic clamping members 190, which are arranged circumferentially along the heating plate body 120.

[0064] The constraint system 140 also includes a second elastic clamping member 270, which is disposed in the circumference of the heat insulation base 100. The second elastic clamping member 270 is provided with a positioning protrusion 280. The circumference of the tray 260 is provided with a positioning groove 290 that matches the positioning protrusion 280. The positioning groove 290 and the positioning protrusion 280 cooperate to prevent the tray 260 from rotating around the normal direction of the mounting surface 110.

[0065] It is easy to understand that the second elastic clamping member 270 is disposed circumferentially on the heat insulation base 100, and the second elastic clamping member 270 is provided with a positioning protrusion 280. The tray 260 is provided circumferentially with a positioning groove 290 that matches the positioning protrusion 280. The positioning protrusion 280 abuts against the side wall of the positioning groove 290, preventing the tray 260 from rotating around the normal direction of the mounting surface 110, thereby constraining the rotational freedom of the tray 260.

[0066] The length of the positioning groove 290 in the normal direction of the mounting surface 110 is greater than the length of the positioning protrusion 280, which allows the positioning protrusion 280 to have a certain amount of room for movement in the Z direction. When the tray 260 expands in the Z direction at high temperature, it will not interfere with the positioning protrusion 280. At the same time, when the tray 260 expands radially at high temperature, the positioning protrusion 280 can expand outward with the tray 260 under the action of elasticity and maintain contact with the positioning groove 290, thus ensuring the effectiveness of rotational constraint at high temperature.

[0067] Reference Figure 3 , Figure 3 for Figure 2 A schematic diagram of the structure of the wafer heating plate 1 from a front view. From the front view, the stacking relationship of each layer of the wafer heating plate 1 and the arrangement of the constraint system can be seen more clearly.

[0068] Among them, the heat insulation base 100 is located at the bottom, the heating plate body 120 is set on the mounting surface 110 of the heat insulation base 100, the insulating conduction plate 250 is set above the heating plate body 120, and the carrier plate 260 is set above the insulating conduction plate 250.

[0069] For the vertical constraint assembly 180, the first elastic clamping member 190 of the vertical constraint assembly 180 is arranged circumferentially along the heating plate body 120. The fixed end of the first elastic clamping member 190 is connected to the heat insulation base 100, and the clamping end presses against the upper surface or outer peripheral edge of the heating plate body 120, applying an elastic clamping force along the normal direction of the mounting surface 110 to the heating plate body 120, so that the heating plate body 120 and the heat insulation base 100 are tightly attached.

[0070] Specifically, multiple first elastic clamping members 190 are arranged circumferentially along the heating plate body 120, with the clamping end pressing against the upper surface or outer peripheral edge of the heating plate body 120. The heating plate body 120 is pressed against the mounting surface 110 of the heat insulation base 100 by the elastic clamping force, thereby constraining the displacement of the heating plate body 120 in the normal direction of the mounting surface 110.

[0071] The fixed end is located at the bottom of the heat insulation base 100. There is a cross-sectional shrinkage section between the fixed end and the pressing end. The cross-sectional shrinkage section reduces the cross-sectional area of ​​the heat conduction path from the heating plate 120 to the fixed end, so that the heat increases along the temperature gradient of the spring during conduction. When the heat reaches the fixed end, the temperature has been greatly reduced, thus avoiding the degradation of the material properties of the fixed end or the failure of the connection due to high temperature.

[0072] The outer periphery of the heating plate 120 is provided with a positioning ring groove 191 that mates with the pressing end. The pressing end is embedded in the positioning ring groove, so that the pressing end is always kept in the positioning ring groove 191 at high temperature, preventing the pressing end from slipping out and ensuring the reliability of vertical constraint.

[0073] In some preferred embodiments of the present invention, the fixed end of the first elastic pressing member 190 can be fixed to the side of the heat insulation base 100 by three screws to meet the pressing requirements, while simplifying the structure of the first elastic pressing member 190.

[0074] In some preferred embodiments of the present invention, the pressing end of the first elastic pressing member 190 can be bent out of the pressing plane to increase the contact area and reduce the risk of separation between the pressing end and the edge of the positioning ring groove 191.

[0075] In some preferred embodiments of the present invention, the first elastic clamping member 190 and the second elastic clamping member 270 can be integrally processed, that is, two parts belonging to one part, which can reduce the number of parts and reduce manufacturing and assembly costs.

[0076] Reference Figure 4 , Figure 4 for Figure 2 A three-dimensional exploded view of the structure of the heating plate 1. Figure 4 The heating plate 120, the insulating conductive plate 250, and the slide plate 260 were exploded apart, revealing the separation state between the layers.

[0077] Depend on Figure 4 As can be seen, the carrier plate 260, the insulating conduction plate 250 and the heating plate 120 are positioned by the engagement of pin holes, ensuring the relative positional accuracy between the three.

[0078] The insulating conduction disk 250 and the heating disk 120 are fixed by adsorption. Specifically, the heating disk 120 is provided with an air channel, and the insulating conduction disk 250 is adsorbed onto the heating disk 120 by vacuuming.

[0079] The substrate tray 260 and the insulating conductive tray 250 are fixed by adsorption. The substrate tray 260 has air channels on its side. The substrate tray 260 is adsorbed onto the insulating conductive tray 250 by vacuuming.

[0080] in addition, Figure 4 It also more clearly shows the mating relationship between the positioning protrusion 280 on the second elastic clamping member 270 and the circumferential positioning groove 290 of the tray 260.

[0081] Reference Figure 5 , Figure 5 for Figure 4 A further exploded structural diagram of the heating plate 1. Figure 5 The heating plate 120 and the heat insulation base 100 are further exploded to reveal the detailed structure of the translation constraint assembly 150 and the rotation constraint assembly 200.

[0082] The translation constraint component 150 is located in the central region of the heating plate body 120 and is used to constrain the displacement of the heating plate body 120 along the mounting surface 110 (i.e., the translational degrees of freedom in the X and Y directions).

[0083] Specifically, the translation constraint assembly 150 includes a positioning member 160. The heating plate body 120 is provided with a positioning hole 130 that cooperates with the positioning member 160. The positioning member 160 passes through the positioning hole 130 to position the heating plate body 120 along the mounting surface 110.

[0084] In some preferred embodiments of the present invention, the coefficient of thermal expansion of the positioning member 160 may be less than that of the heating plate 120, so that a clearance gap is formed between the heating plate 120 and the positioning member 160 at high temperature.

[0085] Specifically, the positioning component 160 is made of ceramic material. The thermal expansion of ceramic at high temperature is less than that of metal heating plate 120. In this way, the central positioning hole 130 of heating plate 120 will become larger at high temperature, and will not be damaged by compression with ceramic.

[0086] Specifically, the positioning element 160 is made of ceramic material, and the coefficient of thermal expansion of ceramic at high temperatures is much smaller than that of the metal heating plate 120. The heating plate 120 has a positioning hole 130 at its center, and the positioning element 160 passes through the positioning hole 130 to achieve positioning of the heating plate 120 in the X and Y directions within the mounting surface 110. When the heating plate 120 undergoes thermal expansion at high temperatures, the increase in the diameter of the positioning hole 130 is greater than the increase in the outer diameter of the positioning element 160, naturally forming a clearance between them. This clearance avoids additional constraint stress caused by the difference in thermal expansion, preventing the heating plate 120 from warping due to over-constraint and ensuring the flatness of the upper surface of the heating plate 120.

[0087] In addition, the translation constraint assembly 150 also includes a fixing member 170. The positioning member 160 has a through hole along the normal direction of the mounting surface 110. The fixing member 170 passes through the through hole to connect the heating plate body 120 to the heat insulation base 100.

[0088] In some preferred embodiments of the present invention, the material of the fixing member 170 can be the same as the main material of the heating plate body 120 to ensure that the fixing member 170 and the heating plate body 120 have the same amount of thermal expansion at high temperature.

[0089] That is, the material of the fixing component 170 is the same as the main material of the heating plate body 120. At high temperatures, the fixing component 170 and the heating plate body 120 have the same amount of thermal expansion, avoiding additional stress at the connection due to differences in thermal expansion. The positioning component 160 is made of ceramic material. The coefficient of thermal expansion of ceramic is much smaller than that of the metal heating plate body 120. When the heating plate body 120 expands at high temperatures, a reliable clearance can be formed between it and the ceramic positioning component 160 to avoid crushing damage.

[0090] The rotation constraint assembly 200 is disposed between the heating plate body 120 and the heat insulation base 100. The rotation constraint assembly 200 is used to constrain the rotation of the heating plate body 120 about the normal direction of the mounting surface 110 (i.e., the rotational degree of freedom about the Z-axis).

[0091] Specifically, the rotation constraint assembly 200 includes a first abutment portion 210, a second abutment portion 220, and a rotation drive spring 230. The first abutment portion 210 is disposed on the heating plate body 120, the second abutment portion 220 is disposed on the heat insulation base 100, and the rotation drive spring 230 connects the heating plate body 120 and the heat insulation base 100.

[0092] The rotation drive spring 230 applies force in a direction perpendicular to the normal direction of the mounting surface 110 and offset from the center of the heating plate body 120, so that the first abutting part 210 and the second abutting part 220 remain in contact, thereby preventing the heating plate body 120 from rotating around the normal direction of the mounting surface 110.

[0093] It is easy to understand that the rotary drive spring 230 connects the heating plate 120 and the heat insulation base 100. Its force direction is perpendicular to the normal direction of the mounting surface 110 and deviates from the center of the heating plate 120, generating a torque about the normal direction of the mounting surface 110. This drives the heating plate 120 to rotate relative to the heat insulation base 100, ensuring that the first abutment portion 210 on the heating plate 120 and the second abutment portion 220 on the heat insulation base 100 remain in contact. The contact between the first abutment portion 210 and the second abutment portion 220 prevents the heating plate 120 from rotating about the normal direction of the mounting surface 110, thus constraining the rotational degree of freedom. Simultaneously, the rotary drive spring 230 maintains the abutment state through adaptive elasticity at high temperatures, avoiding deformation caused by rigid constraints.

[0094] In this embodiment, the first abutment portion 210 includes a positioning bearing, the second abutment portion 220 includes a heat insulation column 240, the heat insulation base 100 has a plurality of heat insulation columns 240, the top surfaces of the plurality of heat insulation columns 240 cooperate to form a mounting surface 110, and the rotation drive spring 230 is disposed in the gap between the heat insulation columns 240.

[0095] It is easy to understand that the heat insulation column 240 not only serves as the second abutment part 220 to constrain the rotation of the heating plate 120, but its top surface also forms a mounting surface 110 to support the heating plate 120, achieving multiple uses and simplifying the structure. The rotation drive spring 230 is set in the gap between the heat insulation columns 240, making full use of the space between the heat insulation columns 240 and making the overall structure more compact.

[0096] In some preferred embodiments of the present invention, the rotary drive spring 230 can be connected to the heating plate 120 and the heat insulation base 100 by screws. At the same time, it is convenient to use the annular structures at both ends of the rotary drive spring 230 for installation.

[0097] Reference Figure 6 , Figure 6 for Figure 5 An exploded view of the heating plate 1 from the front perspective. The front view more clearly shows the state of the heating plate body 120 after it is separated from the heat insulation base 100, as well as the cooperation relationship between the positioning element 160 and the positioning hole 130 in the translation constraint assembly 150.

[0098] The positioning member 160 is inserted into the positioning hole 130, and the fixing member 170 passes through the through hole of the positioning member 160 to connect the heating plate body 120 with the heat insulation base 100.

[0099] Figure 6The distribution of the first elastic clamping member 190 of the vertical constraint component 180 is also shown. Multiple first elastic clamping members 190 are evenly arranged along the circumference of the heating plate body 120. The clamping end presses against the positioning ring groove 191 on the outer peripheral edge of the heating plate body 120. The clamping force is maintained by elasticity adaptively at different temperatures.

[0100] Reference Figure 7 , Figure 7 for Figure 5 A schematic diagram of the structure of the heating plate and the heat insulation base. Figure 7 The connection structure between the heating plate 120 and the heat insulation base 100, as well as the internal channel structure of the heating plate 120, are shown in detail.

[0101] The heating plate 120 includes a plate 300 and a channel assembly 310 disposed within the plate 300. The channel assembly 310 includes an adsorption channel, a heating channel, and a cooling channel. The channel assembly 310 is integrally manufactured with the plate 300 as an insert.

[0102] Specifically, the heating plate 120 is formed by casting (or die-casting) a pre-embedded pipe into a mold, integrating the pre-embedded pipe with the plate 300 as a single unit, followed by stress-relief annealing and surface finishing. This integrated structure ensures good material microstructure and temperature consistency of the heating plate 120, avoiding the residual thermal stress and sealing failure problems associated with split-part structures. The adsorption channel is used to create a vacuum to adsorb the insulating conductive plate 250 onto the heating plate 120, the heating channel is used to accommodate the heating wire to heat the heating plate 120, and the cooling channel is used to introduce compressed air for rapid cooling after high-temperature testing.

[0103] It is easy to understand that the channel assembly 310 is manufactured as an insert integrally with the disk body 300, so that the adsorption channel, heating channel and cooling channel are directly formed inside the disk body. There is no need to process the disk body into upper and lower parts and then splice them together, thus avoiding the residual thermal stress and sealing failure problems that exist in spliced ​​structures.

[0104] The integrated structure ensures good consistency in the overall material structure and temperature distribution of the plate 300, resulting in uniform thermal deformation at high temperatures and preventing severe deformation due to localized stress concentration, thus guaranteeing the flatness of the upper surface of the heating plate 120.

[0105] Reference Figure 8 , Figure 8 for Figure 2A schematic diagram of an alternative to the rotation constraint assembly of the carrier heating plate 1. In some other embodiments of the present invention, the rotation constraint assembly 200 may also be implemented with a structure similar to the second elastic clamping member 270, the positioning protrusion 280 and the positioning groove 290, that is, the rotation constraint assembly 200 includes the second elastic clamping member 270, the positioning protrusion 280 and the positioning groove 290.

[0106] Specifically, Figure 8 An alternative to the rotation constraint assembly 200 is shown, in which a spring-loaded and V-groove mating structure replaces the abutment fit between the positioning bearing and the heat insulation column in the first embodiment. In this alternative, the contact position between the spring-loaded and V-groove is formed by stamping a cylindrical positioning protrusion, which tightly engages with the V-groove under the action of elastic force. The cylindrical surface of the spring-loaded and the V-groove constrain the heating plate 120 in the rotational direction, preventing rotation about the normal direction of the mounting surface 110, while no constraint is required in the Z direction (normal direction of the mounting surface). Thus, translation in the XY directions is restricted by the central pin, rotation is restricted by the outer ring V-groove, and displacement in the Z direction is restricted by the central screw and the outer ring buckle. At high temperatures, the self-adaptive nature of the spring can also effectively limit the heating plate 120, ensuring that the upper surface of the heating plate 120 maintains good flatness.

[0107] In some preferred embodiments of the present invention, the heat insulation column 240 can be formed by cutting a groove in the heat insulation base 100, so that the cross-section of the heat insulation column 240 is rectangular, which can reduce heat conduction and reduce manufacturing costs.

[0108] The working principle of the carrier heating plate 1 according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0109] Reference Figures 2 to 5 When the heating plate 1 is in operation, the heating plate body 120 is mounted on the mounting surface 110 of the heat insulation base 100. The positioning member 160 of the translation constraint assembly 150 passes through the positioning hole 130 of the heating plate body 120, constraining the displacement of the heating plate body 120 along the X and Y directions of the mounting surface 110. The first elastic clamping member 190 of the vertical constraint assembly 180 is arranged circumferentially along the heating plate body 120, and the clamping end presses against the positioning ring groove 191 of the heating plate body 120, applying an elastic clamping force along the normal direction of the mounting surface 110 to the heating plate body 120, constraining the displacement of the heating plate body 120 in the Z direction. The rotation drive spring 230 of the rotation constraint assembly 200 connects the heating plate body 120 and the heat insulation base 100. The direction of the applied force is deviated from the center of the heating plate body 120, so that the first abutting part 210 and the second abutting part 220 remain in contact, thereby constraining the rotation of the heating plate body 120 about the normal direction of the mounting surface 110.

[0110] Through the cooperation of the three constraint components described above, the six degrees of freedom of the heating plate 120 are fully constrained. Simultaneously, each constraint component employs an elastic adaptive structure, automatically adjusting the constraint force according to the thermal expansion of the heating plate 120 at high temperatures. Specifically, the coefficient of thermal expansion of the positioning component 160 is less than that of the heating plate 120, creating a clearance gap between the heating plate 120 and the positioning component 160 when the heating plate 120 expands at high temperatures, thus avoiding additional stress. The first elastic clamping component 190 maintains the clamping force through elastic adaptive force at high temperatures, preventing deformation caused by a rigid connection. The rotary drive spring 230 maintains the contact state of the first abutment portion 210 and the second abutment portion 220 through elastic adaptive force at high temperatures. Therefore, the heating plate 120 is fully constrained at high temperatures without deforming due to over-constraint, ensuring that the flatness of the upper surface of the heating plate 120 meets the requirements of the needle puncture test.

[0111] An insulating conductive disk 250 is positioned above the heating disk body 120 and is fixed in place by vacuum adsorption through the adsorption channels within the heating disk body 120. A wafer carrier disk 260 is positioned above the insulating conductive disk 250 and is fixed in place by vacuum adsorption through air channels on the side of the wafer carrier disk 260. The semiconductor chip under test is placed on the wafer carrier disk 260, which is fixed in place by vacuum holes on its surface. The heating disk body 120 is heated by heating wires within the heating channels, and the heat is transferred to the wafer carrier disk 260 and the semiconductor chip under test via the insulating conductive disk 250. After testing, compressed cooling air is introduced through the cooling channels for rapid cooling.

[0112] It is easy to understand that this embodiment uses translational constraint component 150, vertical constraint component 180, and rotational constraint component 200 to constrain the translation of the heating plate 120 within the mounting surface 110, its displacement along the normal direction of the mounting surface 110, and its rotation about the normal direction of the mounting surface 110, thus achieving complete constraint on all six degrees of freedom of the heating plate 120. Simultaneously, each constraint component adopts an elastic adaptive structure, which can automatically adjust the constraint force according to the thermal expansion of the heating plate 120 at high temperatures, avoiding deformation of the heating plate 120 caused by hard constraint (over-constraint), thereby ensuring that the flatness of the upper surface of the heating plate 120 meets the requirements of the needle puncture test.

[0113] This embodiment integrates the air path and heating wire pipeline into a single structure using the heating plate body 120, avoiding the residual thermal stress and sealing failure issues of separate spliced ​​structures. The heating wire runs through the heating plate body 120, improving the internal thermal efficiency and enabling faster heating. Multiple cooling paths are achieved through cooling compressed air and compressed air introduced into the heating wire pipeline. The heating plate body 120 is not fixed with screws, allowing the material to deform freely with temperature at high temperatures, reducing deformation caused by rigid constraints such as fixing, thus ensuring the surface flatness of the carrier plate 260 meets requirements. The use of snap-fit, vacuum, and spring-loaded structures also facilitates quick installation and disassembly.

[0114] Reference Figure 1 , Figures 9 to 14 The present invention also solves the problem that airflow disturbance during the movement of the heat-controlled slide stage affects the edge cooling of the slide heating plate 1 and thus affects the test.

[0115] Specifically, during the insulation process, the temperature-controlled stage regulates the temperature through a temperature control system to maintain a constant surface temperature during wafer testing. However, when the stage moves along the XY axis, the air inside the probe station creates wind resistance, and the airflow lowers the stage's temperature. Similarly, when the stage moves along the Z direction, it causes air to flow up and down, which also cools the stage. Ultimately, this results in the outer ring temperature of the wafer tray 260 surface being lower than the inner ring temperature.

[0116] In addition, when the temperature control panel is high, the cool air below it is heated and flows upward, creating a small airflow circulation around the panel where airflow rises and airflow in the space away from the panel flows downward. Simultaneously, the heat radiation from the substrate 260 also causes a temperature drop. To maintain a stable temperature on the substrate 260, the temperature controller replenishes heat as the temperature drops, compensating for the heat loss.

[0117] Therefore, referring to Figure 9 and Figure 10 The present invention is improved in that the substrate base 2 includes a substrate portion 400 for carrying and supporting the substrate heating plate 1 and a ring-shaped heat preservation portion 410 erected on the substrate portion 400. The internal space of the ring-shaped heat preservation portion 410 is used to set the substrate heating plate 1.

[0118] Meanwhile, an airflow guide cap 420 is provided on the outside of the substrate heating plate 1; the airflow guide cap 420, the ring-shaped heat preservation part 410, the substrate part 400 and the substrate heating plate 1 cooperate to form a heat flow micro-circulation space 430.

[0119] In summary, firstly, it significantly improves heating efficiency and insulation performance, achieving rapid heating and precise temperature control.

[0120] By setting up a ring-shaped heat insulation part 410, a physical heat insulation barrier is constructed around the heating plate 1, which can effectively block the direct convection loss of heat from the heating plate to the surrounding ambient air.

[0121] Meanwhile, the heat flow micro-circulation space 430 formed by the airflow guide cap 420, the ring-shaped heat insulation part 410, the carrier plate part 400 and the carrier heating plate 1 together causes the hot air rising around the heating plate to be forcibly guided and flow back down along the inner wall of the ring-shaped heat insulation part 410 after encountering the obstruction of the airflow guide cap 420, thereby forming a closed internal heat circulation airflow around the carrier heating plate 1.

[0122] This microcirculation mechanism effectively prevents hot air from directly overflowing and cold air from intruding, greatly reducing heat exchange loss. This allows the surface temperature of the carrier heating plate 1 to rise quickly to the set value and maintain a uniform and controllable temperature state for a longer period of time, significantly shortening the test waiting time and improving test efficiency.

[0123] Second, it significantly improves the temperature uniformity of the stage surface, ensuring the accuracy of test data.

[0124] In traditional structures, the movement of the stage in the X, Y, and Z directions causes airflow around it, resulting in a lower temperature on the outer ring of the tray 260 compared to the inner ring. This invention, through the constraint of the heat flow micro-circulation space 430, allows the hot airflow around the heating plate to circulate orderly along a set path, avoiding localized overheating or undercooling and effectively improving the temperature distribution uniformity on the surface of the tray 260.

[0125] A uniform temperature field ensures that test cells at different locations on the wafer are tested under the same temperature conditions, thereby significantly improving the consistency and reliability of test results.

[0126] Third, it effectively isolates the thermal effects of external motion systems, ensuring the accuracy of equipment movement and its service life.

[0127] The ring-shaped insulation section 410 not only provides thermal insulation but also acts as an external thermal barrier, confining the high-temperature heat radiation and convection generated by the substrate heating plate 1 within the insulation section's internal space. This effectively prevents heat transfer to the X, Y, and Z motion platforms and rotating mechanism at the bottom of the substrate stage. This structural design ensures that the external motion mechanism remains in a stable temperature environment over a long period, preventing a decrease in mechanical precision or motion jamming due to thermal expansion, thereby guaranteeing the probe station's pin insertion accuracy and long-term operational reliability.

[0128] Fourth, the combined internal and external cooling mode significantly improves heat dissipation efficiency and shortens the testing cycle.

[0129] Based on the open structure of the notch 560 reserved in the ring-shaped insulation section 410 and the heat flow micro-circulation space 430, this invention can introduce external cooling airflow into this space when cooling is required. This allows the cooling gas to flow rapidly along the outer ring of the substrate heating plate 1, and, combined with the existing cooling air channels inside the heating plate, achieves simultaneous internal and external cooling. This synergistic internal and external cooling method significantly increases the heat dissipation area and improves heat exchange efficiency, enabling the substrate stage to rapidly cool from a high temperature to room temperature or the target temperature. This effectively shortens the total time of the heating and cooling cycle, thereby increasing the test throughput.

[0130] Fifth, reduce heat energy consumption to achieve energy conservation and emission reduction.

[0131] Since the ring-shaped heat insulation part 410 and the heat flow micro-circulation space 430 effectively reduce heat loss, the carrier heating plate 1 can maintain the set temperature without frequent or high-power heat replenishment during the heat preservation stage, which significantly reduces the power consumption of the temperature control system and conforms to the green and energy-saving design concept.

[0132] Sixth, it also has electromagnetic shielding function, which enhances the anti-interference capability of the testing system.

[0133] When the ring-shaped heat preservation part 410 is made of stainless steel or other metal materials, its closed ring structure can form an electromagnetic shielding layer for the carrier heating plate 1, effectively suppressing the interference of electromagnetic radiation generated by the heating system on the test signal circuit and surrounding precision instruments, which is beneficial to improving the signal-to-noise ratio and measurement accuracy of the test system.

[0134] Accordingly, the present invention also provides a semiconductor probe station comprising any of the above-mentioned heat-insulated temperature-controlled wafer stage, enabling the probe station to possess excellent wafer stage temperature uniformity and heat preservation performance. In high-temperature wafer testing, this probe station can effectively shorten the temperature stabilization time and reduce testing errors introduced by temperature drift; simultaneously, due to the heat insulation effect of the heat insulation tank, the XYZ motion and rotational motion mechanisms at the bottom of the probe station are not affected by thermal radiation and thermal convection, and the motion accuracy of each axis remains stable, without accuracy deviations caused by thermal expansion and contraction; furthermore, when the heat insulation tank is made of stainless steel, it also has an electromagnetic shielding function, which can reduce electromagnetic interference from the heating system to the test circuit or other precision instruments, thereby comprehensively improving the testing accuracy, reliability, and long-term operational stability of the probe station.

[0135] Reference Figure 11 and Figure 12 In some preferred embodiments of the present invention, the airflow guide cap 420 can be a strip extending along the outer periphery of the substrate heating plate 1. The strip is provided with a waist hole 440. The length direction of the waist hole 440 is set along the length direction of the strip. The waist hole 440 is provided with a positioning screw 450 connecting the substrate heating plate 1. The waist hole 440 can be adjusted relative to the positioning screw 450 along its own length direction.

[0136] It is readily understood that this invention sets the airflow guide cap 420 as a strip extending along the outer periphery of the substrate heating plate 1, and provides a waist hole 440 and a positioning screw 450 on this strip, allowing the installation position of the airflow guide cap 420 to be flexibly adjusted along the length of the waist hole 440. This adjustable structure, on the one hand, can adaptively adjust the relative position of the airflow guide cap 420 and the heating plate according to different specifications of the substrate heating plate 1 or different temperature control requirements, thereby optimizing the size of the heat flow micro-circulation space 430 and the airflow guiding angle; on the other hand, the cooperation between the waist hole 440 and the positioning screw 450 achieves a floating connection during the installation of the guide cap. When the substrate heating plate 1 undergoes thermal expansion at high temperatures, the guide cap can generate a slight displacement relative to the positioning screw 450 through the waist hole 440, effectively releasing thermal stress and avoiding constrained deformation of the substrate plate 260, ensuring the structural integrity and flatness accuracy of the heating plate and the substrate plate 260 under high-temperature conditions.

[0137] In some preferred embodiments of the present invention, the positioning screw 450 may include a threaded section, a cylindrical section, and a screw head. The cylindrical section is located between the threaded section and the screw head, and the diameter of the cylindrical section is also between the threaded section and the screw head. Therefore, the threaded section connects to the carrier heating plate 1, such as the carrier plate 260, while the cylindrical section abuts against the carrier plate 260, so that the positioning screw 450 is fixed. At the same time, the cylindrical section is located in the waist hole 440 and can cooperate with the waist hole 440, so that the airflow guide cap 420 can change its position along the axial and radial directions of the cylindrical section to meet the needs of thermal deformation compensation.

[0138] In some preferred embodiments of the present invention, the airflow guide cap 420 can be designed as a non-circular shape, which has deformability, is convenient for installation, and does not affect the setting of other components.

[0139] In some preferred embodiments of the present invention, the airflow guide cap 420 may include a mounting portion 460 that fits the outer periphery of the carrier heating plate 1 and a cap brim portion 470 that connects to the mounting portion 460. The cap brim portion 470 is used to cooperate in forming a heat flow microcirculation space 430.

[0140] It is readily understood that by configuring the airflow guide cap 420 as a mounting portion 460 that fits against the outer periphery of the substrate heating plate 1 and a brim portion 470 connected to the mounting portion 460, the brim portion 470 can physically block and directionally guide the rising hot air around the substrate heating plate 1. When the rising hot air encounters the brim portion 470, it is forced to change its flow direction and moves outward and downward along the surface of the brim portion 470 to the inner wall of the annular heat preservation portion 410, thereby forming a stable micro-circulation of hot airflow inside the heat preservation groove. This effectively prevents hot air from directly overflowing and cold air from intruding, reduces heat loss caused by the exchange of hot and cold airflows, and further improves the temperature uniformity of the substrate stage surface.

[0141] Meanwhile, the brim 470 helps to reduce the gap between the ring-shaped heat insulation part 410 and the carrier heating plate 1, reducing the direct overflow of hot air and the intrusion of external cold air. At the same time, it is not necessary to strictly control the size of the ring-shaped heat insulation part 410 and the carrier heating plate 1, reducing the manufacturing difficulty.

[0142] Reference Figure 13 and Figure 14 In some preferred embodiments of the present invention, the substrate 2 may include a base member 580 and a heat-insulating member 480 disposed on the base member 580. The heat-insulating member 480 includes an outer barrel member 490 and an inner barrel member 500 disposed inside the outer barrel member 490. The bottom of the inner barrel member 500 and the bottom of the outer barrel member 490 are used to form a tray portion 400, and the barrel wall of the inner barrel member 500 and the barrel wall of the outer barrel member 490 are used to form a ring-shaped heat-insulating portion 410.

[0143] It is readily understood that this invention sets the carrier base 2 as a combination of a base component 580 and an insulation component 480, and further specifies the insulation component 480 as an outer barrel component 490 and an inner barrel component 500 disposed within the outer barrel component 490. The bottom of the inner barrel component 500 and the bottom of the outer barrel component 490 form a carrier plate portion 400, and the barrel wall of the inner barrel component 500 and the barrel wall of the outer barrel component 490 form a ring-shaped insulation portion 410. This double-layer nested structure provides a physical basis for vacuum insulation, allowing the carrier heating plate 1 to be embedded inside the inner barrel component 500, achieving all-round thermal insulation of the sides and bottom. At the same time, the modular double-layer structure facilitates the independent processing, assembly, and maintenance of each component, reducing manufacturing costs and assembly difficulty.

[0144] It should be noted that the outer tub part 490 and the inner tub part 500 are descriptions based on shape and do not represent a size ratio. They can also be replaced by outer basin part and inner basin part.

[0145] In some preferred embodiments of the present invention, the space between the outer barrel 490 and the inner barrel 500 can form a vacuum insulation cavity, which includes a side vacuum cavity portion 510 and a bottom vacuum cavity portion 520. The side vacuum cavity portion 510 is located between the inner wall surface of the outer barrel 490 and the outer wall surface of the inner barrel 500, and the bottom vacuum cavity portion 520 is located between the inner surface of the bottom of the outer barrel 490 and the outer surface of the bottom of the inner barrel 500.

[0146] It is readily understood that this invention forms a vacuum insulation cavity in the space between the outer barrel 490 and the inner barrel 500, specifically configuring the vacuum insulation cavity as a side vacuum cavity 510 and a bottom vacuum cavity 520, so that the vacuum insulation layer simultaneously covers the side and bottom surfaces of the carrier heating plate 1. The vacuum cavity contains almost no air molecules, effectively blocking heat transfer outwards through heat conduction and convection, greatly reducing heat loss. Simultaneously, the continuous design of the side vacuum cavity 510 and the bottom vacuum cavity 520 ensures the uniformity of vacuum extraction and the stability of its maintenance, significantly improving the overall insulation effect. This results in a substantial reduction in the frequency and power of heat replenishment for the carrier heating plate 1 during the high-temperature holding phase, achieving energy saving and consumption reduction.

[0147] In some preferred embodiments of the present invention, a vacuum forming suction port may be provided on the outer side of the outer barrel 490 to facilitate vacuum suction and form the required vacuum effect, while not affecting the internal structure.

[0148] In some preferred embodiments of the present invention, at least one of the inner wall surface of the outer barrel 490 and the outer wall surface of the inner barrel 500 may be provided with a plurality of support frames 530 for abutting against the other, and the space around the support frame 530 is used to form a side vacuum cavity 510.

[0149] It is readily understood that by providing a plurality of support frames 530 for abutting against the other on at least one of the inner wall surface of the outer barrel 490 and the outer wall surface of the inner barrel 500, the inner and outer barrels can resist external atmospheric pressure without collapsing or deforming during vacuuming, ensuring that the effective space of the vacuum chamber is not destroyed. The support frame 530 adopts a thin-plate structure design, which provides reliable support while reducing the contact area with the barrel wall, thereby reducing heat leakage caused by solid contact conduction; the space around the support frame 530 remains connected to form a complete side vacuum chamber 510, achieving a balance between structural strength and excellent thermal insulation performance.

[0150] In some preferred embodiments of the present invention, the support frame 530 can be extended along the axial direction of the inner barrel 500 for ease of manufacturing.

[0151] In some preferred embodiments of the present invention, the inner barrel 500 may have an outer protruding edge 540 that overlaps the top of the outer barrel 490. The outer protruding edge 540 is used to suspend the bottom of the inner barrel 500 so that a bottom vacuum cavity 520 is formed between the inner surface of the bottom of the outer barrel 490 and the outer surface of the bottom of the inner barrel 500.

[0152] It is readily understood that this invention, by providing an outer protruding edge 540 on the inner barrel 500 that overlaps with the top of the outer barrel 490, suspends the bottom of the inner barrel 500, thereby easily forming a bottom vacuum cavity 520 between the bottom of the inner barrel 500 and the inner surface of the bottom of the outer barrel 490. This overlapping structure achieves the positioning and suspension support of the inner barrel 500 without additional welding or fasteners, simplifying the manufacturing process and assembly flow; at the same time, the sealing fit between the outer protruding edge 540 and the top of the outer barrel 490 effectively ensures the airtightness of the vacuum cavity, ensuring the long-term stability and reliability of the vacuum insulation effect.

[0153] In some preferred embodiments of the present invention, a heat-reflective coating may be provided on the inner surface of the inner barrel 500 to further reflect heat and reduce heat absorption.

[0154] In some preferred embodiments of the present invention, a channel connection portion 550 may be provided on the substrate heating plate 1. The channel connection portion 550 is used for the transmission of electrical energy so that the substrate heating plate 1 can heat up, cool down, adsorb and desorb.

[0155] In addition, the ring-shaped insulation part 410 is provided with a notch 560 for connecting the channel connection part 550 to the outside. The channel connection part 550 also includes a ventilation pipe 570 for connecting the heat flow micro-circulation space 430.

[0156] It is readily understood that by providing a receiving channel connection portion 550 on the annular insulation portion 410 to connect to an external notch 560, the external connection lines and pipes such as the vacuum connector, cooling air passage, and heating wire of the wafer heating plate 1 can be easily passed through the insulation groove for external connection, avoiding interference between the lines and the insulation structure. At the same time, the ventilation pipe 570 is connected to the heat flow micro-circulation space 430, allowing the external cooling airflow to be introduced into the outer ring area of ​​the wafer heating plate 1 through this pipe, achieving synergistic cooling with the internal cooling air passage, significantly improving cooling efficiency and shortening the testing cycle; in addition, the ventilation pipe 570 can also be used to introduce inert protective gas into the heat flow micro-circulation space 430 to prevent wafer oxidation at high temperatures, expanding the applicability of the wafer stage.

[0157] In the description of this specification, references to terms such as "an embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" are used to indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0158] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein.

[0159] It should also be noted that in the description of this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0160] Furthermore, the terms “comprising,” “having,” and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to those steps or units that are explicitly listed, but may also include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0161] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0162] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A thermally insulated temperature-controlled substrate stage, characterized in that, include: A wafer heating plate (1) is used to support and heat semiconductor boards; The substrate base (2) includes a substrate portion (400) for carrying and supporting the substrate heating plate (1) and a ring-shaped heat preservation portion (410) erected on the substrate portion (400). The internal space of the ring-shaped heat preservation portion (410) is used to set the substrate heating plate (1), and an airflow guide cap (420) is provided on the outside of the substrate heating plate (1). The airflow guide cap (420), the ring-shaped heat preservation part (410), the carrier plate part (400) and the carrier plate heating plate (1) cooperate to form a heat flow micro-circulation space (430). The airflow guide cap (420) is a strip extending along the outer periphery of the substrate heating plate (1). The strip is provided with a waist hole (440). The length direction of the waist hole (440) is set along the length direction of the strip. The waist hole (440) is provided with a positioning screw (450) for connecting the substrate heating plate (1). The waist hole (440) can be adjusted relative to the positioning screw (450) along its own length direction.

2. The insulated temperature-controlled substrate stage according to claim 1, characterized in that, The airflow guide cap (420) includes a mounting portion (460) that fits the outer periphery of the carrier heating plate (1) and a cap brim portion (470) that connects to the mounting portion (460). The cap brim portion (470) is used to cooperate in forming the heat flow microcirculation space (430).

3. The insulated temperature-controlled substrate stage according to claim 1, characterized in that, The substrate base (2) includes a base component (580) and an insulation component (480) disposed on the base component (580). The insulation component (480) includes an outer barrel component (490) and an inner barrel component (500) disposed inside the outer barrel component (490). The bottom of the inner barrel component (500) and the bottom of the outer barrel component (490) are used to form the tray portion (400). The barrel wall of the inner barrel component (500) and the barrel wall of the outer barrel component (490) are used to form the ring-shaped insulation portion (410).

4. The insulated temperature-controlled substrate stage according to claim 3, characterized in that, The space between the outer barrel (490) and the inner barrel (500) forms a vacuum insulation cavity. The vacuum insulation cavity includes a side vacuum cavity (510) and a bottom vacuum cavity (520). The side vacuum cavity (510) is located between the inner wall of the outer barrel (490) and the outer wall of the inner barrel (500). The bottom vacuum cavity (520) is located between the inner surface of the bottom of the outer barrel (490) and the outer surface of the bottom of the inner barrel (500).

5. The insulated temperature-controlled substrate stage according to claim 4, characterized in that, At least one of the inner wall surface of the outer barrel (490) and the outer wall surface of the inner barrel (500) is provided with a plurality of support frames (530) for abutting against the other, and the space around the support frames (530) is used to form the side vacuum cavity (510).

6. The insulated temperature-controlled substrate stage according to claim 4, characterized in that, The inner barrel (500) has an outer protruding edge (540) that overlaps the top of the outer barrel (490). The outer protruding edge (540) is used to suspend the bottom of the inner barrel (500) so that the bottom vacuum cavity (520) is formed between the inner surface of the bottom of the outer barrel (490) and the outer surface of the bottom of the inner barrel (500). And / or, the inner surface of the inner barrel component (500) is provided with a heat-reflective coating.

7. The insulated temperature-controlled substrate stage according to claim 1, characterized in that, The heating plate (1) has a channel connection (550) for the transmission of electrical energy so that the heating plate (1) can heat up, cool down, adsorb and desorb. The ring-shaped heat insulation part (410) is provided with a notch (560) for connecting the channel connection part (550) to the outside. The channel connection part (550) also includes a ventilation pipe (570) for connecting the heat flow micro-circulation space (430).

8. The insulated temperature-controlled substrate stage according to claim 1, characterized in that, The substrate heating plate (1) includes a stacked heat insulation base (100), a heating plate body (120), an insulating conduction plate (250), and a substrate plate (260). A constraint system (140) is provided between the heat insulation base (100) and the heating plate body (120). The constraint system (140) includes a translation constraint component (150), a vertical constraint component (180), and a rotation constraint component (200). The heating plate body (120), the insulating conduction plate (250) and the carrier plate (260) are provided with a center positioning and adsorption fixing structure; A rotational constraint structure is provided between the heat insulation base (100) and the substrate disk (260).

9. A semiconductor probe station, characterized in that, Includes the insulated temperature-controlled slide stage as described in any one of claims 1 to 8.

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