Optical coupling assembly and method of manufacturing the same
Patent Information
- Application Number
- CN202510510744.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2026-10-23
AI Technical Summary
[0003]然而,光纤这样单层的安装方式,会使得共封装光学组件中的光路密度受到限制
[0019]根据上述实施例所揭露之光耦合组件及其制造方法,光纤于定位槽部上排列成多层,且至少部分的光纤受支撑部支撑。因此,光耦合组件的光纤阵列能在包含多层光纤的同时将光纤精准地设置在所需的位置。如此一来,便能在提高光路密度的同时兼顾安装光纤的可靠度。
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Figure CN122962730A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an optical coupling component and its manufacturing method, and more particularly to an optical coupling component comprising an optical fiber and its manufacturing method. Background Technology
[0002] Generally, co-packaged optics (CPO) includes an optical engine, which in turn contains a photonic chip (PIC) and an electronic chip (EIC). Optical signals travel through optical fiber into the photonic chip, while the electronic chip converts the optical signals into electrical signals. Traditionally, the optical fiber is mounted as a single layer on a carrier board to achieve optical coupling with the photonic chip.
[0003] However, the single-layer installation method of optical fiber limits the optical path density in co-packaged optical components. In other words, the number of optical fibers that can be installed in traditional co-packaged optical components is very limited, which further restricts the application of co-packaged optical components. Summary of the Invention
[0004] The present invention provides an optical coupling component and a method for manufacturing the same, which improves optical path density through multiple layers of optical fiber.
[0005] An embodiment of the present invention discloses an optical coupling component comprising at least one fiber array. The at least one fiber array includes a carrier plate, a plurality of optical fibers, a first adhesive layer, and a cover plate. The carrier plate includes a positioning groove and a support portion connected to each other. The support portion is higher than the positioning groove. The optical fibers are arranged in multiple layers on the positioning groove. At least a portion of the optical fibers are supported by the support portion. The first adhesive layer adheres the optical fibers to the carrier plate. The cover plate is disposed on the first adhesive layer, and at least a portion of the first adhesive layer is located between the cover plate and the support portion.
[0006] In one embodiment of the present invention, the support portion has a support surface. At least a portion of the optical fiber is supported by the support surface. Optical fibers of different layers are aligned with each other in a direction perpendicular to a normal direction of the support surface.
[0007] In one embodiment of the present invention, the positioning slot has multiple positioning grooves. The optical fibers of one layer are respectively positioned in the positioning grooves.
[0008] In one embodiment of the present invention, the optical coupling component further includes a second adhesive layer. The positioning groove and the support portion together form a bottom surface. The bottom surface faces away from the optical fiber. The number of at least one optical fiber array is two. The bottom surfaces of the two carrier plates of the two optical fiber arrays are bonded to each other through the second adhesive layer.
[0009] In one embodiment of the present invention, the number of optical fibers in different layers is the same.
[0010] In one embodiment of the present invention, the number of optical fibers in different layers is different.
[0011] In one embodiment of the present invention, a first-layer optical fiber is closer to the positioning groove than a second-layer optical fiber, and the number of first-layer optical fibers is less than the number of second-layer optical fibers.
[0012] In one embodiment of the present invention, an optical fiber in a first layer is closer to the positioning groove than an optical fiber in a second layer, and at least a portion of the optical fibers in the first layer are aligned with at least a portion of the optical fibers in the second layer along a thickness direction of the carrier plate.
[0013] In one embodiment of the present invention, the optical coupling component further includes a waveguide. The waveguide includes at least a substrate, a cladding layer, and a plurality of fiber cores. The cladding layer is disposed on the substrate. The fiber cores are disposed in the cladding layer and are optically coupled to at least a portion of the optical fibers in the optical fiber array.
[0014] In one embodiment of the present invention, the core of the waveguide is optically coupled to an optical fiber.
[0015] In one embodiment of the present invention, the core of the waveguide is optically coupled to a portion of the optical fiber.
[0016] Another embodiment of the present invention discloses a method for manufacturing an optical coupling component, comprising: providing a carrier plate and processing the carrier plate into a positioning groove portion and a support portion connected to each other, the support portion being higher than the positioning groove portion; bonding a plurality of optical fibers to the carrier plate through a first adhesive layer, the optical fibers being arranged in multiple layers on the positioning groove portion, and at least a portion of the optical fibers being supported by the support portion; and disposing a cover plate on the first adhesive layer, at least a portion of the first adhesive layer being located between the cover plate and the support portion.
[0017] In one embodiment of the present invention, the method of manufacturing an optical coupling component further includes: providing a substrate; disposing a cladding layer on the substrate and disposing a plurality of fiber cores in the cladding layer; and optically coupling the fiber cores to at least a portion of an optical fiber.
[0018] In one embodiment of the present invention, the step of attaching an optical fiber to a carrier plate through a first adhesive layer includes: disposing a first sub-adhesive layer on the carrier plate; partially disposing a first layer of optical fiber in the first sub-adhesive layer such that the first layer of optical fiber is disposed in a positioning groove; disposing a second sub-adhesive layer and a second layer of optical fiber on the first sub-adhesive layer and the first layer of optical fiber; and disposing a third sub-adhesive layer on the second sub-adhesive layer and the second layer of optical fiber.
[0019] According to the optical coupling assembly and its manufacturing method disclosed in the above embodiments, optical fibers are arranged in multiple layers on the positioning groove, and at least a portion of the optical fibers are supported by the support portion. Therefore, the optical fiber array of the optical coupling assembly can accurately position the optical fibers at the required locations while including multiple layers of optical fibers. In this way, the optical path density can be improved while ensuring the reliability of the installed optical fibers. Attached Figure Description
[0020] Figures 1 to 22 A method for manufacturing an optical coupling component according to a first embodiment of the present invention is presented.
[0021] Figure 23 and Figure 24 The optical fiber assembly and waveguide according to the second embodiment of the present invention are presented respectively.
[0022] Figure 25 and Figure 26 The optical fiber assembly and waveguide according to the third embodiment of the present invention are presented respectively.
[0023] Figure 27 and Figure 28 The optical fiber assembly and waveguide according to the fourth embodiment of the present invention are presented respectively. Detailed Implementation
[0024] The following detailed description of the embodiments of the present invention outlines its features and advantages. This description is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and to implement them accordingly. Furthermore, based on the disclosure, patent claims, and drawings in this specification, anyone skilled in the art can easily understand the relevant objectives and advantages of the present invention. The following embodiments further illustrate the points of the present invention but are not intended to limit the scope of the invention in any way.
[0025] The following will be referred to Figures 1 to 22 A method for manufacturing an optical coupling component 10 according to a first embodiment of the present invention is described. Figures 1 to 22 A method for manufacturing an optical coupling component according to a first embodiment of the present invention is presented. The method for manufacturing the optical coupling component 10 may include, for example, the following steps.
[0026] First, such as Figure 1 and Figure 2 As shown, a carrier plate 110 is provided and is processed, for example by laser processing or machining, into a configuration comprising a positioning groove 111 and a support portion 112 connected to each other. The support portion 112 is higher than the positioning groove 111. Specifically, the positioning groove 111 and the support portion 112 together form a bottom surface 113. The support portion 112 is higher than the positioning groove 111 relative to the bottom surface 113. Furthermore, the positioning groove 111 has a plurality of positioning grooves 1110. These positioning grooves 1110 are, for example, V-shaped. The support portion 112 has a support surface 1120. The bottom surface 113 faces away from the positioning grooves 1110 and the support surface 1120. Furthermore, the carrier plate 110 is made of glass, for example, but is not limited thereto. In other embodiments, the carrier plate may also be made of a less deformable material such as ceramic or silicon.
[0027] Next, as Figures 3 to 8As shown, a plurality of optical fibers 121-124 are bonded to the carrier plate 110 through a first adhesive layer 130. In this embodiment, for example, the optical fibers 121-124 are bonded to the carrier plate 110 layer by layer through the first adhesive layer 130. That is, in this embodiment, the step of bonding the optical fibers 121-124 to the carrier plate 110 through the first adhesive layer 130 includes, for example, the following steps.
[0028] First, such as Figure 3 As shown, a first sub-adhesive layer 131 is disposed on the carrier plate 110.
[0029] Next, as Figure 4 As shown, the first layer of optical fiber 121 is partially disposed in the first sub-adhesive layer 131, such that the first layer of optical fiber 121 is positioned, for example, in the positioning groove 1110 of the positioning groove portion 111.
[0030] Next, as Figure 5 As shown, a second sub-adhesive layer 132 and a second layer optical fiber 122 are disposed on the first sub-adhesive layer 131 and the first layer optical fiber 121.
[0031] Next, as Figure 6 As shown, a third sub-adhesive layer 133 and a third-layer optical fiber 123 are disposed on the second sub-adhesive layer 132 and the second-layer optical fiber 122.
[0032] Next, as Figure 7 As shown, a fourth sub-adhesive layer 134 and a fourth layer optical fiber 124 are disposed on the third sub-adhesive layer 133 and the third layer optical fiber 123.
[0033] Next, as Figure 8 As shown, a fifth sub-adhesive layer 135 is disposed on the fourth sub-adhesive layer 134 and the optical fiber 124 of the fourth layer. The first sub-adhesive layer 131, the second sub-adhesive layer 132, the third sub-adhesive layer 133, the fourth sub-adhesive layer 134, and the fifth sub-adhesive layer 135 together constitute the first adhesive layer 130. The first adhesive layer 130 is formed, for example, by curing a liquid adhesive, to ensure that the optical fibers 121-124 can be firmly adhered to each other to the carrier plate 110. Furthermore, the first adhesive layer 130 is formed, for example, by curing an ultraviolet photosensitive adhesive with ultraviolet light. In addition, the first sub-adhesive layer 131, the second sub-adhesive layer 132, the third sub-adhesive layer 133, the fourth sub-adhesive layer 134, and the fifth sub-adhesive layer 135 are disposed on the carrier plate 110, for example, by dispensing.
[0034] Figures 3 to 8The method of bonding optical fibers 121-124 to the carrier plate 110 layer by layer through the first adhesive layer 130 makes the placement and alignment of optical fibers 121-124 more convenient. However, the present invention is not limited thereto. In other embodiments, if the convenience of optical fiber placement and alignment is not considered, the entire first adhesive layer and optical fibers can be placed on the carrier plate at once.
[0035] In addition, such as Figure 8 As shown, in this embodiment, optical fibers 121-124 each include a fiber core 125 and a cladding 126 covering the fiber core 125. At least a portion of the optical fibers 121-124 are supported by a support surface 1120. Furthermore, the optical fibers 121-124 of different layers are aligned with each other along a direction A perpendicular to a normal direction N of the support surface 1120. Alternatively, the fiber cores 125 of the optical fibers 121-124 of different layers are aligned with each other along an alignment line L parallel to the support surface 1120. In this way, the optical fibers 121-124 can be arranged more densely on the carrier plate 110, thereby further improving the optical path density.
[0036] Furthermore, in this embodiment, for example, the number of optical fibers 121 to 124 in different layers is the same, such as 4 fibers each. In some embodiments, the number of optical fibers in a single layer can be adjusted to 2 to 32 fibers according to actual needs. In addition, in other embodiments, the optical fibers can be arranged in any number of layers, such as 6, 8, or 12 layers.
[0037] Next, as Figure 9 As shown, a cover plate 140 is disposed on the first adhesive layer 130. At least a portion of the first adhesive layer 130 is located between the cover plate 140 and the support portion 112. Furthermore, relative to the bottom surface 113 facing away from the optical fibers 121-124, the height of the support portion 112 is lower than the height of the uppermost optical fiber 124 and the height of the first adhesive layer 130. The cover plate 140 is made of, for example, glass. Thus, the fabrication of an optical fiber array 100 comprising the carrier plate 110, optical fibers 121-124, the first adhesive layer 130, and the cover plate 140 is completed.
[0038] Because optical fibers 121-124 are arranged in multiple layers on the positioning groove 111, and at least a portion of the optical fibers 121-124 are supported by the support portion 112, the fiber array 100 can precisely position the optical fibers 121-124 at the required locations while including multiple layers of optical fibers 121-124. In this way, the optical path density can be increased while maintaining the reliability of the installed optical fibers 121-124.
[0039] Next, as Figure 10 and Figure 11As shown, another fiber array 100 is provided, and the two bottom surfaces 113 of the two carrier plates 110 of the two fiber arrays 100 are bonded to each other through a second adhesive layer 200. The second adhesive layer 200 is, for example, a sheet adhesive.
[0040] Next, as Figure 12 As shown, a substrate 310 is provided. The substrate 310 is made of glass, for example, but is not limited thereto. In other embodiments, the substrate may also be made of a less deformable material such as ceramic or silicon.
[0041] Next, as Figures 13 to 19 As shown, a cladding layer 320 is disposed on a substrate 310, and a plurality of fiber cores 331 to 334 are disposed within the cladding layer 320. In this embodiment, for example, the cladding layer 320 is disposed on the substrate 310 and the fiber cores 331 to 334 are disposed within the cladding layer 320 layer by layer. That is, in this embodiment, the steps of disposing the cladding layer 320 on the substrate 310 and disposing the plurality of fiber cores 331 to 334 within the cladding layer 320 include, for example, the following steps.
[0042] First, such as Figure 13 As shown, for example, a first sub-coating layer 321 is disposed on the substrate 310 by coating or lamination and curing.
[0043] Next, as Figure 14 and Figure 15 As shown, a first core layer 335 is disposed on a first sub-covering layer 321, for example by coating or lamination, and a plurality of fiber cores 331 are formed on the first sub-covering layer 321 by removing portions of the first core layer 335, for example by photolithography and curing.
[0044] Next, as Figure 16 As shown, a second sub-covering layer 322 is disposed on the first sub-covering layer 321 and the fiber core 331.
[0045] Next, as Figure 17 As shown, a third sub-cladding layer 323 is disposed on the second sub-cladding layer 322 to form a plurality of fiber cores 332 located on the second sub-cladding layer 322.
[0046] Next, as Figure 18 As shown, a fourth sub-cladding layer 324 is disposed on the third sub-cladding layer 323 to form a plurality of fiber cores 333 located on the third sub-cladding layer 323.
[0047] Next, as Figure 19As shown, a fifth sub-cladding layer 325 is disposed on the fourth sub-cladding layer 324, forming a plurality of fiber cores 334 on the fourth sub-cladding layer 324. The first sub-cladding layer 321, the second sub-cladding layer 322, the third sub-cladding layer 323, the fourth sub-cladding layer 324, and the fifth sub-cladding layer 325 together constitute the cladding layer 320. The cladding layer 320 is made of polymers such as polyimide (PI) and benzocyclobutene (BCB). The method of forming the fiber cores 332 to 334 is similar to the method of forming the fiber core 331, and is therefore simply shown in the figure and will not be described in detail in the specification. At this point, the fabrication of a waveguide 300 including the substrate 310, the cladding layer 320, and the fiber cores 331 to 334 is completed.
[0048] Figures 13 to 19 The method of depositing the cladding layer 320 layer by layer on the substrate 310 and placing the fiber cores 331-334 within the cladding layer 320 makes the placement and alignment of the fiber cores 331-334 more convenient. However, the present invention is not limited thereto. In other embodiments, if the convenience of fiber core placement and alignment is not considered, the entire cladding layer and fiber cores can be placed on the substrate at once.
[0049] Next, as Figure 20 and Figure 21 As shown, another waveguide 300 is provided, and the two substrates 310 of the two waveguides 300 are bonded to each other through a third adhesive layer 400. The third adhesive layer 400 is, for example, a sheet adhesive.
[0050] Next, as Figure 22 As shown, the fiber cores 331 to 334 of waveguide 300 are optically coupled to the optical fibers 121 to 124 of fiber array 100, respectively. Furthermore, the fiber cores 125 of optical fibers 121 to 124 are optically coupled to the fiber cores 331 to 334 of waveguide 300, respectively. In this embodiment, the fiber cores 331 to 334 and optical fibers 121 to 124 have, for example, the same number and arrangement, so the number and arrangement of the fiber cores 331 to 334 will not be described again. Thus, the fabrication of the optical coupling assembly 10, comprising two fiber arrays 100, a second adhesive layer 200, two waveguides 300, and a third adhesive layer 400, is complete.
[0051] It should be noted that the carrier plate 110 of the adjacent fiber array 100 and the substrate 310 of the waveguide 300 can be assembled together by any suitable means such as snap-fit or adhesive bonding. In addition, the fiber cores 125 of the optical fibers 121-124 and the fiber cores 331-334 of the waveguide 300 are made of different materials, for example.
[0052] Furthermore, the optical coupling component 10 of this embodiment includes two fiber arrays 100 bonded by a second adhesive layer 200 and two waveguides 300 bonded by a third adhesive layer 400. Therefore, the optical path density of the optical coupling component 10 can be further increased, enabling it to cooperate with photonic chips with higher optical path density. However, the present invention is not limited thereto. In other embodiments, depending on the form of the photonic chip cooperating with the optical coupling component, the optical coupling component may also include only one fiber array 100 and one waveguide 300. Furthermore, in other embodiments, depending on the actual optical path design, the optical coupling component may not include the waveguide 300.
[0053] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.
[0054] This invention is not limited to the arrangement of optical fibers; the arrangement can be adjusted according to the form of the photonic chip that mates with the optical coupling component. For example, please refer to... Figure 23 and Figure 24 . Figure 23 and Figure 24 Optical fiber assemblies and waveguides according to the second embodiment of the present invention are presented respectively. The main difference between the optical fiber assembly 100a of this embodiment and the optical fiber assembly 100 of the first embodiment lies in the arrangement of optical fibers 121a to 124a. Figure 23 As shown, in this embodiment, the number of optical fibers 121a to 124a in different layers is different. Furthermore, the optical fibers 121a in the first layer are closer to the positioning groove 111 than the optical fibers 122a in the second layer, and the number of optical fibers 121a in the first layer is less than the number of optical fibers 122a in the second layer. Similarly, the number of optical fibers 122a in the second layer is less than the number of optical fibers 123a in the third layer, and the number of optical fibers 123a in the third layer is less than the number of optical fibers 124a in the fourth layer. In addition, in this embodiment, the carrier plate 110a includes a positioning groove 111 and two support portions 112. The two support portions 112 are respectively connected to opposite sides of the positioning groove 111 and support at least a portion of the optical fibers 124a. Furthermore, optical fibers 121a are closer to the positioning groove 111 than optical fibers 123a, and at least a portion of the optical fibers 121a are aligned with at least a portion of the optical fibers 123a along a thickness direction D of the carrier plate 110a. Furthermore, optical fiber 122a is closer to the positioning groove 111 than optical fiber 124a, and at least a portion of optical fiber 122a is aligned with at least a portion of optical fiber 124a along the thickness direction D of the carrier plate 110a.
[0055] In addition, such as Figure 24As shown, the arrangement of fiber cores 331a to 334a in waveguide 300a in this embodiment corresponds to the adjustment of optical fibers 121a to 124a, and therefore will not be described again. It should be understood that optical fibers 121a to 124a can be optically coupled to fiber cores 331a to 334a respectively, and... Figure 23 The two-fiber array 100a and the second adhesive layer 200 are described. Figure 24 The two waveguides 300a and the third adhesive layer 400 can form an optical coupling component.
[0056] This invention is not limited to the spacing between optical fibers in the same layer; the spacing between optical fibers in the same layer can be adjusted according to the form of the photonic chip that mates with the optical coupling assembly. For example, please refer to... Figure 25 and Figure 26 . Figure 25 and Figure 26 Optical fiber assemblies and waveguides according to a third embodiment of the present invention are presented respectively. The main difference between the optical fiber assembly 100b of this embodiment and the optical fiber assembly 100 of the first embodiment lies in the spacing between optical fibers 121b to 124b. Figure 25 As shown, in this embodiment, compared to the optical fibers 121-124 of the first embodiment, the spacing between optical fibers 121b, 122b, 123b, and 124b of the same layer are all increased. Correspondingly, in this embodiment, the positioning groove 111b of the carrier plate 110b further has multiple flat surfaces 1111b. The flat surfaces 1111b are located between these positioning grooves 1110.
[0057] In addition, such as Figure 26 As shown, the arrangement of fiber cores 331b to 334b in waveguide 300b in this embodiment corresponds to the adjustment of optical fibers 121b to 124b, and therefore will not be described again. It should be understood that optical fibers 121b to 124b are optically coupled to fiber cores 331b to 334b respectively, and... Figure 25 The two-fiber array 100b and the second adhesive layer 200 are described. Figure 26 The two waveguides 300b and the third adhesive layer 400 can form an optical coupling component.
[0058] The optical fiber of this invention is not limited to being optically coupled to the fiber core of the waveguide separately; depending on the form of the photonic chip that mates with the optical coupling component, only a portion of the optical fiber may be optically coupled to the fiber core of the waveguide. For example, please refer to... Figure 27 and Figure 28 . Figure 27 and Figure 28 Optical fiber assemblies and waveguides according to the fourth embodiment of the present invention are presented respectively. The main difference between the optical fiber assembly 100c of this embodiment and the optical fiber assembly 100a of the second embodiment lies in the optical coupling configuration of optical fibers 121c to 124c. Figure 27 and Figure 28 As shown, fiber cores 331c and 333c of waveguide 300c are optically coupled to fiber cores 121c to 124c in certain layers. Specifically, fiber core 331c of waveguide 300c is optically coupled to fiber 121c, and fiber core 333c of waveguide 300c is optically coupled to fiber 123c. In other words, fibers 122c and 124c are dummy fibers; no optical signals are transmitted to fibers 122c and 124c during actual use, and waveguide 300c does not contain any fiber cores optically coupled to fibers 122c and 124c. It should be understood that... Figure 27 The two-fiber array 100c and the second adhesive layer 200 are described. Figure 28 The two waveguides 300c and the third adhesive layer 400 can form an optical coupling component.
[0059] According to the optical coupling assembly and its manufacturing method disclosed in the above embodiments, optical fibers are arranged in multiple layers on the positioning groove, and at least a portion of the optical fibers are supported by the support portion. Therefore, the optical fiber array of the optical coupling assembly can accurately position the optical fibers at the required locations while including multiple layers of optical fibers. In this way, the optical path density can be improved while ensuring the reliability of the installed optical fibers.
[0060] (Symbol Explanation)
[0061] 10: Optical coupling components
[0062] 100, 100a, 100b, 100c: Fiber optic arrays
[0063] 110, 110a, 110b: Carrier plates
[0064] 111, 111b: Positioning groove
[0065] 1110: Positioning groove
[0066] 1111b: Flat surface
[0067] 112: Support section
[0068] 1120: Support surface
[0069] 113: Bottom surface
[0070] 121~124, 121a~124a, 121b~124b, 121c~124c: Optical fiber
[0071] 125: Fiber Core
[0072] 126: Cladding
[0073] 130: First adhesive layer
[0074] 131: First Sub-adhesive Layer
[0075] 132: Second Sub-adhesive Layer
[0076] 133: Third Sub-adhesive Layer
[0077] 134: Fourth Sub-adhesive Layer
[0078] 135: Fifth Sub-adhesive Layer
[0079] 140: Cover plate
[0080] 200: Second adhesive layer
[0081] 300, 300a, 300b, 300c: Waveguide
[0082] 310:Substrate
[0083] 320: Covering layer
[0084] 321: First sub-coating layer
[0085] 322: Second sub-coating layer
[0086] 323: Third sub-coating layer
[0087] 324: Fourth sub-coating layer
[0088] 325: Fifth sub-coating layer
[0089] 331~334, 331a~334a, 331b~334b, 331c, 333c: Fiber core
[0090] 400: Third adhesive layer
[0091] N: Normal direction
[0092] A: direction
[0093] L: Alignment line
[0094] D: Thickness direction.
Claims
1. An optical coupling component, comprising: At least one fiber optic array, comprising: A carrier plate includes a positioning groove and a support portion connected to each other, the support portion being higher than the positioning groove; Multiple optical fibers are arranged in multiple layers on the positioning groove, and at least some of these optical fibers are supported by the support portion. A first adhesive layer is used to adhere the optical fibers to the carrier plate; and A cover plate is disposed on the first adhesive layer, and at least a portion of the first adhesive layer is located between the cover plate and the support portion.
2. The optical coupling assembly of claim 1, wherein the support portion has a support surface, at least a portion of the optical fibers are supported by the support surface, and the optical fibers of different layers are aligned with each other in a direction perpendicular to a normal direction of the support surface.
3. The optical coupling assembly as claimed in claim 1, wherein the positioning slot has a plurality of positioning grooves, and the optical fibers of one layer are respectively positioned in the positioning grooves.
4. The optical coupling assembly as claimed in claim 1 further includes a second adhesive layer, the positioning groove and the support portion together form a bottom surface, the bottom surface facing away from the optical fibers, the number of the at least one optical fiber array is two, and the two bottom surfaces of the two carrier plates of the two optical fiber arrays are bonded to each other through the second adhesive layer.
5. The optical coupling assembly of claim 1, wherein the number of optical fibers in different layers is the same.
6. The optical coupling assembly of claim 1, wherein the number of optical fibers in different layers is different.
7. The optical coupling assembly of claim 6, wherein the optical fibers of a first layer are closer to the positioning slots than the optical fibers of a second layer, and the number of optical fibers of the first layer is less than the number of optical fibers of the second layer.
8. The optical coupling assembly of claim 1, wherein the optical fibers of a first layer are closer to the positioning slots than the optical fibers of a second layer, and at least a portion of the optical fibers of the first layer are aligned with at least a portion of the optical fibers of the second layer along a thickness direction of the carrier plate.
9. The optical coupling component of claim 1, further comprising a waveguide, the waveguide comprising: At least one substrate; A coating layer is disposed on the substrate; and Multiple fiber cores are disposed in the cladding layer and optically coupled to at least a portion of the optical fibers in the fiber array.
10. The optical coupling assembly of claim 9, wherein the fiber cores of the waveguide are optically coupled to the optical fibers respectively.
11. The optical coupling assembly of claim 9, wherein the fiber cores of the waveguide are optically coupled to the optical fibers of the partial layers.
12. A method for manufacturing an optical coupling component, comprising: A carrier plate is provided and the carrier plate is processed to include a positioning groove and a support portion that are connected to each other, the support portion being higher than the positioning groove. Multiple optical fibers are bonded to the carrier plate through a first adhesive layer. These optical fibers are arranged in multiple layers on the positioning groove, and at least a portion of the optical fibers are supported by the support portion. A cover plate is disposed on the first adhesive layer, and at least a portion of the first adhesive layer is located between the cover plate and the support portion.
13. The method of manufacturing the optical coupling component as described in claim 12, further comprising: Provide a substrate; A cladding layer is disposed on the substrate, and multiple fiber cores are disposed within the cladding layer; and These fiber cores are optically coupled to at least a portion of these optical fibers.
14. The method of manufacturing an optical coupling assembly as claimed in claim 13, wherein the step of attaching the optical fibers to the carrier plate through the first adhesive layer comprises: A first sub-adhesive layer is disposed on the carrier plate; The optical fibers of the first layer are partially disposed in the first sub-adhesive layer, such that the optical fibers of the first layer are disposed in the positioning groove. A second sub-adhesive layer and the optical fibers of a second layer are disposed on the first sub-adhesive layer and the optical fibers of the first layer; and A third sub-adhesive layer is disposed on the second sub-adhesive layer and the optical fibers of the second layer.