Display module, display device

Abstract

The application discloses a display module and a display device. The display module comprises a display panel, an array substrate and a counter substrate; the array substrate has a bonding area; a first circuit board comprises a first glass substrate, has a lead area, a first adhesive area, a second adhesive area and two clearance areas; the lead area comprises an inner lead area and an outer lead area; the two clearance areas are located between the lead area and the two side edges of the first glass substrate in a one-to-one correspondence in a second direction; a second circuit board comprises a second glass substrate and a circuit layer; the first adhesive area is provided with a first adhesive layer and is bonded to the bonding area and the first circuit board; the second adhesive area is provided with a second adhesive layer and is bonded to the first circuit board and the second circuit board; in the clearance area, the first circuit board is fixedly connected to the bonding area and the second circuit board through a laser welding process. The above arrangement can solve the technical problems of insufficient connection strength between the flexible circuit board and the printed circuit board of the display module, and insufficient utilization rate of the glass substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and a display device. Background Technology

[0002] With the rapid expansion of the LCD panel industry and increasingly fierce market competition, cost reduction has become a key factor for companies to maintain their market position. Among these measures, improving the utilization rate of glass substrates is an important way to reduce production costs.

[0003] In related technologies, in conventional COG (Chip on Glass) display modules, the traditional flexible printed circuit board (FPC) is usually made of substrates such as polyimide (PI). Its fixed shape makes high-precision cutting and panel optimization difficult, leading to material waste or structural redundancy in irregular or narrow-bezel designs. Furthermore, in traditional COG display modules, the connection between the FPC and the display panel and printed circuit board (PCB) mainly relies on conductive adhesive (ACF), which has limited mechanical strength and is prone to failure under complex stress environments. Moreover, the utilization rate of the glass substrate in the display module is insufficient. Summary of the Invention

[0004] This application mainly provides a display module and a display device to solve the technical problems of insufficient mechanical connection strength between the flexible circuit board and the printed circuit board and between the flexible circuit board and the display panel in the display module, as well as insufficient utilization of the glass substrate of the display module.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display module, comprising: A display panel includes an array substrate and a counter substrate disposed opposite to each other; the array substrate includes a first glass substrate; the array substrate has a bonding area. A first circuit board includes a first glass substrate; the first glass substrate has a lead area, a first bonding area, a second bonding area, and two clearance areas; the lead area includes an inner lead area and an outer lead area spaced apart from each other in a first direction; the inner lead area has a plurality of inner leads, and the outer lead area has a plurality of outer leads; the first bonding area is located on the side of the inner lead area away from the outer lead area, and the second bonding area is located on the side of the outer lead area away from the inner lead area; the two clearance areas are located one-to-one between the lead area and the two sides of the first glass substrate in a second direction; wherein, the first direction is perpendicular to the second direction; The second circuit board includes a second glass substrate and a circuit layer disposed on the second glass substrate; The first bonding area is provided with a first adhesive layer, and the second bonding area is provided with a second adhesive layer; the first adhesive layer bonds the bonding area and the first circuit board, and the second adhesive layer bonds the first circuit board and the second circuit board; the inner lead is electrically connected to the array substrate, and the outer lead is electrically connected to the circuit layer; in the clearance area, the first circuit board is fixedly connected to the bonding area and the second circuit board respectively by laser welding process.

[0006] In some embodiments, the first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate; the second circuit board is located on one side of the array substrate in the first direction; Wherein, along the first direction, the second circuit board is spaced apart from the array substrate; or, along the first direction, the side of the second circuit board is attached to the side of the array substrate.

[0007] In some embodiments, the first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate; the second circuit board is located on one side of the array substrate in the first direction; In the first direction, the first circuit board partially covers the second circuit board, and the second circuit board extends to the outer side of the first circuit board away from the array substrate; Alternatively, in the first direction, the first circuit board completely covers the second circuit board; the outer side of the second circuit board is located on the side of the outer side of the first circuit board close to the array substrate, or is flush with the outer side of the first circuit board.

[0008] In some embodiments, the bonding area is provided with a driver chip, which is disposed on the surface of the array substrate facing the opposing substrate; the first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate. In the first direction, the first circuit board is located outside the driver chip and is spaced apart from the driver chip; Alternatively, the surface of the first glass substrate facing the array substrate is provided with a clearance groove, the driving chip is housed in the clearance groove and is spaced apart from the sidewall of the clearance groove; the distance between the driving chip and the sidewall of the clearance groove is greater than or equal to 0.1 mm.

[0009] In some embodiments, the size of the array substrate is larger than the size of the counterpart substrate, and in the first direction, the array substrate protrudes from the counterpart substrate to form the bonding region; the first adhesive layer is bonded to the surface of the array substrate facing the counterpart substrate. In the second direction, a plurality of first circuit boards spaced apart from each other are provided, each first circuit board is connected to the array substrate and the second circuit board, and the length of each first circuit board is less than the length of the second circuit board; Alternatively, in the second direction, a first circuit board is provided, the entire surface of which covers the bonding area.

[0010] In some embodiments, a first circuit board is provided in the second direction, the first circuit board covering the entire bonding area; The first glass substrate has a first ink layer on its surface opposite to the array substrate.

[0011] In some embodiments, the display panel further includes an upper polarizer located on the side of the counter substrate away from the array substrate; Wherein, the upper polarizer only covers the opposite substrate, and the first ink layer is configured to be laser-engravable; Alternatively, the upper polarizer covers the opposing substrate and extends to cover the first circuit board; the first ink layer covers the entire surface of the first glass substrate, and the upper polarizer has a second ink layer on its surface opposite to the array substrate, the second ink layer being configured to be laser-engravable.

[0012] In some embodiments, the display module includes two display panels stacked together, the two display panels being a first display panel and a second display panel, respectively; in a third direction, the first display panel is located on top of the second display panel, the first display panel includes a first array substrate and a first paired substrate disposed opposite each other, and the second display panel includes a second array substrate and a second paired substrate disposed opposite each other; wherein, the third direction, the first direction, and the second direction are perpendicular to each other; The display module includes a first set of circuit boards and a second set of circuit boards spaced upwards from the third side. Both the first set of circuit boards and the second set of circuit boards include at least one of the first circuit boards. The first set of circuit boards is bonded and soldered to the first array substrate, and the second set of circuit boards is bonded and soldered to the second array substrate. The display module includes a second circuit board, and the second glass substrate has the circuit layer on both opposite surfaces in the third direction; the second circuit board is disposed between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are bonded and soldered to the two opposite surfaces of the second glass substrate in the third direction.

[0013] In some embodiments, the display module includes two display panels stacked together, the two display panels being a first display panel and a second display panel, respectively; in a third direction, the first display panel is located on top of the second display panel, the first display panel includes a first array substrate and a first paired substrate disposed opposite each other, and the second display panel includes a second array substrate and a second paired substrate disposed opposite each other; wherein, the third direction, the first direction, and the second direction are perpendicular to each other; The display module includes a first circuit board group, which includes at least one first circuit board; the first circuit board of the first circuit board group has a first adhesive layer, a second adhesive layer, an inner lead and an outer lead on two opposite surfaces in the third direction; wherein the third direction, the first direction and the second direction are perpendicular to each other. The first circuit board assembly is disposed between the first array substrate and the second array substrate. The first array substrate and the second array substrate are bonded and soldered to the two opposite surfaces of the first circuit board assembly in the third direction. The display module includes two second circuit boards spaced apart in the third direction. The two second circuit boards are bonded and soldered one-to-one to the two opposite surfaces of the first circuit board of the first circuit board group in the third direction.

[0014] In some embodiments, both the first pair of substrates and the second pair of substrates include a second glass substrate and a color resist layer disposed on one side of the second glass substrate. Alternatively, both the first pair of substrates and the second pair of substrates include a second glass substrate. Only one of them includes a color resist layer disposed on one side of the second glass substrate.

[0015] In some embodiments, the first adhesive layer and / or the second adhesive layer is glass glue; And / or, the width of the first adhesive layer is 1-2 mm; And / or, the width of the second adhesive layer is 1-2 mm; And / or, the thickness of the first adhesive layer is 0.08-0.12 mm; And / or, the thickness of the second adhesive layer is 0.08-0.12 mm; And / or, the width of the clearance area is 200-300 μm; And / or, the clearance area has welding traces, the width of which is 100-150 μm; the welding traces extend along the first direction; And / or, the shape of the first glass substrate is any one of rectangular, trapezoidal, or I-shaped.

[0016] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a display device, comprising: Any of the display modules described above; A backlight module is disposed on one side of the display module and is used to provide backlight for the display panel.

[0017] The beneficial effects of this application are as follows: Unlike existing technologies, this application discloses a display module and a display device. The display module includes: a display panel, comprising an array substrate and a counter-array substrate disposed opposite each other; the array substrate includes a first glass substrate, and the array substrate has a bonding area; a first circuit board, comprising a first glass substrate, the first glass substrate having a lead area, a first bonding area, a second bonding area, and two clearance areas; the lead area includes an inner lead area and an outer lead area spaced apart in a first direction, the inner lead area having a plurality of inner leads, and the outer lead area having a plurality of outer leads; the first bonding area is located on the side of the inner lead area away from the outer lead area, and the second bonding area is located on the side of the outer lead area away from the inner lead area; the two clearance areas... The empty areas are located one-to-one with the lead area and the two sides of the first glass substrate in the second direction; wherein, the first direction is perpendicular to the second direction; the second circuit board includes the second glass substrate and the circuit layer disposed on the second glass substrate; wherein, the first bonding area is provided with a first adhesive layer, and the second bonding area is provided with a second adhesive layer; the first adhesive layer bonds the bonding area and the first circuit board, and the second adhesive layer bonds the first circuit board and the second circuit board; the inner lead is electrically connected to the array substrate, and the outer lead is electrically connected to the circuit layer; in the clearance area, the first circuit board is fixedly connected to the bonding area and the second circuit board respectively by laser welding process.

[0018] By configuring the first circuit board to include a first glass substrate and the second circuit board to include a second glass substrate, both circuit boards utilize glass substrates. This allows for the use of glass scraps to fabricate the first and second glass substrates, effectively improving glass utilization and reducing production costs. The glass substrate-based first circuit board replaces the flexible printed circuit board (FPC) with a flexible substrate, enhancing structural strength and addressing the insufficient utilization of glass substrates in display modules of related technologies. Simultaneously, the first adhesive layer in the first bonding area of ​​the first circuit board bonds the bonding area of ​​the array substrate and the first circuit board, while the second adhesive layer in the second bonding area bonds the first and second circuit boards. This bonding of the first and second adhesive layers provides a basic, fixed connection and prevents moisture ingress. Furthermore, by using laser welding to weld the first circuit board to the bonding area of ​​the array substrate and the second circuit board in the two clear areas of the first circuit board, moisture ingress is prevented, and the mechanical connection is effectively strengthened. This improves the mechanical connection strength between the array substrate, the first circuit board, and the second circuit board, addressing the insufficient mechanical connection strength between the flexible circuit board and the printed circuit board, and between the flexible circuit board and the display panel in related technologies. Moreover, the two clearance areas are located one-to-one between the lead area and the two sides of the first glass substrate in the second direction, which can avoid the welding process from affecting the lead in the lead area and facilitate the improvement of the display module performance. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a top view of the display module provided in the first embodiment of this application; Figure 2 yes Figure 1 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 3 yes Figure 2 A bottom view of one embodiment of the first circuit board of the provided display module; Figure 4 This is a top view of the display module provided in the second embodiment of this application; Figure 5 yes Figure 4 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 6 This is a top view of the display module provided in the third embodiment of this application; Figure 7 yes Figure 6 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 8 This is a top view of the display module provided in the fourth embodiment of this application; Figure 9 This is a top view of the display module provided in the fifth embodiment of this application; Figure 10 This is a top view of the display module provided in the sixth embodiment of this application; Figure 11 yes Figure 10 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 12 This is a top view of the display module provided in the seventh embodiment of this application; Figure 13 yes Figure 12 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 14 This is a top view of the display module provided in the eighth embodiment of this application; Figure 15 yes Figure 14 A cross-sectional schematic diagram of one embodiment of the provided display module; Figure 16 This is a cross-sectional schematic diagram of an embodiment of the display module provided in the ninth embodiment of this application; Figure 17 This is a cross-sectional schematic diagram of another embodiment of the display module provided in the ninth embodiment of this application; Figure 18 This is a cross-sectional schematic diagram of an embodiment of the display module provided in the tenth embodiment of this application; Figure 19 This is a cross-sectional schematic diagram of another embodiment of the display module provided in the ninth embodiment of this application; Figure 20 This is a schematic diagram of an embodiment of the display device provided in the tenth embodiment of this application.

[0020] Icon labels: 200. Display module; 100. Display panel; 1. Array substrate; 11. First glass substrate; 12. Driving circuit layer; 2. Alignment substrate; 21. Second glass substrate; 22. Color resist layer; 3. First circuit board; 31. First glass substrate; 311. Clearance groove; 32. Lead area; 321. Inner lead area; 322. Outer lead area; 33. First bonding area; 34. Second bonding area; 35. Clearance area; 36. First adhesive layer; 37. Second adhesive layer; 38. Inner lead; 39. Outer lead; 4. Second circuit board; 41. Second glass substrate; 5. Driver chip; 6. Upper polarizer; 7. Lower polarizer; 8. First ink layer; 9. Second ink layer; 10. First display panel; 101. First array substrate; 102. First pairing substrate; 20. Second display panel; 201. Second array substrate; 202. Second pairing substrate; 30. First circuit board group; 40. Second circuit board group; 401. Through hole; 402. Conductive layer; 50. First circuit board group; 300. Backlight module; 400. Display device; A1. First direction; A2. Second direction; A3. Third direction; B. Bonding area. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] See Figures 1 to 19 , Figure 1 This is a top view of the display module provided in the first embodiment of this application. Figure 2 yes Figure 1 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 3 yes Figure 2 A bottom view of one embodiment of the first circuit board of the provided display module. Figure 4 This is a top view of the display module provided in the second embodiment of this application. Figure 5 yes Figure 4 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 6 This is a top view of the display module provided in the third embodiment of this application. Figure 7 yes Figure 6 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 8 This is a top view of the display module provided in the fourth embodiment of this application. Figure 9 This is a top view of the display module provided in the fifth embodiment of this application. Figure 10 This is a top view of the display module provided in the sixth embodiment of this application. Figure 11 yes Figure 10 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 12 This is a top view of the display module provided in the seventh embodiment of this application. Figure 13 yes Figure 12 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 14 This is a top view of the display module provided in the eighth embodiment of this application. Figure 15 yes Figure 14 A cross-sectional schematic diagram of one embodiment of the provided display module. Figure 16 This is a cross-sectional schematic diagram of an embodiment of the display module provided in the ninth embodiment of this application. Figure 17 This is a cross-sectional schematic diagram of another embodiment of the display module provided in the ninth embodiment of this application. Figure 18 This is a cross-sectional schematic diagram of an embodiment of the display module provided in the tenth embodiment of this application. Figure 19 This is a cross-sectional schematic diagram of another embodiment of the display module provided in the ninth embodiment of this application.

[0025] See Figures 1 to 19 This application provides a display module 200, which includes a display panel 100, a first circuit board 3, and a second circuit board 4.

[0026] The display panel 100 includes an array substrate 1 and a counter substrate 2 disposed opposite to each other. The array substrate 1 includes a first glass substrate 11 and has a bonding area B for bonding components such as a driver chip 5 (IC) and a circuit board. In some embodiments, the display panel 100 is a liquid crystal display panel 100, which further includes a liquid crystal layer (not shown) and a sealant (not shown). The liquid crystal layer is disposed between the array substrate 1 and the counter substrate 2, and the sealant is disposed around the liquid crystal layer and connects the array substrate 1 and the counter substrate 2 respectively.

[0027] In some embodiments, the substrate 2 includes a second glass substrate 21 and a color resist layer 22 disposed on one side of the second glass substrate 21. Specifically, the color resist layer 22 is located on the side of the second glass substrate 21 facing the substrate 2. For example, the color resist layer 22 may include a plurality of red, blue and green color resists to facilitate color display.

[0028] The first circuit board 3 includes a first glass substrate 31, which has a lead area 32, a first bonding area 33, a second bonding area 34, and two clearance areas 35.

[0029] Specifically, the lead area 32 includes an inner lead area 321 and an outer lead area 322 spaced apart in the first direction A1. The inner lead area 321 contains a plurality of inner leads 38, and the outer lead area 322 contains a plurality of outer leads 39. Exemplarily, both the inner leads 38 and the outer leads 39 extend along the first direction A1. The plurality of inner leads 38 are spaced apart in the second direction A2, and the plurality of outer leads 39 are spaced apart in the second direction A2. The inner leads 38 and the outer leads 39 are also spaced apart in the first direction A1. Exemplarily, the first direction A1 and the second direction A2 are perpendicular to each other. Exemplarily, the corresponding inner leads 38 and outer leads 39 can be formed through processes such as coating, exposure, development, and etching.

[0030] The first bonding area 33 is located on the side of the inner lead area 321 away from the outer lead area 322, and the second bonding area 34 is located on the side of the outer lead area 322 away from the inner lead area 321. That is, the first bonding area 33 and the second bonding area 34 are located on opposite sides of the lead area 32 along the first direction A1, specifically between the lead area 32 and the side of the first glass substrate 31 in the first direction A1. The first bonding area 33 is provided with a first adhesive layer 36, and the second bonding area 34 is provided with a second adhesive layer 37. The first adhesive layer 36 bonds the bonding area B of the array substrate 1 and the first circuit board 3, and the second adhesive layer 37 bonds the first circuit board 3 and the second circuit board 4. That is, the array substrate 1, the first circuit board 3 and the second circuit board 4 are connected and distributed in pairs in the first direction A1. The first adhesive layer 36 is used to bond the array substrate 1 to the first circuit board 3. The inner lead 38 of the first circuit board 3 is electrically connected to the array substrate 1. Specifically, the inner lead 38 of the first circuit board 3 is electrically connected to the driving circuit layer 12 of the array substrate 1.

[0031] Two clearance areas 35 are located one-to-one between the lead area 32 and the two sides of the first glass substrate 31 in the second direction A2. That is, in the second direction A2, the opposite sides of the lead area 32 and the two sides of the first glass substrate 31 are spaced apart to form clearance areas 35. For example, the first adhesive layer 36 and the second adhesive layer 37 both extend along the second direction A2. The first adhesive layer 36 is only located in the first bonding area 33, and the second adhesive layer 37 is only located in the second bonding area 34. Neither the first adhesive layer 36 nor the second adhesive layer 37 can extend into the clearance area 35 to avoid affecting the welding effect.

[0032] The second circuit board 4 includes a second glass substrate 41 and a circuit layer (not shown) disposed on the second glass substrate 41. Specifically, the circuit layer is disposed on the top or bottom surface of the second glass substrate 41. Exemplarily, the second circuit board 4 is a printed circuit board (PCB). The first circuit board 3 is bonded to the second circuit board 4 by a second adhesive layer 37, and the outer leads 39 of the first circuit board 3 are electrically connected to the circuit layer of the second circuit board 4.

[0033] In the clearance area 35, the first circuit board 3 is fixedly connected to the bonding area B of the array substrate 1 and the second circuit board 4 by laser welding process. Since the array substrate 1, the first circuit board 3 and the second circuit board 4 are all glass substrates, the first glass substrate 31 of the first circuit board 3 can be welded to the glass substrate of the array substrate 1 and the second glass substrate 41 of the second circuit board 4 in the clearance area 35 of the first circuit board 3, so as to achieve a stable fixed connection between the components.

[0034] It is understood that by setting the first circuit board 3 to include a first glass substrate 31 and the second circuit board 4 to include a second glass substrate 41, both circuit boards use glass substrates. The first glass substrate 31 and the second glass substrate 41 can be made using glass scraps, which can effectively improve the utilization rate of glass and reduce production costs. The first circuit board 3 with glass substrate replaces the flexible circuit board (FPC) with a flexible substrate, which is beneficial to improve structural strength and solve the problem of insufficient utilization of glass substrate in display module 200 in related technologies. Meanwhile, the first adhesive layer 36 of the first bonding area 33 of the first circuit board 3 connects the bonding area B of the array substrate 1 and the first circuit board 3, and the second adhesive layer 37 of the second bonding area 34 connects the first circuit board 3 and the second circuit board 4. The first adhesive layer 36 and the second adhesive layer 37 achieve mutual bonding of the above structure, which can play a basic fixed connection role and prevent moisture from entering. Moreover, by using laser welding technology to weld the first circuit board 3 to the bonding area B of the array substrate 1 and the second circuit board 4 through the two clearance areas 35 of the first circuit board 3, moisture can be prevented from entering, and the mechanical connection can be effectively strengthened. This is beneficial to improving the mechanical connection strength of the array substrate 1, the first circuit board 3, and the second circuit board 4, and solving the problem of insufficient mechanical connection strength between the flexible circuit board and the printed circuit board and between the flexible circuit board and the display panel 100 in the display module 200 of related technologies. In addition, the two clearance areas 35 are located one-to-one between the lead area 32 and the two sides of the first glass substrate 31 in the second direction A2, which can avoid the welding process from affecting the leads of the lead area 32, and facilitate the improvement of the performance of the display module 200.

[0035] In some embodiments, the first adhesive layer 36 is bonded to the surface of the array substrate 1 facing the opposing substrate 2. That is, the surface of the first circuit board 3 with the first adhesive layer 36 is bonded to the surface of the array substrate 1 facing the opposing substrate 2 (the upper surface of the array substrate 1). For example, the lower surface of the first circuit board 3 has the first adhesive layer 36, and the portion of the lower surface of the first circuit board 3 with the first adhesive layer 36 is positioned opposite to the bonding region B of the array substrate 1 facing the opposing substrate 2, and is bonded by the first adhesive layer 36. By restricting the first adhesive layer 36 to the surface of the array substrate 1 facing the opposing substrate 2, the connection structure layout is clearer, which facilitates the uniform coating and curing of the first adhesive layer 36, improves the uniformity of the bonding strength, and thus enhances the stability of the bond between the first circuit board 3 and the array substrate 1.

[0036] In some embodiments, the array substrate 1 includes a first glass substrate 11 and a driving circuit layer 12 disposed on the side of the first glass substrate 11 facing the opposing substrate 2. The first circuit board 3 is bonded to the array substrate 1 by a first adhesive layer 36, and the first circuit board 3 is further fixedly connected to the array substrate 1 by a laser welding process. The plurality of inner leads 38 in the inner lead area 321 of the first circuit board 3 can be electrically connected to the driving circuit layer 12 of the array substrate 1.

[0037] In some embodiments, the second circuit board 4 is located on one side of the array substrate 1 in the first direction A1. Specifically, the first direction A1 is a horizontal direction. For example, the first direction A1 can be the width direction of the display module 200. The second circuit board 4 is located on the bonding area B side of the array substrate 1 in the first direction A1. The first circuit board 3 is bonded to the second circuit board 4 by the second adhesive layer 37, and the first circuit board 3 and the second circuit board 4 are further fixedly connected by laser welding process. The multiple outer leads 39 in the outer lead area 322 of the first circuit board 3 can be electrically connected to the circuit layer of the second circuit board 4.

[0038] In some embodiments, the first adhesive layer 36 and / or the second adhesive layer 37 are made of glass adhesive, an inorganic adhesive with excellent high-temperature stability, low coefficient of thermal expansion, and high compatibility with glass substrates. Since the array substrate 1, the first circuit board 3, and the second circuit board 4 are all made of glass, using glass adhesive as the material for the first adhesive layer 36 and / or the second adhesive layer 37 ensures that the coefficient of thermal expansion of the first adhesive layer 36 and / or the second adhesive layer 37 matches that of the array substrate 1, the first circuit board 3, and the second circuit board 4. This effectively eliminates thermal stress concentration caused by temperature changes and improves the reliability of the connection structure in a wide temperature range.

[0039] In some embodiments, the width of the first adhesive layer 36 is 1-2 mm; and / or, in some embodiments, the width of the second adhesive layer 37 is 1-2 mm. Specifically, the width of the first adhesive layer 36 and the width of the second adhesive layer 37 both refer to their dimensions in the first direction A1. The aforementioned width range is designed to balance the bonding area and the bezel width, ensuring sufficient adhesive strength to resist peeling forces and guaranteeing a reliable connection between the first circuit board 3 and the array substrate 1 and the second circuit board 4. It also avoids the first adhesive layer 36 and / or the second adhesive layer 37 being too wide, which would affect the distribution of the inner leads 38 and the outer leads 39 and thus the electrical connection between the first circuit board 3 and the array substrate 1 and the second circuit board 4. Furthermore, it avoids the excessive width affecting the narrow bezel design of the display module 200. Moreover, it also helps to control the volume of the bonding area and prevent adhesive overflow from contaminating the display area of ​​the display panel 100.

[0040] In some embodiments, the thickness of the first adhesive layer 36 is 0.08-0.12 mm; and / or, the thickness of the second adhesive layer 37 is 0.08-0.12 mm. Specifically, the thickness of the first adhesive layer 36 and the width of the second adhesive layer 37 both refer to their dimensions in the third direction A3, wherein the third direction A3 is perpendicular to both the first direction A1 and the second direction A2. By setting the thickness of the first adhesive layer 36 and / or the second adhesive layer 37 within the above-mentioned range, sufficient adhesive strength can be ensured to resist peeling forces and improve connection reliability. Furthermore, excessive thickness of the first adhesive layer 36 and / or the second adhesive layer 37 can be avoided, which would affect the contact between the soldering surfaces of the first circuit board 3 and the array substrate 1 and the second circuit board 4, thus facilitating soldering reliability.

[0041] In some embodiments, the width of the clearance area 35 is 200-300 μm. Specifically, the width of the clearance area 35 refers to its width in the second direction A2. The clearance area 35 is the gap between the lead area 32 and the two sides of the first circuit board 3 in the second direction A2. Setting the width of the clearance area 35 within the above range is based on the spot focusing requirements and heat-affected zone control of the laser welding process. This ensures sufficient space for laser welding and that the laser can accurately act on the clearance area 35 without damaging the inner lead 38 and outer lead 39 in the adjacent lead area 32.

[0042] In some embodiments, the clearance area 35 is provided with soldering traces extending along the first direction A1, that is, along the width direction of the display module 200. Specifically, a portion of the soldering traces are located at the overlap position between the array substrate 1 and the first circuit board 3, and another portion of the soldering traces are located at the overlap position between the second circuit board 4 and the first circuit board 3. In some embodiments, the width of the soldering traces is 100-150 μm. Specifically, the width of the soldering traces refers to their dimension in the second direction A2. This width matches the width of the clearance area 35, facilitating the formation of a continuous soldering path.

[0043] Specifically, the first circuit board 3 is fixedly connected to the bonding area B of the array substrate 1 and the second circuit board 4 by laser welding. The focus of the laser welding process is on the surfaces where the first glass substrate 31 of the first circuit board 3 is bonded to the first glass substrate 11 of the array substrate 1 and the second glass substrate 41 of the second circuit board 4. The laser energy is used to instantly fuse the two layers of glass at the interface, achieving a welding effect. In some embodiments, during laser welding, the gap between the first glass substrate 31 and the first glass substrate 11, and between the first glass substrate 31 and the second glass substrate 41, is less than 5μm. The laser welding process can be a femtosecond laser welding method, for example, an infrared laser with a wavelength of 1030nm, an average laser output power of 10W, and a pulse width of 500-800 femtoseconds.

[0044] In some specific implementations, see Figure 1 , Figure 2 , Figure 4 and Figure 5 Along the first direction A1, the second circuit board 4 is spaced apart from the array substrate 1. That is, the second circuit board 4 and the array substrate 1 are spaced apart from each other in the first direction A1 and do not contact each other. The three are electrically connected by the first circuit board 3 disposed between the second circuit board 4 and the array substrate 1. It can be understood that the second circuit board 4 is located on one side of the array substrate 1 in the first direction A1 and is arranged in a spaced manner, so that the second circuit board 4 and the array substrate 1 form a non-rigid contact space. This is beneficial for absorbing and dispersing the stress generated by external impacts, avoiding the stress from being directly transmitted to the fragile glass substrate and causing breakage. At the same time, this space can be used to arrange additional shielding layers or heat dissipation materials, which is beneficial for improving the electromagnetic compatibility and heat dissipation performance of the module.

[0045] In other specific embodiments, see Figure 6 and Figure 7 Along the first direction A1, the side of the second circuit board 4 is attached to the side of the array substrate 1. That is, the second circuit board 4 is disposed adjacent to the array substrate 1. It can be understood that by attaching the side of the second circuit board 4 to the side of the array substrate 1, there is no gap between the side of the second circuit board 4 and the array substrate 1. A part of the first circuit board 3 covers the array substrate 1, and another part covers the second circuit board 4. The first circuit board 3 is not suspended, which can facilitate the strengthening of the structure and make it easier to weld the bonding area B of the array substrate 1 and the second circuit board 4 at the clear area 35 of the first circuit board 3, ensuring the welding effect and facilitating the improvement of mechanical performance. Moreover, the second circuit board 4 is closer to the array substrate 1, reducing the space occupied by the display module 200 in the first direction A1, which is more conducive to realizing a narrow bezel design, improving the screen ratio and aesthetic effect of the display module 200, and is conducive to the miniaturization and thinning of the display module 200.

[0046] In some implementations, see Figures 1 to 9 In the first direction A1, the first circuit board 3 partially covers the second circuit board 4, and the second circuit board 4 extends to the outer side of the first circuit board 3 away from the array substrate 1. That is, in the first direction A1, the first circuit board 3 does not completely cover the second circuit board 4, and the end of the second circuit board 4 away from the array substrate 1 protrudes from the first circuit board 3. The second adhesive layer 37 of the first circuit board 3 can be bonded to any suitable position on the upper surface of the second circuit board 4, which facilitates reducing the difficulty of connecting the first circuit board 3 and the second circuit board 4.

[0047] In other implementations, see Figures 10 to 15In the first direction A1, the first circuit board 3 completely covers the second circuit board 4; the outer side of the second circuit board 4 is located on the side of the outer side of the first circuit board 3 closest to the array substrate 1, or is flush with the outer side of the first circuit board 3. That is, in this embodiment, in the first direction A1, the size of the first circuit board 3 is larger than the size of the second circuit board 4, and the end of the second circuit board 4 away from the array substrate 1 does not protrude from the first circuit board 3. Through the above arrangement, the sides of the first circuit board 3 and the second circuit board 4 away from the array substrate 1 overlap, making the structure of the display module 200 near the frame area more compact, which is beneficial to reducing the frame width of the display module 200 in the first direction A1, and also facilitates increasing the welding area of ​​the first circuit board 3 and the second circuit board 4 in the first direction A1, which can further improve the mechanical properties of the display module 200 and facilitate improving the structural strength; moreover, the first circuit board 3 can play a certain protective role for the second circuit board 4, preventing the second circuit board 4 from being damaged by external forces during assembly or use, which is beneficial to improving the structural reliability of the display module 200.

[0048] In some implementations, see Figures 1 to 19 Bonding area B is provided with a driver chip 5. Specifically, the driver chip 5 is disposed on the surface of the array substrate 1 facing the opposing substrate 2, and the first adhesive layer 36 is bonded to the surface of the array substrate 1 facing the opposing substrate 2. That is, the driver chip 5 is disposed on the surface of the array substrate 1 used for bonding with the first circuit board 3.

[0049] Specifically, in some embodiments, the driver chip 5 is electrically connected to the driver circuit layer 12 of the array substrate 1. After the first circuit board 3 is fixed to the array substrate 1, the inner lead 38 of the first circuit board 3 is also electrically connected to the driver circuit layer 12 of the array substrate 1. The driver chip 5 and the first circuit board 3 can be electrically connected through the driver circuit layer 12 of the array substrate 1 to realize signal transmission.

[0050] In some specific implementations, see Figure 1 , Figure 2 , Figures 6 to 9 In the first direction A1, the first circuit board 3 is located outside the driver chip 5 and is spaced apart from the driver chip 5. Specifically, "outer side" refers to the side closer to the edge of the display module 200. That is, in this embodiment, the driver chip 5 is located in the bonding area B of the array substrate 1, and the first circuit board 3 and the driver chip 5 are spaced apart in the first direction A1, with no overlap in their orthographic projections. This arrangement ensures that the first circuit board 3 does not directly cover the driver chip 5, but is connected to the driving circuit layer 12 or pads of the bonding area B of the array substrate 1 through its inner lead 38, thereby avoiding the first circuit board 3 from obstructing or squeezing the driver chip 5.

[0051] In other specific embodiments, see Figure 4, Figure 5 , Figures 10 to 15 The first glass substrate 31 has a relief groove 311 on its surface facing the array substrate 1. The driving chip 5 is housed within the relief groove 311, and the driving chip 5 is spaced apart from the sidewall of the relief groove 311. That is, in this embodiment, the orthographic projection of the first glass substrate 31 of the first circuit board 3 covers the driving chip 5. Exemplarily, the relief groove 311 is a groove structure pre-formed on the first glass substrate 31 by laser engraving, chemical etching, or mechanical grinding. By providing a clearance groove 311 on the surface of the first glass substrate 31 facing the array substrate 1, the driving chip 5 can be accommodated within the clearance groove 311. This is equivalent to the first circuit board 3 covering the driving chip 5, which can protect the driving chip 5 and prevent damage. Moreover, in the first direction A1, the orthographic projection of the clearance groove 311 is located within the orthographic projection of the first circuit board 3. The first circuit board 3 is closer to the array substrate 1, and the overlap area between the first circuit board 3 and the array substrate 1 is increased. This is beneficial to increasing the laser welding area between the first circuit board 3 and the array substrate 1, which further enhances the connection strength between the first circuit board 3 and the array substrate 1 and improves mechanical performance. In addition, the bezel can also be further narrowed.

[0052] Specifically, after the driver chip 5 is accommodated in the clearance slot 311, the side and top surfaces of the driver chip 5 are spaced apart from the side and bottom walls of the clearance slot 311. In some embodiments, the distance between the driver chip 5 and the side wall of the clearance slot 311 is greater than or equal to 0.1 mm. It can be understood that by setting the outer surface of the driver chip 5 apart from the inner wall of the clearance slot 311, interference between the driver chip 5 and the inner wall of the clearance slot 311 can be avoided, collisions with the driver chip 5 can be prevented, and the assembly difficulty of the clearance slot 311 and the driver chip 5 of the first circuit board 3 can be reduced, which is beneficial to simplifying the assembly process. Setting the distance between the driver chip 5 and the side wall of the clearance slot 311 within the above range can more effectively ensure that there is sufficient distance between the driver chip 5 and the side wall of the clearance slot 311, thereby better avoiding interference between the driver chip 5 and the side wall of the clearance slot 311.

[0053] In some embodiments, the size of the array substrate 1 is larger than the size of the opposing substrate 2, and in the first direction A1, the array substrate 1 protrudes from the opposing substrate 2 to form a bonding area B. For example, both the array substrate 1 and the opposing substrate 2 are rectangular, the first direction A1 is the width direction of the display module 200, one end face of the array substrate 1 protrudes from the opposing substrate 2 to form the bonding area B, and the first circuit board 3 is connected to the portion of the array substrate 1 that protrudes from the opposing substrate 2, thereby realizing the electrical connection between the first circuit board 3 and the array substrate 1.

[0054] In some embodiments, the first adhesive layer 36 is bonded to the surface of the array substrate 1 facing the opposing substrate 2 (i.e., the upper surface of the array substrate 1). The thickness of the first circuit board 3 is the same as the thickness of the opposing substrate 2, thereby ensuring the structural strength of the first circuit board 3. This prevents the first circuit board 3 from protruding from the opposing substrate 2 in the third direction A3 (i.e., the thickness direction) after it is connected to the bonding area B of the array substrate 1. This is beneficial for reducing the thickness of the display module 200, maintaining the thickness consistency of the display module 200, and facilitating the design of an ultra-thin display module 200.

[0055] In some implementations, see Figures 1 to 10 On the second direction A2, a plurality of first circuit boards 3 are arranged at intervals. Each first circuit board 3 is connected to the array substrate 1 and the second circuit board 4. The length of each first circuit board 3 is less than the length of the second circuit board 4.

[0056] For example, the display module 200 includes two first circuit boards 3 spaced apart on a second direction A2, which is perpendicular to the first direction A1. For example, the first direction A1 is the width direction of the display module 200, and the second direction A2 is the length direction of the display module 200. The inner sides of the two first circuit boards 3 are bonded and soldered to the bonding area B of the array substrate 1, and the outer sides of the two first circuit boards 3 are bonded and soldered to the second circuit board 4. On the second direction A2, the length of the two first circuit boards 3 is less than the length of the second circuit board 4. For example, on the second direction A2, the length of the second circuit board 4 may be equal to or slightly less than the length of the array substrate 1. It can be understood that by setting multiple first circuit boards 3 on the second direction A2 and connecting them to the array substrate 1 and the second circuit board 4, the stability and reliability of the electrical connection between the first circuit boards 3, the array substrate 1, and the second circuit board 4 can be improved. The two spaced-apart first circuit boards 3 can correspond to different parts of the display area of ​​the display panel 100, which facilitates modular connection and makes it easier to drive and control the display module 200.

[0057] In other embodiments, three, four, five, or any other arbitrary number of second circuit boards 4 can be arranged at intervals on the second direction A2, which can be set according to needs.

[0058] Specifically, in some implementation methods, such as Figures 1 to 7 As shown, the first circuit board 3 can be rectangular in shape; in other embodiments, such as Figure 8 As shown, the first circuit board 3 can be trapezoidal in shape; or, in other embodiments, such as Figure 9As shown, the first circuit board 3 can be H-shaped, and the specific design can be customized as needed. In other embodiments, the first circuit board 3 can also be set to any other regular or irregular shape, as long as reliable bonding and soldering of the first circuit board 3 to the array substrate 1 and the second circuit board 4 can be achieved. This application does not limit this aspect.

[0059] In other implementations, see Figures 12 to 15 In the second direction A2, only one first circuit board 3 is provided, and the first circuit board 3 covers the entire bonding area B. That is, in this embodiment, the array substrate 1 is connected to only one first circuit board 3, and the second circuit board 4 is also connected to only one first circuit board 3. The first circuit board 3 extends along the second direction A2, and its length in the second direction A2 is equal to the length of the array substrate 1. The first circuit board 3 covers the entire bonding area B of the array substrate 1. It can be understood that by providing a first circuit board 3 to cover the entire bonding area B, the structural strength of the first circuit board 3 can be further improved, and the contact area between the first circuit board 3 and the array substrate 1 and the second circuit board 4 can be increased. This facilitates further improvement of the mechanical strength of the side where the bonding area B of the display module 200 is located, and makes it easier to prevent moisture and other substances from entering the display panel 100. Moreover, since the first circuit board 3 covers the entire bonding area B, the first circuit board 3 can be used directly as the display appearance of the display module 200 without setting an extra outer frame, thereby facilitating the realization of a borderless design and making it easier to perform appearance processing on the surface of the first circuit board 3, improving the product's aesthetics and integration.

[0060] In some implementations, see Figures 12 to 15 A first circuit board 3 is provided on the second direction A2. The first circuit board 3 covers the bonding area B on its entire surface, and a first ink layer 8 is provided on the surface of the first glass substrate 31 facing away from the array substrate 1.

[0061] For example, the first circuit board 3 covers the entire bonding area B. In the second direction A2, the length of the first circuit board 3 is equal to the length of the array substrate 1, and in the first direction A1, the first circuit board 3 completely covers the second circuit board 4, which does not protrude from the first circuit board 3. A first ink layer 8 is provided on the surface of the first glass substrate 31 of the first circuit board 3 facing away from the array substrate 1 (e.g., the upper surface of the first glass substrate 31). For example, the first ink layer 8 covers the entire surface of the first glass substrate 31 facing away from the array substrate 1. The surface of the first glass substrate 31 facing away from the array substrate 1 is the surface of the first glass substrate 31 opposite to the surface connected to the array substrate 1, and is the outward-facing surface. Specifically, the first ink layer 8 can be an inorganic or organic coating formed by screen printing, inkjet printing, or photolithography.

[0062] It is understood that the bonding area B is fully covered by the first circuit board 3, and the first ink layer 8 is directly disposed on the surface of the first glass substrate 31 of the first circuit board 3 away from the array substrate 1. The first ink layer 8 can be used for appearance processing, serving as an appearance decoration layer, or it can be used to cover the underlying circuitry, etc.

[0063] In some embodiments, the first ink layer 8 is made of high-temperature resistant and anti-aging inorganic glass ink, which is adhered to the surface of the first glass substrate 31 by high-temperature sintering and curing to ensure its durability during the packaging and use of the display module 200. The thickness of the first ink layer 8 can be designed as needed, so as not to affect the overall thin and light design of the display module 200, while effectively covering the underlying circuits or components, and providing a uniform matte or glossy appearance.

[0064] In some implementations, see Figures 12 to 15 The display panel 100 also includes an upper polarizer 6 located on the side of the substrate 2 away from the array substrate 1, which is used to provide optical polarization function.

[0065] In some specific implementations, see Figure 12 and Figure 13 The upper polarizer 6 only covers the opposing substrate 2, and the first ink layer 8 is configured to be laser-engravable. That is, in this embodiment, since the bonding area B of the array substrate 1 protrudes from the opposing substrate 2, the first circuit board 3 covers the entire bonding area B of the array substrate 1, while the upper polarizer 6 only covers the opposing substrate 2 and does not cover the first circuit board 3 connected to the bonding area B. The first circuit board 3 is exposed, and the first ink layer 8 of the first glass substrate 31 of the first circuit board 3 facing away from the surface of the array substrate 1 is exposed. Therefore, the first circuit board 3 can be directly exposed to the display module 200, and the first ink layer 8 of the first circuit board 3 directly serves as the display appearance of the display module 200 without the need for a border. This is beneficial for further narrowing the border of the display module 200, making it easier to achieve a borderless design. Moreover, the first ink layer 8 is configured to be laser-engravable, and part of the ink can be removed by laser ablation to form a logo or text. The first ink layer 8 directly serves as an appearance decoration layer, which is conducive to improving the display appearance and meeting more needs.

[0066] In other specific embodiments, see Figure 14 and Figure 15 The upper polarizer 6 covers the substrate 2 and extends to cover the first circuit board 3. The first ink layer 8 covers the entire surface of the first glass substrate 31. The upper polarizer 6 has a second ink layer 9 on the surface opposite to the array substrate 1. The second ink layer 9 is configured to be laser-engravable.

[0067] In this embodiment, the upper polarizer 6 not only covers the opposing substrate 2 but also extends beyond the bonding area B and completely covers the first circuit board 3. The first ink layer 8 covers the entire surface of the first glass substrate 31 to shield the circuits and components below the first glass substrate 31, so as to avoid affecting the aesthetics when the second polarizer is exposed as the appearance surface. The upper polarizer 6 has a second ink layer 9 on the surface facing away from the array substrate 1. Since the first ink layer 8 has covered the entire surface of the first glass substrate 31, the structure below the first glass substrate 31 will not be exposed. The upper polarizer 6 can be directly exposed as the display appearance, and there is no need to set extra borders, which is convenient for achieving a borderless design. The second ink layer 9 is configured to be laser-engravable, and part of the ink can be directly removed by laser ablation to form a logo or text. The second ink layer 9 directly serves as an appearance decoration layer, which can improve the display appearance and meet more needs.

[0068] In some implementations, see Figures 1 to 19 The display panel 100 also includes a lower polarizer 7, which is located on the side of the substrate 2 away from the array substrate 1. The lower polarizer 7 is also used to provide optical polarization. For example, the polarization angles of the upper polarizer 6 and the lower polarizer 7 are perpendicular to each other to better realize the image display function.

[0069] In some implementations, see Figures 16 to 19 The display module 200 includes two stacked display panels 100, namely a first display panel 10 and a second display panel 20. In the third direction A3, i.e., the thickness direction of the display module 200, the first display panel 10 is located on top of the second display panel 20. The first display panel 10 includes a first array substrate 101 and a first opposing substrate 102 disposed opposite to each other, and the second display panel 20 includes a second array substrate 201 and a second opposing substrate 202 disposed opposite to each other. That is, in this embodiment, the display module 200 is a dual-cell display module 200.

[0070] In some implementations, see Figure 16 and Figure 17 The display module 200 includes a first set of circuit boards 30 and a second set of circuit boards 40 spaced apart on a third direction A3. Both the first set of circuit boards 30 and the second set of circuit boards 40 include at least one first circuit board 3. The first set of circuit boards 30 is bonded and soldered to the first array substrate 101, and the second set of circuit boards 40 is bonded and soldered to the second array substrate 201.

[0071] Specifically, when the first group of circuit boards 30 includes a plurality of first circuit boards 3, the plurality of first circuit boards 3 of the first group of circuit boards 30 are distributed at intervals along the second direction A2 (refer to...). Figure 1And correspondingly bonded and soldered to different positions on the first array substrate 101 in the second direction A2. Similarly, when the second group of circuit boards 40 includes a plurality of first circuit boards 3, the plurality of first circuit boards 3 of the second group of circuit boards 40 are distributed at intervals along the second direction A2, and correspondingly bonded and soldered to different positions on the second array substrate 201 in the second direction A2. When both the first group of circuit boards 30 and the second group of circuit boards 40 include only one first circuit board 3 (refer to Figure 12 The first circuit board 3 can extend along the second direction A2.

[0072] In this embodiment, the display module 200 includes a second circuit board 4. The second glass substrate 41 of the second circuit board 4 has circuit layers on both opposite surfaces in the third direction A3. Specifically, in the third direction A3, the second circuit board 4 is disposed between the first group of circuit boards 30 and the second group of circuit boards 40, and the first group of circuit boards 30 and the second group of circuit boards 40 are bonded and soldered to the two opposite surfaces of the second glass substrate 41 in the third direction A3 in a one-to-one correspondence.

[0073] Specifically, in this embodiment, the surface of the first circuit board 30 facing the first array substrate 101 (such as the lower surface of the first circuit board 30) is provided with a first adhesive layer 36, a second adhesive layer 37, an inner lead 38, and an outer lead 39 (see reference). Figure 3 The first adhesive layer 36 is bonded to the surface of the first array substrate 101 facing the first paired substrate 102 (i.e., the upper surface of the first array substrate 101), and the first array substrate 101 and the first set of circuit boards 30 are fixedly connected by laser welding. The inner lead 38 of the first set of circuit boards 30 is electrically connected to the driving circuit layer 12 of the first array substrate 101. The second adhesive layer 37 on the lower surface of the first set of circuit boards 30 is bonded to the upper surface of the second circuit board 4, and the outer lead 39 of the first set of circuit boards 30 is electrically connected to the circuit layer on the upper surface of the second circuit board 4. The lower surface of the first set of circuit boards 30 and the upper surface of the second circuit board 4 are fixedly connected by laser welding.

[0074] The surface of the second circuit board 40 facing the second array substrate 201 (such as the lower surface of the second circuit board 40) is provided with a first adhesive layer 36, an inner lead 38, and an outer lead 39 (see reference). Figure 3 That is, the second adhesive layer 37 is not provided on the surface of the second circuit board 40 facing the second array substrate 201. The first adhesive layer 36 is bonded to the surface of the second array substrate 201 facing the second opposing substrate 202 (the upper surface of the second array substrate 201), and the upper surface of the second array substrate 201 is fixedly connected to the lower surface of the second circuit board 40 by laser welding process. The inner lead 38 of the second circuit board 40 is electrically connected to the driving circuit layer 12 of the second array substrate 201.

[0075] A second adhesive layer 37 is provided on the surface of the second circuit board 40 facing away from the second array substrate 201 (such as the upper surface of the second circuit board 40). In the first direction A1, the second adhesive layer 37 of the second circuit board 40 is spaced apart from the outer lead 39. The second adhesive layer 37 on the upper surface of the second circuit board 40 is bonded to the lower surface of the second circuit board 4, and the upper surface of the second circuit board 40 and the lower surface of the second circuit board 4 are fixedly connected by laser welding process. In this embodiment, the second circuit board 40 is provided with a through hole 401, which is provided corresponding to the outer lead area 322 and penetrates the first circuit board 3 of the second circuit board 40 along the third direction A3, i.e., the thickness direction. The through hole 401 is filled with a conductive layer 402. One end of the conductive layer 402 is in contact with the circuit layer on the lower surface of the second circuit board 4, and the other end is in contact with the outer lead 39 on the lower surface of the second circuit board 40, thereby realizing the electrical connection between the outer lead 39 and the circuit layer of the second circuit board 4 through the conductive layer 402. For example, the through hole 401 can be formed using a glass drilling process. The upper surface of the second circuit board 40 and the lower surface of the second circuit board 4 are fixedly connected by a laser welding process.

[0076] In other implementations, see Figure 18 and Figure 19 The display module 200 includes only one first circuit board group 50, and the first circuit board group 50 includes at least one first circuit board 3.

[0077] Specifically, when the first circuit board group 50 includes a plurality of first circuit boards 3, the plurality of first circuit boards 3 of the first circuit board group 50 are distributed at intervals along the second direction A2 (refer to...). Figure 1 ), and correspondingly bonded and soldered to different positions on the first array substrate 101 in the second direction A2. When the first circuit board group 50 includes only one first circuit board 3 (refer to Figure 12 The first circuit board 3 can extend along the second direction A2.

[0078] In some embodiments, the first circuit board 3 of the first circuit board assembly 50 has a first adhesive layer 36, a second adhesive layer 37, an inner lead 38, and an outer lead 39 on its two opposing surfaces in the third direction A3 (thickness direction). The first circuit board assembly 50 is disposed between the first array substrate 101 and the second array substrate 201, and the first array substrate 101 and the second array substrate 201 are bonded and soldered one-to-one to the two opposing surfaces of the first circuit board 3 of the first circuit board assembly 50 in the third direction A3.

[0079] Specifically, the first adhesive layer 36 on the upper surface of the first circuit board 3 of the first circuit board group 50 is bonded to the lower surface of the first array substrate 101, and the upper surface of the first circuit board group 50 and the lower surface of the first array substrate 101 are fixedly connected by laser welding process. In this embodiment, the bonding area B of the first array substrate 101 is provided with a through hole 401 corresponding to the position of the inner lead area 321 of the first circuit board group 50. The through hole 401 penetrates the first glass substrate 11 of the first array substrate 101 along the third direction A3. The through hole 401 is filled with a conductive layer 402. One end of the conductive layer 402 is in contact with and electrically connected to the driving circuit layer 12 on the upper surface of the first glass substrate 11, and the other end is in contact with and electrically connected to the inner lead 38 on the upper surface of the first circuit board group 50, thereby realizing the electrical connection between the driving circuit layer 12 of the first array substrate 101 and the inner lead 38 on the upper surface of the first circuit board group 50 through the conductive layer 402.

[0080] The first adhesive layer 36 on the lower surface of the first circuit board 3 of the first circuit board group 50 is bonded to the upper surface of the second array substrate 201. The inner lead 38 on the lower surface of the first circuit board group 50 is electrically connected to the driving circuit layer 12 on the upper surface of the second array substrate 201. The lower surface of the first circuit board group 50 and the upper surface of the second array substrate 201 are fixedly connected by laser welding process.

[0081] In this embodiment, see Figure 18 and Figure 19 The display module 200 includes two second circuit boards 4 spaced apart on a third direction A3. The two second circuit boards 4 are bonded and soldered one-to-one to the two opposite surfaces of the first circuit board 3 on the third direction A3 of the first circuit board group 50.

[0082] Specifically, on the third-party A3, two second circuit boards 4 are located on opposite sides of the first circuit board group 50. The lower surface of one of the second circuit boards 4 (the upper second circuit board 4) is bonded to the second adhesive layer 37 on the upper surface of the first circuit board 3 of the first circuit board group 50, and the circuit layer on the lower surface of this second circuit board 4 is electrically connected to the outer lead 39 on the upper surface of the first circuit board 3 of the first circuit board group 50. The lower surface of this second circuit board 4 and the upper surface of the first circuit board 3 of the first circuit board group 50 are fixedly connected by laser welding. The upper surface of the other second circuit board 4 (the lower second circuit board 4) is bonded to the second adhesive layer 37 on the lower surface of the first circuit board 3 of the first circuit board group 50, and the circuit layer on the upper surface of this second circuit board 4 is electrically connected to the outer lead 39 on the lower surface of the first circuit board 3 of the first circuit board group 50. The upper surface of this second circuit board 4 and the lower surface of the first circuit board 3 of the first circuit board group 50 are fixedly connected by laser welding.

[0083] It is understood that the above-mentioned dual-layer liquid crystal display module 200 can not only improve the contrast and color gamut of the display module 200, but also save the number of the first circuit board 3 and the second circuit board 4 through the above connection settings. It is also beneficial to improve the mechanical performance of the display module 200 and facilitate the realization of narrow bezel design.

[0084] In some implementations, see Figure 16 and Figure 18 Both the first pair of substrates 102 and the second pair of substrates 202 include a second glass substrate 21 and a color resist layer 22 disposed on one side of the second glass substrate 21. With the above configuration, both the first display panel 10 and the second display panel 20 have high color gamut display capabilities, which is beneficial to achieving high-quality display effects.

[0085] In other implementations, see Figure 17 and Figure 19 Both the first pair of display substrates 102 and the second pair of display substrates 202 include a second glass substrate 21, but only one of them includes a color resist layer 22 disposed on one side of the second glass substrate 21, while the other does not include a color resist layer 22. For example, only the first pair of display substrates 102 includes a color resist layer 22, while the second pair of display substrates 202 does not. This configuration effectively reduces the material cost of the color resist layer 22, simplifies the manufacturing process, and the fact that only one of the display substrates 202 includes a color resist layer 22 improves light transmittance, which is beneficial for use in scenarios requiring high brightness or low power consumption. It is understood that by optimizing the structural configuration of the first pair of display substrates 102 and the second pair of display substrates 202, it is beneficial to balance the color performance, light transmittance, cost, and production efficiency of the display module 200, meeting different usage requirements.

[0086] In the embodiments of this application, the above-described multiple implementation methods can be combined in any suitable way. The specific methods can be selected or designed according to the needs, and the embodiments of this application do not limit this.

[0087] See Figure 20 , Figure 20 This is a schematic diagram of an embodiment of the display device provided in the tenth embodiment of this application.

[0088] See Figure 20 This application also provides a display device 400. Specifically, the display device 400 includes a display module 200 and a backlight module 300. The display module 200 can be the display module 200 in any of the above embodiments.

[0089] The backlight module 300 is disposed on one side of the display module 200. Specifically, the backlight module 300 is disposed on one side of the display panel 100 of the display module 200 to provide backlight for the display panel 100 so that the display panel 100 can realize the screen display function.

[0090] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display module, characterized in that, include: The display panel includes an array substrate and a counter substrate arranged opposite to each other. The array substrate includes a first glass substrate; The array substrate has a bonding area; A first circuit board includes a first glass substrate; the first glass substrate has a lead area, a first bonding area, a second bonding area, and two clearance areas; the lead area includes an inner lead area and an outer lead area spaced apart from each other in a first direction; the inner lead area has a plurality of inner leads, and the outer lead area has a plurality of outer leads; the first bonding area is located on the side of the inner lead area away from the outer lead area, and the second bonding area is located on the side of the outer lead area away from the inner lead area; the two clearance areas are located one-to-one between the lead area and the two sides of the first glass substrate in a second direction; wherein, the first direction is perpendicular to the second direction; The second circuit board includes a second glass substrate and a circuit layer disposed on the second glass substrate; The first bonding area is provided with a first adhesive layer, and the second bonding area is provided with a second adhesive layer; the first adhesive layer bonds the bonding area and the first circuit board, and the second adhesive layer bonds the first circuit board and the second circuit board; the inner lead is electrically connected to the array substrate, and the outer lead is electrically connected to the circuit layer; in the clearance area, the first circuit board is fixedly connected to the bonding area and the second circuit board respectively by laser welding process.

2. The display module according to claim 1, characterized in that, The first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate; the second circuit board is located on one side of the array substrate in the first direction; Wherein, along the first direction, the second circuit board is spaced apart from the array substrate; or, along the first direction, the side of the second circuit board is attached to the side of the array substrate.

3. The display module according to claim 1, characterized in that, The first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate; the second circuit board is located on one side of the array substrate in the first direction; In the first direction, the first circuit board partially covers the second circuit board, and the second circuit board extends to the outer side of the first circuit board away from the array substrate; Alternatively, in the first direction, the first circuit board completely covers the second circuit board; the outer side of the second circuit board is located on the side of the outer side of the first circuit board close to the array substrate, or is flush with the outer side of the first circuit board.

4. The display module according to claim 1, characterized in that, The bonding area is provided with a driver chip, which is disposed on the surface of the array substrate facing the opposing substrate; the first adhesive layer is bonded to the surface of the array substrate facing the opposing substrate. In the first direction, the first circuit board is located outside the driver chip and is spaced apart from the driver chip; Alternatively, the surface of the first glass substrate facing the array substrate is provided with a clearance groove, the driving chip is housed in the clearance groove and is spaced apart from the sidewall of the clearance groove; the distance between the driving chip and the sidewall of the clearance groove is greater than or equal to 0.1 mm.

5. The display module according to claim 1, characterized in that, The size of the array substrate is larger than the size of the counterpart substrate. In the first direction, the array substrate protrudes from the counterpart substrate to form the bonding area. The first adhesive layer is bonded to the surface of the array substrate facing the counterpart substrate. In the second direction, a plurality of first circuit boards spaced apart from each other are provided, each first circuit board is connected to the array substrate and the second circuit board, and the length of each first circuit board is less than the length of the second circuit board; Alternatively, in the second direction, a first circuit board is provided, the entire surface of which covers the bonding area.

6. The display module according to claim 5, characterized in that, In the second direction, a first circuit board is provided, the first circuit board covering the entire bonding area; The first glass substrate has a first ink layer on its surface opposite to the array substrate.

7. The display module according to claim 6, characterized in that, The display panel also includes an upper polarizer located on the side of the opposing substrate away from the array substrate; Wherein, the upper polarizer only covers the opposite substrate, and the first ink layer is configured to be laser-engravable; Alternatively, the upper polarizer covers the opposing substrate and extends to cover the first circuit board; the first ink layer covers the entire surface of the first glass substrate, and the upper polarizer has a second ink layer on its surface opposite to the array substrate, the second ink layer being configured to be laser-engravable.

8. The display module according to claim 1, characterized in that, The display module includes two display panels stacked together, namely a first display panel and a second display panel; in the third direction, the first display panel is located on top of the second display panel, the first display panel includes a first array substrate and a first paired substrate disposed opposite each other, and the second display panel includes a second array substrate and a second paired substrate disposed opposite each other; wherein, the third direction, the first direction, and the second direction are perpendicular to each other; The display module includes a first set of circuit boards and a second set of circuit boards spaced upwards from the third side. Both the first set of circuit boards and the second set of circuit boards include at least one of the first circuit boards. The first set of circuit boards is bonded and soldered to the first array substrate, and the second set of circuit boards is bonded and soldered to the second array substrate. The display module includes a second circuit board, and the second glass substrate has the circuit layer on both opposite surfaces in the third direction; the second circuit board is disposed between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are bonded and soldered to the two opposite surfaces of the second glass substrate in the third direction.

9. The display module according to claim 1, characterized in that, The display module includes two display panels stacked together, namely a first display panel and a second display panel; in the third direction, the first display panel is located on top of the second display panel, the first display panel includes a first array substrate and a first paired substrate disposed opposite each other, and the second display panel includes a second array substrate and a second paired substrate disposed opposite each other; wherein, the third direction, the first direction, and the second direction are perpendicular to each other; The display module includes a first circuit board group, which includes at least one first circuit board; the first circuit board of the first circuit board group has a first adhesive layer, a second adhesive layer, an inner lead and an outer lead on two opposite surfaces in the third direction; wherein the third direction, the first direction and the second direction are perpendicular to each other. The first circuit board assembly is disposed between the first array substrate and the second array substrate. The first array substrate and the second array substrate are bonded and soldered to the two opposite surfaces of the first circuit board assembly in the third direction. The display module includes two second circuit boards spaced apart in the third direction. The two second circuit boards are bonded and soldered one-to-one to the two opposite surfaces of the first circuit board of the first circuit board group in the third direction.

10. The display module according to claim 8 or 9, characterized in that, Both the first pair of substrates and the second pair of substrates include a second glass substrate and a color resist layer disposed on one side of the second glass substrate; Alternatively, both the first pair of substrates and the second pair of substrates include a second glass substrate. Only one of them includes a color resist layer disposed on one side of the second glass substrate.

11. The display module according to claim 1, characterized in that, The first adhesive layer and / or the second adhesive layer are glass glue; And / or, the width of the first adhesive layer is 1-2 mm; And / or, the width of the second adhesive layer is 1-2 mm; And / or, the thickness of the first adhesive layer is 0.08-0.12 mm; And / or, the thickness of the second adhesive layer is 0.08-0.12 mm; And / or, the width of the clearance area is 200-300 μm; And / or, the clearance area has welding traces, the width of which is 100-150 μm; the welding traces extend along the first direction; And / or, the shape of the first glass substrate is any one of rectangular, trapezoidal, or I-shaped.

12. A display device, characterized in that, include: The display module as described in any one of claims 1-11; A backlight module is disposed on one side of the display module and is used to provide backlight for the display panel.

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