Optical fiber bidirectional optical transceiver connection module

Abstract

The application discloses a kind of optical fiber bidirectional optical transceiver connection module, belong to optical signal connection technical field, including integrated circuit board integrated with optical module chip and optical module shell, and optical transceiver assembly and signal terminal end are respectively arranged at the both ends of optical module shell, and optical module shell includes plastic package shell seat and metal cover, and heat exchange substrate for bearing integrated circuit board is arranged in the inside of optical module shell, and heat dissipation fin group is integrally arranged on metal cover, and heat dissipation fin group and heat exchange substrate are matched to realize the efficient heat dissipation of integrated circuit board.The application is by setting movable heat exchange baffle and plugging mouth, for the first time in optical module field realizes the intelligent switching of two states of "static sealing" and "dynamic heat dissipation", overcomes inherent contradiction that traditional full plastic package module is good in sealing but poor in heat dissipation, contact type heat dissipation module has certain heat dissipation capacity but is insufficient in sealing, realizes the technical breakthrough that sealing and heat dissipation both get, and does not need additional power drive, and pure mechanical linkage is reliable and efficient.

Description

Technical Field

[0001] This invention relates to the field of optical signal connection technology, and in particular to a fiber optic bidirectional optical transceiver connection module. Background Technology

[0002] Existing fiber optic bidirectional transceiver modules typically employ a double-molded encapsulation process to ensure packaging reliability and dustproof performance before installation. While this process effectively prevents dust and moisture from entering the external environment, the sealed encapsulation structure severely restricts the natural conduction of internal heat to the outside. Under extreme operating conditions, the temperature rise generated by the core optical and electrical chips cannot be dissipated in time. This significant temperature increase directly leads to laser wavelength drift, output optical power attenuation, and receiver sensitivity degradation, severely impacting the module's long-term operating accuracy and lifespan.

[0003] To alleviate the aforementioned thermal bottleneck, some existing solutions have introduced contact-type heat dissipation structures. However, these solutions are limited by the compact physical size of the module and its internal operating environment after installation. Their heat conduction paths are long and their thermal resistance is high, making it difficult to achieve efficient and rapid heat dissipation in practical applications and failing to meet the increasing high-load operating requirements of the module. Therefore, a novel fiber optic bidirectional optical transceiver module is proposed. Summary of the Invention

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a fiber optic bidirectional optical transceiver connection module.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fiber optic bidirectional optical transceiver connection module includes an integrated circuit board with an integrated optical module chip and an optical module housing. Optical transceiver components and signal terminals are respectively provided at both ends of the optical module housing. The optical module housing includes a plastic encapsulation base and a metal cover. A heat exchange substrate for supporting the integrated circuit board is provided inside the optical module housing. A heat dissipation fin assembly is integrated on the metal cover. The heat dissipation fin assembly and the heat exchange substrate are paired to achieve efficient heat dissipation of the integrated circuit board. The plastic-encapsulated housing is connected to flip-top caps on both sides by elastic traction components. The elastic traction components control the up-and-down movement of the heat exchange substrate through connecting rod traction components. The optical transceiver assembly is installed at one end of the optical module housing through a shielding base and is dustproof and sealed by the flip-top cap. The signal terminal is installed at the other end of the optical module housing and is detachably connected to the optical module housing through a combination buckle.

[0006] As a preferred embodiment, the heat exchange substrate consists of two heat exchange plates that slide and adhere to each other. The heat exchange plate at the bottom is connected to the integrated circuit board, and the heat exchange plate at the top is connected to a heat exchange plug.

[0007] As a preferred embodiment, the metal cover located between adjacent heat dissipation fin groups has a sealing opening adapted to the heat exchange plug, and the bottom sides of the sealing opening are provided with intermediate heat exchange perforated plates.

[0008] As a preferred embodiment, flexible circuit boards are provided at both ends of the integrated circuit board, and the flexible circuit boards located on both sides of the integrated circuit board are respectively connected to the optical receiver and transmitter assembly and the signal terminal.

[0009] As a preferred embodiment, both ends of the heat exchange plate located at the bottom are provided with guide ends, and the inner wall of the plastic-sealed housing is provided with oblique guide grooves for the two ends of the guide ends to be installed.

[0010] As a preferred embodiment, the elastic traction member includes traction ports opened on both sides of the plastic-sealed housing. The inner wall of the traction port is connected to a limiting push post by a contact spring. The limiting push post is rotatably connected to the guide end by a rotating traction rod.

[0011] As a preferred embodiment, the flip cap is made of elastic plastic, and both ends of the flip cap are connected to an outward push cover plate via a pivot. The outward push cover plate is fixedly connected to both ends of the limiting horizontal push column to cover the traction port and ensure the sealing of the inside of the optical module housing.

[0012] As a preferred embodiment, the push-out cover plate has a guide notch at the end away from the flip cap, and the outer wall of the plastic sealing shell has a limit slot.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention, by setting a movable heat exchange plug and sealing opening, achieves for the first time in the field of optical modules the intelligent switching between "static sealing" and "dynamic heat dissipation" states. In the uninstalled state, the heat exchange plug seals the sealing opening between the heat dissipation fins, forming a fully sealed cavity with the flip cap, effectively preventing the intrusion of external dust and moisture, ensuring the cleanliness and reliability of the module during storage and transportation. In the installed and used state, the heat exchange plug moves downward through the elastic traction component, opening the sealing opening, allowing external cold air to directly enter the shell and flow through the heat dissipation fins and heat exchange substrate, forming a forced convection heat exchange channel, significantly improving heat dissipation efficiency. This design overcomes the inherent contradiction of traditional fully encapsulated modules having good sealing but poor heat dissipation, and contact heat dissipation modules having certain heat dissipation capacity but insufficient sealing, achieving a technological breakthrough that achieves both sealing and heat dissipation, and requires no additional electric drive, with pure mechanical linkage for reliable and efficient operation.

[0014] 2. This invention constructs a composite heat dissipation path that combines conductive and convective heat dissipation. On one hand, the heat dissipation fins integrated on the metal cover and the heat exchange substrate carrying the integrated circuit board inside are paired up and down to form a low thermal resistance conduction path. The heat generated by the chip can be directly transferred to the metal cover and the heat dissipation fins through the heat exchange substrate and dissipated outward. On the other hand, after the sealing opening is opened, a convection channel is formed, and external cold air directly blows across the surface of the heat exchange substrate and the heat dissipation fins, forcibly carrying away the accumulated heat. The sliding and fitting structure composed of two heat exchange plates ensures that the heat conduction path is not interrupted during operation, and the setting of the heat exchange perforated plate in the middle further increases the airflow turbulence, destroys the thermal boundary layer, and enhances the convective heat transfer effect. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a fiber optic bidirectional optical transceiver connection module proposed in this invention; Figure 2 This is a schematic diagram of the structural assembly of a fiber optic bidirectional optical transceiver connection module proposed in this invention; Figure 3 This is a schematic diagram of the installation of the optical transceiver components and signal terminals in a fiber optic bidirectional optical transceiver connection module proposed in this invention. Figure 4 This is a schematic diagram of the optical module housing in a fiber optic bidirectional optical transceiver connection module proposed in this invention; Figure 5 This is a schematic diagram of the connection structure between the elastic traction component and the heat exchange substrate in a fiber optic bidirectional optical transceiver connection module proposed in this invention. Figure 6 This is a schematic diagram of the internal structure of the plastic-encapsulated housing in a fiber optic bidirectional optical transceiver connection module proposed in this invention; Figure 7 This is a schematic diagram of the cross-sectional structure of the metal cover in a fiber optic bidirectional optical transceiver connection module proposed in this invention.

[0016] In the diagram: 1. Integrated circuit board; 2. Optical transceiver assembly; 3. Signal terminal; 4. Plastic encapsulation base; 5. Metal cover; 6. Heat exchange substrate; 7. Heat dissipation fin assembly; 8. Flip cap; 9. Shielding base; 10. Combination fastener; 11. Heat exchange plug; 12. Sealing port; 13. Central heat exchange perforated plate; 14. Flexible circuit board; 15. Guide end; 16. Angled guide groove; 17. Limiting horizontal push column; 18. Traction port; 19. Rotating traction rod; 20. Outward push cover plate; 21. Limiting bayonet. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0020] Example, refer to Figures 1 to 7 A fiber optic bidirectional optical transceiver connection module includes an integrated circuit board 1 with an integrated optical module chip and an optical module housing. Optical transceiver components 2 and signal terminals 3 are respectively provided at both ends of the optical module housing. The optical module housing includes a plastic encapsulation base 4 and a metal cover 5. A heat exchange substrate 6 for supporting the integrated circuit board 1 is provided inside the optical module housing. A heat dissipation fin group 7 is integrated on the metal cover 5. The heat dissipation fin group 7 and the heat exchange substrate 6 are paired to achieve efficient heat dissipation of the integrated circuit board 1. Air cooling is achieved by an air cooling device installed in the server. The separate housing design of the plastic housing 4 and the metal cover 5 not only retains the advantages of the plastic housing 4 in terms of molding complexity and insulation, but also utilizes the metal cover 5 with integrated heat dissipation fins 7 as a high-efficiency heat conduction interface, which, together with the internal heat exchange substrate 6, forms an upper and lower clamping heat dissipation path. This structure significantly shortens the heat conduction path from the chip to the external environment, significantly reduces the contact thermal resistance, and provides basic hardware guarantee for the stable operation of the module under high power conditions.

[0021] The plastic-encapsulated housing 4 has flip-top caps 8 connected to both sides via elastic traction components. The flip-top caps 8 are used to seal the optical transceiver assembly 2. The elastic traction components control the up-and-down movement of the heat exchange substrate 6 via a connecting rod traction component. The optical transceiver assembly 2 is installed at one end of the optical module housing via a shielding seat 9, and dustproof sealing is achieved through the flip-top caps 8. The signal terminal 3 is installed at the other end of the optical module housing and is detachably connected to the optical module housing via a combination fastener 10. The installation of the optical transceiver assembly 2 via the shielding seat 9 can effectively suppress the influence of external electromagnetic interference on the optical signal. The detachable connection of the signal terminal 3 via the combination fastener 10 facilitates the adaptation of the module to external equipment interfaces of different specifications, improving the product's versatility and ease of maintenance.

[0022] Furthermore, the heat exchange substrate 6 is composed of two heat exchange plates that slide and adhere to each other. The heat exchange plates can slide relative to each other. This arrangement ensures that the lower heat exchange plate can move horizontally under the action of the elastic traction member, while the upper heat exchange plate will not move. The heat exchange plate at the bottom is connected to the integrated circuit board 1, and the heat exchange plate at the top is connected to the heat exchange plug 11.

[0023] Furthermore, a sealing opening 12 adapted to the heat exchange plug 11 is provided on the metal cover 5 located between adjacent heat dissipation fin groups 7. A middle heat exchange perforated plate 13 is provided on both sides of the bottom of the sealing opening 12. The middle heat exchange perforated plate 13 is a grid-like or mesh-like metal sheet with a perforation rate of 30% to 60%. By providing the middle heat exchange perforated plate 13 on both sides of the bottom of the sealing opening 12, after the heat exchange plug 11 moves down to open the sealing opening 12, the perforated plate can serve as an auxiliary turbulence element to increase the turbulence when the cold air enters the shell, thereby destroying the boundary layer and enhancing the convective heat transfer effect. In addition, the contact between the middle heat exchange perforated plate 13 and the heat exchange plug 11 can also ensure heat transfer.

[0024] Furthermore, flexible circuit boards 14 are provided at both ends of the integrated circuit board 1. The flexible circuit boards 14 located on both sides of the integrated circuit board 1 are connected to the optical receiver and transmitter assembly and the signal terminal 3, respectively. The provision of flexible circuit boards 14 provides elastic electrical connection margin for the vertical floating movement of the integrated circuit board 1 within the housing, avoiding the risk of solder joint cracking or circuit breakage caused by the stress of traditional rigid circuit boards.

[0025] Furthermore, both ends of the heat exchange plate at the bottom are provided with guide ends 15, and the inner wall of the plastic-sealed housing 4 is provided with inclined guide grooves 16 for the two ends of the guide ends 15 to be installed. The inclined guide grooves 16 are inclined and can move upward when subjected to horizontal traction.

[0026] Furthermore, the elastic traction component includes traction ports 18 opened on both side walls of the plastic-sealed housing 4. The inner wall of the traction port 18 is connected to a limiting horizontal push column 17 by a contact spring. The limiting horizontal push column 17 is rotatably connected to the guide end 15 by rotating the traction rod 19. The engagement of the contact spring, the limiting horizontal push column 17, and the rotating traction rod 19 forms a symmetrical elastic linkage mechanism located on both sides of the housing. The contact spring provides holding force when the module is not installed, ensuring that the heat exchange plug 11 is in a sealed state. When the module is installed and triggered by an external force, the horizontal force and displacement can be efficiently converted into the lifting driving force of the guide end 15 through the horizontal sliding of the limiting horizontal push column 17 and the rotating traction rod 19. This structure is simple and compact, makes full use of the space on the side wall of the housing, has high transmission efficiency, and has a self-resetting function, which can restore the sealing state after the module is pulled out without additional operation.

[0027] Furthermore, the flip cap 8 is made of elastic plastic. Both ends of the flip cap 8 are connected to the push-out cover plate 20 via a pivot. The push-out cover plate 20 is fixedly connected to both ends of the limiting horizontal push column 17 to cover the traction port 18, ensuring the sealing of the inside of the optical module housing. When the push-out cover plate 20 moves horizontally with the limiting horizontal push column 17, it always covers the traction port 18, effectively preventing external dust from entering the housing through the port, and ensuring the overall sealing and dustproof performance of the module during operation and use.

[0028] Meanwhile, the flip cap 8 is made of elastic plastic material. When the optical module is inserted into the device, it can be squeezed and deformed to fit the device interface, achieving an elastic seal at the end. After being pulled out, it can elastically restore its shape and cover the port of the optical transceiver component 2, serving as a dust cap for protection. The structural design is highly integrated.

[0029] Furthermore, the push-out cover 20 has a guide notch at the end away from the flip cap 8, and the outer wall of the plastic casing 4 has a limit slot 21. A limit pin is set on the server at the position corresponding to the upper limit slot 21 of the optical module. When the optical module is installed inward, the limit pin will correspond to the position of the guide notch, exert pressure on the push-out cover 20, and push the push-out cover 20 to move. When installed in place, the limit pin is just locked in the limit slot 21, realizing the limit installation of the optical module. This is a conventional technical means and will not be described in detail here.

[0030] When the optical module is not inserted into the server, the resisting spring pushes the limiting horizontal push column 17 to reset. The limiting horizontal push column 17 pulls the guide end 15 upward along the inclined guide groove 16 by rotating the traction rod 19, which drives the heat exchange substrate 6 to move upward, so that the heat exchange plug 11 located on the top heat exchange plate is embedded in the sealing port 12, thereby sealing the sealing port 12. At the same time, the flip cap 8 closes at the port of the optical transceiver component 2 under its own elasticity, thereby achieving an overall dustproof seal.

[0031] When the optical module is inserted into the server, the limiting pin on the server first contacts the guide notch on the push-out cover 20. As the insertion depth increases, the limiting pin pushes the push-out cover 20 to move horizontally towards the optical transceiver component 2. The push-out cover 20 drives the limiting horizontal push column 17 to slide in the same direction and compress the contact spring. The limiting horizontal push column 17 pushes the guide end 15 to slide downward along the inclined guide groove 16 by rotating the traction rod 19, which drives the heat exchange substrate 6 to move downward, so that the heat exchange plug 11 disengages from the sealing port 12, and the sealing port 12 opens. When the module is inserted into place, the limiting pin engages in the limiting slot 21 to achieve installation locking. At this time, the sealing port 12 remains open, and external cold air can enter the housing through the sealing port 12, flow through the heat dissipation fin assembly 7 and the heat exchange substrate 6, and carry away the heat.

[0032] When the optical module is pulled out of the server, the limit pin disengages from the limit slot 21, the contact spring releases its elastic potential energy, and pushes the limit push column 17 to reset. Through the rotation of the traction rod 19 and the guide end 15, the heat exchange substrate 6 is driven to reset upward, the heat exchange plug 11 is re-embedded into the sealing port 12 to restore the seal, and the flip cap 8 resets and closes at the same time, and the module returns to a fully sealed state.

[0033] The integrated circuit board mounted on the heat exchange substrate 6 is in a mobile state when not installed due to its elastic design. The elastic traction component allows the integrated circuit board 1 to be in a floating support state when not installed. Vibrations and impacts generated during transportation, transfer, or installation can be absorbed by the elastic deformation of the contact spring and the rotating traction rod 19, thereby effectively avoiding rigid impact damage to the internal core optical and electrical chips, and significantly improving the product's transportation reliability and installation yield.

[0034] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A fiber optic bidirectional optical transceiver module, comprising an integrated circuit board (1) with an integrated optical module chip and an optical module housing, characterized in that, The optical module housing is provided with an optical transceiver assembly (2) and a signal terminal (3) at both ends. The optical module housing includes a plastic encapsulation base (4) and a metal cover (5). The optical module housing is provided with a heat exchange substrate (6) that carries the integrated circuit board (1). The metal cover (5) is integrated with a heat dissipation fin assembly (7). The heat dissipation fin assembly (7) and the heat exchange substrate (6) are paired to achieve efficient heat dissipation of the integrated circuit board (1). The plastic-sealed housing (4) is connected to flip caps (8) on both sides by elastic traction members. The elastic traction members control the up and down movement of the heat exchange substrate (6) through the connecting rod traction members. The optical transceiver assembly (2) is installed at one end of the optical module housing through the shielding seat (9) and is dustproof and sealed through the flip cap (8). The signal terminal (3) is installed at the other end of the optical module housing and is detachably connected to the optical module housing through the combination buckle (10).

2. The fiber optic bidirectional optical transceiver module according to claim 1, characterized in that, The heat exchange substrate (6) consists of two heat exchange plates that slide and adhere to each other. The heat exchange plate at the bottom is connected to the integrated circuit board (1), and the heat exchange plate at the top is connected to a heat exchange plug (11).

3. The fiber optic bidirectional optical transceiver module according to claim 1, characterized in that, The metal cover (5) located between adjacent heat dissipation fin groups (7) has a sealing opening (12) adapted to the heat exchange plug (11), and the bottom sides of the sealing opening (12) are provided with intermediate heat exchange perforated plates (13).

4. The fiber optic bidirectional optical transceiver module according to claim 1, characterized in that, Flexible circuit boards (14) are provided at both ends of the integrated circuit board (1). The flexible circuit boards (14) located on both sides of the integrated circuit board (1) are connected to the optical receiver and transmitter assembly and the signal terminal (3), respectively.

5. The fiber optic bidirectional optical transceiver module according to claim 2, characterized in that, The heat exchange plate at the bottom is provided with guide ends (15) at both ends, and the inner wall of the plastic-sealed shell (4) is provided with inclined guide grooves (16) for the two ends of the guide ends (15) to be installed.

6. The fiber optic bidirectional optical transceiver module according to claim 1, characterized in that, The elastic traction component includes traction ports (18) opened on both sides of the plastic-sealed housing (4). The inner wall of the traction port (18) is connected to a limiting horizontal push column (17) by a contact spring. The limiting horizontal push column (17) is rotatably connected to the guide end (15) by rotating the traction rod (19).

7. The fiber optic bidirectional optical transceiver module according to claim 1, characterized in that, The flip cap (8) is made of elastic plastic. Both ends of the flip cap (8) are connected to the outer push cover plate (20) through the pivot. The outer push cover plate (20) is fixedly connected to both ends of the limiting horizontal push column (17) to cover the traction port (18) and ensure the sealing of the inside of the optical module housing.

8. The fiber optic bidirectional optical transceiver module according to claim 7, characterized in that, The push-out cover plate (20) has a guide notch at one end away from the flip cap (8), and the outer wall of the plastic sealing shell (4) has a limit slot (21).

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